CN116583037A - Mounting method and mounting structure of elastic electric contact terminal - Google Patents
Mounting method and mounting structure of elastic electric contact terminal Download PDFInfo
- Publication number
- CN116583037A CN116583037A CN202310139879.7A CN202310139879A CN116583037A CN 116583037 A CN116583037 A CN 116583037A CN 202310139879 A CN202310139879 A CN 202310139879A CN 116583037 A CN116583037 A CN 116583037A
- Authority
- CN
- China
- Prior art keywords
- contact terminal
- metal layer
- electric contact
- length
- conductive pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 14
- 229910000679 solder Inorganic materials 0.000 claims abstract description 132
- 239000002184 metal Substances 0.000 claims abstract description 118
- 229910052751 metal Inorganic materials 0.000 claims abstract description 118
- 239000010410 layer Substances 0.000 claims description 175
- 238000005476 soldering Methods 0.000 claims description 29
- 229920006254 polymer film Polymers 0.000 claims description 21
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000009751 slip forming Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 description 10
- 239000010931 gold Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 229920001821 foam rubber Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- -1 particularly Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Disclosed are a mounting method and a mounting structure for an elastic electrical contact terminal, which can maintain reliable electrical connection between objects even if cracks occur in a metal layer of the electrical contact terminal. In the electric contact terminal, a solder layer is interposed between the solder portions including the lower portions of both sides of the metal layer and attached to the upper side of the conductive pattern formed on the circuit board, a portion of the solder layer rises along the side surface of the electric contact terminal to form a side surface solder layer, and the length of the metal layer is longer than the length of the side surface solder layer.
Description
Technical Field
The present utility model relates to a mounting structure and a mounting method of an elastic electric contact terminal capable of soldering by surface mounting, and more particularly, to a technique capable of electrically connecting opposing objects in a vertical direction with reliability even if cracks occur in a metal layer of the electric contact terminal due to pressing after the electric contact terminal is soldered.
Background
In general, an elastic electrical contact terminal capable of soldering by surface mounting is required to be capable of vacuum pickup, and to be low in resistance, excellent in restoring force based on elasticity, and capable of withstanding soldering temperature.
In particular, when the electric contact terminal is interposed between the targets having conductivity which are opposite in the up-down direction and presses the electric contact terminal in the vertical direction, the electric contact terminal should be electrically connected to the upper and lower targets with low resistance.
Such electric contact terminals include korean patent nos. 10-1001354, 10-1711013, 10-1735656, 10-2038412 and 10-2331990, korean patent No. 20-0442316, etc. by the present inventors.
Fig. 1 a) and 1 b) are a front view and a side view, respectively, showing an example of a conventional mounting structure of an elastic electric contact terminal.
As shown in the enlarged circle, the electric contact terminal 200 is composed of a tube-shaped elastic core 210 having a through hole 215 formed therein in the longitudinal direction, a heat-resistant polymer film 230 surrounding the adhesive core 210 with an adhesive layer 220 interposed therebetween, and a metal layer 240 formed on the outer surface of the polymer film 230.
When the solder portion 245 of the electric contact terminal 200 is located at the solder paste above the conductive pattern 20 of the circuit board 10 formed to be separated in the longitudinal direction so as to correspond to the solder portion 245 by vacuum pick-up of the upper portion of the electric contact terminal 200 and reflow soldering is performed, the solder paste adhered to the metal layer 240 is cooled to become the solder layer 30 after being melted, and the conductive pattern 20 and the metal layer 240 are adhered and soldered at the same time to be mounted.
When the soldered electric contact terminal 200 having such a structure is pressed by a force applied in the vertical direction from the object on the upper side, the core 210 is folded or concentrated at a portion or the like which is easily spread aside by the applied force or a portion where stress is concentrated.
The portion where the core 210 is folded or the portion where the external force is concentrated differs depending on the size and shape of the core 210, the size or shape of the through hole 215 formed in the core 210, and the like.
Further, the lower portions of both sides of the metal layer 240 are fixed by the solder layer 30, and the solder layer 30 formed above the side surfaces of the metal layer by the rising of the solder paste has no elasticity and high strength, and thus, the force pressing at the boundary portion where the metal layer 240 meets the solder layer 30 is concentrated.
