CN116552069A - Preparation method for improving tensile strength of PTFE copper-clad plate material - Google Patents
Preparation method for improving tensile strength of PTFE copper-clad plate material Download PDFInfo
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- 239000004810 polytetrafluoroethylene Substances 0.000 title claims abstract description 87
- 229920001343 polytetrafluoroethylene Polymers 0.000 title claims abstract description 87
- 239000000463 material Substances 0.000 title claims abstract description 45
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000000945 filler Substances 0.000 claims abstract description 40
- 239000000839 emulsion Substances 0.000 claims abstract description 35
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 6
- 239000000843 powder Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 16
- 238000001125 extrusion Methods 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 238000013329 compounding Methods 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 239000007822 coupling agent Substances 0.000 claims description 6
- 238000005189 flocculation Methods 0.000 claims description 6
- 230000016615 flocculation Effects 0.000 claims description 6
- 238000007731 hot pressing Methods 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 4
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- 238000003825 pressing Methods 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 239000012298 atmosphere Substances 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 2
- 239000000919 ceramic Substances 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 239000004408 titanium dioxide Substances 0.000 claims 1
- 238000003490 calendering Methods 0.000 abstract description 11
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000004891 communication Methods 0.000 abstract description 2
- 238000012986 modification Methods 0.000 abstract description 2
- 230000004048 modification Effects 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 9
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- 230000007547 defect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 238000005266 casting Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 150000003384 small molecules Chemical class 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 238000011161 development Methods 0.000 description 1
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- 230000003311 flocculating effect Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
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- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08J2327/18—Homopolymers or copolymers of tetrafluoroethylene
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
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Abstract
The invention relates to the technical field of high-frequency copper-clad plates for microwave circuits, in particular to a preparation method for improving the tensile strength of a PTFE copper-clad plate material, which does not adopt mature and mainstream filler powder surface organic modification treatment technologies such as silane coupling agents, adds modified filler specified by the invention to PTFE emulsion, combines folding and rotation at specific time in calendaring, and the prepared PTFE copper-clad plate material has high filler ratio, small mechanical property difference in X, Y direction and obviously improved tensile strength compared with continuous calendaring, and can be used for preparing devices such as high-precision antennas, LNB circuit boards, phase shifters, power dividers, wearable antennas, radars, vehicle-mounted antennas and the like in wireless communication.
Description
Technical Field
The invention relates to the technical field of high-frequency copper-clad plates for microwave circuits, in particular to a preparation method for improving the tensile strength of PTFE copper-clad plate materials.
Background
PTFE materials are tried to be applied to the development of high-end copper-clad plate materials because of extremely low dielectric constant and dielectric loss, but the PTFE materials have the problems of poor compatibility, poor mechanical properties of materials and the like when being used in combination with high-proportion inorganic fillers due to low molecular polarity and low surface tension. At present, one of the most common manufacturing methods of PTFE copper-clad plate materials is to mix PTFE suspension emulsion with filler, small molecule auxiliary agent and the like to prepare glue solution, and then dip the glue solution into glass fiber cloth to obtain prepregs with different thickness specifications, which is also called a wet process. However, the PTFE copper-clad plate material prepared by the wet process has the defect that the thermal expansion coefficient in the Z-axis direction is obviously increased compared with that in the X-axis direction and the Y-axis direction. In order to overcome the material defect caused by the wet process, the dry process provides a new way for people to develop the high-performance copper-clad plate material. The conventional polymer material forming technologies such as compression forming, injection forming, extrusion forming, calendaring forming and the like have certain applicability.
In the forming technology, the calendaring forming process has the advantages of high production continuity, high production capacity, controllable material thickness, good uniformity of material characteristics and the like, and meets the production and manufacturing requirements better. In practice, the calendaring molding relies on a kind of key equipment such as a calendaring machine, a strong shearing force is caused by the rotary motion among rollers, and the design of gaps among the rollers is matched, so that materials are extruded and sheared for many times, and the materials are subjected to extrusion and extension effects, so that the materials become plates, sheets and film products with certain thickness and width and smooth surfaces. However, the PTFE sheet manufactured by conventional continuous calendaring has the performance defect of large difference in X, Y-axis mechanical properties, so that it is very challenging to develop a PTFE material with uniform and stable properties in all directions.
