CN116518682A - Automatic power semiconductor blow-drying device - Google Patents

Automatic power semiconductor blow-drying device Download PDF

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Publication number
CN116518682A
CN116518682A CN202310806124.8A CN202310806124A CN116518682A CN 116518682 A CN116518682 A CN 116518682A CN 202310806124 A CN202310806124 A CN 202310806124A CN 116518682 A CN116518682 A CN 116518682A
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CN
China
Prior art keywords
power semiconductor
blow
air
drying
spray head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202310806124.8A
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Chinese (zh)
Other versions
CN116518682B (en
Inventor
贾士龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chenxin Electronics Suzhou Co ltd
Original Assignee
Chenxin Electronics Suzhou Co ltd
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Filing date
Publication date
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Priority to CN202310806124.8A priority Critical patent/CN116518682B/en
Publication of CN116518682A publication Critical patent/CN116518682A/en
Application granted granted Critical
Publication of CN116518682B publication Critical patent/CN116518682B/en
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B11/00Machines or apparatus for drying solid materials or objects with movement which is non-progressive
    • F26B11/18Machines or apparatus for drying solid materials or objects with movement which is non-progressive on or in moving dishes, trays, pans, or other mainly-open receptacles
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/001Drying-air generating units, e.g. movable, independent of drying enclosure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/004Nozzle assemblies; Air knives; Air distributors; Blow boxes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00Details of general application not covered by group F26B21/00 or F26B23/00
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00Details of general application not covered by group F26B21/00 or F26B23/00
    • F26B25/02Applications of driving mechanisms, not covered by another subclass
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00Details of general application not covered by group F26B21/00 or F26B23/00
    • F26B25/06Chambers, containers, or receptacles
    • F26B25/14Chambers, containers, receptacles of simple construction
    • F26B25/18Chambers, containers, receptacles of simple construction mainly open, e.g. dish, tray, pan, rack
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)

Abstract

The utility model relates to an automatic device's field that weathers, discloses an automatic device that weathers of power semiconductor, it includes the support body, be provided with the collecting box on the support body, be provided with the gas blow pipe on the collecting box, rotate on the gas blow pipe and be connected with rotatory nozzle, the intracavity of having seted up the gas blow chamber that is linked together with the gas blow pipe, the gas blow seam that is linked together with the gas blow chamber has been seted up to the gas blow pipe outer wall, rotatory nozzle is provided with the air guide plate in gas blow seam opening part, the air guide plate sets up along the direction slope that keeps away from rotatory nozzle, the incline direction of a plurality of air guide plates is the same; the clamping claw used for clamping the power semiconductor is arranged on the frame body in an adjustable mode, and the driving device used for moving the clamping claw is arranged on the frame body. This application has the effect of drying that improves power semiconductor to improve the effect of drying the efficiency of water stain.

Description

Automatic power semiconductor blow-drying device
Technical Field
The application relates to the field of automatic blow-drying devices, in particular to an automatic blow-drying device for a power semiconductor.
Background
Power semiconductor devices, also referred to as power electronics in the past, are currently being power processed and have the capability of handling high voltages and large currents. In the research and development or factory test of the power semiconductor device, some main drive application system tests are usually carried out, the temperature of a heat dissipation column is reduced by adopting water cooling heat dissipation for the tested device, water stains usually remain after the test is finished, the device is easy to rust due to untimely blow-drying, and the quality of the device is affected, so that the water stains are cleaned after the device is finished.
In the prior art, when carrying out the water stain of clearance power semiconductor, place the power semiconductor fixedly, directly use traditional air gun to blow to power semiconductor again, such clearance mode not only wastes time and energy, work efficiency is low, and the water stain on the power semiconductor is located the root of heat dissipation post in general moreover, and such mode hardly with water stain clean up, reduces the convenience of power semiconductor clearance water stain.
For this purpose. The inventor provides a power semiconductor automatic blow-drying device.
Disclosure of Invention
In order to improve the effect of drying of power semiconductor to improve the efficiency of drying the water stain, this application provides an automatic device that weathers of power semiconductor.
The application provides an automatic device that weathers of power semiconductor adopts following technical scheme:
the automatic power semiconductor blow-drying device comprises a frame body, wherein a collecting box is arranged on the frame body, a blow pipe is arranged on the collecting box, a rotary spray head is rotationally connected on the blow pipe, a blow cavity communicated with the blow pipe is formed in the rotary spray head, a blow seam communicated with the blow cavity is formed in the outer wall of the blow pipe, an air guide plate is arranged at the opening of the blow seam of the rotary spray head, the air guide plate is obliquely arranged along the direction far away from the rotary spray head, and the inclination directions of the air guide plates are the same; the power semiconductor clamping device is characterized in that clamping claws for clamping the power semiconductor are adjustably arranged on the frame body, and a driving device for moving the clamping claws is arranged on the frame body.
By adopting the technical scheme, when the power semiconductor is used, the clamping claw clamps the power semiconductor, the power semiconductor is moved to the rotary spray head under the action of the driving device, the power semiconductor is moved on the rotary spray head, meanwhile, the pressure gas is injected into the rotary spray head through the gas injection pipe, the pressure gas is blown out from the gas blowing seam, and the gas blown in the gas blowing seam acts on the gas guide plate, so that the gas can be blown out obliquely, the rotary spray head is automatically rotated, the pressure gas can be blown to the power semiconductor more uniformly, the effect of drying water stains is achieved, the drying convenience of the power semiconductor is improved, the power semiconductor can be dried more uniformly and more efficiently, and the convenience of using the drying device is improved; and adopt such design to weather power semiconductor centre gripping and removal, can make the water stain on the heat dissipation post like this, at the in-process that weathers, be difficult for making the water stain collect in the heat dissipation post bottom to reduced the water stain and taken place the accumulational condition, improved power semiconductor and weathered the efficiency of water stain.
Preferably, a blowing seam is formed at the top of the rotary spray head.
Through adopting above-mentioned technical scheme, use and blow-dry the seam and can directly blow to power semiconductor to can improve power semiconductor and blow-dry efficiency.
Preferably, an air deflector is arranged at the top of the rotary spray head, and the air deflector divides the blow-drying seam into two blow-drying holes.
By adopting the technical scheme, when the rotary spray head rotates, the gas can be rotated after being sprayed out of the blowing-drying hole, so that the gas can be blown to the power semiconductor in an inclined spiral direction.
Preferably, the bottom of the collecting tank is provided with a water collecting tank, one side of the water collecting tank is provided with an exhaust port, and one side of the water collecting tank, which is provided with an exhaust fan, is provided with an exhaust port opening.
Through adopting above-mentioned technical scheme, the air exhauster is by the exhaust port bleed to make the water smoke that blows out on the power semiconductor flow to being close to the header tank, thereby can collect the water smoke in the header tank better, adopt such design, can reduce the water smoke that blows out and attach to on the power semiconductor again, ensure power semiconductor's effect of drying.
Preferably, a guide tube is arranged at the bottom of the collecting box, and the guide tube is arranged in an extending manner along the direction away from the collecting box.
Through adopting above-mentioned technical scheme, the flow distance of the water smoke that uses the stand pipe can increase down the suction to can make water smoke can liquefy better in the header tank, reduce water smoke in exhaust port exhaust condition emergence, improve the result of use that uses the header tank.
Preferably, a plurality of air holes are formed in the outer wall of the guide tube in a penetrating mode.
Through adopting above-mentioned technical scheme, can increase the space that gas flows, and when the gas that contains fog flows in the gas pocket, fog can better in the gas pocket liquid, improves fog liquefaction's efficiency.
Preferably, a hot air pipe is arranged in the collecting box, a hot air port communicated with the hot air pipe is formed in the side wall of the collecting box, and a hot air fan is fixed at the position of the opening of the hot air port.
Through adopting above-mentioned technical scheme, the air heater blows in the hot-blast main with hot-blast, acts on power semiconductor again to can dry power semiconductor better, improve the convenience of drying power semiconductor.
Preferably, the bottom of the rotary spray head is rotationally connected with a connecting nut, the bottom of the rotary spray head is provided with a limiting ring for limiting the connecting nut, and the connecting nut is connected to the air blowing pipe in a threaded fit manner.
Through adopting above-mentioned technical scheme, can make rotatory nozzle more conveniently install on the gas blowing pipe, improve the stability of using rotatory nozzle.
Preferably, the width of the air deflector and the width of the air guide plate are gradually increased along the direction away from the rotary spray head.
Through adopting above-mentioned technical scheme, blow the gas seam with blow and blow seam spun gas and be the diffusion form, under the effect of aviation baffle and air guide plate, make the more convenient direction of gas, improve the convenience that uses blow and blow device.
Preferably, the top of the collecting box is provided with a collecting seat, a collecting groove is formed in the collecting seat, a through hole communicated with the inside of the collecting box is formed in the bottom of the collecting groove, and the rotary spray head is arranged in the through hole.
Through adopting above-mentioned technical scheme, collect the seat and collect after can liquefying water smoke, reduce the circumstances of water smoke diffusion and take place, improve the convenience that water smoke was collected.
In summary, the present application includes at least one of the following beneficial technical effects:
1. when the power semiconductor blowing device is used, the power semiconductor is clamped by the clamping claw, the power semiconductor is moved to the rotary spray head under the action of the driving device, the power semiconductor is moved on the rotary spray head, meanwhile, the pressure gas is injected into the rotary spray head through the gas injection pipe, the pressure gas is blown out through the gas blowing seam, and the gas blown by the gas blowing seam acts on the gas guide plate, so that the gas can be obliquely blown out, the rotary spray head automatically rotates, the pressure gas can be blown to the power semiconductor more uniformly, the effect of blowing water stains on the power semiconductor is achieved, the convenience of blowing the power semiconductor is improved, the power semiconductor can be blown more uniformly and more efficiently, and the convenience of using the blowing device is improved; the power semiconductor is clamped and moved to be dried by adopting the design, so that water stains on the heat dissipation column are not easy to collect at the bottom of the heat dissipation column in the drying process, the situation that the water stains are piled up is reduced, and the efficiency of drying the water stains by the power semiconductor is improved;
2. the blowing-drying seam is matched with the air deflector, and the blowing-drying seam can be used for directly blowing the power semiconductor, so that the blowing-drying efficiency of the power semiconductor can be improved, and when the rotary nozzle rotates, the gas can be rotated after being ejected out of the blowing-drying hole, so that the gas can be blown to the power semiconductor in an inclined spiral direction;
3. the air exhauster is pumped by the air exhaust port, so that the water mist blown out of the power semiconductor flows towards the water collection tank, the water mist can be better collected in the water collection tank, and by adopting the design, the blown water mist can be reduced to be attached to the power semiconductor again, and the blow-drying effect of the power semiconductor is ensured.
Drawings
Fig. 1 is a schematic structural diagram of an automatic power semiconductor drying device according to an embodiment of the present application.
Fig. 2 is a cross-sectional view showing the guide pipe and the header tank in a highlighting manner in the embodiment of the present application.
Fig. 3 is an enlarged schematic view of the portion a in fig. 2.
Reference numerals: 1. a second slider; 2. a second motor; 3. a first slider; 4. a third slider; 5. a driving cylinder; 6. a clamping jaw; 7. rotating the spray head; 8. a through hole; 9. a collection tank; 10. a collection seat; 11. a frame body; 12. a first slide rail; 13. a first motor; 14. a collection box; 15. a water collection tank; 16. an air suction port; 17. an exhaust fan; 18. a guide tube; 19. a third motor; 20. air holes; 21. an air heater; 22. a hot air pipe; 23. an air guide plate; 24. blowing the air seam; 25. an air deflector; 26. drying the seam; 27. a coupling nut; 28. and (3) an air blowing pipe.
Detailed Description
The present application is described in further detail below in conjunction with figures 1-3.
The embodiment of the application discloses an automatic power semiconductor blow-drying device.
Referring to fig. 1 and 2, an automatic power semiconductor blow-drying device comprises a frame body 11, the frame body 11 is a rectangular plate, a rectangular opening is formed in one side of the rectangular frame, a collecting box 14 is fixed in the rectangular opening, a blowing pipe 28 is installed on the collecting box 14, a rotary spray head 7 is connected to the blowing pipe 28 in a rotating mode, two blowing slits 24 communicated with the blowing pipe 28 are formed in the rotary spray head 7, the blowing slits 24 are rectangular slits, the length direction of the rectangular slits is formed in the vertical direction, two air guide plates 23 are fixed at the opening of the blowing slits 24 of the rotary spray head 7, and the width of the air guide plates 23 is gradually increased along the direction away from the rotary spray head 7. The air guide plates 23 are fixed obliquely in a direction away from the rotary head 7, and the oblique directions of the two air guide plates 23 are opposite to the rotation direction of the rotary head 7. The frame 11 is adjustably connected with a clamping claw for clamping the power semiconductor, and a driving device for moving the clamping claw is fixed on the frame 11. Therefore, the power semiconductor can be moved more conveniently and quickly, and the power semiconductor can be moved more conveniently and quickly on the rotary spray head 7, so that the drying speed of the power semiconductor is increased.
Referring to fig. 1 and 2, the driving device comprises a first slide rail 12 fixed on a frame 11, a first slide carriage 3 is slidingly connected on the first slide rail 12, a first motor 13 for driving the first slide carriage 3 to move is arranged on the first slide rail 12, a first screw is rotatably connected on the first motor 13, the length direction of the first screw is arranged along the length direction of the first slide rail 12, and the first screw is in threaded fit connection with the first slide carriage 3. The first sliding seat 3 is connected with a second sliding seat 1 in a sliding manner along the vertical direction, the first sliding seat 3 is fixedly provided with a second motor 2 for driving the second sliding seat 1 to ascend and descend, the second motor 2 is rotationally connected with a second screw rod, and the second screw rod is in threaded fit connection with the second sliding seat 1. The sliding direction of the second sliding seat 1 is perpendicular to the sliding direction of the first sliding seat 3. The second slide 1 is connected with the third slide 4 that slides, and the gripper jaw is fixed in on the third slide 4, is fixed with third motor 19 on the second slide 1, rotates on the third motor 19 and is connected with the third screw rod, third screw rod screw thread cooperation is connected on the third slide 4, and the slip direction of third slide 4 sets up perpendicularly with the slip direction of second slide 1 to can carry out the regulation of a plurality of angles, improve the convenience of using the gripper jaw.
With reference to fig. 1 and 2, the gripper jaw comprises two gripper jaws 6 slidingly connected to the third carriage 4, the two gripper jaws 6 cooperating to grip the power semiconductor. A driving cylinder 5 for driving the two clamping jaws 6 to approach each other is fixed on the third slide 4.
The top of the rotary spray head 7 is provided with a drying seam 26, the drying seam 26 is a rectangular hole, the top of the rotary spray head 7 is provided with an air deflector 25 along the vertical direction of the drying seam 26, the width of the air deflector 25 is gradually increased along the direction away from the rotary spray head 7, the air deflector 25 equally divides the drying seam 26 into two drying holes, the power semiconductor can be better blown to the two drying holes, and the drying effect of the power semiconductor is improved.
Referring to fig. 2 and 3, a water collection tank 15 is fixed at the bottom of the collection tank 14, a guide tube 18 is fixed at the bottom of the collection tank 14, the guide tube 18 is in a ring shape, the guide tube 18 extends along a direction away from the collection tank 14, a plurality of air holes 20 are formed in the outer wall of the guide tube 18 in a penetrating manner along a circumferential array, and the air holes 20 are cylindrical. An exhaust opening 16 is formed in one side of the water collection tank 15, the exhaust opening 16 is cylindrical, an exhaust fan 17 is fixed on one side of the water collection tank 15, mist can be sucked to the water collection tank 15 through the exhaust fan 17, and therefore the mist can be collected in the water collection tank 15 better, and convenience in mist collection is improved.
The hot air pipe 22 is fixed in the collecting box 14, the hot air pipe 22 is U-shaped, a hot air port communicated with the hot air pipe 22 is formed in the side wall of the collecting box 14, the hot air fan 21 is fixed at the position of the hot air port, and air is supplied to the hot air pipe 22 through the hot air fan 21, so that hot air acts on the power semiconductor, and the drying efficiency of the power semiconductor is improved.
The rotating nozzle 7 bottom is rotationally connected with coupling nut 27, and rotating nozzle 7 bottom is fixed with the spacing ring that is used for restricting coupling nut 27, and coupling nut 27 screw-thread fit connects on the gas blow pipe 28, carries out spacingly in the spacing ring through coupling nut 27, improves the convenience of using rotating nozzle 7.
The collecting box 14 top is fixed with collecting seat 10, has seted up collecting vat 9 on the collecting seat 10, and collecting vat 9 is rectangular groove, and collecting vat 9 bottom has seted up the through-hole 8 that is linked together with collecting box 14, and through-hole 8 is rectangular hole, and rotatory nozzle 7 is fixed in the central point of through-hole 8 put to the water smoke that can blow out can collect more conveniently, improves the convenience of using rotatory nozzle 7.
The implementation principle of the automatic power semiconductor blow-drying device provided by the embodiment of the application is as follows: when the power semiconductor drying device is used, the power semiconductor is clamped by the two clamping jaws 6, the power semiconductor is driven to move by the first motor 13, the second single machine and the third motor 19, so that the power semiconductor moves on the upper side of the rotary spray head 7, water stains on the power semiconductor are blown out through the rotary spray head 7, water mist is formed, the water mist is collected in the water collecting tank 15 through the exhaust fan 17, the power semiconductor is clamped and moved to be dried, and therefore, the water stains on the heat dissipation column are not easy to collect at the bottom of the heat dissipation column in the drying process, the water stains are reduced to be accumulated, and the efficiency of drying the water stains by the power semiconductor is improved; and then the power semiconductor is dried by being matched with hot air generated by the hot air blower 21, so that the efficiency of drying the power semiconductor is improved.
The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.

Claims (10)

1. The utility model provides a power semiconductor automatic blow-dry device which characterized in that: the novel air guide device comprises a frame body (11), wherein a collecting box (14) is arranged on the frame body (11), an air blowing pipe (28) is arranged on the collecting box (14), a rotary spray head (7) is rotationally connected to the air blowing pipe (28), an air blowing cavity communicated with the air blowing pipe (28) is formed in the rotary spray head (7), an air blowing seam (24) communicated with the air blowing cavity is formed in the outer wall of the air blowing pipe (28), an air guide plate (23) is arranged at the opening of the air blowing seam (24) of the rotary spray head (7), and the air guide plates (23) are obliquely arranged along the direction away from the rotary spray head (7), and the oblique directions of the air guide plates (23) are the same; clamping claws for clamping the power semiconductor are arranged on the frame body (11) in an adjustable mode, and a driving device for moving the clamping claws is arranged on the frame body (11).
2. The automatic power semiconductor blow-drying device according to claim 1, wherein: the top of the rotary spray head (7) is provided with a blowing seam (26).
3. The automatic power semiconductor blow-drying device according to claim 2, wherein: the top of the rotary spray head (7) is provided with an air deflector (25), and the air deflector (25) divides the blow-drying seam (26) into two blow-drying holes.
4. A power semiconductor automatic blow-drying apparatus according to claim 3, wherein: the water collecting device is characterized in that a water collecting tank (15) is arranged at the bottom of the collecting tank (14), an exhaust opening (16) is formed in one side of the water collecting tank (15), and an exhaust fan (17) is arranged on one side of the water collecting tank (15) where the exhaust opening (16) is formed.
5. The automatic power semiconductor blow-drying device according to claim 4, wherein: the bottom of the collecting box (14) is provided with a guide pipe (18), and the guide pipe (18) is arranged in an extending manner along the direction away from the collecting box (14).
6. The automatic power semiconductor blow-drying device according to claim 5, wherein: a plurality of air holes (20) are formed in the outer wall of the guide pipe (18) in a penetrating mode.
7. The automatic power semiconductor blow-drying device according to claim 1, wherein: the hot air pipe (22) is arranged in the collecting box (14), a hot air port communicated with the hot air pipe (22) is formed in the side wall of the collecting box (14), and a hot air fan (21) is fixed at the position of the opening of the hot air port.
8. A power semiconductor automatic blow-drying apparatus according to claim 3, wherein: the rotary sprayer is characterized in that a connecting nut (27) is rotatably connected to the bottom of the rotary sprayer (7), a limiting ring used for limiting the connecting nut (27) is arranged at the bottom of the rotary sprayer (7), and the connecting nut (27) is connected to the air blowing pipe (28) in a threaded fit mode.
9. The automatic power semiconductor blow-drying device according to claim 8, wherein: the width of the air deflector (25) and the width of the air guide plate (23) are gradually increased along the direction away from the rotary spray head (7).
10. The automatic power semiconductor blow-drying device according to claim 1, wherein: the collecting box is characterized in that a collecting seat (10) is arranged at the top of the collecting box (14), a collecting groove (9) is formed in the collecting seat (10), a through hole (8) communicated with the inside of the collecting box (14) is formed in the bottom of the collecting groove (9), and the rotary spray head (7) is arranged in the through hole (8).
CN202310806124.8A 2023-07-04 2023-07-04 Automatic power semiconductor blow-drying device Active CN116518682B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310806124.8A CN116518682B (en) 2023-07-04 2023-07-04 Automatic power semiconductor blow-drying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310806124.8A CN116518682B (en) 2023-07-04 2023-07-04 Automatic power semiconductor blow-drying device

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CN116518682A true CN116518682A (en) 2023-08-01
CN116518682B CN116518682B (en) 2023-09-29

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001259557A (en) * 2000-03-17 2001-09-25 Ishikawajima Harima Heavy Ind Co Ltd Nozzle device for cleaning filter cloth of bag filter
CN209802005U (en) * 2019-03-29 2019-12-17 江门市东联热工设备有限公司 Blow-drying device
CN213915006U (en) * 2020-11-20 2021-08-10 醴陵市和兴瓷业有限公司 Cleaning device for roll squeezer
CN214132989U (en) * 2020-12-08 2021-09-07 惠州润众科技股份有限公司 Screen printing plate cleaning machine suitable for PCB circuit board
CN216752583U (en) * 2021-12-30 2022-06-14 河南开扩智能科技有限公司 Electrical equipment automated control device
CN218868417U (en) * 2022-10-13 2023-04-14 安徽理工大学 Strong-blowing high-negative-pressure suction type electrostatic dust collection device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001259557A (en) * 2000-03-17 2001-09-25 Ishikawajima Harima Heavy Ind Co Ltd Nozzle device for cleaning filter cloth of bag filter
CN209802005U (en) * 2019-03-29 2019-12-17 江门市东联热工设备有限公司 Blow-drying device
CN213915006U (en) * 2020-11-20 2021-08-10 醴陵市和兴瓷业有限公司 Cleaning device for roll squeezer
CN214132989U (en) * 2020-12-08 2021-09-07 惠州润众科技股份有限公司 Screen printing plate cleaning machine suitable for PCB circuit board
CN216752583U (en) * 2021-12-30 2022-06-14 河南开扩智能科技有限公司 Electrical equipment automated control device
CN218868417U (en) * 2022-10-13 2023-04-14 安徽理工大学 Strong-blowing high-negative-pressure suction type electrostatic dust collection device

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