Also, the core 210 and the polymer film 230 are bonded by the adhesive layer 220, and thus, when the core 210 is folded or stress-concentrated at a specific portion, the corresponding portions or adjacent portions of the polymer film 230 and the metal layer 240 are also folded or stress-concentrated.
When the stress is repeatedly concentrated by repeating folding by such pressing, the metal layer 240 in these portions is likely to generate cracks (cracks).
In particular, in the case of repeated pressing, as shown in b) of fig. 1, cracks 242 may occur in the metal layer 240 in the longitudinal direction at boundary portions of the solder layer 30 and the metal layer 240 welded above the side surfaces of the metal layer 240.
At the boundary portion between the solder layer 30 and the metal layer 240, when the metal layer 240 is cut in the entire longitudinal direction by the crack 242 of the metal layer 240, the electrical connection of the electrical contact terminal 200 may be broken in the vertical direction, and when the electrical contact terminal 200 is not cut in the entire longitudinal direction but is partially connected, the electrical resistance in the vertical direction may be increased.
That is, after the electric contact terminal 200 is fixed by soldering the lower portions of both sides of the metal layer 240 of the electric contact terminal 200, if the electric contact terminal 200 is pressed in the vertical direction, since the solder layer 30 does not have elasticity and much force is concentrated at the boundary portion where the metal layer 240 meets the soldering, the metal layer 240 of the portion is easily cut, and there is a possibility that the resistance in the up-down direction varies.
In particular, in order to make it difficult for the electrical contact terminal 200 to separate from the circuit board by external force, the soldering strength of the electrical contact terminal 200 should be good, and therefore, it is preferable that the boundary portion where the solder layer 30 meets the metal layer 240 is located at a predetermined height from the lower end to the side surface of the electrical contact terminal 200, in which case, if the electrical contact terminal 200 is repeatedly pressed a plurality of times, the force concentrates at the boundary portion where the solder layer 30 located at the side surface portion meets the metal layer 240, and thus cracks of the metal layer 240 may occur at this portion.
If the solder layer 30 is not formed on the side surface portion of the metal layer 240 constituting the height of the electric contact terminal 200 but formed only on the bottom surface of the metal layer 240, there is a disadvantage in that the soldering strength of the electric contact terminal 200 is weak, and in particular, in the case where the height and width of the electric contact terminal 200 are high and greater than the length, the soldering strength of the electric contact terminal 200 is weaker.
For example, in the case where the solder layer 30 is not formed on the side surface of the metal layer 240 but is formed only on the bottom surface of the metal layer 240, the area of the final metal layer 240 to be soldered is narrow and the soldering strength is weak, and in particular, in the case where the height of the electrical contact terminal 200 is high, there is a disadvantage in that the electrical contact terminal 200 is easily separated from the conductive pattern 20 by a force applied sideways.
Therefore, although research and development have been conventionally conducted to prevent cracking of the metal layer 240 at the boundary portion where the solder layer 30 and the metal layer 240 of the electric contact terminal 200 meet, no alternative has been proposed that can electrically connect the opposing object and the electric contact terminal 200 stably even when the electric contact terminal 200 is repeatedly pressed to cause cracking in the metal layer 240 while the welding strength is strong.
Disclosure of Invention
The purpose of the present utility model is to provide a mounting structure for an electrical contact terminal, which is capable of preventing the electrical resistance of the electrical contact terminal in the vertical direction from greatly increasing even if cracks occur in a metal layer due to repeated pressing in the vertical direction.
Another object of the present utility model is to provide a mounting method of an electrical contact terminal, as follows: even if the electric contact terminal having a high height and a width larger than the length is repeatedly pressed a plurality of times, the electric connection is not completely broken or the resistance is greatly increased in the vertical direction, and the welding strength is strong.
Another object of the present utility model is to provide a mounting structure and a mounting method for an electrical contact terminal, which are easy and inexpensive to modify a circuit board at a soldering portion.
According to an aspect of the present utility model, there is provided a mounting method of an elastic electric contact terminal as a mounting method of mounting an elastic electric contact terminal to a circuit board, wherein the elastic electric contact terminal is composed of an elastic core, a heat-resistant polymer film which is sandwiched by an adhesive layer so as to continuously surround and adhere the core in a longitudinal direction of the core, and a metal layer which is continuously formed on an outer surface of the polymer film, characterized by comprising the steps of: coating solder paste on the conductive pattern formed on the circuit board; mounting soldering portions including both side lower portions of the metal layer of the electric contact terminal so as to be placed above the solder paste, and performing reflow soldering; and forming a main solder layer in the solder portion by melting the solder paste by the soldering and joining the metal layer, a portion of the solder paste rising along a side of the electrical contact terminal to form a side solder layer, wherein a length of the solder paste to be applied is smaller than a length of the metal layer.
Preferably, the length of the conductive pattern is greater than or equal to the length of the metal layer and greater than the length of the solder paste.
According to another aspect of the present utility model, there is provided a mounting structure of an elastic electric contact terminal as a structure of mounting an elastic electric contact terminal on a circuit board, wherein the elastic electric contact terminal is composed of an elastic core, a heat-resistant polymer film which is continuously sandwiched by an adhesive layer in a longitudinal direction of the core so as to surround and adhere the core, and a metal layer formed on an outer surface of the polymer film, and the elastic electric contact terminal is capable of being soldered by surface mounting, characterized in that, in the electric contact terminal, a solder portion including both lower surfaces in a width direction of the metal layer is sandwiched by a main solder layer formed by applying solder paste over a conductive pattern formed on the circuit board so as to be mounted between upper sides of the conductive pattern formed on the circuit board, and a part of the main solder layer is raised along a side surface of the metal layer so as to form a side solder layer, and a length of the metal layer is longer than a length of the side solder layer.
Preferably, the conductive patterns are formed of a single body, the main solder layers are formed separately from each other along the soldering portions of the metal layers above the conductive patterns, or are formed separately from each other along the soldering portions of the metal layers, and the main solder layers are formed above the conductive patterns, respectively.
According to another aspect of the present utility model, there is provided a mounting structure of an elastic electric contact terminal as a mounting structure of mounting the elastic electric contact terminal to a mounting pattern of a circuit board, wherein the elastic electric contact terminal is composed of an elastic core, a heat-resistant polymer film which is bonded to the core with an adhesive layer interposed therebetween, and a metal layer formed on an outer surface of the polymer film, and the elastic electric contact terminal is capable of being soldered by surface mounting, characterized in that a length of the metal layer is longer than a length of a main solder layer formed above the conductive pattern, so that a contact portion where the main solder layer is not formed is formed at least one end portion of both ends of the metal layer, and if the electric contact terminal is pressed by pressing from above, the contact portion is brought into contact with the conductive pattern to be electrically connected.
Preferably, the contact portion may be formed at a lower portion of both ends of the metal layer, and both ends of the conductive pattern may protrude and extend from both ends of the metal layer.
Preferably, the contact portion may be spaced apart from the conductive pattern by a predetermined gap by the main solder layer, and a length of the contact portion may be a length to enable the contact portion to contact the conductive pattern when the electrical contact terminal is pressed by 10%.
According to the present utility model, even if cracks occur in the metal layer located at the portion where the metal layer on the side surface of the electric contact terminal meets the side surface solder layer due to repeated pressing of the electric contact terminal a plurality of times, the metal layers on both ends of the side surface of the electric contact terminal are not formed or are formed less, and the resistance in the vertical direction of the electric contact terminal is not greatly increased.
Further, the side surface solder layer is formed in the center portion of the metal layer of the electric contact terminal, so that the soldering strength is strong.
Further, by external pressing, the metal layer portion longer than the length of the solder pattern is connected to the conductive pattern without solder, and thus, reliable electrical connection is provided.
Further, a single conductive pattern is formed on the circuit board, and a solder pattern based on solder paste is formed separately thereon, thereby having advantages of easy modification of soldered portions and low modification cost.
Drawings
Fig. 1 a) and 1 b) are a front view and a side view, respectively, showing an example of a conventional mounting structure of an elastic electric contact terminal.
Fig. 2 is a view showing a state where an elastic electric contact terminal according to an embodiment of the present utility model is attached.
Fig. 3 a) and fig. 3 b) show before and after pressing, respectively.
