CN116376292A - High-elastic heat-conducting silica gel material, high-elastic heat-conducting silica gel gasket and preparation method - Google Patents
High-elastic heat-conducting silica gel material, high-elastic heat-conducting silica gel gasket and preparation method Download PDFInfo
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 77
- 239000000741 silica gel Substances 0.000 title claims abstract description 74
- 229910002027 silica gel Inorganic materials 0.000 title claims abstract description 74
- 239000000463 material Substances 0.000 title claims abstract description 30
- 238000002360 preparation method Methods 0.000 title abstract description 12
- 239000000945 filler Substances 0.000 claims abstract description 62
- 239000002245 particle Substances 0.000 claims abstract description 46
- 229920002545 silicone oil Polymers 0.000 claims abstract description 39
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 27
- 239000004944 Liquid Silicone Rubber Substances 0.000 claims abstract description 22
- 239000003054 catalyst Substances 0.000 claims abstract description 19
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 15
- 239000011231 conductive filler Substances 0.000 claims abstract description 11
- 239000003112 inhibitor Substances 0.000 claims abstract description 10
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 18
- 239000001257 hydrogen Substances 0.000 claims description 18
- 229910052739 hydrogen Inorganic materials 0.000 claims description 18
- 238000004898 kneading Methods 0.000 claims description 15
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 13
- 239000011159 matrix material Substances 0.000 claims description 12
- 239000002994 raw material Substances 0.000 claims description 10
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 9
- 229920002554 vinyl polymer Polymers 0.000 claims description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 238000004132 cross linking Methods 0.000 claims description 5
- 229920001971 elastomer Polymers 0.000 claims description 5
- 238000003490 calendering Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- -1 alkynyl cyclohexyl alcohol Chemical compound 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052703 rhodium Inorganic materials 0.000 claims description 3
- 239000010948 rhodium Substances 0.000 claims description 3
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 6
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 8
- 239000004945 silicone rubber Substances 0.000 description 5
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- HIHIPCDUFKZOSL-UHFFFAOYSA-N ethenyl(methyl)silicon Chemical group C[Si]C=C HIHIPCDUFKZOSL-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012464 large buffer Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The embodiment of the application provides a high-elastic heat-conducting silica gel material, a high-elastic heat-conducting silica gel gasket and a preparation method, and relates to the field of heat-conducting materials. The high-elastic heat-conducting silica gel material comprises the following components in parts by weight: 10-20 parts of liquid silicone rubber; 20-40 parts of silicone oil; 3-6 parts of cross-linking agent; 800-1200 parts of heat conducting filler; 0.05 to 0.15 part of inhibitor; 2-4 parts of a catalyst; wherein the heat conductive filler comprises: large-particle-size filler with particle size ranging from 80 to 120 mu m, wherein the mass ratio of the large-particle-size filler is 35 to 45 percent; the medium-grain size filler with the grain size range of 5-79.9 mu m accounts for 45-60% by mass; the mass ratio of the small particle size filler with the particle size range of 1-4.99 μm is 3-10%. The high-elastic heat-conducting silica gel gasket has the characteristics of high rebound and high heat conduction, ensures the heat dissipation effect and ensures the normal service life of electronic devices.
Description
Technical Field
The application relates to the field of heat conduction materials, in particular to a high-elastic heat conduction silica gel material, a high-elastic heat conduction silica gel gasket and a preparation method.
Background
With the development of integration technology and the packing densification of microelectronics, the heat generated by electronic devices accumulates and increases rapidly. But with the rapid increase in heat generated by the electronic device, the performance and reliability of the electronic device may decrease. To solve this problem, a layer of thermally conductive interface material is typically provided on the heat exchange surface of the electronic device where the heat generation amount is large. The heat-conducting silica gel gasket is used as a good heat-conducting interface material, has certain flexibility, excellent insulativity, compressibility and natural surface viscosity, and can rapidly and effectively transfer heat generated by electronic components to a heat dissipation device. But there are differences in the performance of the different thermally conductive silicone gaskets.
The rebound ability of traditional heat conduction silica gel gasket in the present market is relatively poor, and long-term use can cause the phenomenon that hardness risees to appear stress relaxation, make appear the gap between fine electronic device of laminating originally, heat conduction silica gel gasket and the radiator, make the thermal resistance increase, thereby influence the radiating effect, reduce electronic device's normal life.
Disclosure of Invention
An aim of the embodiment of the application is to provide a high-elastic heat-conducting silica gel material, a high-elastic heat-conducting silica gel gasket and a preparation method, wherein the silica gel gasket has the characteristics of high rebound and high heat conduction, ensures the heat dissipation effect and ensures the normal service life of an electronic device.
In a first aspect, embodiments of the present application provide a high elastic thermal conductive silica gel material, which includes, in parts by weight:
wherein the heat conductive filler comprises:
large-particle-size filler with particle size ranging from 80 to 120 mu m, wherein the mass ratio of the large-particle-size filler is 35 to 45 percent;
the medium-grain size filler with the grain size range of 5-79.9 mu m accounts for 45-60% by mass;
the mass ratio of the small particle size filler with the particle size range of 1-4.99 μm is 3-10%.
In the technical scheme, the liquid silicone rubber and the silicone oil are specifically matched and crosslinked with the crosslinking agent to form the silica gel matrix of the high-elastic heat-conducting silica gel gasket, so that the high-rebound effect can be achieved, the electronic component and the high-elastic heat-conducting silica gel gasket, the high-elastic heat-conducting silica gel gasket and the radiator can keep good contact stress, the stress relaxation phenomenon is reduced, the interface gap caused by the rising of the long-term use hardness and the relaxation of the stress is reduced, and the heat conducting performance is improved.
The application adopts the specific collocation of the heat conduction filler and the silica gel matrix, can realize the low hardness and the low internal stress effect of the formed high-elastic heat conduction silica gel gasket, so that the electronic component and the high-elastic heat conduction silica gel gasket, the small internal stress between the high-elastic heat conduction silica gel gasket and the radiator, the large buffer is provided, and the damage to the electronic component is small.
The application adopts specific heat conduction filler combination, and the particle size gradient of heat conduction filler makes the filling more complete, realizes high heat conduction to can realize the high heat conductivility of high-elastic heat conduction silica gel gasket under the high rebound condition, satisfy the high heat conductivility of the big condition of calorific capacity. The application synthesizes high resilience and the high heat conduction demand of high elastic heat conduction silica gel gasket, controls the particle diameter gradient distribution of heat conduction filler, and little particle diameter filler in the heat conduction filler is great to the viscous degree influence of system, and the viscosity of excessive system increases, and the bigger the specific surface area of heat conduction filler, the bigger the oil absorption degree, and the specific surface area is too big, then is the scattered sand state, can't gather.
In one possible implementation, the mass ratio of the liquid silicone rubber to the silicone oil is 1:2-1:3;
optionally, the molecular weight of the liquid silicone rubber is 40-100 ten thousand g/mol;
optionally, the silicone oil comprises at least one of methyl silicone oil and vinyl silicone oil, the viscosity of the methyl silicone oil is 50-500 mPas, the viscosity of the vinyl silicone oil is 100-5000 mPas, and the vinyl content is 0.5% -5%.
In the technical scheme, the silicone rubber has longer molecular chain, larger viscosity, strong flexibility and strong elasticity of the cured (crosslinked) silicone matrix, but larger system viscosity, and more heat-conducting filler cannot be filled; the silicone oil has shorter molecular chain and smaller viscosity, and can be filled with more heat-conducting filler, but the cured (crosslinked) silicone matrix has strong rigidity and weak elasticity. The application adopts specific liquid silicone rubber and silicone oil, and the specific liquid silicone rubber and the silicone oil are matched in a certain proportion, so that a relatively high heat conductivity coefficient can be obtained under the condition of ensuring relatively strong rebound performance.
In one possible implementation, the mass of the cross-linking agent is 5% -15% of the total mass of the liquid silicone rubber and the silicone oil.
In the technical scheme, too large amount of the cross-linking agent can cause too high cross-linking degree, so that the hardness of the prepared heat-conducting silica gel gasket is too high, the original elasticity is lost, and the heat-conducting capacity of a product can be influenced in the actual use process; too small an amount of cross-linking agent can result in too low a degree of cross-linking, resulting in a material that is not formable and unusable.
In one possible implementation, the cross-linking agent comprises hydrogen-containing silicone oil, the viscosity of which is 100-500 mPa.s, and the active hydrogen content is 0.04% -0.4%.
In the technical scheme, the specific hydrogen-containing silicone oil is adopted as the cross-linking agent, so that the cross-linked network can be regulated and controlled to a certain extent. The heat-conducting silica gel gasket prepared by using the hydrogen-containing silicone oil with lower hydrogen content has stronger flexibility and poorer tensile strength; the heat-conducting silica gel gasket prepared by the hydrogen-containing silicone oil with higher hydrogen content has stronger rigidity and is easier to prepare a product with high hardness. The application uses the hydrogen-containing silicone oil with lower hydrogen content and the silicone rubber and silicone oil with high-low viscosity matched, can prepare the high-elastic heat-conducting silica gel gasket with good rebound performance and high heat conductivity coefficient, and meets the scene of high rebound and high heat-conducting performance requirements.
In one possible implementation, the medium-sized filler is divided into a first medium-sized filler having a particle size ranging from 20 to 79.9 μm and a second medium-sized filler having a particle size ranging from 5 to 19.99 μm, the mass ratio of the first medium-sized filler in the heat conductive filler being 5% to 15%, and the mass ratio of the second medium-sized filler being 40% to 45%.
In one possible implementation, the heat-conducting filler further comprises nano-scale alumina with the particle size of 100-500 nm, and the mass ratio of the nano-scale alumina in the heat-conducting filler is 1% -5%.
In the technical scheme, the nanoscale aluminum oxide improves the contact surface with the heat conduction object, and reduces the interface thermal resistance.
In one possible implementation, the color paste also comprises 2-4 parts of color paste according to parts by weight;
and/or the catalyst is one of a platinum catalyst, a rhodium catalyst and a palladium catalyst;
and/or the inhibitor is alkynyl cyclohexyl alcohol or alkynol compound.
In a second aspect, an embodiment of the present application provides a high-elastic heat-conducting silica gel gasket, which is obtained by mixing and crosslinking the high-elastic heat-conducting silica gel material provided in the first aspect.
In the technical scheme, the high-elastic heat-conducting silica gel gasket prepared by the method has higher rebound capability under the condition of ensuring high heat-conducting capability, so that electronic components and the high-elastic heat-conducting silica gel gasket, the high-elastic heat-conducting silica gel gasket and the radiator keep better contact stress, and the stress relaxation phenomenon is reduced, thereby reducing interface gaps generated by stress relaxation due to the increase of long-term use hardness, and improving the heat-conducting property. The high-elastic heat-conducting silica gel gasket is soft, has small stress in the bonding process with the electronic components, has good bonding between the electronic components and the high-elastic heat-conducting silica gel gasket and between the high-elastic heat-conducting silica gel gasket and the radiator, reduces gaps, reduces thermal resistance to the greatest extent, and improves heat conducting performance.
In a third aspect, an embodiment of the present application provides a method for preparing a high-elastic heat-conductive silica gel gasket, which includes the following steps of:
premixing liquid silicone rubber, silicone oil and a cross-linking agent to prepare a matrix rubber;
kneading the matrix adhesive and the heat conducting filler for the first time, adding the inhibitor and the catalyst in sequence after kneading uniformly, and kneading for the second time;
and (3) carrying out vacuumizing treatment, calendaring molding and baking on the raw materials which are uniformly kneaded for the second time in a vacuum environment.
In the technical scheme, the high-efficiency heat conduction is realized, and meanwhile, the production cost of the product is reduced.
In one possible implementation, the premixing time is 20-40 min; the time of one kneading is 30-60 min; the secondary kneading time is 40-80 min;
and/or the vacuum degree is-0.07 to-0.1 MPa when the vacuum is pumped, and the time is 30 to 60 minutes;
and/or baking temperature is 120-150 ℃ and baking time is 15-30 min.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below. The specific conditions are not noted in the examples and are carried out according to conventional conditions or conditions recommended by the manufacturer. The reagents or apparatus used were conventional products commercially available without the manufacturer's attention.
The following specifically describes a high-elastic heat-conducting silica gel material, a high-elastic heat-conducting silica gel gasket and a preparation method of the high-elastic heat-conducting silica gel material.
The embodiment of the application provides a high-elastic heat-conducting silica gel material, which comprises the following components in parts by weight: 10-20 parts of liquid silicone rubber; 20-40 parts of silicone oil; 3-6 parts of cross-linking agent; 800-1200 parts of heat conducting filler; 0.05 to 0.15 part of inhibitor; 2-4 parts of a catalyst; 2-4 parts of color paste.
In the embodiment of the application, the mass ratio of the liquid silicone rubber to the silicone oil is 1:2-1:3; the main chain of the silicone rubber is composed of silicon and oxygen atoms alternately, the silicon atoms are usually connected with two organic groups, the molecular weight of the liquid silicone rubber is 40 ten thousand to 100 ten thousand g/mol, and the molecular weight of the liquid silicone rubber is 60 ten thousand to 80 ten thousand g/mol; further alternatively 70 ten thousand g/mol. The silicone oil comprises at least one of methyl silicone oil and vinyl silicone oil, and the viscosity of the methyl silicone oil is 50-500 mPas, alternatively 50-150 mPas, and further alternatively 100 mPas; the viscosity of the vinyl silicone oil is 100-5000 mPas, and is optionally 850-1000 mPas, and the vinyl content is 0.5-5%, and is optionally 0.5-1%.
In the embodiment of the application, the mass of the cross-linking agent is 5-15% of the total mass of the liquid silicone rubber and the silicone oil. The cross-linking agent comprises hydrogen-containing silicone oil, the viscosity of the hydrogen-containing silicone oil is 100-500 mPa.s, and the active hydrogen content is 0.04% -0.4%, and optionally 0.07% -0.1%.
In the embodiment of the application, the heat conducting filler is one or more of boron nitride, magnesium oxide, aluminum hydroxide, zinc oxide, silicon dioxide, boron nitride, aluminum nitride and silicon carbide.
In terms of particle size distribution, the thermally conductive filler comprises:
large-particle-size filler with particle size ranging from 80 to 120 mu m, wherein the mass ratio of the large-particle-size filler is 35 to 45 percent;
a first medium-particle-size filler with the particle size range of 20-79.9 mu m, wherein the mass ratio of the first medium-particle-size filler is 5% -15%;
a second medium-size filler with the particle size range of 5-19.99 mu m, wherein the mass ratio of the second medium-size filler is 40-45%;
the mass ratio of the small particle size filler with the particle size range of 1-4.99 μm is 3-10%.
In some embodiments, the heat conductive filler further comprises nano-sized alumina with a particle size of 100-500 nm, and the mass ratio of the nano-sized alumina in the heat conductive filler is 1% -5%.
In the embodiment of the application, the catalyst is one of a platinum catalyst, a rhodium catalyst and a palladium catalyst.
An inhibitor (also called retarder) is a substance that acts to retard or reduce the rate of chemical reactions, acting the same as a negative catalyst. It cannot stop the polymerization reaction but slow down the polymerization reaction. Substances by which chemical reactions are inhibited or moderated. In the embodiment of the application, the inhibitor is alkynyl cyclohexyl alcohol or alkynol compounds.
The embodiment of the application provides a high-elastic heat-conducting silica gel gasket, which is obtained by mixing and crosslinking the high-elastic heat-conducting silica gel material.
In addition, the embodiment of the application provides a preparation method of the high-elastic heat-conducting silica gel gasket, which comprises the following steps of adopting the high-elastic heat-conducting silica gel material:
s1, premixing liquid silicone rubber, silicone oil and a cross-linking agent for 20-40 min to obtain the matrix rubber.
S2, kneading the matrix glue prepared in the step S1 and the heat-conducting filler for 30-60 min.
S3, adding the inhibitor, the catalyst and the color paste in sequence after the primary kneading is uniform, and carrying out secondary kneading for 40-80 min.
S4, carrying out vacuumizing treatment on the raw materials which are uniformly kneaded for the second time in a vacuum environment, wherein the vacuum degree is-0.07 to-0.1 MPa during vacuumizing, and the time is 30-60 min.
And S5, carrying out calendaring molding on the vacuumized raw material.
And S6, baking after calendaring, wherein the baking temperature is 120-150 ℃ and the baking time is 15-30 min, so as to obtain the large-sized high-resilience high-heat-conductivity silica gel heat-conducting gasket.
S7, cutting the large high-resilience high-heat-conductivity silica gel heat-conductivity gasket into a specified size.
The features and capabilities of the present application are described in further detail below in connection with the examples.
Examples 1 to 4
The embodiment provides a silica gel gasket, and the preparation process is as follows:
(1) Premixing liquid silicone rubber, silicone oil and hydrogen-containing silicone oil in a 2000rpm stirrer for 20min to obtain matrix rubber, putting the obtained matrix rubber and the heat-conducting filler into a kneader for kneading for 45min, and sequentially adding an alkynol inhibitor, a platinum catalyst and color paste for kneading for 60min.
Wherein the liquid silicone rubber is methyl vinyl silicone rubber with a molecular weight of 700000g/mol; the silicone oil is methyl silicone oil, and the viscosity is 100 mPas; the viscosity of the hydrogen-containing silicone oil is 200 mPas, and the hydrogen content is 0.06%;
the heat conducting filler is micron-sized alumina particles, micron-sized aluminum nitride particles and nanometer-sized alumina particles, and the particle size ratio is as follows:
large particle size filler: 80-120 mu m alumina particles, the mass ratio is 20%;
80-120 mu m aluminum nitride particles, wherein the mass ratio is 20%;
first medium particle size filler: alumina particles with the mass ratio of between 20 and 79.9 mu m is 10 percent;
and a second medium particle size filler: alumina particles with the mass ratio of 5-19.9 mu m is 45%;
small particle size filler: alumina particles with the mass ratio of 1-4.99 mu m is 4%;
particle diameter filler: alumina particles with the mass ratio of 0.1-0.5 mu m are 1%.
(2) And (3) placing the kneaded raw materials into a vacuum environment of-0.1 MPa for 40min, carrying out vacuumizing treatment, putting the vacuumized raw materials into a calender for molding, and then, putting the raw materials into a baking oven at 120 ℃ for baking and curing for 20 min.
(3) And cutting the mixture into specified specifications after the mixture is completely solidified to obtain the high-elastic heat-conducting silica gel gasket.
The proportions of the raw materials are shown in Table 1.
Table 1: raw material ratio (unit: g) in examples 1 to 3
Comparative example 1
According to example 1 of CN113563721a, a silica gel material is used, which is formed from a liquid silicone rubber and a filler having a different particle size.
Comparative example 2
According to example 1 of CN109777107a, a silica gel gasket formed from a raw material such as filler, methyl silicone oil, methyl vinyl silicone rubber, etc. was used.
Comparative example 3
Which differs from the preparation method of example 1 in that: the mass ratio of other heat conductive fillers is correspondingly changed without adding large-particle-size fillers, and the rest is the same as in the embodiment 1.
Comparative example 4
Which differs from the preparation method of example 1 in that: the first medium-diameter filler and the second medium-diameter filler are not added, the mass ratio of other heat conducting fillers is correspondingly changed, and the rest is the same as in the embodiment 1.
Comparative example 5
Which differs from the preparation method of example 1 in that: the mass ratio of other heat conductive fillers is correspondingly changed without adding small-particle-size fillers, and the rest is the same as in the embodiment 1.
Performance tests were performed on the silica gel gaskets prepared in examples 1 to 3 and comparative examples 1 to 2, as follows:
thermal conductivity: thermal conductivity was tested according to ASTM D5470 standard;
mechanical properties: tensile strength was tested according to ASTM D412;
compression resilience: rebound according to ASTM D575-91;
flame retardancy: flame retardant performance was tested according to UL 94 standard;
the test results are shown in Table 2.
Table 2: examples 1 to 3 Performance test data
As can be seen from Table 1, examples 1 to 4 adopt the high-elastic heat-conducting silica gel material of the present application, and especially examples 1 to 3 control the mass ratio of the liquid silicone rubber to the silicone oil to be 1:2 to 1:3, and the prepared silica gel gasket has the characteristics of high rebound and high heat conduction.
While the comparative examples 1-2 were made of other silica gel gaskets, the rebound and heat conduction effects were poor; comparative examples 3 to 5 are compositions using the heat conductive filler of the present application, and cannot have the characteristics of high rebound and high heat conductivity.
To sum up, the high-elastic heat-conducting silica gel material, the high-elastic heat-conducting silica gel gasket and the preparation method of the high-elastic heat-conducting silica gel material, the silica gel gasket have the characteristics of high rebound and high heat conduction, the heat dissipation effect is guaranteed, and the normal service life of an electronic device is guaranteed.
The foregoing is merely exemplary embodiments of the present application and is not intended to limit the scope of the present application, and various modifications and variations may be suggested to one skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims (10)
1. The high-elastic heat-conducting silica gel material is characterized by comprising the following components in parts by weight:
wherein the heat conductive filler comprises:
large-particle-size filler with particle size ranging from 80 to 120 mu m, wherein the mass ratio of the large-particle-size filler is 35 to 45 percent;
the medium-grain size filler with the grain size range of 5-79.9 mu m accounts for 45-60% by mass;
the mass ratio of the small particle size filler with the particle size range of 1-4.99 μm is 3-10%.
2. The high-elastic heat-conducting silica gel material according to claim 1, wherein the mass ratio of the liquid silicone rubber to the silicone oil is 1:2-1:3;
optionally, the molecular weight of the liquid silicone rubber is 40-100 ten thousand g/mol;
optionally, the silicone oil comprises at least one of methyl silicone oil and vinyl silicone oil, the viscosity of the methyl silicone oil is 50-500 mPas, the viscosity of the vinyl silicone oil is 100-5000 mPas, and the vinyl content is 0.5-5%.
3. The high-elastic heat-conducting silica gel material according to claim 1, wherein the mass of the cross-linking agent is 5% -15% of the total mass of the liquid silicone rubber and the silicone oil.
4. The high-elastic heat-conducting silica gel material according to claim 1, wherein the cross-linking agent comprises hydrogen-containing silicone oil, the viscosity of the hydrogen-containing silicone oil is 100-500 mPa-s, and the active hydrogen content is 0.04% -0.4%.
5. The high elastic heat conductive silica gel material according to claim 1, wherein the medium particle size filler is divided into a first medium particle size filler with a particle size range of 20-79.9 μm and a second medium particle size filler with a particle size range of 5-19.99 μm, wherein the mass ratio of the first medium particle size filler in the heat conductive filler is 5% -15% and the mass ratio of the second medium particle size filler is 40% -45%.
6. The high-elastic heat-conducting silica gel material according to claim 1, wherein the heat-conducting filler further comprises nano-scale alumina with a particle size of 100-500 nm, and the mass ratio of the nano-scale alumina in the heat-conducting filler is 1% -5%.
7. The high-elastic heat-conducting silica gel material according to claim 1, which is characterized by further comprising 2-4 parts of color paste in parts by weight;
and/or the catalyst is one of a platinum catalyst, a rhodium catalyst and a palladium catalyst;
and/or the inhibitor is alkynyl cyclohexyl alcohol or alkynol compound.
8. A high-elastic heat-conducting silica gel gasket, which is characterized in that the gasket is obtained by mixing and crosslinking the high-elastic heat-conducting silica gel material according to any one of claims 1 to 7.
9. A method for preparing a high-elastic heat-conducting silica gel gasket, which is characterized by comprising the following steps of adopting the high-elastic heat-conducting silica gel material according to any one of claims 1 to 7:
premixing liquid silicone rubber, silicone oil and a cross-linking agent to prepare a matrix rubber;
kneading the matrix glue and the heat conducting filler for the first time, adding an inhibitor and a catalyst in sequence after kneading uniformly, and kneading for the second time;
and (3) carrying out vacuumizing treatment, calendaring molding and baking on the raw materials which are uniformly kneaded for the second time in a vacuum environment.
10. The method for preparing the high-elastic heat-conducting silica gel gasket according to claim 9, wherein the premixing time is 20-40 min; the time of one kneading is 30-60 min; the secondary kneading time is 40-80 min;
and/or the vacuum degree is-0.07 to-0.1 MPa when the vacuum is pumped, and the time is 30 to 60 minutes;
and/or baking temperature is 120-150 ℃ and baking time is 15-30 min.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117004232A (en) * | 2023-08-24 | 2023-11-07 | 常州宏巨电子科技有限公司 | Low-volatility high-resilience double-component heat conduction gasket and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117004232A (en) * | 2023-08-24 | 2023-11-07 | 常州宏巨电子科技有限公司 | Low-volatility high-resilience double-component heat conduction gasket and preparation method thereof |
| CN117004232B (en) * | 2023-08-24 | 2024-04-05 | 常州宏巨电子科技有限公司 | Low-volatility high-resilience double-component heat conduction gasket and preparation method thereof |
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