CN116504674A - Semiconductor graphite device encapsulation mechanism - Google Patents
Semiconductor graphite device encapsulation mechanism Download PDFInfo
- Publication number
- CN116504674A CN116504674A CN202310448934.0A CN202310448934A CN116504674A CN 116504674 A CN116504674 A CN 116504674A CN 202310448934 A CN202310448934 A CN 202310448934A CN 116504674 A CN116504674 A CN 116504674A
- Authority
- CN
- China
- Prior art keywords
- connecting rod
- plate
- cylinder
- graphite device
- rotating arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 32
- 229910002804 graphite Inorganic materials 0.000 title claims abstract description 27
- 239000010439 graphite Substances 0.000 title claims abstract description 27
- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 238000005538 encapsulation Methods 0.000 title claims abstract description 8
- 238000004806 packaging method and process Methods 0.000 claims abstract description 23
- 238000007789 sealing Methods 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000012545 processing Methods 0.000 abstract description 6
- 238000012858 packaging process Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 4
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Vacuum Packaging (AREA)
Abstract
The invention discloses a semiconductor graphite device packaging mechanism, and belongs to the technical field of production packaging. The utility model provides a semiconductor graphite device encapsulation mechanism, includes mounting panel and heat-seal plate, mounting panel one side is provided with the fixed block, the fixed block front end is provided with the pneumatic cylinder, pneumatic cylinder one end is provided with the hydraulic stem, the mounting panel front end is provided with the slide rail, slide rail one side is provided with the connecting plate, connecting plate one side is provided with the rotating arm, the rotating arm lower extreme is connected with the connecting rod, connecting rod one side is provided with the leading truck, rotating arm one end is provided with the xarm, the xarm top is provided with the fixing base, fixing base one side is provided with the cylinder, cylinder one side is provided with the connecting rod, the connecting rod below is provided with the rotating piece, rotating piece one side is provided with the heat-seal board, the heat-seal inboard is provided with the encapsulation bag; the invention aims to solve the problems of lower automation degree and larger manual investment of the graphite device in the processing and packaging process in the prior art.
Description
Technical Field
The invention relates to the technical field of production packaging, in particular to a semiconductor graphite device packaging mechanism.
Background
The semiconductor refers to a material with conductivity between a conductor and an insulator at normal temperature, the importance of the semiconductor is very huge from the viewpoint of technological or economic development, continuous research and exploration of high-purity graphite powder drives the progress of the semiconductor industry, in the semiconductor industry, a main heating system, a sintering mold, a heat preservation cover, an electrode and the like are all made of high-purity graphite powder, the high-purity graphite powder is adopted as a heater, the high-temperature resistance characteristic of the graphite powder is fully utilized, and a high-purity graphite powder product still keeps good dimensional stability in a high-temperature state, so that the precision of a workpiece is guaranteed;
the semiconductor graphite device is required to be packaged with bag consumable materials in the production and processing process, the sealing bags are taken, the manual operation is mostly adopted in the prior art, the probability of manually contacting the consumable materials is increased, the packaging disqualification phenomenon is easy to occur, the degree of automation is low, the packaging period is long, the efficiency is low, the cost is high, and the use requirement cannot be met.
Disclosure of Invention
The invention aims to solve the problems of low automation degree and large labor investment of a graphite device in the processing and packaging process in the prior art, and provides a semiconductor graphite device packaging mechanism.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the semiconductor graphite device packaging mechanism comprises a mounting plate and a heat sealing plate, wherein a fixed block is arranged on one side of the mounting plate, a hydraulic cylinder is arranged at the front end of the fixed block, a hydraulic rod is arranged at one end of the hydraulic cylinder, a sliding rail is arranged at the front end of the mounting plate, a connecting plate is arranged on one side of the sliding rail, a rotating arm is arranged on one side of the connecting plate, a connecting rod is connected with the lower end of the rotating arm, and a guide frame is arranged on one side of the connecting rod;
the hot sealing device comprises a rotating arm, wherein a transverse arm is arranged at one end of the rotating arm, a fixing seat is arranged above the transverse arm, an air cylinder is arranged on one side of the fixing seat, a connecting rod is arranged on one side of the air cylinder, a rotating piece is arranged below the connecting rod, a hot sealing plate is arranged on one side of the rotating piece, and a sealing bag is arranged on the inner side of the hot sealing plate.
