CN117790379B - Double-station mini chip moving control system - Google Patents
Double-station mini chip moving control system Download PDFInfo
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- CN117790379B CN117790379B CN202410211915.0A CN202410211915A CN117790379B CN 117790379 B CN117790379 B CN 117790379B CN 202410211915 A CN202410211915 A CN 202410211915A CN 117790379 B CN117790379 B CN 117790379B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The invention discloses a double-station mini chip moving control system, which relates to the technical field of chip processing, and comprises a setting module, an information acquisition module, a detection module, a planning module and a blanking module, wherein the setting module is used for setting corresponding working information based on double stations, the information acquisition module is used for respectively planning path information of the double stations based on the working information, the information acquisition module is connected with the setting module and used for acquiring station information, the detection module is connected with the information acquisition module and used for carrying out quality detection on chips to obtain quality information of the chips, the planning module is connected with the detection module and used for acquiring stations corresponding to unqualified chips, and the blanking module is connected with the planning module and used for carrying out blanking on the chips through the path information based on the working information and the qualified information. The invention better realizes the chip moving selection in the actual operation process and improves the efficiency and accuracy of the chip moving operation.
Description
Technical Field
The invention relates to the technical field of chip processing, in particular to a double-station mini chip moving control system.
Background
Along with the continuous development and progress of technology, especially the rapid growth of the fields of semiconductors, photoelectrons and the like, the requirements for microelectronic components and chips are increasing; the trend promotes the development of the electronic manufacturing industry, simultaneously promotes the increase of the demands of a conveying system, is difficult to accurately correspond to stations for loading and unloading chips in the process of moving the chips at present, can not accurately judge the quality of the chips and automatically obtain chip moving paths with different quality, can not better realize the chip moving selection in the actual operation process, and is difficult to improve the efficiency and the accuracy of the chip moving operation.
Disclosure of Invention
The invention aims to provide a double-station mini chip moving control system which aims to solve the defects in the background technology.
In order to achieve the above object, the present invention provides the following technical solutions: a dual-station mini chip movement control system, comprising:
the setting module is used for setting corresponding working information based on the double stations and respectively planning path information of the double stations based on the working information, wherein the path information comprises feeding path information and discharging path information;
The information acquisition module is connected with the setting module and used for acquiring station information, wherein the station information comprises a material station and a material-free station, and the corresponding relation between the chip and the station is completed through path information based on the station information;
The detection module is connected with the information acquisition module and is used for carrying out quality detection on the chip to obtain quality information of the chip and judging qualified information of the quality information based on preset conditions, wherein the qualified information comprises qualified chips and unqualified chips;
The planning module is connected with the detection module and used for acquiring stations corresponding to the unqualified chips and planning blanking paths of the stations corresponding to the unqualified chips as unqualified blanking path information;
And the blanking module is connected with the planning module and is used for blanking the chip through the path information based on the working information and the qualified information, and returning the double station to the original position after the blanking operation is completed.
In a preferred embodiment, the setting module includes:
the selecting and setting unit is used for acquiring the moving parameter information of the double stations and selecting working information corresponding to the double stations based on the moving parameter information, wherein the working information comprises feeding work of the chip and discharging work of the chip;
And the path planning unit is used for respectively carrying out path planning on the double stations based on the working information to obtain feeding path information and discharging path information as path information, and constructing based on the path information to obtain a virtual operation model.
In a preferred embodiment, the path planning unit comprises:
the construction unit is used for acquiring the station position for placing the chip, planning path information based on the station position and constructing a virtual operation model of the path information;
The information setting unit is used for constructing a mapping line of the path information based on the virtual operation model, and setting a plurality of monitoring points in the mapping line, wherein the monitoring points comprise position information of the monitoring points and time information of reaching the monitoring points by the double-station manipulator;
And the binding unit is used for binding the mapping lines with the corresponding feeding path information, the corresponding discharging path information and the corresponding manipulator.
