CN116487293B - Micropore filling device and micropore filling method - Google Patents
Micropore filling device and micropore filling method Download PDFInfo
- Publication number
- CN116487293B CN116487293B CN202310450469.4A CN202310450469A CN116487293B CN 116487293 B CN116487293 B CN 116487293B CN 202310450469 A CN202310450469 A CN 202310450469A CN 116487293 B CN116487293 B CN 116487293B
- Authority
- CN
- China
- Prior art keywords
- hole
- target substrate
- liquid
- jig plate
- controller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 54
- 239000007788 liquid Substances 0.000 claims abstract description 375
- 238000002347 injection Methods 0.000 claims abstract description 255
- 239000007924 injection Substances 0.000 claims abstract description 255
- 239000000758 substrate Substances 0.000 claims abstract description 191
- 238000003860 storage Methods 0.000 claims abstract description 51
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000004381 surface treatment Methods 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 9
- 239000002699 waste material Substances 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 12
- 239000011521 glass Substances 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 238000007639 printing Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 230000009977 dual effect Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000005361 soda-lime glass Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The application discloses micropore filling device and method, the device comprises a liquid injection system, a bearing system and a control system, wherein the liquid injection system comprises a liquid storage tank, a liquid injection tank and a liquid supply pipe for communicating the liquid storage tank and the liquid injection tank, the bottom of the liquid injection tank is provided with an opening, a jig plate is arranged, the jig plate covers the opening at the bottom of the liquid injection tank, and the opening at the bottom of the liquid injection tank exposes each first through hole in the jig plate; a target substrate with a plurality of second through holes to be filled is placed on a workbench in the bearing system; during operation, the second controller in the control system controls the liquid injection system and the bearing system, so that the first through holes in the jig plate are attached to the second through holes in the target substrate in a one-to-one correspondence manner, the first controller on the liquid supply pipe in the control system is further adjusted, and the second through holes in the target substrate are subjected to point-to-point pressurizing injection filling, so that the filling effect is ensured, the waste of conductive liquid is avoided, the material cost is reduced, and the filling efficiency is greatly improved.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a micropore filling device and a micropore filling method.
Background
As wafer fabrication processes continue to shrink, moore's law approaches a limit and packaging technology is gradually evolving towards 2.5D/3D packaging. The 2.5D package is a package technology in which an intermediate layer is placed between a substrate and a chip, the intermediate layer is connected to an upper portion and a lower portion through a through hole, and the 3D package is also called a stacked chip package technology, in which two or more chips are stacked in a vertical direction in the same package body without changing the size of the package body. Through Silicon Via (TSV) and glass via (TGV) are becoming increasingly important as core technologies for 2.5D/3D packages. The through silicon hole technology is to punch holes on a wafer, and the glass through hole technology is to punch holes on a glass sheet, so that conductive materials are filled in the through holes to realize interconnection between chips and interconnection between the chips and a substrate.
At present, the metallization filling of the through silicon vias and the glass vias is mainly realized by printing conductive liquid on the whole surface of a silk screen, specifically, the conductive liquid is introduced into the vias by the self gravity of the conductive liquid and the pushing action of a scraper on the conductive liquid in the printing process, so that the metallization in the vias is realized.
However, when the conductive liquid is printed on the whole surface of the silk screen to fill the micropores, the conductive liquid overflows a large amount of metal in the back and forth printing process, so that the material cost is high, the printing speed of the conductive liquid is low, the metal filling effect in the holes can be guaranteed to be good, and therefore the filling efficiency is low.
Disclosure of Invention
In order to solve the technical problems, embodiments of the present application provide a micropore filling device and a micropore filling method, so as to reduce material cost and improve filling efficiency.
In order to achieve the above purpose, the embodiment of the present application provides the following technical solutions:
a micropore filling device comprises a liquid injection system, a bearing system and a control system, wherein,
the liquid injection system comprises a liquid storage tank, a liquid injection tank and a liquid supply pipe communicated with the liquid storage tank and the liquid injection tank, wherein the liquid storage tank is used for storing conductive liquid; the liquid injection groove is provided with a top, a bottom and side walls, wherein the top and the bottom are oppositely arranged, the side walls encircle the top and the bottom, the top of the liquid injection groove is communicated with the liquid supply pipe, the bottom of the liquid injection groove is provided with an opening, the bottom of the liquid injection groove is provided with a jig plate, the jig plate covers the opening, the jig plate is provided with a plurality of first through holes penetrating through, and the opening exposes each first through hole;
the bearing system comprises a workbench, wherein the workbench is used for placing a target substrate, and the target substrate is provided with a plurality of second through holes to be filled;
the control system comprises a first controller and a second controller, wherein the first controller is arranged on the liquid supply pipe and is used for controlling the injection pressure and the injection time of the conductive liquid; the second controller is used for controlling the liquid injection system and the bearing system, so that the first through holes in the jig plate and the second through holes in the target substrate are in one-to-one alignment fit or separation.
Optionally, the liquid storage tank storing the conductive liquid is a vacuum-tight chamber.
Optionally, the second controller includes a first sub-controller and a second sub-controller, wherein,
the first sub-controller is used for controlling the workbench in the bearing system to move and/or rotate in the plane where the workbench is located, so that the first through holes in the jig plate and the second through holes in the target substrate are aligned one by one;
the second sub-controller is used for controlling the liquid injection system to move towards the direction close to the bearing system so that the jig plate is attached to the target substrate, or controlling the liquid injection system to move towards the direction far away from the bearing system so that the jig plate is separated from the target substrate.
Optionally, the aperture of the first through hole in the jig plate on the surface where the jig plate is attached to the target substrate is a first aperture d1, and the aperture of the second through hole in the target substrate on the surface where the target substrate is attached to the jig plate is a second aperture d2, d1> d2.
A microwell filling method applied to the microwell filling device of any one of the above claims, the method comprising:
storing conductive liquid in the liquid storage tank, and controlling injection pressure and injection time of the conductive liquid by using the first controller, so that the conductive liquid flows out of the liquid storage tank, fills up the liquid injection tank and each first through hole in the jig plate, and eliminates gas in the liquid injection tank and each first through hole in the jig plate;
Placing a target substrate on the workbench, and controlling the liquid supply system and the bearing system by utilizing the second controller so that a first through hole in the jig plate and a second through hole in the target substrate are in one-to-one alignment fit;
controlling the injection pressure and the injection time of the conductive liquid by using the first controller, so that the conductive liquid flows out of a first through hole in the jig plate and is correspondingly filled into a second through hole in the target substrate;
and after filling of the second through holes in the target substrate is completed, controlling the liquid supply system and the bearing system by using the second controller so that the jig plate and the target substrate are separated.
Optionally, after storing the conductive liquid in the reservoir, the method further comprises:
and vacuumizing the liquid storage tank, so that the liquid storage tank storing the conductive liquid is a vacuum airtight chamber.
