CN1165727A - 晶片的抛光方法及装置 - Google Patents
晶片的抛光方法及装置 Download PDFInfo
- Publication number
- CN1165727A CN1165727A CN97103428A CN97103428A CN1165727A CN 1165727 A CN1165727 A CN 1165727A CN 97103428 A CN97103428 A CN 97103428A CN 97103428 A CN97103428 A CN 97103428A CN 1165727 A CN1165727 A CN 1165727A
- Authority
- CN
- China
- Prior art keywords
- wafer
- polishing
- temperature
- cmp
- polished
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4079596A JPH09234663A (ja) | 1996-02-28 | 1996-02-28 | ウエハ研磨方法及びその装置 |
JP040795/96 | 1996-02-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1165727A true CN1165727A (zh) | 1997-11-26 |
CN1080166C CN1080166C (zh) | 2002-03-06 |
Family
ID=12590564
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN97103428A Expired - Fee Related CN1080166C (zh) | 1996-02-28 | 1997-02-28 | 晶片的抛光方法及装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5749772A (zh) |
JP (1) | JPH09234663A (zh) |
KR (1) | KR100416273B1 (zh) |
CN (1) | CN1080166C (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102303281A (zh) * | 2011-09-16 | 2012-01-04 | 北京通美晶体技术有限公司 | 一种减少晶片表面缺陷的方法 |
CN101630629B (zh) * | 2008-07-17 | 2013-03-27 | 台湾积体电路制造股份有限公司 | 通过控制抛光温度改进化学机械抛光 |
CN103273413A (zh) * | 2013-04-09 | 2013-09-04 | 上海华力微电子有限公司 | 化学机械研磨装置 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5957750A (en) | 1997-12-18 | 1999-09-28 | Micron Technology, Inc. | Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates |
JPH11254294A (ja) * | 1998-03-13 | 1999-09-21 | Speedfam Co Ltd | 定盤修正用ドレッサーの洗浄装置 |
KR100562484B1 (ko) * | 1998-09-10 | 2006-06-23 | 삼성전자주식회사 | 반도체소자 제조용 씨엠피장치 및 그 구동방법 |
US6276996B1 (en) * | 1998-11-10 | 2001-08-21 | Micron Technology, Inc. | Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad |
JP2000343416A (ja) * | 1999-05-31 | 2000-12-12 | Ebara Corp | ポリッシング装置および方法 |
US6341997B1 (en) * | 2000-08-08 | 2002-01-29 | Taiwan Semiconductor Manufacturing Company, Ltd | Method for recycling a polishing pad conditioning disk |
US6679769B2 (en) | 2000-09-19 | 2004-01-20 | Rodel Holdings, Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
US6722948B1 (en) * | 2003-04-25 | 2004-04-20 | Lsi Logic Corporation | Pad conditioning monitor |
JP2009500182A (ja) * | 2005-07-09 | 2009-01-08 | ティービーダブリュ インダストリーズ インク. | Cmpパッドコンディショニング用に改良されたエンドエフェクタアーム装置 |
US8292691B2 (en) * | 2008-09-29 | 2012-10-23 | Applied Materials, Inc. | Use of pad conditioning in temperature controlled CMP |
JP6088919B2 (ja) * | 2013-06-28 | 2017-03-01 | 株式会社東芝 | 半導体装置の製造方法 |
JP6340205B2 (ja) | 2014-02-20 | 2018-06-06 | 株式会社荏原製作所 | 研磨パッドのコンディショニング方法及び装置 |
KR101622513B1 (ko) * | 2015-02-17 | 2016-05-18 | 동명대학교산학협력단 | 스프레이 노즐을 이용한 cmp연마 장치 |
CN207480364U (zh) * | 2016-11-25 | 2018-06-12 | 凯斯科技股份有限公司 | 化学机械基板研磨装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4976020A (en) * | 1986-10-21 | 1990-12-11 | Fuji Photo Film Co., Ltd. | Magnetic sheet polishing device |
US5081051A (en) * | 1990-09-12 | 1992-01-14 | Intel Corporation | Method for conditioning the surface of a polishing pad |
US5291693A (en) * | 1992-08-20 | 1994-03-08 | Texas Instruments Incorporated | Semiconductors structure precision lapping method and system |
JP2933795B2 (ja) * | 1993-02-18 | 1999-08-16 | 利勝 中島 | 研削装置 |
US5653623A (en) * | 1993-12-14 | 1997-08-05 | Ebara Corporation | Polishing apparatus with improved exhaust |
US5456627A (en) * | 1993-12-20 | 1995-10-10 | Westech Systems, Inc. | Conditioner for a polishing pad and method therefor |
JPH08168953A (ja) * | 1994-12-16 | 1996-07-02 | Ebara Corp | ドレッシング装置 |
US5645682A (en) * | 1996-05-28 | 1997-07-08 | Micron Technology, Inc. | Apparatus and method for conditioning a planarizing substrate used in chemical-mechanical planarization of semiconductor wafers |
-
1996
- 1996-02-28 JP JP4079596A patent/JPH09234663A/ja not_active Withdrawn
- 1996-12-02 US US08/756,902 patent/US5749772A/en not_active Expired - Lifetime
-
1997
- 1997-01-29 KR KR1019970002697A patent/KR100416273B1/ko not_active IP Right Cessation
- 1997-02-28 CN CN97103428A patent/CN1080166C/zh not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101630629B (zh) * | 2008-07-17 | 2013-03-27 | 台湾积体电路制造股份有限公司 | 通过控制抛光温度改进化学机械抛光 |
CN102303281A (zh) * | 2011-09-16 | 2012-01-04 | 北京通美晶体技术有限公司 | 一种减少晶片表面缺陷的方法 |
CN103273413A (zh) * | 2013-04-09 | 2013-09-04 | 上海华力微电子有限公司 | 化学机械研磨装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH09234663A (ja) | 1997-09-09 |
US5749772A (en) | 1998-05-12 |
KR100416273B1 (ko) | 2004-05-24 |
CN1080166C (zh) | 2002-03-06 |
KR970063547A (ko) | 1997-09-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1080166C (zh) | 晶片的抛光方法及装置 | |
CN101022921B (zh) | 用于半导体晶片的抛光垫的修整组件和抛光该晶片的方法 | |
US6561881B2 (en) | System and method for chemical mechanical polishing using multiple small polishing pads | |
KR100390247B1 (ko) | 화학적/기계적연마방법및장치 | |
CN1233508C (zh) | 带槽的抛光垫及其使用方法 | |
US6951507B2 (en) | Substrate polishing apparatus | |
JPH11156711A (ja) | 研磨装置 | |
CN102554788B (zh) | 一种抛光垫修整方法 | |
US6458012B1 (en) | Polishing apparatus | |
CN1274949A (zh) | 在半导体晶片化学机械抛光时输送抛光液的系统 | |
KR101005245B1 (ko) | 반도체 웨이퍼 연삭법 | |
CN1329533A (zh) | 带有可装载的罩的换向线性抛光机 | |
US9908213B2 (en) | Method of CMP pad conditioning | |
CN2724922Y (zh) | 预热装置 | |
CN111266937B (zh) | 一种平面零件全口径确定性抛光的摇臂式抛光装置和方法 | |
CN207239906U (zh) | 一种打磨机 | |
US6641462B2 (en) | Method and apparatus for distributing fluid to a polishing surface during chemical mechanical polishing | |
CN1771110A (zh) | 抛光垫设备和方法 | |
US7153188B1 (en) | Temperature control in a chemical mechanical polishing system | |
US20050113009A1 (en) | Polishing pad conditioner and chemical mechanical polishing apparatus having the same | |
US6752698B1 (en) | Method and apparatus for conditioning fixed-abrasive polishing pads | |
CN210818966U (zh) | 基于复合梯度弹性小工具的分级研抛装置 | |
KR20090038502A (ko) | 웨이퍼 연마 방법 | |
CN111409015B (zh) | 一种磨床机构、研磨工艺及其研磨材料的制备工艺 | |
JP2613081B2 (ja) | ウエハ外周部の鏡面研磨方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: OKI SEMICONDUCTOR CO., LTD. Free format text: FORMER OWNER: OKI ELECTRIC INDUSTRY CO., LTD. Effective date: 20090508 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20090508 Address after: Tokyo, Japan, Japan Patentee after: OKI Semiconductor Co., Ltd. Address before: Tokyo, Japan Patentee before: Oki Electric Industry Co., Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20020306 Termination date: 20110228 |