CN116470876B - Surface acoustic wave device - Google Patents
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- CN116470876B CN116470876B CN202310455753.0A CN202310455753A CN116470876B CN 116470876 B CN116470876 B CN 116470876B CN 202310455753 A CN202310455753 A CN 202310455753A CN 116470876 B CN116470876 B CN 116470876B
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- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 47
- 239000000725 suspension Substances 0.000 claims abstract description 98
- 238000005339 levitation Methods 0.000 claims description 17
- 230000000712 assembly Effects 0.000 claims description 12
- 238000000429 assembly Methods 0.000 claims description 12
- 238000003780 insertion Methods 0.000 abstract description 4
- 230000037431 insertion Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 34
- 239000000306 component Substances 0.000 description 22
- 239000000758 substrate Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910052733 gallium Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052746 lanthanum Inorganic materials 0.000 description 4
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 238000010295 mobile communication Methods 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- PSHMSSXLYVAENJ-UHFFFAOYSA-N dilithium;[oxido(oxoboranyloxy)boranyl]oxy-oxoboranyloxyborinate Chemical compound [Li+].[Li+].O=BOB([O-])OB([O-])OB=O PSHMSSXLYVAENJ-UHFFFAOYSA-N 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910003465 moissanite Inorganic materials 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052596 spinel Inorganic materials 0.000 description 2
- 239000011029 spinel Substances 0.000 description 2
- 239000008358 core component Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02842—Means for compensation or elimination of undesirable effects of reflections
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14502—Surface acoustic wave [SAW] transducers for a particular purpose
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6423—Means for obtaining a particular transfer characteristic
- H03H9/643—Means for obtaining a particular transfer characteristic the transfer characteristic being determined by reflective or coupling array characteristics
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
The invention discloses a surface acoustic wave device, which comprises a busbar, a false finger and a finger assembly, and also comprises a suspension block assembly, wherein the finger assembly comprises a plurality of fingers uniformly arranged along the axial direction, the suspension block assembly comprises a plurality of suspension block components uniformly arranged along the axial direction, the suspension block components are in one-to-one correspondence with the fingers, the suspension block components are positioned between the false finger and the fingers, gaps are reserved between the suspension block components and the false finger and between the suspension block components and the fingers, and the suspension block components comprise at least two suspension blocks arranged along the axial direction. The scheme can restrict more acoustic surface wave energy at the center of the acoustic surface wave device, so as to reduce the existence of transverse clutter, improve the pass band flatness of the acoustic surface wave device, reduce the use performance of insertion loss and the like.
Description
Technical Field
The invention relates to the technical field of surface acoustic wave devices, in particular to a surface acoustic wave device.
Background
As a basis and key for mobile communications, radio frequency front ends are a core component of radar, satellite communications electronics, and mobile terminal products. The radio frequency front-end filter is used for filtering various interference signals such as various parasitic clutters, noise and the like and mainly comprises a filter/duplexer, a power amplifier, a tag and other device units. Because of the characteristics of small volume, good consistency, high reliability, low loss, good filtering performance and the like, surface Acoustic Wave (SAW) filters have become the most mainstream radio frequency front-end filters for radars, satellite communication electronics, mobile terminals and the like.
The structure of the surface acoustic wave device generally comprises a substrate layer, a piezoelectric layer and an electrode finger strip layer, however, when the surface acoustic wave device propagates in a piezoelectric material, a certain energy flow angle exists in the sound wave, so that the surface acoustic wave is scattered in the aperture direction, and transverse clutters exist in the passband range or near the passband of the surface acoustic wave device, and further the performances of the surface acoustic wave device such as passband flatness, insertion loss and the like are deteriorated.
Disclosure of Invention
Aiming at the defects existing in the prior art, the invention aims to solve the technical problems that: how to provide a surface acoustic wave device which can restrict the energy of the surface acoustic wave to the central area of the surface acoustic wave device, further reduce the existence of transverse clutter and improve the service performance.
In order to solve the technical problems, the invention adopts the following technical scheme:
the utility model provides a surface acoustic wave device, includes busbar, false finger and finger subassembly, still includes the suspension piece subassembly, the finger subassembly includes a plurality of fingers that set up along the axial is even, the suspension piece subassembly includes a plurality of suspension piece parts that set up along the axial is even, the suspension piece part with finger one-to-one, just the suspension piece part is located the false finger with between the finger, the suspension piece part with all have the clearance between the false finger with the finger, the suspension piece part includes two at least suspension pieces that set up along the axial.
