CN116453987A - Carrier for previous working procedure of chip material and application method thereof - Google Patents

Carrier for previous working procedure of chip material and application method thereof Download PDF

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Publication number
CN116453987A
CN116453987A CN202310439203.XA CN202310439203A CN116453987A CN 116453987 A CN116453987 A CN 116453987A CN 202310439203 A CN202310439203 A CN 202310439203A CN 116453987 A CN116453987 A CN 116453987A
Authority
CN
China
Prior art keywords
basket
turnover
baking
clamping groove
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310439203.XA
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Chinese (zh)
Inventor
陆敏琴
张兴鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Yingdafu Electronic Technology Co ltd
Original Assignee
Jiangsu Yingdafu Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Yingdafu Electronic Technology Co ltd filed Critical Jiangsu Yingdafu Electronic Technology Co ltd
Publication of CN116453987A publication Critical patent/CN116453987A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

The invention discloses a carrier for a previous working procedure of chip materials and a use method thereof, wherein the carrier comprises an alkali washing basket, a cleaning basket, a baking basket, a sizing basket and a turnover basket, the number of clamping grooves of the alkali washing basket, the cleaning basket, the baking basket, the sizing basket and the turnover basket is the same as the spacing of the clamping grooves, and the turnover basket can change the angles of the clamping grooves. The invention has the advantages of simple structure, convenient use and operation, improved production efficiency of chip materials, and avoiding secondary pollution of the chip materials caused by mixed use of the carrier.

Description

Carrier for previous working procedure of chip material and application method thereof
Technical Field
The invention relates to the technical field of chip material processing, in particular to a carrier related to alkaline washing, cleaning, baking and sizing of chip materials and a carrier using method thereof.
Background
Along with the development of modern science and technology, the application range of chip materials on electronic equipment is wider and wider, the market demand for chip materials is also larger and larger, when the chip materials are produced and processed, the chip materials need to be subjected to previous working procedures including alkali washing, cleaning, baking and sizing, however, the equipment used in the working procedures is different, the workshops in which the working procedures are located are different, and the used carriers are different and cannot be mixed, so that the existing method usually needs to wear clean operation gloves for workers, the chip materials are taken down from the carrier in the previous working procedure one by one, and then are processed one by one, so that the operation of the workers is inconvenient, the speed is slow, great trouble is brought to the subsequent working procedures, and the production efficiency is influenced, for example: after baking, the chip materials are manually placed into the carrier of the next process one by one, the speed is low, after all the chip materials are placed into the carrier, the temperature of the chip materials is reduced greatly, the temperature cannot meet the requirement, and therefore the chip materials cannot directly enter the next process, need to enter the heat preservation device for heat preservation and then enter the next process, and the production efficiency is greatly influenced.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the carrier for the previous working procedure of the chip material and the use method thereof, which are convenient for workers to use, improve the production efficiency and avoid secondary pollution to the chip material as much as possible.
The technical scheme adopted for solving the technical problems is as follows: the carrier for the previous working procedure of the chip material comprises an alkaline washing basket, a cleaning basket, a baking basket, a sizing basket and a turnover basket, and the using method comprises the following steps:
(1) In an alkaline washing workshop, putting the welded chip material precursor into a clamping groove of an alkaline washing basket, and then hanging the alkaline washing basket on a hook of an alkaline washing device to carry out alkaline washing by using alkaline liquid;
(2) After the alkaline washing is finished, reversely buckling the turnover basket on the alkaline washing basket, enabling the clamping groove of the turnover basket to be clamped on each chip material, installing a bottom plate, turning the turnover basket and the alkaline washing basket together for 180 degrees, enabling the chip materials to fall into the clamping groove of the turnover basket, removing the alkaline washing basket, and then transferring the turnover basket and the chip materials to a washing room;
(3) In a cleaning workshop, reversely buckling the cleaning basket on the turnover basket, clamping the clamping groove of the cleaning basket on each chip material, mounting a bottom plate, overturning the turnover basket and the cleaning basket together for 180 degrees, enabling the chip materials to fall into the clamping groove of the cleaning basket, removing the turnover basket, and then hanging the cleaning basket on a hook of a cleaning device for cleaning;
(4) After the cleaning is finished, the turnover basket is reversely buckled on the cleaning basket, so that the clamping groove of the turnover basket is clamped on each chip material, a bottom plate is arranged, the turnover basket and the cleaning basket are overturned together for 180 degrees, so that the chip materials fall into the clamping groove of the turnover basket, the cleaning basket is removed, and then the turnover basket and the chip materials are transferred to a baking workshop;
(5) In a baking workshop, reversely buckling a baking basket on a turnover basket, clamping a clamping groove of the baking basket on each chip material, mounting a bottom plate, overturning the turnover basket and the baking basket together by 180 degrees, enabling the chip materials to fall into the clamping groove of the baking basket, removing the turnover basket, and then putting the baking basket into a tunnel furnace for high-temperature baking;
(6) After baking, reversely buckling the turnover basket on the baking basket, clamping the clamping groove of the turnover basket on each chip material, mounting a bottom plate, overturning the turnover basket and the baking basket together for 180 degrees, enabling the chip materials to fall into the clamping groove of the turnover basket, removing the baking basket, and transferring the turnover basket and the chip materials to a gluing workshop;
(7) The angle of the clamping groove of the gluing basket is adjusted to be the same as that of the clamping groove of the turnover basket in a gluing workshop, the gluing basket is reversely buckled on the turnover basket, the clamping groove of the gluing basket is clamped on each chip material, the gluing basket and the gluing basket are turned over by 180 degrees together, the chip materials fall into the clamping groove of the gluing basket, the turnover basket is moved away, and then the angle of the clamping groove of the gluing basket is adjusted to enable the gluing basket to be placed into a gluing machine for gluing.
Preferably, the alkali washing basket, the cleaning basket, the baking basket, the sizing basket and the turnover basket are all provided with rectangular frames and clamping grooves, and the spacing of the clamping grooves is the same.
Preferably, the clamping grooves of the alkaline washing basket, the cleaning basket, the baking basket and the turnover basket are fixedly connected with the rectangular frame, and the angle of the clamping groove is 90 degrees with the operating platform.
Preferably, the clamping groove of the rubberizing basket is movably connected with the rectangular frame, and the angle of the clamping groove can be adjusted.
Preferably, the alkali washing basket and the cleaning basket are provided with handles and connecting rods, and the connecting rods are movably connected.
Preferably, the alkaline basket, the cleaning basket, the baking basket, the sizing basket and the turnover basket are provided with bottom plates which are detachably connected.
Preferably, the material of the baking basket and the sizing basket is high-temperature stainless steel.
The alkaline basket and the cleaning basket are provided with the handle and the connecting rod, so that the carrier is hung on the equipment hook to facilitate processing, and the connecting rod can move to rotate the handle and the connecting rod to the side surface when the chip material is transferred, so that the chip material is not influenced to transfer the carrier.
Because rubberizing syringe needle and operation mesa are perpendicular setting, if chip material also is perpendicular with the operation mesa, can lead to the glue to drip the speed too fast under, easily from the bottom drip loss, the draw-in groove of rubberizing basket's angle personally submit 20 degrees to 70 degrees with the operation mesa, be convenient for rubberizing syringe needle accurate with glue point at the key position of chip material, glue also can slowly drip and can not run off.
On a chip material production line, the types and the sizes of the chip materials in the same batch are consistent, so that the rectangular frames, the number of clamping grooves and the spacing of the clamping grooves of carriers in the previous process of the chip materials in the same batch can be designed to be the same, and workers only need to use a turnover basket for transferring when the carriers of the chip materials are replaced; the chip material is transferred to the carrier at each time through twice overturning, so that the position and the direction of the chip material on the carriers in each process are kept unchanged, the carrier is prevented from being mixed by the aid of the turnover basket, the carriers in different processes cannot enter other workshops to cause workshop pollution, operation is convenient, manual loading of the chip material one by one is not needed, and production efficiency is greatly improved.
The invention has the beneficial effects that: the device has the advantages of simple structure and convenient operation, improves the production efficiency of the previous working procedure of the chip material, and avoids secondary pollution of the chip material caused by mixed use of the carrier.
Drawings
FIG. 1 is a side elevational view of a basic basket.
FIG. 2 is a top view of the alkali wash basket.
FIG. 3 is a side elevational view of the cleaning basket.
FIG. 4 is a top view of the cleaning basket.
Fig. 5 is a side view structural diagram of the basket.
Fig. 6 is a top view of the basket.
Fig. 7 is a side view of the glue basket.
FIG. 8 is a top view of the glue basket.
FIG. 9 is a side elevational structural view of the transfer basket.
FIG. 10 is a top view of the epicyclic basket.
FIG. 11 is a side view of the turnbuckle on another carrier.
In the figure: 1. the novel cleaning device comprises an alkaline cleaning basket, a baking basket, a sizing basket, a turnover basket, a clamping groove, a bottom plate, a connecting rod, a handle, a rectangular frame and a hinge structure.
Description of the embodiments
Example 1
As shown in each side view structure diagram, the alkali wash basket 1, the cleaning basket 2, the baking basket 3, the sizing basket 4 and the turnover basket 5 are all provided with a clamping groove 6, a rectangular frame 10 and a bottom plate 7, the clamping grooves 6 are arranged on two long sides of the rectangular frame, the number and the interval of the clamping grooves 6 are the same, the clamping grooves 6 of the alkali wash basket 1, the cleaning basket 2, the baking basket 3 and the turnover basket 5 are fixed on the rectangular frame, the angles of the clamping grooves 6 are 90 degrees with the operation table, the alkali wash basket 1 and the cleaning basket 2 are provided with a connecting rod 8 and a handle 9, and the connecting rod 8 can move.
As shown in fig. 7, each clamping groove 6 of the rubberizing basket 4 is connected with the rectangular frame 10 through a hinge structure 11, a fixed pin is arranged in the hinge structure 11, and the angle of the clamping groove 6 can be adjusted by adjusting the hinge structure 11 after the fixed pin is removed.
As shown in each of the top view structural drawings, rectangular frames 10 of the alkaline basket 1, the cleaning basket 2, the baking basket 3, the sizing basket 4 and the turnover basket 5 are identical in size, the rectangular frames 10 are provided with sliding grooves, and the bottom plate 7 can be pulled out from the side edges of the rectangular frames 10 or mounted along the sliding grooves.
As shown in fig. 11, after the rectangular frame 10 of the turnover basket 5 is aligned with the rectangular frames 10 of other carriers, the rectangular frames 10 are inversely buckled on the other carriers, because the sizes of the rectangular frames 10 are the same, the number of the clamping grooves 6 and the spacing between the clamping grooves 6 are the same, the clamping grooves 6 of the turnover basket 5 can be in one-to-one correspondence with the clamping grooves 6 of the other carriers, and because the bottom plate 7 of the turnover basket 5 can be drawn out, whether the clamping grooves 6 of the two carriers are in one-to-one correspondence can be clearly observed, after the correct correspondence is confirmed, the bottom plate 7 is arranged for overturning, and then the chip materials fall in the clamping grooves 6 of the turnover basket 5 and can be transferred together with the turnover basket 5.
The material of the baking basket 3 and the gluing basket 4 is high-temperature stainless steel.
The using method comprises the following steps:
(1) In an alkaline washing workshop, putting the welded chip material precursor into a clamping groove 6 of an alkaline washing basket 1, and then hanging the alkaline washing basket 1 on a hook of an alkaline washing device to carry out alkaline washing by using alkaline solution;
(2) After the alkaline washing is finished, reversely buckling the turnover basket 5 on the alkaline washing basket 1, enabling the clamping groove 6 of the turnover basket 5 to be clamped on each chip material, installing the bottom plate 7, overturning the turnover basket 5 and the alkaline washing basket 1 together for 180 degrees, enabling the chip materials to fall into the clamping groove 6 of the turnover basket 5, removing the alkaline washing basket 1, and then transferring the turnover basket 5 and the chip materials to a washing room;
(3) In a cleaning workshop, reversely buckling the cleaning basket 2 on the turnover basket 5 to enable the clamping groove 6 of the cleaning basket 2 to be clamped on each chip material, installing the bottom plate 7, overturning the turnover basket 5 and the cleaning basket 2 together for 180 degrees to enable the chip materials to fall into the clamping groove of the cleaning basket 2, removing the turnover basket 5, and then hanging the cleaning basket 2 on a hook of a cleaning device for cleaning;
(4) After the cleaning is finished, the turnover basket 5 is reversely buckled on the cleaning basket 2, so that the clamping groove 6 of the turnover basket 5 is clamped on each chip material, the bottom plate 7 is arranged, the turnover basket 5 and the cleaning basket 2 are overturned together for 180 degrees, so that the chip materials fall into the clamping groove 6 of the turnover basket 5, the cleaning basket 2 is removed, and then the turnover basket 5 and the chip materials are transferred to a baking workshop;
(5) In a baking workshop, reversely buckling the baking basket 3 on the turnover basket 5 to enable the clamping groove 6 of the baking basket 3 to be clamped on each chip material, installing the bottom plate 7, overturning the turnover basket 5 and the baking basket 3 together for 180 degrees to enable the chip materials to fall into the clamping groove of the baking basket 3, removing the turnover basket 5, and then placing the baking basket 3 into a tunnel furnace to be baked at a high temperature;
(6) After baking, reversely buckling the turnover basket 5 on the baking basket 3 to enable the clamping groove 6 of the turnover basket 5 to be clamped on each chip material, installing the bottom plate 7, overturning the turnover basket 5 and the baking basket 3 together for 180 degrees to enable the chip materials to fall into the clamping groove 6 of the turnover basket 5, removing the baking basket 3, and then transferring the turnover basket 5 and the chip materials to a gluing workshop;
(7) In a gluing workshop, the angle of the clamping groove 6 of the gluing basket 4 is adjusted to 90 degrees with an operation table, a fixing pin is arranged for fixation, the gluing basket 4 is reversely buckled on the turnover basket 5, the clamping groove 6 of the gluing basket 4 is clamped on each chip material, a bottom plate 7 is arranged, the turnover basket 5 and the gluing basket 4 are overturned together for 180 degrees, the chip materials fall into the clamping groove 6 of the gluing basket 4, the turnover basket is moved away, the fixing pin is taken down, then the angle of the clamping groove 6 of the gluing basket 4 is adjusted to 45 degrees with the operation table, and then the gluing basket 4 is put into a gluing machine for gluing.
Example 2
The bottom plate 7 is connected with the rectangular frame 10 through the clamping pieces, when the carriers are transferred, the bottom plate 7 can be disassembled, the corresponding conditions of the clamping grooves 6 of the two carriers are observed, after the clamping grooves 6 are in one-to-one correspondence, the bottom plate 7 is arranged, and then the carriers are turned 180 degrees.
The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above examples, and all technical solutions belonging to the concept of the present invention belong to the protection scope of the present invention. It should be noted that modifications and adaptations to the invention without departing from the principles thereof are intended to be within the scope of the invention as set forth in the following claims.

Claims (7)

1. The carrier for the chip material front process is characterized by comprising an alkaline washing basket, a cleaning basket, a baking basket, a sizing basket and a turnover basket, wherein the alkaline washing basket, the cleaning basket, the baking basket, the sizing basket and the turnover basket are all provided with rectangular frames and clamping grooves, and the spacing of the clamping grooves is the same.
2. The carrier for the previous process of chip materials according to claim 1, wherein the clamping grooves of the alkaline basket, the cleaning basket, the baking basket and the turnover basket are fixedly connected with the rectangular frame, and the angle of the clamping groove is 90 degrees with the operating platform.
3. The carrier for a preceding process of chip material according to claim 1, wherein the clamping groove of the sizing basket is movably connected with the rectangular frame, and the angle of the clamping groove is adjustable.
4. The carrier for a preceding process of chip materials according to claim 1, wherein the alkaline basket and the cleaning basket are provided with handles and connecting rods, and the connecting rods are movably connected.
5. The carrier for a preceding process of chip materials according to claim 1, wherein the alkaline basket, the cleaning basket, the baking basket, the sizing basket and the turnover basket are provided with bottom plates, and the bottom plates are detachably connected.
6. The carrier for a preceding process of chip material as recited in claim 1, wherein said baking basket and said sizing basket are made of high temperature stainless steel.
7. The application method of the carrier for the previous working procedure of the chip material is characterized by comprising the following steps:
(1) In an alkaline washing workshop, putting the welded chip material precursor into a clamping groove of an alkaline washing basket, and then hanging the alkaline washing basket on a hook of an alkaline washing device to carry out alkaline washing by using alkaline liquid;
(2) After the alkaline washing is finished, reversely buckling the turnover basket on the alkaline washing basket, enabling the clamping groove of the turnover basket to be clamped on each chip material, installing a bottom plate, turning the turnover basket and the alkaline washing basket together for 180 degrees, enabling the chip materials to fall into the clamping groove of the turnover basket, removing the alkaline washing basket, and then transferring the turnover basket and the chip materials to a washing room;
(3) In a cleaning workshop, reversely buckling the cleaning basket on the turnover basket, clamping the clamping groove of the cleaning basket on each chip material, mounting a bottom plate, overturning the turnover basket and the cleaning basket together for 180 degrees, enabling the chip materials to fall into the clamping groove of the cleaning basket, removing the turnover basket, and then hanging the cleaning basket on a hook of a cleaning device for cleaning;
(4) After the cleaning is finished, the turnover basket is reversely buckled on the cleaning basket, so that the clamping groove of the turnover basket is clamped on each chip material, a bottom plate is arranged, the turnover basket and the cleaning basket are overturned together for 180 degrees, so that the chip materials fall into the clamping groove of the turnover basket, the cleaning basket is removed, and then the turnover basket and the chip materials are transferred to a baking workshop;
(5) In a baking workshop, reversely buckling a baking basket on a turnover basket, clamping a clamping groove of the baking basket on each chip material, mounting a bottom plate, overturning the turnover basket and the baking basket together by 180 degrees, enabling the chip materials to fall into the clamping groove of the baking basket, removing the turnover basket, and then putting the baking basket into a tunnel furnace for high-temperature baking;
(6) After baking, reversely buckling the turnover basket on the baking basket, clamping the clamping groove of the turnover basket on each chip material, mounting a bottom plate, overturning the turnover basket and the baking basket together for 180 degrees, enabling the chip materials to fall into the clamping groove of the turnover basket, removing the baking basket, and transferring the turnover basket and the chip materials to a gluing workshop;
(7) The angle of the clamping groove of the gluing basket is adjusted to be the same as that of the clamping groove of the turnover basket in a gluing workshop, the gluing basket is reversely buckled on the turnover basket, the clamping groove of the gluing basket is clamped on each chip material, the gluing basket and the gluing basket are turned over by 180 degrees together, the chip materials fall into the clamping groove of the gluing basket, the turnover basket is moved away, and then the angle of the clamping groove of the gluing basket is adjusted to enable the gluing basket to be placed into a gluing machine for gluing.
CN202310439203.XA 2022-11-16 2023-04-23 Carrier for previous working procedure of chip material and application method thereof Pending CN116453987A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2022114369800 2022-11-16
CN202211436980 2022-11-16

Publications (1)

Publication Number Publication Date
CN116453987A true CN116453987A (en) 2023-07-18

Family

ID=87125309

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310439203.XA Pending CN116453987A (en) 2022-11-16 2023-04-23 Carrier for previous working procedure of chip material and application method thereof

Country Status (1)

Country Link
CN (1) CN116453987A (en)

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