CN116429573B - Welding type IGBT module bonding wire tensile testing device and method - Google Patents
Welding type IGBT module bonding wire tensile testing device and method Download PDFInfo
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- CN116429573B CN116429573B CN202310403795.XA CN202310403795A CN116429573B CN 116429573 B CN116429573 B CN 116429573B CN 202310403795 A CN202310403795 A CN 202310403795A CN 116429573 B CN116429573 B CN 116429573B
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- 238000005493 welding type Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000009864 tensile test Methods 0.000 title claims description 14
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 32
- 238000012360 testing method Methods 0.000 claims abstract description 30
- 230000005540 biological transmission Effects 0.000 claims abstract description 25
- 238000005491 wire drawing Methods 0.000 claims description 4
- 238000010998 test method Methods 0.000 claims description 3
- 230000008859 change Effects 0.000 abstract description 5
- 238000006073 displacement reaction Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 3
- 230000000630 rising effect Effects 0.000 abstract description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 2
- 230000008878 coupling Effects 0.000 description 7
- 238000010168 coupling process Methods 0.000 description 7
- 238000005859 coupling reaction Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
- G01N3/04—Chucks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0001—Type of application of the stress
- G01N2203/0003—Steady
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
- G01N2203/0016—Tensile or compressive
- G01N2203/0017—Tensile
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/04—Chucks, fixtures, jaws, holders or anvils
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- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The application discloses a welding type IGBT module bonding wire tension testing device and a method, wherein the tension testing device comprises a coupler, and an upper coupler and a lower coupler are respectively arranged on a controller and a load sensor of a micro-stretcher by a pin shaft; the metal stay wire hook is connected to the upper coupler through threads; the dovetail groove clamp can adjust the IGBT module DBC substrate to move transversely; the transmission device can adjust the dovetail groove clamp to move longitudinally; the fixture base is used for placing the transmission device and is connected to the lower coupler through screws; the application can realize transverse and longitudinal movement on the micro-stretcher, and the nut is used for pre-tightening to ensure that the micro-stretcher has a positioning function; the metal stay wire hook can be detached and replaced at any time in a threaded connection mode, and can be used for measuring lead wire tensile loads with different diameters, and the micro-tensile load sensor can output a load-displacement change curve of the load-displacement change curve along with the rising of the metal stay wire hook in the test process, so that the purpose of measuring the bonding strength of a bonding wire after power circulation is achieved.
Description
Technical Field
The application belongs to the technical field of tension detection devices, and particularly relates to a welding type IGBT module bonding wire tension test device and method.
Background
The Insulated Gate Bipolar Transistor (IGBT) has the advantages of high switching speed, low driving power, low on-state voltage and high current carrying capacity, and is a dominant power device in various medium-power and high-power electronic converter systems, and is widely applied to the fields of new energy equipment, rail transit, military aviation, household appliances and the like.
At present, high-power IGBT generally adopts a module packaging structure, wire bonding is a main mode of internal electric interconnection of the IGBT module, and interconnection between an IGBT chip and a DBC substrate is realized through bonding wires.
In the power cycle aging experiment, the bonding wire is damaged due to the fact that the thermal expansion coefficient of the bonding wire is different from that of the chip material, so that the bonding wire is subjected to repeated impact of thermal stress, the strength of the bonding wire is reduced, the strength of the bonding wire is often judged through destructive experiments, and a bonding wire tensile test is generally used.
Therefore, it is needed to provide a device and a method for testing the bonding wire tension of a welded IGBT module, so as to measure the bonding strength of the bonding wire after power cycle.
Disclosure of Invention
The application aims to provide a welding type IGBT module bonding wire tensile testing device and method, which are used for solving the problems in the prior art.
In order to achieve the above object, the present application provides a tensile testing device for bonding wires of welded IGBT modules, including:
the upper coupler is arranged on a controller of the micro-stretcher through a pin shaft;
the lower coupler is arranged on the load sensor of the micro-stretcher through a pin shaft;
the upper coupler and the lower coupler are connected and fixed with the micro-stretcher through the coupler pre-tightening nuts;
the clamp base is detachably arranged on the lower coupler;
the dovetail groove clamp is arranged at the top of the clamp base in a limiting sliding manner and is used for installing an IGBT module DBC substrate;
the metal stay wire hook is detachably arranged on the upper coupler and is used for stretching a bonding wire on the IGBT module DBC substrate;
and the transmission device is arranged on the clamp base and is in transmission fit with the dovetail groove clamp.