Preferably, the suspension block component comprises a plurality of suspension block assemblies arranged vertically, and the suspension block assemblies comprise a plurality of suspension blocks arranged axially.
Preferably, the distance between two adjacent suspension blocks arranged along the axial direction is greater than or equal to a first set value and less than or equal to a second set value, and the distance between two adjacent suspension blocks arranged along the vertical direction is greater than or equal to the first set value and less than or equal to the second set value.
Preferably, the fingers and the suspension block member have the same width in the axial direction.
Preferably, the distance between the suspension block component and the finger is greater than or equal to a first set value and less than or equal to a second set value, and the distance between the suspension block component and the finger is greater than or equal to the first set value and less than or equal to the second set value.
The utility model provides a surface acoustic wave device, includes busbar and finger subassembly, still includes the suspension piece subassembly, the finger subassembly includes a plurality of fingers that set up along the axial is even, the suspension piece subassembly includes a plurality of suspension piece parts that set up along the axial is even, the suspension piece part with finger one-to-one, just the suspension piece part is located the busbar with between the finger, the suspension piece part with the busbar with all have the clearance between the finger, the suspension piece part includes two at least suspension pieces that set up along the axial.
Preferably, the suspension block component comprises a plurality of suspension block assemblies arranged vertically, and the suspension block assemblies comprise a plurality of suspension blocks arranged axially.
Preferably, the distance between two adjacent suspension blocks arranged along the axial direction is greater than or equal to a first set value and less than or equal to a second set value, and the distance between two adjacent suspension blocks arranged along the vertical direction is greater than or equal to the first set value and less than or equal to the second set value.
Preferably, the distance between the suspension block part and the finger is greater than or equal to a first set value and less than or equal to a second set value, and the distance between the suspension block part and the bus bar is greater than or equal to the first set value and less than or equal to the second set value.
Preferably, two adjacent finger strips are arranged in pairs, and in the two finger strips of the same group, the finger strip part end at the uppermost side of one finger strip extends upwards and is connected with the busbar, and the finger strip part at the lowermost side of the other finger strip extends downwards and is connected with the busbar.
Compared with the prior art, the invention has the following advantages:
1. according to the invention, by arranging single or multiple metal suspension blocks in the aperture direction, the sound propagation speed of the tips of the interdigital electrode fingers can be reduced by utilizing the first metal suspension block, and the sound surface wave energy is bound to the central area of the sound surface wave device; and secondly, reflection of high-order clutter in the aperture direction in the propagation direction can be enhanced, so that influence of the high-order surface acoustic waves in the aperture direction on the main mode sound wave can be restrained. Therefore, the scheme can restrict more acoustic surface wave energy to the center of the acoustic surface wave device, so as to reduce the existence of transverse clutter, improve the pass band flatness, reduce the use performance such as insertion loss and the like.
2. The design of the artificial finger in the scheme can also reduce the sound propagation speed of the limb terminal, and strengthen the surface acoustic wave reflection at the same time, thereby being beneficial to binding the surface acoustic wave energy to the central area of the surface acoustic wave device.
3. According to the scheme, through structural optimization of the busbar, the false finger, the gap and the finger strip assembly, the suspension blocks arranged along the axial direction and the vertical direction are arranged at the same time, parasitic noise wave modes of various orders are restrained, and meanwhile, a high Q value (quality factor) sound wave mode can be excited. Therefore, the low-loss, passband high-flatness and other performances of the surface acoustic wave device are facilitated to be realized, the requirements of terminals such as high-speed mobile communication on the high-performance surface acoustic wave device are met, and the preparation process used by the structure is easy to realize and easy to popularize on a large scale.
Drawings
Fig. 1 is a schematic structural diagram of a surface acoustic wave device according to an embodiment of the present invention (two suspension blocks are arranged along an axial direction);
fig. 2 is a schematic structural diagram of a surface acoustic wave device according to an embodiment of the present invention (three suspension blocks are arranged along an axial direction);
fig. 3 is a schematic structural diagram of a surface acoustic wave device according to an embodiment of the present invention (a plurality of suspension blocks are disposed along an axial direction and a vertical direction);
fig. 4 is a schematic structural diagram of a surface acoustic wave device according to a second embodiment of the present invention (a plurality of suspension blocks are disposed along the axial direction and the vertical direction).