Optionally, the second controller includes a first sub-controller and a second sub-controller, and the liquid supply system and the bearing system are controlled by using the second controller, so that the one-to-one alignment lamination of the first through hole in the jig board and the second through hole in the target substrate includes:
The first sub-controller is used for controlling a workbench in the bearing system to move and/or rotate in a plane where the workbench is located, so that a first through hole in the jig plate and a second through hole in the target substrate are aligned one by one;
the second sub-controller is used for controlling the liquid injection system to move towards the direction close to the bearing system, so that the jig plate is attached to the target substrate, and the first through holes in the jig plate are attached to the second through holes in the target substrate in a one-to-one alignment manner;
controlling the liquid supply system and the bearing system by using the second controller, so that the jig plate and the target substrate are separated, wherein the method comprises the following steps:
and controlling the liquid injection system to move in a direction far away from the bearing system by utilizing the second sub-controller, so that the jig plate and the target substrate are separated.
Optionally, controlling the injection pressure and injection time of the conductive liquid by using the first controller, so that the conductive liquid flows out from a first through hole in the jig plate, and correspondingly filling into a second through hole in the target substrate includes:
adjusting the first controller so that the conductive liquid flows out of the first through hole in the jig plate under a first injection pressure in a first period of time, and correspondingly fills into the second through hole in the target substrate;
Before controlling the liquid supply system and the carrying system by the second controller so that the jig plate and the target substrate are separated, the method further comprises:
the first controller is adjusted such that the conductive liquid flows out of the first through hole in the jig plate at a second injection pressure, and the second through hole in the target substrate is overfilled so as to form a bump at a hole face of the second through hole, in a second period, the second injection pressure being smaller than the first injection pressure.
Optionally, the method further comprises:
and baking the target substrate after the second through holes are filled, so that the filled conductive liquid is solidified.
Optionally, the method further comprises:
and carrying out surface treatment on the baked target substrate, and removing the cured protrusion, so that the hole surface of the second through hole is flush with the surface of the target substrate.
Compared with the prior art, the technical scheme has the following advantages:
the micropore filling device comprises a liquid injection system, a bearing system and a control system, wherein the liquid injection system comprises a liquid storage tank, a liquid injection tank and a liquid supply pipe for communicating the liquid storage tank and the liquid injection tank, the bottom of the liquid injection tank is provided with an opening, the bottom of the liquid injection tank is provided with a jig plate, the jig plate covers the opening at the bottom of the liquid injection tank, and the opening at the bottom of the liquid injection tank exposes each first through hole penetrating through the jig plate; a target substrate is placed on a workbench in the bearing system, and the target substrate is provided with a plurality of second through holes to be filled; during specific work, the second controller in the control system controls the liquid injection system and the bearing system, so that the first through holes in the jig plate are attached to the second through holes in the target substrate in a one-to-one correspondence manner, the first controller located on the liquid supply pipe in the control system is adjusted, conductive liquid is injected into the second through holes in the target substrate from the liquid storage tank through the liquid supply pipe, the liquid injection groove and the first through holes in the jig plate, namely, the micropore filling device provided by the embodiment of the application can perform point-to-point pressurizing injection filling on the second through holes in the target substrate, the injection pressure and the injection time of the conductive liquid can be accurately controlled through the first controller in the injection process, the injection quantity of the conductive liquid is controlled, the waste of the conductive liquid is avoided while the filling effect is ensured, the material cost is reduced, and the filling efficiency is greatly improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a micropore filling device according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of the micro-hole filling device provided in the embodiment of the present application when a first through hole in a jig plate and a second through hole in a target substrate are aligned and bonded one to one;
fig. 3 is a schematic perspective view of a micro-hole filling device according to an embodiment of the present application when a first through hole in a jig plate and a second through hole in a target substrate are aligned and attached one to one;
fig. 4 is a schematic top view of the micro-hole filling device according to the embodiment of the present application when the first through hole in the jig plate and the second through hole in the target substrate are aligned and attached one to one;
FIG. 5 is a schematic view of the section AA' of FIG. 4;
fig. 6 is a schematic structural diagram of a micropore filling device provided in an embodiment of the present application, in which a conductive liquid flows out from a first through hole in a jig plate and is injected into a second through hole in a target substrate;
Fig. 7 is a schematic structural diagram of the micro-hole filling device provided in the embodiment of the present application after the second through hole in the target substrate is filled, where the jig plate and the target substrate are separated;
FIG. 8 is a schematic flow chart of a method for filling micro-holes according to an embodiment of the present disclosure;
FIG. 9 is a schematic flow chart of another method for filling micro-holes according to an embodiment of the present disclosure;
fig. 10 is a schematic diagram of baking a target substrate after filling a second through hole in the micro hole filling method provided in the embodiment of the present application, so that the filled conductive liquid is cured;
fig. 11 is a schematic diagram of performing surface treatment on a baked target substrate and removing the cured bump in the micropore filling method provided in the embodiment of the present application, so that the empty surface of the second through hole is flush with the surface of the target substrate.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
As described in the background art, when the conductive liquid is printed on the whole surface of the screen to fill the micropores, the conductive liquid overflows a large amount of metal in the back and forth printing process, so that the material cost is high, and the printing speed of the conductive liquid is low to ensure that the metal filling effect in the holes is good, so that the filling efficiency is low.
In view of this, an embodiment of the present application provides a micropore filling device, fig. 1 shows a schematic structural diagram of the micropore filling device provided in the embodiment of the present application, as shown in fig. 1, the micropore filling device includes a liquid injection system 100, a bearing system 200, and a control system 300, where:
the liquid injection system 100 comprises a liquid storage tank 110, a liquid injection tank 120 and a liquid supply pipe 130 which is communicated with the liquid storage tank 110 and the liquid injection tank 120, wherein the liquid storage tank 110 is used for storing conductive liquid 111; the liquid injection groove 120 is provided with a top 121, a bottom 122 and a side wall 123 which surrounds the top 121 and the bottom 122, the top 121 of the liquid injection groove 120 is communicated with the liquid supply pipe 130, the bottom 122 of the liquid injection groove 120 is provided with an opening K1, the bottom 122 of the liquid injection groove 120 is provided with a jig plate 140, the jig plate 140 covers the opening K1, the jig plate 140 is provided with a plurality of first through holes T1 penetrating through, and the opening K1 exposes each first through hole T1;
The carrier system 200 includes a stage 210, where the stage 210 is used to place a target substrate 220, and the target substrate 220 has a plurality of second through holes T2 to be filled;
the control system 300 includes a first controller 310 and a second controller 320, wherein the first controller 310 is disposed on the liquid supply tube 130 and is used for controlling the injection pressure and injection time of the conductive liquid 111; the second controller 320 is used for controlling the liquid injection system 100 and the bearing system 200, so that the first through hole T1 in the jig plate 140 and the second through hole T2 in the target substrate 220 are aligned and attached or separated one by one.
In the embodiment of the present application, as shown in fig. 1, the liquid storage tank 110 has at least a bottom 112 and a side wall 113 surrounding the bottom 112, and the bottom 112 of the liquid storage tank 110 is in communication with the liquid supply pipe 130, so that the conductive liquid 111 stored in the liquid storage tank 110 can flow out from the bottom 112 of the liquid storage tank 110, through the liquid supply pipe 130, and into the liquid filling tank 120.