Disclosure of Invention
Aiming at the defects in the background technology, the invention provides the preparation method for improving the tensile strength of the PTFE copper-clad plate material, which solves the defects that PTFE plates prepared by a single wet process and calendaring process have uneven mechanical properties.
The preparation method for improving the tensile strength of the PTFE copper-clad plate material is characterized by comprising the following steps of:
s1, adding modified filler into PTFE emulsion, and uniformly stirring to prepare PTFE emulsion;
s2, adding a demulsifier into the PTFE emulsion of the S1 to form PTFE flocculation groups;
s3, flocculating and pressing the PTFE of the S2 into a sheet with the thickness of 1+/-0.05 mm;
s4, compounding the sheet material of the S3 and copper foil into a copper-clad plate material by hot pressing at high temperature and high pressure.
Preferably, the mass ratio of modified filler to PTFE emulsion in S1 is 1:1.
Preferably, in S1, the modified filler is prepared by the following method:
s1.1, pre-sintering the pretreated filler in a special atmosphere to obtain a modified filler A;
s1.2, uniformly mixing the powdery filler with a silane coupling agent solution, and drying to obtain a pretreated filler B;
wherein the addition amount of the coupling agent is 1-3% of the total mass of the mixture.
Preferably, the coupling agent is one or more of silane coupling agent and titanate coupling agent.
Preferably, the powdery filler is crushed silica.
Preferably, the PTFE emulsion has a solids content of 60%.
The pre-selected adding amount of the demulsifier is 20-30% wt of PTFE emulsion, and the demulsifier is monohydric alcohol.
Preferably, S3 is specifically: and pressing the PTFE floccule into a sheet by a calender, wherein the setting of the gaps of the calender is 5mm, 3mm, 2mm and 1mm in sequence, and the rotation speed ratio of the roller is 1:1.
Preferably, the obtained sheet with the thickness of about 3mm is folded into a sheet with the thickness of 6mm, and the sheet is fed into a gap with the thickness of 3mm for extrusion again, and then enters a gap with the thickness of 2mm for extrusion; folding the obtained sheet with the thickness of about 2mm into a sheet with the thickness of 4mm, rotating by 90 degrees, feeding into a gap with the thickness of 2mm, extruding again, and feeding into a gap with the thickness of 1mm for extruding; the obtained 1mm thick working sheet was repeatedly rotated 90 °, and pressed by different rolls to obtain a green sheet having a thickness of 1.+ -. 0.05 mm.
The beneficial effects are that: compared with the existing technology of modifying inorganic powder by using a silane coupling agent to finish the organic modification of the surface of the powder, the invention has simple, stable and good reproducibility. The PTFE copper-clad plate material prepared by the invention has small mechanical property difference in the X, Y direction and improved tensile strength compared with continuous calendaring, and can be used for preparing devices such as high-precision antennas, LNB circuit boards, phase shifters, power dividers, wearable antennas, radars, vehicle-mounted antennas and the like in wireless communication.
Detailed Description
The present invention will be described in detail below with reference to the accompanying tables and embodiments in order for those skilled in the art to better understand the technical aspects of the present invention.
Example 1 preparation of PTFE copper-clad plate Material
S1, uniformly mixing silicon dioxide powder and KH550 solution to obtain a pretreatment filler; wherein the adding amount of KH550 is 1.5% of the total mass of the mixture; drying the pretreated filler at 120 ℃ to obtain modified filler; adding modified filler into PTFE emulsion with solid content of 60%, and stirring uniformly to prepare PTFE emulsion, wherein the mass ratio of the modified filler to the PTFE emulsion is 1:1, and the mass fraction of the modified filler and the PTFE emulsion is 62.5wt% after deducting the volatile components of small molecules;
s2, adding a demulsifier into the PTFE emulsion of the S1 to form PTFE flocculation groups, wherein the addition amount of the demulsifier is 2% wt of the PTFE emulsion;
s3, setting gaps of the calender to be 5mm, 3mm, 2mm and 1mm in sequence, wherein the rotation speed ratio of the roller is 1:1; feeding the PTFE flocs of the S2 into a calender, folding the sheet into a sheet with the thickness of 6mm when the sheet is pressed into the thickness of 3mm, feeding the sheet into a gap with the thickness of 3mm for re-extrusion, and feeding the sheet into a gap with the thickness of 2mm for extrusion; folding the obtained sheet with the thickness of about 2mm into a sheet with the thickness of 4mm, rotating by 90 degrees, feeding into a gap with the thickness of 2mm, extruding again, and feeding into a gap with the thickness of 1mm for extruding; continuously rotating the obtained sheet with the thickness of about 1mm clockwise by 90 degrees, and extruding by using different rollers to obtain PTFE green sheets with the thickness of 1+/-0.05 mm;
s4, carrying out hot-pressing compounding on the sheet rolled in the S3 and a high-ductility rolled copper foil (HTE) with the thickness of 32 mu m by adopting a laminating machine in a high-temperature high-pressure vacuum environment according to a specific procedure to prepare a PTFE copper-clad plate material; the maximum pressure set by the laminating machine is 7.5MPa, the temperature is 350-400 ℃, the vacuum degree is less than-0.07 MPa, the high-temperature heat preservation time is 60-180 minutes, half pressure is started when the temperature rises to 310-325 ℃, full pressure is started when the temperature reaches high-temperature heat preservation, and the half pressure is maintained when the temperature is reduced to below 200 ℃.
Example 2 preparation of PTFE copper-clad plate Material
S1, uniformly mixing silicon dioxide powder and KH570 solution to obtain a pretreatment filler; wherein the adding amount of KH550 is 3% of the total mass of the mixture; drying the pretreated filler at 120 ℃ to obtain modified filler; adding modified filler into PTFE emulsion with solid content of 60%, and uniformly stirring to prepare PTFE emulsion, wherein the mass ratio of the modified filler to the PTFE emulsion is 1:1;
s2, adding a demulsifier into the PTFE emulsion of the S1 to form PTFE flocculation groups, wherein the addition amount of the demulsifier is 30% wt of the PTFE emulsion;
s3, setting gaps of the calender to be 5mm, 3mm, 2mm and 1mm in sequence, wherein the rotation speed ratio of the roller is 1:1; feeding the PTFE flocs of the S2 into a calender, folding the sheet into a sheet with the thickness of 6mm when the sheet is pressed into the thickness of 3mm, feeding the sheet into a gap with the thickness of 3mm for re-extrusion, and feeding the sheet into a gap with the thickness of 2mm for extrusion; folding the obtained sheet with the thickness of about 2mm into a sheet with the thickness of 4mm, rotating by 90 degrees, feeding into a gap with the thickness of 2mm, extruding again, and feeding into a gap with the thickness of 1mm for extruding; continuously rotating the obtained sheet with the thickness of about 1mm clockwise by 90 degrees, and extruding by using different rollers to obtain PTFE green sheets with the thickness of 1+/-0.05 mm;
s4, carrying out hot-pressing compounding on the sheet rolled in the S3 and a high-ductility rolled copper foil (HTE) with the thickness of 32 mu m by adopting a laminating machine in a high-temperature high-pressure vacuum environment according to a specific procedure to prepare a PTFE copper-clad plate material; the maximum pressure set by the laminating machine is 7.5MPa, the temperature is 350-400 ℃, the vacuum degree is-0.07 MPa, the high-temperature heat preservation time is 60-180 minutes, half pressure is started when the temperature rises to 310-325 ℃, full pressure is started when the temperature reaches high-temperature heat preservation, and half pressure is maintained when the temperature is reduced to below 200 ℃.
Example 3 preparation of PTFE copper-clad plate Material
S1, pre-sintering silicon dioxide powder at 300 ℃ in a nitrogen atmosphere to obtain modified filler; adding modified filler into PTFE emulsion with solid content of 60%, and uniformly stirring to prepare PTFE emulsion, wherein the mass ratio of the modified filler to the PTFE emulsion is 1:1;
s2, adding a demulsifier into the PTFE emulsion of the S1 to form PTFE flocculation groups, wherein the addition amount of the demulsifier is 30% wt of the PTFE emulsion;
s3, setting gaps of the calender to be 5mm, 3mm, 2mm and 1mm in sequence, wherein the rotation speed ratio of the roller is 1:1; feeding the PTFE flocs of the S2 into a calender, folding the sheet into a sheet with the thickness of 6mm when the sheet is pressed into the thickness of 3mm, feeding the sheet into a gap with the thickness of 3mm for re-extrusion, and feeding the sheet into a gap with the thickness of 2mm for extrusion; folding the obtained sheet with the thickness of about 2mm into a sheet with the thickness of 4mm, rotating by 90 degrees, feeding into a gap with the thickness of 2mm, extruding again, and feeding into a gap with the thickness of 1mm for extruding; continuously rotating the obtained sheet with the thickness of about 1mm clockwise by 90 degrees, and extruding by using different rollers to obtain PTFE green sheets with the thickness of 1+/-0.05 mm;
s4, carrying out hot-pressing compounding on the sheet rolled in the S3 and a high-ductility rolled copper foil (HTE) with the thickness of 32 mu m by adopting a laminating machine in a high-temperature high-pressure vacuum environment according to a specific procedure to prepare a PTFE copper-clad plate material; the maximum pressure set by the laminating machine is 7.5MPa, the temperature is 350-400 ℃, the vacuum degree is less than-0.07 MPa, the high-temperature heat preservation time is 60-180 minutes, half pressure is started when the temperature rises to 310-325 ℃, full pressure is started when the temperature reaches high-temperature heat preservation, and the half pressure is maintained when the temperature is reduced to below 200 ℃.
Example 4 preparation of PTFE copper-clad plate Material
S1, pre-sintering silicon dioxide powder at 600 ℃ in a nitrogen atmosphere to obtain modified filler; adding modified filler into PTFE emulsion with solid content of 60%, and uniformly stirring to prepare PTFE emulsion, wherein the mass ratio of the modified filler to the PTFE emulsion is 1:1;
s2, adding a demulsifier into the PTFE emulsion of the S1 to form PTFE flocculation groups, wherein the addition amount of the demulsifier is 30% wt of the PTFE emulsion;
s3, setting gaps of the calender to be 5mm, 3mm, 2mm and 1mm in sequence, wherein the rotation speed ratio of the roller is 1:1; feeding the PTFE flocs of the S2 into a calender, folding the sheet into a sheet with the thickness of 6mm when the sheet is pressed into the thickness of 3mm, feeding the sheet into a gap with the thickness of 3mm for re-extrusion, and feeding the sheet into a gap with the thickness of 2mm for extrusion; folding the obtained sheet with the thickness of about 2mm into a sheet with the thickness of 4mm, rotating by 90 degrees, feeding into a gap with the thickness of 2mm, extruding again, and feeding into a gap with the thickness of 1mm for extruding; continuously rotating the obtained sheet with the thickness of about 1mm clockwise by 90 degrees, and extruding by using different rollers to obtain PTFE green sheets with the thickness of 1+/-0.05 mm;
s4, carrying out hot-pressing compounding on the sheet rolled in the S3 and a high-ductility rolled copper foil (HTE) with the thickness of 32 mu m by adopting a laminating machine in a high-temperature high-pressure vacuum environment according to a specific procedure to prepare a PTFE copper-clad plate material; the maximum pressure set by the laminating machine is 7.5MPa, the temperature is 350-400 ℃, the vacuum degree is less than-0.07 MPa, the high-temperature heat preservation time is 60-180 minutes, half pressure is started when the temperature rises to 310-325 ℃, full pressure is started when the temperature reaches high-temperature heat preservation, and the half pressure is maintained when the temperature is reduced to below 200 ℃.
Comparative example 1
The difference from example 1 is that the filler is not treated.
Comparative example 2
The difference from example 1 is that there is rotation and no doubling-up during calendering.
Comparative example 3
The difference from example 1 is that the rolling direction is doubled and unrotated.
Comparative example 4
The difference from example 1 is that the casting time is not doubled and rotated.
Comparative example 5
The difference from example 4 is that the filler is treated at 120 ℃.
Comparative example 6
The difference from example 4 is that there is rotation and no doubling-up during calendering.
Comparative example 7
The difference from example 4 is that the rolls were folded in half and not rotated.
Comparative example 8
The difference from example 4 is that the casting time is not doubled and rotated.
The PTFE copper-clad plate materials obtained in examples 1 to 4 and comparative examples 1 to 8 of the present invention were subjected to tensile test, and the results are shown in Table 1:
TABLE 1
Finally, it should be noted that the above description is only a preferred embodiment of the present invention, and that many similar changes can be made by those skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (9)
1. The preparation method for improving the tensile strength of the PTFE copper-clad plate material is characterized by comprising the following steps of:
s1, adding modified filler into PTFE emulsion, and uniformly stirring to prepare PTFE emulsion containing the filler;
s2, adding a demulsifier into the PTFE emulsion of the S1 to form PTFE flocculation groups;
s3, pressing the PTFE flocs of the S2 into a sheet with the thickness of 1+/-0.05 mm;
s4, compounding the sheet material of the S3 and copper foil into a copper-clad plate material by hot pressing at high temperature and high pressure.
2. The preparation method for improving the tensile strength of the PTFE copper-clad plate material according to claim 1, wherein the mass ratio of the modified filler to the PTFE emulsion in S1 is 1:1.
3. The preparation method for improving the tensile strength of the PTFE copper-clad plate material according to claim 1 or 2, wherein in S1, the modified filler is prepared by the following method:
s1.1, pre-sintering the pretreated filler in a special atmosphere to obtain a modified filler A;
s1.2, uniformly mixing the powdery filler with a silane coupling agent solution, and drying to obtain a pretreated filler B;
wherein the addition amount of the coupling agent is 1-3% of the total mass of the mixture.
4. The method for preparing the PTFE copper-clad plate material with improved tensile strength according to claim 3, which is characterized in that: the coupling agent is one or more of silane coupling agent and titanate coupling agent.
5. The method for preparing the PTFE copper-clad plate material with improved tensile strength according to claim 3, which is characterized in that: the powdery filler is various inorganic ceramic powder materials such as silicon dioxide, titanium dioxide and the like.
6. The method for preparing the PTFE copper-clad plate material with improved tensile strength according to claim 3, which is characterized in that: the solids content of the PTFE emulsion was 60%.
7. The method for preparing the PTFE copper-clad plate material with improved tensile strength according to claim 3, which is characterized in that: the demulsifier is added in an amount of 2-30% wt of the PTFE emulsion.
8. The preparation method for improving the tensile strength of the PTFE copper-clad plate material according to claim 3, wherein the step S3 is specifically as follows: and pressing the PTFE floccule into a sheet by a calender, wherein the setting of the gaps of the calender is 5mm, 3mm, 2mm and 1mm in sequence, and the rotation speed ratio of the roller is 1:1.
9. The preparation method for improving the tensile strength of the PTFE copper-clad plate material according to claim 8, which is characterized by comprising the following steps of: when the sheet is pressed into a thickness of 3mm, folding the sheet into a sheet with a thickness of 6mm, feeding the sheet into a gap with a thickness of 3mm for extrusion again, and feeding the sheet into a gap with a thickness of 2mm for extrusion; folding the obtained sheet with the thickness of about 2mm into a sheet with the thickness of 4mm, rotating by 90 degrees, feeding into a gap with the thickness of 2mm, extruding again, and feeding into a gap with the thickness of 1mm for extruding; the obtained sheet with the thickness of about 1mm was continuously rotated by 90 degrees clockwise or counterclockwise, and extruded by different rollers to obtain a PTFE green sheet with the thickness of 1.+ -. 0.05 mm.
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