CN116598861B - Structure, insulating material and method for inhibiting metal particles - Google Patents
Structure, insulating material and method for inhibiting metal particles Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R39/00—Rotary current collectors, distributors or interrupters
- H01R39/64—Devices for uninterrupted current collection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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Abstract
The application discloses a structure, an insulating material and a method for inhibiting metal particles, belongs to the technical field of aerospace, and is used for effectively inhibiting the metal particles on the premise of not changing the mechanical properties of the insulating material. The structure for inhibiting the metal particles is a cuboid-shaped empty groove structure, the cuboid-shaped empty groove structure is used for scattering electrons and limiting the metal particles in the groove, and the electrons are emitted from the surface of the insulating material promoted by the metal particles; the cuboid-shaped empty slot structure is built in an insulating material through a 3D printing technology, and the insulating material is arranged in a vacuum environment; the distance between the symmetrical center point of the cuboid-shaped empty groove structure and the symmetrical center point of the insulating material is a first preset threshold value.
Description
Technical Field
The application relates to the technical field of aerospace, in particular to a structure, an insulating material and a method for inhibiting metal particles.
Background
The solar cell array driving mechanism (Solar Array Drive Assembly, SADA) is an electrical transmission component for maintaining the normal operation of the satellite by transmitting the electrical power and the electrical signal of the solar cell array to the inside of the satellite. The conducting ring is a key link for realizing power transmission and energy supply of the SADA mechanism, and transmits electric energy and electric signals through sliding electric contact with the electric brush, so that the conducting ring has extremely wide application on various satellites, detectors and other spacecrafts at home and abroad.
However, the conductive ring and the brush are in sliding electrical contact to realize electrical transmission, and metal particles generated by abrasion become one of the important reasons for the failure of the SADA mechanism. Because of the rough contact surface, the long-term friction between the conductive ring and the brush can lead to wear of the contact surface and correspondingly generate a large amount of abrasive dust to form metal particles, and the metal particles can migrate to the electrode gap of the conductive ring to cause gap breakage and dielectric breakdown under the combined action of an electric field, a magnetic field and electrochemical corrosion. Meanwhile, a large amount of metal particles are accumulated in the conductive ring, so that vacuum surface flashover discharge is extremely easy to be induced, the SADA mechanism is burnt, and irreversible spacecraft damage accidents are caused. Therefore, in order to ensure the safety of the power transmission of the SADA mechanism for long-life operation of the spacecraft on orbit, it is important to reduce or suppress the influence of metal particles.
At present, because the research on the migration rule of metal particles in a vacuum environment and the influence of the migration rule on surface flashover discharge is relatively insufficient, a method for changing conductive rings and brush wire materials is generally adopted in engineering application to reduce abrasion. However, this method cannot completely avoid the generation of metal particles, and a small amount of metal particles generated by abrasion still induce vacuum surface flashover to damage the spacecraft, so that a new method for inhibiting metal particles in a vacuum environment is needed.
Disclosure of Invention
The embodiment of the application provides a structure, an insulating material and a method for inhibiting metal particles, which are used for effectively inhibiting the metal particles on the premise of not changing the mechanical properties of the insulating material.
The embodiment of the application adopts the following technical scheme:
in a first aspect, an embodiment of the present application provides a structure for suppressing metal particles, where the structure is a rectangular hollow structure, and the rectangular hollow structure is used for scattering electrons and confining the metal particles in a groove, and the electrons are promoted to be emitted from the surface of an insulating material by the metal particles; the cuboid-shaped empty slot structure is built in an insulating material through a 3D printing technology, and the insulating material is arranged in a vacuum environment; the distance between the symmetrical center point of the cuboid-shaped empty groove structure and the symmetrical center point of the insulating material is a first preset threshold value.
In one or more embodiments of the present disclosure, when the first preset threshold is not 0, a symmetry center point of the rectangular parallelepiped hollow structure is close to one end of the insulating material where the anode electrode is mounted.
In one or more embodiments of the present disclosure, the width and depth of the rectangular parallelepiped void structures are equal, and the depth of the rectangular parallelepiped void structures is 1mm; the length of the cuboid-shaped empty groove structure is equal to that of the insulating material.
In one or more embodiments of the present disclosure, the rectangular hollow structure is used for scattering electrons, specifically, the rectangular hollow structure is used for accumulating charges on the surface of the side wall when the electrons strike the side wall of the hollow, so as to form an electric field in the rectangular hollow, thereby scattering the electrons into the vacuum environment through the electric field, and inhibiting the promotion effect of the metal particles on the surface secondary electron emission.
In a second aspect, embodiments of the present application also provide an insulating material for suppressing metal particles, the insulating material being disposed in a vacuum environment; the insulating material is provided with a cuboid-shaped empty groove structure constructed by a 3D printing technology, the cuboid-shaped empty groove structure is used for scattering electrons and confining the metal particles in a groove, and the electrons are emitted from the surface of the insulating material by the metal particles; the distance between the symmetry center point of the insulating material and the symmetry center point of the cuboid-shaped empty slot structure is a first preset threshold value.
In one or more embodiments of the present disclosure, one end of the insulating material is provided with an anode electrode, and the other end is provided with a cathode electrode; the insulating material is arranged in a pressure welding way with the anode electrode and/or the cathode electrode.
In one or more embodiments of the present disclosure, the insulating material is rectangular in shape; the flashover voltage on the vacuum surface of the insulating material is not lower than a second preset threshold.
In a third aspect, embodiments of the present application further provide a method for suppressing metal particles, the method including: constructing a cuboid empty slot structure on an insulating material in a vacuum environment through a 3D printing technology, wherein the distance between the symmetrical center point of the cuboid empty slot structure and the symmetrical center point of the insulating material is a first preset threshold value; electrons are scattered out through the rectangular parallelepiped hollow groove structure and the metal particles are limited in the groove, and the electrons are promoted to be emitted from the surface of the insulating material by the metal particles.
In one or more embodiments of the present disclosure, the scattering of electrons includes: accumulating charges on the surfaces of the side walls of the cuboid-shaped empty slot structure when the electron motion impinges on the side walls of the cuboid-shaped empty slot structure, so as to form an electric field in the cuboid-shaped empty slot; the electrons are scattered into a vacuum environment by the electric field.
In one or more embodiments of the present disclosure, the confining the metal particles within the groove specifically includes: when the metal particles move to the bottom of the cuboid-shaped empty groove structure, the cuboid-shaped empty groove structure limits the metal particles in the groove through the side wall of the cuboid-shaped empty groove structure.
The structure, the insulating material and the method for inhibiting the metal particles provided by the embodiment of the application have the following beneficial effects: a cuboid empty groove structure is constructed on an insulating material by utilizing a 3D printing technology, metal particles in a vacuum environment can be limited in the groove, electrons formed by promotion of the metal particles can be scattered, the reduction of flashover voltage by the metal particles can be obviously restrained, the problem of mechanical performance reduction of the insulating material is avoided, and the development requirements of high power and long service life of a spacecraft are met. Meanwhile, the cuboid-shaped empty groove in the scheme of the application has a simple structure and is easy to process, and the preparation of a coating film or a complex structure on the surface of the insulating material is not needed, so that the effects of metal particles are inhibited and the vacuum along-surface electrical resistance of the surface on which the particles are attached is improved on the premise that the mechanical property of the insulating material is not reduced.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to the drawings without inventive effort to those skilled in the art. In the drawings:
FIG. 1 is a schematic diagram of a structure for suppressing metal particles according to an embodiment of the present application;
FIG. 2 is a flow chart of a method for suppressing metal particles according to an embodiment of the present application;
fig. 3 is an electronic distribution simulation schematic diagram in an application scenario provided in an embodiment of the present application;
fig. 4 is a schematic diagram of flashover voltage and average flashover voltage distribution under an application scenario provided by an embodiment of the present application;
fig. 5 is a schematic diagram of flashover voltage and average flashover voltage distribution in another application scenario provided by the embodiment of the present application.
Detailed Description
In order to make the technical solution of the present application better understood by those skilled in the art, the technical solution of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, shall fall within the scope of the present application.
The embodiment of the application focuses on the influence of metal particles and cuboid empty slot structures on the flashover voltage of the vacuum surface in the vacuum environment such as the interior of a spacecraft, and combines with a 3D printing technology to realize the inhibition of the influence of the metal particles in the vacuum environment and improve the electric resistance of the vacuum surface of the insulating material with the metal particles attached on the surface on the premise of not influencing the mechanical property of the insulating material by constructing the cuboid empty slot structures.
The following describes the embodiments of the present application in detail with reference to the drawings.
Fig. 1 is a schematic structural diagram of a metal particle suppression structure provided in an embodiment of the present application, as shown in fig. 1, a structure for suppressing metal particles in the embodiment of the present application is a rectangular hollow structure 2, and the rectangular hollow structure 2 is constructed on an insulating material 1, so as to limit the metal particles 5 in the groove or scatter electrons, and the principle thereof may be referred to the related description of the method embodiment, which is not repeated herein.
Since the scheme in the embodiment of the present application researches the influence of metal particles in a vacuum environment such as the interior of a spacecraft, the insulating material 1 in the embodiment of the present application is disposed in the vacuum environment, and the insulating material 1 in the embodiment of the present application is a planar insulating material, and has a rectangular parallelepiped shape. Meanwhile, in order not to affect the mechanical properties of the insulating material 1, the embodiment of the application adopts a 3D printing technology to construct the rectangular hollow groove structure 2 on the insulating material 1.
In one possible implementation manner of the embodiment of the present application, the width and the depth of the rectangular hollow groove structure are equal, and in fig. 1, the values are w, in one example, w may be 1mm, and at the same time, the length of the rectangular hollow groove structure is equal to the length of the insulating material.
In one possible implementation manner of the embodiment of the present application, a distance between a symmetry center point of the rectangular parallelepiped hollow structure 2 and a symmetry center point of the insulating material 1 is a first preset threshold, where the first preset threshold may be 0 or not. And, when the first preset threshold value is 0, it means that the symmetry center point of the rectangular parallelepiped hollow groove structure 2 coincides with the symmetry center point of the insulating material 1, that is, the rectangular parallelepiped hollow groove structure 2 is constructed at the center position of the insulating material 1, and when the first preset threshold value is not 0, it means that the symmetry center point of the rectangular parallelepiped hollow groove structure 2 deviates from the symmetry center point of the insulating material 1, at this time, the rectangular parallelepiped hollow groove structure 2 is constructed at one end near the insulating material 1 where the anode electrode is mounted.
Further, as shown in fig. 1, the electrodes 3 and 4 are mounted at two ends of the insulating material 1, and the distance between the electrodes 3 and 4 is L, where the electrode 3 may be an anode electrode or a cathode electrode, and similarly, the electrode 4 may be a cathode electrode or an anode electrode, that is, the position where the electrode is mounted on the insulating material 1 is not required in the embodiment of the present application, so long as the anode electrode and the cathode electrode are mounted on one side of the insulating material 1. In one example of the application, the electrodes 3, 4 are each mounted on the insulating material 1 by crimping, taking care to keep the surface of the insulating material 1 clean and free of dirt. Meanwhile, as can be seen from fig. 1, the distance between the symmetry center of the rectangular parallelepiped hollow structure 2 and the electrode 3 is d, and d is half of L.
Fig. 2 is a flowchart of a method for suppressing metal particles according to an embodiment of the present application. As shown in fig. 2, the metal particle suppression method in the embodiment of the application at least includes the following implementation steps:
step 201, constructing a cuboid-shaped empty groove structure on an insulating material in a vacuum environment through a 3D printing technology.
By the 3D printing technology, surface coating or preparation of a complex structure on the insulating material is not needed, and the mechanical properties of the insulating material can be not influenced as much as possible. The rectangular hollow structure can be described with reference to fig. 1 and related parts, and the embodiments of the present application are not described herein.
Step 202, scattering electrons out through a cuboid-shaped empty groove structure and confining metal particles in the groove.
In the embodiment of the application, the inhibition effect of the cuboid-shaped empty groove structure on the influence of the metal particles is mainly embodied in two aspects, namely, electrons generated by the promotion of the metal particles can be scattered into a vacuum environment, and the metal particles can be limited in the groove, so that the influence of the metal particles on the reduction of the flashover voltage of the vacuum surface is inhibited, and the principle is as follows:
firstly, according to a secondary electron emission avalanche theory, vacuum flashover starts from cathode field emission, seed electrons generated by field emission impact the surface of a medium after being accelerated by an electric field and induce secondary electron emission, and SEY of the medium is generally larger, so that more electrons are generated in the secondary electron emission process, secondary electron multiplication is induced, secondary electron collapse is formed, and positive charges are accumulated on the surface of the medium; then secondary electron collapse develops to the anode under the action of an electric field and finally forms a steady state; finally, the electrons strike the medium to generate outgas, the air pressure is increased, and the creeping discharge of the medium is finally initiated.
In the new metal particle suppression technology provided by the embodiment of the application, part of electrons can enter the rectangular empty slot structure and strike the side wall of the slot in the electron movement process, so that the surface charge accumulation of the side wall is caused, and an electric field is formed on the surface and the inside of the empty slot structure after the charge accumulation, and the electric field can apply a force for electrons to leave the surface upwards, so that the electrons are scattered. As shown in fig. 3 (b) and (c), a large number of electrons on the right side of the structure move to the upper right in the vacuum region, i.e., electrons that are scattered out.
That is, the embodiment of the application utilizes the characteristics that the cuboid-shaped empty groove structure can scatter electrons and improve the electric strength of the vacuum surface, and can scatter secondary electrons to the vacuum depth to be difficult to return to the surface, thereby obviously inhibiting the influence of metal particles in the structure on the surface discharge process and achieving the purposes of improving the electric strength of the surface and inhibiting the metal particles in the vacuum environment. Meanwhile, the method in the embodiment of the application has simple structure and easy processing, can obviously inhibit the reduction of the flashover voltage by the metal particles, does not bring the problem of mechanical property reduction to the insulating material, and is beneficial to meeting the development requirements of high power and long service life of a spacecraft.
Fig. 3 is a schematic diagram of electronic distribution simulation in an application scenario provided in an embodiment of the present application. As shown in fig. 3, the electron distribution results at simulation time 1 ns are, from left to right, the comparison of the plane without the particle suppression structure (i.e., the plane of the insulating material), the plane with the shallower particle suppression structure, and the plane with the deeper particle suppression structure, respectively. The secondary electrons can be scattered, the collision between the secondary electrons and the surface can be reduced, the development speed and development process of secondary electron collapse extending from the cathode to the anode can be restrained, and the surface electric strength of the insulating material can be improved by constructing a particle restraining structure on the surface of the insulating material; meanwhile, when the depth of the particle suppression structure is deeper, secondary electrons cannot move to the bottom of the structure, and the metal particles placed in the particle suppression structure cannot influence secondary electron collapse when the depth of the structure is enough, so that the metal particle suppression effect of the structure is realized, and therefore, the depth of the rectangular empty slot structure in the embodiment of the application is preferably set to be 1mm.
Secondly, when the metal particles are on the surface of the insulating material, particularly the electric field at the junction of the electrode and the insulating material, is severely distorted, and field emission and charge accumulation are more likely to occur, so that the flashover voltage is reduced; when the metal particles are limited in the rectangular empty slot structure, the distortion effect on the surface electric field is obviously reduced, the metal particles are not easy to induce discharge, and meanwhile, the structure also has a scattering effect on electrons to further improve the creepage resistance, so that the flashover voltage under the condition that the metal particles exist can be improved, namely the reduction of the flashover voltage of the vacuum creepage of the insulating material is inhibited.
In order to explain the scheme in the embodiment of the application in more detail, the embodiment of the application also performs the following experimental study on the scheme.
In one example of the present application, the insulating material is a photosensitive resin, the metal particle material is AuNi9, which is a gold-nickel alloy with a gold content of about 90%, and is a common material for generating metal particles in a spacecraft, and the size of the material is 0.7-mm a/d 5-mm a/d, and the material can be completely embedded into the interior of the particle suppression structure (for the sake of understanding, this section describes a rectangular hollow groove structure as a particle suppression structure); the distance L between the electrodes was fixed at 5 mm, and the depth and width of the particle suppression structure were 1mm.
Specific experiment one:
the 3D print width and depth of the particle suppression structure at the center line of the insulating material was 1mm, i.e., the upper edge of the structure was 2 mm from the cathode and the lower edge from the anode. Four samples were prepared, which were respectively a normal planar control sample (sample 1), a planar sample containing particle adhesion (sample 2), a planar sample containing a particle suppression structure (sample 3), and a planar sample containing metal particles preset inside the particle suppression structure (sample 4), and the particle suppression structure, the influence of the metal particles on the flashover voltage, and the particle suppression effect of the structure were investigated by comparison.
The dc flashover voltage data for the four samples are shown in table 1 below, and the flashover voltage distribution and average flashover voltage for the different samples can be obtained from the data plotted as shown in fig. 4.
Table 1 vacuum dc flashover voltage data for different samples
It was found that the flashover voltage of control plane sample 1 without particle inhibiting structure and particle attachment was 25.81 kV; the metal particles attached to the surface have a larger influence on the flashover voltage, the flashover voltage of a plane can be obviously reduced, the flashover voltage of a sample 2 is only 21.56 and kV, and the amplitude reduction reaches 16.47%; sample 3, which contained the particle suppression structure, had a higher flashover voltage than the control plane, with an average value of 33.81 kV, with a 31% increase in flashover voltage; whereas sample 4, which contained metal particles within the particle structure, had a flashover voltage of 30.05 kV, which was 16.43% and 39.38% higher than the control plane and the adhesion particle plane, respectively.
From this, it can be derived that the particle suppression structure in the embodiment of the present application can significantly suppress the decrease of the flashover voltage affected by the metal particles.
And a specific experiment II:
the metal particle suppression structure with the depth and the width of 1mm is printed at different positions of the insulating material, the position change is realized by controlling the distance between the cathode and the upper edge of the particle suppression structure, and the upper edge of the particle suppression structure is respectively 1mm, 2 mm and 3 mm from the cathode, which represent three position distributions near the cathode, the center and near the anode.
The dc flashover voltage data for the three samples and the control plane without the particle suppression structure are shown in table 2 below, and the flashover voltage distribution and average flashover voltage for the different samples can be obtained from the data plot as shown in fig. 5.
Table 2 vacuum dc flashover voltage data for different samples
It was found that when the particle suppression structure was located in the center of the insulating material or near the anode, the vacuum subsurface flashover voltages were 33.81 kV and 32.40 kV, respectively, which were 31% and 25.53% higher than the flashover voltages of the control plane 25.81 kV; when the particle suppression structure is positioned near the cathode of the insulating material, the vacuum surface flashover voltage is reduced to 23.37 kV, which is 9.45% lower than the control plane flashover voltage, and the particle suppression effect is poor.
It can be seen that the particle suppression structure in the embodiments of the present application should be constructed as much as possible at the center of symmetry of the insulating material or at the end of the insulating material near which the anode electrode is mounted.
In addition, the solution for inhibiting metal particles in the embodiment of the present application has the following effects:
1) Construction of metal particle suppression structures on insulating material surfaces using 3D printing techniques
According to the method provided by the embodiment of the application, the metal particle inhibition structure is constructed on the surface of the insulating material by a 3D printing technology, the preparation process is simple, the cost performance is high, the prepared sample is stable in structure and high in precision, and the vacuum surface electric resistance intensity of the sample and the reduction of flashover voltage caused by particles are improved on the premise that the mechanical property of the insulating material is not reduced.
2) Concern about the effect of metal particles on vacuum rim flashover voltage
The prior researches neglect the influence of metal abrasive dust particles inevitably generated in a spacecraft on the vacuum creeping surface flashover voltage, and lack of researches on how to inhibit the particles from inducing creeping discharge. The embodiment of the application explores the reduction of flashover voltage caused by metal particle adhesion in a vacuum environment, and provides an innovative particle inhibition method by combining a 3D printing technology.
3) Improving the electric strength of vacuum surface and inhibiting the induction of surface flashover by metal particles by using a surface structure
Aiming at the problem of metal particle pollution in a spacecraft, the traditional solution is focused on changing the conducting ring and the brush wire materials to reduce abrasion, but the method cannot completely avoid the generation of metal particles and induce the surface flashover. According to the method provided by the embodiment of the application, the particle inhibition structure is constructed on the surface of the insulating material, so that the vacuum surface flashover voltage is improved, the characteristic that metal particles are easy to induce surface flashover is inhibited, and meanwhile, the appearance, the volume and the mechanical strength of the insulating material are not greatly changed, so that the problem of metal particle induced discharge is solved under the condition that the overall design of spaceflight is not interfered.
It will be appreciated by those skilled in the art that the present description may be provided as a method, system, or computer program product. Accordingly, the present specification embodiments may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present description embodiments may take the form of a computer program product on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) having computer-usable program code embodied therein.
The present description is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the specification. It will be understood that each flow and/or block of the flowchart illustrations and/or block diagrams, and combinations of flows and/or blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.
The description may be described in the general context of computer-executable instructions, such as program modules, being executed by a computer. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform particular tasks or implement particular abstract data types. The specification may also be practiced in distributed computing environments where tasks are performed by remote processing devices that are linked through a communications network. In a distributed computing environment, program modules may be located in both local and remote computer storage media including memory storage devices.
In this specification, each embodiment is described in a progressive manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. In particular, for apparatus, devices, non-volatile computer storage medium embodiments, the description is relatively simple, as it is substantially similar to method embodiments, with reference to the section of the method embodiments being relevant.
The foregoing describes specific embodiments of the present disclosure. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims can be performed in a different order than in the embodiments and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.
The foregoing is merely one or more embodiments of the present description and is not intended to limit the present description. Various modifications and alterations to one or more embodiments of this description will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, or the like, which is within the spirit and principles of one or more embodiments of the present description, is intended to be included within the scope of the claims of the present description.
Claims (8)
1. A structure for suppressing metal particles is characterized in that,
the structure is a cuboid-shaped empty groove structure, the cuboid-shaped empty groove structure is used for scattering electrons and limiting the metal particles in the groove, and the electrons are emitted from the surface of the insulating material promoted by the metal particles;
the cuboid-shaped empty slot structure is constructed on the surface of an insulating material through a 3D printing technology, and the insulating material is arranged in a vacuum environment;
the distance between the symmetrical center point of the cuboid-shaped empty slot structure and the symmetrical center point of the insulating material is a first preset threshold value;
the cuboid-shaped empty groove structure is used for scattering electrons, specifically, when the electrons strike the side wall of the groove, the cuboid-shaped empty groove structure is used for accumulating charges on the surface of the side wall so as to form an electric field in the cuboid-shaped empty groove, and therefore the electrons are scattered into the vacuum environment through the electric field.
2. A structure for suppressing metal particles as defined in claim 1,
and when the first preset threshold value is not 0, the symmetry center point of the cuboid-shaped empty groove structure is close to one end of the insulating material, on which the anode electrode is mounted.
3. A structure for suppressing metal particles as defined in claim 1,
the width and the depth of the cuboid-shaped empty groove structure are equal, and the depth of the cuboid-shaped empty groove structure is 1mm;
the length of the cuboid-shaped empty groove structure is equal to that of the insulating material.
4. An insulating material for suppressing metal particles, characterized in that,
the insulating material is arranged in a vacuum environment;
the insulating material is provided with a cuboid-shaped empty groove structure constructed by a 3D printing technology, the cuboid-shaped empty groove structure is used for scattering electrons and confining the metal particles in a groove, and the electrons are emitted from the surface of the insulating material by the metal particles; the cuboid-shaped empty groove structure is used for scattering electrons, specifically, when the electrons strike the side wall of the groove, charges on the surface of the side wall are accumulated, so that an electric field is formed in the cuboid-shaped empty groove, and the electrons are scattered into the vacuum environment through the electric field;
the distance between the symmetry center point of the insulating material and the symmetry center point of the cuboid-shaped empty slot structure is a first preset threshold value.
5. An insulating material for suppressing metal particles as recited in claim 4, wherein,
one end of the insulating material is provided with an anode electrode, and the other end of the insulating material is provided with a cathode electrode;
the insulating material is arranged in a pressure welding way with the anode electrode and/or the cathode electrode.
6. An insulating material for suppressing metal particles as recited in claim 4, wherein,
the shape of the insulating material is cuboid;
the flashover voltage on the vacuum surface of the insulating material is not lower than a second preset threshold.
7. A method of inhibiting metal particles, the method comprising:
constructing a cuboid empty slot structure on an insulating material in a vacuum environment through a 3D printing technology, wherein the distance between the symmetrical center point of the cuboid empty slot structure and the symmetrical center point of the insulating material is a first preset threshold value;
scattering electrons out of the rectangular hollow groove structure and confining the metal particles in the groove, wherein the electrons are promoted to be emitted from the surface of the insulating material by the metal particles;
the step of scattering electrons specifically comprises the following steps: when electrons move and strike the side wall of the cuboid-shaped empty groove structure under the influence of the metal particles, accumulating charges on the surface of the side wall to form an electric field in the cuboid-shaped empty groove; the electrons are scattered into a vacuum environment by the electric field.
8. A method of suppressing metal particles as recited in claim 7, wherein said confining the metal particles within the trough comprises:
when the metal particles move to the bottom of the cuboid-shaped empty groove structure, the cuboid-shaped empty groove structure limits the metal particles in the groove through the side wall of the cuboid-shaped empty groove structure.
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Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5654532A (en) * | 1994-04-05 | 1997-08-05 | Abb Power T&D Company Inc. | Moving interrupter gap shield |
US6476317B1 (en) * | 1997-07-15 | 2002-11-05 | The United States Of America As Represented By The Secretary Of The Air Force | Radiation shield using electrical insulating materials and the spacecharge fields therein |
JP2010106289A (en) * | 2008-10-28 | 2010-05-13 | Jeol Ltd | Vacuum vapor-deposition apparatus |
CN105467281A (en) * | 2015-11-19 | 2016-04-06 | 西安交通大学 | Method for improving surface flashover characteristic of solid insulating material |
CN107552361A (en) * | 2017-08-07 | 2018-01-09 | 中国电力科学研究院 | Gas-insulated transmission line tank body and the method for suppressing its interior particle movement |
CN208155941U (en) * | 2018-05-11 | 2018-11-27 | 沈阳工业大学 | A kind of experimental provision that metal particle is innoxious |
CN110212480A (en) * | 2019-06-13 | 2019-09-06 | 华北电力大学 | Gas Insulated HVDC Transmission Line particle trap and parameter optimization method |
CN113919091A (en) * | 2021-09-28 | 2022-01-11 | 国网山东省电力公司菏泽供电公司 | Method for carrying out structure optimization on metal particle trap in GIS |
CN113985231A (en) * | 2021-10-29 | 2022-01-28 | 广东电网有限责任公司 | Estimation method and device for insulation material surface flashover voltage |
CN114709744A (en) * | 2022-03-24 | 2022-07-05 | 国网江苏省电力有限公司电力科学研究院 | GIS metal particle trap and GIS |
WO2022267985A1 (en) * | 2021-06-23 | 2022-12-29 | 西安交通大学 | Partial discharge suppression method at flange of gis/gil supporting insulator |
CN115832926A (en) * | 2022-11-22 | 2023-03-21 | 国网河南省电力公司电力科学研究院 | Novel metal particle trap |
CN115864272A (en) * | 2023-02-27 | 2023-03-28 | 国网天津市电力公司电力科学研究院 | Particle trap structure of GIS bus air chamber and arrangement method thereof |
-
2023
- 2023-07-13 CN CN202310857420.0A patent/CN116598861B/en active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5654532A (en) * | 1994-04-05 | 1997-08-05 | Abb Power T&D Company Inc. | Moving interrupter gap shield |
US6476317B1 (en) * | 1997-07-15 | 2002-11-05 | The United States Of America As Represented By The Secretary Of The Air Force | Radiation shield using electrical insulating materials and the spacecharge fields therein |
JP2010106289A (en) * | 2008-10-28 | 2010-05-13 | Jeol Ltd | Vacuum vapor-deposition apparatus |
CN105467281A (en) * | 2015-11-19 | 2016-04-06 | 西安交通大学 | Method for improving surface flashover characteristic of solid insulating material |
CN107552361A (en) * | 2017-08-07 | 2018-01-09 | 中国电力科学研究院 | Gas-insulated transmission line tank body and the method for suppressing its interior particle movement |
CN208155941U (en) * | 2018-05-11 | 2018-11-27 | 沈阳工业大学 | A kind of experimental provision that metal particle is innoxious |
CN110212480A (en) * | 2019-06-13 | 2019-09-06 | 华北电力大学 | Gas Insulated HVDC Transmission Line particle trap and parameter optimization method |
WO2022267985A1 (en) * | 2021-06-23 | 2022-12-29 | 西安交通大学 | Partial discharge suppression method at flange of gis/gil supporting insulator |
CN113919091A (en) * | 2021-09-28 | 2022-01-11 | 国网山东省电力公司菏泽供电公司 | Method for carrying out structure optimization on metal particle trap in GIS |
CN113985231A (en) * | 2021-10-29 | 2022-01-28 | 广东电网有限责任公司 | Estimation method and device for insulation material surface flashover voltage |
CN114709744A (en) * | 2022-03-24 | 2022-07-05 | 国网江苏省电力有限公司电力科学研究院 | GIS metal particle trap and GIS |
CN115832926A (en) * | 2022-11-22 | 2023-03-21 | 国网河南省电力公司电力科学研究院 | Novel metal particle trap |
CN115864272A (en) * | 2023-02-27 | 2023-03-28 | 国网天津市电力公司电力科学研究院 | Particle trap structure of GIS bus air chamber and arrangement method thereof |
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