In the embodiment of the present application, as shown in fig. 1, the liquid injection groove 120 has a top 121 and a bottom 122 disposed opposite to each other, and a side wall 123 surrounding the top 121 and the bottom 122, wherein the top 121 of the liquid injection groove 120 is in communication with the liquid supply pipe 130, so that the conductive liquid 111 can flow out of the liquid supply pipe 130, through the top 121 of the liquid injection groove 120, and into the liquid injection groove 120; the bottom 122 of the liquid injection groove 120 has an opening K1, and the bottom 122 of the liquid injection groove 120 is mounted with a jig plate 140, the jig plate 140 covers the opening K1 of the bottom 122 of the liquid injection groove 120, that is, the top 121 of the liquid injection groove 120, the side wall 123 of the liquid injection groove 120, the bottom 122 of the liquid injection groove 120 and the jig plate 140 enclose a chamber of the liquid injection groove 120, and the opening K1 of the bottom 122 of the liquid injection groove 120 exposes each through-hole T1 in the jig plate 140, so that after the cavity of the liquid injection groove 120 is filled with the conductive liquid 111, the conductive liquid can uniformly flow out from each through-hole T1 in the jig plate 140.
Optionally, as shown in fig. 1, the jig plate 140 may be located at a side of the bottom 122 of the liquid injection groove 120 near the top 121 thereof; alternatively, the jig plate 140 may be disposed on the same layer as the bottom 122 of the liquid injection groove 120, i.e. the jig plate 140 is located at the opening K1 of the bottom 122 of the liquid injection groove 120; still alternatively, the jig plate 140 may be located on a side of the bottom 122 of the liquid injection groove 120 facing away from the top 121 thereof, as the case may be.
Optionally, as shown in fig. 1, the front projection of the opening K1 on the plane of the bottom 122 of the liquid injection groove 120 is located in the front projection range of the plane of the jig plate 140 on the bottom 122 of the liquid injection groove 120, and is surrounded by the front projection of the jig plate 140 on the plane of the bottom 122 of the liquid injection groove 120; alternatively, the front projection of the jig plate 140 on the plane of the bottom 122 of the liquid injection groove 120 may also overlap with the front projection of the opening K1 on the plane of the bottom 122 of the liquid injection groove 120, as the case may be.
In this embodiment, as shown in fig. 1, the second controller 320 is configured to control the liquid injection system 100 and the carrier system 200, and specifically, the second controller 320 may control the carrier system 200 to move and/or rotate, and control the liquid injection system 100 to move, so that the first through hole T1 in the jig plate 140 and the second through hole T2 in the target substrate 220 are attached or detached in a one-to-one alignment manner. The location of the second controller 320 in fig. 1 is merely schematic, and specific needs to be determined according to practical situations.
Fig. 2 is a schematic structural diagram of the micro hole filling device provided in the embodiment of the present application when the first through holes T1 in the jig plate 140 and the second through holes T2 in the target substrate 220 are aligned and bonded one by one, for convenience of understanding, fig. 3 is a schematic perspective diagram of the jig plate 140 when the first through holes T1 in the jig plate 140 and the second through holes T2 in the target substrate 220 are aligned and bonded one by one, fig. 4 is a schematic top view of the jig plate 140 when the first through holes T1 in the jig plate 140 and the second through holes T2 in the target substrate 220 are aligned and bonded one by one, and fig. 5 is a schematic view of the AA' section in fig. 4, so it can be seen that the number of the first through holes T1 in the jig plate 140 and the number of the second through holes T2 in the target substrate 220 are equal, and the positions of the first through holes T1 in the jig plate 140 and the positions of the second through holes T2 in the target substrate 220 are in one by one.
As shown in fig. 1-5, when the second through hole T2 in the target substrate 220 is to be filled with the conductive liquid 111, the second controller 142 is required to control the liquid injection system 100 and the carrier system 200, so that the first through hole T1 in the jig plate 140 and the second through hole T2 in the target substrate 220 are aligned and attached one by one, so that the conductive liquid 111 is injected into the second through hole T2 in the target substrate 220 from the liquid storage tank 110 through the liquid supply pipe 130, the liquid injection tank 120 and the first through hole T1 in the jig plate 140, and the second through hole T2 in the target substrate 220 is filled. After the second through holes T2 in the target substrate 220 are filled, the second controller 320 is used to control the liquid injection system 100 and the carrier system 200, so that the jig plate 140 and the target substrate 220 are separated.
In this embodiment, as shown in fig. 1, the liquid supply pipe 130 is provided with the first controller 310 for controlling the injection pressure and injection time of the conductive liquid 112, so that the injection amount of the conductive liquid 111 can be accurately controlled, and further, the filling effect of the second through holes T2 in the target substrate 220 is ensured, meanwhile, the utilization rate of the conductive liquid is greatly improved, the waste of the conductive liquid is avoided, and the material cost is reduced.
In a specific operation, after the conductive liquid 111 is stored in the liquid storage tank 110 and before the conductive liquid 111 is injected into the second through hole T2 in the target substrate 220, the first controller 320 may be adjusted to make the injection pressure of the conductive liquid 111P 0, so that the conductive liquid 111 flows into the liquid injection tank 120 from the liquid storage tank 110 through the liquid supply pipe 130, fills up the liquid injection tank 120 and each first through hole T1 in the jig plate 140, and eliminates the gas in the liquid injection tank 120 and each first through hole T1 in the jig plate 140, so as to prepare for the subsequent injection of the conductive liquid 111 into the second through hole T2 in the target substrate 220. Here, for clarity of illustration, fig. 1 only shows a case where the conductive liquid 111 fills the liquid filling tank 120 and does not fill each of the first through holes T1 in the jig plate 140.
After the conductive liquid 111 fills up the liquid filling tank 120 and each first through hole T1 in the jig plate 140, the injection pressure of the conductive liquid 111 may be changed to P1 by adjusting the first controller 320, so that the conductive liquid 111 may not flow out of the first through hole T1 in the jig plate 140. In practical applications, the conductive liquid 111 is usually flowed out from the first through hole T1 in the jig plate 140 at the injection pressure P0, and the injection pressure is adjusted to P1 to ensure that the gas in the liquid injection tank 120 and the first through holes T1 in the jig plate 140 is exhausted.
After the target substrate 220 is placed on the workbench 210 and the liquid injection system 100 and the bearing system 200 are controlled by the second controller 320, so that the first through hole T1 in the jig plate 140 and the second through hole T2 in the target substrate 220 are aligned and attached one by one, as shown in fig. 6, the injection pressure of the conductive liquid 111 can be changed to P2 by adjusting the first controller 320, so that the conductive liquid 111 flows out from the first through hole T1 in the jig plate 140 and is correspondingly filled into the second through hole T2 in the target substrate 220;
after the filling of the second through-holes T2 in the target substrate 220 is completed, as shown in fig. 7, the first controller 320 may be adjusted such that the injection pressure of the conductive liquid 111 becomes P3, thereby stopping the injection of the conductive liquid 111 into the second through-holes T2 in the target substrate 220.
It is understood that the injection pressure of the conductive liquid 111 is controlled by adjusting the first controller 320 such that the injection process is ready for injection when the injection pressure is P0, the injection process is stopped when the injection pressures are P1 and P3, and the injection process is performed when the injection pressure is P2.
