CN116454014B

CN116454014B - Wafer clamping device

Info

Publication number: CN116454014B
Application number: CN202310702095.0A
Authority: CN
Inventors: 田文康; 范雄; 王兆丰
Original assignee: Wuxi Shangji Semiconductor Technology Co ltd
Current assignee: Wuxi Shangji Semiconductor Technology Co ltd
Priority date: 2023-06-14
Filing date: 2023-06-14
Publication date: 2023-09-05
Anticipated expiration: 2043-06-14
Also published as: CN116454014A

Abstract

The application discloses a wafer clamping device, which comprises a tray, a rotary limiting block and at least two groups of fixed limiting components, wherein one group of fixed limiting components comprises two fixed limiting blocks, a bracket is arranged on each fixed limiting block, and a supporting table is arranged on each rotary limiting block; the fixed limiting block can be used as a clamping reference, so that the wafer is clamped at a preset position; the distance between the rotary limiting block and the fixed limiting component can be changed through rotation, so that the three limiting blocks can clamp wafers with different specifications; the wafer is supported through the cooperation of the bracket and the supporting table, and the three limiting blocks can lift the wafer, so that the back surface of the wafer is prevented from being damaged; the clamping device can clamp wafers with more specifications by additionally arranging the fixed limiting assembly; the supporting grooves of different groups are located at different heights, the positions of the supporting grooves far away from the rotary limiting blocks are higher, and the supporting grooves are matched with the supporting tables of corresponding heights, so that wafers can be stably supported, and the supported wafers can be prevented from being interfered by other groups of fixed limiting components.

Description

Wafer clamping device

Technical Field

The application relates to the field of semiconductor manufacturing equipment, in particular to a wafer clamping device.

Background

In semiconductor processing, it is often necessary to transfer the wafer using a robot arm to facilitate the wafer to the desired process chamber. In order to control the position of the wafer on the robot, a clamping device is usually disposed on the robot, and the wafer is fixed by the clamping device and the position of the wafer is limited by using a preset clamping position.

With the rapid development of the semiconductor industry, wafers with various sizes are appeared in the market, and the clamping device with single clamping amount is difficult to meet the clamping needs of wafers with different sizes.

In the prior art, a spring is arranged on a clamping device, and the specification of a wafer is adapted through the deformation of the spring; however, the elasticity of the spring is uncontrollable, so that the wafer is easy to be concentric, and the wafer is positioned on the manipulator differently, thereby increasing the complexity of logic control; meanwhile, the spring also has the condition of weakening elasticity along with the time, and the problem that the wafer is loose and even falls easily occurs in the process of clamping the wafer.

Disclosure of Invention

The application aims to overcome the defects in the prior art and provide a wafer clamping device.

To achieve the above technical object, the present application provides a wafer clamping apparatus, including: a tray for receiving a wafer; the fixed limiting assemblies are arranged on the tray, and each fixed limiting assembly comprises two fixed limiting blocks which are provided with bracket grooves; the rotary limiting block is rotatably arranged on the tray and is provided with a supporting table; the brackets on the two fixed limiting blocks of the same group of fixed limiting components are positioned at the same height, and the brackets on the fixed limiting blocks of different groups of fixed limiting components are positioned at different heights; the more the distance from the rotary limiting block to the bracket, the higher the height of the bracket is; at least two layers of pallets are arranged on the rotary limiting block, and each layer of pallet can independently rotate to approach or depart from the fixed limiting component; the part of the fixed limiting block, which is used for pressing the wafer, is arc-shaped, and the arc-shaped surface of the bracket can be attached to the side edge of the wafer; the bracket and the bracket at the same horizontal plane can support the wafer in a matched manner; the rotary limiting block and two fixed limiting blocks in any group of fixed limiting components are arranged in a triangular mode; the wafer clamping device also comprises a turntable, and the turntable is arranged on the tray and can rotate automatically; the rotary limiting block is arranged on the turntable and is far away from the rotating shaft of the turntable; the tray is provided with a mounting groove, and the turntable is embedded in the mounting groove.

Further, at least two groups of fixed limiting components are arranged on the tray, and the rotation center of the rotation limiting block is positioned on the middleline of the two fixed limiting blocks of each group of fixed limiting components.

Further, the part of the fixed limiting block for pressing the wafer is set to be an elastic structure.

Further, the fixed limiting block is detachably arranged on the tray.

Further, two groups of fixed limiting components are arranged on the tray; two groups of mounting holes are formed in the tray, any one group of mounting holes are used for mounting a group of fixed limiting assemblies, and any one fixed limiting block is detachably connected with one mounting hole.

Further, the part of the rotary limiting block for pressing the wafer is arc-shaped; and/or the part of the rotary limiting block for pressing the wafer is set to be an elastic structure.

Further, the rotary limiting block is detachably arranged on the turntable; alternatively, the turntable is removably disposed on the tray.

Further, the wafer clamping device further comprises a rotary driving piece, and the rotary driving piece is used for driving the turntable to rotate.

Further, a clearance groove is formed in the tray, and after the tray receives the wafer, part of the wafer is hung on the clearance groove.

Further, the tray is provided with air holes, and after the tray receives the wafers, the negative pressure equipment can adsorb the wafers through the air holes; and/or the tray is provided with an anti-slip strip.

The application provides a wafer clamping device, which comprises a tray, a rotary limiting block and at least two groups of fixed limiting components, wherein one group of fixed limiting components comprises two fixed limiting blocks, a bracket is arranged on each fixed limiting block, and a supporting table is arranged on each rotary limiting block; the fixed limiting block can be used as a clamping reference, so that the wafer is clamped at a preset position conveniently, the wafer is ensured to fall accurately, logic control can be simplified, and the accuracy and reliability of the feeding operation and the discharging operation on the wafer are ensured; the rotary limiting block can change the distance between the rotary limiting block and the fixed limiting component through rotation, so that the rotary limiting block rotates by different angles, and the three limiting blocks can clamp wafers with different sizes; the wafer is supported through the cooperation of the bracket and the supporting table, and the three limiting blocks can lift the wafer, so that the back surface of the wafer is prevented from directly contacting the tray, and the back surface of the wafer is prevented from being damaged; in addition, the clamping device can clamp wafers with more specifications by additionally arranging the fixed limiting assembly; the supporting grooves of different groups are located at different heights, the positions of the supporting grooves far away from the rotary limiting blocks are higher, and the supporting grooves are matched with the supporting tables of corresponding heights, so that wafers can be stably supported, the supported wafers can be prevented from being interfered by other groups of fixed limiting assemblies, and the safety and reliability of wafer supporting are guaranteed.

Drawings

FIG. 1 is a schematic view of a first wafer clamping apparatus according to the present application;

FIG. 2 is a schematic diagram of a second wafer clamping apparatus according to the present application;

FIG. 3 is a schematic view of a third wafer clamping apparatus according to the present application;

FIG. 4 is a schematic diagram of a fourth wafer clamping apparatus according to the present application;

FIG. 5 is an enlarged view of the in-loop structure of FIG. 4;

FIG. 6 is a schematic view of a rotation stopper and a turntable in the wafer clamping apparatus shown in FIG. 4;

FIG. 7 is a schematic view of the wafer clamping device of FIG. 4 clamping a 6 inch wafer;

FIG. 8 is a schematic view of the wafer clamping device of FIG. 4 clamping an 8 inch wafer;

FIG. 9 is a schematic diagram of the wafer clamping device of FIG. 4 clamping two different sizes of wafers;

FIG. 10 is a schematic view of the wafer clamping apparatus of FIG. 4 clamping a 6 inch wafer;

FIG. 11 is a schematic view of the wafer clamping apparatus of FIG. 4 clamping an 8 inch wafer.

Reference numerals:

1-rotation axis, 2-rotation axis, 3-rotation axis

10-of a tray, 11-of a mounting groove, 13-of a clearance groove, 14-of an air hole and 15-of an anti-slip strip;

20a or 20 b-fixed limiting block, 20 c-rotating limiting block, 21-bracket, 22-bracket;

31-a turntable, 32-a rotary drive;

a-6 inch wafer and B-8 inch wafer.

Detailed Description

In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.

The application provides a wafer clamping device, which comprises: a tray 10 for receiving a wafer; the fixed limiting assembly is arranged on the tray 10 and comprises two fixed limiting blocks 20a and 20b, and a bracket 21 is arranged on the fixed limiting blocks; a rotation limiting block 20c, wherein the rotation limiting block 20c is rotatably arranged on the tray 10, and a supporting table 22 is arranged on the rotation limiting block 20 c; the bracket 21 and the bracket 22 can cooperatively support the wafer when being positioned on the same horizontal plane; wherein, the rotary limiting block 20c and two fixed limiting blocks 20a and 20b in the fixed limiting component are arranged in a triangle; the rotating limiting block 20c is enabled to rotate, and the distance between the rotating limiting block 20c and the fixed limiting component can be changed, so that the two fixed limiting blocks 20a and 20b and the rotating limiting block 20c can be matched to clamp a wafer.

Referring specifically to fig. 1 or 2, in the illustrated embodiment, a set of fixed limiting components is disposed on the tray 10, two fixed limiting blocks 20a and 20b are disposed at intervals along the left-right direction, and a rotating limiting block 20c is disposed above the fixed limiting components and between the two fixed limiting blocks 20a and 20 b. The rotary limiting block 20c is enabled to rotate, the rotary limiting block 20c can be far away from the fixed limiting component, and at the moment, the space between the three limiting blocks is increased, so that the wafer can be conveniently placed in and taken out; after a wafer is placed between the three stoppers, the rotation stopper 20c is rotated reversely, and the rotation stopper 20c can be brought close to the wafer against the fixed stoppers 20a and 20 b.

Since the fixed stoppers 20a and 20b are fixedly provided on the tray 10, the fixed stoppers 20a and 20b can serve as references for clamping; specifically, when the clamping device is operated, the wafer is made to abut against the fixed stoppers 20a and 20b, and the falling position of the wafer on the clamping device is necessarily determined due to the position determination of the fixed stoppers 20a and 20 b.

Especially when the automatic equipment such as robots and manipulators is adopted to carry out the loading and unloading operations of the wafers on the clamping device, the preset position of the fixed limiting assembly is used as the reference of the running path of the automatic equipment, so that the logic control can be simplified, and the accuracy and the reliability of the loading and unloading operations are ensured.

Because the distance between the rotary limiting block 20c and the fixed limiting component can be changed through rotation, the rotary limiting block 20c can rotate by different angles, and the three limiting blocks can also clamp wafers with different sizes.

For example, in the embodiment shown in fig. 1 or fig. 2, when the angle of the reverse rotation of the rotation limiting block 20c is smaller, the wafer with larger specification can be propped against; when the angle of the reverse rotation of the rotation limiting block 20c is larger, the wafer with smaller specification can be propped against; therefore, the clamping device can clamp wafers with various specifications, and the applicability of the clamping device is improved.

In addition, the wafer is supported by the supporting groove 21 and the supporting table 22 in a matched mode, the three limiting blocks can lift the wafer, so that the back surface of the wafer is prevented from directly contacting the tray 10, the contact area between the supporting groove 21 and the supporting table 22 and the wafer is small, and the back surface of the wafer can be prevented from being damaged; the non-contact support design can function to protect the wafer, especially when the backside of the wafer has a process structure.

Further, the present application provides a wafer clamping apparatus, including: a tray 10 for receiving a wafer; at least two groups of fixed limiting components are arranged on the tray 10, one group of fixed limiting components comprises two fixed limiting blocks 20a and 20b, and a bracket 21 is arranged on each fixed limiting block; the rotation stopper 20c, the rotation stopper 20c is rotatably disposed on the tray 10, and the support stand 22 is disposed on the rotation stopper 20c.

Further, the brackets 21 on the two fixed limiting blocks 20a and 20b of the same set of fixed limiting components are at the same height, and the brackets 21 on the fixed limiting blocks 20a and 20b of different sets of fixed limiting components are at different heights; the farther from the rotation stopper 20c, the higher the height of the bracket 21; the height of the supporting table 22 is adjustable, or at least two layers of supporting tables 22 are arranged on the rotary limiting block 20 c; the bracket 21 and the pallet 22 at the same level can cooperatively support the wafer.

Wherein the rotary limiting block 20c and two fixed limiting blocks 20a and 20b in any group of fixed limiting components are arranged in a triangular manner; the rotating limiting block 20c is enabled to rotate, and the distance between the rotating limiting block 20c and the fixed limiting component can be changed, so that the two fixed limiting blocks 20a and 20b and the rotating limiting block 20c can be matched to clamp a wafer.

Referring specifically to fig. 3, in the illustrated embodiment, two sets of fixed limiting components are provided on the tray 10, the first set of fixed limiting components is disposed above and near the rotational limiting block 20c, and the second set of fixed limiting components is disposed below and far from the rotational limiting block 20c. The first group of fixed limiting components can be matched with the rotary limiting block 20c to clamp the wafer with smaller size, and the second group of fixed limiting components can be matched with the rotary limiting block 20c to clamp the wafer with larger size.

It is easy to understand that the farther away from the rotational stop block 20c, the greater the distance between the fixed stop assembly and the rotational stop block 20c, and the greater the wafer that the two can support in cooperation.

Therefore, through addding fixed spacing subassembly, clamping device can the centre gripping more specification wafer.

At present, two crystal compass grids are the most main crystal compass grids in the market, namely six inches and eight inches. Referring to fig. 4 to 8, in the illustrated embodiment, two sets of fixed limiting components are disposed on the tray 10, wherein a first set of fixed limiting components can be matched with the rotating limiting block 20c to clamp the 6 inch wafer a, and a second set of fixed limiting components can be matched with the rotating limiting block 20c to clamp the 8 inch wafer B.

Referring to fig. 9 in combination, the first set of fixed stop assemblies is lower than the second set of fixed stop assemblies; the bracket 21 on the two fixed limiting blocks 20a and 20b of the first group of fixed limiting components is arranged at a low position, and the bracket 21 on the two fixed limiting blocks 20a and 20b of the second group of fixed limiting components is arranged at a position higher than that of the first group of fixed limiting components; when the first group of fixed limiting components are matched with the rotary limiting block 20c to support the wafer, the wafer is suspended above the tray 10; when the second set of fixed limiting components cooperate with the rotating limiting block 20c to support the wafer, the wafer is suspended above the first set of fixed limiting components.

The brackets 21 of different groups are positioned at different heights, and the positions of the brackets 21 far away from the rotary limiting block 20c are higher, so that the supported wafer can be prevented from being interfered by other groups of fixed limiting components, and the safety and the reliability of the wafer support are ensured.

In order to ensure the stability of clamping the wafer, the supporting table 22 on the rotary limiting block 20c and the supporting groove 21 for fixing the limiting component need to be arranged at the same height; so that the surfaces of the supporting table 22 and the supporting groove 21 for supporting the wafer are positioned in the same plane, and the wafer is uniformly clamped, and is not easy to deform or damage.

Because brackets 21 of different sets of fixed stop assemblies are at different height positions, in one embodiment, the height of the brackets 22 is adjustable to ensure that the brackets 22 on the rotational stop block 20c are compatible therewith.

For example, the tray 10 is provided with screw holes, and the screw holes extend in the vertical direction; the rotation limiting block 20c is provided with a thread section, and the rotation limiting block 20c can be in threaded connection with a threaded hole in the tray 10 through the thread section. During installation and debugging, according to the bearing requirement of the wafer, the rotary limiting block 20c rotates relative to the tray 10 through the threaded structure, and the height of the supporting table 22 can be adjusted, so that the supporting table 22 and the corresponding supporting groove 21 are located at the same height.

For another example, the rotational stop 20c includes at least two joinable structures such that a different number of joinable structures are assembled together, i.e., the height of the pallet 22 can be adjusted.

For example, the rotation stopper 20c is configured to be folded, and is configured to be unfolded so as to increase the height of the pallet 22, and folded so as to be folded so as to reduce the height of the pallet 22.

For example, the rotation stopper 20c has a telescopic structure, and extends out of the telescopic portion to increase the height of the pallet 22, and compresses the telescopic portion to decrease the height of the pallet 22.

The application is not limited to the manner in which the height of the pallet 22 is adjusted.

In another embodiment, the rotation limiting block 20c is provided with at least two layers of brackets 22, and the brackets 22 of different layers are used for matching with the brackets 21 of different heights.

Referring specifically to fig. 4 to 8, in the illustrated embodiment, two sets of fixed limiting components are provided on the tray 10, two layers of pallets 22 are provided on the rotating limiting block 20c, and the two layers of pallets 22 are arranged along the vertical direction; the first layer of supporting table 22 and the supporting groove 21 of the first group of fixed limiting components are positioned at the same height, and can support the 6-inch wafer A in cooperation with the first group of fixed limiting components; the second layer of supporting table 22 and the supporting groove 21 of the second group of fixed limiting components are positioned at the same height, and can support the 8-inch wafer B in cooperation with the second group of fixed limiting components.

The tray table 22 is directly added on the rotary limiting block 20c, so that the problem that the height of the rotary limiting block 20c needs to be additionally adjusted according to the wafer size when only one tray table 22 is arranged can be avoided, and the operation of clamping wafers with different specifications by the clamping device is simplified.

In one embodiment, the tray 10 receives only one wafer at a time.

Referring specifically to fig. 7 and 8, in the illustrated embodiment, two sets of fixed stop assemblies are provided on the tray 10, a first set of fixed stop assemblies being used to support a 6 inch wafer a and a second set of fixed stop assemblies being used to support an 8 inch wafer B.

Referring to fig. 10 in combination, the rotating limiting block 20c is far away from the two groups of fixed limiting components, so that the 6-inch wafer a is placed between the three limiting blocks by manual or feeding equipment; after the two fixed limiting blocks 20a and 20b of the first group of fixed limiting components support the 6-inch wafer A, the rotating limiting block 20c rotates by a preset angle to prop against the wafer, so that the wafer is clamped by the three limiting blocks; thus, 6-inch wafer a was fixed at a preset position.

Referring to fig. 11 in combination, the rotating limiting block 20c is far away from the two groups of fixed limiting components, so that 8-inch wafers B can be placed between the three limiting blocks by manual or feeding equipment; after the two fixed limiting blocks 20a and 20B of the second group of fixed limiting components support the 8-inch wafer B, the rotating limiting block 20c rotates by another preset angle to prop against the wafer, so that the wafer is clamped by the three limiting blocks; thus, 8-inch wafer B was fixed at a preset position.

It should be noted that, in the illustrated embodiment, the clamping device is only used to clamp 6-inch and 8-inch wafers B; the positions of the first group of fixed limiting assemblies and the second group of fixed limiting assemblies are determined, so that the feeding position of the wafer can be determined; because the size of the wafer is determined, the angle through which the rotation stopper 20c rotates can also be determined; therefore, after the 6-inch or 8-inch wafer B is fed, the rotary limiting block 20c rotates by a corresponding preset angle, and the clamping and positioning of the wafer can be rapidly and accurately realized.

In another embodiment, at least two sets of fixed limiting components are disposed on the tray 10, at least two layers of pallets 22 are disposed on the rotating limiting block 20c, and each layer of pallet 22 can independently rotate to approach or separate from the fixed limiting components.

In this embodiment, the clamping device is capable of simultaneously receiving a plurality of wafers of different specifications. For example, referring to fig. 4, the rotation limiting block 20c is provided with two layers of pallets 22, the first layer of pallets 22 is arranged below and corresponds to the first group of fixed limiting components, and the second layer of pallets 22 is arranged above and corresponds to the second group of fixed limiting components; the first layer of pallets 22 are rotatably arranged on the pallet 10, the second layer of pallets 22 are rotatably arranged on the first layer of pallets 22, and the two layers of pallets 22 can rotate independently; referring to fig. 9, the clamping device supports two wafers simultaneously, wherein the first set of fixed limiting components cooperate with the first layer support 22 to support the 6 inch wafer a, the second set of fixed limiting components cooperate with the second layer support 22 to support the 8 inch wafer B, and the 8 inch wafer B is positioned above the 6 inch wafer a, and the two wafers are not interfered with each other.

It will be readily appreciated that three or more sets of fixed stop assemblies can be provided on the tray 10, if desired.

Optionally, at least two sets of fixed limiting components are provided on the tray 10, and the rotation center of the rotation limiting block 20c is located on the middle vertical line of the two fixed limiting blocks 20a and 20b of each set of fixed limiting components.

Referring specifically to fig. 3, in the illustrated embodiment, the rotation center of the rotation stopper 20c is the rotation shaft 1; two groups of fixed limiting components are arranged on the tray 10 and are arranged at intervals along the vertical direction; two fixed limiting blocks 20a and 20b of any group of fixed limiting components are arranged at intervals along the left-right direction; the spacing between the two fixed stoppers 20a and 20b of the upper first set of fixed stop assemblies is smaller and the spacing between the two fixed stoppers 20a and 20b of the lower second set of fixed stop assemblies is larger.

More specifically, in the embodiment shown in fig. 3, the rotation shaft 1 is located on both the midplane of the two fixed stoppers 20a and 20b of the first set of fixed stopper assemblies and the midplane of the two fixed stoppers 20a and 20b of the second set of fixed stopper assemblies; so that the rotation limiting block 20c and the two groups of fixed limiting components are arranged in a triangle of isosceles triangle.

So set up, when three stopper cooperation centre gripping wafer, the wafer possesses fine stability.

In order to facilitate the supporting groove 21 to abut against and fix the wafer, in one embodiment, the supporting groove 21 is obliquely extended, so that the portion of the fixed limiting block for abutting against the wafer is an inclined plane, and the inclined planes of the two fixed limiting blocks of the same group of fixed limiting components are inclined in opposite directions.

It is easy to understand that the portion of the fixed stopper for pressing the wafer is the groove wall of the bracket 21.

Referring to fig. 1 or fig. 3, in the illustrated embodiment, two fixed limiting blocks 20a and 20b of a set of fixed limiting components are arranged at intervals along the left-right direction, the bracket 21 on the fixed limiting block 20a is inclined downwards from left to right, the bracket 21 on the fixed limiting block 20b is inclined upwards from left to right, and the two brackets 21 are symmetrically arranged to form a V-shaped clamping groove. At this time, the two brackets 21 can cooperate to support the wafer, on the one hand, the upper end opening of the V-shaped clamping groove is large, which is favorable for placing the wafer, on the other hand, along with the continuous shrinkage of the lower end of the V-shaped clamping groove, the wafer can be guided to displace to a proper position until the wafer is clamped by the two brackets 21.

Through setting up bracket 21 slope extension, the wafer of different specifications can support the different positions of inclined plane, so, can enough guarantee that the inclined plane supports the wafer, play the effect of fixed wafer, can avoid the bracket 21 level to set up the time again, the wafer supports the corner of leaning on bracket 21 to harm the wafer when avoiding the centre gripping.

In order to avoid the wafer sliding down along the inclined plane when the inclined plane is matched with the rotary limiting block 20c to clamp the wafer, optionally, the end of the inclined plane, which is far away from the rotary limiting block 20c, is provided with a plane, and the plane can assist in supporting the wafer and avoid the wafer sliding down.

In another embodiment, the portion of the fixed limiting block for pressing the wafer is arc-shaped.

Optionally, the part of the fixed limiting block for pressing the wafer is in a convex arc shape.

For example, the bracket 21 is used for abutting against the groove wall of the wafer to form an arc shape protruding towards the wafer, so that the fixed limiting block is matched with the rotary limiting block 20c to clamp wafers with different specifications, and sharp structures such as corners and the like can be prevented from damaging the wafer during clamping.

Optionally, the portion of the fixed limiting block for pressing the wafer is in a concave arc shape.

For example, in the embodiment shown in fig. 2, the bracket 21 is configured to be recessed toward the wafer by abutting against the groove wall of the wafer, so that the arc surface of the groove wall can be attached to the side edge of the wafer, thereby ensuring the stability of clamping the wafer.

Optionally, the part of the fixed limiting block for pressing the wafer is set to be an elastic structure.

The elastic structure has the ability to deform and recover.

In one embodiment, the part of the fixed limiting block for abutting against the wafer is provided with an elastic block, and the elastic block can be made of elastic materials such as rubber, plastic and the like; when the fixed limiting block is matched with the rotary limiting block 20c to clamp the wafer, the wafer can squeeze the elastic block, the elastic block is compressed to generate elastic force, and the elastic force can reversely prop against the wafer, so that the clamping force of the clamping device is ensured; meanwhile, the deformed elastic block can further increase the friction force between the fixed limiting block and the wafer, so that the wafer is prevented from slipping in the clamping state. Meanwhile, the elastic setting of the elastic block is also beneficial to the clamping device to clamp wafers with different specifications.

In another embodiment, the elastic structure is a balloon. The spacing between the fixed limiting block and the rotary limiting block 20c can be adjusted by controlling the inflation amount of the air bag, so that the clamping device can clamp wafers with different specifications. Meanwhile, because the compressibility of gas is strong, when the fixed limiting block is matched with the rotary limiting block 20c to clamp the wafer, the wafer can squeeze the air bag, so that the effects of enhancing the clamping force, increasing the friction force and the like are achieved.

The application is not limited to the specific configuration of the elastic structure.

Optionally, a fixed stopper is detachably provided on the tray 10.

It is easy to understand that fixed stopper is used for contacting the wafer, belongs to the wearing part for fixed stopper detachable setting can be convenient to overhaul, maintain, change etc. to fixed stopper and handle.

In one embodiment, the tray 10 is provided with a screw hole, the fixed limiting block is provided with a screw thread section, and the fixed limiting block can be in threaded connection with the screw hole on the tray 10 through the screw thread section; so that the fixed stopper can be fixed or removed by rotating the fixed stopper relative to the tray 10.

In another embodiment, the tray 10 is provided with a positioning hole, the fixed limiting block is provided with a pin portion, and the fixed limiting block can be tightly matched with the positioning hole on the tray 10 through the pin portion.

In yet another embodiment, a clamping groove is formed on the tray 10, a clamping block is formed on the fixed limiting block, and the fixed limiting block can be clamped with the clamping groove on the tray 10 through the clamping block.

The application is not limited to the mounting mode of the fixed limiting block.

In one embodiment, referring to fig. 3 or 4, two sets of fixed limiting assemblies are provided on the tray 10; at this time, two groups of mounting holes are formed in the tray 10, and any mounting hole can be used for mounting a group of fixed limiting assemblies; any fixed limiting block is detachably connected with a mounting hole.

In this embodiment, if the clamping device is only used to receive one wafer at a time, it may be used with only one set of fixed stop assemblies. Specifically, the group of fixed limiting components are installed in a proper installation hole according to the clamping requirement of the wafer specification; before clamping another specification of wafer, the fixed limiting block is detached and is installed in other mounting holes, so that the use requirement can be met.

Similarly, more mounting holes with different positions can be arranged on the tray 10, and the fixed limiting block is detachably connected with the mounting holes; before clamping operation, a proper mounting hole is selected to mount and fix a limiting block according to the requirement of the wafer specification to be clamped, so that the requirement of more various wafer clamping is met.

The present application is not limited to the manner of rotation mounting of the rotation stopper 20c.

In one embodiment, the rotation limiting block 20c is rotatably disposed on the tray 10 through the rotation shaft 1, and the rotation shaft 1 is eccentrically disposed.

Referring specifically to fig. 1, in the illustrated embodiment, a tray 10 is provided with a set of fixed limiting components, and two fixed limiting blocks 20a and 20b are arranged at intervals along the left-right direction; the rotating shaft 1 is arranged above the fixed limiting component, and the rotating shaft 1 is positioned on the midverticals of the two fixed limiting blocks 20a and 20 b. The portion of the rotation stopper 20c near the edge is connected to the rotation shaft 1, and the rotation stopper 20c can rotate around the rotation shaft 1.

Because the rotating shaft 1 is eccentrically arranged, when the rotating limiting block 20c rotates around the rotating shaft 1, the part of the rotating limiting block, which is used for abutting against the wafer, can be close to or far away from the fixed limiting component.

With continued reference to fig. 1, in the illustrated embodiment, the rotational stopper 20c is configured to be cylindrical, and the rotational stopper 20c is circular in a top view; the rotating shaft 1 is arranged away from the center of the rotation limiting block 20c, so that eccentric rotation of the rotation limiting block 20c is realized.

In other embodiments, the rotation limiting block 20c may be provided with other shapes, as long as the rotation limiting block 20c is guaranteed to have a distance between the portion for abutting against the wafer and the rotation shaft 1 when rotating around the rotation shaft 1.

In another embodiment, the rotation limiting block 20c is a special-shaped cam, the special-shaped cam can rotate around the rotation shaft 2 relative to the tray 10, and the distance between the wheel surface of the special-shaped cam and the rotation shaft 2 is not unique.

Referring specifically to fig. 2, in the illustrated embodiment, a side of the rotation stopper 20c for contacting the wafer is configured as an arc, and the arc side forms a tread of the profile cam; the distances between the arc-shaped side parts and the rotating shaft 2 are changed, and the arc-shaped side parts are close to the rotating shaft 2 and the arc-shaped side parts are far away from the rotating shaft 2. Therefore, when the special-shaped cam rotates around the rotating shaft 2, the part close to the rotating shaft 2 faces the fixed limiting component, the distance between the rotating limiting block 20c and the fixed limiting component is increased, and the wafer is conveniently placed in the special-shaped cam; so that the part far away from the rotating shaft 2 is close to the fixed limiting component, the distance between the rotating limiting block 20c and the fixed limiting component is reduced, and the rotating limiting block 20c can prop against the wafer.

Optionally, the portion of the rotation limiting block 20c for pressing the wafer is arc-shaped.

It is easy to understand that the portion of the rotation stopper 20c for pressing the wafer is the wall of the susceptor 22.

In one embodiment, the portion of the rotation limiting block 20c for pressing the wafer is in a concave arc shape; therefore, when the part is abutted against the wafer, the wafer can be contained, and the stability and reliability of limiting the wafer can be ensured.

In another embodiment, the portion of the rotation limiting block 20c for pressing the wafer is in an arc shape; thus, when the rotary limiting block 20c abuts against the wafer, the contact area between the rotary limiting block and the wafer is smaller, and the clamping force on the wafer can be ensured; meanwhile, the design of the outward protruding arc is convenient for adapting to wafers with different specifications.

Optionally, the portion of the rotation stopper 20c for pressing the wafer is set as an elastic structure.

The elastic structure design on the rotation stopper 20c is the same as the elastic structure design on the fixed stopper, and will not be described here again.

Through setting up elastic construction, rotatory stopper 20c can the elastic contact wafer, can enough avoid with the wafer rigid contact, press from both sides the damage wafer, can adapt to the wafer of different specifications again better, can also improve the centre gripping stability to the wafer.

In one embodiment, the wafer clamping device provided by the application further comprises a turntable 31, wherein the turntable 31 is arranged on the tray 10 and can rotate automatically; the rotation limiting block 20c is arranged on the turntable 31 and is far away from the rotation shaft 3 of the turntable 31.

Referring specifically to fig. 4, 10 and 11, in the illustrated embodiment, two sets of fixed limiting assemblies are provided on the tray 10; the rotary table 31 is arranged in front of the two groups of fixed limiting components, and the rotating shaft 3 of the rotary table 31 is positioned on the middle vertical line of the two groups of fixed limiting blocks 20a and 20 b; the rotation limiting block 20c is arranged close to the edge of the turntable 31; when the turntable 31 rotates around the rotation shaft 3, the rotation limiting block 20c revolves around the rotation shaft 3 and can approach or depart from the fixed limiting component.

By arranging the turntable 31, the rotation of the turntable 31 is utilized to drive the rotation limiting block 20c to make revolution motion, and the motion track of the rotation limiting block 20c is more definite and stable.

Alternatively, the rotation stopper 20c is detachably provided on the turntable 31; alternatively, the turntable 31 is detachably provided on the tray 10.

Through removable design, can make things convenient for rotatory stopper 20c to overhaul, maintain and change etc. and handle.

The present application is not limited to the specific configuration of the removable structure of the rotational stopper 20c or the turntable 31, and the implementation can be referred to above with respect to the removable design of the fixed stopper.

Optionally, the tray 10 is provided with a mounting groove 11, and the turntable 31 is embedded in the mounting groove 11.

For example, in the embodiment shown in fig. 4, the turntable 31 is provided in a disk shape, and the mounting groove 11 is provided as a cylindrical hole. The mounting groove 11 can define a mounting position of the turntable 31 so as to accurately mount the turntable 31 at a preset position on the tray 10 at the time of equipment assembly.

Further, the turntable 31 can only rotate in the mounting groove 11, and the rotational position of the turntable 31 is determined, so that the rotational movement of the rotational stopper 20c is more easily stabilized, which is limited by the mounting groove 11.

Furthermore, when the turntable 31 is arranged in a detachable form, the embedded design is more convenient for assembling and disassembling the turntable 31; when necessary, the turntable 31 is placed in the mounting groove 11, the turntable 31 can be mounted, the turntable 31 can be taken out from the mounting groove 11, and the turntable 31 can be dismounted.

Alternatively, after the turntable 31 is fitted into the mounting groove 11, the turntable 31 is not higher than the tray 10; in this way, the protrusion of the turntable 31 can be prevented from interfering with the insertion or removal of the wafer.

Alternatively, the mounting groove 11 is a half-groove, and the mounting groove 11 has a groove bottom capable of supporting the turntable 31.

Alternatively, the mounting groove 11 is a through groove, the mounting groove 11 penetrates the tray 10 in the thickness direction, and the turntable 31 is rotatably provided in the mounting groove 11.

The present application is not limited to the specific configuration of the mounting groove 11, as long as the turntable 31 can be fitted into the mounting groove 11 and can rotate within the mounting groove 11.

In one embodiment, the rotation of the rotation stopper 20c is achieved manually.

For example, the rotation limiting block 20c is arranged on the turntable 31, the turntable 31 is rotatably arranged on the tray 10 through a rotating shaft, and a damping piece is arranged on the rotating shaft; when the rotary table 31 is in operation, external force acts on the rotary table 31 or the rotary limiting block 20c, and damping is overcome, so that the rotary table 31 rotates, and the rotary table 31 carries the rotary limiting block 20c away from the fixed limiting component; after the fixed limiting component supports the wafer, external force acts on the turntable 31 or the rotary limiting block 20c again to overcome damping, so that the turntable 31 reversely rotates, and the turntable 31 carries the rotary limiting block 20c to abut against the wafer close to the fixed limiting component; after the rotational stopper 20c is in place, the external force is removed, and the damper can prevent the turntable 31 from rotating so that the rotational stopper 20c remains at the current position.

For another example, the rotation limiting block 20c is disposed on the turntable 31, the turntable 31 is rotatably disposed on the tray 10, and the turntable 31 is in threaded connection with a screw rod capable of rectilinear movement in the thickness direction relative to the tray 10; in operation, the rotating screw, affected by the screw thread, the turntable 31 can rotate relative to the tray 10, and the screw can be lifted and lowered in the thickness direction; the rotation force to the screw is removed, and the screw structure can hinder the rotation of the turntable 31 so that the rotation stopper 20c remains at the current position.

In another embodiment, the rotation of the rotation stopper 20c is achieved by an automatic driving manner.

For example, the wafer clamping device provided by the application further comprises a rotation driving member 32, wherein the rotation driving member 32 is used for driving the turntable 31 to rotate. The rotary driving member 32 may be a rotary cylinder, a motor, or the like. The output end of the rotary driving member 32 is connected to the turntable 31, and the rotary driving member 32 is operative to drive the turntable 31 to rotate about the rotation axis 3.

In the embodiment shown in fig. 4, the tray 10 is provided with a mounting groove 11, and the turntable 31 is embedded in the mounting groove 11; the fixed end of the rotary driving piece 32 is arranged on the back surface of the tray 10 and far away from the wafer; the movable end of the rotary driving member 32 is coupled to the turntable 31 through the mounting groove 11.

In this embodiment, the turntable 31 is embedded in the mounting groove 11, so that the turntable 31 can be prevented from protruding from the tray 10 and interfering with the carrying of the tray 10 on the wafer, and the rotary driving member 32 can be prevented from being designed, so that the main body of the rotary driving member 32 is positioned on the back of the tray 10, the surface structure of the tray 10 for carrying the wafer can be simplified, and the normal use of the rotary driving member 32 can be ensured.

The present application is not limited to the manner in which the rotation stopper 20c is rotated.

Optionally, the tray 10 is provided with a clearance groove 13, and after the tray 10 receives the wafer, a part of the wafer is suspended on the clearance groove 13.

The design of the clearance groove 13 can further ensure that the back surface of the wafer does not contact the tray 10, thereby being beneficial to protecting the back surface of the wafer.

In some embodiments, the wafer with smaller size may be further placed in the avoidance slot 13, and the slot wall of the avoidance slot 13 is matched with the rotation limiting block 20c to achieve clamping and fixing of the wafer. More specifically, steps are arranged on the groove walls at two sides of the avoidance groove 13, and after the wafer is placed in the avoidance groove 13, the two steps can support the wafer in a matched mode, so that the back of the wafer is suspended; subsequently, the limiting block 20 is rotated to abut against the wafer, so that the wafer is pressed in the avoidance slot 13.

Optionally, the tray 10 is provided with air holes 14, and the negative pressure device can adsorb the wafer through the air holes 14 after the tray 10 receives the wafer.

Specifically, after the tray 10 receives the wafer, the negative pressure device works, and the surface of the tray 10 can be pumped through the air holes 14 to generate negative pressure, so that the negative pressure acts on the wafer and can adsorb the wafer, and the wafer is further ensured to be firmly supported on the tray 10.

The air hole 14 may be disposed on the bracket 21 or the supporting table 22, which is beneficial to the wafer being stabilized by the limiting block through negative pressure adsorption.

Alternatively, in an embodiment, the tray 10 is provided with a clearance groove 13, and the air hole 14 is arranged in the clearance groove 13; the negative pressure equipment works, the air in the avoidance groove 13 can be pumped out through the air hole 14, and the relatively stable negative pressure can be formed in the avoidance groove 13. In this embodiment, when the clearance groove 13 is used to cooperate with the rotation limiting block 20c to clamp the wafer, the negative pressure characteristic of the air hole 14 is beneficial to the stability of the wafer.

Optionally, the tray 10 is provided with a slip preventing strip 15, and after the tray 10 receives the wafer, the slip preventing strip 15 contacts the wafer and can prevent the wafer from slipping or shifting relative to the tray 10.

The anti-slip strips 15 can increase the friction between the clamping device and the wafer. When the clamping device supports the wafer, the anti-slip strip 15 contacts the wafer, and the surface of the anti-slip strip 15 has certain viscosity, or the surface of the anti-slip strip 15 is rough, so that the wafer can be prevented from slipping relative to the tray 10, and the stability of the wafer on the clamping device is ensured.

Wherein, the anti-slip strip 15 can be made of anti-slip materials such as fluororubber; alternatively, the cleat 15 is a member having a surface with a slip-resistant structure.

For example, the surface of the anti-slip strip 15 is provided with a plurality of ribs which are arranged at intervals, and the ribs are used as anti-slip ribs and can play a role in preventing slipping when supporting a wafer.

Optionally, cleats 15 are provided on brackets 21 and/or pallets 22.

Optionally, the anti-slip strip 15 is disposed outside the fixed limit component and the rotating limit block 20c, and can cooperate with the limit block to support the wafer together.

The foregoing examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.

Claims

1. A wafer clamping apparatus, comprising:

a tray (10) for receiving a wafer;

at least two groups of fixed limiting components are arranged on the tray (10), one group of fixed limiting components comprises two fixed limiting blocks (20 a and 20 b), and a bracket (21) is arranged on each fixed limiting block;

a rotation limiting block (20 c), wherein the rotation limiting block (20 c) is rotatably arranged on the tray (10), and a supporting table (22) is arranged on the rotation limiting block (20 c);

the brackets (21) on the two fixed limiting blocks of the same group of fixed limiting components are positioned at the same height, and the brackets (21) on the fixed limiting blocks of different groups of fixed limiting components are positioned at different heights;

the more the height away from the rotary limiting block (20 c) and the bracket (21) is higher;

at least two layers of pallets (22) are arranged on the rotary limiting block (20 c), and each layer of pallet (22) can independently rotate to be close to or far away from the fixed limiting component;

the part of the fixed limiting block, which is used for pressing the wafer, is arc-shaped, and the arc-shaped surface of the bracket (21) can be attached to the side edge of the wafer;

the bracket (21) and the bracket table (22) which are positioned on the same horizontal plane can cooperatively support a wafer;

wherein the rotation limiting block (20 c) and two fixed limiting blocks (20 a and 20 b) in any group of fixed limiting components are arranged in a triangular manner;

the wafer clamping device further comprises a rotary table (31), wherein the rotary table (31) is arranged on the tray (10) and can rotate automatically;

the rotation limiting block (20 c) is arranged on the rotary table (31) and is far away from the rotation shaft (3) of the rotary table (31);

the tray (10) is provided with a mounting groove (11), and the turntable (31) is embedded in the mounting groove (11).

2. Wafer clamping device according to claim 1, wherein at least two sets of fixed limit components are provided on the tray (10), and the rotation center of the rotation limit block (20 c) is located on the middle vertical line of two fixed limit blocks (20 a and 20 b) of each set of fixed limit components.

3. The wafer clamping apparatus according to claim 1, wherein a portion of the fixed stopper for pressing the wafer is provided as an elastic structure.

4. Wafer clamping device according to claim 1, characterized in that the fixed stop is detachably arranged on the tray (10).

5. Wafer clamping device according to claim 4, characterized in that the tray (10) is provided with two sets of the fixed limiting assemblies;

two groups of mounting holes are formed in the tray (10), any one group of mounting holes are used for mounting a group of fixed limiting assemblies, and any one fixed limiting block is detachably connected with one mounting hole.

6. The wafer clamping device according to claim 1, wherein a portion of the rotation stopper (20 c) for pressing the wafer is arc-shaped;

and/or the part of the rotary limiting block (20 c) for pressing the wafer is arranged to be an elastic structure.

7. Wafer clamping device according to claim 1, characterized in that the rotation limiting block (20 c) is detachably arranged on the turntable (31);

alternatively, the turntable (31) is detachably arranged on the tray (10).

8. The wafer clamping device according to claim 1, further comprising a rotational drive (32), the rotational drive (32) being configured to drive the turntable (31) to spin.

9. Wafer clamping device according to claim 1, characterized in that the tray (10) is provided with a clearance groove (13), and that after the tray (10) receives a wafer, a part of the wafer is suspended from the clearance groove (13).

10. Wafer clamping device according to claim 1, characterized in that the tray (10) is provided with air holes (14), and the negative pressure equipment can adsorb wafers through the air holes (14) after the tray (10) receives the wafers;

and/or the tray (10) is provided with an anti-slip strip (15).