Preferably, an upper pin shaft hole is formed in the upper coupler, and the upper coupler is fixedly connected with the controller of the micro-stretcher through the upper pin shaft hole and a pin shaft; the outer wall of the bottom of the upper coupler is provided with threads, and the coupler pre-tightening nut is connected with the bottom of the upper coupler through threads; an upper base is fixedly arranged at the bottom end of the upper coupler and is in limit fit with the coupler pre-tightening nut; an upper threaded hole is formed in the bottom end of the upper base, and the metal stay wire hook is in threaded connection with the upper threaded hole.
Preferably, a lower pin shaft hole is formed in the lower coupler, and the lower coupler and the load sensor of the micro-stretcher are fixedly connected through the lower pin shaft hole and a pin shaft; the outer wall of the top of the lower coupler is provided with threads, and the coupler pre-tightening nut is connected with the top of the lower coupler through threads; the top of lower shaft coupling is fixed and is provided with down the base, down the base with anchor clamps base Ji Kuan, offered the counter bore on the base down, be provided with the screw in the counter bore, the screw hole has been offered down to the bottom of anchor clamps base, down the base with the anchor clamps base passes through the screw down the screw hole is connected fixedly.
Preferably, the dovetail groove clamp comprises a fixed clamp and a movable clamp, and the fixed clamp is slidably arranged on the clamp base; the fixing clamp and the moving clamp are respectively provided with a horizontal through hole, a bolt is arranged in the horizontal through holes, a nut is connected to the bolt in a threaded manner, and the fixing clamp and the moving clamp are fixed through the bolt and the nut; clamping grooves are formed in the tops of one sides, opposite to the movable clamp, of the fixed clamp, two clamping grooves form a dovetail groove, the groove direction of the dovetail groove is perpendicular to the bolt, and the IGBT module DBC substrate is clamped in the dovetail groove.
Preferably, the fixing clamp is of an L-shaped structure, an I-shaped convex groove is formed in the bottom of the fixing clamp, and the fixing clamp is in sliding connection with the clamp base through the I-shaped convex groove; the fixed clamp is provided with a moving groove, the bottom end of the moving clamp is arranged in the moving groove in a limiting sliding mode, and the I-shaped convex groove and the groove direction of the moving groove are all arranged along the axial direction of the bolt.
Preferably, the transmission device comprises a gear shaft and a gear, the gear is fixedly sleeved in the middle of the gear shaft, a rack is fixedly arranged at the bottom of the dovetail groove clamp, and the gear is meshed with the rack; a gear groove is formed in the middle of the top end of the clamp base, the gear is arranged in the gear groove, U-shaped grooves are formed in two opposite side walls of the gear groove, and two ends of the gear shaft extend out of the clamp base through the two U-shaped grooves respectively; the two ends of the gear shaft are respectively provided with a threaded end, the threaded ends are connected with a pre-tightening nut in a threaded mode, and the gear shaft is fixedly matched with the outer wall of the clamp base through the pre-tightening nut.
Preferably, one end of the threaded end, which is far away from the gear, is provided with a knob end, the diameter of the knob end is smaller than that of the gear shaft, a knob is sleeved on the knob end, and the knob is in interference fit with the knob end.
Preferably, an i-shaped groove is formed in the top of the clamp base, and the i-shaped convex groove is matched with the i-shaped groove.
A welding type IGBT module bonding wire tension test method, which uses a welding type IGBT module bonding wire tension test device, specifically comprises the following steps:
s1, assembling a tension testing device, and connecting the tension testing device with a controller of a micro-stretcher and a load sensor of the micro-stretcher respectively;
s2, adjusting a dovetail groove clamp of the tension testing device, placing an IGBT module DBC substrate on a platform of the dovetail groove clamp, and adjusting the height of the metal stay wire hook to enable the bottom end of the metal stay wire hook to be positioned below a bonding wire on the IGBT module DBC substrate;
s3, adjusting the longitudinal position of the IGBT module DBC substrate by using a transmission device, so that the metal wire drawing hook of the tension testing device hooks the central positions of two bonding points of the bonding wire on the IGBT module DBC substrate; the bonding wire is moved to the position above the metal stay wire hook by manually transversely moving the IGBT module DBC substrate, and the IGBT module DBC substrate is fixed by utilizing a dovetail groove clamp;
and S4, starting the micro-stretcher until one bonding point of the bonding wire is separated from the IGBT module DBC substrate.
Preferably, in step S1, the tensile testing device is specifically assembled as follows:
s11, mounting a metal stay wire hook on an upper coupler, and mounting the upper coupler on a controller of a micro-stretcher through a pin shaft;
s12, mounting the clamp base on a lower coupler, and mounting the lower coupler on a load sensor of a micro-stretcher through a pin shaft;
s13, installing a transmission device at the top end of the clamp base, installing the dovetail groove clamp on the clamp base, and moving the dovetail groove clamp to the middle position of the clamp base by using the transmission device to complete the assembly of the tension testing device.
Compared with the prior art, the application has the following advantages and technical effects:
the welding type IGBT module bonding wire tension testing device provided by the application can realize transverse and longitudinal movement on a micro-stretcher, and is pre-tightened by a nut so as to have a positioning function; the metal stay wire hook can be detached and replaced at any time in a threaded connection mode, and can be used for measuring lead wire tensile loads with different diameters, and the micro-tensile load sensor can output a load-displacement change curve of the load-displacement change curve along with the rising of the metal stay wire hook in the test process, so that the purpose of measuring the bonding strength of a bonding wire after power circulation is achieved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of the overall structure of the present application;
FIG. 2 is a schematic view of the upper coupling structure of the present application;
FIG. 3 is a schematic view of a fixing clamp according to the present application;
FIG. 4 is a schematic view of the structure of the parts on the gear shaft of the present application;
FIG. 5 is a left side view of the transmission construction of the present application;
FIG. 6 is a schematic view of the structure of the clamp base of the present application partially cut away;
FIG. 7 is a schematic view of the placement of the clamp base and gear shaft of the present application;
FIG. 8 is a schematic view of the lower coupling structure of the present application;
FIG. 9 is a schematic diagram of a partial structure of a tensile testing apparatus according to the present application;
wherein, 1, upper coupling; 101. an upper pin shaft hole; 102. an upper base; 103. an upper threaded hole; 2. a lower coupling; 201. a lower pin shaft hole; 202. a lower base; 203. countersink; 204. a screw; 3. a coupler pre-tightening nut; 4. a metal wire hook; 5. a dovetail groove clamp; 501. a fixing clamp; 5011. an I-shaped convex groove; 5012. a moving groove; 502. moving the clamp; 503. a bolt; 504. a nut; 6. IGBT module DBC base plate; 7. a transmission device; 701. a rack; 702. a gear; 703. a gear shaft; 7031. a threaded end; 7032. a knob end; 704. pre-tightening the nut; 705. a knob; 8. a clamp base; 801. a gear groove; 802. a U-shaped groove; 803. a lower threaded hole; 804. i-shaped grooves.
Detailed Description
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art without the inventive effort, are intended to be within the scope of the present application. The application will be described in detail below with reference to the drawings in connection with embodiments.
As shown in fig. 1 to 9, the present application provides a welding type IGBT module bonding wire tensile testing device, including:
the upper coupler 1 is arranged on a controller of the micro-stretcher through a pin shaft;
the lower coupler 2 is arranged on a load sensor of the micro-stretcher through a pin shaft;
the coupler pre-tightening nut 3, the upper coupler 1 and the lower coupler 2 are connected and fixed with the micro-stretcher through the coupler pre-tightening nut 3;
the clamp base 8 is detachably arranged on the lower coupler 2;
the dovetail groove clamp 5 is arranged at the top of the clamp base 8 in a limiting sliding manner, and the dovetail groove clamp 5 is used for installing the IGBT module DBC substrate 6;
the metal stay wire hook 4 is detachably arranged on the upper coupler 1, and the metal stay wire hook 4 is used for stretching a bonding wire on the IGBT module DBC substrate 6;
and the transmission device 7 is arranged on the clamp base 8, and the transmission device 7 is in transmission fit with the dovetail groove clamp 5.