It will be appreciated that the greater the injection pressure of the conductive liquid 111, the faster the injection rate of the conductive liquid 111, and vice versa, the lesser the injection pressure of the conductive liquid 111, the slower the injection rate of the conductive liquid 111, and thus, in the foregoing processes, P2> P1 and P2> P3 are required, so that the conductive liquid 111 may be injected into the second through hole T2 in the target substrate 220 from the first through hole T1 in the jig plate 140 more quickly during the injection process, wherein P1 and P3 may be equal or unequal.
In each of the above processes, P0> P1 is also required to fill the liquid injection groove 120 and each first through hole T1 in the jig plate 140 with the conductive liquid 111, and to remove the gas in the liquid injection groove 120 and each first through hole T1 in the jig plate 140.
The specific pressure values of the injection pressures P0, P1, P2 and P3 are not limited in this application, and may be specific to the actual situation.
Also, in the foregoing respective processes, the injection time of the conductive liquid 111 can also be controlled by adjusting the first controller 310. It will be appreciated that the longer the injection time, the more the injection amount of the conductive liquid 111, and conversely, the shorter the injection time, the less the injection amount of the conductive liquid 111, and the specific injection time may be dependent on the volume of the conductive liquid 111 to be injected.
Specifically, the first controller 310 may be a high-precision piston pump metering system, which may precisely control the injection pressure and injection time of the conductive liquid 111, so that the injection amount of the conductive liquid 111 may be precisely controlled, and may make the injection amount error of the conductive liquid 111 be ±1.5% (by volume). Moreover, the injection preparation, injection and injection stopping processes can be fully automated in a high-precision piston pump metering system.
In this embodiment, optionally, the target substrate 220 may be a silicon wafer, and the second through hole T2 may be a through silicon via; alternatively, the target substrate 220 may be a glass substrate, such as a soda lime glass substrate, and the second through hole T2 may be a glass through hole. Of course, the target substrate 220 may be another material substrate as long as each of the second through holes T2 in the target substrate 220 needs to be filled with the conductive liquid 111.
In summary, the micropore filling device provided in the embodiments of the present application includes a liquid injection system 100, a bearing system 200 and a control system 300, wherein the liquid injection system 100 includes a liquid storage tank 110, a liquid injection tank 120 and a liquid supply pipe 130 communicating the liquid storage tank 110 and the liquid injection tank 120, the bottom of the liquid injection tank 120 has an opening K1, the bottom of the liquid injection tank 120 is provided with a jig plate 140, the jig plate 140 covers the opening K1 at the bottom of the liquid injection tank 120, and the opening K1 at the bottom of the liquid injection tank 120 exposes each first through hole T1 penetrating through the jig plate 140; a target substrate 220 is placed on the workbench 210 in the bearing system 200, and the target substrate 220 is provided with a plurality of second through holes T2 to be filled; during specific operation, the second controller 320 in the control system 300 controls the liquid injection system 100 and the bearing system 200, so that the first through hole T1 in the jig plate 140 and the second through hole T2 in the target substrate 220 are aligned and attached one by one, and then the first controller 310 on the liquid supply pipe 130 in the control system 300 is adjusted, so that the conductive liquid 111 is injected into the second through hole T2 in the target substrate 220 from the liquid storage tank 110 through the liquid supply pipe 130, the liquid injection tank 120 and the first through hole T1 in the jig plate 140, namely, the micropore filling device provided by the embodiment of the application can perform point-to-point pressurizing injection filling on the second through hole T2 in the target substrate 220, and the injection pressure and the injection time of the conductive liquid 111 can be precisely controlled through the first controller 310 in the injection process, so that the injection quantity of the conductive liquid 111 is controlled, the waste of the conductive liquid is avoided while the filling effect is ensured, the material cost is reduced, and the filling efficiency is greatly improved.
The inventor further researches and discovers that when the conductive liquid is printed on the whole surface of the silk screen to fill the micropores, the conductive liquid is exposed in the air for a long time, so that the conductive liquid is easy to oxidize and dry, in the back and forth printing process, the oxidation and drying of the conductive liquid are accelerated, the fluidity is poor, the resistance value of metal in the holes is increased after the holes are filled, holes are easy to appear in the holes, and the service life of the metal in the holes is short.
Based on this, in the above-described embodiment, optionally, in one embodiment of the present application, as shown in fig. 1, the liquid storage tank 110 storing the conductive liquid 111 is provided as a vacuum-tight chamber, that is, in this embodiment, the liquid storage tank 110 includes a top 114 in addition to a bottom 112 and a side wall 113 surrounding the bottom 112, and the bottom 112 of the liquid storage tank 110 and the top 114 thereof are disposed opposite to each other.
Specifically, after the conductive liquid 111 is stored in the liquid storage tank 110, the liquid storage tank 110 may be vacuumized, so that the liquid storage tank 110 storing the conductive liquid 111 is a vacuum sealed chamber, and then the conductive liquid 111 stored in the liquid storage tank 110 is always in the vacuum sealed chamber, so that the problems of oxidation, drying, poor fluidity and the like caused by long-time contact of the conductive liquid 111 with air are avoided to a great extent, further, the hole filling effect is improved, and the service life of metals in holes is prolonged.
Optionally, in one embodiment of the present application, as shown in fig. 1, the second controller 320 includes a first sub-controller 321 and a second sub-controller 322, where:
the first sub-controller 321 is used for controlling the worktable in the carrying system 200 to move or rotate in the plane where the worktable is located, so that the first through hole T1 in the jig plate 140 and the second through hole T2 in the target substrate 220 are aligned one by one;
the second sub-controller 322 is used for controlling the liquid injection system 100 to move towards the direction approaching the carrier system 200 so that the jig plate 140 is attached to the target substrate 220, or controlling the liquid injection system 100 to move away from the carrier system 200 so that the jig plate 140 is separated from the target substrate 220.
Specifically, the first sub-controller 321 may be a dual high-precision image sensor (Charge Coupled Device, CCD) alignment system, and the dual high-precision CCD alignment system may accurately capture the position of the first through hole T1 in the jig plate 140 and the position of the second through hole T2 in the target substrate 220, so as to control the movement and/or rotation of the working table 210 in the carrier system 200 in the plane thereof, so that the working table 210 carries the target substrate 220 to move and/or rotate together, and further realize one-to-one alignment of the first through hole T1 in the jig plate 140 and the second through hole T2 in the target substrate 220.
The dual-high-precision CCD alignment system may move the table 210 in one direction in the plane of the table 210 at the same time, or may rotate the table 210 in a certain angle in the plane of the table, or may move the table 210 in one direction in the plane of the table 210 and simultaneously rotate the table 210 in a certain angle in the plane of the table, as the case may be.
As shown in fig. 2, fig. 2 further shows an enlarged schematic diagram of when the first through hole T1 in the jig plate 140 and the second through hole T2 in the target substrate 220 are aligned and attached one by one, and optionally, in an embodiment of the present application, the aperture of the first through hole T1 in the jig plate 140 on the surface S1 where the jig plate 140 is attached to the target substrate 220 is a first aperture d1, and the aperture of the second through hole T2 in the target substrate 220 on the surface S2 where the target substrate 220 is attached to the jig plate 140 is a second aperture d2, d1> d2.
That is, in the present embodiment, at the surface S1/S2 where the jig plate 140 is attached to the target substrate 220, the aperture d1 of the first through hole T1 is larger than the aperture d2 of the second through hole T2, which is considered that under the control of the first sub-controller 321 in the second controller 320, there may be a misalignment between the first through hole T1 in the jig plate 140 and the second through hole T2 in the target substrate 220, and therefore, d1> d2 is set to cancel the misalignment between the first through hole T1 in the jig plate 140 and the second through hole T2 in the target substrate 220, so that even if there is a misalignment between the first through hole T1 in the jig plate 140 and the second through hole T2 in the target substrate 220, the second through hole T2 in the target substrate 200 is still located within the corresponding range of the first through hole T1 in the jig plate 140, so that the conductive liquid 111 can still be injected from the first through hole T1 in the jig plate 140 into the second through hole T2 in the target substrate 200.
Specifically, when the first sub-controller 321 is a dual high-precision CCD alignment system, the deviation of the repeated alignment of the dual high-precision CCD alignment system may be ±0.02mm, and at this time, Δd, that is, (d 1-d 2) may be set to be 0.2mm, so as to sufficiently offset the alignment deviation. However, Δd is not limited in this application, and is specifically determined according to the alignment accuracy of the first sub-controller 321.
Alternatively, the jig plate 140 may be made of a soda-lime glass material, and at this time, laser drilling may be performed in the jig plate 140 made of the soda-lime glass material to determine the position of each first through hole T1 in the jig plate 140, and then the position of each first through hole T1 in the jig plate 140 is etched by using a hydrofluoric acid solution, so as to form each first through hole T1 in the jig plate 140. However, the specific material of the jig plate 140 and the manufacturing process for forming each first through hole T1 in the jig plate 140 are not limited in this application, and may be specific as occasion demands.
Alternatively, as shown in fig. 2, the first through hole T1 in the jig plate 140 may be a waist-shaped hole, that is, the middle aperture is small and the two-end aperture is large. However, the specific shape of the first through hole T1 in the jig plate 140 is not limited in this application, and it may be other shapes such as a cylindrical shape and a rectangular shape.
Alternatively, in other embodiments of the present application, d1 may be smaller than d2, or d1 may be equal to d2, so long as the conductive liquid 111 can be injected from the first through hole T1 in the jig plate 140 to the second through hole T2 in the target substrate 220 when the first through hole T1 in the jig plate 140 and the second through hole T2 in the target substrate 220 are aligned one by one.
The embodiment of the application also provides a micropore filling method, which is applied to the micropore filling device provided by any of the embodiments, as shown in fig. 8, and includes:
s100: referring to fig. 1, the conductive liquid 111 is stored in the liquid storage tank 110, and the injection pressure and injection time of the conductive liquid 111 are controlled by the first controller 310 such that the conductive liquid 111 flows out of the liquid storage tank 110, fills each of the first through holes T1 in the liquid injection tank 120 and the jig plate 140, and removes the gas in the liquid injection tank 120 and each of the first through holes T1 in the jig plate 140.
Specifically, in step S100, after the conductive liquid 111 is stored in the liquid storage tank 110 and before the conductive liquid 111 is injected into the second through hole T2 in the target substrate 220, the first controller 320 may be adjusted so that the injection pressure of the conductive liquid 111 is P0, so that the conductive liquid 111 flows into the liquid injection tank 120 from the liquid storage tank 110 through the liquid supply pipe 130, fills up the first through holes T1 in the liquid injection tank 120 and the jig plate 140, and excludes the gas in the liquid injection tank 120 and the first through holes T1 in the jig plate 140, so as to prepare for the subsequent injection of the conductive liquid 111 into the second through hole T2 in the target substrate 220.
After the conductive liquid 111 fills up the liquid filling tank 120 and each first through hole T1 in the jig plate 140, the injection pressure of the conductive liquid 111 may be changed to P1 by adjusting the first controller 320, so that the conductive liquid 111 may not flow out of the first through hole T1 in the jig plate 140. In practical applications, the conductive liquid 111 is usually flowed out from the first through hole T1 in the jig plate 140 at the injection pressure P0, and the injection pressure is adjusted to P1 to ensure that the gas in the liquid injection tank 120 and the first through holes T1 in the jig plate 140 is exhausted.
Optionally, after storing the conductive liquid 111 in the reservoir 110, the method may further include:
s110: the reservoir 110 is evacuated such that the reservoir 110 storing the conductive liquid 111 is a vacuum-tight chamber.
Referring to fig. 1, the liquid storage tank 110 may further include a top 114 in addition to the bottom 112 and the sidewall 113 surrounding the bottom 112, and the bottom 112 of the liquid storage tank 110 and the top 114 thereof are disposed opposite to each other, so that after the conductive liquid 111 is stored in the liquid storage tank 110, the liquid storage tank 110 may be vacuumized, so that the liquid storage tank 110 storing the conductive liquid 111 is a vacuum sealed chamber, and then the conductive liquid 111 stored in the liquid storage tank 110 is always in the vacuum sealed chamber, thereby greatly avoiding the problems of oxidation, drying, poor fluidity, and the like caused by long-time contact of the conductive liquid 111 with air, further improving the hole filling effect, and prolonging the service life of metals in holes.
S200: referring to fig. 2, a target substrate 220 is placed on a workbench 210, and a second controller 320 is used to control the liquid supply system 100 and the carrying system 200, so that a first through hole T1 in the jig plate 140 and a second through hole T2 in the target substrate 220 are aligned and attached one by one.
Optionally, as shown in fig. 1, the second controller 320 includes a first sub-controller 321 and a second sub-controller 322, so in step S200, controlling the liquid supply system 100 and the carrier system 200 by using the second controller 320 so that the first through hole T1 in the jig plate 140 and the second through hole T2 in the target substrate 220 are aligned and attached one by one may include:
s210: the first sub-controller 321 is used to control the stage 210 in the carrier system 200 to move or rotate in the plane thereof, so that the first through hole T1 in the jig plate 140 and the second through hole T1 in the target substrate 220 are aligned one by one.
Specifically, the first sub-controller 321 may be a dual high-precision image sensor (Charge Coupled Device, CCD) alignment system, and the dual high-precision CCD alignment system may accurately capture the position of the first through hole T1 in the jig plate 140 and the position of the second through hole T2 in the target substrate 220, so as to control the movement and/or rotation of the working table 210 in the carrier system 200 in the plane thereof, so that the working table 210 carries the target substrate 220 to move and/or rotate together, and further realize one-to-one alignment of the first through hole T1 in the jig plate 140 and the second through hole T2 in the target substrate 220.
The dual-high-precision CCD alignment system may move the table 210 in one direction in the plane of the table 210 at the same time, or may rotate the table 210 in a certain angle in the plane of the table, or may move the table 210 in one direction in the plane of the table 210 and simultaneously rotate the table 210 in a certain angle in the plane of the table, as the case may be.
S220: the second sub-controller 322 is used to control the liquid injection system 100 to move towards the direction approaching to the bearing system 200, so that the jig plate 140 is attached to the target substrate 220, and the first through hole T1 in the jig plate 140 is attached to the second through hole T2 in the target substrate 220 in a one-to-one alignment manner.
Fig. 2 is a schematic structural diagram of the micro hole filling device provided in the embodiment of the present application when the first through holes T1 in the jig plate 140 and the second through holes T2 in the target substrate 220 are aligned and bonded one by one, for convenience of understanding, fig. 3 is a schematic perspective diagram of the jig plate 140 when the first through holes T1 in the jig plate 140 and the second through holes T2 in the target substrate 220 are aligned and bonded one by one, fig. 4 is a schematic top view of the jig plate 140 when the first through holes T1 in the jig plate 140 and the second through holes T2 in the target substrate 220 are aligned and bonded one by one, and fig. 5 is a schematic view of the AA' section in fig. 4, so it can be seen that the number of the first through holes T1 in the jig plate 140 and the number of the second through holes T2 in the target substrate 220 are equal, and the positions of the first through holes T1 in the jig plate 140 and the positions of the second through holes T2 in the target substrate 220 are in one by one.
S300: referring to fig. 6, the injection pressure and injection time of the conductive liquid 111 are controlled by the first controller 310 such that the conductive liquid 111 flows out of the first through hole T1 in the jig plate 140 to be correspondingly filled into the second through hole T2 in the target substrate 220.
Specifically, as shown in fig. 6, the injection pressure of the conductive liquid 111 may be changed to P2 by adjusting the first controller 320, so that the conductive liquid 111 flows out of the first through hole T1 in the jig plate 140 and is correspondingly filled into the second through hole T2 in the target substrate 220.
Referring to fig. 1 to 5, in step S300, since the first through hole T1 in the jig plate 140 and the second through hole T2 in the target substrate 220 are aligned and attached one by one, the conductive liquid 111 is injected into the second through hole T2 in the target substrate 220 from the liquid storage tank 110 through the liquid supply pipe 130, the liquid injection tank 120 and the first through hole T1 in the jig plate 140, so as to fill the second through hole T2 in the target substrate 220, and compared with the conventional method of filling the micro holes by printing the conductive liquid on the whole surface of the screen, the method of filling the micro holes provided by the embodiment of the present invention can perform point-to-point filling on the second through hole T2 in the target substrate 220, thereby greatly improving the filling efficiency.
S400: referring to fig. 7, after filling of the second through holes T2 in the target substrate 220 is completed, the liquid supply system 100 and the carrier system 200 are controlled by the second controller 320 so that the jig plate 140 and the target substrate 220 are separated.
Alternatively, the second controller 320 includes a first sub-controller 321 and a second sub-controller 322, and thus, in step S400, controlling the liquid supply system 100 and the carrier system 200 with the first controller 320 such that the jig plate 140 and the target substrate 220 are separated includes:
s410: referring to fig. 7, the second sub-controller 322 is used to control the movement of the liquid injection system 100 away from the carrier system 200, so that the jig plate 140 and the target substrate 220 are separated.
Also, in step S400, after the second through-holes T2 in the target substrate 220 are completely filled, referring to fig. 7, the first controller 320 may be adjusted such that the injection pressure of the conductive liquid 111 becomes P3, thereby stopping the injection of the conductive liquid 111 into the second through-holes T2 in the target substrate 220.
As can be seen from the foregoing, the injection pressure of the conductive liquid 111 is controlled by adjusting the first controller 320 such that the injection process is ready for injection when the injection pressure is P0, the injection process is stopped when the injection pressures are P1 and P3, and the injection process is performed when the injection pressure is P2.
It will be appreciated that the greater the injection pressure of the conductive liquid 111, the faster the injection rate of the conductive liquid 111, and vice versa, the lesser the injection pressure of the conductive liquid 111, the slower the injection rate of the conductive liquid 111, and thus, in the foregoing processes, P2> P1 and P2> P3 are required, so that the conductive liquid 111 may be injected into the second through hole T2 in the target substrate 220 from the first through hole T1 in the jig plate 140 more quickly during the injection process, wherein P1 and P3 may be equal or unequal.
In each of the above processes, P0> P1 is also required to fill the liquid injection groove 120 and each first through hole T1 in the jig plate 140 with the conductive liquid 111, and to remove the gas in the liquid injection groove 120 and each first through hole T1 in the jig plate 140.
The specific pressure values of the injection pressures P0, P1, P2 and P3 are not limited in this application, and may be specific to the actual situation.
Also, in the foregoing respective processes, the injection time of the conductive liquid 111 can also be controlled by adjusting the first controller 310. It will be appreciated that the longer the injection time, the more the injection amount of the conductive liquid 111, and conversely, the shorter the injection time, the less the injection amount of the conductive liquid 111, and the specific injection time may be dependent on the volume of the conductive liquid 111 to be injected.
Therefore, in the micropore filling method provided by the embodiment of the application, the injection pressure and injection time of the conductive liquid 112 are controlled by the first controller 310, so that the injection amount of the conductive liquid 111 can be precisely controlled, thereby greatly improving the utilization rate of the conductive liquid, avoiding the waste of the conductive liquid and reducing the material cost while ensuring the filling effect of the second through holes T2 in the target substrate 220.
Specifically, the first controller 310 may be a high-precision piston pump metering system, which may precisely control the injection pressure and injection time of the conductive liquid 111, so that the injection amount of the conductive liquid 111 may be precisely controlled, and may make the injection amount error of the conductive liquid 111 be ±1.5% (by volume). Moreover, the injection preparation, injection and injection stopping processes can be fully automated in a high-precision piston pump metering system.
In this embodiment, optionally, the target substrate 220 may be a silicon wafer, and the second through hole T2 may be a through silicon via; alternatively, the target substrate 220 may be a glass substrate, such as a soda lime glass substrate, and the second through hole T2 may be a glass through hole. Of course, the target substrate 220 may be another material substrate as long as each of the second through holes T2 in the target substrate 220 needs to be filled with the conductive liquid 111.
On the basis of any of the above embodiments, in order to avoid forming a recess at the second through hole T2 due to gravity after filling the second through hole T2 in the target substrate 220, optionally, in one embodiment of the present application, as shown in fig. 9, in step S300, the injection pressure and the injection time of the conductive liquid are controlled by using the first controller, so that the conductive liquid flows out from the first through hole in the jig plate, and the corresponding filling into the second through hole in the target substrate includes:
s310: referring to fig. 6, the first controller 310 is adjusted such that, in a first period, the conductive liquid 111 flows out from the first through hole T1 in the jig plate 140 at the first injection pressure P21, and correspondingly fills into the second through hole T2 in the target substrate 220;
before controlling the liquid supply system 100 and the carrier system 200 with the second controller 320 such that the jig plate 140 and the target substrate 200 are separated, the method further includes:
s500: referring to fig. 6 and 7, the first controller 310 is adjusted such that the conductive liquid 111 flows out from the first through hole T1 in the jig plate 140 at the second injection pressure P22 for a second period of time, overfilling the second through hole T2 in the target substrate 220, thereby forming the protrusion Z1 at the hole surface of the second through hole T2, the second injection pressure P22 being smaller than the first injection pressure P21.
As can be seen, in the present embodiment, in the first period, the first controller 310 is adjusted so that the conductive liquid 111 is injected under the first injection pressure P21, and in the second period, before the jig plate 140 and the target substrate 200 are about to be separated, the first controller 310 is adjusted so that the conductive liquid 111 is continuously injected at the second injection pressure P22 for a time delay, and the second through hole T2 in the target substrate 220 is overfilled, so that the protrusion Z1 is formed at the hole surface of the second through hole T2, and thus the recess is prevented from being formed at the second through hole T2 due to the gravity of the conductive liquid 111 after the second through hole T2 in the target substrate 220 is filled.
Note that, since the conductive liquid 111 flows out from the first through hole T1 in the jig plate 140 at the second injection pressure P22 and overfills the second through hole T2 in the target substrate 220 in the second period, the injection speed of the conductive liquid 111 needs to be slow a little at this time, so that the second injection pressure P22 is set smaller than the first injection pressure P21.
It will be appreciated that the second period of time may be entered before the jig plate 140 and the target substrate 220 are separated, the injection pressure of the conductive liquid 111 is adjusted to the second injection pressure P22, and as the jig plate 140 and the target substrate 220 are separated, the conductive liquid 111 may overfill the second through hole T2 in the target substrate 220 at the second injection pressure P22, i.e., the second period of time may be continued after the jig plate 140 and the target substrate 220 are separated, so that the protrusion Z1 is formed at the hole surface of the second through hole T2, i.e., the steps S500 and S400 are closely related in time.
Based on the above embodiments, in one embodiment of the present application, as shown in fig. 9, after separating the jig plate 140 and the target substrate 220, the method further includes:
s600: referring to fig. 10, the target substrate 220 after the second through-holes T2 are filled is baked so that the filled conductive liquid 111 is cured.
Specifically, after the filling of the second through holes T2 in the target substrate 220 is completed, the target substrate 200 is baked at a preset temperature for a period of time, for example, may be baked at 160 ℃ for 1 hour, so that the filled conductive liquid 111 is cured.
Further optionally, in an embodiment of the present application, as shown in fig. 9, the method further includes:
s700: referring to fig. 11, the baked target substrate 220 is subjected to surface treatment, and the cured protrusions Z1 are removed so that the hole surfaces of the second through holes T2 are flush with the surface of the target substrate 220.
Specifically, in step S700, the baked target substrate 220 may be surface polished, so that the cured bump Z1 is removed, and the hole surface of the second through hole T2 is flush with the surface of the target substrate 220.
In the description, each part is described in a parallel and progressive mode, and each part is mainly described as a difference with other parts, and all parts are identical and similar to each other.
The features described in the various embodiments of the present disclosure may be interchanged or combined with one another in the description to enable those skilled in the art to make or use the disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. A micropore filling device is characterized by comprising a liquid injection system, a bearing system and a control system, wherein,
the liquid injection system comprises a liquid storage tank, a liquid injection tank and a liquid supply pipe communicated with the liquid storage tank and the liquid injection tank, wherein the liquid storage tank is used for storing conductive liquid; the liquid injection groove is provided with a top, a bottom and side walls, wherein the top and the bottom are oppositely arranged, the side walls encircle the top and the bottom, the top of the liquid injection groove is communicated with the liquid supply pipe, the bottom of the liquid injection groove is provided with an opening, the bottom of the liquid injection groove is provided with a jig plate, the jig plate covers the opening, the jig plate is provided with a plurality of first through holes penetrating through, and the opening exposes each first through hole;
The bearing system comprises a workbench, wherein the workbench is used for placing a target substrate, and the target substrate is provided with a plurality of second through holes to be filled;
the control system comprises a first controller and a second controller, wherein the first controller is arranged on the liquid supply pipe and is used for controlling the injection pressure and the injection time of the conductive liquid; the second controller is used for controlling the liquid injection system and the bearing system so that the first through holes in the jig plate and the second through holes in the target substrate are in one-to-one alignment fit or separation;
the aperture of the first through hole in the jig plate on the surface of the jig plate, which is attached to the target substrate, is a first aperture d1, and the aperture of the second through hole in the target substrate on the surface of the target substrate, which is attached to the jig plate, is a second aperture d2, d1> d2;
and controlling the liquid injection system and the bearing system by using the second controller, after the first through holes in the jig plate and the second through holes in the target substrate are in one-to-one alignment and fit, controlling the injection pressure and the injection time of the conductive liquid by using the first controller, so that the conductive liquid flows out of the first through holes in the jig plate, correspondingly fills the second through holes in the target substrate, overfills the second through holes in the target substrate, forms bulges at the hole surfaces of the second through holes, and then controls the liquid injection system and the bearing system by using the second controller, so that the jig plate and the target substrate are separated and removed.
2. The micropore filling device of claim 1, wherein the reservoir storing the electrically conductive liquid is a vacuum-tight chamber.
3. The micro-hole filling apparatus according to claim 1, wherein the second controller comprises a first sub-controller and a second sub-controller, wherein,
the first sub-controller is used for controlling the workbench in the bearing system to move and/or rotate in the plane where the workbench is located, so that the first through holes in the jig plate and the second through holes in the target substrate are aligned one by one;
the second sub-controller is used for controlling the liquid injection system to move towards the direction close to the bearing system so that the jig plate is attached to the target substrate, or controlling the liquid injection system to move towards the direction far away from the bearing system so that the jig plate is separated from the target substrate.
4. A microwell filling method as claimed in any one of claims 1 to 3, applied to the microwell filling apparatus, the method comprising:
storing conductive liquid in the liquid storage tank, and controlling injection pressure and injection time of the conductive liquid by using the first controller, so that the conductive liquid flows out of the liquid storage tank, fills up the liquid injection tank and each first through hole in the jig plate, and eliminates gas in the liquid injection tank and each first through hole in the jig plate;
Placing a target substrate on the workbench, and controlling the liquid injection system and the bearing system by utilizing the second controller so that a first through hole in the jig plate and a second through hole in the target substrate are in one-to-one alignment fit;
controlling injection pressure and injection time of the conductive liquid by using the first controller, so that the conductive liquid flows out of a first through hole in the jig plate, correspondingly fills a second through hole in the target substrate, overfills the second through hole in the target substrate, and forms a bulge at a hole surface of the second through hole;
after filling of the second through holes in the target substrate is completed, controlling the liquid injection system and the bearing system by using the second controller so that the jig plate and the target substrate are separated;
and removing the bulge.
5. The microwell filling method of claim 4, further comprising, after storing the conductive liquid in the reservoir:
and vacuumizing the liquid storage tank, so that the liquid storage tank storing the conductive liquid is a vacuum airtight chamber.