Fig. 4 a) and fig. 4 b) show cases where solder paste is applied on the conductive pattern, respectively.
Detailed Description
The technical terms used in the present utility model are used only to illustrate specific embodiments, and are not intended to limit the present utility model. Further, technical terms used in the present utility model should be interpreted as meaning commonly understood by a person having ordinary skill in the art to which the present utility model pertains, unless otherwise defined in the present utility model, and should not be interpreted as meaning excessively broad or excessively narrow.
Hereinafter, specific embodiments of the present utility model will be described in detail with reference to the accompanying drawings.
Fig. 2 shows a state in which the elastic electric contact terminal according to an embodiment of the present utility model is mounted, and a) and b) of fig. 3 show cases before and after being pressed, respectively.
The electric contact terminal 200 has a structure as shown in fig. 1, and is composed of a tube-shaped elastic core 210 having a through hole formed therein in the longitudinal direction, a heat-resistant polymer film 230 sandwiching an adhesive layer so as to surround the adhesive core 210 in the width direction, and a metal layer 240 formed on the outer surface of the polymer film 230.
Such an electric contact terminal 200 is described in korean patent laid-open nos. 10-1001354, 10-1711013, 10-1735656, 10-2038412, 10-2331990, etc. mentioned above.
In this embodiment, the case where the through-holes are formed in the elastic core 210 is described as an example, but the present utility model is not limited thereto, and may include a foam rubber having heat resistance corresponding to welding and not having through-holes.
The shape of the solder portion 245, which is a portion including the lower portions of the both sides of the metal layer 240 and soldered above the conductive pattern 20 of the circuit board 10, may be a rounded shape as shown in fig. 1 in the present embodiment, but is not limited thereto, and may be a substantially planar surface.
For example, in the case where the core 210 is made of foamed rubber, the bottom surface of the electric contact terminal 200 may be substantially flat, and the welded portion 245 may be flat.
The metal layer 240 formed on the outer surface of the polymer film 230 may be formed by sputtering a metal on the polymer film 230 and copper plating, or may be formed by curing after casting a liquid polymer resin on a copper foil, or may be formed by bonding a copper foil on a polymer film using an adhesive.
If the solder portion 245 of the metal layer 240 of the electric contact terminal is pressed and arranged over the solder paste coated over the conductive pattern 20 separately formed over the circuit board 10 by vacuum pickup and reflow soldering is performed, the molten solder paste in a liquid state is cooled between the lower surface of the metal layer 240 and the conductive pattern 20, thereby forming a solid state main solder layer 30, and rises along the side of the metal layer 240 of the electric contact terminal 200 and is cooled, forming a solid state side solder layer 32.
The conductive pattern 20 is generally referred to herein as a pad (print) or Land pattern (Land pattern), and functions to electrically connect electronic components mounted opposite to a circuit board by soldering.
In the following description, for convenience of understanding, a portion where solder paste is cooled between the lower surface of the metal layer 240 and the upper surface of the conductive pattern 20 is referred to as a main solder layer 30, and a portion where solder paste rises above the metal layer 240 along the side of the electrical contact terminal 200 and is cooled is referred to as a side solder layer 32.
Fig. 4 a) and fig. 4 b) show examples of the solder paste coated on top of the conductive pattern, respectively.
Referring to a) of fig. 4, the solder paste 31 is coated over the individual conductive patterns 20, and the length of the conductive patterns 20 is formed to be greater than the length of the solder paste 31.
In other words, both ends of each of the conductive patterns 20 are disposed apart from both ends of the solder paste 31 by a predetermined distance, and the conductive patterns 20 not coated with the solder paste 31 are exposed to the spaced portions.
Solder paste 31 is applied over each of the conductive patterns 20, and is formed so as to be symmetrical to each other for ease of reflow soldering.
As shown in a) of fig. 4, in the case of separately forming the conductive patterns 20, if the conductive patterns 20 are to be newly manufactured in order to minimize cracks generated in the metal layer 240 or to improve the welding strength, much cost may be required.
For example, the solder pattern to which the solder paste 31 is applied is formed using a metal mask, and therefore, in the case of changing the solder pattern, the solder pattern can be modified only by replacing the corresponding metal mask, and conversely, if the conductive pattern 20 is to be replaced, the entire circuit board 10 needs to be replaced.
