CN116469783A - Selective packaging method and packaging structure - Google Patents
Selective packaging method and packaging structure Download PDFInfo
- Publication number
- CN116469783A CN116469783A CN202310654009.3A CN202310654009A CN116469783A CN 116469783 A CN116469783 A CN 116469783A CN 202310654009 A CN202310654009 A CN 202310654009A CN 116469783 A CN116469783 A CN 116469783A
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- CN
- China
- Prior art keywords
- packaging
- layer
- demand
- selective
- shielding layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 57
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000005538 encapsulation Methods 0.000 claims abstract description 27
- 230000000873 masking effect Effects 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000010330 laser marking Methods 0.000 claims description 3
- 239000005022 packaging material Substances 0.000 abstract description 3
- 239000002390 adhesive tape Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention discloses a selective packaging method and a packaging structure, wherein the technology is improved on the basis of a universal mould, a shielding layer is arranged in a demand avoidance area for protection before packaging operation, the packaging layer in the demand avoidance area is removed after the whole packaging is finished, the shielding layer is removed to enable the demand avoidance area to be exposed, and the shielding layer is arranged to prevent elements in the demand avoidance area from being directly contacted with packaging materials and also prevent the elements in the demand avoidance area from being influenced and damaged by laser; the scheme of the invention can adopt a universal die to finish selective encapsulation, thereby reducing encapsulation cost and improving encapsulation efficiency.
Description
Technical Field
The present invention relates to the field of semiconductor packaging technology, and in particular, to a selective packaging method and a packaging structure.
Background
The 'selectable packaging' mode is a packaging mode which aims at a special design demand avoiding area of a pressure-sensitive component or a demand exposed component in system level packaging, in a traditional selectable packaging mode, a special packaging die is generally designed according to the demand avoiding area, the die is high in design precision requirement and high in cost, the corresponding exchange period is very long, the universality is not realized in similar products, the packaging cost is increased, and the packaging efficiency is reduced.
Disclosure of Invention
The invention aims to provide a selective packaging method and a packaging structure, which can solve the problems of cost increase and efficiency reduction caused by non-universal packaging molds in a selective packaging mode.
In order to achieve the above object, the present invention provides a selective packaging method, comprising:
a shielding layer is arranged in a demand avoiding area of the to-be-packaged body;
packaging the whole body to be packaged to form a packaging layer, wherein the packaging layer covers the shielding layer;
removing the encapsulation layer on the shielding layer;
and removing the shielding layer to expose the demand avoiding area.
Optionally, the shielding layer has the same size as the demand avoiding area.
Optionally, the shielding layer is configured to be positioned to match the demand avoidance area on the to-be-packaged body and to be in contact with the to-be-packaged body.
Optionally, the shielding layer includes a high temperature adhesive tape.
Optionally, the heat-resistant temperature range of the high-temperature adhesive tape is 120-260 ℃.
Optionally, the removing the encapsulation layer on the shielding layer includes: the encapsulation layer on the masking layer is removed using a laser.
Optionally, the laser comprises an infrared pulse or an ultraviolet pulse.
Optionally, before the shielding layer is disposed in the area where the package is to be avoided, the method further includes: and (5) surface mounting and plasma cleaning.
Optionally, the removing the shielding layer, after exposing the demand avoiding area, further includes: and (5) performing mounting and laser marking.
The invention also provides a packaging structure which is prepared by adopting the selective packaging method.
Compared with the prior art, the invention has the following beneficial effects: according to the technical scheme, the process is improved on the basis of a universal die, a shielding layer is arranged in a demand avoidance area for protection before packaging operation, the packaging layer in the demand avoidance area is removed after the whole packaging is finished, the shielding layer is removed to enable the demand avoidance area to leak out naked, the shielding layer not only prevents elements in the demand avoidance area from being in direct contact with packaging materials, but also protects the elements in the demand avoidance area from being influenced and damaged by laser; the scheme of the invention can adopt a universal die to finish selective encapsulation, thereby reducing encapsulation cost and improving encapsulation efficiency.
Drawings
FIG. 1 is a flow chart of a method of selective encapsulation according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an alternative packaging method according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a second alternative packaging method according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a third alternative packaging method according to an embodiment of the present invention;
fig. 5 is a top view of a package to be packaged according to an embodiment of the invention.
1-packaging a body to be packaged; 2-a masking layer; 3-packaging layer; 4-demand avoidance area.
Detailed Description
The present invention will be described in more detail below with reference to the drawings, in which preferred embodiments of the invention are shown, it being understood that one skilled in the art can modify the invention herein described while still achieving the advantageous effects of the invention. Accordingly, the following description is to be construed as broadly known to those skilled in the art and not as limiting the invention.
The invention is more particularly described by way of example in the following paragraphs with reference to the drawings. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for convenience and clarity in aiding in the description of embodiments of the invention.
The invention provides a selective packaging method, please refer to fig. 1-4, comprising the following steps:
s1, arranging a shielding layer 2 in a demand avoiding area 4 of a to-be-packaged body 1;
s2, packaging the whole body of the to-be-packaged body 1 to form a packaging layer 3, wherein the packaging layer 3 covers the shielding layer 2;
s3, removing the packaging layer 3 on the shielding layer 2;
s4, removing the shielding layer to expose the demand avoiding area.
In step S1, the shielding layer 2 is preferably the same size as the demand avoidance area 4, i.e. the shielding layer 2 has the same area as the demand avoidance area 4.
In other embodiments, the size of the shielding layer 2 may be slightly larger than the size of the demand avoiding area 4, that is, the area of the shielding layer 2 may be slightly larger than the area of the demand avoiding area 4, and may also be adjusted according to actual demands.
The shielding layer 2 is configured to be positioned to match the demand avoidance area 4 on the package 1 and to be able to contact the package 1.
The shielding layer 2 plays a role in protecting the elements in the demand avoiding area 4, in the step S2, the to-be-packaged body 1 is integrally packaged to form the packaging layer 3, the packaging layer 3 covers the shielding layer 2, the shielding layer 2 on the demand avoiding area 4 is in contact with the packaging layer 3, and direct contact between the pressure-sensitive components or the demand exposed components on the demand avoiding area 4 and the packaging layer 3 is avoided.
In an embodiment of the present invention, preferably, the shielding layer includes a high temperature adhesive tape.
In other embodiments, the shielding layer may be other high temperature resistant materials, or other protective materials.
Preferably, in the embodiment of the present invention, the heat-resistant temperature range of the high-temperature adhesive tape is 120-260 ℃, and in the removal process, the high-temperature adhesive tape plays a secondary protection role on the pressure-sensitive component or the exposed component on the area 4 is avoided, so as to prevent the damage of the laser on the pressure-sensitive component or the exposed component.
In step S3, please refer to fig. 2, the encapsulation layer 3 of the demand avoidance region 4 is removed by using a laser.
Specifically, the laser used in the removal process includes an infrared pulse or an ultraviolet pulse.
In other embodiments, the laser energy and pulse type can be adjusted to avoid damage to the device caused by the laser with too high energy during the removal process.
Referring to fig. 3, after the encapsulation layer 3 on the demand avoiding area 4 is removed, the shielding layer 2 is exposed, and after the shielding layer 2 is removed, referring to fig. 4-5, the demand avoiding area 4 is exposed.
In the embodiment of the present invention, it is preferable that when a high temperature adhesive tape is used as the shielding layer 2, the high temperature adhesive tape may be torn, and in other embodiments, if other heat-resistant materials are selected, an auxiliary tool may be used to remove the shielding layer 2.
Further, the step S1 further includes the steps of: surface Mount Technology (SMT) and Plasma cleaning (Plasma) are performed.
Further, the step S4 further includes the steps of: mounting (SMT 2) and laser marking.
The embodiment of the invention also provides a packaging structure, and please continue to refer to fig. 4, and the packaging structure is prepared by adopting the selective packaging method, so that the prepared packaging structure can meet the requirement of selective packaging.
In summary, the technical improvement is performed on the basis of the universal die, the shielding layer is arranged in the demand avoidance area for protection before packaging operation, the packaging layer in the demand area is removed by using laser after plastic packaging is completed, the shielding layer is removed to enable the demand avoidance area to leak out, the shielding layer not only prevents elements in the demand avoidance area from being in direct contact with packaging materials, but also protects the elements in the demand avoidance area from being influenced and damaged by the laser; the scheme of the invention can adopt a universal die to finish selective encapsulation, reduces the encapsulation cost and improves the encapsulation efficiency, and selects the high-temperature adhesive tape as a shielding layer, so that the material cost is low and the operation is simple.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (10)
1. A method of selective encapsulation comprising:
a shielding layer is arranged in a demand avoiding area of the to-be-packaged body;
packaging the whole body to be packaged to form a packaging layer, wherein the packaging layer covers the shielding layer;
removing the encapsulation layer on the shielding layer;
and removing the shielding layer to expose the demand avoiding area.
2. The selective encapsulation method of claim 1, wherein the masking layer is the same size as the demand avoidance region.
3. The selective encapsulation method of claim 1, wherein the masking layer is configured to be positionally matable with the demand avoidance area on the to-be-encapsulated body and to be contactable to the to-be-encapsulated body.
4. The selective encapsulation method of claim 1, wherein the masking layer comprises a high temperature tape.
5. The selective encapsulation method of claim 4, wherein the high temperature tape has a heat resistant temperature in the range of 120-260 ℃.
6. The selective encapsulation method of claim 1, wherein the removing the encapsulation layer on the masking layer comprises: the encapsulation layer on the masking layer is removed using a laser.
7. The selective encapsulation method of claim 6, wherein the laser light comprises an infrared pulse or an ultraviolet pulse.
8. The selective packaging method according to claim 1, wherein before the shielding layer is disposed in the area where the demand is avoided, the method further comprises the steps of: and (5) surface mounting and plasma cleaning.
9. The selective encapsulation method of claim 1, wherein the removing the masking layer to expose the demand avoidance region further comprises: and (5) performing mounting and laser marking.
10. A package structure, characterized in that it is prepared by the selective encapsulation method according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310654009.3A CN116469783A (en) | 2023-06-05 | 2023-06-05 | Selective packaging method and packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310654009.3A CN116469783A (en) | 2023-06-05 | 2023-06-05 | Selective packaging method and packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116469783A true CN116469783A (en) | 2023-07-21 |
Family
ID=87182762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310654009.3A Pending CN116469783A (en) | 2023-06-05 | 2023-06-05 | Selective packaging method and packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116469783A (en) |
-
2023
- 2023-06-05 CN CN202310654009.3A patent/CN116469783A/en active Pending
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