6. The method of filling micro holes according to claim 4, wherein the second controller includes a first sub-controller and a second sub-controller, and the controlling the liquid injection system and the carrying system by using the second controller, such that the first through hole in the jig plate and the second through hole in the target substrate are aligned one by one, includes:
The first sub-controller is used for controlling a workbench in the bearing system to move and/or rotate in a plane where the workbench is located, so that a first through hole in the jig plate and a second through hole in the target substrate are aligned one by one;
the second sub-controller is used for controlling the liquid injection system to move towards the direction close to the bearing system, so that the jig plate is attached to the target substrate, and the first through holes in the jig plate are attached to the second through holes in the target substrate in a one-to-one alignment manner;
controlling the liquid injection system and the bearing system by using the second controller, so that the jig plate and the target substrate are separated, wherein the method comprises the following steps:
and controlling the liquid injection system to move in a direction far away from the bearing system by utilizing the second sub-controller, so that the jig plate and the target substrate are separated.
7. The micro-hole filling method according to claim 4, wherein controlling the injection pressure and the injection time of the conductive liquid by the first controller so that the conductive liquid flows out of the first through hole in the jig plate, and correspondingly filling into the second through hole in the target substrate comprises:
Adjusting the first controller so that the conductive liquid flows out of the first through hole in the jig plate under a first injection pressure in a first period of time, and correspondingly fills into the second through hole in the target substrate;
before controlling the liquid injection system and the bearing system by using the second controller so that the jig plate and the target substrate are separated, overfilling a second through hole in the target substrate, and forming a protrusion at a hole surface of the second through hole includes:
the first controller is adjusted such that the conductive liquid flows out of the first through hole in the jig plate at a second injection pressure, and the second through hole in the target substrate is overfilled so as to form a bump at a hole face of the second through hole, in a second period, the second injection pressure being smaller than the first injection pressure.
8. The method of micropore filling as claimed in claim 7, further comprising:
and baking the target substrate after the second through holes are filled, so that the filled conductive liquid is solidified.
9. The microwell filling method of claim 8, further comprising:
And carrying out surface treatment on the baked target substrate, and removing the cured protrusion, so that the hole surface of the second through hole is flush with the surface of the target substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310450469.4A CN116487293B (en) | 2023-04-24 | 2023-04-24 | Micropore filling device and micropore filling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310450469.4A CN116487293B (en) | 2023-04-24 | 2023-04-24 | Micropore filling device and micropore filling method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116487293A CN116487293A (en) | 2023-07-25 |
| CN116487293B true CN116487293B (en) | 2024-04-12 |
Family
ID=87211435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310450469.4A Active CN116487293B (en) | 2023-04-24 | 2023-04-24 | Micropore filling device and micropore filling method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116487293B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09262644A (en) * | 1996-03-28 | 1997-10-07 | Nippon Steel Corp | Method for controlling supply of a little quantity of molten metal and alloy and apparatus therefor |
| JPH10270477A (en) * | 1997-03-27 | 1998-10-09 | Hitachi Ltd | Manufacture of semiconductor package |
| CN201975376U (en) * | 2011-02-14 | 2011-09-14 | 大连保税区新时代国际工贸有限公司 | Through hole injection filling machine |
| CN103258786A (en) * | 2012-02-17 | 2013-08-21 | 东京毅力科创株式会社 | Method and apparatus for filling metal paste, and method for fabricating via plug |
| JP2014059220A (en) * | 2012-09-18 | 2014-04-03 | Tokyo Electron Ltd | Apparatus and method for supplying conductive material |
| CN103765563A (en) * | 2011-09-21 | 2014-04-30 | 住友精密工业股份有限公司 | Metal filling device |
| CN105671473A (en) * | 2016-03-17 | 2016-06-15 | 大连理工大学 | Method and device for filling of vertical through hole |
| TW201732906A (en) * | 2016-03-10 | 2017-09-16 | 住友精密工業股份有限公司 | Metal filling apparatus and metal filling method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6138026B2 (en) * | 2013-11-12 | 2017-05-31 | 日本メクトロン株式会社 | Method for filling conductive paste and method for producing multilayer printed wiring board |
-
2023
- 2023-04-24 CN CN202310450469.4A patent/CN116487293B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09262644A (en) * | 1996-03-28 | 1997-10-07 | Nippon Steel Corp | Method for controlling supply of a little quantity of molten metal and alloy and apparatus therefor |
| JPH10270477A (en) * | 1997-03-27 | 1998-10-09 | Hitachi Ltd | Manufacture of semiconductor package |
| CN201975376U (en) * | 2011-02-14 | 2011-09-14 | 大连保税区新时代国际工贸有限公司 | Through hole injection filling machine |
| CN103765563A (en) * | 2011-09-21 | 2014-04-30 | 住友精密工业股份有限公司 | Metal filling device |
| CN103258786A (en) * | 2012-02-17 | 2013-08-21 | 东京毅力科创株式会社 | Method and apparatus for filling metal paste, and method for fabricating via plug |
| JP2014059220A (en) * | 2012-09-18 | 2014-04-03 | Tokyo Electron Ltd | Apparatus and method for supplying conductive material |
| TW201732906A (en) * | 2016-03-10 | 2017-09-16 | 住友精密工業股份有限公司 | Metal filling apparatus and metal filling method |
| CN105671473A (en) * | 2016-03-17 | 2016-06-15 | 大连理工大学 | Method and device for filling of vertical through hole |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116487293A (en) | 2023-07-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI357134B (en) | ||
| JP5964750B2 (en) | Method of embedding a substance in a glass substrate | |
| TW201813469A (en) | Molded circuit board of camera module and manufacturing equipment and manufacturing method of molded circuit board | |
| JP5018062B2 (en) | Solder ball printing device | |
| CN116487293B (en) | Micropore filling device and micropore filling method | |
| JP5083259B2 (en) | Conductive material filling apparatus and filling method using the same | |
| CN115066103A (en) | LED circuit board circuit etching equipment and method | |
| CN102700275A (en) | Method for printing soldering paste on device with cavity | |
| JP2016175276A (en) | Printer and printing method | |
| CN112136212B (en) | Chip interconnection device, substrate of integrated bridge structure and preparation method thereof | |
| CN108602088B (en) | Fluid discharge device and fluid discharge method | |
| JP5013318B2 (en) | Electronic component mounting apparatus and mounting method | |
| CN217121749U (en) | Liquid metal additive manufacturing device and additive manufacturing system | |
| CN112723306B (en) | Atomic air chamber manufacturing integrated bonding device and method for alkali metal direct filling | |
| WO2018151252A1 (en) | Printing device and printing method | |
| US20180025932A1 (en) | Laminated top plate of a workpiece carrier in micromechanical and semiconductor processing | |
| US20190352789A1 (en) | Method for synchronous electroplating filling of differential vias and electroplating device implementing same | |
| JP7149238B2 (en) | RESIN MOLDING APPARATUS AND RESIN MOLDED PRODUCT MANUFACTURING METHOD | |
| JP2023077440A (en) | Printer, printing method, and manufacturing method of mounting board | |
| JP2010105021A (en) | Columnar solder piece | |
| CN216857179U (en) | Wafer-level glue dispensing device | |
| JP2015015292A (en) | Wiring formation device | |
| CN202345932U (en) | Cylinder filled soldering paste filling device | |
| JP3947155B2 (en) | Metal filling equipment | |
| JP2017109211A (en) | Fluid discharge method and fluid discharge device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |