CN116435232A - Loading and unloading equipment for semiconductor packaging - Google Patents

Loading and unloading equipment for semiconductor packaging Download PDF

Info

Publication number
CN116435232A
CN116435232A CN202310290550.0A CN202310290550A CN116435232A CN 116435232 A CN116435232 A CN 116435232A CN 202310290550 A CN202310290550 A CN 202310290550A CN 116435232 A CN116435232 A CN 116435232A
Authority
CN
China
Prior art keywords
materials
loading
oven
stacking
discharging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310290550.0A
Other languages
Chinese (zh)
Inventor
蔡建兵
刘新奎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huatian Technology Nanjing Co Ltd
Original Assignee
Huatian Technology Nanjing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huatian Technology Nanjing Co Ltd filed Critical Huatian Technology Nanjing Co Ltd
Priority to CN202310290550.0A priority Critical patent/CN116435232A/en
Publication of CN116435232A publication Critical patent/CN116435232A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Specific Conveyance Elements (AREA)

Abstract

The invention discloses a loading and unloading device for semiconductor packaging, which comprises: the feeding mechanism is used for storing materials; the material taking mechanism is used for taking out materials from the feeding mechanism; the material identification mechanism is used for identifying the materials taken out by the material taking mechanism; the manipulator mechanism is used for taking and placing materials; the stacking mechanism is used for stacking materials, sending the materials into the oven mechanism and taking the materials out of the oven mechanism; the oven mechanism is used for baking and processing materials; the buffer station is used for storing baked materials; and the discharging mechanism is used for discharging. The equipment integrates feeding, mechanical sorting, stacking, baking and discharging, can truly realize full-automatic transmission and feeding and discharging management, reduces manual assistance in the processing process, and improves the efficiency and quality of product processing.

Description

Loading and unloading equipment for semiconductor packaging
Technical field:
the invention belongs to the technical field of semiconductor packaging equipment, and particularly relates to loading and unloading equipment for semiconductor packaging.
The background technology is as follows:
in the semiconductor packaging industry, chip baking is a common procedure in semiconductor processing, operations such as loading and unloading, sorting and the like are involved in baking processing, a large amount of manual assistance is needed for loading and unloading, sorting and the like of a chip at present, complete loading and unloading processing equipment is lacked, and excessive manual assistance is relatively high in labor cost on one hand, and on the other hand, errors are easy to occur in the manual assistance process, so that abnormal processing procedures are caused, such as product dropping, collision, scratch, contamination and the like caused by manual reasons, and therefore, an automatic loading and unloading equipment is necessary to be developed to reduce manual assistance.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person of ordinary skill in the art.
The invention comprises the following steps:
the invention aims to provide a loading and unloading device for semiconductor packaging, thereby overcoming the defects in the prior art.
In order to achieve the above object, the present invention provides a loading and unloading apparatus for semiconductor package, comprising:
the feeding mechanism is used for storing materials;
the material taking mechanism is used for taking out materials from the feeding mechanism;
the material identification mechanism is used for identifying the materials taken out by the material taking mechanism;
the manipulator mechanism is used for taking and placing materials;
the stacking mechanism is used for stacking materials, sending the materials into the oven mechanism and taking the materials out of the oven mechanism;
the oven mechanism is used for baking and processing materials;
the buffer station is used for storing baked materials;
and the discharging mechanism is used for discharging.
Preferably, the feeding mechanism comprises a plurality of feeding trolleys, a plurality of layers of baffle transmission rails are arranged in each feeding trolley, oven baffles are arranged on the baffle transmission rails and can slide on the baffle transmission rails, and the oven baffles are used for placing chip clips.
Preferably, the oven partition plate is further provided with a plurality of positioning pins, and the positioning pins are used for positioning the oven partition plate.
Preferably, the material taking mechanism is close to the feeding mechanism and comprises a ground rail and a sliding seat arranged on the ground rail, wherein the sliding seat is provided with a lifting mechanism, the lifting mechanism is provided with a supporting mechanism, the supporting mechanism is provided with a pair of transmission rails and a transmission seat, the transmission rails are used for placing a baking oven partition plate, the transmission seat is provided with a sliding clamp, and the sliding clamp is used for clamping the baking oven partition plate.
Preferably, the material identification mechanism comprises a rack, a light source and an identification camera, wherein the light source and the identification camera are arranged on the rack, the rack is close to the feeding mechanism and is fixed on the ground, and the light source and the identification camera are both positioned above the ground rail.
Preferably, the manipulator mechanism comprises a multi-axis manipulator, the multi-axis manipulator is close to the ground rail, and the multi-axis manipulator is provided with a baffle clamping jaw.
Preferably, the baffle clamping jaw comprises a clamp seat, the clamp seat is connected with the multi-axis manipulator, a pair of adjusting plates and a pair of air cylinders are mounted on the clamp seat, the air cylinders are connected with the adjusting plates and used for adjusting the adjusting plates, and a pair of clamping jaws are arranged on each adjusting plate.
Preferably, the stacking mechanism is close to the manipulator mechanism and comprises a stacking ground rail and a stacking trolley arranged on the stacking ground rail, wherein an up-down adjusting support seat is arranged on the stacking trolley, a pair of feeding rails and a pushing rail are arranged on the up-down adjusting support seat, a pushing clamp is arranged on the pushing rail, and the pushing clamp is used for pushing a baking oven partition plate.
Preferably, the oven mechanism comprises a plurality of ovens which are uniformly distributed on two sides of the stacking ground rail.
Preferably, the buffer station is close to the stacking mechanism and is used for buffering materials.
Preferably, the discharging mechanism is close to the buffer station and comprises at least one discharging conveying line.
Preferably, the system further comprises a work order temporary storage station, wherein a plurality of work order temporary storage racks are arranged on the work order temporary storage station.
Preferably, the discharging mechanism further comprises a discharging manipulator, and a visual scanning mechanism is arranged on the discharging manipulator.
Compared with the prior art, one aspect of the invention has the following beneficial effects:
(1) The equipment integrates feeding, mechanical sorting, stacking, baking and discharging, can truly realize full-automatic transmission and feeding and discharging management, reduces manual assistance in the processing process, and improves the processing efficiency and quality of products;
(2) The feeding structure adopts the design of a feeding trolley, and a transmission rail and a baffle plate are arranged in the trolley, so that the baffle plate can be conveniently pulled out of the trolley when materials are taken and placed;
(3) The combined design of the material ground rail of the material taking mechanism, the lifting mechanism and the sliding clamp is more convenient for taking materials from the feeding trolley;
(4) The baffle clamping jaw adopts the combined design of a pair of adjusting plates and a pair of air cylinders, so that the baffle is more convenient to stably clamp;
(5) The stacking mechanism adopts the combined design of a stacking ground rail, a stacking trolley and a pushing clamp, so that materials are more conveniently sent into an oven for baking and processing, and the processed materials are taken out from the oven;
(6) The discharging mechanism is also provided with a discharging mechanical arm and a visual scanning mechanism, so that sorting operation of the processed materials can be realized.
Description of the drawings:
fig. 1 is a schematic diagram showing the overall structure of the loading and unloading device for semiconductor package of the present invention;
fig. 2 is an enlarged schematic view of a partial structure of a loading mechanism of the loading and unloading apparatus for semiconductor package of the present invention;
FIG. 3 is a top view of the take-out mechanism of the semiconductor packaging loading and unloading apparatus of the present invention;
FIG. 4 is an enlarged plan view showing a part of the structure of the pick-up mechanism of the loading and unloading device for semiconductor package of the present invention;
fig. 5 is an enlarged schematic view of a part of the structure of the material taking mechanism of the loading and unloading device for semiconductor package of the present invention;
FIG. 6 is an enlarged schematic view of a material recognition mechanism of the loading and unloading device for semiconductor package of the present invention;
fig. 7 is an enlarged schematic view of a robot mechanism of the loading and unloading apparatus for semiconductor package of the present invention;
fig. 8 is an enlarged schematic view of a spacer jaw of a manipulator mechanism of the loading and unloading apparatus for semiconductor package of the present invention;
fig. 9 is an enlarged schematic view of a stacking mechanism of the loading and unloading device for semiconductor package of the present invention;
fig. 10 is an enlarged plan view of a stacking mechanism and a buffer mechanism of the loading and unloading device for semiconductor package of the present invention;
FIG. 11 is an enlarged top view of the discharge mechanism of the loading and unloading apparatus for semiconductor package of the present invention;
FIG. 12 is an enlarged schematic view of a discharge robot of a discharge mechanism of the semiconductor packaging loading and unloading apparatus of the present invention;
FIG. 13 is an enlarged schematic view of a work order temporary storage station of the loading and unloading apparatus for semiconductor package of the present invention;
reference numerals: 1-feeding mechanism, 101-feeding trolley, 102-baffle transmission rail, 103-oven baffle, 104-chip clip, 105-locating pin, 2-material taking mechanism, 201-ground rail, 202-slide, 203-lifting mechanism, 204-supporting mechanism, 205-transmission rail, 206-transmission seat, 207-sliding clamp, 3-material identification mechanism, 301-rack, 302-light source, 303-identification camera, 4-manipulator mechanism, 401-multiaxial manipulator, 402-baffle clamping jaw, 403-clamp seat, 404-adjusting plate, 405-cylinder, 406-clamping jaw, 5-stacking mechanism, 501-stacking ground rail, 502-stacking trolley, 503-up-down adjusting supporting seat, 504-feeding rail, 505-pushing rail, 506-pushing clamp, 6-oven mechanism, 601-oven, 7-buffer station, 8-discharging mechanism, 801-discharging conveying line, 802-discharging manipulator, 803-visual scanning mechanism, 9-enclosure frame, 10-work sheet temporary storage station.
The specific embodiment is as follows:
the following detailed description of specific embodiments of the invention is, but it should be understood that the invention is not limited to specific embodiments.
The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.
Example 1:
in order to achieve the above object, as shown in fig. 1 to 13, the present invention provides a loading and unloading apparatus for semiconductor package, comprising:
the feeding mechanism 1 is used for storing materials;
the material taking mechanism 2 is used for taking out materials from the feeding mechanism 1;
the material identification mechanism 3 is used for identifying the materials taken out by the material taking mechanism 2;
the manipulator mechanism 4 is used for taking and placing materials;
a stacking mechanism 5, wherein the stacking mechanism 5 is used for stacking materials, sending the materials into the oven mechanism 6 and taking the materials out of the oven mechanism 6;
the oven mechanism 6 is used for baking and processing materials;
the buffer station 7 is used for storing baked materials;
the discharging mechanism 8 is used for discharging.
Wherein feed mechanism 1, feeding mechanism 2, material recognition mechanism 3, manipulator mechanism 4, stacking mechanism 5, buffer memory station 7, discharge mechanism 8 enclose in enclosing fender frame 9 through the design and enclose fender frame 9.
As shown in fig. 2, in this embodiment, the feeding mechanism 1 includes a plurality of feeding trolleys 101 that are orderly arranged, a plurality of groups of baffle driving rails 102 are disposed on the inner wall of each feeding trolley 101, oven baffles 103 are disposed on the baffle driving rails 102, the bottoms of the oven baffles 103 can move on the baffle driving rails 102, chip clips 104 are disposed on the oven baffles 103, and chips to be processed are disposed in the chip clips 104. Wherein the universal wheel can be installed to the bottom of material loading dolly 101, and the dolly of being convenient for removes, and the goods shelves of dolly adopts stainless steel material, and the width matches with oven baffle 103 to the oven baffle 103 is placed in the dolly.
As shown in fig. 3 to 5, in this embodiment, the material taking mechanism 2 is close to the feeding trolley 101, and includes a ground rail 201, a sliding seat 202 mounted on the ground rail 201, a lifting mechanism 203 mounted on the sliding seat, the lifting mechanism 203 may be a combined structure of a driving motor and a screw rod, a supporting mechanism 204 mounted on the lifting mechanism 203, a pair of transmission rails 205 and a transmission seat 206 mounted on the supporting mechanism 204, and a sliding clamp 207 mounted on the transmission seat 206, where the sliding clamp 207 can be controlled by the motor to move on the transmission seat 206. During material taking, the sliding seat 202 moves on the ground rail 201 to a position close to the feeding trolley 101 to be material taken, the lifting mechanism 203 works, the supporting mechanism 204 is adjusted to a proper height, the sliding clamp 207 moves into the feeding trolley 101 along the transmission seat 206, when the sliding clamp 207 moves to a proper position of the feeding trolley 101, the sliding clamp 207 clamps the oven partition plate 103 in the feeding trolley 101, the sliding clamp 207 moves in the opposite direction along the sliding seat 206 again, the oven partition plate 103 is taken out of the feeding trolley 101, the bottom of the oven partition plate 103 slides on the partition plate transmission rail 102 in the process, and the bottom of the oven partition plate 103 slides on the pair of transmission rails 205 on the supporting mechanism 204 after the taking out until the oven partition plate 103 is completely taken out of the feeding trolley 101.
As shown in fig. 6, in this embodiment, the material identifying mechanism 3 includes a frame 301, and a light source 302 and an identifying camera 303 disposed on the frame 301, where the frame 301 is close to the feeding mechanism 1 and is fixed on the ground, and the light source 302 and the identifying camera 303 are both located above the ground rail 201. After the oven partition plate 103 is completely taken out of the feeding trolley 101 by the sliding clamp 207, the sliding seat 202 moves on the ground rail 201, and the oven partition plate 103 moves below the light source 302 and the recognition camera 303, so that the primary recognition of chips in the chip cartridge 104 on the oven partition plate 103 is realized.
As shown in fig. 7, in the present embodiment, the manipulator mechanism 4 includes a multi-axis manipulator 401, the multi-axis manipulator 401 being proximate to the rail 201, and a separator jaw 402 being mounted on the multi-axis manipulator 401.
As shown in fig. 8, as a further preferred embodiment, the spacer clamping jaw 402 includes a clamping seat 403, the clamping seat 403 is connected to the multi-axis manipulator 401, a pair of adjusting plates 404 and a pair of air cylinders 405 are mounted on the clamping seat 403, the air cylinders 405 are connected to the adjusting plates 404, and are used for adjusting the adjusting plates 404, and a pair of clamping jaws 406 are disposed on each adjusting plate 404. After the materials on the oven partition 103 are primarily identified, the multi-axis manipulator 401 works, four clamping jaws 406 respectively clamp the oven partition 103 from two sides of the oven partition 103, and when clamping, the air cylinders 405 work to adjust the distance between the pair of clamping jaws 406, so that the clamping jaws 406 clamp the oven partition 103, and the multi-axis manipulator 401 sends the oven partition 103 to the next station.
As shown in fig. 9-10, in this embodiment, the stacking mechanism 5 is close to the manipulator mechanism 4, and includes a stacking rail 501 and a stacking trolley 502 disposed on the stacking rail 501, an up-down adjusting support seat 503 is disposed on the stacking trolley 502, a pair of feeding rails 504 and a pushing rail 505 are disposed on the up-down adjusting support seat 503, and a pushing clamp 506 is disposed on the pushing rail 505, where the pushing clamp 506 is used for pushing the oven partition 103. The multi-axis manipulator 401 clamps the oven partition plate 103 and then sends the oven partition plate 103 to the feeding track 504 of the stacking trolley 502, the pushing clamp 506 moves along the pushing track 505 until the pushing clamp 506 is tightly attached to the oven partition plate 103, the stacking trolley 502 moves on the stacking ground track 501, and when the stacking trolley moves to the oven position, the pushing clamp 506 pushes the oven partition plate 103 on the feeding track 504 into the oven for baking.
As shown in fig. 1, in this embodiment, the oven mechanism 6 includes a plurality of ovens 601, and the ovens 601 are uniformly distributed on two sides of the stacking rail 501.
In this embodiment, as shown in fig. 11, the buffer station 7 is close to the stacking mechanism 5, and is used for buffering materials. After the baking process of the chips in the chip clips 104 on the oven partition plate 103 is completed, the pushing clamp 506 on the stacking trolley 502 takes out the oven partition plate 103 in the oven and then moves the oven partition plate 103 to the buffer station 7 along the stacking ground rail 501 to temporarily put the oven partition plate 103 on the buffer station 7 for buffer.
As shown in fig. 11, in this embodiment, the outfeed mechanism 8 is proximate to the buffer station 7 and includes at least one outfeed conveyor line 801. The material at the buffer station 7 is discharged from the discharge conveyor line 801.
As shown in fig. 13, in this embodiment, the system further includes a work order temporary storage station 10, where a plurality of work order temporary storage shelves 11 are disposed on the work order temporary storage station 10. The work order corresponding to the chip in the chip clip 104 on the oven partition 103 is placed on the work order temporary storage station 10 for buffering.
Example 2:
as shown in fig. 2, as a further optimization of embodiment 1, a plurality of positioning pins 105 are also mounted on the oven partition 103, and the positioning pins 105 clamp the chip clips 104 from four corners.
Example 3:
as shown in fig. 12, as a further optimization of embodiment 1, the discharging mechanism 8 further includes a discharging manipulator 802, and a visual scanning mechanism 803 is mounted on the discharging manipulator 802. Before discharging, a visual scanning mechanism 803 on a discharging manipulator 802 scans and detects materials at the buffer station 7, and the materials which are qualified in detection are clamped to a discharging conveying line 801 through the discharging manipulator 802 to discharge.
The working principle of the invention is as follows:
the chip clip 104 after the core loading is finished is sent to the oven partition plate 103 of the feeding mechanism 1, and the four corners of the chip clip 104 are positioned by the positioning pins 105;
the material taking mechanism 2 takes out the oven partition 103 from the feeding mechanism 1, moves the oven partition 103 to the material identification mechanism 3, works with the light source 302 and the identification camera 303 at the material identification mechanism 3, identifies the material on the oven partition 103, and transmits identified data to the control console, wherein the data comprises bar code information on a material box (chip cartridge 104), the control console is compared with data in mes and CIM systems, and whether the material on the oven partition 103 needs to be baked by the same program is judged, wherein mes is a work order posting system, contains work order information, and executes commands such as binding of the material box and the work order, binding of baking program and the like; the control console is the equipment control assembly, can record alarm information, and independently acts on the mechanical arm, the stacking trolley and the like.
After the judgment is completed, the mechanical arm mechanism 4 clamps the oven partition plate 103 from the material taking mechanism 2 and puts the oven partition plate onto the stacking trolley 502, and meanwhile, the corresponding work order is put into a work order temporary storage station for storage and recording;
the stacking trolley 502 runs on the stacking ground rail 501, the oven partition board 103 is sent to the oven 601 for baking after running to the loading and unloading parts of the oven, after the operation is repeated for a plurality of times, the oven partition board 103 fills up one oven 601, a control console informs CIM of finishing loading, the oven 601 receives CIM signals to start equipment, after baking is finished, CIM is informed of unloading, the CIM interacts with the control console, the control console instructs the stacking trolley 502 to work, and the oven partition board 103 is taken out from the oven 601;
the taken oven separator 103 is brought to the buffer station 7 by the stacking trolley 502, the mechanical arm mechanism 4 takes the oven separator 103 down and places it on the buffer station 7,
the visual scanning mechanism 803 on the discharging manipulator 802 scans and detects the material at the buffer station 7, and the qualified material is clamped to the discharging conveying line 801 through the discharging manipulator 802 to be discharged.
The equipment integrates feeding, mechanical sorting, stacking, baking and discharging, can truly realize full-automatic transmission and feeding and discharging management, reduces manual assistance in the processing process, and improves the efficiency and quality of product processing.
The foregoing descriptions of specific exemplary embodiments of the present invention are presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain the specific principles of the invention and its practical application to thereby enable one skilled in the art to make and utilize the invention in various exemplary embodiments and with various modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.

Claims (10)

1. Feeding and discharging equipment for semiconductor packaging is characterized by comprising:
the feeding mechanism is used for storing materials;
the material taking mechanism is used for taking out materials from the feeding mechanism;
the material identification mechanism is used for identifying the materials taken out by the material taking mechanism;
the manipulator mechanism is used for taking and placing materials;
the stacking mechanism is used for stacking materials, sending the materials into the oven mechanism and taking the materials out of the oven mechanism;
the oven mechanism is used for baking and processing materials;
the buffer station is used for storing baked materials;
and the discharging mechanism is used for discharging.
2. The loading and unloading device for semiconductor packaging according to claim 1, wherein the loading mechanism comprises a plurality of loading trolleys, a plurality of layers of partition plate transmission rails are arranged in each loading trolley, oven partition plates are arranged on the partition plate transmission rails and can slide on the partition plate transmission rails, and the oven partition plates are used for placing chip clips.
3. The loading and unloading device for semiconductor packaging according to claim 2, wherein the oven partition plate is further provided with a plurality of positioning pins, and the positioning pins are used for positioning the oven partition plate.
4. The loading and unloading device for semiconductor packaging according to claim 2, wherein the material taking mechanism is close to the loading mechanism and comprises a ground rail and a sliding seat arranged on the ground rail, a lifting mechanism is arranged on the sliding seat, a supporting mechanism is arranged on the lifting mechanism, a pair of transmission rails and a transmission seat are arranged on the supporting mechanism, the transmission rails are used for placing a baking oven partition board, a sliding clamp is arranged on the transmission seat, and the sliding clamp is used for clamping the baking oven partition board.
5. The loading and unloading device for semiconductor package as recited in claim 4, wherein the material recognition mechanism comprises a frame, a light source and a recognition camera arranged on the frame, the frame is close to the loading mechanism and fixed on the ground, and the light source and the recognition camera are all arranged above the ground rail.
6. The loading and unloading device for semiconductor package as recited in claim 4, wherein the manipulator mechanism comprises a multi-axis manipulator, the multi-axis manipulator being attached to the ground rail, and a separator jaw being mounted on the multi-axis manipulator.
7. The loading and unloading device for semiconductor package according to claim 6, wherein the partition clamping jaw comprises a clamp seat, the clamp seat is connected with the multi-axis manipulator, a pair of adjusting plates and a pair of air cylinders are mounted on the clamp seat, the air cylinders are connected with the adjusting plates and used for adjusting the adjusting plates, and a pair of clamping jaws are arranged on each adjusting plate.
8. The loading and unloading device for semiconductor package according to claim 2, wherein the stacking mechanism is close to the manipulator mechanism and comprises a stacking ground rail and a stacking trolley arranged on the stacking ground rail, an up-down adjusting support seat is arranged on the stacking trolley, a pair of feeding rails and a pushing rail are arranged on the up-down adjusting support seat, and a pushing clamp is arranged on the pushing rail and used for pushing the oven partition plate.
9. The semiconductor packaging loading and unloading device according to claim 1, wherein the buffer station is close to the stacking mechanism and is used for buffering materials; the discharging mechanism is close to the buffer station and comprises at least one discharging conveying line; the discharging mechanism further comprises a discharging manipulator, and a visual scanning mechanism is arranged on the discharging manipulator.
10. The loading and unloading device for semiconductor packaging according to claim 1, further comprising a work order temporary storage station, wherein a plurality of work order temporary storage shelves are arranged on the work order temporary storage station.
CN202310290550.0A 2023-03-23 2023-03-23 Loading and unloading equipment for semiconductor packaging Pending CN116435232A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310290550.0A CN116435232A (en) 2023-03-23 2023-03-23 Loading and unloading equipment for semiconductor packaging

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310290550.0A CN116435232A (en) 2023-03-23 2023-03-23 Loading and unloading equipment for semiconductor packaging

Publications (1)

Publication Number Publication Date
CN116435232A true CN116435232A (en) 2023-07-14

Family

ID=87089954

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310290550.0A Pending CN116435232A (en) 2023-03-23 2023-03-23 Loading and unloading equipment for semiconductor packaging

Country Status (1)

Country Link
CN (1) CN116435232A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117790379A (en) * 2024-02-27 2024-03-29 深圳市金创图电子设备有限公司 Double-station mini chip moving control system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117790379A (en) * 2024-02-27 2024-03-29 深圳市金创图电子设备有限公司 Double-station mini chip moving control system
CN117790379B (en) * 2024-02-27 2024-04-26 深圳市金创图电子设备有限公司 Double-station mini chip moving control system

Similar Documents

Publication Publication Date Title
CN109132526B (en) Workpiece feeding device and workpiece feeding method
WO2021237981A1 (en) Automatic shoemaking production line
CN113939462B (en) Sorting system for a machine tool, machine tool and method for sorting cut parts
CN116435232A (en) Loading and unloading equipment for semiconductor packaging
US20130017052A1 (en) Apparatus and Method for the Stacking of Stackable Parts
CN115140548B (en) Full-automatic all-in-one machine integrating blanking, stacking tray and CCD detection
CN111137663B (en) Automatic production line of hard alloy pressing, forming and sintering preparation furnace
CN212944180U (en) Automatic test equipment for electronic element
WO2011161059A2 (en) Stacking line system and method
WO2022021465A1 (en) Workshop material transport monitoring system and monitoring method thereof
CA2893920A1 (en) Device and method for processing battery plates and arranging them in wet or agm battery cases for cars or trucks
JP2012504054A (en) Assembly and method for machining an object with a milling machine
CN116727888A (en) Full-automatic laser cutting circuit board device
US20210024153A1 (en) Method for the production of motor vehicles
CN111003248A (en) Device, system and baling press that adjustment carton warp
CN114654291B (en) CNC automatic processing system and CNC processing method capable of automatically feeding and discharging
CN214442574U (en) Automatic bending device
CN210653951U (en) Full-automatic buzzer vision and audio detection equipment
CN115921319A (en) Core particle appearance detection and partition all-in-one machine and detection method thereof
CN112792253A (en) Automatic bending device
CN112974276A (en) Material removing and supplementing control method of intelligent production line system of liquid transfer head
JPH0755701B2 (en) Device for taking out containers in boxes
KR101844314B1 (en) An Apparatus for Transferring a Plural of Materials to Each Processing Machine Automatically
CN115091092B (en) Automatic welding equipment
JP2550071Y2 (en) FMS pallet and work transfer device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination