CN116583034A - FPC built-in component packaging method applied to OLED module - Google Patents
FPC built-in component packaging method applied to OLED module Download PDFInfo
- Publication number
- CN116583034A CN116583034A CN202310395664.1A CN202310395664A CN116583034A CN 116583034 A CN116583034 A CN 116583034A CN 202310395664 A CN202310395664 A CN 202310395664A CN 116583034 A CN116583034 A CN 116583034A
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- fpc
- resistor
- insulating layer
- built
- packaging
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- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 29
- 239000003990 capacitor Substances 0.000 claims abstract description 31
- 238000007639 printing Methods 0.000 claims abstract description 19
- 238000003466 welding Methods 0.000 claims abstract description 15
- 239000011810 insulating material Substances 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 229910000570 Cupronickel Inorganic materials 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 claims description 3
- 230000008878 coupling Effects 0.000 abstract description 5
- 238000010168 coupling process Methods 0.000 abstract description 5
- 238000005859 coupling reaction Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 4
- 238000010146 3D printing Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The invention relates to an FPC built-in component packaging method applied to an OLED module, which comprises the following steps: resistor printing curing and capacitor built-in. According to the invention, the resistor is 3D printed on the FPC insulating layer, and the capacitor is arranged in the FPC insulating layer and then laser welding is adopted, so that the thickness of the FPC is reduced, the flexibility of the FPC is improved, the line coupling interference is reduced, and the process flow of packaging components is reduced; meanwhile, the 3D printed film resistor and the sine wave wiring are adopted, so that the resistor precision is kept stable, the harmonic loss is reduced, and the temperature rise is reduced.
Description
Technical Field
The invention relates to the technical field of FPC production, in particular to a packaging method of an FPC built-in component applied to an OLED module.
Background
OLED (organic light emitting diode) belongs to a replaceable liquid crystal display screen, has the advantages of self-luminescence, wide viewing angle, energy conservation, environmental protection and the like, and the application of OLED covers two markets of flat panel display and lighting devices, and relates to multiple fields of televisions, displays, mobile phones, wearable equipment, lamps, aviation and the like. The current mainstream FPC components and parts encapsulation mode that is applied to OLED module is surface mounting, but component surface mounting still makes FPC's volume too big and compliance not much, and part manufacturer adopts from pasting the mode of installing at FPC surface integration to burying inside FPC with components and parts, because the circuit thin density of the FPC who is applied to the OLED module is higher, the pad interval is little, the inner space is narrow, leads to burying the inside components and parts of FPC unable effective heat dissipation, and produces coupling interference between components and parts and FPC line layer easily.
Disclosure of Invention
In order to solve the defects that the FPC component packaging method applied to the OLED module in the prior art has overlarge FPC volume and insufficient flexibility, components cannot effectively dissipate heat and coupling interference is easy to generate, the invention provides a technical scheme that resistors are directly printed on an FPC insulating layer in a 3D mode, capacitors are arranged in the FPC insulating layer, and electrodes are connected with an FPC circuit layer in a laser welding mode, so that the thickness of the FPC is reduced, the flexibility of the FPC is improved, the temperature rise of the components is reduced, and the coupling interference of the circuit is avoided.
The technical scheme adopted for solving the technical problems is as follows:
the invention provides an FPC built-in component packaging method applied to an OLED module, which comprises the following steps: and (3) resistor printing and curing: printing a resistor on the FPC insulating layer by using a 3D printer and curing; and (3) capacitor is built in: and the capacitor is internally arranged in the FPC insulating layer, and the capacitor electrode is exposed from the FPC insulating layer to be connected to the FPC circuit layer, so that the thickness of the FPC is reduced, and the packaging process flow is reduced.
Further, the method for packaging the FPC built-in component further comprises the following steps: and manufacturing an FPC circuit layer and laser welding. Laser welding: and the resistance electrode and the capacitance electrode are respectively connected to the FPC circuit layer in a laser welding mode, so that quick and reliable connection between different materials is realized, and the capacitance electrodes exposed out of the FPC insulating layer are filled with insulating materials.
Further, the method further comprises the steps of etching and exposing the insulating layer before the resistor printing curing and capacitor embedding: and etching copper foil or a bonding pad at the position of the resistor and the capacitor to expose the FPC insulating layer, so as to facilitate 3D printing of the resistor on the surface of the FPC insulating layer and arranging the capacitor inside the FPC insulating layer.
Further, after exposing the FPC insulating layer and before resistor printing curing, the method further comprises the steps of cleaning the surface of the insulating layer: the surface of the exposed FPC insulating layer is cleaned, so that the combination between the resistor and the FPC insulating layer is better and the positioning is accurate.
Further, after the resistor printing curing, the method further comprises the steps of: and passivating the resistor to reduce metal oxidation on the surface of the resistor and stabilize the resistor precision.
Further, the method for packaging the FPC built-in component further comprises the steps of coating an insulating material: insulating materials are respectively coated on the surfaces of the FPC insulating layer of the printing resistor and the built-in capacitor and the surfaces of the adjacent FPC circuit layers so as to protect the FPC circuit layers and components built in the FPC.
Further, the resistor is a film resistor for improving precision and reducing temperature rise, the resistor wiring mode is sine wave shape for reducing harmonic loss and reducing temperature rise, and the resistor material is copper-nickel alloy.
The beneficial effects of the invention are as follows: according to the invention, after the resistor is 3D printed on the FPC insulating layer and the capacitor is arranged in the FPC insulating layer, the resistor is connected to the FPC circuit layer by adopting laser welding, so that the thickness of the FPC is reduced, the flexibility of the FPC is improved, the circuit coupling interference is reduced, and the process flow of packaging components is reduced; meanwhile, the 3D printed film resistor and the sine wave wiring are adopted, so that the resistor precision is kept stable, the harmonic loss is reduced, and the temperature rise is reduced.
Drawings
FIG. 1 is a process flow diagram of a method for packaging an FPC built-in component provided by an embodiment of the invention;
fig. 2 is a schematic diagram of a package structure manufactured by using an FPC-embedded component packaging method according to an embodiment of the present invention.
Reference numerals:
1-an FPC insulating layer;
2-FPC circuit layer;
3-resistance; 31-a resistive electrode; 32-resistor wiring;
4-capacitance; 41-capacitive electrodes; 42-capacitance wiring;
5-insulating material.
Detailed Description
The invention is further described below with reference to the drawings and detailed description.
Referring to fig. 1 and 2, the invention provides a method for packaging an FPC-embedded component applied to an OLED module, comprising the steps of: resistor 3 printing and curing: printing a resistor 3 on the FPC insulating layer 1 by using a 3D printer and curing; the capacitor 4 is built in: the capacitor 4 is embedded in the FPC insulating layer 1, and the capacitor electrode 41 is exposed from the FPC insulating layer 1.
Specifically, the embedded component can shorten the distance of signal transmission, improve the electrical characteristics, improve the body and people of the circuit board, reduce welding parts, improve the reliability of packaging, and simultaneously, the embedded component is small in size, easy to package and the like, thereby being very beneficial to reducing the cost and especially improving the electrical characteristics. The sheet resistor 3 built in the FPC is generally used in the inner layer of the multi-layer board, and the resistor 3 is directly manufactured on the inner layer board by adopting an etching mode to replace the resistor 3 attached to the surface of the FPC, so that the maximum limit of the FPC is thinned, and the overall function is enhanced. However, the etching method makes the alignment not accurate enough, and the line length and line width of the resistor not accurate enough, so that the resistor is not accurate. Along with development of a microcosmic 3D printing technology, the resistor can be accurately positioned and aligned through the 3D printing technology, accurate wiring of the resistor 3 is realized, and the precision of the resistor 3 is greatly improved. The capacitors 4 are arranged in the FPC insulating layer 1 and parallel to the FPC surface, and if a plurality of capacitors 4 are to be arranged in the FPC insulating layer 1, the capacitors 4 are symmetrically arranged in the same FPC insulating layer 1 as much as possible, so that the processing flow is reduced, and the mutual interference between the capacitors and the FPC circuit layer are avoided or reduced.
Preferably, the packaging method of the FPC built-in component packaging method further comprises the steps of: the FPC wiring layer 2 is fabricated.
Specifically, the FPC wiring layer 2 is preferably manufactured before the resistor 3 and the built-in capacitor 4 are printed, so as to reduce the damage to the built-in components caused by the manufacture of the FPC wiring layer 2.
Preferably, the method for packaging the FPC-embedded component further comprises the step of laser welding: the resistive electrode 31 and the capacitive electrode 41 are connected to the FPC wiring layer 2 by laser welding, respectively, and the space between the capacitive electrodes 41 exposed from the FPC insulating layer 1 is filled with the insulating material 5.
In particular, laser welding has the advantages of high speed, large depth and small deformation compared with other welding technologies, and can realize welding among materials which are refractory to each other and micro welding in a small space which is difficult to access.
Preferably, the step of etching the exposed insulating layer is further included before the step of resistor 3 print curing and capacitor 4 embedding: copper foil or pads where resistor 3 and capacitor 4 are located are etched away to expose FPC insulating layer 1.
Specifically, since the subsequent printing of the resistor 3 and the embedding of the capacitor 4 are performed on the surface or inside of the FPC insulating layer 1, the copper foil or the bonding pad of the FPC wiring layer 2 corresponding to the printed and embedded portion needs to be etched first to bare out the working surface of the FPC insulating layer 1.
Preferably, after exposing the FPC insulation layer 1 and before printing and curing the resistor 3, the method further comprises the step of cleaning the surface of the insulation layer: the exposed surface of the FPC insulating layer 1 is cleaned.
Specifically, the FPC insulating layer 1 itself and the cleanliness degree may affect the packaged components, and the attached stains may be conductive, which may affect the use effect and precision of the components, and even if the attached stains are non-conductive, may affect the positioning precision and the packaging stability, thereby affecting the precision of the components. Therefore, between the 3D printing resistors 3, the FPC insulating layer 1 needs to be pre-treated, and impurities are cleaned as much as possible, so that the influence of the impurities on the printing, the embedding and the packaging of subsequent components is reduced.
Preferably, after the resistor 3 printing and curing, the method further comprises the steps of: the resistor 3 is passivated.
Specifically, the resistive material is an alloy material, and air oxidation or rust easily occurs between the encapsulation insulating materials to affect the accuracy of the resistance, so that it is necessary to form a passivation film on the metal surface by a passivation process.
Preferably, the FPC-built-in component packaging method further includes the step of applying an insulating material 5: insulating materials 5 are respectively coated on the surfaces of the FPC insulating layer 1 of the printing resistor 3 and the built-in capacitor 4 and the surface of the adjacent FPC circuit layer 2.
Specifically, an essential ring in the package is to apply insulating material 5 to protect the wires, pads, and components. In order to reduce the material stress and the swelling and collapsing effect, it is preferable that the materials of the insulating material 5 and the FPC insulating layer 1 are kept uniform.
Preferably, the resistor 3 is a film resistor, the routing mode of the resistor 3 is sine wave, and the resistor 3 is made of copper-nickel alloy.
In particular, the film resistor has the advantage of small volume, the resistor value precision, the temperature coefficient and the stability of the resistor are excellent, and the manufacturing process is simple by adopting a 3D printing mode. In order to ensure the resistance value of the resistor between the two electrodes, the resistor is often in a winding and wiring mode, and a common wiring mode comprises a serpentine wire or an S-shaped wire, so that the method has the advantage of adjusting the signal delay, but also has the defect of damaging a circuit signal. The sine wave form wiring realizes the sine of the magneto-acoustic wave form, reduces harmonic loss generated by harmonic action, improves the resistance efficiency and reduces the temperature rise, but the difficulty in production is high and low in precision by adopting an etching mode, the difficulty in production is avoided by adopting the 3D printing sine wave form wiring, and the required resistance value can be accurately designed by calculating the line length and the line width. The capacitor trace 42 is preferably linear.
Note that, the FPC insulating layer 1, the insulating material 5, and the capacitor 4 of this embodiment may also be printed in 3D. The FPC can be a double-layer board or a multi-layer board.
It will be apparent to those skilled in the art from this disclosure that various other changes and modifications can be made which are within the scope of the invention as defined in the appended claims.
It should be noted that: the embodiments described above are only some, but not all, embodiments of the invention. As used in the examples and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
Claims (10)
1. The FPC built-in component packaging method applied to the OLED module is characterized by comprising the following steps of:
and (3) resistor printing and curing: printing a resistor on the FPC insulating layer by using a 3D printer and curing;
and (3) capacitor is built in: and the capacitor is embedded into the FPC insulating layer, and the capacitor electrode is exposed from the FPC insulating layer.
2. The method for packaging the FPC-embedded component applied to the OLED module according to claim 1, further comprising the steps of: and manufacturing an FPC circuit layer.
3. The method for packaging the FPC-embedded component applied to the OLED module according to claim 2, further comprising the step of laser welding: and respectively connecting the resistance electrode and the capacitance electrode to the FPC circuit layer by using a laser welding mode, and filling the space between the capacitance electrodes exposed out of the FPC insulating layer with insulating materials.
4. The method of claim 1, further comprising the step of etching to expose the insulating layer prior to the step of resistive print curing and capacitor embedding: and etching copper foil or a bonding pad of the FPC circuit layer at the positions of the resistor and the capacitor to expose the FPC insulating layer.
5. The method for packaging the built-in component of the FPC applied to the OLED module of claim 4, further comprising the step of cleaning the surface of the insulating layer after exposing the insulating layer of the FPC and before curing by resistive printing: and cleaning the surface of the exposed FPC insulating layer.
6. The method for packaging the FPC-built-in component applied to the OLED module according to claim 1, further comprising the steps of, after the step of resistive printing curing: the resistor is passivated.
7. The method for packaging an FPC built-in component applied to an OLED module as claimed in claim 1, further comprising the step of coating an insulating material: and respectively coating insulating materials on the surfaces of the FPC insulating layers of the printing resistor and the built-in capacitor and the surfaces of the adjacent FPC circuit layers.
8. The method for packaging the FPC built-in component applied to the OLED module according to claim 1, wherein the resistor is a sheet resistor.
9. The method for packaging the built-in FPC component applied to the OLED module according to claim 8, wherein the resistor routing mode is sinusoidal.
10. The method for packaging the built-in component of the FPC applied to the OLED module according to claim 8, wherein the resistive material is copper-nickel alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310395664.1A CN116583034A (en) | 2023-04-14 | 2023-04-14 | FPC built-in component packaging method applied to OLED module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310395664.1A CN116583034A (en) | 2023-04-14 | 2023-04-14 | FPC built-in component packaging method applied to OLED module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116583034A true CN116583034A (en) | 2023-08-11 |
Family
ID=87540358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310395664.1A Pending CN116583034A (en) | 2023-04-14 | 2023-04-14 | FPC built-in component packaging method applied to OLED module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116583034A (en) |
-
2023
- 2023-04-14 CN CN202310395664.1A patent/CN116583034A/en active Pending
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