Preferably, the inner wall of the sliding rail is provided with a roller, and one end of the roller is assembled with the connecting plate.
Preferably, the output end of the hydraulic cylinder is mutually sleeved with a hydraulic rod, and one end of the hydraulic rod is connected with a connecting rod.
Preferably, the outer wall of the connecting rod is assembled with the inner wall of the guide frame in a sliding way.
Preferably, the cross arm is connected with the connecting rod through a rotating arm, and one end of the connecting rod is connected with the connecting plate in an adaptive manner.
Preferably, the output ends of the hydraulic cylinder, the air cylinder and the heat sealing plate are all connected with an external power supply through cables.
Compared with the prior art, the invention provides a semiconductor graphite device packaging mechanism, which has the following beneficial effects:
1. in the structure of the device, the hydraulic rod is driven by the hydraulic cylinder to do telescopic action, the hydraulic rod is ejected to drive the connecting rod to do reciprocating circular motion, the roller moves in the sliding rail, the connecting rod drives the rotating arm and the cross arm to stretch forwards to the position of the packaging bag, the packaging bag is placed by pre-clamping, the working efficiency is improved, and meanwhile, the production cost of the graphite device is reduced, so that the problems of lower automation degree and larger manual investment of the graphite device in the processing and packaging process in the prior art are solved;
2. the device is structurally, when carrying out the envelope to graphite device, pneumatic cylinder and cylinder coordinated control, the cylinder promotes the connecting rod and rotates the heat-seal board and open for the heat-seal board presss from both sides the envelope and gets, carries out heat-seal treatment to the envelope simultaneously, accomplishes the prepackaging to the envelope, and at this moment, drive the hydraulic stem through the pneumatic cylinder and shrink back, under the connecting rod effect, drive the xarm and withdraw downwards and press from both sides the envelope and get to next station, realize envelope material work, moreover simple structure, the practicality is strong.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a semiconductor graphite device packaging mechanism according to the present invention;
FIG. 2 is a schematic view of another directional structure of a semiconductor graphite device packaging mechanism according to the present invention;
FIG. 3 is a schematic side view of a semiconductor graphite device packaging mechanism according to the present invention;
fig. 4 is a schematic front view of a semiconductor graphite device packaging mechanism according to the present invention.
In the figure:
1. a mounting plate; 2. a slide rail; 3. a hydraulic rod; 4. a hydraulic cylinder; 5. a fixed block; 6. a connecting plate; 7. a rotating arm; 8. a connecting rod; 9. a guide frame; 10. a cross arm; 11. a fixing seat; 12. a cylinder; 13. a connecting rod; 14. a rotating member; 15. a heat sealing plate; 16. packaging bags; 17. and a roller.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1-4, a semiconductor graphite device packaging mechanism comprises a mounting plate 1 and a heat sealing plate 15, wherein a fixed block 5 is arranged on one side of the mounting plate 1, a hydraulic cylinder 4 is arranged at the front end of the fixed block 5, a hydraulic rod 3 is arranged at one end of the hydraulic cylinder 4, a sliding rail 2 is arranged at the front end of the mounting plate 1, a connecting plate 6 is arranged on one side of the sliding rail 2, a rotating arm 7 is arranged on one side of the connecting plate 6, a connecting rod 8 is connected to the lower end of the rotating arm 7, a guide frame 9 is arranged on one side of the connecting rod 8, and a cross arm 10 is arranged at one end of the rotating arm 7;
in the embodiment, in the use, the device is installed with external equipment by the mounting panel 1, establish coordinated control between the external equipment pneumatic cylinder 4 and cylinder 12, when getting the material to encapsulation bag 16, the pneumatic cylinder 4 outwards pushes up hydraulic stem 3, play the supporting role to pneumatic cylinder 4 through fixed block 5, hydraulic stem 3 promotes connecting rod 8 so that the gyro wheel 17 of the inboard of rotating arm 7 one end drive connecting plate 6 moves in slide rail 2, the other end promotion xarm 10 of rotating arm 7 is stretched forward simultaneously, connecting rod 8 rotates the department and carries out spacingly through leading truck 9, guarantee the accuracy of connecting rod 8 in rotation in-process position, prevent connecting rod 8 slippage.
As shown in fig. 1, 2 and 4, a fixed seat 11 is arranged above a cross arm 10, an air cylinder 12 is arranged on one side of the fixed seat 11, a connecting rod 13 is arranged on one side of the air cylinder 12, a rotating piece 14 is arranged below the connecting rod 13, a heat sealing plate 15 is arranged on one side of the rotating piece 14, and a packaging bag 16 is arranged on the inner side of the heat sealing plate 15;
in this embodiment, in the use, through external equipment driving cylinder 12, cylinder 12 installs through fixing base 11, cylinder 12 forward ejection connecting rod 13 makes rotor 14 be in the open state, hot seal board 15 is opened and presss from both sides and get the envelope processing to envelope 16, realize envelope material work of getting, at this moment, hydraulic cylinder 4 return stroke, drive connecting rod 8 to retrieving contracts, carry to next station at the clamp of hot seal board 15 to get the envelope material action of getting, get into next work cycle, improve work efficiency, simultaneously, reduce the cost of graphite device production.
Referring to fig. 3, an inner wall of the slide rail 2 is provided with rollers 17, one end of each roller 17 is assembled with a connecting plate 6, the rollers 17 reciprocate on the inner wall of the slide rail 2 to drive the rotating arms 7 to reciprocate for taking materials, and the connecting plate 6 plays a role in preventing the rollers 17 from falling.
Referring to fig. 1, the output end of a hydraulic cylinder 4 is connected with a hydraulic rod 3 in a sleeved mode, one end of the hydraulic rod 3 is connected with a connecting rod 8, the hydraulic cylinder 4 drives the hydraulic rod 3 to stretch out and draw back, the connecting rod 8 performs circular motion, the purpose of automatic material taking is achieved, and the automatic use degree of the device is improved.
Referring to fig. 4, the outer wall of the connecting rod 8 is slidably assembled with the inner wall of the guide frame 9, and the guide frame 9 plays a limiting role on the rotation of the connecting rod 8, so that the phenomenon that the connecting rod 8 slips in the rotation process is prevented, and the use safety of the device is improved.
Referring to fig. 1, a cross arm 10 is connected with a connecting rod 8 through a rotating arm 7, one end of the connecting rod 8 is connected with a connecting plate 6 in an adaptive manner, and the rotating arm 7 is driven to do swing arm movement through rotation of the connecting rod 8, so that the cross arm 10 is driven to synchronously move, and automatic material taking and bag sealing work of the device is realized.
Referring to fig. 2, the output ends of the hydraulic cylinder 4, the air cylinder 12 and the heat sealing plate 15 are all connected with an external power supply through cables, and the stable operation of the device is ensured through electric connection with the external power supply.
Working principle: in the use, mounting panel 1 installs the device with external equipment, establish coordinated control through between external equipment pneumatic cylinder 4 and the cylinder 12, when getting the material to encapsulation bag 16, pneumatic cylinder 4 outwards pushes up hydraulic stem 3, play the supporting role to pneumatic cylinder 4 through fixed block 5, hydraulic stem 3 promotes connecting rod 8 and makes the gyro wheel 17 of rotating arm 7 one end drive connecting plate 6 inboard, remove in slide rail 2, the other end promotion xarm 10 of rotating arm 7 is forward extended simultaneously, connecting rod 8 rotation department carries out spacingly through leading truck 9, guarantee connecting rod 8 position's accuracy in the rotation in-process, prevent connecting rod 8 slippage, at this moment, through external equipment drive cylinder 12, cylinder 12 installs through fixing base 11, cylinder 12 forward ejection connecting rod 13 makes rotation piece 14 be in the open state, thermal seal board 15 opens and presss from both sides and get the envelope processing, realize the envelope work, at this moment, drive connecting rod 8 is to retrieving, the clamp of heat seal board 15 is got and is fallen the encapsulation bag 16 and is carried to next station, accomplish the envelope action, get into next work cycle, lower work efficiency is improved, simultaneously, lower manual work is invested in the cost is lower than the manufacturing cost of graphite device in the manufacturing process, the invention is greatly solved.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention.
Claims (6)
1. The utility model provides a semiconductor graphite device encapsulation mechanism, includes mounting panel (1) and heat-seal plate (15), its characterized in that: the hydraulic device comprises a mounting plate (1), wherein a fixed block (5) is arranged on one side of the mounting plate (1), a hydraulic cylinder (4) is arranged at the front end of the fixed block (5), a hydraulic rod (3) is arranged at one end of the hydraulic cylinder (4), a sliding rail (2) is arranged at the front end of the mounting plate (1), a connecting plate (6) is arranged on one side of the sliding rail (2), a rotating arm (7) is arranged on one side of the connecting plate (6), a connecting rod (8) is connected to the lower end of the rotating arm (7), and a guide frame (9) is arranged on one side of the connecting rod (8);
the novel heat sealing device is characterized in that a cross arm (10) is arranged at one end of the rotating arm (7), a fixing seat (11) is arranged above the cross arm (10), an air cylinder (12) is arranged on one side of the fixing seat (11), a connecting rod (13) is arranged on one side of the air cylinder (12), a rotating piece (14) is arranged below the connecting rod (13), a heat sealing plate (15) is arranged on one side of the rotating piece (14), and a sealing bag (16) is arranged on the inner side of the heat sealing plate (15).
2. The semiconductor graphite device packaging mechanism according to claim 1, wherein rollers (17) are arranged on the inner wall of the sliding rail (2), and one end of each roller (17) is assembled with the connecting plate (6).
3. The semiconductor graphite device packaging mechanism according to claim 1, wherein the output end of the hydraulic cylinder (4) is mutually sleeved with the hydraulic rod (3), and one end of the hydraulic rod (3) is connected with the connecting rod (8).
4. A semiconductor graphite device packaging mechanism according to claim 1, wherein the outer wall of the connecting rod (8) is slidingly assembled with the inner wall of the guide frame (9).
5. The packaging mechanism of the semiconductor graphite device according to claim 1, wherein the cross arm (10) is connected with the connecting rod (8) through the rotating arm (7), and one end of the connecting rod (8) is connected with the connecting plate (6) in an adapting mode.
6. The semiconductor graphite device packaging mechanism according to claim 1, wherein the output ends of the hydraulic cylinder (4), the air cylinder (12) and the heat sealing plate (15) are all connected with an external power supply through cables.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310448934.0A CN116504674A (en) | 2023-04-24 | 2023-04-24 | Semiconductor graphite device encapsulation mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310448934.0A CN116504674A (en) | 2023-04-24 | 2023-04-24 | Semiconductor graphite device encapsulation mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116504674A true CN116504674A (en) | 2023-07-28 |
Family
ID=87324163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310448934.0A Withdrawn CN116504674A (en) | 2023-04-24 | 2023-04-24 | Semiconductor graphite device encapsulation mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116504674A (en) |
-
2023
- 2023-04-24 CN CN202310448934.0A patent/CN116504674A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20230728 |
|
| WW01 | Invention patent application withdrawn after publication |