The metal stay wire hook 4 can be detached and replaced at any time, can be used for measuring the tension load of bonding wires with different diameters, and the micro-tensile load sensor can output a load-displacement change curve along with the rising of the metal stay wire hook 4 in the test process.
Further, an upper pin shaft hole 101 is formed in the upper coupler 1, and the upper coupler 1 is fixedly connected with a controller of the micro-stretcher through the upper pin shaft hole 101 and a pin shaft; the outer wall of the bottom of the upper coupler 1 is provided with threads, and a coupler pre-tightening nut 3 is connected with the bottom of the upper coupler 1 through threads; the pin shaft can be positioned through the arrangement of the coupler pre-tightening nut 3, an upper base 102 is fixedly arranged at the bottom end of the upper coupler 1, and the upper base 102 is in limit fit with the coupler pre-tightening nut 3; an upper threaded hole 103 is formed in the bottom end of the upper base 102, and the metal wire drawing hook 4 is in threaded connection with the upper threaded hole 103. The outer diameter of the upper base 102 is larger than the inner diameter of the coupler pre-tightening nut 3, so that the coupler pre-tightening nut 3 is prevented from falling off from the upper coupler 1.
Further, a lower pin shaft hole 201 is formed in the lower coupler 2, and the lower coupler 2 is fixedly connected with a load sensor of the micro-stretcher through the lower pin shaft hole 201 and a pin shaft; the outer wall of the top of the lower coupler 2 is provided with threads, and a coupler pre-tightening nut 3 is connected with the top of the lower coupler 2 through threads; the top of the lower coupler 2 is fixedly provided with a lower base 202, the lower base 202 is in width with the clamp base 8 and is used for bearing the clamp base 8, a counter bore 203 is formed in the lower base 202, a screw 204 is arranged in the counter bore 203, a lower threaded hole 803 is formed in the bottom end of the clamp base 8, and the lower base 202 is fixedly connected with the clamp base 8 through the screw 204 and the lower threaded hole 803. The counter bore 203 is provided to prevent the coupling pre-tightening nut 3 from colliding with the top end of the screw 204 during pre-tightening and loosening to prevent the coupling pre-tightening nut 3 from moving up and down.
Further, the dovetail groove clamp 5 comprises a fixed clamp 501 and a movable clamp 502, wherein the fixed clamp 501 is slidably arranged on the clamp base 8; the fixing clamp 501 and the moving clamp 502 are respectively provided with a horizontal through hole, a bolt 503 is arranged in the horizontal through holes, a nut 504 is connected to the bolt 503 in a threaded manner, and the fixing clamp 501 and the moving clamp 502 are fixed through the bolt 503 and the nut 504; clamping grooves are formed in the tops of one sides, opposite to the moving clamp 502, of the fixing clamp 501, two clamping grooves form a dovetail groove, the groove direction of the dovetail groove is perpendicular to the bolt 503, and the IGBT module DBC substrate 6 is clamped in the dovetail groove;
the fixing clamp 501 is of an L-shaped structure, an I-shaped convex groove 5011 is formed in the bottom of the fixing clamp 501, and the fixing clamp 501 is in sliding connection with the clamp base 8 through the I-shaped convex groove 5011; the fixed clamp 501 is provided with a moving groove 5012, the moving groove 5012 is a dovetail groove, the bottom end of the moving clamp 502 is arranged in the moving groove 5012 in a limiting sliding manner, and the I-shaped protruding groove 5011 and the moving groove 5012 are arranged along the axial direction of the bolt 503.
Through the arrangement of the dovetail grooves, enough movement space can be reserved for the IGBT module DBC substrate 6 in the transverse direction, the IGBT module DBC substrate 6 is prevented from moving in the vertical direction, and through the arrangement of the I-shaped convex grooves 5011, the fixing clamp 501 can move longitudinally under the action of the transmission device 7, and the fixing clamp 501 is limited to move in the vertical direction; by the arrangement of the moving groove 5012, the moving jig 502 can be moved in the longitudinal direction, and the movement of the moving jig 502 in the vertical direction can be restricted; the I-shaped convex groove 5011 and the movable groove 5012 can prevent the dovetail groove clamp 5 from moving along with the IGBT module DBC baseplate 6 during testing, so that a load sensor cannot obtain accurate results.
