CN110862576B - Modified boron nitride particles and preparation method and application thereof - Google Patents
Modified boron nitride particles and preparation method and application thereof Download PDFInfo
- Publication number
- CN110862576B CN110862576B CN201911190641.7A CN201911190641A CN110862576B CN 110862576 B CN110862576 B CN 110862576B CN 201911190641 A CN201911190641 A CN 201911190641A CN 110862576 B CN110862576 B CN 110862576B
- Authority
- CN
- China
- Prior art keywords
- boron nitride
- nitride particles
- modified
- mass
- organic silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/10—Encapsulated ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
Abstract
The invention discloses a modified boron nitride particle and a preparation method thereof. The preparation method of the modified boron nitride particles comprises the following steps: (1) preparing raw materials, and carrying out hydroxylation treatment on 10-50 parts by mass of boron nitride particles to obtain hydroxylated boron nitride particles; (2) mixing the hydroxylated boron nitride particles and 0.1-5 parts by mass of hydrogen-containing siloxane for reaction till the reaction is complete to obtain preliminarily crosslinked boron nitride particles; (3) and mixing and reacting the preliminarily crosslinked boron nitride particles with 1-20 parts by mass of vinyl siloxane completely to obtain modified boron nitride particles. The modified boron nitride particles have the advantages of good compatibility with an organic silicon system and high addition amount in the organic silicon system, the preparation method is simple and easy to implement, environment-friendly and reliable, and the mechanical property and the heat conductivity of the silicon rubber can be improved when the modified boron nitride particles are used as a filler in the silicon rubber.
Description
Technical Field
The invention belongs to the field of polymer composite materials, and particularly relates to modified boron nitride particles and a preparation method thereof.
Background
With the development of new electronic appliances towards high integration, miniaturization and light weight, how to effectively dissipate heat becomes a key influencing factor limiting the service life and reliability of electronic components. The organic silicon rubber material has various excellent performances such as good environmental protection performance, weather resistance, high and low temperature resistance and the like, so that the organic silicon rubber material is widely applied to packaging protection of electronic and electric appliances. The traditional high-thermal-conductivity organic silicon rubber is mainly added with high-thermal-conductivity fillers such as aluminum oxide, magnesium oxide and zinc oxide to improve the thermal conductivity, but the addition of the substances has a limited improvement on the thermal conductivity of the organic silicon rubber, and also causes the problem of overlarge rubber density, and can not meet the requirement of the existing electronic components in the development direction of light weight gradually.
The boron nitride filler has various characteristics of low density, high heat conductivity, high insulation, high thermal stability and the like, and has become the key research direction of future high-heat-conductivity composite materials. However, the common boron nitride particles have poor compatibility with an organic silicon system due to the stability of B-N groups, and the application of the boron nitride particles in organic silicon rubber is greatly limited.
Disclosure of Invention
The technical problem to be solved by the present invention is to overcome the above mentioned disadvantages and drawbacks of the background art, and to provide a modified boron nitride particle, a method for preparing the same, and an application thereof.
In order to solve the technical problems, the technical scheme provided by the invention is as follows:
a modified boron nitride particle comprises a boron nitride particle and an organosilicon polymer layer coated on the surface of the boron nitride particle.
The design idea of the technical scheme is that the organic silicon polymer layer is coated on the surface of the boron nitride particles, the compatibility of the boron nitride particles in the organic silicon polymer system can be improved by utilizing the principle of similar compatibility, the addition amount of the boron nitride particles in the organic silicon rubber can be improved, and the effect of improving the thermal conductivity of the boron nitride particles to the organic silicon rubber is improved.
Preferably, the silicone polymer layer contains active groups in the molecular formula, and the active groups are one or two of hydrogen and vinyl. The idea of the design is that active groups contained in an organic silicon polymer molecular layer can participate in the reaction of an organic silicon system in the preparation process of organic silicon rubber, so that the crosslinking density of the polymer system is effectively improved, the organic system and inorganic filler in the rubber are tightly combined, and the mechanical property and the heat conductivity of the organic silicon rubber are improved.
Preferably, the silicone polymer layer is obtained by addition reaction of a hydrogen-containing siloxane and a vinyl siloxane. The idea of this design is that the hydrogen-containing siloxane and vinyl siloxane are selected as monomers, and the silicone polymer layer obtained by polymerization can contain a large amount of active groups of hydrogen and vinyl groups.
Preferably, the molar ratio of Si-H to Si-Vi in the silicone polymer layer is less than 0.75. The design idea is that the molar ratio of Si-H to Si-Vi is limited to be less than 0.75, so that the crosslinking degree of the organosilicon polymer layer is not too high, and the compatibility of the organosilicon polymer layer with an organosilicon resin system is influenced because the active groups of the polymer layer are obviously reduced and the hardness is obviously improved due to the excessively high crosslinking degree of the organosilicon polymer layer, so that the addition amount of the boron nitride particles in the organosilicon rubber can be increased when the crosslinking degree is controlled in a proper range.
Preferably, in the above aspect, the silicone polymer layer accounts for 1% to 10% by mass of the total mass of the modified boron nitride particles. The idea of the design is that if the quality of the organic silicon polymer layer is too high, the heat conductivity of the modified boron nitride particles can be obviously reduced, and if the quality of the organic silicon polymer layer is too low, the modification effect can be influenced, so that the compatibility of the heat-conducting filler and the organic silicon resin is influenced, therefore, the heat conductivity of the boron nitride particles and the compatibility of the boron nitride particles and siloxane can be simultaneously ensured by limiting the quality of the organic silicon polymer layer to 1-10% of the total quality of the modified boron nitride particles.
Preferably, the crystal form of the boron nitride particles is a hexagonal crystal form. The idea of the design is that due to the unique crystal structure, hexagonal crystal boron nitride particles are selected, and the optimal heat conducting property of the modified boron nitride particles can be ensured.
Preferably, the particle size of the boron nitride particles is 0.5 to 50 μm. The design idea is that the addition amount of the modified boron nitride particles in an organic silicon system can be increased and the heat-conducting property of the modified boron nitride particles can be improved by limiting the particle size of the boron nitride particles to be 0.5-50 mu m.
A preparation method of modified boron nitride particles comprises the following steps:
(1) preparing raw materials, and carrying out hydroxylation treatment on 10-50 parts by mass of boron nitride particles to obtain hydroxylated boron nitride particles;
(2) mixing the hydroxylated boron nitride particles and 0.1-5 parts by mass of hydrogen-containing siloxane for reaction till the reaction is complete to obtain preliminarily crosslinked boron nitride particles;
(3) and mixing and reacting the preliminarily crosslinked boron nitride particles with 1-20 parts by mass of vinyl siloxane completely to obtain modified boron nitride particles.
The design idea of the technical scheme is that because the B-N group on the surface of the boron nitride has stable chemical properties and is difficult to graft other active groups, the boron nitride particles are hydroxylated to activate the inert boron nitride surface, so that the hydrogen-containing siloxane can be conveniently introduced, and then the vinyl siloxane and the hydrogen-containing siloxane are used for further crosslinking reaction, so that the surface of the boron nitride particles is effectively coated with the organic silicon rubber layer, and the compatibility of the boron nitride particles and an organic silicon system is improved; the method is simple to operate, does not use volatile solvent, and is green and environment-friendly.
Preferably, the hydrogen-containing siloxane has a molecular formula of H-Si (CH)3)2-O-(Si(CH3)2-O)n-Si(CH3)2-H, 2 < n < 100. The idea of the design is that siloxane with hydrogen at both ends is selected to react with hydroxylated boron nitride particles, so that the siloxane can be effectively connected to the surfaces of the boron nitride particles, a certain active hydrogen-containing group is reserved for an organic silicon polymer layer, the next reaction is facilitated, the crosslinking density of a polymer system can be effectively improved, an organic system and an inorganic filler in rubber are tightly combined, and the mechanical property and the heat conductivity of organic silicon rubber are improved.
Preferably, the vinyl siloxane has a molecular formula of Vi-Si (CH3)2-O-(SiVi(CH3)-O)m-Si(CH3)2-Vi, 2 < m < 100. The idea of the design is that siloxane with high vinyl content is selected for further reaction, on one hand, the effective reaction of vinyl groups and hydrogen-containing groups is ensured, so that the surfaces of the vinyl groups and the hydrogen-containing groups are effectively coated with a silicon-hydrogen addition cross-linked product layer, the compatibility of modified boron nitride particles and an organic silicon system is effectively improved, and on the other hand, the compatibility of the modified boron nitride particles and the organic silicon system is effectively improvedThe modified boron nitride particles can retain effective vinyl active groups, can participate in the reaction of an organic silicon system, and effectively improve the crosslinking density of the polymer system, so that the mechanical property of the polymer system is improved, and the tightness between an organic system and an inorganic filler system in the polymer system can be effectively improved, so that the heat conductivity coefficient of the polymer system is further improved.
Preferably, in the above technical solution, a mixed solution of a platinum catalyst and an inhibitor is further added to the mixed system of the preliminarily crosslinked boron nitride particles and the vinyl siloxane in the step (3), and the mixed solution is 0.001 to 1 part by mass. The idea of the design is that the addition of the catalyst can reduce the reaction conditions, thereby simplifying the operation and reducing the cost; the inhibitor is added to control the reaction rate of hydrosilylation, a polymer layer is absent and is bonded to filler molecules due to the excessively high reaction speed, and the compound use of the catalyst and the inhibitor can ensure that the hydrosilylation reaction is controlled, so that a product with a good modification effect is obtained.
The modified boron nitride particles are used as fillers in the field of silicone rubber.
The design idea of the technical scheme is that the modified boron nitride particles are used as the filler in the field of silicon rubber, and the addition amount of boron nitride in the silicon rubber can be increased, so that the mechanical property and the heat conductivity of the silicon rubber are improved.
Compared with the prior art, the invention has the advantages that:
(1) the surface of the modified boron nitride particle is coated with the organic silicon polymer layer, so that the modified boron nitride particle has good compatibility with an organic silicon system, has excellent dispersion compatibility in an organic silicon resin system, and can effectively improve the addition amount of the boron nitride particle in the organic silicon system; and the surface has active groups (mainly containing hydrogen and vinyl groups) which can participate in the reaction of addition type organic silicon resin, thereby effectively improving the crosslinking density of the polymer and further improving the mechanical property and the heat-conducting property of the polymer.
(2) The preparation method of the modified boron nitride particles is simple and easy to implement, has the characteristics of environmental protection, does not use any volatile solvent, does not generate any toxic and harmful substances, can repeatedly and circularly utilize part of substances used in the process, and meets the requirements of energy conservation and emission reduction.
Detailed Description
In order to facilitate an understanding of the present invention, the present invention will be described more fully and in detail with reference to the preferred embodiments, but the scope of the present invention is not limited to the specific embodiments described below.
Unless otherwise defined, all terms of art used hereinafter have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the present invention.
Unless otherwise specifically stated, various raw materials, reagents, instruments, equipment and the like used in the present invention are commercially available or can be prepared by existing methods.
Example 1:
the modified boron nitride particle of the embodiment comprises a hexagonal boron nitride particle with the particle size of 30 μm and an organosilicon polymer layer coated on the surface of the boron nitride particle, wherein the organosilicon polymer contains hydrogen and vinyl groups, and the mass of the organosilicon polymer accounts for 10% of the total mass of the modified boron nitride particle.
The modified boron nitride particles of the present example were prepared mainly by the following method:
(1) preparing required raw materials, putting 500g of boron nitride particles into a beaker, adding excessive sodium hydroxide aqueous solution, dispersing at a high speed for 5h, then continuing to disperse for 2h by ultrasonic, washing with deionized water for three times, and drying to obtain hydroxylated boron nitride particles.
(2) 200g of hydroxylated boron nitride particles are placed in a four-neck flask, 10g of H-Si (CH) with molecular formula is added3)2-O-(Si(CH3)2-O)n-Si(CH3)2Hydrogen-containing siloxane of-H, n is 50, the mixture is even, the temperature is raised to 60 ℃, the mixture is stirred for 3 hours, then silane coupling agent KH560 is used for washing for many times, and preliminary cross-linked is obtained by suction filtrationBoron nitride particles.
(3) 200g of preliminarily crosslinked boron nitride particles were placed in a four-necked flask, and 20g of a powder having the molecular formula Vi-Si (CH3) was added thereto2-O-(SiVi(CH3)-O)m-Si(CH3)2And (3) taking the value of m of vinyl siloxane of-Vi as 50, uniformly mixing, heating to 80 ℃, dropwise adding a mixed solution of a platinum catalyst and an inhibitor (the platinum catalyst accounts for 1% of the total mass, and the inhibitor accounts for 0.5% of the total mass), keeping stirring at a high speed for 2h, washing for multiple times by using a siloxane coupling agent KH570, and drying to obtain the modified boron nitride particles.
Example 2:
the modified boron nitride particle of the embodiment comprises a hexagonal boron nitride particle with the particle size of 20 μm and an organosilicon polymer layer coated on the surface of the boron nitride particle, wherein the organosilicon polymer contains hydrogen and vinyl groups, and the mass of the organosilicon polymer accounts for 15% of the total mass of the modified boron nitride particle.
The modified boron nitride particles of the present example were prepared mainly by the following method:
(1) preparing required raw materials, putting 500g of boron nitride particles into a beaker, adding excessive sodium hydroxide aqueous solution, dispersing at a high speed for 5h, then continuing to disperse for 2h by ultrasonic, washing with deionized water for three times, and drying to obtain hydroxylated boron nitride particles.
(2) 200g of hydroxylated boron nitride particles are placed in a four-neck flask, 10g of H-Si (CH) with molecular formula is added3)2-O-(Si(CH3)2-O)n-Si(CH3)2And (3) hydrogen-containing siloxane of-H, wherein n is 75, the hydrogen-containing siloxane is uniformly mixed, the temperature is raised to 60 ℃, the mixture is stirred for 3 hours, then silane coupling agent KH560 is used for washing for many times, and the preliminarily crosslinked boron nitride particles are obtained through suction filtration.
(3) 200g of preliminarily crosslinked boron nitride particles were placed in a four-necked flask, and 20g of a powder having the molecular formula Vi-Si (CH3) was added thereto2-O-(SiVi(CH3)-O)m-Si(CH3)2Vinyl siloxane of-Vi, wherein m is 30, mixing, heating to 80 ℃, and dropwise adding a mixed solution of a platinum catalyst and an inhibitor (the platinum catalyst accounts for 1% of the total mass, and the inhibitor accounts for 0.5% of the total mass)And keeping stirring at a high speed for 2 hours, then washing for multiple times by using a siloxane coupling agent KH570, and drying to obtain the modified boron nitride particles.
Example 3:
the modified boron nitride particle of the embodiment comprises a hexagonal boron nitride particle with the particle size of 10 μm and an organosilicon polymer layer coated on the surface of the boron nitride particle, wherein the organosilicon polymer contains hydrogen and vinyl groups, and the mass of the organosilicon polymer accounts for 8% of the total mass of the modified boron nitride particle.
The modified boron nitride particles of the present example were prepared mainly by the following method:
(1) preparing required raw materials, putting 500g of boron nitride particles into a beaker, adding excessive sodium hydroxide aqueous solution, dispersing at a high speed for 5h, then continuing to disperse for 2h by ultrasonic, washing with deionized water for three times, and drying to obtain hydroxylated boron nitride particles.
(2) Putting 200g of hydroxylated boron nitride particles into a four-neck flask, adding 10g of hydrosiloxane with the molecular formula of H-Si (CH3)2-O- (Si (CH3)2-O) n-Si (CH3)2-H, wherein the value of n is 30, uniformly mixing, heating to 60 ℃, mixing and stirring for 3H, then washing for multiple times by using a silane coupling agent KH560, and performing suction filtration to obtain the preliminarily crosslinked boron nitride particles.
(3) Putting 200g of preliminarily crosslinked boron nitride particles into a four-neck flask, adding 20g of vinyl siloxane with the molecular formula of Vi-Si (CH3)2-O- (SiVi (CH3) -O) m-Si (CH3)2-Vi, wherein m is 80, uniformly mixing, heating to 80 ℃, dropwise adding a mixed solution of a platinum catalyst and an inhibitor (the platinum catalyst accounts for 1% of the total mass, and the inhibitor accounts for 0.5% of the total mass), keeping stirring at a high speed for 2h, and then washing and drying for multiple times by using a siloxane coupling agent KH570 to obtain the modified boron nitride particles.
The modified boron nitride particles prepared in example 1, example 2 and example 3 above were added to silicone rubber and subjected to compatibility and thermal conductivity tests, the results of which are shown in tables 1 and 2, wherein the comparative example is unmodified boron nitride particles. As can be seen from the data in Table 1, the modified boron nitride particles prepared by the invention have better compatibility with the silicone resin, the viscosity of the product can be ensured to be in a reasonable range after the particles are added into the silicone resin rubber, and the fluidity of the product is maintained, while the fluidity of the product is lost after the addition amount of the filler in comparative example 1 is increased to 20%, so that the modified boron nitride particles can improve the addition amount of boron nitride in a silicone rubber system. As can be seen from the data in Table 2, the modified boron nitride particles prepared by the method can obviously improve the content of the boron nitride particles in the silicone rubber, and greatly improve the heat-conducting property of the heat-conducting silicone rubber. The comparison results of the thermal conductivity coefficient and the density of the silicone rubber prepared from the modified boron nitride particles of the embodiment 3 and similar products are shown in table 3, and it can be seen that the modified boron nitride particles prepared by the invention can obviously improve the thermal conductivity of the silicone rubber, and the density is well controlled, so that the silicone rubber meets the requirements of high thermal conductivity and low density of novel electronic and electric appliances.
TABLE 1 results of compatibility test of modified boron nitride particles prepared in examples and comparative examples
| Item | Example 1 | Example 2 | Example 3 | Comparative example |
| Product traits | Grey solid powder | Grey solid powder | Grey solid powder | Grey solid powder |
| Quality of the fillerThe content is 15 percent | 2100 | 2300 | 3200 | 8200 |
| The mass content of the filler is 20 percent | 3650 | 3865 | 4300 | No fluidity |
| The mass content of the filler is 30 percent | 5460 | 5432 | 6040 | No fluidity |
| The mass content of the filler is 40 percent | 9400 | 8900 | 9750 | No fluidity |
| The mass content of the filler is 50 percent | 14000 | 14760 | 14800 | No fluidity |
Table 2 results of testing the effect of modified boron nitride particles prepared in each example on the thermal conductivity of silicone rubber
| Thermal conductivity w/(m.k) | Example 1 | Example 2 | Example 3 | Comparative example 1 |
| The mass content of the filler is 15 percent | 0.4532 | 0.4643 | 0.4367 | 0.4532 |
| The mass content of the filler is 20 percent | 0.5432 | 0.5132 | 0.5612 | - |
| The mass content of the filler is 30 percent | 0.7432 | 0.7345 | 0.7653 | - |
| The mass content of the filler is 40 percent | 1.5432 | 1.5864 | 1.5732 | - |
| The mass content of the filler is 50 percent | 2.012 | 2.143 | 2.124 |
Table 3 comparative results of thermal conductivity and density of silicone rubber prepared from modified boron nitride particles of example 3 with like products
Claims (8)
1. The modified boron nitride particle is characterized by comprising a boron nitride particle and an organic silicon polymer layer coated on the surface of the boron nitride particle, wherein the organic silicon polymer layer is obtained by addition reaction of a hydrogen-containing siloxane monomer and a vinyl siloxane monomer, the organic silicon polymer layer contains active groups, the active groups are hydrogen and vinyl, and the molar ratio of the active groups to the vinyl in the organic silicon polymer layer is less than 0.75.
2. The modified boron nitride particle of claim 1, wherein the silicone polymer layer comprises from 1% to 10% by mass of the total mass of the modified boron nitride particle.
3. The modified boron nitride particles of claim 1 or claim 2, wherein the crystalline form of the boron nitride particles is a hexagonal crystalline form.
4. A method of preparing the modified boron nitride particle of claim 1, comprising the steps of:
(1) preparing raw materials, and carrying out hydroxylation treatment on 10-50 parts by mass of boron nitride particles to obtain hydroxylated boron nitride particles;
(2) mixing the hydroxylated boron nitride particles and 0.1-5 parts by mass of hydrogen-containing siloxane for reaction till the reaction is complete to obtain preliminarily crosslinked boron nitride particles;
(3) and mixing and reacting the preliminarily crosslinked boron nitride particles with 1-20 parts by mass of vinyl siloxane completely to obtain modified boron nitride particles.
5. The method of claim 4, wherein the hydrosiloxane has the formula H-Si (CH)3)2-O-(Si(CH3)2-O)n-Si(CH3)2-H，2＜n＜100。
6. The process according to claim 4, wherein the vinylsiloxane has the formula Vi-Si (CH3)2-O-(SiVi(CH3)-O)m-Si(CH3)2-Vi，2＜m＜100。
7. The method according to any one of claims 4 to 6, wherein a mixed solution of a platinum catalyst and an inhibitor is further added to the mixed system of the preliminarily crosslinked boron nitride particles and the vinylsiloxane in step (3), and the mixed solution is added in an amount of 0.001 to 1 part by mass.
8. Use of the modified boron nitride particles according to any of claims 1 to 3 as a filler in the field of silicone rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911190641.7A CN110862576B (en) | 2019-11-28 | 2019-11-28 | Modified boron nitride particles and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911190641.7A CN110862576B (en) | 2019-11-28 | 2019-11-28 | Modified boron nitride particles and preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110862576A CN110862576A (en) | 2020-03-06 |
| CN110862576B true CN110862576B (en) | 2021-08-31 |
Family
ID=69657429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911190641.7A Active CN110862576B (en) | 2019-11-28 | 2019-11-28 | Modified boron nitride particles and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110862576B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112266618B (en) * | 2020-10-13 | 2022-06-10 | 无锡吉仓纳米材料科技有限公司 | Heat-conducting silica gel of composite heat-conducting network and preparation method thereof |
| CN114957834B (en) * | 2022-05-31 | 2023-08-18 | 马鞍山恒粤塑胶有限公司 | Plastic for washing liquid plastic packaging bottle and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101003696A (en) * | 2006-01-06 | 2007-07-25 | 通用电气公司 | Enhanced boron nitride composition and compositions made therewith |
| CN103102689A (en) * | 2011-11-15 | 2013-05-15 | 佛山市金戈消防材料有限公司 | Organic-silicon pouring sealant composition with high thermal conductivity and application thereof |
| WO2015065297A1 (en) * | 2013-11-01 | 2015-05-07 | Öncel Mehmet | Polymer obtained by the polimerization of hexagonal boron nitrite nano particles with tetrachloroethylene/tetrabromoethylene cross linking monomer |
| CN105461963A (en) * | 2014-09-11 | 2016-04-06 | 佛山市三水金戈新型材料有限公司 | Surface-organically-modified boron nitride powder, preparation method and applications thereof |
| CN107189348A (en) * | 2017-05-11 | 2017-09-22 | 华中科技大学 | A kind of epoxy resin heat conduction composite and its preparation and application |
| CN108659537A (en) * | 2018-04-12 | 2018-10-16 | 中科广化（重庆）新材料研究院有限公司 | A kind of carbon nanotube and boron nitride collaboration enhancing organosilicon Heat Conduction Material and its preparation method and application |
| CN110343291A (en) * | 2019-07-31 | 2019-10-18 | 武汉工程大学 | The preparation method and Water-borne inflation type refractory coating of modified hexagonal boron nitride fire retardant |
-
2019
- 2019-11-28 CN CN201911190641.7A patent/CN110862576B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101003696A (en) * | 2006-01-06 | 2007-07-25 | 通用电气公司 | Enhanced boron nitride composition and compositions made therewith |
| CN103102689A (en) * | 2011-11-15 | 2013-05-15 | 佛山市金戈消防材料有限公司 | Organic-silicon pouring sealant composition with high thermal conductivity and application thereof |
| WO2015065297A1 (en) * | 2013-11-01 | 2015-05-07 | Öncel Mehmet | Polymer obtained by the polimerization of hexagonal boron nitrite nano particles with tetrachloroethylene/tetrabromoethylene cross linking monomer |
| CN105461963A (en) * | 2014-09-11 | 2016-04-06 | 佛山市三水金戈新型材料有限公司 | Surface-organically-modified boron nitride powder, preparation method and applications thereof |
| CN107189348A (en) * | 2017-05-11 | 2017-09-22 | 华中科技大学 | A kind of epoxy resin heat conduction composite and its preparation and application |
| CN108659537A (en) * | 2018-04-12 | 2018-10-16 | 中科广化（重庆）新材料研究院有限公司 | A kind of carbon nanotube and boron nitride collaboration enhancing organosilicon Heat Conduction Material and its preparation method and application |
| CN110343291A (en) * | 2019-07-31 | 2019-10-18 | 武汉工程大学 | The preparation method and Water-borne inflation type refractory coating of modified hexagonal boron nitride fire retardant |
Non-Patent Citations (3)
| Title |
|---|
| Vinyl polysiloxane microencapsulated ammonium polyphosphate and its application in flame retardant polypropylene;Jianqiang Zhu,et al.;《Journal of Polymer Research》;20181231;正文第107页 * |
| 六方氮化硼纳米片的制备、功能化及其在导热聚合物中的应用;李晨;《中国优秀硕士学位论文全文数据库工程科技I辑》;20170115;B015-37 * |
| 立方氮化硼表面Stober法包覆硅氧纳米涂层及其表征;姜铸峰;《中国表面工程》;20170831;第30卷(第4期);正文第94-97页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110862576A (en) | 2020-03-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108410416B (en) | Encapsulating silica gel and preparation method and application thereof | |
| CN110105926B (en) | High-thermal-conductivity gel capable of being subjected to dispensing operation and preparation process thereof | |
| CN102234427B (en) | Silicone rubber composition and preparation method of silicone rubber | |
| CN110862576B (en) | Modified boron nitride particles and preparation method and application thereof | |
| CN113248928B (en) | Heat-conducting silica gel and preparation method and application thereof | |
| CN110724320B (en) | Heat-conducting rubber composite material and preparation method thereof | |
| KR20100079046A (en) | Heat-dissipating resin composition comprising siloxane compounds | |
| CN110387128B (en) | Self-adhesive single-component addition type silicone rubber and preparation method thereof | |
| CN114437546A (en) | High-thermal-conductivity organic silicon gel and preparation method thereof | |
| CN114874442A (en) | Si-H polymer, heat-conducting silica gel composition, and preparation method and application thereof | |
| CN112940674B (en) | High-temperature-resistant flame-retardant organic silicon pouring sealant and preparation method thereof | |
| CN114507506A (en) | Single-component addition type heat-conducting adhesive and preparation method and application thereof | |
| CN107641466B (en) | Organic silicon solvent-free impregnating varnish and preparation method thereof | |
| WO2022014129A1 (en) | Thermally conductive composition and cured product thereof | |
| WO2021109730A1 (en) | Two-component organosilicon potting sealant and application method therefor | |
| CN106928722B (en) | Silicone grease composition and preparation method thereof | |
| WO2023007894A1 (en) | Thermally conductive resin composition, cured product, heat transfer member and electronic device | |
| CN109627473B (en) | Preparation process of enhanced organic silicon composite sheet with surface tack removal function | |
| CN110484025B (en) | Method for improving settling resistance and dispersibility of silicon micro powder in organic silicon pouring sealant | |
| CN115216267B (en) | Environment-friendly high-adhesion high-thermal-conductivity organic silicon pouring sealant and preparation method and application thereof | |
| CN114874745B (en) | Bi-component high-thermal-conductivity electric-insulation acrylate structural adhesive composition | |
| CN114316892B (en) | Organic pouring sealant and preparation method and application thereof | |
| CN114045036B (en) | Heat-conducting gel composition and preparation method thereof | |
| JP2000038511A (en) | Silicone rubber composition for high-voltage electrical insulator | |
| CN116656315A (en) | Halogen-free flame-retardant heat-conducting organic silicon pouring sealant and preparation method and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |