CN116554693A - Single-component high-heat-conductivity silicon mud and preparation method thereof - Google Patents
Single-component high-heat-conductivity silicon mud and preparation method thereof Download PDFInfo
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- CN116554693A CN116554693A CN202310747389.5A CN202310747389A CN116554693A CN 116554693 A CN116554693 A CN 116554693A CN 202310747389 A CN202310747389 A CN 202310747389A CN 116554693 A CN116554693 A CN 116554693A
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- silicone oil
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 69
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 69
- 239000010703 silicon Substances 0.000 title claims abstract description 69
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 229920002050 silicone resin Polymers 0.000 claims abstract description 80
- 229920002545 silicone oil Polymers 0.000 claims abstract description 62
- 239000000843 powder Substances 0.000 claims abstract description 49
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 45
- 239000000463 material Substances 0.000 claims abstract description 25
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 20
- 239000003054 catalyst Substances 0.000 claims abstract description 17
- 239000000945 filler Substances 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000004014 plasticizer Substances 0.000 claims abstract description 10
- 239000004970 Chain extender Substances 0.000 claims abstract description 8
- 239000000049 pigment Substances 0.000 claims abstract description 8
- 238000006243 chemical reaction Methods 0.000 claims abstract description 4
- 239000003973 paint Substances 0.000 claims abstract description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 70
- 229920002554 vinyl polymer Polymers 0.000 claims description 66
- 239000001257 hydrogen Substances 0.000 claims description 35
- 229910052739 hydrogen Inorganic materials 0.000 claims description 35
- 239000000203 mixture Substances 0.000 claims description 35
- -1 polydimethylsiloxane Polymers 0.000 claims description 34
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 20
- 239000004593 Epoxy Substances 0.000 claims description 17
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 16
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 15
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 14
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 11
- 239000011265 semifinished product Substances 0.000 claims description 11
- 150000002431 hydrogen Chemical group 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 8
- 239000012798 spherical particle Substances 0.000 claims description 8
- 229910052582 BN Inorganic materials 0.000 claims description 7
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 7
- 238000004513 sizing Methods 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 7
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 6
- 229920003216 poly(methylphenylsiloxane) Polymers 0.000 claims description 5
- 239000000047 product Substances 0.000 claims description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 3
- 238000005303 weighing Methods 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 239000007822 coupling agent Substances 0.000 claims description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims 1
- 239000003921 oil Substances 0.000 abstract description 27
- 229920003023 plastic Polymers 0.000 abstract description 6
- 239000004033 plastic Substances 0.000 abstract description 6
- 230000001105 regulatory effect Effects 0.000 abstract description 4
- 230000001276 controlling effect Effects 0.000 abstract description 3
- 230000035699 permeability Effects 0.000 abstract description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 15
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 15
- 238000004132 cross linking Methods 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 229910052697 platinum Inorganic materials 0.000 description 10
- 239000004568 cement Substances 0.000 description 9
- 229920002379 silicone rubber Polymers 0.000 description 8
- 239000004519 grease Substances 0.000 description 7
- 239000004945 silicone rubber Substances 0.000 description 7
- 238000009472 formulation Methods 0.000 description 5
- 230000007774 longterm Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000004062 sedimentation Methods 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 238000000926 separation method Methods 0.000 description 4
- 238000007792 addition Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- ZXPDYFSTVHQQOI-UHFFFAOYSA-N diethoxysilane Chemical compound CCO[SiH2]OCC ZXPDYFSTVHQQOI-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002687 intercalation Effects 0.000 description 2
- 238000009830 intercalation Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- HIHIPCDUFKZOSL-UHFFFAOYSA-N ethenyl(methyl)silicon Chemical compound C[Si]C=C HIHIPCDUFKZOSL-UHFFFAOYSA-N 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
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Abstract
The invention relates to the field of heat-conducting interface materials, in particular to single-component high-heat-conductivity silicon mud and a preparation method thereof, wherein the single-component high-heat-conductivity silicon mud comprises 100 parts of silicone oil, 10-50 parts of MQ silicon resin and 1500-2600 parts of high-heat-conductivity powder; the paint also comprises 0.3 to 10 parts of chain extender, 0.5 to 5 parts of cross-linking agent, 1 to 10 parts of catalyst, 5 to 20 parts of tackifier, 5 to 15 parts of plasticizer and 1 to 5 parts of pigment. According to the method, the silicone oil, the MQ silicone resin and the heat-conducting filler are matched with each other, so that the heat-conducting silicone paste with good plasticity, high heat conductivity, low oil permeability and low high-temperature plastic deformability can be obtained. Meanwhile, the comprehensive performance of the silicon mud is further improved by further regulating and controlling the structures of the silicon oil and the MQ resin and the reaction conditions in the preparation process.
Description
Technical Field
The invention relates to the field of heat-conducting interface materials, in particular to single-component high-heat-conductivity silicon mud and a preparation method thereof.