Further, the transmission device 7 comprises a gear shaft 703 and a gear 702, the gear 702 is fixedly sleeved in the middle of the gear shaft 703, a rack 701 is fixedly arranged at the bottom of the dovetail groove clamp 5, and the gear 702 is meshed with the rack 701; a gear groove 801 is formed in the middle of the top end of the clamp base 8, a gear 702 is arranged in the gear groove 801, U-shaped grooves 802 are formed in two opposite side walls of the gear groove 801, and two ends of a gear shaft 703 extend out of the clamp base 8 through the two U-shaped grooves 802 respectively; both ends of the gear shaft 703 are provided with threaded ends 7031, the threaded ends 7031 are connected with pre-tightening nuts 704 in a threaded mode, and the gear shaft 703 is fixedly matched with the outer wall of the clamp base 8 through the pre-tightening nuts 704.
The gear groove 801 can give the gear 702 sufficient space of movement, through gear 702 and rack 701 meshing, can make dovetail anchor clamps 5 slide along the direction of I-shaped tongue 5011 through rotating gear shaft 703, through the setting of pretension nut 704, can fix the position of gear shaft 703, prevents that gear shaft 703 from appearing the condition of autorotation, guarantees the stability that the test made dovetail anchor clamps 5.
Further, in order to facilitate rotation of the gear shaft 703, a knob end 7032 is provided at an end of the threaded end 7031 away from the gear 702, the diameter of the knob end 7032 is smaller than that of the gear shaft 703, a knob 705 is sleeved on the knob end 7032, and the knob 705 is in interference fit with the knob end 7032. During assembly, after the gear 702 and the pre-tightening nut 704 are assembled, the knob 705 is assembled, and the knob 705 and the gear shaft 703 can rotate together through interference fit between the knob 705 and the knob end 7032.
When the longitudinal position of the dovetail groove clamp 5 is adjusted, the gear shaft 703 is rotated through the knob 705, after the position of the dovetail groove clamp 5 is adjusted through the gear 702 and the rack 701, the pre-tightening nut 704 is tightly attached to the outer wall of the clamp base 8 through rotation of the pre-tightening nut 704, so that the gear shaft 703 cannot rotate, and the positioning effect of the dovetail groove clamp 5 is achieved by utilizing the meshing relationship between the gear 702 and the rack 701.
Further, in order to prevent the dovetail groove clamp 5 from being displaced in the vertical direction while being capable of moving in the longitudinal direction, an i-shaped groove 804 is formed in the top of the clamp base 8, and the i-shaped groove 5011 is adapted to the i-shaped groove 804.
A welding type IGBT module bonding wire tension test method, which uses a welding type IGBT module bonding wire tension test device, specifically comprises the following steps:
s1, assembling a tension testing device, and connecting the tension testing device with a controller of a micro-stretcher and a load sensor of the micro-stretcher respectively;
s2, adjusting a dovetail groove clamp 5 of the tension testing device, placing an IGBT module DBC substrate 6 on a platform of the dovetail groove clamp 5, and adjusting the height of the metal stay wire hook 4 to enable the bottom end of the metal stay wire hook 4 to be positioned below a bonding wire on the IGBT module DBC substrate 6;
s3, adjusting the longitudinal position of the IGBT module DBC substrate 6 by using the transmission device 7, so that the metal wire drawing hook 4 of the tension testing device hooks the central positions of two bonding points of the bonding wires on the IGBT module DBC substrate 6; the bonding wire is moved to the position above the metal stay wire hook 4 by manually and transversely moving the IGBT module DBC substrate 6, and the IGBT module DBC substrate 6 is fixed by utilizing the dovetail groove clamp 5;
and S4, starting the micro-stretcher until one bonding point of the bonding wire is separated from the IGBT module DBC substrate 6.
Further, in step S1, the specific assembly method of the tensile testing device is as follows:
s11, mounting a metal stay wire hook 4 on the upper coupler 1, and mounting the upper coupler 1 on a controller of a micro-stretcher through a pin shaft;
s12, mounting the clamp base 8 on the lower coupler 2, and mounting the lower coupler 2 on a load sensor of the micro-stretcher through a pin shaft;
s13, installing a transmission device 7 at the top end of the clamp base 8, longitudinally pushing the I-shaped convex groove 5011 of the dovetail groove clamp 5 along the I-shaped groove 804 of the clamp base 8, rotating the knob 705 after the rack 701 contacts with the gear 702, and moving the dovetail groove clamp 5 to the middle position by using the transmission device 7 to complete the assembly of the tension testing device.
The present application is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present application are intended to be included in the scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims (7)
1. Welding type IGBT module bonding wire tensile testing device, its characterized in that includes: the upper coupler (1) is arranged on a controller of the micro-stretcher through a pin shaft;
the lower coupler (2) is arranged on a load sensor of the micro-stretcher through a pin shaft;
the upper coupler (1) and the lower coupler (2) are connected and fixed with the micro-stretcher through the coupler pre-tightening nuts (3);
the clamp base (8) is detachably arranged on the lower coupler (2);
the dovetail groove clamp (5) is arranged at the top of the clamp base (8) in a limiting sliding manner, and the dovetail groove clamp (5) is used for installing the IGBT module DBC substrate (6);
the metal stay wire hook (4), the metal stay wire hook (4) is detachably arranged on the upper coupler (1), and the metal stay wire hook (4) is used for stretching a bonding wire on the IGBT module DBC substrate (6);
the transmission device (7) is arranged on the clamp base (8), and the transmission device (7) is in transmission fit with the dovetail groove clamp (5);
the dovetail groove clamp (5) comprises a fixed clamp (501) and a movable clamp (502), and the fixed clamp (501) is slidably mounted on the clamp base (8); the fixing clamp (501) and the moving clamp (502) are respectively provided with a horizontal through hole, a bolt (503) is arranged in each horizontal through hole, a nut (504) is connected to each bolt (503) in a threaded manner, and the fixing clamp (501) and the moving clamp (502) are fixed through the bolts (503) and the nuts (504); clamping grooves are formed in the top of one side, opposite to the moving clamp (502), of the fixing clamp (501), two clamping grooves form a dovetail groove, the groove direction of the dovetail groove is perpendicular to the bolt (503), and the IGBT module DBC substrate (6) is clamped in the dovetail groove;
the fixing clamp (501) is of an L-shaped structure, an I-shaped convex groove (5011) is formed in the bottom of the fixing clamp (501), and the fixing clamp (501) is in sliding connection with the clamp base (8) through the I-shaped convex groove (5011); a moving groove (5012) is formed in the fixed clamp (501), the bottom end of the moving clamp (502) is arranged in the moving groove (5012) in a limiting sliding mode, and the I-shaped protruding groove (5011) and the groove direction of the moving groove (5012) are arranged along the axial direction of the bolt (503);
the transmission device (7) comprises a gear shaft (703) and a gear (702), the gear (702) is fixedly sleeved in the middle of the gear shaft (703), a rack (701) is fixedly arranged at the bottom of the dovetail groove clamp (5), and the gear (702) is meshed with the rack (701); a gear groove (801) is formed in the middle of the top end of the clamp base (8), a gear (702) is arranged in the gear groove (801), U-shaped grooves (802) are formed in two opposite side walls of the gear groove (801), and two ends of the gear shaft (703) extend out of the clamp base (8) through the two U-shaped grooves (802) respectively; both ends of gear shaft (703) all are provided with screw thread end (7031), screw thread end (7031) go up threaded connection has pretension nut (704), gear shaft (703) pass through pretension nut (704) with the outer wall fixed fit of anchor clamps base (8).
2. The welding type IGBT module bonding wire tensile testing device according to claim 1, wherein an upper pin shaft hole (101) is formed in the upper coupler (1), and the upper coupler (1) and a controller of the micro-stretcher are fixedly connected through the upper pin shaft hole (101) and a pin shaft; the outer wall of the bottom of the upper coupler (1) is provided with threads, and the coupler pre-tightening nut (3) is connected with the bottom of the upper coupler (1) in a threaded manner; an upper base (102) is fixedly arranged at the bottom end of the upper coupler (1), and the upper base (102) is in limit fit with the coupler pre-tightening nut (3); an upper threaded hole (103) is formed in the bottom end of the upper base (102), and the metal stay wire hook (4) is in threaded connection with the upper threaded hole (103).
3. The welding type IGBT module bonding wire tensile testing device according to claim 1, wherein a lower pin shaft hole (201) is formed in the lower coupler (2), and the lower coupler (2) is fixedly connected with a load sensor of the micro-stretcher through the lower pin shaft hole (201) and a pin shaft; the outer wall of the top of the lower coupler (2) is provided with threads, and the coupler pre-tightening nut (3) is connected with the top of the lower coupler (2) in a threaded manner; the upper end of the lower coupler (2) is fixedly provided with a lower base (202), the lower base (202) and the clamp base (8) Ji Kuan are provided with a counter bore (203) on the lower base (202), a screw (204) is arranged in the counter bore (203), the bottom end of the clamp base (8) is provided with a lower threaded hole (803), and the lower base (202) and the clamp base (8) are fixedly connected through the screw (204) and the lower threaded hole (803).
4. The welding type IGBT module bonding wire tensile testing device according to claim 1, characterized in that one end of the threaded end (7031) far away from the gear (702) is provided with a knob end (7032), the diameter of the knob end (7032) is smaller than the diameter of the gear shaft (703), a knob (705) is sleeved on the knob end (7032), and the knob (705) is in interference fit with the knob end (7032).
5. The welding type IGBT module bonding wire tensile testing device according to claim 1, wherein an I-shaped groove (804) is formed in the top of the clamp base (8), and the I-shaped groove (5011) is matched with the I-shaped groove (804).
6. A welding type IGBT module bonding wire tension test method, characterized by using the welding type IGBT module bonding wire tension test device according to any one of claims 1 to 5, specifically comprising the steps of:
s1, assembling a tension testing device, and connecting the tension testing device with a controller of a micro-stretcher and a load sensor of the micro-stretcher respectively;
s2, adjusting a dovetail groove clamp (5) of the tension testing device, placing an IGBT module DBC substrate (6) on a platform of the dovetail groove clamp (5), and adjusting the height of the metal stay wire hook (4) to enable the bottom end of the metal stay wire hook (4) to be positioned below a bonding wire on the IGBT module DBC substrate (6);
s3, adjusting the longitudinal position of the IGBT module DBC substrate (6) by using a transmission device (7) to enable a metal wire drawing hook (4) of the tension testing device to hook the central positions of two bonding points of a bonding wire on the IGBT module DBC substrate (6); the bonding wire is moved to the position above the metal stay wire hook (4) by manually and transversely moving the IGBT module DBC substrate (6), and the IGBT module DBC substrate (6) is fixed by utilizing the dovetail groove clamp (5);
and S4, starting the micro-stretcher until one bonding point of the bonding wire is separated from the IGBT module DBC substrate (6).
7. The method for testing the tensile force of the bonding wire of the welded IGBT module according to claim 6, wherein in step S1, the tensile force testing device is assembled in the following manner:
s11, mounting a metal stay wire hook (4) on the upper coupler (1), and mounting the upper coupler (1) on a controller of a micro-stretcher through a pin shaft;
s12, mounting the clamp base (8) on the lower coupler (2), and mounting the lower coupler (2) on a load sensor of the micro-stretcher through a pin shaft;
s13, installing a transmission device (7) at the top end of the clamp base (8), installing the dovetail groove clamp (5) on the clamp base (8), and moving the dovetail groove clamp (5) to the middle position of the clamp base (8) by using the transmission device (7) to complete the assembly of the tension testing device.
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| CN116818534A (en) * | 2023-08-30 | 2023-09-29 | 江铃汽车股份有限公司 | Wave soldering quality detection method and device |
| CN117538161B (en) * | 2024-01-10 | 2024-03-19 | 烟台台芯电子科技有限公司 | IGBT module bonding wire tensile test tool |
| CN118294370B (en) * | 2024-05-27 | 2024-09-27 | 赛晶亚太半导体科技(浙江)有限公司 | IGBT unit aluminum wire welding defect detection method, detection device and detection system |
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