CN116564834A - Manufacturing method of power module and power module - Google Patents

Manufacturing method of power module and power module Download PDF

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Publication number
CN116564834A
CN116564834A CN202310616402.3A CN202310616402A CN116564834A CN 116564834 A CN116564834 A CN 116564834A CN 202310616402 A CN202310616402 A CN 202310616402A CN 116564834 A CN116564834 A CN 116564834A
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CN
China
Prior art keywords
power module
section
substrate
pin
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310616402.3A
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Chinese (zh)
Inventor
王剑峰
汤宏伟
刘洋
王洋
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Nantong Shangyangtong Integrated Circuit Co ltd
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Nantong Shangyangtong Integrated Circuit Co ltd
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Application filed by Nantong Shangyangtong Integrated Circuit Co ltd filed Critical Nantong Shangyangtong Integrated Circuit Co ltd
Priority to CN202310616402.3A priority Critical patent/CN116564834A/en
Publication of CN116564834A publication Critical patent/CN116564834A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The embodiment of the application relates to the technical field of electronic part manufacturing and discloses a power module manufacturing method and a power module. The manufacturing method of the power module comprises the following steps: preparing a substrate with a metal circuit layer on the surface, and arranging a bonding pad on the surface of the substrate with the metal circuit layer; respectively attaching the electronic component and the base with the mounting hole to the bonding pad, and carrying out reflow soldering on the electronic component, the base and the bonding pad on the substrate; assembling the pin needles on the substrate through the mounting holes of the base to be electrically connected with the bonding pads so as to form a to-be-packaged body; and placing the to-be-packaged body in a lower die of the die, covering an upper die of the die on the lower die to form a cavity for accommodating the to-be-packaged body, and communicating the cavity with an external injection molding channel, and enabling a part of the pin needle far away from the substrate to enter the lower die. The manufacturing method of the power module and the power module provided by the embodiment of the application can simplify the process and improve the reliability of the power module.

Description

Manufacturing method of power module and power module
Technical Field
The embodiment of the application relates to the technical field of electronic part manufacturing, in particular to a power module manufacturing method and a power module.
Background
The power module is a widely used electronic module, in which electronic components are combined according to a certain function to form a complete circuit structure. In the manufacturing process of the power module, electronic components are often required to be welded and packaged. The electronic components form a circuit structure with specific functions during the soldering process. And a protective structure can be formed around the electronic component by encapsulation. Thus, the electronic components can be protected from the influence of external environment, and the service life of the electronic components is prolonged.
However, in the current manufacturing process of the power module, the process is complicated, and the situation that the reliability of the power module is insufficient is easily caused.
Disclosure of Invention
An object of the embodiments of the present application is to provide a method for manufacturing a power module and a power module, which can simplify the process and improve the reliability of the power module.
In order to solve the above technical problems, embodiments of the present application provide a method for manufacturing a power module, including the following steps:
preparing a substrate with a metal circuit layer on the surface, and arranging a bonding pad on the surface of the substrate with the metal circuit layer;
respectively attaching the electronic component and the base with the mounting hole to the bonding pad, and carrying out reflow soldering on the electronic component, the base and the bonding pad on the substrate;
assembling the pin needles on the substrate through the mounting holes of the base to be electrically connected with the bonding pads so as to form a to-be-packaged body;
placing the to-be-packaged body in a lower die of a die, covering an upper die of the die on the lower die to form a cavity for accommodating the to-be-packaged body, and communicating the cavity to an external injection molding channel, and simultaneously enabling a part of the pin away from the substrate to enter the lower die to isolate a abdication hole of the cavity;
and injecting a molten plastic packaging material into the cavity through the injection molding channel, and forming the power module after the molten plastic packaging material is solidified.
The embodiment of the application also provides a power module, which comprises a substrate, an electronic component, a base, a pin, a positioning plate and a plastic packaging material. One side of the substrate is provided with a metal circuit layer and a bonding pad. The electronic component and the base are welded with the bonding pad, the base is provided with a mounting hole, and a pin needle is inserted into the mounting hole for one section and is electrically connected with the bonding pad. The positioning plate is sleeved on the pin from the other end of the pin, so that the part of the pin, which is far away from the substrate, penetrates out of the positioning plate. The plastic package material is filled between the substrate and the positioning plate and used for wrapping the electronic components and the part of the pin needle which does not pass through the positioning plate.
According to the manufacturing method of the power module and the power module, the pin is assembled in the mode of the base, and the base can be welded with each electronic component synchronously. That is, the base may be reflow soldered with the pads of the substrate along with the electronic components, and the pins may be assembled to the substrate through the base. This avoids the adverse effects caused by the adoption of multiple reflow soldering, and is beneficial to improving the reliability of the power module product. Meanwhile, the packaging of the power module adopts injection molding packaging, so that the steps of housing mounting are reduced, and the moisture and temperature resistance of the material can be improved. Thus, the manufacturing method of the power module provided by some embodiments of the present application not only can simplify the process, but also can improve the reliability of the power module.
In some embodiments, the pin comprises a first section, a second section and a third section, wherein the first section is inserted into the mounting hole, the second section is connected with the first section and the third section, the second section is provided with a sealing structure, and the sealing structure is used for sealing the yielding hole when the third section enters the yielding hole.
In some embodiments, the sealing structure is a protrusion arranged on the second section in a tapered shape along the circumferential direction, and when the third section enters the yielding hole, a tapered surface of the protrusion abuts against the wall of the yielding hole.
In some embodiments, the second section is provided with a mold locking structure comprising at least one of a notch, a boss, and a receiving hole.
In some embodiments, the first section and/or the second section are provided with external threads.
In some embodiments, the third section is configured in a fisheye or column shape.
In some embodiments, after assembling the pins to the substrate through the mounting holes of the base and before placing the body to be packaged in the lower mold of the mold, further comprising: the pin is sleeved with a positioning plate with a positioning hole, and the part of the pin far away from the substrate passes through the positioning plate through the positioning hole.
In some embodiments, the positioning plate is provided with a buffer material on a side facing the substrate, the buffer material surrounding the pins.
In some embodiments, the positioning holes are tapered.
Drawings
One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which the figures of the drawings are not to be taken in a limiting sense, unless otherwise indicated.
FIG. 1 is a flow chart of a method of fabricating a power module provided in some embodiments of the present application;
FIG. 2 is a schematic cross-sectional view of a package to be packaged provided in some embodiments of the present application when placed in a mold;
FIG. 3 is a schematic cross-sectional view of a power module according to some embodiments of the present application;
fig. 4 is a schematic perspective view of a base in a power module according to some embodiments of the present disclosure;
fig. 5 is a schematic diagram of a composition structure of a pin in a power module according to some embodiments of the present disclosure;
fig. 6 is a schematic structural diagram of a first section of a pin in a power module according to some embodiments of the present disclosure;
fig. 7 is a schematic structural diagram of a second section of a pin in a power module according to some embodiments of the present disclosure;
FIG. 8 is a schematic top view of a locating plate in a power module according to some embodiments of the present disclosure;
FIG. 9 is a schematic top view of a positioning plate in a power module according to other embodiments of the present disclosure;
fig. 10 is a schematic cross-sectional structure of a positioning plate in a power module according to some embodiments of the present application.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the following detailed description of each embodiment of the present application will be given with reference to the accompanying drawings. However, those of ordinary skill in the art will understand that in various embodiments of the present application, numerous technical details have been set forth in order to provide a better understanding of the present application. However, the technical solutions claimed in the present application can be implemented without these technical details and with various changes and modifications based on the following embodiments. The following embodiments are divided for convenience of description, and should not be construed as limiting the specific implementation of the present application, and the embodiments may be mutually combined and referred to without contradiction.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description and claims of the present application and in the description of the figures above are intended to cover non-exclusive inclusions.
In the description of the embodiments of the present application, the technical terms "first," "second," etc. are used merely to distinguish between different objects and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, a particular order or a primary or secondary relationship. In the description of the embodiments of the present application, the meaning of "plurality" is two or more unless explicitly defined otherwise.
In the description of the embodiments of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "coupled," and the like should be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; or may be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to the specific circumstances.
The power module combines active electronic components such as chips and capacitors or passive electronic components according to certain functions and forms a module through encapsulation. The power module is widely applied to the fields of motors, frequency converters, inverters and the like. In order to improve the reliability of the power module in a severe environment, it is generally required to perform injection molding packaging on each electronic component in the power module.
At present, the power module is mainly manufactured in two modes. The first is to perform injection molding packaging on the electronic component and the pin after the electronic component and the pin are assembled respectively. The second uses a housing structure and is encapsulated with a silicone gel. After the electronic components and the pin needles are assembled, the power module adopting the housing structure can be used for installing the shell, and after the shell is installed, the electronic components can be integrally accommodated in a relatively closed space. And injecting silica gel into the space through the opening on the shell for packaging.
In the first manufacturing method, since the pins are not sheet-like components, electronic components and pins are often assembled onto a substrate by reflow soldering in sequence. This means that the latter has been subjected to one reflow soldering at the time of the latter reflow soldering. Multiple reflow soldering processes can result in the generation of thermo-mechanical stresses that are detrimental to the electronic components, accelerating material-to-material degradation, and thus reducing the reliability of the power module product. In the second manufacturing method, after the pin is assembled, the housing needs to be attached, which results in complicated process. Meanwhile, the silicon gel is limited to the material, so that the waterproof and moistureproof performances of the power module are poor, and the reliability of the power module product is influenced.
In order to simplify the process and improve the reliability of the power module, some embodiments of the present application provide a method for manufacturing the power module. In the process of manufacturing the power module, the pin is assembled through the base, and the base is assembled together with the electronic components. Thus, the welding process of the pin needles is eliminated, and the assembly time and cost are reduced. Meanwhile, after the pin is assembled, the electronic components are directly encapsulated by injection molding. Therefore, the reflow soldering process of the pin needles and the mounting process of the shell can be eliminated, the purpose of simplifying the manufacturing process of the power module can be achieved, and the reliability of the power module can be improved by reducing the reflow soldering times and replacing the silicone gel package by injection molding packaging.
Next, a method for manufacturing a power module according to some embodiments of the present application is described with reference to fig. 1. Wherein fig. 2 shows a structure in which the power module is placed in a mold before packaging, and fig. 3 shows a structure after the power module is packaged.
As shown in fig. 1, a method for manufacturing a power module according to some embodiments of the present application includes the following steps:
step S110, preparing a substrate 10 having a metal circuit layer on the surface, and disposing a pad 11 on the surface of the substrate 10 having the metal circuit layer.
Specifically, the substrate 10 is a carrier member for mounting other components in the power module. The substrate 10 has a metal wiring layer for forming a circuit structure having a specific function. The surface of the substrate 10 is provided with the bonding pads 11, and the bonding pads 11 can provide a welding foundation for other components, so that the assembly of each component is facilitated. The number of the bonding pads 11 may be plural, and each bonding pad 11 may be used for assembling different components, or a plurality of components may be assembled on the same bonding pad 11.
In step S120, the electronic component 20 and the mount 30 having the mounting hole 31 are attached to the pad 11, and the electronic component 20, the mount 30, and the pad 11 on the substrate 10 are reflow soldered.
Specifically, the electronic component 20 and the base 30 are mounted prior to reflow soldering. The electronic components 20 may be various active electronic components 20 such as chips, capacitors, etc. or passive electronic components 20, and these electronic components 20 may be in a chip package form so as to perform a soldering process.
As shown in fig. 3 and 4, the base 30 is the assembly base of the pins 40 in the power module, and after the electronic component 20 and the base 30 are assembled in advance, the pins 40 can be directly assembled on the substrate 10 in a solderless manner. In this way, in the assembly process of the electronic component 20 and the pin 40, only one reflow soldering process is required. That is, the pins 40 may be inserted into the mounting holes 31 of the base 30 when assembled, and the base 30 may be soldered to the pads 11 of the substrate 10 in synchronization with the respective electronic components 20, forming a tight connection with the pads 11 through the solder 12. Adverse effects due to the adoption of a plurality of reflow soldering processes can be avoided.
In addition, after the assembly of the electronic component 20 and the mount 30 is completed, the interconnection of the electronic component 20 may be performed. The electronic components 20 are connected with the metal circuit layer on the substrate 10 through the bonding wires 13, one end of each bonding wire 13 is electrically connected with the surface, far away from the substrate 10, of each electronic component 20, the other end of each bonding wire 13 is electrically connected with the bonding pad 11 on the substrate 10, and therefore interconnection of the electronic components 20 is completed, and each electronic component 20 is connected into the circuit structure formed by the metal circuit layer according to a certain mode.
Step S130, assembling the pins 40 to the substrate 10 through the mounting holes 31 of the base 30 to electrically connect with the pads 11, so as to form a package to be packaged.
Specifically, after the pins 40 are inserted into the mounting holes 31 of the mount 30, electrical connection with the pads 11 may be achieved by the mount 30, or electrical connection with the pads 11 may be directly achieved. After the pin 40 is assembled, the electronic component 20 can be packaged.
In step S140, the to-be-packaged body is placed on the lower mold 71 of the mold, and the upper mold 72 of the mold is covered on the lower mold 71 to form the cavity 73 for accommodating the to-be-packaged body therein, and the injection molding channel 74 communicates the cavity 73 to the outside, and simultaneously, the portion of the pin 40 away from the substrate 10 enters the lower mold 71 to isolate the cavity 73 from the relief hole 75.
Specifically, before encapsulation, an injection space is formed by a mold. The package to be packaged formed after the electronic component 20 and the pin 40 are assembled on the substrate 10 is placed in the injection space of the mold. At the same time, the top of the pin 40 and the portion far from the substrate 10 are exposed by ejection during packaging. The tops of pins 40 enter relief holes 75 in lower mold 71 when lower mold 71 of the mold is closed, while remaining relatively isolated from the injection space.
And step S150, injecting a molten plastic packaging material into the cavity 73 through the injection molding channel 74, and forming the power module after the molten plastic packaging material is solidified.
Specifically, after the upper and lower molds 72 and 71 of the mold are closed, a molten molding material is injected into the injection space through the injection passage 74. The plastic package material can be epoxy resin. And after the plastic packaging material is solidified to form the packaging layer 60, the packaging process of the power module is completed, and the packaged power module can be finally formed after the power module is taken out of the die.
In the method for manufacturing the power module provided in some embodiments of the present application, the pin 40 is assembled by using the base 30, and the base 30 can be welded with each electronic component 20 synchronously. That is, the mount 30 may be reflow soldered with the pads 11 of the substrate 10 along with the electronic components 20, and the pins 40 may be assembled to the substrate 10 through the mount 30. This avoids the adverse effects caused by the adoption of multiple reflow soldering, and is beneficial to improving the reliability of the power module product. Meanwhile, the packaging of the power module adopts injection molding packaging, so that the steps of housing mounting are reduced, and the moisture and temperature resistance of the material can be improved. Thus, the manufacturing method of the power module provided by some embodiments of the present application not only can simplify the process, but also can improve the reliability of the power module.
In some embodiments of the present application, as shown in fig. 5, the pin 40 may include a first section 41, a second section 42 and a third section 43, where the first section 41 is inserted into the mounting hole 31, the second section 42 connects the first section 41 and the third section 43, and the second section 42 is provided with a sealing structure for sealing the yielding hole 75 when the third section 43 enters the yielding hole 75.
Pin 40 is a conductor for external connection of the power module. One part of the pin 40 is connected to the circuit of the power module, and the other part of the pin can be electrically connected with an external electronic component, so that the power module and the external electronic component are connected together. The pin 40 generally comprises three parts, a first section 41 at the bottom, a second section 42 at the middle, and a third section 43 at the top. The first section 41 of the pin 40 is inserted and soldered into the base 30 of the pad 11 of the substrate 10 when the power module is manufactured. The second section 42 of the pin 40 is the part that is packaged with the electronic component 20 when the power module is manufactured. The third section 43 of the pin 40 is the ejection portion of the power module for connection with external electronic components.
In order to avoid the third section 43 of the pin 40 from being affected by the molding material during the packaging process of the power module, a relief hole 75 is provided in the lower die 71 of the die. The third section 43 of the pin 40 can enter the relief hole 75 and be kept relatively isolated from the injection space formed by the upper die 72 and the lower die 71 of the die. Meanwhile, the second section 42 of the pin 40 is provided with a sealing structure, so that the opening of the abdication hole 75 can be sealed, and the sealing effect is achieved, and the situation that the molten plastic packaging material enters the abdication hole 75 in the packaging process is effectively avoided.
In some embodiments of the present application, the sealing structure may be a protrusion 401 that is disposed on the second section 42 and is tapered circumferentially, and when the third section 43 enters the relief hole 75, a tapered surface of the protrusion 401 abuts against a wall of the relief hole 75.
By providing the protrusion 401 with a tapered shape, the tapered surface of the protrusion 401 can be tightly abutted against the wall of the relief hole 75 during the process of closing the lower die 71 of the die, that is, during the process of entering the third section 43 of the pin 40 into the relief hole 75. Thereby effectively sealing the opening of the relief hole 75.
In addition, second section 42 may be provided with a mold-locking structure 402, mold-locking structure 402 including at least one of a notch, a boss, and a receiving hole.
That is, the second section 42 may be provided with a notch, a boss and a receiving hole, so as to form a tight connection after the plastic sealing material is cured, thereby avoiding easy loosening. Also, the mold-lock structure 402 may be provided in different forms or numbers depending on the desired degree of tightness. For example, in practical cases, the receiving hole may be used in combination with a notch or a boss to improve connection tightness with the molding material.
In some embodiments of the present application, as shown in fig. 6 and 7, the first section 41 and/or the second section 42 may be provided with external threads.
By means of external threads, a threaded connection between the first section 41 and the base 30 can be achieved or the mold-locking ability of the second section 42 can be enhanced. It is also possible to provide the first section 41 and/or the second section 42 smooth or to provide parallel score lines on the second section 42.
In some embodiments of the present application, the third section 43 may be provided in a fisheye or column shape.
That is, the connection between the pin 40 and the external electronic component may be realized by crimping or soldering.
In some embodiments of the present application, after the pins 40 are assembled to the substrate 10 through the mounting holes 31 of the base 30 in step S130 and before the to-be-packaged body is placed on the lower die 71 of the die in step S140, the method further includes the steps of:
the pin 40 is sleeved with a positioning plate 50 with a positioning hole 51, and the part of the pin 40 away from the substrate 10 passes through the positioning plate 50 via the positioning hole 51.
The positioning plate 50 can position the pins 40, and a limiting plate opposite to the substrate 10 can be formed on the top of the power module, so as to define a packaging area of the plastic packaging material. And the position of each pin 40 may be defined. The positioning holes 51 on the positioning plate 50 are correspondingly arranged according to the number and the shape of the pins 40, so that the positioning plate 50 can be sleeved on the pins 40. As shown in fig. 8 and 9, the positioning hole 51 of the positioning plate 50 may be designed in a circular shape or a square shape according to the shape of the pin 40.
In addition, as shown in fig. 10, a surface of the positioning plate 50 facing the substrate 10 may be provided with a buffer material 501, and the buffer material 501 surrounds the pins 40.
The buffer material 501 may be a material with elastic deformation, and can play a role in sealing between the positioning plate 50 and the pin 40, so as to ensure a sealing effect at the connection between the middle and top of the pin 40.
In some embodiments of the present application, the positioning holes 51 on the positioning plate 50 may be tapered.
By adopting the conical positioning hole 51, the pin needle 40 can be matched with the conical protrusion 401 in the middle of the pin needle 40, and the tightness of the pin needle 40 when being matched with the positioning plate 50 is improved. Meanwhile, when the buffer material 501 is provided, the buffer material 501 can be compressed, so that the buffer material 501 can be tightly filled between the positioning plate 50 and the pin 40.
As shown in fig. 3, some embodiments of the present application further provide a power module manufactured by the above manufacturing method. The power module includes a substrate 10, an electronic component 20, a base 30, pins 40, a positioning board 50, and a molding compound. One side of the substrate 10 has a metal wiring layer and is provided with pads 11. The electronic component 20 and the base 30 are soldered to the bonding pad 11, and the base 30 is provided with a mounting hole 31, and a pin 40 is inserted into the mounting hole 31 to be electrically connected to the bonding pad 11. The positioning plate 50 is sleeved on the pin 40 from the other end of the pin 40, so that the part of the pin 40 away from the substrate 10 passes out of the positioning plate 50. The plastic package material is filled between the substrate 10 and the positioning board 50, and is used for wrapping the electronic component 20 and the portion of the pin 40 that does not pass through the positioning board 50.
In the power module, the mounting base can be provided for the pins 40 by the base 30, and the base 30 can be mounted with the electronic component 20 by means of the bottom surface having a large area, and is fixed on the pads 11 of the substrate 10 by reflow soldering. The base 30 may be a metal base 30, such as copper, to facilitate ensuring electrical conductivity between the pins 40 and the pads 11. In order to ensure the stability of the base 30 during welding, the portions at both ends of the base 30 may be thickened so that the base 30 may be formed in a dumbbell shape as a whole. The plastic packaging material can adopt epoxy resin, and the moisture resistance and the temperature resistance are improved through the characteristics of the plastic packaging material.
In the power module, each electronic component 20, and the electronic component 20 and the metal wiring layer of the substrate 10 may be electrically connected by bonding wires. The bond wires may complete the connection prior to assembly of the pins 40.
The number of reflow soldering processes during manufacturing the power module is reduced, the step of mounting the shell is reduced, the manufacturing process of the power module can be simplified, meanwhile, adverse effects on the power module product caused by the adoption of multiple reflow soldering processes can be avoided, and the reliability of the product is improved. Meanwhile, the power module is encapsulated by injection molding by adopting an epoxy resin material, so that the reliability of the product can be improved.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples of implementing the present application and that various changes in form and details may be made therein without departing from the spirit and scope of the present application.

Claims (10)

1. A method of manufacturing a power module, comprising:
preparing a substrate with a metal circuit layer on the surface, and arranging a bonding pad on the surface of the substrate with the metal circuit layer;
attaching an electronic component and a base with a mounting hole to the bonding pad respectively, and carrying out reflow soldering on the electronic component, the base and the bonding pad on the substrate;
assembling pins to the substrate through the mounting holes of the base to be electrically connected with the bonding pads so as to form a to-be-packaged body;
placing the to-be-packaged body in a lower die of a die, covering an upper die of the die on the lower die to form a cavity for accommodating the to-be-packaged body, and communicating the cavity to an external injection molding channel, and simultaneously enabling a part of the pin needle, which is far away from the substrate, to enter the lower die to isolate a abdication hole of the cavity;
and injecting a molten plastic packaging material into the cavity through the injection molding channel, and forming the power module after the molten plastic packaging material is solidified.
2. The method of claim 1, wherein the pin includes a first section, a second section, and a third section, the first section is inserted into the mounting hole, the second section connects the first section and the third section, the second section is provided with a sealing structure, and the sealing structure is used for sealing the relief hole when the third section enters the relief hole.
3. The method according to claim 2, wherein the sealing structure is a protrusion arranged on the second section along a circumferential direction and tapered, and when the third section enters the relief hole, a tapered surface of the protrusion abuts against a wall of the relief hole.
4. The method of claim 2, wherein the second section is provided with a mold locking structure, the mold locking structure including at least one of a notch, a boss, and a receiving hole.
5. The method of manufacturing a power module according to claim 2, wherein the first section and/or the second section is provided with external threads.
6. The method of manufacturing a power module according to claim 2, wherein the third section is provided in a fish-eye shape or a column shape.
7. The method according to any one of claims 1 to 6, wherein after the pin is assembled to the substrate through the mounting hole of the base, the method further comprises, before the placing the package to be packaged in the lower die of the die:
and a positioning plate with a positioning hole is sleeved on the pin, and the part of the pin, which is far away from the substrate, penetrates out of the positioning plate through the positioning hole.
8. The method of claim 7, wherein a buffer material is disposed on a surface of the positioning plate facing the substrate, and the buffer material surrounds the pins.
9. The method of claim 7, wherein the positioning holes are tapered.
10. A power module manufactured by the manufacturing method according to any one of claims 1 to 9, characterized in that the power module comprises:
one surface of the substrate is provided with a metal circuit layer and a bonding pad;
an electronic component soldered to the pad;
the base is welded with the bonding pad and is provided with a mounting hole;
a pin, a section of which is inserted into the mounting hole and is electrically connected with the bonding pad;
the positioning plate is sleeved on the pin from the other end of the pin, so that the part of the pin, which is far away from the substrate, penetrates out of the positioning plate;
and the plastic packaging material is filled between the substrate and the positioning plate and is used for wrapping the electronic components and the part of the pin needle which does not pass through the positioning plate.
CN202310616402.3A 2023-05-29 2023-05-29 Manufacturing method of power module and power module Pending CN116564834A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310616402.3A CN116564834A (en) 2023-05-29 2023-05-29 Manufacturing method of power module and power module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310616402.3A CN116564834A (en) 2023-05-29 2023-05-29 Manufacturing method of power module and power module

Publications (1)

Publication Number Publication Date
CN116564834A true CN116564834A (en) 2023-08-08

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310616402.3A Pending CN116564834A (en) 2023-05-29 2023-05-29 Manufacturing method of power module and power module

Country Status (1)

Country Link
CN (1) CN116564834A (en)

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