In a preferred embodiment, the information acquisition module includes:
The information acquisition unit is used for correspondingly acquiring the characteristic information of the material-free station based on the station position and taking the characteristic information of the material-containing station as a reference condition;
The extraction unit is used for collecting the image information of the station and extracting the characteristic information in the image information, and matching the characteristic information in the image information based on the reference condition to obtain the station information;
and the feeding unit is used for acquiring the feeding path information of the non-feeding station in the station information and feeding the chip to obtain the corresponding relation between the chip and the station.
In a preferred embodiment, the information acquisition unit comprises:
The first acquisition unit is used for acquiring station images without materials and with materials in the stations respectively, and acquiring the distance between the edge line of the bottom of the station in the station images and the outer contour edge line in the station images based on the materials without materials and with materials in the stations as a first characteristic;
The second acquisition unit is used for acquiring lines of the station bottom images in the station images based on the absence and presence of materials in the stations as second features, taking the first features and the second features as feature information, and storing the feature information as a reference condition.
In a preferred embodiment, the detection module comprises:
The reference unit is used for selecting a qualified chip as a reference chip, acquiring an image of the reference chip, dividing the chip surface on the image to obtain a plurality of detection areas, respectively acquiring chip detection item information of the plurality of detection areas, and formulating preset conditions based on the chip detection item information;
Determining a detection area, setting the same light environment, collecting chip bulge information and chip recess information in the detection area, performing contour acquisition and marking on the chip bulge information and the chip recess information to obtain a contour line, selecting a plurality of mark points on the contour line based on preset marking conditions, taking the center of the chip as an origin, giving the origin to construct a three-dimensional coordinate system, obtaining position information of the plurality of mark points based on the three-dimensional coordinate system as chip detection item information, wherein the preset conditions are a preset limiting value, and a calculation standard formula of the chip quality is required to be determined firstly, and the method is as follows Wherein ω is the chip quality index,As the total value of the difference in position information of the mark points,In order to obtain the number of mark points with position information difference, μ is the weight coefficient of the detection area corresponding to the position information difference, ε and γ are constants greater than zero, and it should be noted that,AndThe larger the numerical value of the chip is, the worse the quality of the chip is represented, then the preset condition can be set according to the formula, and the chip corresponding to the information to be judged, which is larger than the preset condition, is represented as the unqualified chip;
The management unit is used for taking the detection area, the chip detection item information corresponding to the detection area and the corresponding preset conditions as quality detection information;
The dividing unit is used for dividing the surface of the chip based on the quality detection information to obtain a plurality of detection areas, collecting chip detection data of the detection areas, and taking the detection areas and the corresponding chip detection data as information to be judged;
The judging unit is used for obtaining a detection area corresponding to the information to be judged and corresponding chip detection item information based on the quality detection information matching, obtaining corresponding preset conditions based on the detection area and the corresponding chip detection item information, judging the quality information of the information to be judged based on the preset conditions, and obtaining qualified information, wherein the chip corresponding to the information to be judged, which does not meet the preset conditions, is a disqualified chip.
In a preferred embodiment, the planning module comprises:
The information acquisition unit is used for acquiring stations corresponding to the unqualified chips and taking the unqualified chips as unqualified stations;
And the blanking planning unit is used for planning the blanking path of the chip based on the unqualified stations to serve as unqualified blanking path information.
In a preferred embodiment, the blanking module includes:
the control unit is used for controlling the corresponding manipulator to perform blanking on the chip passing path information according to the qualified information based on the working information;
And the recovery unit is used for controlling the double-station manipulator to return to the original position after the blanking operation is completed.
In the technical scheme, the invention has the technical effects and advantages that:
the invention avoids the situation of station shortage or repeated feeding, can better realize the detection of chips and avoid the situation of repeated feeding, can accurately correspond to stations to carry out the loading and unloading of chips, can judge the actual detection of chips through the preset conditions set by the chip detection item information, can better and rapidly judge the quality of chips, can facilitate the follow-up manipulator to carry out the moving operation on the chip by distinguishing qualified and unqualified path information, can accurately judge the quality of chips and automatically obtain the moving paths of chips with different qualities, better realizes the moving selection of chips in the actual operation process, and improves the moving operation efficiency and accuracy of chips.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.
Fig. 1 is a system block diagram of the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In embodiment 1, referring to fig. 1, a dual-station mini chip moving control system according to the present embodiment includes:
the setting module is used for setting corresponding working information based on the double stations and respectively planning path information of the double stations based on the working information, wherein the path information comprises feeding path information and discharging path information;
The information acquisition module is connected with the setting module and used for acquiring station information, wherein the station information comprises a material station and a material-free station, and the corresponding relation between the chip and the station is completed through path information based on the station information;
The detection module is connected with the information acquisition module and is used for carrying out quality detection on the chip to obtain quality information of the chip and judging qualified information of the quality information based on preset conditions, wherein the qualified information comprises qualified chips and unqualified chips;
The planning module is connected with the detection module and used for acquiring stations corresponding to the unqualified chips and planning blanking paths of the stations corresponding to the unqualified chips as unqualified blanking path information;
the blanking module is connected with the planning module and is used for blanking the chip through path information based on the working information and the qualified information, and the double-station is returned to the original position after the blanking operation is completed;
Further, with the continuous development and progress of technology, especially the rapid growth of the fields of semiconductors, optoelectronics, etc., the demands for microelectronic components and chips are increasing; the trend promotes the development of the electronic manufacturing industry, simultaneously promotes the increase of the demand of a carrying system, is difficult to accurately correspond to stations for loading and unloading the chips in the process of carrying the chips at present, can not accurately judge the quality of the chips and automatically obtain chip carrying paths with different quality, can not better realize the chip carrying selection in the actual operation process, and is difficult to improve the chip carrying operation efficiency and accuracy, but the situation of station shortage or repeated loading is avoided in the application, the detection of the chips and the situation of repeated loading can be better realized, the loading and unloading of the chips can be accurately correspond to the stations, the detection of the actual chips can be better judged through preset conditions set by chip detection item information, the quality of the chips can be effectively and quickly judged, the subsequent manipulators can conveniently distinguish the qualified and unqualified path information for carrying the chips, the quality of the chips can be accurately judged, the chip carrying paths with different quality can be automatically obtained, the chip carrying selection in the actual operation process is better realized, and the chip carrying operation efficiency and the homogeneity are improved;
In one embodiment, the setting module includes:
the selecting and setting unit is used for acquiring the moving parameter information of the double stations and selecting working information corresponding to the double stations based on the moving parameter information, wherein the working information comprises feeding work of the chip and discharging work of the chip;
The path planning unit is used for respectively carrying out path planning on the double stations based on the working information to obtain feeding path information and discharging path information as path information, and constructing a virtual operation model based on the path information;
in one embodiment, the path planning unit includes:
the construction unit is used for acquiring the station position for placing the chip, planning path information based on the station position and constructing a virtual operation model of the path information;
The information setting unit is used for constructing a mapping line of the path information based on the virtual operation model, and setting a plurality of monitoring points in the mapping line, wherein the monitoring points comprise position information of the monitoring points and time information of reaching the monitoring points by the double-station manipulator;
the binding unit is used for binding the mapping lines with the corresponding feeding path information, the corresponding discharging path information and the corresponding manipulator in an information manner;
Further, the moving parameter information of the double stations is obtained, the moving parameter information is the moving stroke of the double stations mechanical arm, proper working information is distributed according to the moving stroke, the working information is the feeding working of the chip and the discharging working of the chip, the moving operation of the chip is completed, then a virtual operation model is obtained according to the moving of the double stations mechanical arm and the path information, the virtual operation model is a dynamic model, then a mapping line of the path information is built according to the virtual operation model, a plurality of monitoring points are set in the mapping line, wherein the monitoring points comprise the position information of the monitoring points and the time information of the arrival of the mechanical arm of the double stations at the monitoring points, the time of the monitoring points is recorded by the mechanical arm, the position of the monitoring points is recorded, the subsequent mechanical arm can monitor the path of the mechanical arm in the actual operation process, the moving control effect of the chip can be better guaranteed and monitored, the mechanical arm can be automatically adjusted according to the monitoring points, the moving of the chip is prevented from being influenced by the path offset, the chip is prevented from being damaged, and the corresponding path information is prevented from being bound to the corresponding to the path information in the process of the chip, and the important information is prevented from being bound to the path information;
In one embodiment, the information acquisition module includes:
The information acquisition unit is used for correspondingly acquiring the characteristic information of the material-free station based on the station position and taking the characteristic information of the material-containing station as a reference condition;
The extraction unit is used for collecting the image information of the station and extracting the characteristic information in the image information, and matching the characteristic information in the image information based on the reference condition to obtain the station information;
the feeding unit is used for acquiring feeding path information of the non-feeding station in the station information and feeding the chip to obtain the corresponding relation between the chip and the station;
in one embodiment, the information acquisition unit comprises:
The first acquisition unit is used for acquiring station images without materials and with materials in the stations respectively, and acquiring the distance between the edge line of the bottom of the station in the station images and the outer contour edge line in the station images based on the materials without materials and with materials in the stations as a first characteristic;
The second acquisition unit is used for acquiring lines of the station bottom images in the station images based on the absence and presence of materials in the stations as second features, taking the first features and the second features as feature information, and storing the feature information as a reference condition;
the method includes the steps of firstly acquiring characteristic information of materials or no materials of a station, storing the characteristic information as a reference condition, performing information reference and judgment on the materials or no materials of the station, respectively acquiring station images without materials and with materials in the station, acquiring the spacing between the edge line of the bottom of the station and the outline edge line in the station image based on the materials or the materials in the station, respectively corresponding to the materials or the materials in the station, then performing characteristic extraction on the actual station image, wherein the first characteristic corresponds to the materials or the materials in the station image, and then performing pattern matching on the position of the bottom of the station image, for example, the position of the station at which a chip is not placed is the pattern of the station, the position of the station at which the chip is placed is covered by the chip, then taking the pattern of the bottom of the station as the second characteristic, then taking the first characteristic and the second characteristic as the characteristic information, storing the characteristic information as the reference condition, then acquiring the actual station image, then performing characteristic extraction on the actual station image, wherein the extracted characteristic is the position of the edge line of the bottom of the station and the outline edge line of the station image, respectively corresponding to the materials in the station image, and the position of the station image at which the bottom of the station is not placed on the chip, and finally performing pattern matching on the position of the station at which the chip is not placed on the station, and the position of the chip is more accurate, and obtaining the information corresponding to the position of the material in the station image, or the position which the position is not placed on the position of the chip, the chip detection can be better realized, and the condition of repeated feeding is avoided;
In one embodiment, the detection module comprises:
The reference unit is used for selecting a qualified chip as a reference chip, acquiring an image of the reference chip, dividing the chip surface on the image to obtain a plurality of detection areas, respectively acquiring chip detection item information of the plurality of detection areas, and formulating preset conditions based on the chip detection item information;
The management unit is used for taking the detection area, the chip detection item information corresponding to the detection area and the corresponding preset conditions as quality detection information;
The dividing unit is used for dividing the surface of the chip based on the quality detection information to obtain a plurality of detection areas, collecting chip detection data of the detection areas, and taking the detection areas and the corresponding chip detection data as information to be judged;
The judging unit is used for obtaining a detection area corresponding to the information to be judged and corresponding chip detection item information based on the quality detection information matching, obtaining corresponding preset conditions based on the detection area and the corresponding chip detection item information, judging the quality information of the information to be judged based on the preset conditions, and obtaining qualified information, wherein a chip corresponding to the information to be judged, which does not meet the preset conditions, is a disqualified chip;
Further, a qualified chip is selected as a reference chip, the reference chip is used as a comparison item of a qualified chip, the reference chip is used for judging data reference of a subsequent unqualified chip, then a detection area, chip detection item information corresponding to the detection area and corresponding preset conditions are used as quality detection information, a plurality of detection areas are obtained by dividing the surface of the chip based on the quality detection information, chip detection data of the detection areas are collected, the detection areas and the corresponding chip detection data are used as information to be judged, the chip detection data and the chip detection item information are the same and correspond to the collected data items, then a detection result (information to be judged) of an actual chip is obtained, then the detection area corresponding to the information to be judged and the corresponding chip detection item information are obtained through quality detection information matching, the quality information of the information to be judged is judged based on the preset conditions, the quality information of the information to be judged is obtained based on the preset conditions, the chip corresponding to be judged is the unqualified chip, the chip detection item information and the chip detection item information to be judged not meeting the preset conditions is the unqualified chip, the chip detection item information is the chip shape of the chip surface is the chip to be judged, and the integrity of the chip is the integrity of the chip, and the scratch is avoided, and the defect is avoided: determining a detection area, setting the same light environment, collecting chip bulge information and chip recess information in the detection area, performing contour acquisition and marking on the chip bulge information and the chip recess information to obtain a contour line, selecting a plurality of mark points on the contour line based on preset marking conditions, taking the center of the chip as an origin, giving the origin to construct a three-dimensional coordinate system, obtaining position information of the plurality of mark points based on the three-dimensional coordinate system as chip detection item information, wherein the preset conditions are a preset limiting value, and a calculation standard formula of the chip quality is required to be determined firstly, and the method is as follows Wherein ω is the chip quality index,As the total value of the difference in position information of the mark points,In order to obtain the number of mark points with position information difference, μ is the weight coefficient of the detection area corresponding to the position information difference, ε and γ are constants greater than zero, and it should be noted that,AndThe larger the numerical value of the chip is, the worse the quality of the chip is represented, the preset condition can be set according to the formula, the chip corresponding to the information to be judged, which is larger than the preset condition, is represented as an unqualified chip, the detection of the actual chip can be judged through the preset condition set by the chip detection item information, the quality of the chip can be judged better and rapidly, the follow-up manipulator can conveniently carry out the moving operation on the chip by distinguishing the qualified and unqualified path information, the quality of the chip can be judged accurately, the moving paths of the chip with different quality can be obtained automatically, the moving selection of the chip in the actual operation process can be realized better, and the moving operation efficiency and accuracy of the chip are improved;
In one embodiment, the planning module includes:
The information acquisition unit is used for acquiring stations corresponding to the unqualified chips and taking the unqualified chips as unqualified stations;
the blanking planning unit is used for planning a blanking path of the chip based on the unqualified stations to serve as unqualified blanking path information;
In one implementation, the blanking module includes:
the control unit is used for controlling the corresponding manipulator to perform blanking on the chip passing path information according to the qualified information based on the working information;
The recovery unit is used for controlling the double-station manipulator to return to the original position after the blanking operation is completed;
Further, a station where the unqualified chip is located is obtained based on qualified information of the chip, different blanking paths are carried out on the corresponding qualified chip and the unqualified chip, the blanking paths of the unqualified chip need to be planned again, a corresponding manipulator is controlled to carry out blanking on the chip passing path information according to the qualified information based on working information, and the manipulator is returned after the chip is moved, so that the current chip movement is completed.
The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (6)
1. A dual-station mini chip movement control system, comprising:
the setting module is used for setting corresponding working information based on the double stations and respectively planning path information of the double stations based on the working information, wherein the path information comprises feeding path information and discharging path information;
The setting module includes:
the selecting and setting unit is used for acquiring the moving parameter information of the double stations and selecting working information corresponding to the double stations based on the moving parameter information, wherein the working information comprises feeding work of the chip and discharging work of the chip;
The path planning unit is used for respectively carrying out path planning on the double stations based on the working information to obtain feeding path information and discharging path information as path information, and constructing a virtual operation model based on the path information;
The path planning unit includes:
the construction unit is used for acquiring the station position for placing the chip, planning path information based on the station position and constructing a virtual operation model of the path information;
The information setting unit is used for constructing a mapping line of the path information based on the virtual operation model, and setting a plurality of monitoring points in the mapping line, wherein the monitoring points comprise position information of the monitoring points and time information of reaching the monitoring points by the double-station manipulator;
the binding unit is used for binding the mapping lines with the corresponding feeding path information, the corresponding discharging path information and the corresponding manipulator in an information manner;
The information acquisition module is connected with the setting module and used for acquiring station information, wherein the station information comprises a material station and a material-free station, and the corresponding relation between the chip and the station is completed through path information based on the station information;
The detection module is connected with the information acquisition module and is used for carrying out quality detection on the chip to obtain quality information of the chip and judging qualified information of the quality information based on preset conditions, wherein the qualified information comprises qualified chips and unqualified chips;
The planning module is connected with the detection module and used for acquiring stations corresponding to the unqualified chips and planning blanking paths of the stations corresponding to the unqualified chips as unqualified blanking path information;
And the blanking module is connected with the planning module and is used for blanking the chip through the path information based on the working information and the qualified information, and returning the double station to the original position after the blanking operation is completed.
2. The dual-station mini chip transfer control system as claimed in claim 1, wherein: the information acquisition module includes:
The information acquisition unit is used for correspondingly acquiring the characteristic information of the material-free station based on the station position and taking the characteristic information of the material-containing station as a reference condition;
The extraction unit is used for collecting the image information of the station and extracting the characteristic information in the image information, and matching the characteristic information in the image information based on the reference condition to obtain the station information;
and the feeding unit is used for acquiring the feeding path information of the non-feeding station in the station information and feeding the chip to obtain the corresponding relation between the chip and the station.
3. The dual-station mini chip transfer control system as claimed in claim 2, wherein: the information acquisition unit includes:
The first acquisition unit is used for acquiring station images without materials and with materials in the stations respectively, and acquiring the distance between the edge line of the bottom of the station in the station images and the outer contour edge line in the station images based on the materials without materials and with materials in the stations as a first characteristic;
The second acquisition unit is used for acquiring lines of the station bottom images in the station images based on the absence and presence of materials in the stations as second features, taking the first features and the second features as feature information, and storing the feature information as a reference condition.
4. The dual-station mini chip transfer control system as claimed in claim 1, wherein: the detection module comprises:
The reference unit is used for selecting a qualified chip as a reference chip, acquiring an image of the reference chip, dividing the chip surface on the image to obtain a plurality of detection areas, respectively acquiring chip detection item information of the plurality of detection areas, and formulating preset conditions based on the chip detection item information;
The management unit is used for taking the detection area, the chip detection item information corresponding to the detection area and the corresponding preset conditions as quality detection information;
The dividing unit is used for dividing the surface of the chip based on the quality detection information to obtain a plurality of detection areas, collecting chip detection data of the detection areas, and taking the detection areas and the corresponding chip detection data as information to be judged;
The judging unit is used for obtaining a detection area corresponding to the information to be judged and corresponding chip detection item information based on the quality detection information matching, obtaining corresponding preset conditions based on the detection area and the corresponding chip detection item information, judging the quality information of the information to be judged based on the preset conditions, and obtaining qualified information, wherein the chip corresponding to the information to be judged, which does not meet the preset conditions, is a disqualified chip.
5. The dual-station mini chip transfer control system as claimed in claim 1, wherein: the planning module comprises:
The information acquisition unit is used for acquiring stations corresponding to the unqualified chips and taking the unqualified chips as unqualified stations;
And the blanking planning unit is used for planning the blanking path of the chip based on the unqualified stations to serve as unqualified blanking path information.
6. The dual-station mini chip transfer control system as claimed in claim 1, wherein: the blanking module comprises:
the control unit is used for controlling the corresponding manipulator to perform blanking on the chip passing path information according to the qualified information based on the working information;
And the recovery unit is used for controlling the double-station manipulator to return to the original position after the blanking operation is completed.
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| JP2022021161A (en) * | 2020-07-21 | 2022-02-02 | 株式会社ディスコ | Pick-up method, pick-up device, and test device |
| CN116435232A (en) * | 2023-03-23 | 2023-07-14 | 华天科技(南京)有限公司 | Loading and unloading equipment for semiconductor packaging |
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