In this regard, as shown in b) of fig. 4, in the case where a single conductive pattern 22 is formed and a solder paste 31 is separated thereon and applied, when the electrical contact terminal 200 is pressed, the generation of cracks is easily minimized and a solder pattern having a proper soldering strength is easily provided.
Further, even if a single conductive pattern 22 is applied, the solder paste 31 is separated and applied, and the lower surface of the metal layer 240 of the electrical contact terminal 200 is also separated, so that the electrical contact terminal 200 is reliably reflow soldered.
The thickness of the solder paste 31 in the Gel (Gel) state is about 0.08mm to 0.15mm, and the width is equal to or smaller than the width of the conductive pattern 20.
According to the present utility model, the length of the side solder layer 32 formed in the length direction along the side of the metal layer 240 is smaller than the length of the metal layer 240 of the electrical contact terminal 200.
Specifically, as shown in fig. 3 a), when the length of the metal layer 240 is L and the length of the side solder layer 32 is L, the length of the side solder layer 32 is smaller than the length of the metal layer 240 (L > L).
Referring to a) of fig. 3, both ends of the metal layer 240 are spaced apart from both ends of the side solder layer 32, respectively, and the side solder layer 32 is not formed therebetween.
Unlike this embodiment, one end of the metal layer 240 may be spaced apart from one end of the side solder layer 32 without forming the side solder layer 32 therebetween, and the other end of the metal layer 240 may coincide with the other end of the side solder layer 32.
In other words, it is important that at least one end of the metal layer 240 is spaced apart from one end of the side solder layer 32 so that the side solder layer 32 is not formed therebetween.
In terms of manufacturing process, it is assumed that the length of the solder paste 31 above the conductive pattern 20 is formed smaller than the length of the metal layer 240 (i.e., the electrical contact terminal 200) when the solder paste 31 is coated on the entire width of the conductive pattern 20 with a conventional thickness. In other words, in consideration of the case where the solder paste 31 spreads in the length direction and rises in the height direction along the side, the length of the solder paste 31 is made smaller than the length of the metal layer 240, and eventually the length of the side solder layer 32 can be made smaller than the length of the metal layer 240.
Preferably, in consideration of the width and length of the electrical contact terminal 200, the length of the solder paste 31 may be coated to an extent of 0.4mm to 4mm smaller than the length of the metal layer 240, but is not limited thereto.
For example, in the case where the length of the electrical contact terminal 200 is 2mm, the length of the solder paste 31 may be 1.8mm to 1.4mm, and preferably, at the time of reflow soldering, the middle portion in the length direction of the electrical contact terminal 200 is located at the middle portion in the length direction of the solder paste 31 so that the electrical contact terminal 200 is kept balanced.
In the case where the metal layer 240 is tin (Sn), silver (Ag), or gold (Au), particularly, gold (Au), when the solder paste 31 is reflow-soldered, the solder paste 31 rises much along the side of the metal layer 240 to form the side solder layer 32, and thus, the conductive pattern 20, the solder paste 31, and the size of the metal layer can be selected and provided according to the metal type of the metal layer 240.
As described above, the length of the metal layer 240 of the electric contact terminal 200 is longer than the length of the solder paste 31 coated over the conductive pattern 20.
Further, the length of the conductive pattern 20 may be formed to be longer than the length of the metal layer 240, and at least one of both ends of the conductive pattern 20 protrudes longer than the end of the metal layer 240.
As in the above-described embodiment, the main solder layer 30 is formed by melting and joining the solder paste applied over the conductive pattern 20 by soldering, and a portion of the solder paste rises along the side of the electrical contact terminal 200 to form the side solder layer 32.
Referring to a) of fig. 3, the solder layer is formed with a thickness of about 0.05mm so that the metal layer 240 corresponding to the portion not coated with the solder paste may form a predetermined gap 244 with the conductive pattern 20 in the conductive pattern 20.
Therefore, when the crack 242 of the metal layer 240 is generated at the boundary portion where the side solder layer 32 and the metal layer 240 meet due to repeated pressing of the electric contact terminal 200, the resistance between the metal layer 240 and the conductive pattern 20 may be greatly increased.
According to this embodiment, as shown in b) of fig. 3, if the electrical contact terminal 200 is pressed by an external force from above, a metal layer portion (i.e., a contact portion 241 (indicated by a quadrangle of a broken line in b) of the conductive pattern 20) corresponding to a portion of the conductive pattern 20 where the solder paste 31 is not applied (in other words, a portion where the side solder layer 32 is not formed) is brought into contact with and electrically connected to the upper side of the conductive pattern 20.
In particular, by forming the conductive pattern 20 longer than the metal layer 240 and protruding from the end portion of the metal layer 240, the contact portion 241 can be electrically connected to the conductive pattern 20 stably and reliably.
The length of the contact portion 241 is not particularly limited, and may be a length capable of electrically connecting the metal layer 240 and the conductive pattern 20 in direct contact if the electrical contact terminal 200 is compressed by about 10% or more.
In this embodiment, a case where the crack 242 is generated at the entire boundary portion where the side solder layer 32 meets the metal layer 240 and the electric path through the side solder layer 32 is completely broken in the metal layer 240 is described as an example.
However, the side solder layer 32 is formed at a relatively low height so that cracks are not generated at the boundary of the metal layer 240 and the side solder layer 32 in both sides of the side solder layer 32 even if the electrical contact terminal 200 is repeatedly pressed.
In this case, in addition to the electrical path formed by directly contacting the metal layer 240 with the conductive pattern 20 through the contact portion 241 of the metal layer 240 described above, electrical paths based on the metal layer 240 and the side solder layer 32 are provided on both sides of the side solder layer 32 where the crack 242 is not generated, so that the resistance can be further reduced.
While the embodiments of the present utility model have been described above mainly, it is obvious that various modifications will be possible to those skilled in the art. Therefore, the scope of the claims of the present utility model should not be construed as being limited to the above-described embodiments, but should be construed according to the scope of the claims.
Claims (12)
1. A mounting method of an elastic electric contact terminal as a mounting method of mounting an elastic electric contact terminal to a circuit board, wherein the elastic electric contact terminal is composed of an elastic core, a heat-resistant polymer film which is sandwiched by adhesive layers so as to continuously surround and adhere the core in a longitudinal direction of the core, and a metal layer which is continuously formed on an outer surface of the polymer film, characterized by comprising the steps of:
coating solder paste on the conductive pattern formed on the circuit board;
mounting soldering portions including both side lower portions of the metal layer of the electric contact terminal so as to be placed above the solder paste, and performing reflow soldering; and
in the solder portion, the solder paste is melted by the soldering and joined with the metal layer to form a main solder layer, a portion of the solder paste rises along a side of the electrical contact terminal to form a side solder layer,
wherein the length of the solder paste to be coated is smaller than the length of the metal layer.
2. The method of mounting an elastic electrical contact terminal according to claim 1, wherein,
the length of the conductive pattern is greater than or equal to the length of the metal layer.
3. The method of mounting an elastic electrical contact terminal according to claim 1, wherein,
the length of the conductive pattern is longer than the length of the solder paste.
4. The method of mounting an elastic electrical contact terminal according to claim 1, wherein,
the conductive pattern is an unseparated unitary body.
5. A mounting structure of an elastic electric contact terminal as a structure of mounting the elastic electric contact terminal on a circuit board, wherein the elastic electric contact terminal is composed of an elastic core, a heat-resistant polymer film which is continuously sandwiched by adhesive layers along the length direction of the core to surround and adhere the core, and a metal layer formed on the outer surface of the polymer film, and the elastic electric contact terminal can be soldered by surface mounting, characterized in that,
in the electric contact terminal, the soldering portions including both lower surfaces in the width direction of the metal layer are attached above the conductive pattern formed on the circuit board by sandwiching a main solder layer formed by applying solder paste above the conductive pattern formed on the circuit board,
a portion of the solder paste rises along the side of the metal layer to form a side solder layer,
the length of the metal layer is greater than the length of the side solder layer.
6. The mounting structure of an elastic electric contact terminal according to claim 5, wherein,
the conductive pattern is composed of a single body, and the main solder layers are formed above the conductive pattern along the soldering portions of the metal layers separately from each other.
7. The mounting structure of an elastic electric contact terminal according to claim 5, wherein,
the conductive patterns are formed separately from each other along the soldering portions of the metal layers, and the main solder layers are respectively formed above the conductive patterns.
8. The mounting structure of an elastic electric contact terminal according to claim 5, wherein,
the length of the conductive pattern is greater than the length of the main solder layer.
9. A mounting structure of an elastic electric contact terminal as a mounting structure of a mounting pattern for mounting the elastic electric contact terminal to a circuit board, wherein the elastic electric contact terminal is composed of an elastic core, a heat-resistant polymer film surrounding and adhering the core with an adhesive layer interposed therebetween, and a metal layer formed on an outer surface of the polymer film, and the elastic electric contact terminal is capable of being soldered by surface mounting, characterized in that,
the length of the metal layer is greater than the length of the main solder layer formed over the conductive pattern, so that a contact portion where the main solder layer is not formed is formed at least one of the both ends of the metal layer,
if the electric contact terminal is pressed by being pressurized from the upper portion, the contact portion is brought into contact with the conductive pattern to be electrically connected.
10. The mounting structure of an elastic electric contact terminal according to claim 9, wherein,
the contact portions are formed at lower portions of both ends of the metal layer,
both ends of the conductive pattern protrude from both ends of the metal layer to extend.
11. The mounting structure of an elastic electric contact terminal according to claim 9, wherein,
the contact portion is separated from the conductive pattern by a predetermined gap by the main solder layer,
the length of the contact portion is a length to enable the contact portion to contact the conductive pattern when the electrical contact terminal is pressed by 10%.
12. The mounting structure of an elastic electric contact terminal according to claim 9, wherein,
an end portion of the conductive pattern corresponding to the contact portion protrudes and extends from an end portion of the metal layer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2022-0016420 | 2022-02-08 | ||
| KR1020220079891A KR102687385B1 (en) | 2022-02-08 | 2022-06-29 | Method for mounting elastic electric contact terminal |
| KR10-2022-0079891 | 2022-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116583037A true CN116583037A (en) | 2023-08-11 |
Family
ID=87541915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310139879.7A Pending CN116583037A (en) | 2022-02-08 | 2023-02-08 | Mounting method and mounting structure of elastic electric contact terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116583037A (en) |
-
2023
- 2023-02-08 CN CN202310139879.7A patent/CN116583037A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4815981A (en) | Flexible printed circuit board terminal structure | |
| KR101662264B1 (en) | Solderable elastic electric contact terminal | |
| JP5011562B2 (en) | Semiconductor device and manufacturing method thereof | |
| KR20090057328A (en) | Elastic contact and method for bonding between metal terminals using the same | |
| KR101562938B1 (en) | Electric contact terminal | |
| KR101025792B1 (en) | Solderable electric and elastic contacts | |
| JP5479406B2 (en) | connector | |
| US7439625B2 (en) | Circuit board | |
| CN2660712Y (en) | Terminal of electrical connector | |
| CN115566451B (en) | Ground terminal and electronic equipment | |
| CN116583037A (en) | Mounting method and mounting structure of elastic electric contact terminal | |
| JP2002290028A (en) | Connection structure and method for printed wiring board | |
| JP2012523685A (en) | Conductor grid for electronic housing and manufacturing method | |
| KR102687385B1 (en) | Method for mounting elastic electric contact terminal | |
| CN221728566U (en) | Circuit board assembly and terminal device | |
| JP2004235232A (en) | Mounting structure of electronic component | |
| JP2006208062A (en) | Contact member, contact sheet using contact member, contact substrate, and electronic equipment unit | |
| CN109714892B (en) | Electric connector and assembling method thereof | |
| KR102651162B1 (en) | Elastic and electric contact terminal and Structure for mounting the same | |
| CN219180189U (en) | Paster buzzer composition structure | |
| JP3237910B2 (en) | Terminal structure of flexible substrate | |
| CN116259992A (en) | Solderable elastic electric contact terminal | |
| JP4457420B2 (en) | Manufacturing method of chip resistor | |
| JP4724963B2 (en) | Thermal fuse | |
| JPH0521097A (en) | Terminal structure of printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |