CN116581207A - Automatic marking and packaging integrated machine for semiconductor - Google Patents

Automatic marking and packaging integrated machine for semiconductor Download PDF

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Publication number
CN116581207A
CN116581207A CN202310637535.9A CN202310637535A CN116581207A CN 116581207 A CN116581207 A CN 116581207A CN 202310637535 A CN202310637535 A CN 202310637535A CN 116581207 A CN116581207 A CN 116581207A
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CN
China
Prior art keywords
semiconductor
pipe
containing groove
conveying belt
material containing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310637535.9A
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Chinese (zh)
Inventor
艾兵
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Shanghai Yingshuo Electronic Technology Co ltd
Original Assignee
Shanghai Yingshuo Electronic Technology Co ltd
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Filing date
Publication date
Application filed by Shanghai Yingshuo Electronic Technology Co ltd filed Critical Shanghai Yingshuo Electronic Technology Co ltd
Priority to CN202310637535.9A priority Critical patent/CN116581207A/en
Publication of CN116581207A publication Critical patent/CN116581207A/en
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H37/00—Combinations of mechanical gearings, not provided for in groups F16H1/00 - F16H35/00
    • F16H37/12—Gearings comprising primarily toothed or friction gearing, links or levers, and cams, or members of at least two of these types
    • F16H37/124—Gearings comprising primarily toothed or friction gearing, links or levers, and cams, or members of at least two of these types for interconverting rotary motion and reciprocating motion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • General Engineering & Computer Science (AREA)

Abstract

The invention discloses an automatic marking and packaging integrated machine for a semiconductor, which belongs to the field of automatic packaging of semiconductors and comprises a material conveying belt arranged on a frame; along the conveying direction of the conveying belt, a marking mechanism, a dust removing mechanism and a material receiving mechanism are sequentially arranged at the side of the conveying belt; the material receiving mechanism comprises a material containing groove for containing a material pipe, the material containing groove is obliquely arranged at the tail end of the material conveying belt, and the material pipe is used for packaging semiconductors on the material conveying belt; the material containing groove is arranged on the rotating unit, and the rotating unit controls the inclination angle of the material containing groove. According to the invention, when a semiconductor enters the material pipe, the inclination angle of the material pipe is continuously adjusted through the rotating unit on the basis of ensuring certain initial acceleration, so that the acceleration of the semiconductor entering the material pipe when the semiconductor falls down is gradually reduced to a negative value, the speed of the semiconductor is increased and then reduced, and finally the semiconductor slowly slides to the bottom of the material pipe, so that serious collision is avoided on the basis of ensuring the packaging efficiency, and pins of the semiconductor are protected.

Description

Automatic marking and packaging integrated machine for semiconductor
Technical Field
The invention relates to the technical field of automatic packaging of semiconductors, in particular to an automatic marking and packaging integrated machine for semiconductors.
Background
LED packages are a technology involving multiple disciplines and have found wide application in practical manufacturing processes. There are also many related devices for LED package in China, such as a semiconductor chip tester, a semiconductor chip taping machine, a semiconductor chip sorting machine, a semiconductor chip marking machine, or a semiconductor chip sorting marking machine. At present, there is an automatic marking and packaging integrated machine for semiconductors, which needs to mark the semiconductor first and then put the semiconductor into a tube container for packaging. Such machines typically utilize the weight of the semiconductor itself during encapsulation to enable it to slide along the lanes into an inclined tube for encapsulation. However, this slipping off can cause the semiconductor to collide with the bottom of the tube, potentially damaging the pins of the semiconductor. In addition, the inclination angle of the material pipe is not well set, if the inclination angle is too large, the falling speed is high, so that the collision is serious; if the tilt angle is too small, the semiconductor enters the tube too slowly, resulting in reduced packaging efficiency. Therefore, there is a need for an integrated semiconductor automatic marking and packaging machine that solves the above-mentioned problems.
Disclosure of Invention
The invention provides an automatic marking and packaging integrated machine for a semiconductor, which can continuously adjust the inclination angle of a material pipe through a rotating unit on the basis of ensuring certain initial acceleration when the semiconductor enters the material pipe, so that the acceleration of the semiconductor entering the material pipe when falling is gradually reduced to a negative value, the speed of the semiconductor is increased first and then reduced, and finally the semiconductor slowly slides to the bottom of the material pipe, thereby avoiding serious collision and protecting pins of the semiconductor on the basis of ensuring packaging efficiency.
In order to achieve the above purpose, the present invention provides the following technical solutions: an automatic marking and packaging integrated machine for semiconductors comprises a material conveying belt arranged on a frame; along the conveying direction of the conveying belt, a marking mechanism, a dust removing mechanism and a material receiving mechanism are sequentially arranged at the side of the conveying belt; the material receiving mechanism comprises a material containing groove for containing a material pipe, the material containing groove is obliquely arranged at the tail end of the material conveying belt, and the material pipe is used for packaging semiconductors on the material conveying belt; the material containing groove is arranged on the rotating unit, and the rotating unit controls the inclination angle of the material containing groove.
As a further scheme of the invention, the rotating unit comprises a rotating disc rotatably mounted on the frame, the rotating disc is fixedly mounted on the trough, a half gear is fixedly mounted on the rotating disc in a coaxial center, and the half gear is meshed with a rack horizontally and slidably mounted on the frame; one end of the rack is fixedly provided with a sliding block, and the sliding block is hinged with the first connecting rod through a first hinge shaft; two ends of the first connecting rod are hinged with the sliding block and the driving column respectively; the driving column is eccentrically and fixedly arranged on a driving disc, and the driving disc is rotatably arranged on the frame; the driving disc is fixedly provided with a first rotating shaft which is connected with a driving power supply.
As a further aspect of the present invention, the axis of the driving disk is on the same horizontal line as the axis of the first hinge shaft.
As a further scheme of the invention, the material receiving mechanism further comprises a material pushing unit, wherein the material pushing unit is used for pushing the previous material pipe away from the material containing groove after the previous material pipe is filled with the semiconductor, and pushing the next empty material pipe into the material containing groove.
As a further scheme of the invention, the pushing unit comprises a pipe feeding box fixedly arranged on the rotating disc, and the pipe feeding box is used for stacking empty pipes; the bottom end of the pipe feeding box is provided with a first channel which is communicated with the material containing groove; a second channel opposite to the first channel is also formed on the material containing groove, and the second channel is used for enabling the material pipe filled with the semiconductor to leave the material containing groove; the bottom of the pipe feeding box is also provided with a pushing component for pushing the bottommost pipe.
As a further scheme of the invention, the pushing component comprises a pushing rod which is horizontally and slidably arranged on the pipe feeding box, a sliding rod is fixedly connected to the pushing rod, the sliding rod is slidably arranged in an annular track, a protruding section is arranged in the annular track, and when the sliding rod slides in the protruding section, the pushing rod pushes a pipe at the bottommost layer of the pipe feeding box; the annular track is fixedly arranged on a second rotating shaft, the second rotating shaft drives the annular track to rotate, and the second rotating shaft is rotatably arranged on the frame; the first large gear is fixedly arranged on the second rotating shaft and meshed with the second small gear fixedly arranged on the first rotating shaft, and the transmission ratio of the first large gear to the second small gear is 1: n, n is the number of semiconductors placed at maximum in a single tube.
As a further scheme of the invention, elastic blocking plates are arranged in the first channel and the second channel, the elastic blocking plates are vertically and slidably arranged on the rotating disc, and a first spring is arranged between the elastic blocking plates and the rotating disc.
As a further scheme of the invention, a wedge surface is arranged on one side of the elastic blocking plate, which is close to the pipe feeding box.
As a further scheme of the invention, a blocking block for preventing the tail end of the material conveying belt from blanking is further arranged on the rotating disc, and the blocking block is arranged above the material containing groove.
As a further scheme of the invention, the marking mechanism comprises a laser machine; the tail end of the material conveying belt is obliquely arranged; the dust removing mechanism is arranged beside the inclined conveying belt; the dust removing mechanism comprises a dust suction pipe and a brush which are externally connected with a motor.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, when a semiconductor enters the material pipe, the inclination angle of the material pipe is continuously adjusted through the rotating unit on the basis of ensuring certain initial acceleration, so that the acceleration of the semiconductor entering the material pipe when the semiconductor falls down is gradually reduced to a negative value, the speed of the semiconductor is increased and then reduced, and finally the semiconductor slowly slides to the bottom of the material pipe, so that serious collision is avoided on the basis of ensuring the packaging efficiency, and pins of the semiconductor are protected.
2. The crank sliding block mechanism is selected to drive the half gear to rotate in a reciprocating manner, and the displacement and time change of the sliding block of the mechanism are gentle, so that the half gear is smoothly switched in forward and reverse rotation, and compared with the control of a cylinder and a motor, the crank sliding block mechanism can avoid vibration of a material pipe in switching, and can protect pins of a semiconductor; in addition, a centering crank sliding block mechanism is selected, so that the quick return characteristic is avoided, and vibration of the material pipe during switching is further avoided.
3. The invention uses the rotation of the rotation unit to measure the number of semiconductors in the material pipe, and uses the rotation of the rotation unit to drive the pushing rod to switch a new material pipe when the material pipe is full, and the invention is in cyclic reciprocation, and is tightly matched without an electronic counter and additional power.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an integrated machine for automatic marking and packaging of semiconductors;
FIG. 2 is a schematic structural view of a receiving mechanism according to the present invention;
FIG. 3 is a schematic view of the structure of the receiving mechanism of the present invention after the pipe feeding box is removed;
FIG. 4 is a schematic diagram of a structure of the receiving mechanism of the invention in a half-section after removing a pipe feeding box;
FIG. 5 is an enlarged partial schematic view of portion A of FIG. 4 in accordance with the present invention;
FIG. 6 is a schematic view of a receiving mechanism according to another embodiment of the present invention;
fig. 7 is a schematic diagram showing the relationship between the displacement of the rack and time when the rotating unit rotates.
In the drawings, the list of components represented by the various numbers is as follows:
11-conveying belt, 12-marking mechanism, 13-dedusting mechanism, 14-receiving mechanism, 15-material containing groove, 16-material pipe, 21-rotating disc, 22-half gear, 23-rack, 24-sliding block, 25-first connecting rod, 26-driving disc, 27-driving column, 28-first rotating shaft, 29-driving power supply, 31-first hinging shaft, 32-material conveying box, 33-first channel, 34-second channel, 41-pushing rod, 42-sliding rod, 43-annular track, 44-protruding section, 45-second rotating shaft, 46-first big gear, 47-second small gear, 51-elastic blocking plate, 52-first spring, 53-wedge surface, 54-blocking block, 61-laser machine, 62-dust suction pipe and 63-brush.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-7, the present invention provides an automatic marking and packaging integrated machine for semiconductor, comprising a material conveying belt 11 arranged on a frame; along the conveying direction of the conveying belt 11, a marking mechanism 12, a dust removing mechanism 13 and a material receiving mechanism 14 are sequentially arranged beside the conveying belt 11; the material receiving mechanism 14 comprises a material containing groove 15 for placing a material pipe 16, the material containing groove 15 is obliquely arranged at the tail end of the material conveying belt 11, and the material pipe 16 is used for packaging semiconductors on the material conveying belt 11; the material containing groove 15 is arranged on a rotating unit, and the rotating unit controls the inclination angle of the material containing groove 15.
As a further aspect of the present invention, the marking mechanism 12 includes a laser 61; the tail end of the material conveying belt 11 is obliquely arranged; the dust removing mechanism 13 is arranged beside the inclined conveying belt 11; the dust removing mechanism 13 comprises a dust suction pipe 62 and a brush 63 which are externally connected with a motor.
The working flow of the invention is as follows, as shown in figure 1, the semiconductor passes through the marking mechanism 12 under the conveying of the conveying belt 11, the laser machine 61 prints the coded code on the upper surface of the semiconductor material by using the optical fiber emitter; then the marked semiconductor is conveyed by the conveying belt 11 to a dust removing mechanism 13; at the dust removing mechanism 13, dust remained on the upper surface of the semiconductor material after laser printing is driven by a motor to rotate and clean the antistatic hairbrush 63, and the dust is pumped away and discharged by matching with the dust pumping pipe 62; the cleaned semiconductor then falls along the inclined conveyor into a tube 16 on the receiving mechanism 14 for packaging. The invention is to incline the material containing groove 15 to incline the material pipe 16, so that the semiconductor just enters the material pipe 16 to have certain initial acceleration due to self gravity. When the semiconductor enters the material pipe 16, the rotation unit drives the material containing groove 15 to rotate, the inclination angle of the material groove 15 is gradually reduced xiao Cheng, so that the acceleration of the semiconductor in the material pipe 16 is gradually reduced to a negative value, the speed of the semiconductor in the material pipe 16 is firstly increased and then reduced, and when the speed of the semiconductor is reduced to about 0, the semiconductor reaches the vicinity of the bottom of the material pipe 16. At this time, the rotation unit drives the material containing groove 15 to rotate reversely, and gradually increases the inclination angle of the material containing groove 15 until the original inclination angle is returned. At this time, although the acceleration applied to the semiconductor in the tube 16 increases, the acceleration distance of the semiconductor is small, so that the speed of the semiconductor reaching the bottom is also small, the collision force between the semiconductor and the bottom of the tube 16 is small, and the pins of the semiconductor are protected. According to the invention, when a semiconductor enters the material pipe 16, the inclination angle of the material pipe 16 is continuously adjusted through the rotating unit on the basis of ensuring certain initial acceleration, so that the acceleration of the semiconductor entering the material pipe 16 when falling gradually decreases to a negative value, the speed of the semiconductor is increased and then decreased, and finally the semiconductor slowly slides to the bottom of the material pipe 16, so that serious collision is avoided on the basis of ensuring quick packaging, and pins of the semiconductor are protected.
As a further scheme of the invention, the rotating unit comprises a rotating disc 21 rotatably mounted on a frame, the rotating disc 21, the material containing groove 15 is fixedly mounted on the rotating disc 21, a half gear 22 is fixedly mounted on the rotating disc 21 in a coaxial center, and the half gear 22 is meshed with a rack 23 horizontally and slidably mounted on the frame; a sliding block 24 is fixedly arranged at one end of the rack 23, and the sliding block 24 is hinged with a first connecting rod 25 through a first hinge shaft 31; both ends of the first connecting rod 25 are hinged with the sliding block 24 and the driving column 27 respectively; the driving column 27 is eccentrically and fixedly arranged on the driving disc 26, and the driving disc 26 is rotatably arranged on the frame; the driving disc 26 is fixedly provided with a first rotating shaft 28, and the first rotating shaft 28 is connected with a driving power supply 29.
The method for specifically adjusting the inclination angle of the material pipe 16 by the rotating unit is shown in fig. 3 and 4, and when the semiconductor conveyor belt 11 works, the semiconductor slides into the material pipe 16 on the material containing groove 15. When the semiconductor completely enters the material pipe 16, the driving power supply 29 drives the first rotating shaft 28 to rotate, the first rotating shaft 28 drives the driving disc 26 to rotate, the driving disc 26 rotates to drive the eccentrically arranged driving column 27 to rotate, the driving column 27 drives the sliding block 24 to horizontally reciprocate on the rack through the first connecting rod 25, and the driving disc 26, the driving column 27, the first connecting rod 25 and the sliding block 24 form a crank sliding block mechanism. The sliding block 24 drives the rack 23 to slide reciprocally, and the rack 23 is meshed with the half gear 22, so that the half gear 22 rotates positively and negatively. As shown in fig. 3, the rack 23 drives the half gear 22 to rotate counterclockwise, the half gear 22 drives the rotating disc 21 to rotate counterclockwise, the inclination angle of the material containing groove 15 is gradually reduced, the acceleration of the semiconductor in the material pipe 16 is gradually reduced to a negative value, thus the speed of the semiconductor in the material pipe 16 is firstly increased and then reduced, and when the speed of the semiconductor is reduced to about 0, the semiconductor reaches the vicinity of the bottom of the material pipe 16. At this time, the rack 23 drives the half gear 22 to rotate clockwise, the rotating disk 21 rotates clockwise, the material containing groove 15, and the inclination angle of the material containing groove 15 increases gradually until the original inclination angle is returned. At this time, although the acceleration applied to the semiconductor in the tube 16 increases, the acceleration distance of the semiconductor is small, so that the speed of the semiconductor reaching the bottom is also small, the collision force between the semiconductor and the bottom of the tube 16 is small, and the pins of the semiconductor are protected. As shown in FIG. 7, the crank slider mechanism is selected to drive the half gear 22 to rotate reciprocally, because the displacement and time variation of the slider of the mechanism are gentle, the switching is gentle when the half gear 22 is switched in the forward and reverse directions, and compared with the control of a cylinder and a motor, the crank slider mechanism can avoid the vibration of the material pipe 16 during the switching, and can protect pins of a semiconductor.
As a further aspect of the present invention, the axis of the driving disk 26 is on the same horizontal line as the axis of the first hinge shaft 31. As shown in fig. 4, this arrangement is to make the driving disc 26, the driving column 27, the first link 25 and the slider 24 constitute a centering crank slider mechanism, so that the mechanism has no quick return characteristic, and when the rack 23 drives the half gear 22 to rotate, the material containing groove 15 rotates stably, so as to avoid vibration, and further to protect pins of the semiconductor.
As a further aspect of the present invention, the material receiving mechanism 14 further includes a material pushing unit, where the material pushing unit is configured to push the previous material pipe 16 away from the material containing slot 15 after the previous material pipe 16 is full of semiconductor, and push the next empty material pipe 16 into the material containing slot 15.
As a further aspect of the present invention, the pushing unit includes a tube feeding box 32 fixedly installed on the rotating disc 21, and the tube feeding box 32 is used for stacking the empty tubes 16; a first channel 33 is formed at the bottom end of the pipe feeding box 32, and the first channel 33 is communicated with the material containing groove 15; a second channel 34 opposite to the first channel 33 is further formed on the material containing groove 15, and the second channel 34 is used for allowing the material pipe 16 filled with the semiconductor to leave the material containing groove 15; the bottom of the delivery tube box 32 is also provided with a pushing assembly for pushing the bottommost tube 16.
As shown in fig. 2, when the material tube 16 in the material containing groove 15 is gradually filled, the pushing component at the bottom of the tube feeding box 32 pushes out the empty material tube 16 at the bottom layer, and enters the material containing groove 15 from the first channel 33, and meanwhile, the pushed-out empty material tube 16 can push out the filled material tube 16 in the material containing groove 15 from the second channel 34 to the material containing groove 15, so that switching and cyclic reciprocation are completed.
As a further scheme of the invention, the pushing assembly comprises a pushing rod 41 horizontally and slidably mounted on the pipe feeding box 32, a sliding rod 42 is fixedly connected to the pushing rod 41, the sliding rod 42 is slidably mounted in an annular track 43, a protruding section 44 is arranged in the annular track 43, and when the sliding rod 42 slides in the protruding section 44, the pushing rod 41 pushes a material pipe 16 at the bottommost layer of the pipe feeding box 32; the annular track 43 is fixedly arranged on a second rotating shaft 45, the second rotating shaft 45 drives the annular track 43 to rotate, and the second rotating shaft 45 is rotatably arranged on the frame; a first large gear 46 is fixedly mounted on the second rotating shaft 45, the first large gear 46 is meshed with a second small gear 47 fixedly mounted on the first rotating shaft 28, and the transmission ratio of the first large gear 46 to the second small gear 47 is 1: n, n is the number of semiconductors placed at maximum in a single tube 16.
The specific operation of the pushing assembly is as follows, as shown in fig. 3, when a semiconductor enters the tube 16 on the holding tank 15, the first rotating shaft 28 drives the driving disk 26 to rotate one circle every time a semiconductor enters, and when the driving disk rotates n circles, n semiconductors enter the tube 16, and the tube 16 is full. Because the second pinion 47 is fixedly mounted on the first rotating shaft 28, the second pinion 47 is meshed with the first large gear 46, and the transmission ratio of the first large gear 46 to the second pinion 47 is 1: n. So, as shown in fig. 2, when the first rotation shaft 28 rotates the second pinion 47 by n weeks, the second bull gear rotates by 1 week. The second large gear drives the annular rail 43 to rotate for 1 week through the second rotating shaft 45, and the sliding rod 42 slides on the annular rail 43 for 1 week relatively; when the material pipe 16 on the material containing groove 15 enters the nth semiconductor, the sliding rod 42 slides in the protruding section 44 on the annular track 43, as shown in fig. 6, the protruding end drives the pushing rod 41 to push the material pipe 16 at the bottommost layer of the material conveying box 32 through the sliding rod 42 and retract, so that the empty material pipe 16 at the bottommost layer of the material conveying box 32 is pushed out and enters the material containing groove 15 from the first channel 33, and meanwhile, the filled material pipe 16 in the material containing groove 15 is extruded out of the material containing groove 15 from the second channel 34 by the pushed empty material pipe 16, so that switching and circulation are completed. The invention uses the rotation of the rotation unit to measure the number of semiconductors in the material pipe 16, and uses the rotation of the rotation unit to drive the pushing rod 41 to switch the new material pipe 16 when the material pipe 16 is full, and the invention is in cyclic reciprocation, is tightly matched, does not need an electronic counter and does not need additional power.
As a further aspect of the present invention, elastic blocking plates 51 are disposed in the first channel 33 and the second channel 34, the elastic blocking plates 51 are vertically slidably mounted on the rotating disc 21, and a first spring 52 is disposed between the elastic blocking plates 51 and the rotating disc 21.
As a further aspect of the present invention, a wedge surface 53 is formed on a side of the elastic blocking plate 51, which is close to the pipe feeding box 32.
As shown in fig. 5, this arrangement is to limit the material tube 16 in the material containing groove 15, and prevent the material tube 16 from sliding out of the first channel 33 and the second channel 34. When the material pipe 16 is switched, the material pipe 16 drives the elastic blocking block 54 to shrink through the wedge surface 53, and the first spring 52 is extruded, so that a new material pipe 16 can enter the material containing groove 15, and the full material pipe 16 can leave the material containing groove 15, so that the method is simple and convenient.
As a further scheme of the invention, a blocking block 54 for preventing the tail end of the material conveying belt 11 from blanking is further arranged on the rotating disc 21, and the blocking block 54 is arranged above the material containing groove 15. As shown in fig. 1 and 3, this arrangement is for blocking the tail end of the material conveying belt 11 when the tilting angle of the material containing groove 15 is adjusted by the rotating unit, so as to avoid the material conveying belt 11 from blanking, and is simple and convenient, and no additional air cylinder is needed. In addition, the semiconductor is accumulated at the tail end of the conveying belt 11, so that the lateral dust removing mechanism 13 is convenient for further removing dust, and the situation that dust is not removed in place is avoided.

Claims (10)

1. An automatic marking and packaging integrated machine for a semiconductor is characterized in that: comprises a material conveying belt (11) arranged on a frame; along the conveying direction of the conveying belt (11), a marking mechanism (12), a dust removing mechanism (13) and a material receiving mechanism (14) are sequentially arranged beside the conveying belt (11); the material receiving mechanism (14) comprises a material containing groove (15) for containing a material pipe (16), the material containing groove (15) is obliquely arranged at the tail end of the material conveying belt (11), and the material pipe (16) is used for packaging semiconductors on the material conveying belt (11); the material containing groove (15) is arranged on the rotating unit, and the rotating unit controls the inclination angle of the material containing groove (15).
2. The automatic semiconductor marking and packaging integrated machine according to claim 1, wherein: the rotating unit comprises a rotating disc (21) rotatably mounted on the frame, the rotating disc (21) is fixedly mounted on the rotating disc (21) by the material containing groove (15), a half gear (22) is fixedly mounted on the rotating disc (21) in a coaxial center, and the half gear (22) is meshed with a rack (23) horizontally and slidably mounted on the frame; one end of the rack (23) is fixedly provided with a sliding block (24), and the sliding block (24) is hinged with the first connecting rod (25) through a first hinge shaft (31); both ends of the first connecting rod (25) are respectively hinged with the sliding block (24) and the driving column (27); the driving column (27) is eccentrically and fixedly arranged on the driving disc (26), and the driving disc (26) is rotatably arranged on the frame; the driving disc (26) is fixedly provided with a first rotating shaft (28), and the first rotating shaft (28) is connected with a driving power supply (29).
3. The automatic semiconductor marking and packaging machine according to claim 2, wherein: the axis of the driving disk (26) is on the same horizontal line with the axis of the first hinge shaft (31).
4. The automatic semiconductor marking and packaging machine according to claim 3, wherein: the receiving mechanism (14) further comprises a pushing unit, wherein the pushing unit is used for pushing the last material pipe (16) away from the material containing groove (15) after the last material pipe (16) is filled with the semiconductor, and pushing the next empty material pipe (16) into the material containing groove (15).
5. The integrated machine for automatic marking and packaging of semiconductors according to claim 4, wherein: the pushing unit comprises a pipe feeding box (32) fixedly arranged on the rotating disc (21), and the pipe feeding box (32) is used for stacking empty pipes (16); a first channel (33) is formed at the bottom end of the pipe conveying box (32), and the first channel (33) is communicated with the material containing groove (15); a second channel (34) opposite to the first channel (33) is also arranged on the material containing groove (15), and the second channel (34) is used for a material pipe (16) filled with the semiconductor to leave the material containing groove (15); the bottom of the pipe feeding box (32) is also provided with a pushing component for pushing the bottommost material pipe (16).
6. The integrated machine for automatic marking and packaging of semiconductors according to claim 5, wherein: the pushing assembly comprises a pushing rod (41) horizontally and slidably arranged on the pipe conveying box (32), a sliding rod (42) is fixedly connected to the pushing rod (41), the sliding rod (42) is slidably arranged in an annular track (43), a protruding section (44) is arranged in the annular track (43), and when the sliding rod (42) slides in the protruding section (44), the pushing rod (41) pushes a material pipe (16) at the bottommost layer of the pipe conveying box (32); the annular track (43) is fixedly arranged on a second rotating shaft (45), the second rotating shaft (45) drives the annular track (43) to rotate, and the second rotating shaft (45) is rotatably arranged on the frame; a first large gear (46) is fixedly arranged on the second rotating shaft (45), the first large gear (46) is meshed with a second small gear (47) fixedly arranged on the first rotating shaft (28), and the transmission ratio of the first large gear (46) to the second small gear (47) is 1: n, n is the number of semiconductors placed at most within a single tube (16).
7. The automatic semiconductor marking and packaging machine according to claim 6, wherein: elastic blocking plates (51) are arranged in the first channel (33) and the second channel (34), the elastic blocking plates (51) are vertically and slidably arranged on the rotating disc (21), and a first spring (52) is arranged between the elastic blocking plates (51) and the rotating disc (21).
8. The automatic semiconductor marking and packaging machine according to claim 7, wherein: a wedge surface (53) is arranged on one side of the elastic blocking plate (51) close to the pipe feeding box (32).
9. The automatic semiconductor marking and packaging machine according to claim 7, wherein: the rotary disc (21) is also provided with a blocking block (54) for blocking the blanking of the tail end of the material conveying belt (11), and the blocking block (54) is arranged above the material containing groove (15).
10. The automatic semiconductor marking and packaging integrated machine according to claim 1, wherein: the marking mechanism (12) comprises a laser machine (61); the tail end of the material conveying belt (11) is obliquely arranged; the dust removing mechanism (13) is arranged beside the inclined conveying belt (11); the dust removing mechanism (13) comprises a dust suction pipe (62) and a brush (63) which are externally connected with a motor.
CN202310637535.9A 2023-05-31 2023-05-31 Automatic marking and packaging integrated machine for semiconductor Pending CN116581207A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310637535.9A CN116581207A (en) 2023-05-31 2023-05-31 Automatic marking and packaging integrated machine for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310637535.9A CN116581207A (en) 2023-05-31 2023-05-31 Automatic marking and packaging integrated machine for semiconductor

Publications (1)

Publication Number Publication Date
CN116581207A true CN116581207A (en) 2023-08-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310637535.9A Pending CN116581207A (en) 2023-05-31 2023-05-31 Automatic marking and packaging integrated machine for semiconductor

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Country Link
CN (1) CN116581207A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117524958A (en) * 2024-01-08 2024-02-06 四川晁禾微电子有限公司 Semiconductor packaging chip discharging device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117524958A (en) * 2024-01-08 2024-02-06 四川晁禾微电子有限公司 Semiconductor packaging chip discharging device
CN117524958B (en) * 2024-01-08 2024-03-08 四川晁禾微电子有限公司 Semiconductor packaging chip discharging device

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