CN116500054B

CN116500054B - Micro-LED detection device

Info

Publication number: CN116500054B
Application number: CN202310758442.1A
Authority: CN
Inventors: 肖永能; 胡强; 郭晓东; 侯少毅; 祝经明
Original assignee: Individual
Current assignee: Individual
Priority date: 2023-06-26
Filing date: 2023-06-26
Publication date: 2023-11-07
Anticipated expiration: 2043-06-26
Also published as: CN116500054A

Abstract

The application relates to the technical field of semiconductors, in particular to a Micro-LED detection device, which comprises: the device comprises a box body, a feeding mechanism and a chuck mechanism; the inner wall of the box body is provided with a test group, and the test group comprises a plurality of laser generating parts and a plurality of first laser receiving ends; the chuck mechanism comprises a first fixing frame, a first chuck and a plurality of second laser receiving ends, the first chuck and the plurality of second laser receiving ends are arranged on the first fixing frame, the first chuck is used for clamping a wafer, the chuck mechanism is connected with the feeding mechanism, and the feeding mechanism is used for driving the first fixing frame to convey the wafer into the box body; the plurality of laser generating parts are used for providing laser irradiation of different angles for the wafer, and each first laser receiving end and each second laser receiving end are used for receiving reflected light irradiated by at least two laser generating parts and reflected by the wafer, so that the overall detection effect of the wafer is more accurate.

Description

Micro-LED detection device

Technical Field

The application relates to the technical field of semiconductors, in particular to a Micro-LED detection device.

Background

With the development of technology, micro-LEDs are being developed as new LED structures, because the Micro-LEDs have higher requirements for crystallization state and crystallization orientation of functional layers, micro-LEDs need to grow on highly crystallized wafers, and as the wafer size increases, the number of Micro-LEDs manufactured increases, and the production efficiency increases, but the larger the wafer size, the more difficult the surface cleanliness of the wafer is to be controlled, and the surface cleanliness of the wafer affects the uniformity of film formation, so that the production effect is determined, and therefore, the surface cleanliness of the wafer needs to be detected.

Patent document CN110943002B discloses a wafer, a wafer detecting system and a wafer detecting method, the system comprises a laser generator, a light transmission channel, a light detecting channel and a moving platform, the wafer to be detected is placed on the moving platform, but in actual use, the method can only detect a single wafer placed on the moving platform, the emitting direction of a laser beam is single, the whole detecting effect is poor, and meanwhile, the moving platform is easy to incline when used for feeding the wafer, so that the laser detecting result is affected, and the detecting processing requirement cannot be well met.

In view of the above problems, no effective technical solution is currently available.

Disclosure of Invention

The application aims to provide a Micro-LED detection device which can realize detection treatment (detection of the cleanliness of the surface of a wafer) of a plurality of angles of the surface of the wafer, so that the overall detection effect of the wafer is more accurate.

The application provides a detection device of Micro-LEDs, which is applied to appearance detection of wafers and comprises the following components: the device comprises a box body, a feeding mechanism and a chuck mechanism;

the inner wall of the box body is provided with a test group, the test group comprises a plurality of laser generating parts and a plurality of first laser receiving ends, the front side of the box body is provided with an opening, and the opening is used for the chuck mechanism to enter the inner cavity of the box body;

the chuck mechanism comprises a first fixing frame, a first chuck and a plurality of second laser receiving ends, the first chuck and the plurality of second laser receiving ends are arranged on the first fixing frame, the first chuck is used for clamping a wafer, the chuck mechanism is connected with the feeding mechanism, and the feeding mechanism is used for driving the first fixing frame to convey the wafer into the box body;

the plurality of laser generating parts are used for providing laser irradiation of different angles for the wafer, and each first laser receiving end and each second laser receiving end are used for receiving reflected light irradiated by at least two laser generating parts and reflected by the wafer.

By the arrangement, the detection processing (the detection of the cleanliness of the surface of the wafer) of a plurality of angles on the surface of the wafer is realized, so that the overall detection effect of the wafer is more accurate.

Optionally, the automatic feeding device comprises a plurality of chuck mechanisms and a transmission rod assembly, wherein the chuck mechanisms are arranged on the transmission rod assembly at intervals along the up-down direction, the transmission rod assembly is connected with the feeding mechanism, and the transmission rod assembly is used for adjusting the up-down positions of the chuck mechanisms.

Optionally, the testing device comprises a plurality of testing groups, wherein the testing groups are arranged at intervals along the upper and lower directions of the inner wall of the box body, and each testing group corresponds to one chuck mechanism.

Through setting up a plurality of test groups, and every test group corresponds a chuck mechanism, can detect a plurality of wafers respectively simultaneously to be favorable to improving detection efficiency.

Optionally, the first chuck includes first clamping part and two stopper, first clamping part and two the stopper sets up relatively on the first mount, first clamping part and two can place between the stopper the wafer, first clamping part can keep away from or be close to two the stopper removes in order to loosen or press from both sides tightly the wafer.

Through the arrangement, the stability of the wafer in the process of entering the box body can be improved, and the influence of the inclination of the wafer on the detection effect can be avoided.

Optionally, the shapes of the surfaces of the first clamping part and the two limiting blocks, which are in contact with the wafer, are arc shapes which are matched with the circumference of the wafer.

Optionally, the both sides of first mount are provided with the roating seat respectively, the roating seat with first mount hub connection, the roating seat can be relative first mount rotates, the roating seat is used for fixing the second laser receiving end.

Optionally, the two limiting blocks are provided with energy absorbing parts, and the energy absorbing parts are used for buffering impact force between the wafer and the two limiting blocks.

Optionally, the front side at the top of box is provided with fan and a plurality of air outlet, the fan is used for to a plurality of the air outlet air supply, a plurality of the air outlet orientation the bottom direction of box sets up and is used for down blowing to form the curtain.

Optionally, the two limiting blocks are rotationally connected with the first fixing frame through a rotating device, so that the limiting blocks are attached to the wafer.

Optionally, the transfer line subassembly includes connecting seat, transmission case, first driving motor and lead screw, be provided with on the transmission case the connecting seat with the lead screw, the connecting seat be used for with feeding mechanism connects, the lead screw with chuck mechanism screw thread drive connection, first driving motor is used for the drive the lead screw reciprocating rotation is in order to adjust chuck mechanism's upper and lower position.

The beneficial effects are that: according to the detection device for the Micro-LEDs, provided by the application, the plurality of laser generating parts, the plurality of first laser receiving ends and the plurality of second laser receiving ends are arranged, the plurality of laser generating parts provide laser irradiation at different angles for the wafer, and each first laser receiving end and each second laser receiving end are used for receiving reflected light irradiated by at least two laser generating parts and reflected by the wafer, so that detection treatment (detection of the cleanliness of the surface of the wafer) at a plurality of angles on the surface of the wafer is realized, and the overall detection effect of the wafer is more accurate.

Drawings

Fig. 1 is a schematic diagram of the overall structure of the Micro-LED detection device provided by the application.

Fig. 2 is a schematic diagram of a partial structure of a Micro-LED detection device according to the present application.

Fig. 3 is a schematic structural diagram of a chuck mechanism according to the present application.

Fig. 4 is a schematic structural diagram of a test set according to the present application.

FIG. 5 is a schematic diagram of an energy absorbing assembly according to the present application.

Description of the reference numerals: 10. a case; 20. a test group; 21. a laser generating section; 22. a first laser receiving end; 30. a chuck mechanism; 31. a first fixing frame; 32. a first clamping part; 33. a limiting block; 34. a second laser receiving end; 35. a rotating seat; 41. a blower; 42. an air outlet; 43. a rotating device; 44. a connecting seat; 45. a transmission case; 46. a first driving motor; 50. an energy absorbing assembly; 51. an energy absorbing plate; 52. a telescopic rod; 53. a connection pad; 54. an energy absorbing pad; 55. a compression spring; 61. a driving seat; 62. a first mechanical arm; 63. a second mechanical arm; 64. and a connecting piece.

Detailed Description

The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present application.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only to distinguish the description, and are not to be construed as indicating or implying relative importance.

Referring to fig. 1 to 5, fig. 1 is a schematic diagram of an overall structure of a Micro-LED inspection device according to an embodiment of the present application, so as to implement inspection processing (inspection of cleanliness of a wafer surface) for multiple angles of the wafer surface, thereby enabling an overall inspection effect of the wafer to be more accurate.

The application provides a detection device of Micro-LEDs, which is applied to appearance detection of wafers and comprises the following components: a box body 10, a feeding mechanism and a chuck mechanism 30;

the inner wall of the box body 10 is provided with a test group 20, the test group 20 comprises a plurality of laser generating parts 21 and a plurality of first laser receiving ends 22, the front side of the box body 10 is provided with an opening, and the opening is used for allowing the chuck mechanism 30 to enter the inner cavity of the box body 10;

the chuck mechanism 30 comprises a first fixing frame 31, a first chuck and a plurality of second laser receiving ends 34, the first chuck and the plurality of second laser receiving ends 34 are arranged on the first fixing frame 31, the first chuck is used for clamping a wafer, the chuck mechanism 30 is connected with a feeding mechanism, and the feeding mechanism is used for driving the first fixing frame 31 to send the wafer into the box body 10;

the plurality of laser light generating parts 21 are configured to provide laser light irradiation at different angles to the wafer, and each of the first laser light receiving ends 22 and each of the second laser light receiving ends 34 is configured to receive reflected light irradiated by at least two of the laser light generating parts 21 and reflected by the wafer.

Specifically, as shown in fig. 1, by providing a plurality of laser generating portions 21, a plurality of first laser receiving ends 22 and a plurality of second laser receiving ends 34, laser irradiation at different angles is provided to the wafer by the plurality of laser generating portions 21, and each of the first laser receiving ends 22 and each of the second laser receiving ends 34 is configured to receive reflected light irradiated by at least two laser generating portions 21 and reflected by the wafer, thereby realizing detection processing (detection of cleanliness of the wafer surface) at a plurality of angles on the wafer surface, so that the overall detection effect of the wafer is more accurate.

The inner wall surface of the case 10 is a "U" profile, which includes two parallel side planes facing each other and a semicircular arc profile disposed between the two side planes, as shown in fig. 2, the plurality of laser generating portions 21 of the test group 20 are disposed at intervals on the semicircular arc profile, the plurality of first laser receiving ends 22 of the test group 20 are disposed on the two side planes, as shown in fig. 4, and all the laser generating portions 21 and all the first laser receiving ends 22 of each test group are identical in height.

The processing manner of the data of the first laser receiving end 22 and the second laser receiving end 34 is a prior art, and will not be described in detail herein.

In some embodiments, the chuck mechanism 30 comprises a plurality of chuck mechanisms 30 and a transmission rod assembly, wherein the chuck mechanisms 30 are arranged on the transmission rod assembly at intervals along the up-down direction (as shown in fig. 1), the transmission rod assembly is connected with the feeding mechanism, and the transmission rod assembly is used for adjusting the up-down position of the chuck mechanisms 30.

Specifically, the chuck mechanisms 30 are disposed on the transmission rod assembly at intervals along the vertical direction, and the chuck mechanisms 30 are driven by the feeding mechanism to convey the wafers into the box 10, so that the feeding efficiency of the wafers is improved.

In some embodiments, a plurality of test groups 20 are included, and the plurality of test groups 20 are disposed at intervals along the inner wall of the case 10 in the up-down direction, and each test group 20 corresponds to one chuck mechanism 30.

Specifically, as shown in fig. 2, by providing a plurality of test groups 20, and each test group 20 corresponds to one chuck mechanism 30, a plurality of wafers can be simultaneously and respectively detected, thereby being beneficial to improving the detection efficiency.

In some embodiments, the first chuck includes a first clamping portion 32 and two stoppers 33, the first clamping portion 32 is disposed on the first fixing frame 31 opposite to the two stoppers 33, a wafer can be placed between the first clamping portion 32 and the two stoppers 33, and the first clamping portion 32 can be moved away from or close to the two stoppers 33 to loosen or clamp the wafer.

Specifically, as shown in fig. 3, by setting the first clamping portion 32 to be able to move away from or close to the two limiting blocks 33, the first chuck is capable of clamping the wafer, so as to improve the stability of the wafer in the process of entering the box 10, and avoid the wafer from tilting to affect the detection effect, where the first clamping portion 32 can be driven by the telescopic cylinder to move away from or close to the two limiting blocks 33, and the specific driving mode can be set according to the actual requirement, without specific limitation.

In some embodiments, the surfaces of the first clamping portion 32 and the two limiting blocks 33 contacting the wafer are each arc-shaped to fit the circumference of the wafer, so that the first clamping portion 32 and the two limiting blocks 33 can clamp the wafer more stably.

In some embodiments, two sides of the first fixing frame 31 are respectively provided with a rotating seat 35, the rotating seat 35 is connected with the first fixing frame 31 in a shaft manner, the rotating seat 35 can rotate relative to the first fixing frame 31, and the rotating seat 35 is used for fixing the second laser receiving end 34.

Specifically, as shown in fig. 3, by setting the rotating seats 35, the position of the second laser receiving end 34 can be adjusted according to actual needs, where the first fixing frame 31 includes a cross bar and two vertical bars, one ends of the two vertical bars are used for setting the limiting block 33, the other ends are all vertically connected with the cross bar and are set along the length direction of the cross bar at intervals, the rotating seats 35 are set on the cross bar of the first fixing frame 31, at least one second laser receiving end 34 is set on each rotating seat 35, preferably, two sides of the first fixing frame 31 are respectively provided with one rotating seat 35, one second laser receiving end 34 is set on each rotating seat 35, and the number of the second laser receiving ends 34 of each rotating seat 35 can be set according to actual needs.

In some embodiments, the two limiting blocks 33 are provided with energy absorbing portions, and the energy absorbing portions are used for buffering impact force between the wafer and the two limiting blocks 33.

Specifically, when the first clamping portion 32 moves close to the two limiting blocks 33 to clamp the wafer, a certain impact force is generated between the wafer and the two limiting blocks 33, so that an energy absorbing portion (not shown in the figure) is disposed on each limiting block 33, so as to be beneficial to protecting the wafer, wherein the energy absorbing portion is disposed inside the limiting block 33, and the material of the energy absorbing portion is rubber.

In some embodiments, a fan 41 and a plurality of air outlets 42 are provided at a front side of a top of the case 10, the fan 41 is configured to supply air to the plurality of air outlets 42, and the plurality of air outlets 42 are provided toward a bottom direction of the case 10 and configured to blow air downward to form a curtain.

Specifically, as shown in fig. 1, by arranging the blower 41 and the plurality of air outlets 42, a top-down air curtain is formed at the opening of the box 10, and when the wafer is fed and discharged, the blower 41 blows air to the plurality of air outlets 42, so that dust is reduced to enter the box 10, and the detection effect is improved.

In some embodiments, both the stoppers 33 are rotatably connected to the first fixing frame 31 by a rotating device 43, so that the stoppers 33 are attached to the wafer.

Specifically, as shown in fig. 3, the two limiting blocks 33 are better attached to the wafer by the rotating device 43, so that stability and safety of the wafer in the loading and unloading process are improved.

In some embodiments, the transmission rod assembly includes a connection base 44, a transmission case 45, a first driving motor 46, and a screw, the transmission case 45 is provided with the connection base 44 and the screw, the connection base 44 is used for being connected with the feeding mechanism, the screw is in threaded driving connection with the chuck mechanism 30, and the first driving motor 46 is used for driving the screw to reciprocate to adjust the upper and lower positions of the chuck mechanism 30.

Specifically, as shown in fig. 1 and 2, through the transmission rod assembly provided in the above manner, not only can a plurality of wafers be simultaneously fed, but also the vertical position of the chuck mechanism 30 can be adjusted.

In some embodiments, the bottom of the case 10 is provided with four energy absorbing assemblies 50, and the four energy absorbing assemblies 50 are used to support the case 10 to avoid shaking of the case 10.

In some embodiments, the energy absorbing assembly 50 includes an energy absorbing plate 51, a telescopic rod 52, a connection pad 53 and an energy absorbing pad 54, wherein an upper surface of the energy absorbing plate 51 is fixedly connected with a bottom of the case 10, a lower surface of the energy absorbing plate 51 is connected with an upper end of the telescopic rod 52, a lower end of the telescopic rod 52 is fixedly connected with the connection pad 53, a compression spring 55 is further disposed on the telescopic rod 52, the connection pad 53 is connected with the energy absorbing pad 54, and the energy absorbing pad 54 is used for contacting with the ground.

Specifically, as shown in fig. 1 and 5, the total weight of the case 10 extrudes the telescopic rod 52 through the energy-absorbing plate 51, when the telescopic rod 52 extrudes the compression spring 55 while contracting, the compression spring 55 reduces the shaking of the case 10 by using the self elastic force, and the contact effect of the case 10 and the ground can be improved by arranging the energy-absorbing pad 54 in contact with the ground, so that shaking of the case 10 can be avoided, the stability of the case 10 can be improved, the compression effect of the compression spring 55 can be ensured by the collapsing of the telescopic rod 52, and the materials of the energy-absorbing plate 51 and the energy-absorbing pad 54 are rubber.

In some embodiments, the feeding mechanism includes a driving seat 61, a first mechanical arm 62, a second mechanical arm 63, and a connecting piece 64, where the first mechanical arm 62 is connected to the second mechanical arm 63, the second mechanical arm 63 is fixedly provided with the connecting piece 64, the connecting piece 64 is used to connect with the connecting seat 44 on the transmission case 45, the first mechanical arm 62 is fixed on the driving seat 61, the driving seat 61 is used to drive the rotation direction of the first mechanical arm 62, and the first mechanical arm 62 and the second mechanical arm 63 can swing up and down (the driving manner is in the prior art, and is not limited herein) to realize the up and down positions of the transmission rod assembly, as shown in fig. 1 and 2, where the specific embodiment of the feeding mechanism is not limited thereto.

In the embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other manners. The above-described apparatus embodiments are merely illustrative, for example, the division of units is merely a logical function division, and there may be other manners of division in actual implementation, and for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some communication interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form.

Further, the units described as separate units may or may not be physically separate, and units displayed as units may or may not be physical units, may be located in one place, or may be distributed over a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

Furthermore, functional modules in various embodiments of the present application may be integrated together to form a single portion, or each module may exist alone, or two or more modules may be integrated to form a single portion.

In this document, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.

The above embodiments of the present application are only examples, and are not intended to limit the scope of the present application, and various modifications and variations will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. Detection device of Micro-LED is applied to the outward appearance detection of wafer, and its characterized in that includes: the device comprises a box body (10), a feeding mechanism and a chuck mechanism (30);

the inner wall of the box body (10) is provided with a test group (20), the test group (20) comprises a plurality of laser generating parts (21) and a plurality of first laser receiving ends (22), the front side of the box body (10) is provided with an opening, and the opening is used for the chuck mechanism (30) to enter the inner cavity of the box body (10);

the chuck mechanism (30) comprises a first fixing frame (31), a first chuck and a plurality of second laser receiving ends (34), wherein the first chuck and the plurality of second laser receiving ends (34) are arranged on the first fixing frame (31), the first chuck is used for clamping a wafer, the chuck mechanism (30) is connected with the feeding mechanism, and the feeding mechanism is used for driving the first fixing frame (31) to convey the wafer into the box body (10);

the plurality of laser generating parts (21) are used for providing laser irradiation of different angles for the wafer, and each first laser receiving end (22) and each second laser receiving end (34) are used for receiving reflected light irradiated by at least two laser generating parts (21) and reflected by the wafer;

the feeding mechanism comprises a transmission rod assembly and a plurality of chuck mechanisms (30), wherein the chuck mechanisms (30) are arranged on the transmission rod assembly at intervals along the up-down direction, the transmission rod assembly is connected with the feeding mechanism, and the transmission rod assembly is used for adjusting the up-down positions of the chuck mechanisms (30);

the test device comprises a plurality of test groups (20), wherein the test groups (20) are arranged at intervals along the upper and lower directions of the inner wall of the box body (10), each test group (20) corresponds to one chuck mechanism (30), and all the laser generating parts (21) and all the first laser receiving ends (22) of each test group are identical in height;

both sides of the first fixing frame (31) are respectively provided with a rotating seat (35), and the rotating seats (35) are used for fixing the second laser receiving ends (34).

2. The Micro-LED detection device according to claim 1, wherein the first chuck comprises a first clamping part (32) and two limiting blocks (33), the first clamping part (32) and the two limiting blocks (33) are oppositely arranged on the first fixing frame (31), the wafer can be placed between the first clamping part (32) and the two limiting blocks (33), and the first clamping part (32) can move away from or close to the two limiting blocks (33) to loosen or clamp the wafer.

3. The Micro-LED detection device according to claim 2, wherein the first clamping portion (32) and the two limiting blocks (33) are both arc-shaped in shape adapted to the circumference of the wafer, and the surfaces of the limiting blocks in contact with the wafer.

4. The Micro-LED detection device according to claim 1, wherein the swivel base (35) is pivotally connected to the first mount (31), and the swivel base (35) is rotatable relative to the first mount (31).

5. The Micro-LED detection device according to claim 2, wherein both the limiting blocks (33) are provided with energy absorbing portions for buffering impact forces between the wafer and both the limiting blocks (33).

6. The Micro-LED detection device according to claim 1, wherein a fan (41) and a plurality of air outlets (42) are arranged on the front side of the top of the box body (10), the fan (41) is used for supplying air to a plurality of the air outlets (42), and the air outlets (42) are arranged towards the bottom direction of the box body (10) and are used for blowing downwards to form an air curtain.

7. The Micro-LED detection device according to claim 2, wherein both the limiting blocks (33) are rotatably connected to the first fixing frame (31) through a rotation device (43), so that the limiting blocks (33) are attached to the wafer.

8. The Micro-LED detection device according to claim 1, wherein the transmission rod assembly comprises a connection seat (44), a transmission case (45), a first driving motor (46) and a screw rod, the transmission case (45) is provided with the connection seat (44) and the screw rod, the connection seat (44) is used for being connected with the feeding mechanism, the screw rod is in threaded driving connection with the chuck mechanism (30), and the first driving motor (46) is used for driving the screw rod to rotate reciprocally to adjust the upper position and the lower position of the chuck mechanism (30).