CN116469805A - Die bonder mounting head and use method - Google Patents
Die bonder mounting head and use method Download PDFInfo
- Publication number
- CN116469805A CN116469805A CN202310448545.8A CN202310448545A CN116469805A CN 116469805 A CN116469805 A CN 116469805A CN 202310448545 A CN202310448545 A CN 202310448545A CN 116469805 A CN116469805 A CN 116469805A
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- Prior art keywords
- suction nozzle
- fixed
- contact
- suction
- seat
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- Pending
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- 238000000034 method Methods 0.000 title claims abstract description 24
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- 238000000926 separation method Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000009423 ventilation Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- WABPQHHGFIMREM-IGMARMGPSA-N lead-207 Chemical compound [207Pb] WABPQHHGFIMREM-IGMARMGPSA-N 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
The invention provides a die bonder mounting head and a use method thereof, comprising the following steps: the axle center seat and the axle center are arranged on the axial seat in a sliding way; the axle center seat comprises a fixed seat, an air cylinder, an air pipe, a voice coil motor coil, a first power line, a sliding rail and a first contact, wherein the air cylinder, the air pipe, the voice coil motor coil, the first power line, the sliding rail and the first contact are fixed on the fixed seat; the fixed seat is provided with a through hole in a penetrating way, and the first contact is electrically connected with the equipment controller through a first wire; the axle center comprises a fixed block, a stator, a rotor, a second power line, a suction nozzle rod, a sliding block, a vacuum tube, a second contact and a permanent magnet fixed on the fixed block; the other end of the suction nozzle rod is used for being connected with the suction nozzle, the stator is arranged in the through hole, the sliding block is arranged in the sliding rail in a sliding way, the first contact and the second contact are correspondingly arranged, and the second contact is electrically connected with the equipment controller through a second wire. The invention can accurately control the rotation angle of the suction nozzle, absorb and attach force, not only ensure the attaching precision, but also not damage the IC.
Description
Technical Field
The invention relates to the technical field of die bonder mounting heads, in particular to a die bonder mounting head and a use method thereof.
Background
A wafer refers to a substrate (also called a base) from which semiconductor transistors or integrated circuits are fabricated. Being crystalline material, it is also commonly referred to as a wafer because of its generally circular shape. Structures fabricated as various circuit elements can be fabricated on wafers (e.g., silicon wafers) to form integrated circuit products having specific electrical functions. Along with the continuous development of technology, various electronic products are rapidly developed, and the demands are continuously increasing, so that the demands of wafers are directly increased. The die bonder mounting head is used for carrying out mounting operation on the wafer.
The existing die bonder mounting head generally has the functions of rotation and buffering. After the CCD lens of the device positions the position and the angle of the IC to be mounted, the suction nozzle sucks the IC, and the suction nozzle rod rotates by a corresponding angle according to the IC angle positioned by the CCD and the angle of the IC mounted on the aluminum substrate so as to ensure the mounting precision; when the suction nozzle moves to the suction position and the mounting position at high speed, a buffer function is required to be added on the suction nozzle rod in order to avoid damaging the IC by pressure. The angle of the suction nozzle is generally that the servo motor pulls the suction nozzle rod to rotate through the belt, and the angle error is large due to the elasticity of the belt; the buffer function is realized by adding a spring on the suction nozzle rod, and the elastic error is larger and is not easy to adjust.
Therefore, the existing die bonder has single mounting head function, troublesome rotation control of the suction nozzle, unstable mounting force, easy damage to the IC, low mounting precision and small application range.
Disclosure of Invention
Aiming at the defects of the related technology, the invention provides the die bonder mounting head which can precisely control the angle of the rotary suction nozzle and can quickly adjust the suction, mounting force and accuracy through parameters.
In order to solve the above technical problems, an embodiment of the present invention provides a die bonder mounting head, including: the axle center seat and the axle center are arranged on the axial seat in a sliding way;
the axle center seat comprises a fixed seat, an air cylinder fixed on the fixed seat, an air pipe communicated with the air cylinder, a voice coil motor coil fixed on the fixed seat, a first power line connected with the voice coil motor coil, a sliding rail fixed on one side of the fixed seat and a first contact fixed on the fixed seat; the fixed seat is provided with a through hole in a penetrating way, the air cylinder and the voice coil motor coil are respectively arranged on two opposite sides of the through hole, and the first contact is electrically connected with the equipment controller through a first wire;
the axle center comprises a fixed block, a stator fixed on the fixed block, a rotor rotatably arranged in the stator, a suction nozzle rod fixed on the rotor, a sliding block fixed on one side of the fixed block, a vacuum tube fixed on the sliding block and communicated with one end of the suction nozzle rod, a second contact fixed on the stator, a second power line connected with the rotor and a permanent magnet fixed on the fixed block; the other end of the suction nozzle rod is used for being connected with a suction nozzle, the stator is arranged in the through hole, the sliding block is arranged in the sliding rail in a sliding manner, the first contact and the second contact are correspondingly arranged, and the second contact is electrically connected with the equipment controller through a second wire.