Reference numerals illustrate: bus bar 1, suspending block 2, finger 3 and artificial finger 4.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. It will be apparent that the described embodiments are some, but not all, embodiments of the invention. All other embodiments, which can be made by a person skilled in the art without creative efforts, based on the described embodiments of the present invention fall within the protection scope of the present invention. Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs.
The terms "first," "second," and the like in the description and in the claims, are not used for any order, quantity, or importance, but are used for distinguishing between different elements. Also, unless the context clearly indicates otherwise, singular forms "a," "an," or "the" and similar terms do not denote a limitation of quantity, but rather denote the presence of at least one. The terms "comprises," "comprising," or the like are intended to cover a feature, integer, step, operation, element, and/or component recited as being present in the element or article that "comprises" or "comprising" does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. "up", "down", "left", "right" and the like are used only to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed accordingly.
Embodiment one:
as shown in the attached figure 1, the surface acoustic wave device mainly optimizes the structure of an electrode finger strip layer and comprises a busbar 1, a false finger 4 and a finger strip assembly, and further comprises a suspension block assembly, wherein the finger strip assembly comprises a plurality of finger strips 3 which are uniformly arranged along the axial direction, the suspension block assembly comprises a plurality of suspension block components which are uniformly arranged along the axial direction, the suspension block components are in one-to-one correspondence with the finger strips 3, the suspension block components are positioned between the false finger 4 and the finger strips 3, gaps are reserved between the suspension block components and the false finger 4 and the finger strips 3, and the suspension block components comprise at least two suspension blocks 2 which are arranged along the axial direction. As shown in fig. 1, two suspension blocks 2 are axially arranged, fig. 2, three suspension blocks 2 are axially arranged, and fig. 3, a plurality of suspension blocks 2 are axially and vertically arranged.
As also shown in fig. 3, in this embodiment, the levitation block component comprises a plurality of levitation block assemblies disposed vertically, and the levitation block assemblies comprise a plurality of levitation blocks 2 disposed axially.
In the present embodiment, the distance between two adjacent levitation blocks 2 disposed in the axial direction is equal to or greater than a first set value and equal to or less than a second set value, and the distance between two adjacent levitation blocks 2 disposed in the vertical direction is equal to or greater than the first set value and equal to or less than the second set value. Wherein the distance between the two most distant levitation blocks 2 arranged in the axial direction is w3.
In this embodiment, the finger 3, the prosthesis 4 and the suspension block member have the same width in the axial direction.
In this embodiment, the distance w2 between the suspension block component and the finger 3 is equal to or greater than the first set value and equal to or less than the second set value, and the distance w1 between the suspension block component and the finger 4 is equal to or greater than the first set value and equal to or less than the second set value.
In this embodiment, the first set point is 50nm, and the second set point is 100 times the width of the interdigital electrode finger.
The surface acoustic wave device generally further comprises a substrate layer and a piezoelectric layer, wherein the electrode finger strip layer comprises a busbar 1, a false finger 4 and a finger strip component, the electrode finger strip layer is positioned on the piezoelectric layer, the suspension block component is also positioned on the piezoelectric layer, the piezoelectric layer is in a single-layer or multi-layer structure, the piezoelectric layer is positioned on the substrate layer, and the substrate layer adopts a cavity type structure and can also adopt a single-layer or multi-layer structure.
The electrode finger strip layer is an interdigital electrode and is made of at least one of the following materials: aluminum Al, copper Cu, gold Au, platinum Pt and copper aluminum alloy.
The piezoelectric layer is made of at least one of the following materials: lithium niobate LiNbO 3 Lithium tantalate LiTaO 3 Quartz, lithium tetraborate, lanthanum gallium silicate, lanthanum gallium niobate.
The substrate layer is made of at least one of the following materials: silicon Si, sapphire, silicon carbide SiC, diamond, spinel.
Embodiment two:
as shown in fig. 4, a surface acoustic wave device includes a busbar 1 and a finger assembly, and further includes a suspension block assembly, where the finger assembly includes a plurality of fingers 3 that are uniformly disposed along an axial direction, the suspension block assembly includes a plurality of suspension block components that are uniformly disposed along the axial direction, the suspension block components are in one-to-one correspondence with the fingers 3, and the suspension block components are located between the busbar 1 and the fingers 3, and gaps are formed between the suspension block components and the busbar 1 and the fingers 3, and the suspension block components include at least two suspension blocks 2 that are disposed along the axial direction.
In this embodiment, the levitation block component comprises a plurality of levitation block assemblies disposed vertically, and the levitation block assemblies comprise a plurality of levitation blocks 2 disposed axially.
In the present embodiment, the distance between two adjacent levitation blocks 2 disposed in the axial direction is equal to or greater than a first set value and equal to or less than a second set value, and the distance between two adjacent levitation blocks 2 disposed in the vertical direction is equal to or greater than the first set value and equal to or less than the second set value.
In this embodiment, the distance w2 between the suspension block member and the finger 3 is equal to or greater than the first set value and equal to or less than the second set value, and the distance w1 between the suspension block member and the bus bar 1 is equal to or greater than the first set value and equal to or less than the second set value.
In this embodiment, two adjacent fingers 3 are arranged in pairs, and in the two fingers 3 of the same group, the end of the uppermost finger 3 of one finger 3 extends upward and is connected with the busbar 1, and the end of the lowermost finger 3 of the other finger 3 extends downward and is connected with the busbar 1.
In this embodiment, the first set point is 50nm, and the second set point is 100 times the width of the interdigital electrode finger.
The surface acoustic wave device generally further comprises a substrate layer and a piezoelectric layer, wherein the electrode finger layer comprises a busbar 1 and a finger assembly, the electrode finger layer is positioned on the piezoelectric layer, the suspension block assembly is also positioned on the piezoelectric layer, the piezoelectric layer adopts a single-layer or multi-layer structure, the piezoelectric layer is positioned on the substrate layer, and the substrate layer adopts a cavity structure and can also adopt a single-layer or multi-layer structure.
The electrode finger strip layer is an interdigital electrode and is made of at least one of the following materials: aluminum Al, copper Cu, gold Au, platinum Pt and copper aluminum alloy.
The piezoelectric layer is made of at least one of the following materials: lithium niobate LiNbO 3 Lithium tantalate LiTaO 3 Quartz, lithium tetraborate, lanthanum gallium silicate, lanthanum gallium niobate.
The substrate layer is made of at least one of the following materials: silicon Si, sapphire, silicon carbide SiC, diamond, spinel.
Compared with the prior art, the invention has the advantages that the single or a plurality of metal suspension blocks 2 are arranged in the aperture direction, and the metal suspension blocks 2 can reduce the sound propagation speed of the tip of the limb, so that the sound surface wave energy is bound to the central area of the sound surface wave device; and secondly, the surface acoustic wave reflection can be enhanced, and the surface acoustic wave energy is favorably bound to the central area of the surface acoustic wave device. Therefore, the scheme can restrict more acoustic surface wave energy to the center of the acoustic surface wave device, so as to reduce the existence of transverse clutter, improve the pass band flatness, reduce the use performance such as insertion loss and the like. The design of the artificial finger 4 in the scheme can also reduce the sound propagation speed of the limb terminal, and strengthen the surface acoustic wave reflection at the same time, thereby being beneficial to binding the sound surface wave energy to the central area of the surface acoustic wave device. According to the scheme, through structural optimization of the busbar 1, the false finger 4, the gap and the finger strip assembly, the suspension blocks 2 arranged along the axial direction and the vertical direction are arranged at the same time, parasitic noise wave modes of various orders are restrained, and meanwhile, a high Q value (quality factor) sound wave mode can be excited. Therefore, the low-loss, passband high-flatness and other performances of the surface acoustic wave device are facilitated to be realized, the requirements of terminals such as high-speed mobile communication on the high-performance surface acoustic wave device are met, and the preparation process used by the structure is easy to realize and easy to popularize on a large scale.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present invention and not for limiting the technical solution, and those skilled in the art should understand that modifications and equivalents may be made to the technical solution of the present invention without departing from the spirit and scope of the present invention, and all such modifications and equivalents are included in the scope of the claims.
Claims (9)
1. The utility model provides a surface acoustic wave device, includes busbar, false finger and finger subassembly, its characterized in that still includes the suspension piece subassembly, the finger subassembly includes a plurality of fingers that set up along the axial is even, the suspension piece subassembly includes a plurality of suspension piece parts that set up along the axial is even, suspension piece part with finger one-to-one, just the suspension piece part is located the false finger with between the finger, suspension piece part with all have the clearance between the false finger with the finger, the suspension piece part includes two at least suspension pieces that set up along the axial.
2. The surface acoustic wave device of claim 1, wherein the levitation block component comprises a plurality of levitation block assemblies disposed vertically, the levitation block assemblies comprising a plurality of levitation blocks disposed axially.
3. The surface acoustic wave device according to claim 2, wherein a distance between two adjacent suspended blocks arranged in the axial direction is equal to or greater than a first set value and equal to or less than a second set value, and a distance between two adjacent suspended blocks arranged in the vertical direction is equal to or greater than the first set value and equal to or less than the second set value.
4. The surface acoustic wave device according to claim 1, wherein the widths of the finger, the dummy finger, and the suspended block member in the axial direction are the same.
5. The surface acoustic wave device according to claim 1, wherein a distance between the suspended block part and the finger is equal to or greater than a first set value and equal to or less than a second set value, and a distance between the suspended block part and the finger is equal to or greater than a first set value and equal to or less than a second set value.
6. The surface acoustic wave device comprises a busbar and a finger assembly, and is characterized by further comprising a suspension block assembly, wherein the finger assembly comprises a plurality of fingers uniformly arranged along the axial direction, the suspension block assembly comprises a plurality of suspension block components uniformly arranged along the axial direction, the suspension block components are in one-to-one correspondence with the fingers, the suspension block components are positioned between the busbar and the fingers, gaps are reserved between the suspension block components and the busbar and between the fingers, and the suspension block components comprise at least two suspension blocks arranged along the axial direction;
the suspension block component comprises a plurality of suspension block assemblies arranged vertically, and the suspension block assemblies comprise a plurality of suspension blocks arranged axially.
7. The surface acoustic wave device according to claim 6, wherein a distance between two adjacent suspended blocks arranged in the axial direction is equal to or greater than a first set value and equal to or less than a second set value, and a distance between two adjacent suspended blocks arranged in the vertical direction is equal to or greater than the first set value and equal to or less than the second set value.
8. The surface acoustic wave device according to claim 6, wherein a distance between the suspended block part and the finger is equal to or greater than a first set value and equal to or less than a second set value, and a distance between the suspended block part and the bus bar is equal to or greater than the first set value and equal to or less than the second set value.
9. The surface acoustic wave device according to claim 6, wherein adjacent ones of said fingers are grouped in pairs, and two of said fingers of a same group have a finger portion of an uppermost one of said fingers extending upward and adjoining said bus bar, and a finger portion of a lowermost one of said fingers extending downward and adjoining said bus bar.
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CN112702040A (en) * | 2021-02-09 | 2021-04-23 | 中国电子科技集团公司第二十六研究所 | Single crystal film surface acoustic wave filter and method for reducing baseband and improving out-of-band rejection |
CN217546008U (en) * | 2022-06-14 | 2022-10-04 | 天通瑞宏科技有限公司 | Surface acoustic wave resonator and filter |
CN116318035A (en) * | 2023-04-04 | 2023-06-23 | 天通瑞宏科技有限公司 | Surface acoustic wave resonator and wireless communication device |
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2023
- 2023-04-25 CN CN202310455753.0A patent/CN116470876B/en active Active
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JP2010263662A (en) * | 2010-08-23 | 2010-11-18 | Kyocera Corp | Surface acoustic wave element and communication apparatus |
CN102497173A (en) * | 2011-12-19 | 2012-06-13 | 北京中讯四方科技股份有限公司 | Novel suspension electrode structure acoustic surface wave filter |
CN112702040A (en) * | 2021-02-09 | 2021-04-23 | 中国电子科技集团公司第二十六研究所 | Single crystal film surface acoustic wave filter and method for reducing baseband and improving out-of-band rejection |
CN217546008U (en) * | 2022-06-14 | 2022-10-04 | 天通瑞宏科技有限公司 | Surface acoustic wave resonator and filter |
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