CN116560013A - Multichannel optical device and optical module - Google Patents

Abstract

The invention provides a multichannel optical device and an optical module, wherein the multichannel optical device comprises: the non-airtight sealed box comprises a base and a first side wall, wherein the first side wall is provided with a first through hole; the airtight sealing box is fixed on a base at one end opposite to the first side wall, penetrates through and is connected to the second side wall, a transparent window is arranged on one side wall of the airtight sealing box, and one end of the airtight sealing box, provided with the transparent window, is inserted into the non-airtight sealing box; the wavelength division multiplexer is arranged on the base in the non-airtight sealing box and comprises more than two light inlet and outlet surfaces, one light inlet and outlet surface of the wavelength division multiplexer is opposite to the transparent window, and the other light inlet and outlet surface of the wavelength division multiplexer is opposite to the first through hole. The invention can effectively reduce the packaging cost without considering the air tightness problem of the accommodating space of the optical device.

Description

Multichannel optical device and optical module

Technical Field

The present invention relates to the field of semiconductor device packaging technology, and in particular, to a multichannel optical device and an optical module.

Background

In the semiconductor device packaging technology, it is necessary to ensure that the sealing property of the entire package structure is good, and the package structure cannot leak air. However, heat is generated during the operation of the electronic device, so that the device cannot normally operate due to overheating, and good heat dissipation performance of the packaging structure is ensured, so that the technical problem of both heat dissipation and air tightness must be solved. The TO coaxial packaging scheme of the common technology is a single-channel structure, relates TO a packaging structure of a multi-channel scene, in particular TO a packaging structure with high requirements on air tightness and heat dissipation, and is realized by adopting a ceramic metal BOX scheme. However, although the ceramic metal BOX structure has good air tightness and heat dissipation, the processing technology is complex, for example, large-area gold plating is needed in the ceramic metal BOX scheme, the material cost and the processing cost are high, and the cost reduction requirement of enterprises is difficult to meet. If the TO coaxial packaging structure is adopted, although the cost can be reduced, the electronic device in the airtight space is increased by several times, the heating value is also increased by several times, and the good heat dissipation effect is difficult TO realize by the conventional TO packaging structure.

The optical module is provided with the laser and the optical device at the same time, if a plurality of lasers and the optical device are arranged in the same closed space, the optical module has high cost for keeping good air tightness as a whole because of large volume; if a plurality of schemes with single-channel TO structures are adopted, each optical emission sub-module TOSA is respectively packaged in an airtight mode, the whole volume of the optical module is larger, and the cost is higher.

Disclosure of Invention

The invention aims to provide a multichannel optical device and an optical module, which are used for solving the technical problems that the air tightness is good and the cost is reduced difficultly in the multichannel optical module structure in the prior art.

In order to achieve the above object, the present invention provides a multi-channel optical device comprising: the non-airtight sealing box comprises a base and a first side wall, wherein the first side wall is connected to one end of the base and is provided with a first through hole; a hermetic sealing box fixed to a base opposite to one end of the first side wall, penetrating and connected to the second side wall, one side wall of the hermetic sealing box being provided with a transparent window, one end of the hermetic sealing box provided with the transparent window being inserted into the non-hermetic sealing box; the wavelength division multiplexer is arranged on the base in the non-airtight sealed box and comprises more than two light in-out surfaces, and one light in-out surface of the wavelength division multiplexer is opposite to the transparent window so as to realize light path connection with the photoelectric element in the airtight sealed box; the other light inlet and outlet surface is opposite to the first through hole so as to realize light path connection with the element outside the non-airtight sealed box.

Further, the optoelectronic component includes: at least two lasers are arranged in the airtight sealed box side by side, each laser comprises a light emitting surface, and the lasers are arranged opposite to the transparent window; and a first collimating lens mounted into the first through hole; more than two light beams emitted by the light emitting surface pass through the wavelength division multiplexer to form a combined light beam, and the combined light beam is emitted from the first collimating lens.

Further, the multi-channel optical device further includes: a first collimating lens holder, which is a tubular member, an outer sidewall of which is connected to a wall of the first through hole, and an inner sidewall of which is connected to an edge of the first collimating lens; the optical fiber lens comprises an adjusting ring, a connector and an optical fiber ferrule, wherein the adjusting ring is rotatably connected to the first collimating lens support, one end of the connector is rotatably connected to the adjusting ring, and the connector is internally provided with an optical fiber ferrule which is opposite to the first collimating lens.

Further, the wavelength division multiplexer is a combiner and comprises a light incident surface and a light emergent surface; the non-hermetically sealed box comprises: more than two second collimating lenses, one surface of each second collimating lens is opposite to the transparent window, and the other surface of each second collimating lens is opposite to the light incident surface of the combiner; and an optical isolator, one surface of which is arranged opposite to the light emergent surface of the combiner, and the other surface of which is arranged opposite to the first collimating lens.

Further, the non-airtight sealed box further comprises a second side wall disposed opposite to the first side wall; a second through hole is formed in the middle of the second side wall; the transition ring is sleeved on the outer surface of the airtight sealing box and inserted into the second through hole; the airtight sealed box is fixed into the second through hole through the transition ring.

Further, an annular plate is arranged at one end, opposite to the direction of inserting the transition ring into the second through hole, of the transition ring, and the annular plate is attached to the surface of the second side wall.

Further, the non-hermetically sealed box includes a cover, which is a plate, mounted over the base and connected to the base, the first side wall, and the second side wall.

Further, a second collimating lens, a wavelength division multiplexer and an optical isolator are sequentially arranged on the top surface of the base; the central axis of the optical isolator is positioned in the same plane with the central axis of the light-emitting surface of the wavelength division multiplexer and the central axis of the transparent window. A first concave area is arranged at one end, close to the first side wall, of the top surface of the base, and the optical isolator is installed in the first concave area.

Further, the hermetically sealed box includes: the tube seat comprises a first surface and a second surface which are away from each other; the pipe cap comprises an opening end and a light emitting plate which are opposite to each other; the opening end is connected to the first surface of the tube seat in a sealing way, and the transparent window is arranged on the light emitting plate; more than two radio frequency probes penetrate through the first surface and the second surface of the tube seat side by side; a first heat sink fixedly connected to a first face of the header; and more than two lasers are arranged on the surface of the first heat sink facing the side of the radio frequency probe side by side; each laser comprises a light emitting surface which is arranged opposite to the transparent window; wherein, the light beam emitted by each light emitting surface is emitted from a transparent window; each radio frequency probe is electrically connected to a laser and provides radio frequency signals for the laser.

Further, the hermetically sealed box includes: the second concave area is arranged on the surface of one side of the first heat sink facing the radio frequency probe; and a semiconductor cooler disposed in the second recess region; the semiconductor cooler comprises a heating plate and a heat absorbing plate, wherein the heating plate is connected to the first heat sink, and the lasers are mounted on the surface of the heat absorbing plate side by side.

Further, the hermetically sealed box includes: the first radio frequency substrate is fixedly connected to the surface of the first heat sink facing the radio frequency probe and is positioned between the tube seat and the laser; the radio frequency probe and the laser are electrically connected to the first radio frequency substrate.

Further, the airtight sealed case further includes: the second heat sink is fixedly connected to the second surface of the tube seat and is positioned outside the tube cap; the second radio frequency substrate is arranged on the surface of the second heat sink facing the side of the radio frequency probe; the central axes of the more than two radio frequency probes are parallel to each other, and the plane where the central axes of the more than two radio frequency probes are located is parallel to the surface of the side, facing the radio frequency probes, of the second heat sink.

Further, the laser includes: the laser substrates are arranged on the surface of the first heat sink or the surface of the heat absorbing plate of the semiconductor cooler in parallel; and a laser diode mounted to a top surface of a laser substrate; the laser diode comprises the light emitting surface; the surface of the laser substrate on the side where the laser diode is mounted is flush with the surface of the first radio frequency substrate on the side facing the radio frequency probe.

Further, the airtight sealing box further comprises a sealing ring, and the sealing ring is arranged at the joint of at least one radio frequency probe and the tube seat, or is arranged at the joint of at least one direct current probe and the tube seat.

In order to achieve the above object, the present invention further provides an optical module, including the multi-channel optical device described above. The optical module comprises a shell and a circuit board assembly, and the multichannel optical device is arranged in the shell; the circuit board assembly is arranged in the shell and is electrically connected to the multichannel optical device.

The invention provides an optical module and a multichannel optical device for the optical module, wherein the multichannel optical device main body is a non-airtight sealed box, the airtight sealed box is embedded into one side wall of the non-airtight sealed box, electronic devices such as a laser are installed into the airtight sealed box, and optical devices such as a wavelength division multiplexer are installed into the non-airtight sealed box. The invention has the advantages that the multichannel laser is manufactured by adopting the TO packaging technology, the airtight sealing box provided with the laser only needs TO be ensured TO have good airtight performance, the problem of airtight performance of the accommodating space of the optical device is not required TO be considered, and the packaging cost can be effectively reduced compared with the scheme of integrally keeping airtight performance of the optical module.

Drawings

The technical scheme and other beneficial effects of the present invention are presented by the detailed description of the specific embodiments of the present invention with reference to the accompanying drawings.

Fig. 1 is a schematic diagram of the overall structure of a multi-channel optical device according to an embodiment of the present invention.

Fig. 2 is a schematic diagram of an internal structure of a multi-channel optical device according to an embodiment of the present invention.

Fig. 3 is a schematic structural diagram of the multi-channel optical device according to the embodiment of the present invention after removing the airtight sealed box.

Fig. 4 is an exploded view of a multi-channel optical device according to an embodiment of the present invention.

Fig. 5 is a schematic structural view of a base according to an embodiment of the invention.

Fig. 6 is a schematic structural diagram of a cover according to an embodiment of the invention.

FIG. 7 is a schematic view of a transition ring according to an embodiment of the present invention.

Fig. 8 is a schematic structural view of an airtight sealed case according to an embodiment of the present invention.

Fig. 9 is a schematic structural view of a cap according to an embodiment of the present invention.

Fig. 10 is a schematic structural view of a first surface of a stem according to an embodiment of the present invention.

Fig. 11 is a schematic structural view of the second face of the stem according to the embodiment of the present invention.

Fig. 12 is a schematic view of the structure of the inside of the cap according to the embodiment of the present invention.

Fig. 13 is a schematic view of the structure of the outer portion of the cap according to the embodiment of the present invention.

The components in the figure are identified as follows:

a non-hermetically sealed box 100, a hermetically sealed box 200,

a base 110, a first sidewall 120, a second sidewall 130, a cover 140, a base connector 150;

the first recess 111, the first through hole 121, the second through hole 131, the transverse plate 141, the vertical plate 142,

a header 210, a header cap 220, a radio frequency probe 230, a first radio frequency substrate 240, a first heat sink 250,

a semiconductor cooler 260, a laser 270, a second heat sink 280, a second radio frequency substrate 290;

a first surface 211 of the tube seat, a second surface 212 of the tube seat, an opening end 221, a light emitting plate 222 and a transparent window 223;

a dc probe 231, a ground probe 232; a seal ring 233;

a first connection member 241, a second recess region 251, a heat generating plate 261, and a heat absorbing plate 262;

a laser substrate 271, a laser diode 272; second connecting piece 291

A first collimating lens 310, an optical isolator 320, a combiner 330, a second collimating lens 340,

a transition ring 410, a first collimating lens holder 420, an adjusting ring 430, and a first interface 440;

light incident surface 331, light emergent surface 332, filter 333, and annular plate 411.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

As shown in fig. 1, the present embodiment provides a multi-channel optical device, which includes a non-airtight sealed case 100 and an airtight sealed case 200.

As shown in fig. 2 to 5, the non-hermetically sealed box 100 includes a base 110 having a horizontal plate of a certain thickness as the bottom surface of the box body of the non-hermetically sealed box 100, and the top of the base 110 is used to house an optical device.

The non-airtight sealed box 100 further comprises a first sidewall 120 and a second sidewall 130 disposed opposite to each other, and vertically connected to two ends of the base 110, wherein the first sidewall 120 and the second sidewall 130 form two box sides of the non-airtight sealed box 100, the first sidewall 120 and the base 110 are in an integral structure, and the bottom of the second sidewall 130 is connected to the bottom of the base 110 through a base connector 150.

As shown in fig. 4 and 6, the non-airtight sealed case 100 further includes a cover 140, which is a plate having a -shaped longitudinal section, and the cover 140 is mounted to the base 110 from above the base 110. The cover 140 includes a cross plate 141 and two risers 142, the cross plate 141 forming the top of the box body of the non-hermetically sealed box 100 and the two risers 142 forming two opposing box body sides of the non-hermetically sealed box 100.

The upper parts of the two risers 142 are respectively vertically connected to both ends of the transverse plate 141, the lower parts of the two risers 142 are connected to both sides of the base 110, each riser 142 is connected to both the first sidewall 120 and the second sidewall 130, and preferably, the cover 140 is welded to the sidewall of the base 110 using a laser welding process.

As shown in fig. 5, the first sidewall 120 of the non-airtight sealed case 100 is provided with a first through hole 121, and the first collimating lens 310 is sealingly mounted into the first through hole of the first sidewall 120. The non-airtight sealed box 100 forms a cavity, which is surrounded by the base 110, the first sidewall 120, the second sidewall 130 and the cover 140, and a plurality of optical devices including an optical isolator 320, a combiner 330 and four second collimating lenses 340 are disposed in the cavity.

As shown in fig. 3, 4 and 7, the second side wall 130 of the non-airtight sealed box 100 is a square frame, a second through hole 131 is formed in the middle of the second side wall 130, the airtight sealed box 200 penetrates through the second through hole 131, the outer wall of the airtight sealed box 200 is sealed and mounted to the second side wall 130 through a transition ring 410, and the transition ring 410 is a square ring, sleeved on the outer surface of the airtight sealed box 200 and inserted into the second through hole 131; the airtight sealed box 200 is fixed into the second through hole 131 by the transition ring 410. The transition ring includes a first end and a second end facing away from each other, the first end of which is insertable into the second through hole 131, and the outer surface of the second end of which is provided with an annular plate 411 protruding along the circumferential direction thereof. When the first end of the transition ring 410 is inserted into the second through hole 131, the annular plate 411 may be attached to the surface of the second sidewall 130 so that the airtight sealed case 200 may be stably fixed to the sidewall of the non-airtight sealed case 100 with a small insertion distance without occupying much space within the non-airtight sealed case so that the non-airtight sealed case may reserve enough space to house the respective optical devices.

As shown in fig. 2-4, the multi-channel optical device includes a first collimating lens holder 420, an adjusting ring 430, and a first interface 440. The first collimating lens holder 420 is a tubular piece, the outer sidewall of which is connected to the inner hole wall of the first through hole 121, and the inner sidewall of which is connected to the edge of the first collimating lens 310; the adjusting ring 430 is rotatably connected to the first collimating lens holder 420, one end of the first interface member 440 is rotatably connected to the adjusting ring 430, and an optical fiber ferrule (not shown) is disposed in the interface member 430 opposite to the first collimating lens 310.

As shown in fig. 4 and 8 to 9, a transparent window 223 is provided on one side wall of the airtight sealed case 200, which is disposed opposite to the first side wall 120 of the non-airtight sealed case 100, and one end of the airtight sealed case 200 provided with the transparent window 223 is inserted into the non-airtight sealed case 100. At least two photoelectric elements for receiving and emitting light are arranged in the airtight sealed box, and the photoelectric elements are lasers or photoelectric detectors.

As shown in fig. 12-13, in this embodiment, the optoelectronic device is a laser, and four lasers 270 disposed side by side are disposed in the hermetically sealed box 200, and each of the lasers 270 includes a light emitting surface (not shown), and each light emitting surface is disposed opposite to a transparent window 223.

As shown in fig. 2 to 4, in the non-airtight sealed case 100, an optical isolator 320, a wavelength division multiplexer and four second collimating lenses (LD lenses) 340 are sequentially disposed on the top surface of the base 110, and in this embodiment, insulating glue is used to attach the above components to the top surface of the base 110.

The wavelength division multiplexer comprises at least two light-in and light-out surfaces, one of which is opposite to the transparent window 223 to realize light path connection with the photoelectric element in the airtight sealed box 200; the other light incident and exit surface is disposed opposite to the first through hole 121 to realize light path connection with the components outside the non-airtight sealed box 100.

In the non-airtight sealed box 100 of the present embodiment, the wavelength division multiplexer is a multiplexer 330, and includes a plurality of light incident surfaces 331 and a light emergent surface 332. One surface of each second collimating lens 340 is opposite to the transparent window 223, and the other surface is opposite to the light incident surface 331 of the combiner; one surface of the optical isolator 320 is disposed opposite to the light-emitting surface 332 of the combiner, and the other surface is disposed opposite to the first collimating lens 310. The combiner 330 further includes at least one filter 333 disposed between the light incident surface 331 of the combiner and the airtight sealed box 200 and opposite to the transparent window 223. The combiner is an optical device for combining multiple light waves with different wavelengths from multiple channels into one light wave, and comprises Z-block, AWG, filter, PBS and the like. In this embodiment, the wavelength division multiplexer is a Z-block multiplexer.

Four second collimating lenses 340 are adhered to the surface of the base 110 side by using insulating glue, and each second collimating lens 340 is located between a Yu Gebo device 330 and a transparent window 223 and is opposite to the transparent window 223, and the distance between each second collimating lens 340 and the corresponding transparent window 223 is the same. In this embodiment, the four second collimating lenses 340 are arranged on a first straight line, the four filter 333 are arranged on a second straight line, and the angle formed by the first straight line and the second straight line is 20-40 degrees.

As shown in fig. 3 and 5, a concave first concave region 111 is disposed at one end of the top surface of the base 110 near the first sidewall 120, and an optical isolator 320 is installed in the first concave region 111, one surface of which is disposed opposite to the light emitting surface 332 of the combiner 330, and the other surface of which is disposed opposite to the first collimating lens 310. Because the height of the optical isolator 320 is different from the height of the combiner (Z-block) 330, the first concave region 111 forms a certain height difference on the top surface of the base 110, so that the central axis of the optical isolator 320, the central axis of the light-emitting surface 332 of the combiner 330 and the central axis of the transparent window 223 are located in the same plane.

As shown in fig. 3-4, in this embodiment, four laser beams emitted from the laser 270 respectively pass through the transparent window 223, the second collimating lens 340, and the filter 333, enter the Z-Block combiner 330, are reflected between two opposite reflection areas of the Z-Block combiner 330 multiple times, are combined into a laser beam, are emitted from the light emitting surface 332 thereof, and form an optical path similar to a zigzag inside the Z-Block.

The optical isolator 320 is wavelength selective, allowing light of one portion of wavelengths to pass through while isolating light of another portion of wavelengths. Therefore, if the difference in wavelength of light from both sides of the optical isolator 320 is large, the effect of unidirectional light guide or unidirectional isolation can be achieved. The optical isolator 320 may also isolate the combined beam if it contains stray light of some particular wavelength. The user can select a proper optical isolator according to the needs, and the main function of the optical isolator is to prevent external reflected light from entering the laser to generate optical resonance, so that the reflected light is prevented from affecting normal laser transmission.

The four laser beams emitted from the light emitting surface of the laser 270 of this embodiment form a combined beam after the combining process of the combiner 330, and then are emitted from the first collimating lens 310 through the optical isolator 320, converged into the optical fiber ferrule of the first interface member 440, and further conducted forward along the optical fiber ferrule.

As shown in fig. 8 to 10, the airtight sealed case 200 includes a tube holder 210 and a tube cap 220, the tube holder 210 is a rectangular metal plate, and is formed by press molding, and two side surfaces having the largest area of the tube holder 210 are a first surface 211 and a second surface 212, respectively, which are away from each other.

As shown in fig. 8, the cap (cap) 2 is a cap-shaped structure, and is made of metal material as a whole, the cap 220 includes an open end 221 and a light-emitting plate 222 opposite to each other, the open end 221 is connected to the first surface 211 of the tube base 210 in a sealing manner, a transparent window 223 is provided on the light-emitting plate 222, the transparent window 223 is provided opposite to the first sidewall 120, and one end of the airtight sealed box 200 provided with the transparent window 223 is inserted into the airtight sealed box 100. The transparent window 223 is made of glass, and the edge of the transparent window 223 is sintered on the light-emitting plate 222 by adopting solder at high temperature, so that the whole air tightness of the pipe cap 220 is ensured to be good. The tube holder 210 and the tube cap 220 enclose the airtight sealed case 200, and a space within the tube cap 220 accommodates a plurality of electronic devices.

As shown in fig. 10-13, the hermetically sealed box 200 further includes two or more radio frequency probes (RF pins) 230 extending side by side through the first face 211 of the header and the second face 212 thereof, one end of which is located within the hermetically sealed box 200 and the other end of which is located outside the hermetically sealed box 200. The central axes of all the rf probes 230 are located in the same plane, and are parallel to each other and are disposed at equal intervals. The joint of the radio frequency probe 230 and the tube seat 210 is provided with a sealing ring 233, so that the sealing effect of the airtight sealed box 200 is good. In this embodiment, the number of the radio frequency probes 230 is four.

A first heat sink (heat sink 1) 250 is disposed within the hermetically sealed box 200 and fixedly attached to the first face 211 of the header. The surface of the first heat sink 250 facing the rf probe 230, that is, the top surface of the first heat sink 250, is provided with a first rf substrate 240, and the first rf substrate 240 is adjacent to the first surface 211 of the stem 210. The surface of the first heat sink 250 facing the rf probe 230, that is, the top surface of the first heat sink 250, is provided with a second recess 251, which is a sinking area of the surface of the first heat sink 250.

The first rf substrate 240 includes at least two first connectors 241, which are metal wires, attached to the top surface of the first rf substrate 240 in parallel, with one end extending to the stem 210 and the other end extending to the vicinity of the laser 270. The two or more first connection pieces 241 are parallel to each other and are arranged on the surface of the first rf substrate 240 facing the rf probe 230 at equal intervals, and each rf probe 230 is soldered to and only soldered to one first connection piece 241 by a gold soldering process, so that the two are electrically connected. In this embodiment, four rf probes 230 are soldered to four first connectors 241, and the rf probes 230 are in one-to-one correspondence with the first connectors 241.

The present embodiment also includes a semiconductor cooler (TEC) 260, which is fabricated using the peltier effect of semiconductor materials. When a direct current passes through a couple of two semiconductor materials, one end absorbs heat and the other end releases heat to assist in transferring heat. The semiconductor cooler (TEC) 260 is disposed in the second recess 251, the two ends of the semiconductor cooler 260 are respectively a heat generating plate 261 and a heat absorbing plate 262, the heat generating plate 261 at the bottom of the semiconductor cooler 260 is adhered to the first heat sink 250 at the bottom of the second recess 251 by using silver paste, and the heat absorbing plate 262 is disposed at the top.

As shown in fig. 12-13, this embodiment includes four Lasers (LD) 270 mounted side-by-side to a heat sink 262 of a semiconductor cooler (TEC). Each of the lasers 270 includes a laser substrate (LD SM) 271, and further includes electronic devices such as a laser diode 272, a Thermistor (not shown), and a Capacitor (not shown), which are soldered to the laser substrate 271 by gold soldering.

As shown in fig. 10 and 12, each rf probe 230 is soldered to a first connector 241 by gold-tin solder, and each laser 270 is soldered to a first connector 241 by a gold wire. Each rf probe 230 is electrically connected to a laser 270 through a first connection 241 and provides an rf signal to the laser 270.

As shown in fig. 12, the semiconductor cooler 260 cooperates with the thermistor to control the temperature of the laser diodes for multiple channels inside the tube cap. Where temperature control is not required, the semiconductor cooler 260 may be removed from the thermistor. In some embodiments, the first heat sink 250 does not need to be provided with the second concave region 251, the laser 270 directly contacts the first heat sink 250, and the heat generated by the laser 270 is conducted out through the first heat sink 250, so as to achieve a heat dissipation effect; meanwhile, the first rf substrate 240 may be removed, the length of the laser substrate 271 in the extending direction of the rf probe 230 may be longer, one end of the laser substrate 271 is adjacent to the first surface 211 of the stem 210, and the laser substrate 271 and the rf probe 230 are directly soldered together by a gold soldering process, so that the two are electrically connected.

In this embodiment, the four laser substrates 271 are adhered to the surface of the heat absorbing plate 262 side by using silver paste, and the surface of the laser substrate 271 on the side far from the heat absorbing plate 262 is perpendicular to the first surface 211 of the stem 210; each of the laser substrates 271 is provided with a laser diode 272, and each of the laser diodes 272 includes a light emitting surface disposed opposite to the light emitting plate 222, specifically, each light emitting surface is disposed opposite to one of the transparent windows 223, and four laser beams emitted from the four lasers 270 are emitted from the four transparent windows 223, respectively.

The laser substrate 271 and the first rf substrate 240 are electrically connected together by gold wires by a gold wire bonding process, so that the rf signal of the rf probe 230 can be sent to the laser diode 272, thereby achieving a signal loading effect. The surface of the laser substrate 271 on the side where the laser diode 272 is mounted is flush with the surface of the first rf substrate 240 on the side facing the rf probe 230, so that the length of the gold wire connecting the laser substrate 271 and the first rf substrate 240 is as short as possible, thereby improving the signal stability of the laser 270.

As shown in fig. 11 and 13, the present embodiment further includes a second heat sink 280 fixedly connected to the second face 212 of the stem 210 and located outside the cap 2; the plane of the central axes of the more than two radio frequency probes 230 is parallel to the surface of the second heat sink 280 facing the radio frequency probes 230. The first heat sink 250 and the second heat sink 280 are respectively in direct contact with two surfaces of the tube holder 210, both the two heat sinks and the tube holder 210 are metal members with good heat dissipation, and heat generated by the laser 270 is conducted to the outside of the airtight sealed box 200 through the two heat sinks.

The surface of the second heat sink 280 facing the side of the rf probe 230, i.e., the top surface of the second heat sink 280 is shown provided with a second rf substrate 290. The second rf substrate 290 includes more than two second connection members 291, which are metal wires, arranged on the top surface of the second rf substrate 290 in parallel and at equal intervals, one end of which extends to the socket 210, and the other end of which extends to the end of the second heat sink 280 away from the socket 210, and is connected to a circuit board. Each rf probe 230 is soldered to and only one second connector 291 using a gold soldering process such that the two are electrically connected. In this embodiment, four rf probes 230 are soldered to four second connectors 291, respectively, and the rf probes 230 and the second connectors 291 are in one-to-one correspondence. Each rf probe 230 is electrically connected to the circuit board through a second connection member 291, and the rf signal sent by the circuit board is sequentially transmitted to the laser 270 through the second connection member 291, the rf probe 230, and the first connection member 241.

As shown in fig. 10-13, the present embodiment further includes a direct current probe (DC pins) 231 and a ground probe (GND pins) 232, where the direct current probe 231 penetrates the first surface 211 and the second surface 212 of the socket 210 side by side for supplying power to the laser 270; the ground probe 232 is connected to the second face 12 of the socket 210 and is disposed outside the cap 2. Sealing rings 233 can be arranged at the joint of the direct current probe 231 and the grounding probe 232 and the tube seat, so that the airtight sealing box can be well sealed.

The semiconductor cooler 260 and the direct current probe 231 are electrically connected together through the gold wire by adopting a gold wire soldering process, so that the direct current of the direct current probe 231 can be transmitted to the semiconductor cooler 260, and the heat transfer effect is realized. A Thermistor (thermal) and a Capacitor (Capacitor) are electrically connected with the first rf substrate 240 or the dc probe 231 through gold wires by adopting a gold wire welding process, and the semiconductor cooler 260 is matched with the Thermistor, so that temperature control can be realized on the laser diodes of a plurality of channels inside the tube cap.

In a conventional horizontal TO coaxial package structure, a laser substrate (LD SM) is generally directly attached TO a semiconductor cooler (TEC), and is connected TO a radio frequency probe (RF pins) through a longer gold wire, and the radio frequency probe (RF pins) is connected TO the radio frequency substrate (RF SM) by a gold soldering process.

The embodiment provides an optical module, which comprises a shell, wherein the multichannel optical device and the circuit board assembly are arranged in the shell, and the circuit board assembly is electrically connected to the multichannel optical device. Specifically, the circuit board assembly includes at least one Printed Circuit Board (PCB), on which a power module, a DC-DC direct current conversion unit, a radio frequency signal generator, a ground wire, etc. are disposed, and the radio frequency probe 230 in the multi-channel optical device is connected to the radio frequency signal generator; the dc probe 231 in the multi-channel optical device is directly or indirectly connected to a dc power supply, and the ground probe 232 is connected to a ground wire.

In this embodiment, the multi-channel optical device main body is a non-airtight sealed box, another airtight sealed box is embedded into one side wall of the non-airtight sealed box, a plurality of light beams emitted by the multi-channel laser are converged into one beam of light through the combiner, and the one beam of light is emitted to the optical fiber ferrule in the interface piece through the collimating lens, wherein the electronic devices such as the laser are installed in the airtight sealed box, and the optical devices such as the wavelength division multiplexer are installed in the non-airtight sealed box.

The beneficial effects of the embodiment are that the multichannel laser is manufactured by adopting the TO packaging technology, the airtight sealing box provided with the laser only needs TO ensure good airtight performance, the airtight problem of the accommodating space of the optical device is not required TO be considered, and compared with the scheme that the whole optical module keeps airtight performance, the packaging cost can be effectively reduced

In the above embodiment, the optical module and the multi-channel optical device are applied to the light emitting end, and in other embodiments, the optical module and the multi-channel optical device may be applied to the light receiving end, for example, the photo element in the hermetically sealed box 200 may be at least two photo detectors for receiving light. The wavelength division multiplexer in the non-airtight sealed box 100 is a beam splitter, the airtight sealed box 200 is internally provided with a plurality of photoelectric detectors, and the light beam is conducted to the beam splitter in the second optical fiber ferrule and is split into more than two split light beams by the beam splitter, and each split light beam is emitted into one photoelectric detector from a transparent window.

The foregoing has described in detail embodiments of the present invention, and specific examples have been presented herein to illustrate the principles and embodiments of the present invention, the above examples being provided solely to assist in the understanding of the present invention; those of ordinary skill in the art will appreciate that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.

Claims (16)

1. A multi-channel optical device, comprising:

the non-airtight sealing box comprises a base and a first side wall, wherein the first side wall is vertically connected to one end of the base and is provided with a first through hole;

a hermetic sealing box fixed to a base at an end opposite to the first side wall, a transparent window being provided at one side wall of the hermetic sealing box, an end of the hermetic sealing box provided with the transparent window being inserted into the non-hermetic sealing box; and

the wavelength division multiplexer is arranged on the base in the non-airtight sealed box and comprises more than two light in-out surfaces, and one light in-out surface of the wavelength division multiplexer is opposite to the transparent window so as to realize light path connection with the photoelectric element in the airtight sealed box; the other light inlet and outlet surface is opposite to the first through hole so as to realize light path connection with the element outside the non-airtight sealed box.

2. The multi-channel optical device of claim 1, wherein the optoelectronic element comprises at least two lasers arranged side-by-side inside the hermetically sealed box, each laser comprising a light emitting surface arranged opposite the transparent window; and

a first collimating lens mounted into the first through hole;

more than two light beams emitted by the light emitting surface pass through the wavelength division multiplexer to form a combined light beam, and the combined light beam is emitted from the first collimating lens.

3. The multi-channel optical device of claim 2, further comprising

A first collimating lens holder, which is a tubular member, an outer sidewall of which is connected to a wall of the first through hole, and an inner sidewall of which is connected to an edge of the first collimating lens;

an adjusting ring rotatably connected to the first collimating lens holder, and

and one end of the interface piece is rotatably connected to the adjusting ring, and an optical fiber inserting core is arranged in the interface piece and is opposite to the first collimating lens.

4. The multi-channel optical device of claim 2 wherein,

the wavelength division multiplexer is a combiner and comprises a light incident surface and a light emergent surface;

the non-hermetically sealed box comprises:

more than two second collimating lenses, one surface of each second collimating lens is opposite to the transparent window, and the other surface of each second collimating lens is opposite to the light incident surface of the combiner; and

one surface of the optical isolator is arranged opposite to the light emergent surface of the combiner, and the other surface of the optical isolator is arranged opposite to the first collimating lens.

5. The multi-channel optical device of claim 1, wherein the non-hermetically sealed box further comprises

A second side wall arranged opposite to the first side wall; a second through hole is formed in the middle of the second side wall; and

the transition ring is sleeved on the outer surface of the airtight sealing box and is inserted into the second through hole; the airtight sealed box is fixed into the second through hole through the transition ring.

6. A multi-channel optical device as defined in claim 5 wherein,

and an annular plate is arranged at one end, opposite to the direction of inserting the second through hole, of the transition ring, and the annular plate is attached to the surface of the second side wall.

7. The multi-channel optical device of claim 1, wherein the non-hermetically sealed box comprises:

a cover, which is a plate, is mounted over the base and is connected to the base, the first side wall and the second side wall.

8. The multi-channel optical device of claim 1 wherein,

the top surface of the base is sequentially provided with a second collimating lens, a wavelength division multiplexer and an optical isolator;

the central axis of the optical isolator is positioned in the same plane with the central axis of the light-emitting surface of the wavelength division multiplexer and the central axis of the transparent window;

a first concave area is arranged at one end, close to the first side wall, of the top surface of the base, and the optical isolator is installed in the first concave area.

9. The multi-channel optical device of claim 1, wherein the hermetically sealed box comprises:

the tube seat comprises a first surface and a second surface which are away from each other;

the pipe cap comprises an opening end and a light emitting plate which are opposite to each other; the opening end is connected to the first surface of the tube seat in a sealing way, and the transparent window is arranged on the light emitting plate;

more than two radio frequency probes penetrate through the first surface and the second surface of the tube seat side by side;

a first heat sink fixedly connected to a first face of the header; and

more than two lasers are arranged on the surface of the first heat sink facing the side of the radio frequency probe side by side; each laser comprises a light emitting surface which is arranged opposite to the transparent window;

wherein, the light beam emitted by each light emitting surface is emitted from a transparent window; each radio frequency probe is electrically connected to a laser and provides radio frequency signals for the laser.

10. The multi-channel optical device of claim 9 wherein the hermetically sealed box comprises:

the second concave area is arranged on the surface of one side of the first heat sink facing the radio frequency probe; and

the semiconductor cooler is arranged in the second concave region; the semiconductor cooler comprises a heating plate and a heat absorbing plate, wherein the heating plate is connected to the first heat sink, and the lasers are mounted on the surface of the heat absorbing plate side by side.

11. The multi-channel optical device of claim 9, wherein the hermetically sealed box comprises a first radio frequency substrate fixedly connected to a surface of the first heat sink facing the radio frequency probe and positioned between the stem and the laser; the radio frequency probe and the laser are electrically connected to the first radio frequency substrate.

12. The multi-channel light device of claim 9 wherein the hermetically sealed box further comprises:

the second heat sink is fixedly connected to the second surface of the tube seat and is positioned outside the tube cap; and

the second radio frequency substrate is arranged on the surface of the second heat sink facing the side of the radio frequency probe;

the central axes of the more than two radio frequency probes are parallel to each other, and the plane where the central axes of the more than two radio frequency probes are located is parallel to the surface of the side, facing the radio frequency probes, of the second heat sink.

13. The multi-channel optical device of claim 9, wherein the laser comprises: the laser substrates are arranged on the surface of the first heat sink or the surface of the heat absorbing plate of the semiconductor cooler in parallel; and

a laser diode mounted to a top surface of a laser substrate; the laser diode comprises the light emitting surface;

the surface of the laser substrate on the side where the laser diode is mounted is flush with the surface of the first radio frequency substrate on the side facing the radio frequency probe.

14. The multi-channel optical device of claim 9, wherein the hermetically sealed package further comprises a sealing ring disposed at a junction of at least one rf probe and the stem or at a junction of at least one dc probe and the stem.

15. An optical module comprising the multi-channel optical device of any one of claims 1-14.

16. The optical module of claim 15, comprising:

the multichannel optical device is arranged in the shell; and

the circuit board assembly is arranged in the shell and is electrically connected to the multichannel optical device.