Background
With the rapid development of economic globalization and science and technology, the living standard of people is continuously improved, the information communication quantity and quality requirements are improved, and devices with higher emissivity are needed. For this reason, the concept of 5G communication is introduced, and compared with the prior communication devices, 5G technology requires devices with higher operating power and denser component arrangement. Therefore, the device inevitably generates more heat, and if the heat cannot be transmitted in time, the local temperature of the components is too high due to the accumulation of a large amount of heat, so that the device cannot work normally or the device is damaged. In order to timely radiate heat, a heat-conducting interface material is filled between the heating device and the heat radiating device, so that the normal operation of the electronic equipment is ensured.
The traditional heat-conducting interface material is heat-conducting silicone grease and a heat-conducting gasket. The heat-conducting silicone grease is usually obtained by mechanically mixing inert silicone oil with low viscosity and heat-conducting powder, and has simple and various construction modes and wide application. However, the heat conduction powder and the inert silicone oil in the silicone grease are easy to separate and settle, and particularly the inert silicone oil is easy to exude at high temperature, so that the silicone grease is dried and cracked, the interface thermal resistance is increased, the heat dissipation is uneven, and the service life of an electronic device is seriously influenced. The heat-conducting gasket is free from the problems of oil seepage, drying and the like silicone grease, is a completely cured elastomer structure, and has the advantages of convenient construction, cleanliness and excellent high-temperature and low-temperature impact resistance. However, the silicone grease can be better in adherence with devices, so that interface thermal resistance is higher, particularly, a gasket is easy to harden at a long-term high temperature, gaps are easy to form between the gasket and the interface, thermal conductivity is seriously reduced, and heat transfer and stability of equipment are affected.
Patent publication No. CN106398226A discloses a thermally conductive silicone gel and a method for preparing the same, using vinyl-terminated polydimethylsiloxane and/or vinyl polymethylvinylsiloxane, 100 parts of a base polymer; 0.1-10 parts of cross-linking agent; 500-1800 parts of filler; 0.1-15 parts of silane coupling agent. However, the use of low molecular weight terminal vinyl polydimethylsiloxanes and/or vinyl polymethylvinylsiloxanes may be subject to low molecular volatilization when used in high temperature environments for prolonged periods of time.
Patent publication No. CN104497575A discloses an organosilicon high-heat-conductivity mud, which comprises the following raw materials: silicone oil, heat-conducting powder filler, plasticizer, powder surface treating agent, cross-linking agent, high-temperature-resistant pigment and platinum catalyst; 100 parts of silicone oil and 1000-1200 parts of heat conducting powder filler in parts by weight; the amount of the plasticizer is 0.5 to 1 weight percent and the amount of the powder surface treating agent is 1 to 3 weight percent based on the heat conducting powder filler; the usage amount of the cross-linking agent is 1-3 wt% based on the silicone oil, the usage amount of the high temperature resistant pigment is 5-10 wt%, and the usage amount of the platinum catalyst is 0.1-0.15 wt%. The low-viscosity silicone oil has low molecular volatile matters in long-term use in a high-temperature environment.
Patent with the publication number of CN 110903656B discloses a low-volatility heat-resistant heat-conducting silica gel paste material, and a preparation method and application thereof. The low-volatility heat-resistant heat-conducting silica gel mud material comprises the following components in parts by weight: 100-1000 parts of heat conducting filler, 100 parts of carrier, 2-5 parts of cross-linking agent, 3-5 parts of temperature resistant agent and 1-2 parts of platinum catalyst. The invention adopts methyl silicone rubber, methyl vinyl silicone rubber and hydroxyl-terminated silicone rubber, which not only have lower volatile components, but also have larger molecular weight than silicone oil system and higher temperature resistance, and the silicone rubber with side chain hydrogen-containing polysiloxane generates hydrosilylation reaction under the catalysis of platinum catalyst to generate the silicone rubber with low crosslinking degree to realize plasticine shape, no flow, no solidification and no volatilization, and high and low temperature resistance. However, the heat-conducting cement prepared by the patent has the disadvantages of reduced plasticity and wettability due to larger molecular weight of the silicon rubber, and is unfavorable for reducing the interface thermal resistance between the cement and the radiating element.
In order to meet the market demands for miniaturization and thinness of electronic devices, dense packaging and high power of electronic components are optimal solutions, which inevitably aggravate heat aging of the electronic devices. Therefore, the problem of high-efficiency 3 heat dissipation of devices is solved, and the heat dissipation becomes an important point for ensuring the normal operation of electronic equipment, and is a great difficulty in the field of heat management design, so that development of a heat conduction interface material which is convenient to construct, low in interface heat resistance, good in heat conductivity, excellent in heat aging, free from drying and hardening is urgently needed.
Disclosure of Invention
The application provides a single-component high-heat-conductivity silicon mud and a preparation method thereof to overcome the defects that a heat-conducting material in the prior art is easy to oil seepage, high in interface thermal resistance and easy to dry and harden.
In order to achieve the aim of the invention, the invention is realized by the following technical scheme:
the single-component high-heat-conductivity silicon mud consists of, by weight, 100 parts of silicone oil, 10-50 parts of MQ silicone resin and 1500-2600 parts of high-heat-conductivity powder;
the paint also comprises 0.3 to 10 parts of chain extender, 0.5 to 5 parts of cross-linking agent, 1 to 10 parts of catalyst, 5 to 20 parts of tackifier, 5 to 15 parts of plasticizer and 1 to 5 parts of pigment;
the silicone oil and the MQ silicone resin both contain vinyl; and, in addition, the method comprises the steps of,
the vinyl content of the MQ silicon resin is 2.5-15 times of that of the silicone oil;
the M/Q ratio of the MQ silicone resin is between 1.4 and 1.6.
Those skilled in the art will appreciate that in order for the heat conductive cement to achieve the best heat conductive properties, the most basic requirements of the heat conductive cement are as follows: (1) The heat-conducting material has good plasticity, so that the heat-conducting material can meet the requirements of heat-conducting interfaces with various shapes; (2) oil seepage and other phenomena can not occur in the using process; (3) good heat conducting performance; (4) plastic deformation can not be generated under the action of high and low temperature.
The heat-conducting daub in the prior art adopts linear low-molecular-weight vinyl silicone oil or high-molecular silicone rubber as a matrix material, and then a certain amount of heat-conducting filler, a cross-linking agent and a catalyst are added into the matrix material oil, and the heat-conducting daub is obtained after cross-linking and solidification at a certain temperature. However, at present, the heat-conducting cement has the following problems: (1) When vinyl silicone oil with low molecular weight is adopted, in order to improve the plasticity of the heat-conducting cement, the whole crosslinking degree of the heat-conducting cement is usually required to be ensured to be at a lower value, but the means can lead to the phenomenon of oil seepage caused by incomplete curing of the vinyl silicone oil with low molecular weight; (2) In order to overcome the phenomenon of oil seepage, a high crosslinking degree is required to be maintained by adopting vinyl silicone oil with low molecular weight as a matrix material, but the plasticity of the heat-conducting cement is reduced due to the excessively high crosslinking degree; (3) When a high molecular weight silicone rubber is used as a base material, although its oil permeability is low under the condition of low crosslinking degree, its plasticity after curing is still poor due to its high viscosity.
In addition to adding conventional silicone oil, the single-component high-heat-conductivity silicone mud is added with a certain amount of MQ silicone resin, and compared with the silicone oil, the MQ silicone resin has lower viscosity and more reactive groups on the premise of the same molecular weight, so that after the MQ silicone resin is compounded with the silicone oil, the MQ silicone resin and the silicone oil can have higher crosslinking degree after being crosslinked and solidified with the silicone oil, the purpose of oil seepage prevention is achieved, and meanwhile, the single-component high-heat-conductivity silicone mud has higher plasticity. Meanwhile, due to the branched structure of the MQ silicon resin, the MQ silicon resin can form a cross-linking interpenetrating network in the silicon mud after reacting with linear silicon oil, so that each component in the cement can be kept stable, the problem of separation and sedimentation of heat conducting powder and silicon oil is further prevented, and meanwhile, the formation of the cross-linking interpenetrating network can also effectively prevent plastic deformation of the silicon mud in a cold and hot environment.
Furthermore, the applicant of the present application has unexpectedly found in daily tests that the structural characteristics of the silicone oil and of the MQ silicone resin itself have a significant impact on the overall properties of the resulting silicone mud, including the ratio of the vinyl content of the MQ silicone resin to that of the silicone oil and the M/Q ratio inside the MQ silicone resin.
The applicant finds that the ratio of the vinyl content of the MQ silicone resin to the vinyl content of the silicone oil can determine the curing mode of the silicone paste in the application, when the ratio of the vinyl content of the MQ silicone resin to the vinyl content of the silicone oil is smaller or the vinyl content of the silicone oil is higher than that of the MQ silicone resin in the application, the silicone paste still plays a dominant role in the crosslinking process, and at the moment, the MQ silicone resin cannot form a high-density crosslinking interpenetrating network structure inside the silicone paste, so that the phenomena of oil seepage, sedimentation of heat conduction powder and plastic deformation of the silicone paste still occur after the preparation of the silicone paste is completed under the condition. When the ratio of the vinyl content of the MQ silicone resin to the vinyl content of the silicone oil is too high, the MQ silicone resin occupies absolute position in the crosslinking process of the silicone mud in the curing process, so that the crosslinking density in the silicone mud is too high, the toughening and softening effects of the linear silicone oil are greatly reduced, and the plasticity of the prepared silicone mud is greatly reduced. After practical tests, the problems of oil seepage and separation and sedimentation of the silicon oil or the high-heat-conductivity powder can be prevented on the premise of ensuring good plasticity of the silicon mud when the ratio of the vinyl content of the MQ silicon resin to the vinyl content of the silicon oil is between 2.5 and 15.
In addition to the ratio of the vinyl content of the MQ silicone resin to the silicone oil, the M/Q ratio within the MQ silicone resin itself has an important effect on the properties of the silicone mud. M and Q in MQ silicone respectively represent two different structural units. Wherein M represents a monofunctional siloxy unit (R 3 SiO), the structural schematic formula of which is as follows:q represents a tetrafunctional siloxy unit (SiO 2 ) The structural schematic formula is as follows: />The applicant finds that the larger the M/Q ratio in the MQ silicone resin per se is, the lower the branching degree of the MQ silicone resin is, so that the fewer crosslinking points are used for forming a crosslinked interpenetrating network structure in the process of compounding the MQ silicone resin and silicone oil, and the problems of oil seepage of heat-conducting silicone mud and separation and sedimentation of high heat-conducting powder are caused. When the M/Q ratio of the internal MQ silicone resin is smaller, the self structure of the MQ resin is closer to the spherical crystal structure, and the phase separation condition between the MQ resin and other materials of the silicon mud is serious, so that the connection node between the silicone oil and the cross-linking agent only occurs around the spherical crystal structure of the MQ silicone resin at high density, but cannot be uniformly generated in the silicon mud, and the internal silicon mud does not contain MQIn addition, when the M/Q ratio in the MQ silicone resin is too small, the hardness of the MQ silicone resin is improved due to the existence of a crystal structure, so that the plasticity of the silicone mud is greatly reduced.
Therefore, in summary, the silicone oil and the silicone resin are matched with each other, so that the high-heat-conductivity silicone mud with good plasticity and no oil seepage and no separation and sedimentation can be obtained. Meanwhile, the comprehensive performance of the silicon mud is further improved by further regulating and controlling the structures of the silicone oil and the MQ resin.
Preferably, the silicone oil is at least two of monovinyl-terminated hydroxyl silicone oil, vinyl-terminated polydimethylsiloxane and polymethylphenyl-methylvinyl siloxane.
Preferably, the viscosity of the silicone oil is 100 mPas-1000 mPas, and the mass fraction of vinyl is 0.1% -0.4%.
Preferably, the MQ silicone is at least one of a low phenyl vinyl MQ silicone, an epoxy modified MQ silicone, and a vinyl MQ silicone.
The MQ silicone resin can select to use unmodified vinyl MQ silicone resin or low phenyl vinyl MQ silicone resin or epoxy modified MQ silicone resin which is regulated by a structure, wherein the long-term temperature resistance of the heat conduction silicone mud can be effectively improved due to the introduction of phenyl when the low phenyl vinyl MQ silicone resin is selected to be used.
Preferably, the mass fraction of vinyl of the MQ silicone resin is between 1% and 1.5%.
Preferably, the phenyl mole fraction of the low phenyl vinyl MQ silicone resin is between 5 and 15%.
In the application, if the low-phenyl vinyl MQ silicon resin is adopted, the mole fraction of the internal phenyl group has a certain influence on the performance of the silicon mud, the plasticity of the silicon mud can be reduced when the mole fraction of the phenyl group is too high, and the long-term temperature resistance of the heat conduction silicon mud can not be obviously improved when the mole fraction of the phenyl group is smaller. Tests show that when the mole fraction of phenyl is between 5 and 15 percent, the heat-conducting silicon mud with good plasticity and good long-term temperature resistance can be obtained.
Preferably, the epoxy modified MQ silicone resin has an epoxy value of 0.03-0.12.
Preferably, the high heat conduction powder comprises spherical heat conduction particles accounting for 40% -60% of the total amount of the high heat conduction powder, nanoscale heat conduction powder accounting for 20% -50% of the total amount of the high heat conduction powder and sheet heat conduction materials accounting for 10% -30% of the total amount of the high heat conduction powder.
In the prior art, the actual heat conduction requirement can be met by only adding one heat conduction filler, and in the application, the applicant adopts a scheme of compounding heat conduction fillers with different structures, so that the obtained high heat conduction powder has higher heat conduction effect. The principle is that spherical heat conducting particles, nanoscale heat conducting powder and sheet heat conducting materials are adopted to be matched with each other in the heat conducting mud heat conducting device, so that a heat conducting passage of a product can be effectively optimized, heat conduction is smoother, meanwhile, the sheet heat conducting materials can be added to form a sheet intercalation structure shown in figure 1, displacement resistance of other heat conducting powder is effectively increased, and plastic deformation of the heat conducting silicon mud at high and low temperatures is reduced.
Preferably, the spherical heat-conducting particles are high alpha phase spherical alumina with alpha phase content more than 97% and spherical particle diameter of 5-15 mu m.
In the method, high alpha phase spherical alumina with alpha phase content more than 97% is selected as the heat conducting filler, and the heat conducting filler has extremely high heat conducting performance, so that the addition amount of the heat conducting filler can be effectively reduced on the premise that the silicon mud has the same heat conducting coefficient, and the plasticity of the heat conducting silicon mud is greatly improved.
Preferably, the nanoscale heat-conducting powder comprises at least one of high alpha-phase nanoscale aluminum oxide and high-purity nanoscale zinc oxide with the particle size of 20-200 nm.
Preferably, the sheet-like heat conductive material includes at least one or a combination of a plurality of boron nitride, aluminum hydroxide, magnesium hydroxide having a particle size of 10-20 μm.
Preferably, the high thermal conductivity powder is surface modified by octadecyltrimethoxy siloxane and vinyl triethoxy siloxane.
Preferably, the chain extender is double-end low-hydrogen polysiloxane, and the mass fraction of hydrogen is 0.05% -0.1%.
Preferably, the cross-linking agent is a blend of terminal hydrogen silicone oil and hydrogen silicone resin, wherein the viscosity of the terminal hydrogen silicone oil is between 50cps and 200cps, the mass fraction of hydrogen is between 0.05% and 0.15%, the viscosity of the hydrogen silicone resin is about 2500-3500 cps, and the mass fraction of hydrogen is between 0.1% and 0.2%.
Preferably, the tackifier is a blend of an epoxy silane coupling agent and a vinyl phenyl siloxane coupling agent, and the mass mixing ratio is 1:1-5:1.
Preferably, the plasticizer is at least one of methyl phenyl silicone oil, methyl fluorine-containing silicone oil and long-chain alkyl grafted dimethyl silicone oil.
In a second aspect, the present invention also provides a method for preparing the single-component high thermal conductivity silicon paste, the preparation method comprising the steps of:
(1) Preparing a semi-finished product: the silicone oil, the MQ silicone resin and the high-heat-conductivity powder are weighed according to the proportion and added into a kneader, and the mixture is vacuumized and uniformly mixed to obtain a semi-finished product for standby;
(2) Preparing a finished product: weighing the semi-finished product, the catalyst, the cross-linking agent and other materials according to the proportion, putting the materials into a kneader, keeping the temperature and the pressure, continuing stirring reaction, and stopping stirring when the viscosity of the sizing material reaches the standard range;
(3) And (5) subpackaging: and (5) discharging and subpackaging when the temperature of the sizing material is reduced to room temperature.
The heat-conducting silicone paste is stirred and mixed by a kneader, solidified and crosslinked at a certain temperature, and continuously plasticized into paste under the action of high shearing force, so that the heat-conducting silicone paste has plasticity and wettability similar to those of heat-conducting silicone grease, and has the unique characteristic of permanent non-drying and non-cracking. Compared with the scheme that the components are uniformly mixed and then solidified, the method of stirring and pre-solidifying by adopting the kneader can enable the prepared silicon mud to have better oil seepage resistance and cold and heat shock resistance.
Therefore, the invention has the following beneficial effects:
according to the method, the silicone oil, the MQ silicone resin and the heat-conducting filler are matched with each other, so that the heat-conducting silicone paste with good plasticity, high heat conductivity, low oil permeability and low high-temperature plastic deformability can be obtained. Meanwhile, the comprehensive performance of the silicon mud is further improved by further regulating and controlling the structures of the silicon oil and the MQ resin and the reaction conditions in the preparation process.
Drawings
Fig. 1 is a schematic diagram of a sheet-like intercalation structure formed by a sheet-like heat conductive material in a high heat conductive powder.
Detailed Description
The invention is further described below in connection with specific embodiments. Those of ordinary skill in the art will be able to implement the invention based on these descriptions. In addition, the embodiments of the present invention referred to in the following description are typically only some, but not all, embodiments of the present invention. Therefore, all other embodiments, which can be made by one of ordinary skill in the art without undue burden, are intended to be within the scope of the present invention, based on the embodiments of the present invention.
[ influence of the ratio of the vinyl content of MQ Silicone resin to vinyl Silicone oil on one-component high thermal conductive Silicone mud ]
Example 1
The single-component high-heat-conductivity silicon mud consists of the following components in parts by weight:
(1) Silicone oil: 100 parts of vinyl-terminated polydimethylsiloxane having a viscosity of 500 mPas and a vinyl mass fraction of 0.2%;
(2) MQ silicone resin: 30 parts of vinyl MQ silicone resin with the mass fraction of vinyl of 0.5% and the M/Q ratio of 1.5;
(3) High heat conduction powder: 2000 parts of high alpha phase spherical alumina with alpha phase content more than 97% and spherical particle size of 5-15 mu m;
(4) Chain extender: 0.3 to 10 parts of double-end low-hydrogen polysiloxane with the hydrogen content of 0.08 percent;
(5) Crosslinking agent: 1 part of terminal hydrogen silicone oil with the viscosity of 150cps and the hydrogen mass fraction of 0.1%;
(6) Crosslinking agent: 3 parts of hydrogen-containing silicone resin with the viscosity of 30500cps and the hydrogen mass fraction of 0.15%;
(7) Tackifier: 10 parts of a mixture of gamma-glycidoxypropyl diethoxysilane and vinyl triethoxysilane in a mass ratio of 2:1;
(8) And (3) a plasticizer: 10 parts of methyl phenyl silicone oil;
(9) 3 parts of pigment;
(10) Catalyst: platinum catalyst, platinum content 3000ppm 5 parts.
The preparation method of the single-component high-heat-conductivity silicon mud comprises the following steps:
01 Semi-finished product preparation: the silicone oil, the MQ silicone resin and the high heat conduction powder are weighed according to the proportion and added into a kneader, and the mixture is vacuumized and mixed uniformly at 150 ℃ to obtain a semi-finished product for standby;
02 Preparing a finished product: weighing the semi-finished product, the catalyst, the cross-linking agent and other materials according to the proportion, putting the materials into a kneader, keeping the temperature and the pressure (60 ℃ minus 0.095 Mpa), continuously stirring and reacting for 2 hours, and stopping stirring when the viscosity of the sizing material reaches the standard range;
03 Split charging: and (5) discharging and subpackaging when the temperature of the sizing material is reduced to room temperature.
Example 2
Example 2 was substantially identical in composition to example 1, except that the vinyl mass fraction of the MQ silicone resin was adjusted to 1%. (the vinyl content of the MQ silicone is 5 times that of vinyl-terminated polydimethylsiloxane).
Example 3
Example 3 is essentially identical to the composition of example 1, except that the vinyl-terminated polydimethylsiloxane is replaced by a vinyl-terminated polydimethylsiloxane having a viscosity of 100 mPas and a vinyl mass fraction of 0.4%. Accordingly, the vinyl mass fraction of the MQ silicone resin was adjusted to 1.2%. (the vinyl content of the MQ silicone is 3 times that of vinyl-terminated polydimethylsiloxane).
Example 4
Example 4 is essentially identical to the composition of example 1, except that the vinyl-terminated polydimethylsiloxane is replaced by a vinyl-terminated polydimethylsiloxane having a viscosity of 1000 mPas and a vinyl mass fraction of 0.1%. Accordingly, the vinyl mass fraction of the MQ silicone resin was adjusted to 1.5%. (the vinyl content of the MQ silicone is 15 times that of vinyl-terminated polydimethylsiloxane).
Comparative example 1
Comparative example 1 was substantially identical in composition to example 1, except that the vinyl mass fraction of the MQ silicone resin was adjusted to 0.2%. (the vinyl content of the MQ silicone is 1 times that of vinyl-terminated polydimethylsiloxane).
Comparative example 2
Comparative example 1 was substantially identical in composition to example 1, except that the vinyl mass fraction of the MQ silicone resin was adjusted to 4%. (the vinyl content of the MQ silicone is 20 times that of vinyl-terminated polydimethylsiloxane).
Various heat-conducting silica pastes were prepared according to the above example formulation and tested for basic properties and resistance to high temperature, oil permeation and cold and hot impact, and the results are shown in table 1.
TABLE 1
[ influence of MQ silicon resin M/Q ratio on single-component high-thermal-conductivity silicon mud ]
Example 5
Example 5 was substantially identical in composition to example 1, except that the M/Q ratio of the MQ silicone resin was adjusted to 1.4.
Example 6
Example 6 was substantially identical in composition to example 1, except that the M/Q ratio of the MQ silicone resin was adjusted to 1.6.
Comparative example 3
Comparative example 3 was substantially identical in composition to example 1, except that the M/Q ratio of MQ silicone resin was adjusted to 1.0.
Comparative example 4
Comparative example 4 was substantially identical in composition to example 1, except that the M/Q ratio of MQ silicone resin was adjusted to 2.0.
Various heat-conducting silica pastes were prepared according to the above example formulation and tested for basic properties and resistance to high temperature, oil permeation and cold and hot impact, and the results are shown in table 2.
TABLE 2
[ influence of MQ silicon resin Structure on single-component high-thermal-conductivity silicon mud ]
Example 7
Example 7 is essentially identical in composition to example 1, except that the vinyl MQ silicone resin is replaced with a low phenyl vinyl MQ silicone resin having a phenyl mole fraction of 5%.
Example 8
Example 8 is essentially identical in composition to example 1, except that the vinyl MQ silicone resin is replaced with a low phenyl vinyl MQ silicone resin having a phenyl mole fraction of 10%.
Example 9
Example 9 is essentially identical in composition to example 1, except that the vinyl MQ silicone resin is replaced with a low phenyl vinyl MQ silicone resin having a phenyl mole fraction of 15%.
Example 10
Example 10 is essentially identical in composition to example 1, except that the vinyl MQ silicone resin is replaced with an epoxy modified vinyl MQ silicone resin having an epoxy value of 0.03.
Example 11
Example 11 is essentially identical in composition to example 1, except that the vinyl MQ silicone resin is replaced with an epoxy modified vinyl MQ silicone resin having an epoxy value of 0.08.
Example 12
Example 12 is essentially the same composition as example 1 except that the vinyl MQ silicone resin is replaced with an epoxy modified vinyl MQ silicone resin having an epoxy value of 0.12.
Comparative example 5
Comparative example 5 is essentially identical in composition to example 1, except that the vinyl MQ silicone resin is replaced with a phenyl vinyl MQ silicone resin having a phenyl mole fraction of 20%.
Comparative example 6
Comparative example 6 is essentially identical in composition to example 1, except that the vinyl MQ silicone resin is replaced with an epoxy modified vinyl MQ silicone resin having an epoxy value of 0.2.
Various heat-conducting silica pastes were prepared according to the above example formulation and tested for basic properties and resistance to high temperature, oil permeation and cold and hot impact, and the results are shown in table 3.
TABLE 3 Table 3
[ influence of high-thermal-conductivity powder component on single-component high-thermal-conductivity silicon mud ]
Example 13
Example 13 was essentially identical to example 1 except that the high thermal conductivity powder was replaced.
In this embodiment, the high thermal conductive powder includes:
1000 parts of high alpha phase spherical alumina with alpha phase content more than 97 percent and spherical particle diameter of 5-15 mu m;
400 parts of high alpha-phase nano-scale alumina with the grain diameter of 20-200 nm;
600 parts of boron nitride with the particle size of 10-20 mu m.
Example 14
Example 14 is essentially identical to example 1 in composition, except that the high thermal conductivity powder is replaced.
In this embodiment, the high thermal conductive powder includes:
800 parts of high alpha phase spherical alumina with alpha phase content more than 97 percent and spherical particle diameter of 5-15 mu m;
1000 parts of high alpha-phase nano-scale alumina with the grain diameter of 20-200 nm;
200 parts of boron nitride with the particle size of 10-20 mu m.
Example 15
Example 15 is essentially identical to example 1 in composition, except that the high thermal conductivity powder was replaced.
In this embodiment, the high thermal conductive powder includes:
1200 parts of high alpha phase spherical alumina with alpha phase content more than 97 percent and spherical particle diameter of 5-15 mu m;
400 parts of high alpha-phase nano-scale alumina with the grain diameter of 20-200 nm;
400 parts of boron nitride with the particle size of 10-20 mu m.
Various heat conductive silica pastes were prepared according to the above example formulation and tested for basic properties and resistance to high temperature, oil permeation and cold and hot impact, and the results are shown in table 4.
TABLE 4 Table 4
[ influence of high-thermal-conductivity powder component on single-component high-thermal-conductivity silicon mud ]
Example 16
The single-component high-heat-conductivity silicon mud consists of the following components in parts by weight:
(1) Silicone oil: 100 parts of vinyl-terminated polydimethylsiloxane having a viscosity of 500 mPas and a vinyl mass fraction of 0.2%;
(2) MQ silicone resin: 10 parts of vinyl MQ silicone resin with the mass fraction of vinyl of 1.5% and the M/Q ratio of 1.5;
(3) High heat conduction powder: 750 parts of high alpha phase spherical alumina with alpha phase content more than 97% and spherical particle diameter of 5-15 mu m;
high heat conduction powder: 300 parts of high alpha-phase nano-scale alumina with the particle size of 20-200 nm;
high heat conduction powder: 450 parts of 10-20 mu m boron nitride;
(4) Chain extender: 10 parts of double-end low-hydrogen polysiloxane with the mass fraction of hydrogen of 0.05%;
(5) Crosslinking agent: 0.5 part of end-side hydrogen-containing silicone oil with the viscosity of 50cps and the hydrogen mass fraction of 0.15%;
(6) Crosslinking agent: 4.5 parts of hydrogen-containing silicone resin with the viscosity of 3500cps and the hydrogen mass fraction of 0.1%;
(7) Tackifier: 5 parts of a mixture of gamma-glycidoxypropyl diethoxysilane and vinyl triethoxysilane in a mass ratio of 1:1;
(8) And (3) a plasticizer: 5 parts of methyl phenyl silicone oil;
(9) 1 part of pigment;
(10) Catalyst: platinum catalyst, platinum content 3000ppm 1 part.
Example 17
The single-component high-heat-conductivity silicon mud consists of the following components in parts by weight:
(1) Silicone oil: 100 parts of vinyl-terminated polydimethylsiloxane having a viscosity of 500 mPas and a vinyl mass fraction of 0.2%;
(2) MQ silicone resin: 50 parts of vinyl MQ silicone resin with the mass fraction of vinyl being 1% and the M/Q ratio being 1.6;
(3) High heat conduction powder: 1300 parts of high alpha phase spherical alumina with alpha phase content more than 97% and spherical particle size of 5-15 mu m;
high heat conduction powder: 650 parts of high alpha-phase nano-scale alumina with the particle size of 20-200 nm;
high heat conduction powder: 650 parts of 10-20 mu m boron nitride;
(4) Chain extender: 0.3 parts of double-end low-hydrogen polysiloxane with the mass fraction of hydrogen being 0.1%;
(5) Crosslinking agent: 1 part of terminal hydrogen silicone oil with the viscosity of 200cps and the hydrogen mass fraction of 0.05%;
(6) Crosslinking agent: 3 parts of hydrogen-containing silicone resin with the viscosity of 2500cps and the hydrogen mass fraction of 0.2%;
(7) Tackifier: 20 parts of a mixture of gamma-glycidoxypropyl diethoxysilane and vinyl triethoxysilane in a mass ratio of 5:1;
(8) And (3) a plasticizer: 15 parts of methyl phenyl silicone oil;
(9) 5 parts of pigment;
(10) Catalyst: platinum catalyst, platinum content of 3000ppm 10 parts.
Various heat-conducting silica pastes were prepared according to the above example formulation and tested for basic properties and resistance to high temperature, oil permeation and cold and hot impact, and the results are shown in table 5.
TABLE 5
Comparative example 7
Comparative example 7 was identical in composition to example 1, except that the preparation method was changed.
The preparation method of the single-component high-heat-conductivity silicon mud comprises the following steps:
01 Semi-finished product preparation: adding all materials into a kneader, and uniformly mixing at room temperature to obtain a semi-finished product;
02 Preparing a finished product: the obtained semi-finished product is vacuumized (-0.095 Mpa) and solidified for 2 hours at 150 ℃;
03 Split charging: and (5) discharging and subpackaging when the temperature of the sizing material is reduced to room temperature.
The heat conductive silicon paste was prepared according to the above comparative example method and tested for basic properties and resistance to high temperature, oil permeation and cold and hot impact, and the results are shown in table 6.
TABLE 6
The specific embodiments described herein are offered by way of example only to illustrate the spirit of the invention. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Claims (10)
1. A single-component high-heat-conductivity silicon mud is characterized in that,
the single-component high-heat-conductivity silicon mud consists of 100 parts of silicone oil, 10-50 parts of MQ silicon resin and 1500-2600 parts of high-heat-conductivity powder according to weight;
the paint also comprises 0.3 to 10 parts of chain extender, 0.5 to 5 parts of cross-linking agent, 1 to 10 parts of catalyst, 5 to 20 parts of tackifier, 5 to 15 parts of plasticizer and 1 to 5 parts of pigment;
the silicone oil and the MQ silicone resin both contain vinyl; and, in addition, the method comprises the steps of,
the vinyl content of the MQ silicon resin is 2.5-15 times of that of the silicone oil;
the M/Q ratio of the MQ silicone resin is between 1.4 and 1.6.
2. The single-component high-thermal-conductivity silicon paste according to claim 1, wherein,
the silicone oil is at least two of monovinyl terminated hydroxyl silicone oil, vinyl terminated polydimethylsiloxane and polymethylphenyl-methylvinyl siloxane.
3. The single-component high-thermal-conductivity silicon paste according to claim 2, wherein,
the viscosity of the vinyl silicone oil is 100 mPas-1000 mPas, and the mass fraction of the vinyl is 0.1% -0.4%.
4. The single-component high-thermal-conductivity silicon paste according to claim 1, wherein,
the MQ silicon resin is at least one of low-phenyl vinyl MQ silicon resin, epoxy modified vinyl MQ silicon resin and vinyl MQ silicon resin;
the mass fraction of vinyl of the MQ silicon resin is between 1% and 1.5%.
5. The one-component high thermal conductivity silicon paste according to claim 4, wherein,
the phenyl mole fraction of the low-phenyl vinyl MQ silicon resin is below 5-15%;
the epoxy modified vinyl MQ silicon resin has an epoxy value of 0.03-0.12.
6. The single-component high-thermal-conductivity silicon paste according to claim 1, wherein,
the high heat conduction powder comprises spherical heat conduction particles accounting for 40% -60% of the total amount of the high heat conduction powder, nanoscale heat conduction powder accounting for 20% -50% of the total amount of the high heat conduction powder and sheet heat conduction materials accounting for 10% -30% of the total amount of the high heat conduction powder.
7. The single-component high thermal conductivity silicon paste according to claim 6, wherein,
the spherical heat-conducting particles are high alpha phase spherical alumina with alpha phase content more than 97% and spherical particle diameter of 5-15 mu m;
the nanoscale heat conduction powder comprises at least one of high alpha-phase nanoscale aluminum oxide and high-purity nanoscale zinc oxide with the particle size of 20-200 nm;
the sheet-shaped heat conducting material comprises at least one or a combination of a plurality of boron nitride, aluminum hydroxide and magnesium hydroxide with the particle size of 10-20 mu m.
8. A one-component high thermal conductivity silicon paste according to claim 1, 6 or 7, wherein,
the high-heat-conductivity powder is modified by the surface of octadecyl trimethoxy siloxane and vinyl triethoxy siloxane.
9. The single-component high thermal conductivity silicon paste according to claim 1, wherein,
the chain extender is double-end low-hydrogen polysiloxane, and the mass fraction of hydrogen is 0.05% -0.1%;
the cross-linking agent is a blend of terminal hydrogen silicone oil and hydrogen silicone resin, wherein the viscosity of the terminal hydrogen silicone oil is between 50cps and 200cps, the mass fraction of hydrogen is between 0.05% and 0.15%, the viscosity of the hydrogen silicone resin is about 2500-3500 cps, and the mass fraction of hydrogen is between 0.1% and 0.2%;
the tackifier is a blend of epoxy silane coupling agent and vinyl phenyl siloxane coupling agent, and the mass mixing ratio is 1:1-5:1;
the plasticizer is at least one of methyl phenyl silicone oil, methyl fluorine-containing silicone oil and long-chain alkyl grafted dimethyl silicone oil.
10. A process for preparing a one-component high thermal conductivity silicon paste according to any one of claims 1 to 9, characterized in that,
the preparation method comprises the following steps:
(1) Preparing a semi-finished product: the silicone oil, the silicone resin and the filler are weighed according to the proportion and added into a kneader, and the mixture is vacuumized and uniformly mixed for standby;
(2) Preparing a finished product: weighing the semi-finished product, the catalyst, the cross-linking agent and other materials according to the proportion, putting the materials into a kneader, keeping the temperature and the pressure, continuing stirring reaction, and stopping stirring when the viscosity of the sizing material reaches the standard range;
(3) And (5) subpackaging: and (5) discharging and subpackaging when the temperature of the sizing material is reduced to room temperature.
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