Preferably, the permanent magnet is fixed at one side of the fixed block and is arranged in the voice coil motor coil in a sliding manner; the cylinder is correspondingly arranged on the other side of the fixed block and used for pushing the fixed block to move up and down so as to realize the contact or separation of the first contact and the second contact.
Preferably, the stator is a servo motor.
In a second aspect, an embodiment of the present invention provides a method for using a die bonder mounting head, including the following steps:
s1, setting patch parameters on a human-computer interface of equipment, wherein the patch parameters comprise suction buffer height, patch buffer height, suction speed and patch speed; the suction nozzle stays at the suction buffer height, and in the process that the suction nozzle moves to the point of the suction buffer height, the air cylinder applies pressure to the rotor so as to prevent the suction nozzle rod from shaking up and down relative to the patch head;
s2, releasing pressure through the air cylinder, applying preset pulling force to the rotor by the voice coil motor coil, slowly descending the suction nozzle from the position of the suction buffer height at the suction speed until the suction nozzle contacts the IC chip, and stopping pressing down and opening the vacuum tube by the suction nozzle when the first contact and the second contact are just separated;
s3, jacking the IC chip through a thimble until the IC chip is separated from the UV film;
s4, the suction nozzle slowly rises to the suction buffer height at the suction speed and sucks the IC chip;
s5, the air cylinder applies pressure again to prevent the suction nozzle from shaking in the moving process of the mounting head, and then the suction nozzle moves to the position of the buffer height of the mounting head;
s6, the air cylinder releases pressure again, the suction nozzle slowly descends at the surface mounting speed until the IC chip contacts the aluminum substrate, and then the vacuum tube of the suction nozzle is closed;
s7, the suction nozzle slowly rises to the position of the patch buffer height at the patch speed, so that the voice coil motor coil always provides pressing force in the suction and mounting process of the suction nozzle, and the cylinder only provides pressing force in the moving process of the mounting head.
Compared with the prior art, the axle center seat comprises a fixed seat, an air cylinder fixed on the fixed seat, an air pipe communicated with the air cylinder, a voice coil motor coil fixed on the fixed seat, a first power line connected with the voice coil motor coil, a sliding rail fixed on one side of the fixed seat and a first contact fixed on the fixed seat; the fixed seat is provided with a through hole in a penetrating way, the air cylinder and the voice coil motor are respectively arranged on two opposite sides of the through hole, and the first contact is electrically connected with the equipment controller through a first wire; the axle center comprises a fixed block, a stator fixed on the fixed block, a rotor rotatably arranged in the stator, a suction nozzle rod fixed on the rotor, a sliding block fixed on one side of the fixed block, a vacuum tube fixed on the sliding block and communicated with one end of the suction nozzle rod, a second contact fixed on the stator, a second power wire connected with the rotor and a permanent magnet fixed on the fixed block; the other end of the suction nozzle rod is used for being connected with the suction nozzle, the stator is arranged in the through hole, the sliding block is arranged in the sliding rail in a sliding way, the first contact and the second contact are correspondingly arranged, and the second contact is electrically connected with the equipment controller through a second wire. The first contact and the second contact are carried out through the equipment controller, the cylinder is ventilated to realize the jacking of the fixed block, the permanent magnet is driven through the mutual driving of the permanent magnet and the voice coil motor, and the vibration effect is realized; when the suction nozzle of the suction nozzle rod is used for taking a piece, the suction nozzle contacts with the IC and then vacuum is opened through the electromagnetic valve to suck the IC, and when the IC contacts with the aluminum substrate during the surface mounting, the electromagnetic valve is closed to vacuum so that the IC is separated from the suction nozzle; the rotor rotates in the stator, so that the rotation angle of the suction nozzle can be adjusted; therefore, the rotation angle of the suction nozzle can be accurately controlled, the suction force and the mounting force can be accurately controlled, the accuracy of mounting can be ensured, the IC can not be damaged, and the operation is convenient.
Drawings
The present invention will be described in detail with reference to the accompanying drawings. The foregoing and other aspects of the invention will become more apparent and more readily appreciated from the following detailed description taken in conjunction with the accompanying drawings. In the accompanying drawings:
FIG. 1 is a schematic diagram of the axis of a die bonder mounting head according to the present invention;
FIG. 2 is a schematic diagram of the structure of the axle seat of the mounting head of the die bonder;
FIG. 3 is a first state diagram of a die bonder mounting head according to the present invention;
FIG. 4 is a second state diagram of the mounting head of the die bonder according to the present invention;
FIG. 5 is a flow chart of a method of using the die bonder mounting head of the present invention;
fig. 6 is a schematic diagram of a method for using the die bonder mounting head according to the present invention.
Detailed Description
The following describes in detail the embodiments of the present invention with reference to the drawings.
The detailed description/examples set forth herein are specific embodiments of the invention and are intended to be illustrative and exemplary of the concepts of the invention and are not to be construed as limiting the scope of the invention. In addition to the embodiments described herein, those skilled in the art will be able to adopt other obvious solutions based on the disclosure of the claims and specification of the present application, including those adopting any obvious substitutions and modifications to the embodiments described herein, all within the scope of the present invention.
Example 1
As shown in fig. 1-4, the present invention provides a die bonder mounting head, comprising: the axial seat 2 and the axial center 1 which is arranged on the axial seat in a sliding way.
The axle center seat 2 comprises a fixed seat 201, an air cylinder 202 fixed on the fixed seat 201, an air pipe 203 communicated with the air cylinder 202, a voice coil motor coil 204 fixed on the fixed seat 201, a first power wire 205 connected with the voice coil motor coil 204, a sliding rail 4 fixed on one side of the fixed seat 201 and a first contact 206 fixed on the fixed seat 201; through holes 208 are formed in the fixing seat 201 in a penetrating manner, the air cylinder 202 and the voice coil motor coil 204 are respectively arranged on two opposite sides of the through holes 208, and the first contact 206 is electrically connected with the equipment controller through a first lead 207.
The fixing base 201 is used for supporting and fixing the voice coil motor coil 204, the air cylinder 202 and the like, the voice coil motor coil 204 is connected with an external power supply through the first power line 205, and the tension of the voice coil motor can be precisely adjusted through current by the voice coil motor coil 204. The two ends of the air cylinder 202 are respectively connected with the axial seat and the axle center 1, and the tension of the air cylinder 202 can be adjusted through a precise pressure regulating valve.
The shaft center 1 comprises a fixed block 109, a stator 101 fixed on the fixed block 109, a rotor 102 rotatably arranged in the stator 101, a suction nozzle rod 104 fixed on the rotor 102, a sliding block 3 fixed on one side of the fixed block 109, a vacuum tube 105 fixed on the sliding block 3 and communicated with one end of the suction nozzle rod 104, a second contact 106 fixed on the stator 101, and a permanent magnet 108 fixed on the fixed block 109; the other end of the suction nozzle rod 104 is used for connecting the suction nozzle 6, the stator 101 is arranged in the through hole 208, the sliding block 3 is arranged in the sliding rail 4 in a sliding manner, the first contact 206 and the second contact 106 are correspondingly arranged, and the second contact 106 is electrically connected with the equipment controller through the second lead 107.
The fixing block 109 is used to fix the stator 101, the slider 3, and the like, so that the shaft center 1 can conveniently move up and down on the shaft center seat 2. So that the suction nozzle 6 of the suction nozzle bar 104 automatically mounts the IC chip 5 with high mounting accuracy. The second power line 103 is used for connecting a power supply and an encoder signal line, and is convenient for power supply and signal transmission.
Specifically, the first contact 206 and the second contact 106 are performed by the device controller, the cylinder 202 is ventilated to lift the fixed block 109, the permanent magnet 108 is driven by the permanent magnet 108 and the voice coil motor coil 204, and the vibration effect is achieved; when the suction nozzle 6 of the suction nozzle rod 104 is used for taking a chip, the suction nozzle 6 contacts with the IC and then vacuum is opened through the electromagnetic valve to suck the IC, and when the IC contacts with the aluminum substrate 8 during the chip mounting, the electromagnetic valve is closed to vacuum so as to separate the IC from the suction nozzle 6; the rotor 102 rotates in the stator 101, so that the rotation angle of the suction nozzle 6 can be adjusted; therefore, the rotation angle of the suction nozzle 6 can be accurately controlled, the suction force and the mounting force can be accurately controlled, the accuracy of mounting can be ensured, the IC can not be damaged, and the operation is convenient.
Optionally, the device controller may be a micro control unit (Microcontroller Unit; MCU), also called a single-chip microcomputer or a single-chip microcomputer, for performing different combination control for different applications.
In this embodiment, the permanent magnet 108 is fixed on one side of the fixed block 109 and is slidably disposed in the voice coil motor coil 204; the air cylinder 202 is correspondingly arranged at the other side of the fixed block 109, and is used for pushing the fixed block 109 to move up and down so as to realize contact or separation between the first contact 206 and the second contact 106.
In this embodiment, the stator 101 is a servo motor.
Example two
As shown in fig. 5-6, an embodiment of the present invention provides a method for using a die bonder mounting head, including the following steps:
s1, setting patch parameters on a human-computer interface of equipment, wherein the patch parameters comprise suction buffer height, patch buffer height, suction speed and patch speed; and the suction nozzle 6 is stopped at the suction buffer height, and the air cylinder 202 applies pressure to the rotor 102 to prevent the suction nozzle rod 104 from shaking up and down relative to the chip head in the process of moving the suction nozzle 6 to the point of the suction buffer height;
s2, releasing pressure through the air cylinder 202, wherein the voice coil motor coil 204 applies preset pulling force to the rotor 102, the suction nozzle 6 slowly descends from the position of the suction buffer height at the suction speed until contacting the IC chip 5, and when the first contact 206 and the second contact 106 are just separated, the suction nozzle 6 stops pressing down and opens the vacuum tube 105;
s3, jacking the IC chip 5 to separate the IC chip 5 from the UV film through the ejector pin 7;
s4, the suction nozzle 6 slowly rises to the suction buffer height at the suction speed and sucks the IC chip 5;
s5, the air cylinder 202 applies pressure again to prevent the suction nozzle 6 from shaking in the moving process of the mounting head, and then the suction nozzle 6 moves to the position of the buffer height of the patch;
s6, the air cylinder 202 releases the pressure again, the suction nozzle 6 slowly descends to the position that the IC chip 5 contacts the aluminum substrate 8 at the surface mounting speed, and then the vacuum tube 105 of the suction nozzle 6 is closed;
s7, the suction nozzle 6 slowly rises to the position of the patch buffer height at the patch speed, so that the voice coil motor coil 204 always provides a pressing force in the suction and mounting process of the suction nozzle 6, and the air cylinder 202 only provides the pressing force in the moving process of the mounting head.
Specifically, setting patch parameters on a human-computer interface of the device, and stopping the suction nozzle 6 at the suction buffer height, wherein the air cylinder 202 applies pressure to the rotor 102 to prevent the suction nozzle rod 104 from shaking up and down relative to the patch head in the process that the suction nozzle 6 moves to the point of the suction buffer height; by releasing the pressure by the cylinder 202, the voice coil motor 204 applies a slight pulling force (the pulling force can be adjusted by parameters) to the rotor 102, the suction nozzle 6 slowly descends from the position of the suction buffer height at the suction speed until contacting the IC chip 5, and when the first contact 206 and the second contact 106 are just separated, the suction nozzle 6 stops pressing down and opens the vacuum tube 105; jacking the IC chip 5 through a thimble 7 until the IC chip 5 is separated from the UV film (jacking height is set through parameters); the suction nozzle 6 is slowly raised to the suction buffer height at the suction speed and sucks up the IC chip 5; the cylinder 202 applies pressure again to prevent the suction nozzle 6 from shaking during the movement of the mounting head, and then the suction nozzle 6 moves to the position of the patch buffer height; the air cylinder 202 releases the pressure again, the suction nozzle 6 slowly descends at the speed of the pasting until the IC chip 5 contacts the aluminum substrate 8, and then the vacuum tube 105 of the suction nozzle 6 is closed; the suction nozzle 6 is slowly lifted to the position of the buffer height of the patch at the speed of the patch, so that the voice coil motor 204 always provides a pressing force in the sucking and mounting process of the suction nozzle 6, and the air cylinder 202 only provides a pressing force in the moving process of the mounting head. The first contact 206 and the second contact 106 are subjected to ventilation by the device controller, the lifting of the fixed block 109 is realized by the ventilation of the air cylinder 202, the driving of the permanent magnet 108 is realized by the mutual driving of the permanent magnet 108 and the voice coil motor 204, and the vibration effect is realized; when the suction nozzle 6 of the suction nozzle rod 104 is used for taking a chip, the suction nozzle 6 contacts with the IC and then vacuum is opened through the electromagnetic valve to suck the IC, and when the IC contacts with the aluminum substrate 8 during the chip mounting, the electromagnetic valve is closed to vacuum so as to separate the IC from the suction nozzle 6; the rotor 102 rotates in the stator 101, so that the rotation angle of the suction nozzle 6 can be adjusted; therefore, the rotation angle of the suction nozzle 6 can be accurately controlled, the suction force and the mounting force can be accurately controlled, the accuracy of mounting can be ensured, the IC can not be damaged, and the operation is convenient.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any such modifications, equivalents, and improvements that fall within the spirit and principles of the present invention are intended to be covered by the following claims.
Claims (4)
1. The utility model provides a die bonder mounting head which characterized in that includes: the axle center seat and the axle center are arranged on the axial seat in a sliding way;
the axle center seat comprises a fixed seat, an air cylinder fixed on the fixed seat, an air pipe communicated with the air cylinder, a voice coil motor coil fixed on the fixed seat, a first power line connected with the voice coil motor coil, a sliding rail fixed on one side of the fixed seat and a first contact fixed on the fixed seat; the fixed seat is provided with a through hole in a penetrating way, the air cylinder and the voice coil motor coil are respectively arranged on two opposite sides of the through hole, and the first contact is electrically connected with the equipment controller through a first wire;
the axle center comprises a fixed block, a stator fixed on the fixed block, a rotor rotatably arranged in the stator, a suction nozzle rod fixed on the rotor, a sliding block fixed on one side of the fixed block, a vacuum tube fixed on the sliding block and communicated with one end of the suction nozzle rod, a second contact fixed on the stator, a second power line connected with the rotor and a permanent magnet fixed on the fixed block; the other end of the suction nozzle rod is used for being connected with a suction nozzle, the stator is arranged in the through hole, the sliding block is arranged in the sliding rail in a sliding manner, the first contact and the second contact are correspondingly arranged, and the second contact is electrically connected with the equipment controller through a second wire.
2. The die bonder mounting head as claimed in claim 1, wherein said permanent magnet is fixed to one side of said fixed block and is slidably disposed in said voice coil motor coil; the cylinder is correspondingly arranged on the other side of the fixed block and used for pushing the fixed block to move up and down so as to realize the contact or separation of the first contact and the second contact.
3. The die bonder mounting head as defined in claim 1 wherein said stator is a servo motor.
4. A method of using the die bonder mounting head of any one of claims 1-3, comprising the steps of:
s1, setting patch parameters on a human-computer interface of equipment, wherein the patch parameters comprise suction buffer height, patch buffer height, suction speed and patch speed; the suction nozzle stays at the suction buffer height, and in the process that the suction nozzle moves to the point of the suction buffer height, the air cylinder applies pressure to the rotor so as to prevent the suction nozzle rod from shaking up and down relative to the patch head;
s2, releasing pressure through the air cylinder, applying preset pulling force to the rotor by the voice coil motor coil, slowly descending the suction nozzle from the position of the suction buffer height at the suction speed until the suction nozzle contacts the IC chip, and stopping pressing down and opening the vacuum tube by the suction nozzle when the first contact and the second contact are just separated;
s3, jacking the IC chip through a thimble until the IC chip is separated from the UV film;
s4, the suction nozzle slowly rises to the suction buffer height at the suction speed and sucks the IC chip;
s5, the air cylinder applies pressure again to prevent the suction nozzle from shaking in the moving process of the mounting head, and then the suction nozzle moves to the position of the buffer height of the mounting head;
s6, the air cylinder releases pressure again, the suction nozzle slowly descends at the surface mounting speed until the IC chip contacts the aluminum substrate, and then the vacuum tube of the suction nozzle is closed;
s7, the suction nozzle slowly rises to the position of the patch buffer height at the patch speed, so that the voice coil motor coil always provides pressing force in the suction and mounting process of the suction nozzle, and the cylinder only provides pressing force in the moving process of the mounting head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310448545.8A CN116469805A (en) | 2023-04-24 | 2023-04-24 | Die bonder mounting head and use method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310448545.8A CN116469805A (en) | 2023-04-24 | 2023-04-24 | Die bonder mounting head and use method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116469805A true CN116469805A (en) | 2023-07-21 |
Family
ID=87180468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310448545.8A Pending CN116469805A (en) | 2023-04-24 | 2023-04-24 | Die bonder mounting head and use method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116469805A (en) |
-
2023
- 2023-04-24 CN CN202310448545.8A patent/CN116469805A/en active Pending
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