CN116551195A - Femtosecond vortex laser processing device and method - Google Patents
Femtosecond vortex laser processing device and method Download PDFInfo
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- CN116551195A CN116551195A CN202210108573.0A CN202210108573A CN116551195A CN 116551195 A CN116551195 A CN 116551195A CN 202210108573 A CN202210108573 A CN 202210108573A CN 116551195 A CN116551195 A CN 116551195A
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- 230000008859 change Effects 0.000 claims description 5
- 238000003672 processing method Methods 0.000 claims description 4
- 230000004323 axial length Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 16
- 238000004381 surface treatment Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 5
- 230000009471 action Effects 0.000 description 16
- 238000003754 machining Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 10
- 238000005520 cutting process Methods 0.000 description 9
- 239000013078 crystal Substances 0.000 description 5
- 238000005086 pumping Methods 0.000 description 5
- 238000005542 laser surface treatment Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
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- 238000005275 alloying Methods 0.000 description 1
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- 230000004907 flux Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004372 laser cladding Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
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Abstract
The invention provides a femtosecond vortex laser processing device and a method, which relate to the field of femtosecond laser processing and comprise a clamp, a focusing mechanism, an adjusting mechanism and a laser used for outputting vortex laser, wherein the output end of the laser faces to the input end of the adjusting mechanism, the output end of the adjusting mechanism faces to the input end of the focusing mechanism, and a vortex linear processing area is arranged between the output end of the focusing mechanism and the clamp; the fixture is connected with a driving mechanism, and the driving mechanism can drive the fixture to axially reciprocate along the processing area; aiming at the problems that the efficiency is lower and the precision is not easy to control when the existing workpiece is subjected to surface treatment by laser, the vortex laser is utilized to carry out the surface treatment of a cylindrical workpiece, a vortex linear processing area is formed after the vortex laser is collimated and focused, the workpiece is sleeved in the processing area to axially move, and the vortex linear vortex laser is utilized to scrape the burrs and other structures on the outer circumferential surface, so that the effect of surface leveling is achieved, and the surface quality of the workpiece material is improved.
Description
Technical Field
The invention relates to the field of femtosecond laser processing, in particular to a femtosecond vortex laser processing device and method.
Background
The surface roughness of the workpiece can have varying degrees of influence on the coating, thermal conductivity and contact resistance, reflectivity and emissivity, resistance to liquid and gas flow, current flow through the conductor surface, and the like of the material.
The laser processing belongs to non-contact processing, and the energy of the high-energy laser beam and the moving speed thereof are adjustable, so that the aim of various processing can be fulfilled. It can be used for processing various metals and non-metals, especially high-hardness, high-brittleness and high-melting point materials, such as cylindrical single crystal optical fibers with several micrometers to tens of micrometers. The laser processing flexibility is mainly used for cutting, surface treatment, welding, marking, punching and the like. Laser surface treatments include laser trimming, laser phase change hardening, laser cladding, laser surface alloying, laser surface fusing, and the like. When the laser is used for carrying out surface treatment on a workpiece to improve the surface roughness, the efficiency of the laser for carrying out surface treatment on a large area is lower due to the small action range of the laser after focusing; when the position of a workpiece or a laser source is adjusted to adjust the action position, the position is limited by the adjustment precision of position change, the working position and the focus position deviate, so that deviation occurs in machining, the cutting-off in the laser cutting process is different from cutting-off, the requirements on the precision of the focus and the relative position of the workpiece are high in surface treatment, the position adjustment structure with high precision is often required to be matched when the surface treatment is carried out through laser, and the efficiency and the precision of the laser surface treatment are difficult to be effectively ensured.
Disclosure of Invention
Aiming at the defects existing in the prior art, the invention provides a femtosecond vortex laser processing device and a femtosecond vortex laser processing method, wherein vortex laser is utilized to carry out surface treatment on cylindrical workpieces, vortex laser is collimated and focused to form a vortex linear processing area, the workpieces are sleeved in the processing area to axially move, and structures such as burrs on the outer circumferential surface are scraped by the vortex linear vortex laser, so that the effect of surface leveling is achieved, and the surface quality of workpiece materials is improved.
The first object of the invention is to provide a femtosecond vortex laser processing device, which adopts the following scheme:
the device comprises a clamp, a focusing mechanism, an adjusting mechanism and a laser for outputting vortex laser, wherein the output end of the laser faces to the input end of the adjusting mechanism, the output end of the adjusting mechanism faces to the input end of the focusing mechanism, and a vortex linear processing area is arranged between the output end of the focusing mechanism and the clamp; the fixture is connected with a driving mechanism, and the driving mechanism can drive the fixture to axially reciprocate along the processing area.
Further, the focusing mechanism comprises a focusing lens, and the focusing lens and the processing area are coaxially distributed.
Further, the processing area coincides with the vortex laser track emitted by the focusing lens, the axis of the processing area is coaxial or parallel to the axis of the clamping part of the clamp, and the projection of the processing area along the axial direction is circular.
Further, the driving mechanism comprises a piezoelectric platform, the clamp is arranged on the piezoelectric platform, and the piezoelectric platform at least has one degree of freedom along the axial direction of the processing area.
Further, the adjusting mechanism comprises a half wave plate, a polarization beam splitter prism, a collimating lens group and a plane mirror which are sequentially arranged along the vortex laser propagation path, and the plane mirror and the vortex laser propagation path are arranged at an included angle so as to change the vortex laser propagation direction.
A second object of the present invention is to provide a femtosecond vortex laser processing method, using the above-described femtosecond vortex laser processing apparatus, comprising the steps of:
adjusting the focusing mechanism, the adjusting mechanism and the laser to enable vortex laser output by the laser to sequentially pass through the adjusting mechanism and the focusing mechanism and form a processing area;
the clamp clamps the workpiece and drives the workpiece to move, so that the processing area is coaxially sleeved outside the workpiece, and vortex laser forms a vortex linear processing area on the outer ring of the workpiece;
the workpiece axially reciprocates along the processing area, and the part of the outer circumference of the workpiece contacting the vortex laser is removed.
Further, after the clamp clamps the workpiece, the driving mechanism drives the workpiece to move so that the workpiece and the processing area are coaxially arranged.
Further, the parameters of the laser, the adjusting mechanism and the focusing mechanism are changed to adjust the diameter and the axial length of the processing area.
Further, the focusing mechanism focuses vortex laser on the processing area, and the clamp drives the workpiece to reciprocate relative to the processing area.
Further, the clamp and the processing area are arranged at intervals, and the workpiece is cylindrical.
Compared with the prior art, the invention has the advantages and positive effects that:
(1) Aiming at the problems that the efficiency is lower and the precision is not easy to control when the existing workpiece is subjected to surface treatment by laser, the vortex laser is utilized to carry out the surface treatment of a cylindrical workpiece, a vortex linear processing area is formed after the vortex laser is collimated and focused, the workpiece is sleeved in the processing area to axially move, and the vortex linear vortex laser is utilized to scrape the burrs and other structures on the outer circumferential surface, so that the effect of surface leveling is achieved, and the surface quality of the workpiece material is improved.
(2) And a machining area is formed between the focusing mechanism and the clamp by utilizing the focusing mechanism, wherein the machining area is in a vortex line shape which is the same as a vortex laser path, namely a vortex line-shaped cutting action area is formed, and a workpiece contacted with the vortex line-shaped machining area can be removed by vortex laser, so that the effect of removing the surface structure of the workpiece and improving the surface precision is achieved.
(3) The processing area is in a vortex line shape and can be sleeved on the outer ring of the cylindrical workpiece, when the workpiece and the processing area axially move relatively, the processing area can form a cutting line, a cutting surface is formed under the moving action, the cutting surface acts on the outer ring of the workpiece, and a structure outside the processing area is cut off, so that the surface of the workpiece is leveled.
(4) Compared with the traditional laser surface treatment mode, the traditional process of forming the action surface by the action point utilizes vortex laser to form a vortex linear action line, the process of forming the action surface again in the machining process utilizes the movement of the workpiece to form contact with the vortex laser, the surface treatment efficiency of the workpiece is improved, the laser source and the light path structure are not required to be adjusted in the whole machining process, the position of the workpiece is only required to be adjusted, the stability of the action area of the vortex laser is maintained, and the machining precision is improved.
(5) The cylindrical workpiece materials are subjected to surface machining in a targeted manner, and when parameters of the workpieces in the same batch are adjusted, the parameters of the corresponding adjusting mechanism, the laser and the focusing mechanism are adjusted, so that the structure of the device is not required to be changed in a large range, and the working precision before and after adjustment is ensured.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention.
Fig. 1 is a schematic diagram of the optical path principle of a laser in embodiment 1 or 2 of the present invention;
fig. 2 is a schematic diagram of a femtosecond vortex laser processing apparatus in embodiment 1 or 2 of the present invention.
In the figure, 1, a laser; 2. an adjusting mechanism; 3. a focusing mechanism; 4. a clamp; 5. a processing zone; 6. a workpiece.
Detailed Description
Example 1
In an exemplary embodiment of the present invention, as shown in fig. 1-2, a femtosecond vortex laser machining apparatus is provided.
The femtosecond vortex laser processing device shown in fig. 2 can output vortex laser by using a laser 1, an adjusting mechanism 2 and a focusing mechanism 3, and focus the vortex laser in a certain area to form a vortex linear processing area 5, a workpiece 6 moves into the processing area 5 and moves relative to the processing area 5, and the contact position of the workpiece 6 and the processing area 5 is subjected to the action of the vortex laser, so that the workpiece 6 is cut by the vortex laser, and the purposes of removing the protruding part structure of the surface of the workpiece 6, reducing the surface roughness of the workpiece 6 and improving the surface quality of the workpiece 6 are achieved.
Referring to fig. 2 and 1, the femto-second vortex laser processing device mainly comprises a laser 1, an adjusting mechanism 2, a focusing mechanism 3 and a clamp 4, wherein the laser 1 outputs vortex laser, a processing area 5 is formed between the clamp 4 and the focusing mechanism 3 after the vortex laser sequentially passes through the adjusting mechanism 2 and the focusing mechanism 3, the processing area 5 is in a vortex linear shape formed in the process of propagating the vortex laser, the clamp 4 and the processing area 5 can move relatively, so that a workpiece 6 clamped on the clamp 4 and the processing area 5 move relatively, the workpiece 6 is removed by utilizing the vortex laser to act on a circumferential material, and the requirement of the processing process is met.
As shown in fig. 2, the output end of the laser 1 faces the input end of the adjusting mechanism 2, the output end of the adjusting mechanism 2 faces the input end of the focusing mechanism 3, the vortex laser is output from the output end of the focusing mechanism 3 by the focusing mechanism 3, a processing area 5 is formed in a region between the focusing mechanism 3 and the clamp 4, and the processing area 5 is in a vortex shape.
As shown in fig. 1, the laser 1 is used for outputting a vortex laser, which is a beam having a spiral wavefront structure with cylindrical symmetry propagation property, and the vortex center of the beam is a dark core, and the central light intensity is maintained at 0 during propagation.
The vortex beam has the characteristics of annular distribution of light intensity and zero central light intensity, and when particles are captured, the particles can be trapped in the central area of the beam with zero light intensity, and the particles cannot be irradiated by light at the moment, so that the activity of the particles (cells) can be maintained. In this embodiment, the femtosecond vortex laser is used to process a cylindrical material with a rough surface by utilizing the unique properties of the vortex laser that the light intensity is annularly distributed and the center intensity is 0, and the internal structure is not destroyed while the surface material of the workpiece 6 is removed.
As shown in fig. 1, the laser 1 is a femtosecond vortex beam laser 1, and the steps of generating the femtosecond vortex laser are as follows: and constructing a folding cavity by using an LD pumping source and using a Tm: YLF crystal as a gain medium and a SESAM as a mode locking element, obtaining a femto-second early Gaussian beam by rotating an output mirror by using an off-axis pumping method, and obtaining femto-second vortex laser by using a cylindrical lens converter.
In this example, for processing cylindrical single crystal optical fibers of several microns to several tens of microns, a set of parameters is given for the laser 1, the pumping source is LD with a wavelength of 792nm, and the Tm: YLF crystal size is 3×3×7mm 3 The doping concentration was 3 at%, the modulation depth of the SESAM modulation element was 1.2%, and the saturation flux was 70. Mu.J/cm 2 。
Meanwhile, in this example, the wavelength of the femtosecond vortex laser was 1.9 μm, the pulse width was 650fs, and the laser power employed in the experiment was 1W.
In addition, in other embodiments, according to the propagation light path configuration, the workpiece 6 material and other parameters, the parameters of the femto-second vortex laser, such as laser power, pulse width, wavelength and the like, can be adjusted to meet the actual processing requirements.
As shown in fig. 2, the adjusting mechanism includes a half-wave plate, a polarization beam splitter prism, a collimating lens group and a plane mirror which are sequentially arranged along the vortex laser propagation path, and the plane mirror is arranged at an included angle with the vortex laser propagation path so as to change the propagation direction of the vortex laser.
The half-wave plate and the polarization beam splitter prism are used for adjusting the output femtosecond vortex laser power; the collimating lens group is used as a collimating focusing system and can collimate the output femtosecond vortex laser; the plane mirror can be a 45-degree mirror, and can regulate and control the movement of the femtosecond vortex laser on an X-Y plane.
In the processing process of the workpiece 6, as the positions of the clamp 4 and the workpiece 6 are required to be adjusted, the clamp 4 is also connected with a driving mechanism, and the driving mechanism can drive the clamp 4 to axially reciprocate along the processing area 5. Wherein, anchor clamps 4 can select the chuck, and actuating mechanism includes piezoelectric platform, anchor clamps 4 are installed in piezoelectric platform, and piezoelectric platform has at least one along the axial degree of freedom of processing district 5. The focusing mechanism 3 comprises a focusing lens which is coaxially distributed with the processing area 5 and is used for focusing the femtosecond vortex laser so that the femtosecond vortex laser is focused on the processing area 5; in this embodiment, the focus lens focal length is 100mm.
Referring to fig. 2, the laser power of the femtosecond vortex laser is adjusted after passing through a half wave plate and a polarization splitting prism; then, carrying out beam shaping on the laser through a collimation focusing system; and then the laser is focused on a cylindrical material with rough surface after passing through a 45-degree mirror and a focusing lens in sequence, wherein the 45-degree mirror is used for regulating and controlling the movement of femtosecond vortex laser on an X-Y plane, the laser is focused through the focusing lens, and a cylindrical workpiece 6 is fixed on a piezoelectric station through a chuck and is driven by a piezoelectric platform to realize the up-and-down movement of the material.
As shown in fig. 2, the processing area 5 coincides with the vortex laser track emitted by the focusing lens, the axis of the processing area 5 is coaxial or parallel to the axis of the clamping part of the clamp 4, and the projection of the processing area 5 along the axial direction is circular. The processing area 5 is in a vortex shape which is the same as the vortex laser path, namely a vortex-shaped cutting action area is formed, and a workpiece 6 contacting the vortex-shaped processing area 5 is removed by the vortex laser, so that the surface structure of the workpiece 6 is removed, and the surface accuracy is improved.
It should be noted that, the projection of the spiral line in the axial direction is circular, and is adapted to the size of the workpiece 6, the processing area 5 is in a spiral line shape, and can be sleeved on the outer ring of the cylindrical workpiece 6, when the workpiece 6 and the processing area 5 axially move relatively, the processing area 5 can form a cutting line, a cutting surface is formed under the action of movement, the cutting surface acts on the outer ring of the workpiece 6, and the structure outside the processing area 5 is cut off, so that the surface of the workpiece 6 is leveled.
In the traditional laser surface treatment mode, laser is projected on the surface of a workpiece 6, an action line is formed through relative movement, and an action surface is formed through superposition of the action lines, so that the treatment efficiency is low; in this embodiment, the vortex laser is utilized to form a vortex linear action line, and in the process of forming an action surface again in the processing process, the movement of the workpiece 6 is utilized to form contact with the vortex laser, so that the surface treatment efficiency of the workpiece 6 is improved, in the whole processing process, the laser source and the light path structure are not required to be adjusted, only the position of the workpiece 6 is required to be adjusted, the stability of the action area of the vortex laser is maintained, and the processing precision is improved.
Example 2
In another exemplary embodiment of the present invention, as shown in fig. 1-2, a femtosecond vortex laser machining method is provided.
As shown in fig. 1 and 2, the femtosecond vortex laser processing apparatus as in example 1 is used, and includes the steps of:
adjusting the focusing mechanism 3, the adjusting mechanism 2 and the laser 1 to enable vortex laser output by the laser 1 to sequentially pass through the adjusting mechanism 2 and the focusing mechanism 3 and form a processing area 5;
the clamp 4 and the processing area 5 are arranged at intervals, the workpiece 6 is cylindrical, the clamp 4 clamps the workpiece 6 and drives the workpiece 6 to move, the processing area 5 is coaxially sleeved outside the workpiece 6, and the workpiece 6 is driven to move through the driving mechanism, so that the workpiece 6 and the processing area 5 are coaxially arranged;
the focusing mechanism 3 focuses vortex laser on the processing area 5, the vortex laser forms a vortex linear processing area 5 on the outer ring of the workpiece 6, and the clamp 4 drives the workpiece 6 to reciprocate relative to the processing area 5;
changing parameters of the laser 1, the adjusting mechanism 2 and the focusing mechanism 3 to adjust the diameter and the axial length of the processing area 5;
the workpiece 6 axially reciprocates along the processing region 5, and the portion of the outer circumference of the workpiece 6 contacting the vortex laser is removed.
In this embodiment, the working procedure of the laser 1 is: the LD pumping source with the wavelength of 792nm is utilized, the doping concentration is 3at percent, and the size is 3 mm by 7mm 3 YLF crystal as gain medium and using input mirror with radius of curvature of 100mm and M with radius of curvature of 200mm 2 ,M 3 The cavity mirror, the flat mirror output mirror and the SESAM mode locking element are used for constructing a folding cavity, a femto-second early Gaussian beam is obtained by rotating the output mirror through an off-axis pumping method, and a pair of cylindrical lenses with the focal length of 25mm and the distance of 35.35mm are used for obtaining femto-second vortex laser;
the femtosecond vortex laser passes through a half wave plate and a polarization beam splitting prism, and then the laser power is adjusted; then, carrying out beam shaping on the laser through a collimation focusing system; and then the laser is focused on a cylindrical material with rough surface after passing through a 45-degree mirror and a focusing lens in sequence, wherein the 45-degree mirror is used for regulating and controlling the movement of femtosecond vortex laser on an X-Y plane, the laser is focused through the focusing lens, and a cylindrical workpiece 6 is fixed on a piezoelectric station through a chuck and is driven by a piezoelectric platform to realize the up-and-down movement of the material.
Because the central light intensity of the vortex laser is 0, the light intensity is in a tendency of increasing and weakening towards two sides, and therefore the circumference radius with the strongest light intensity on the cross section is intercepted to be used as the light spot radius of the vortex light beam. Deriving an expression of the light intensity distribution of the light beam:
where l is the topological charge number of the beam, σ is the spot radius, which can be considered as characterizing the Gaussian spot size on the observation plane, r, θ is the polar coordinate of the observation plane, and z is the transmission distance, where
After derivation, taking the extremum to obtain a new spot size expression as follows:
from equation (2), it can be seen that the spot size is related to the size of the topological payload and the transmission distance. Since the collimation system is added after the generated femtosecond vortex laser and the position where the cylindrical workpiece 6 is placed is close to the vortex light generation position, the sigma' =sigma can be approximately considered here, so that after the parameters of the resonant cavity are determined, the spot radius at z=0 can be obtained, and the spot size of the vortex light beam can be calculated by using the obtained different topological load values. The parameters of the resonant cavity are continuously adjusted according to the size of the cylindrical material with rough surface, so that the material can be processed conveniently.
The cylindrical workpiece 6 is subjected to surface machining in a targeted manner, and when parameters of the workpieces 6 in the same batch are adjusted, the corresponding adjusting mechanism 2, the laser 1 and the focusing mechanism 3 are subjected to parameter adjustment, so that the structure of the device is not required to be changed in a large range, and the working precision before and after adjustment is ensured.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The femtosecond vortex laser processing device is characterized by comprising a clamp, a focusing mechanism, an adjusting mechanism and a laser used for outputting vortex laser, wherein the output end of the laser faces to the input end of the adjusting mechanism, the output end of the adjusting mechanism faces to the input end of the focusing mechanism, and a vortex linear processing area is arranged between the output end of the focusing mechanism and the clamp; the fixture is connected with a driving mechanism, and the driving mechanism can drive the fixture to axially reciprocate along the processing area.
2. The femtosecond vortex laser processing apparatus of claim 1 wherein the focusing mechanism comprises a focusing lens coaxially distributed with the processing region.
3. The femtosecond vortex laser processing device as set forth in claim 1, wherein the processing area coincides with the vortex laser track emitted by the focusing lens, the axis of the processing area is coaxial or parallel to the axis of the clamping part of the clamp, and the projection of the processing area along the axial direction is circular.
4. The femtosecond vortex laser processing apparatus of claim 1 wherein the drive mechanism comprises a piezoelectric platform to which the fixture is mounted, the piezoelectric platform having at least one degree of freedom along an axial direction of the processing region.
5. The femtosecond vortex laser processing apparatus according to claim 1, wherein the adjustment mechanism comprises a half wave plate, a polarization splitting prism, a collimating lens group and a plane mirror which are sequentially arranged along a vortex laser propagation path, and the plane mirror is arranged at an angle with the vortex laser propagation path to change the vortex laser propagation direction.
6. A femtosecond vortex laser processing method using the femtosecond vortex laser processing apparatus according to any one of claims 1 to 5, comprising the steps of:
adjusting the focusing mechanism, the adjusting mechanism and the laser to enable vortex laser output by the laser to sequentially pass through the adjusting mechanism and the focusing mechanism and form a processing area;
the clamp clamps the workpiece and drives the workpiece to move, so that the processing area is coaxially sleeved outside the workpiece, and vortex laser forms a vortex linear processing area on the outer ring of the workpiece;
the workpiece axially reciprocates along the processing area, and the part of the outer circumference of the workpiece contacting the vortex laser is removed.
7. The femtosecond vortex laser processing method of claim 6 wherein the workpiece is moved by the driving mechanism after the workpiece is clamped by the clamp so that the workpiece is coaxially arranged with the processing area.
8. The method of claim 6, wherein the laser, adjustment mechanism and focusing mechanism parameters are varied to adjust the diameter and axial length of the processing zone.
9. The method of claim 6, wherein the focusing mechanism focuses the swirling laser light on the processing region and the fixture reciprocates the workpiece relative to the processing region.
10. The method of claim 6, wherein the fixture is spaced from the processing region and the workpiece is cylindrical.
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