CN116426196A - Energy-saving coating for electrical equipment - Google Patents
Energy-saving coating for electrical equipment Download PDFInfo
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- CN116426196A CN116426196A CN202310428777.7A CN202310428777A CN116426196A CN 116426196 A CN116426196 A CN 116426196A CN 202310428777 A CN202310428777 A CN 202310428777A CN 116426196 A CN116426196 A CN 116426196A
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- saving
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- 239000011248 coating agent Substances 0.000 title claims abstract description 105
- 238000000576 coating method Methods 0.000 title claims abstract description 105
- 239000002202 Polyethylene glycol Substances 0.000 claims abstract description 18
- 229920001223 polyethylene glycol Polymers 0.000 claims abstract description 18
- 230000005855 radiation Effects 0.000 claims abstract description 18
- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 17
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims abstract description 17
- 239000010452 phosphate Substances 0.000 claims abstract description 17
- 238000001723 curing Methods 0.000 claims abstract description 15
- 230000001681 protective effect Effects 0.000 claims abstract description 14
- 238000001035 drying Methods 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000000945 filler Substances 0.000 claims abstract description 11
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000002360 preparation method Methods 0.000 claims abstract description 10
- 239000004593 Epoxy Substances 0.000 claims abstract description 9
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 9
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 8
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 5
- 239000000853 adhesive Substances 0.000 claims abstract description 5
- 230000001070 adhesive effect Effects 0.000 claims abstract description 5
- 239000002904 solvent Substances 0.000 claims abstract description 5
- 239000003999 initiator Substances 0.000 claims abstract description 4
- 239000004065 semiconductor Substances 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims abstract description 4
- 238000002156 mixing Methods 0.000 claims abstract description 3
- 239000000203 mixture Substances 0.000 claims abstract description 3
- 238000004806 packaging method and process Methods 0.000 claims abstract description 3
- 238000003825 pressing Methods 0.000 claims description 17
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 10
- 238000011161 development Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 claims description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 6
- 238000004381 surface treatment Methods 0.000 claims description 6
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 5
- LGPAKRMZNPYPMG-UHFFFAOYSA-N (3-hydroxy-2-prop-2-enoyloxypropyl) prop-2-enoate Chemical compound C=CC(=O)OC(CO)COC(=O)C=C LGPAKRMZNPYPMG-UHFFFAOYSA-N 0.000 claims description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 claims description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 2
- GSNUFIFRDBKVIE-UHFFFAOYSA-N DMF Natural products CC1=CC=C(C)O1 GSNUFIFRDBKVIE-UHFFFAOYSA-N 0.000 claims description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- 239000008096 xylene Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 6
- 239000011241 protective layer Substances 0.000 abstract description 3
- 239000002994 raw material Substances 0.000 description 12
- 238000003475 lamination Methods 0.000 description 11
- 229940068918 polyethylene glycol 400 Drugs 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/08—Anti-corrosive paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/10—Process efficiency
Abstract
The invention relates to the technical field of nonmetallic protective layers, and provides a preparation process of an energy-saving coating of electrical equipment and the energy-saving coating of the electrical equipment, wherein the electrical equipment is one of a printed circuit board and a semiconductor packaging substrate, and comprises the following steps: s1, mixing 10-15 parts of epoxy acrylic resin, 10-15 parts of polyfunctional acrylate, 2-4 parts of polyethylene glycol phosphate, 5-8 parts of polyethylene glycol dimethacrylate, 1-3 parts of 3- (trimethoxy silane) propyl acrylate, 1-3 parts of initiator, 3-6 parts of curing agent, 15-20 parts of heat radiation filler and 15-20 parts of solvent, and coating the mixture on a coating material; s2, drying to obtain a viscous coating; and S3, attaching the adhesive coating and the protective film to obtain the energy-saving coating. Through the technical scheme, the problem of low heat radiation performance in the prior art is solved.
Description
Technical Field
The invention relates to the technical field of nonmetallic protective layers, in particular to an energy-saving coating for electrical equipment.
Background
In recent years, with the development of society and the progress of technology, electronic devices have been developed to be miniaturized and light-weighted, and photosensitive protective films capable of forming minute opening patterns have been applied to printed circuit boards, semiconductor package substrates, flexible printed circuit boards, and the like.
The solder mask is green and has other colors, such as insulativity, welding heat tolerance, corrosion resistance, high adhesive force and the like. The solder resist can not only prevent short circuits and small bridges, but also be considered as an additional protective layer for the PCB. The solder mask layer acts as an insulating layer of the PCB and can prevent corrosion, oxidation or damage caused by chemical exposure.
With the increasing degree of integration of electronic components, there is an increasing need to improve heat radiation to effectively disperse and dissipate heat generated in electronic devices, and thus to improve the heat radiation performance of solder masks. However, it is generally necessary to add a heat radiation filler such as alumina or the like, but generally inorganic nanoparticles, and the adhesiveness on a circuit board is poor, and the heat radiation performance cannot be fully exhibited.
Disclosure of Invention
The invention provides an energy-saving coating for electrical equipment, which solves the problem of low heat radiation performance in the related technology.
The technical scheme of the invention is as follows:
the preparation process of the energy-saving coating of the electrical equipment is one of a printed circuit board and a semiconductor packaging substrate, and comprises the following steps of:
s1, mixing 10-15 parts of epoxy acrylic resin, 10-15 parts of polyfunctional acrylate, 1-3 parts of polyethylene glycol phosphate, 5-8 parts of polyethylene glycol dimethacrylate, 2-4 parts of 3- (trimethoxy silane) propyl acrylate, 1-3 parts of initiator, 3-6 parts of curing agent, 15-20 parts of heat radiation filler and 15-20 parts of solvent, and coating the mixture on a coating material;
s2, drying to obtain a viscous coating;
and S3, attaching the adhesive coating and the protective film to obtain the energy-saving coating.
As a further technical scheme, the polyethylene glycol phosphate is less than 3- (trimethoxysilane) propyl acrylate.
As a further technical scheme, the multifunctional acrylate comprises one or more of glycerol diacrylate, ethylene glycol diacrylate and 1, 4-butanediol diacrylate.
As a further technical scheme, the heat radiation filler comprises one or two of titanium oxide and aluminum oxide, and the particle size is 20-40nm.
The heat radiation filler is added in the invention, the particle size is controlled to be 20-40nm, the particle size is smaller, and the agglomeration is easy in the preparation process. Due to the addition of polyethylene glycol phosphate and 3- (trimethoxy silane) propyl acrylate, the dispersity of the nanoscale superfine filler in the coating can be ensured, the maximum exertion of heat radiation performance is ensured, the uniformity of the coating is improved, the corrosion resistance and durability of the coating can be improved by adding the heat radiation filler, and the service life is prolonged.
As a further technical scheme, the solvent comprises one or more of acetone, ethyl acetate, DMF, butanone, tetrahydrofuran, xylene, toluene, methylene dichloride and butyl acetate.
As a further technical solution, the coating rate is 25m/min.
As a further technical scheme, the drying is as follows: drying at 50-60deg.C for 10-12min.
According to the invention, polyethylene glycol phosphate and polyethylene glycol dimethacrylate are added, so that the drying speed of the coating can be improved, and the prepared coating has higher corrosion resistance when applied to a circuit board.
As a further technical scheme, the attaching temperature is 60-70 ℃.
The invention also provides an energy-saving coating obtained according to the preparation process.
The invention also provides a using method of the energy-saving coating, which comprises the following steps:
a1, carrying out surface treatment on electrical equipment;
a2, stripping the protective film on the coating, and pasting the coating on the surface of the electrical equipment;
a3, removing the coating material after ultraviolet exposure, and curing after development.
As a further technical scheme, the vacuum lamination is adopted during lamination, the vacuum time of a vacuum film pressing machine is 15s, and the lamination temperature is 7The pressing time is 12-15s at 0-75deg.C, and the pressure is 0.6Kg/cm 2 。
The beneficial effects of the invention are as follows:
according to the invention, the heat radiation filler is added into the coating raw material to improve the heat radiation performance of the coating, and polyethylene glycol phosphate and 3- (trimethoxy silane) propyl acrylate are added to ensure the dispersion degree and the adhesion degree of the heat radiation filler in the high polymer, so that the obtained coating has high heat radiation performance, high adhesive force, pencil hardness of 7H-8H, excellent corrosion resistance and improved electrical insulation property of the coating.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Epoxy acrylic resin: waterborne acrylic modified epoxy ester resin EE672A, beijing Naghui environmental protection technology Co., ltd;
curing agent: epoxy resin E-44 curing agent, jinan sunny chemical technology Co., ltd;
alumina: the average grain diameter is 30nm, shanghai Hui essence sub-nanometer New Material Co., ltd;
polyethylene glycol 400 phosphate: petrochemical industry of Jiangsu province sea-safe;
polyethylene glycol dimethacrylate: korean KPX photo-curing monomer D208M PEG200DMA, available from Shanghai chemical company, inc;
and (3) an initiator: 2, 2-dimethoxy-2-phenylacetophenone, hengqiao industries, inc.
Example 1
A preparation process of a printed circuit board coating comprises the following steps:
s1, coating a coating raw material on a coating material at a coating rate of 25m/min;
s2, bonding the dried coating with the protective film to obtain an energy-saving coating with the thickness of 50 mu m, wherein the drying is carried out at 60 ℃ for 10min, and the bonding temperature is 70 ℃;
the coating raw materials comprise the following components in parts by weight: 10 parts of epoxy acrylic resin, 10 parts of glycerol diacrylate, 1 part of polyethylene glycol 400 phosphate, 5 parts of polyethylene glycol dimethacrylate, 2 parts of 3- (trimethoxysilane) propyl acrylate, 1 part of 2, 2-dimethoxy-2-phenylacetophenone, 3 parts of curing agent, 15 parts of alumina and 15 parts of acetone;
the application method of the coating comprises the following steps:
a1, carrying out surface treatment on the electrical equipment so that the biting amount is 1.2 mu m;
a2, stripping the protective film on the coating, and pasting the coating on the surface of the electrical equipment;
a3, removing the coating material after ultraviolet exposure, and curing after development.
The vacuum lamination is adopted during lamination, the vacuum time of the vacuum laminator is 15s, the lamination temperature is 70 ℃, the lamination time is 15s, and the pressure is 0.6Kg/cm 2 。
Example 2
A preparation process of a printed circuit board coating comprises the following steps:
s1, coating a coating raw material on a coating material at a coating rate of 25m/min;
s2, bonding the dried coating with the protective film to obtain an energy-saving coating with the thickness of 50 mu m, wherein the drying is carried out at 50 ℃ for 10min, and the bonding temperature is 60 ℃;
the coating raw materials comprise the following components in parts by weight: 15 parts of epoxy acrylic resin, 15 parts of ethylene glycol diacrylate, 3 parts of polyethylene glycol 400 phosphate, 8 parts of polyethylene glycol dimethacrylate, 4 parts of 3- (trimethoxysilane) propyl acrylate, 3 parts of 2, 2-dimethoxy-2-phenylacetophenone, 6 parts of a curing agent, 20 parts of aluminum oxide and 20 parts of ethyl acetate;
the application method of the coating comprises the following steps:
a1, carrying out surface treatment on the electrical equipment so that the biting amount is 1.2 mu m;
a2, stripping the protective film on the coating, and pasting the coating on the surface of the electrical equipment;
a3, removing the coating material after ultraviolet exposure, and curing after development.
The pressing and pasting adopts vacuum pressing and pasting, the vacuum time of a vacuum film pressing machine is 15s, the pressing and pasting temperature is 75 ℃, the pressing and pasting time is 12s, and the pressure is 0.6Kg/cm 2 。
Example 3
A preparation process of a printed circuit board coating comprises the following steps:
s1, coating a coating raw material on a coating material at a coating rate of 25m/min;
s2, bonding the dried coating with the protective film to obtain an energy-saving coating with the thickness of 50 mu m, wherein the drying is carried out at 50 ℃ for 10min, and the bonding temperature is 60 ℃;
the coating raw materials comprise the following components in parts by weight: 12 parts of epoxy acrylic resin, 12 parts of 1, 4-butanediol diacrylate, 2 parts of polyethylene glycol 400 phosphate, 6 parts of polyethylene glycol dimethacrylate, 3 parts of 3- (trimethoxy silane) propyl acrylate, 2.5 parts of 2, 2-dimethoxy-2-phenylacetophenone, 4 parts of curing agent, 16 parts of aluminum oxide and 18 parts of ethyl acetate;
the application method of the coating comprises the following steps:
a1, carrying out surface treatment on the electrical equipment so that the biting amount is 1.2 mu m;
a2, stripping the protective film on the coating, and pasting the coating on the surface of the electrical equipment;
a3, removing the coating material after ultraviolet exposure, and curing after development.
The pressing and pasting adopts vacuum pressing and pasting, the vacuum time of a vacuum film pressing machine is 15s, the pressing and pasting temperature is 75 ℃, the pressing and pasting time is 12s, and the pressure is 0.6Kg/cm 2 。
Example 4
A preparation process of a printed circuit board coating comprises the following steps:
s1, coating a coating raw material on a coating material at a coating rate of 25m/min;
s2, bonding the dried coating with the protective film to obtain an energy-saving coating with the thickness of 50 mu m, wherein the drying temperature is 60 ℃, the drying time is 10min, and the bonding temperature is 70 ℃;
the coating raw materials comprise the following components in parts by weight: 12 parts of epoxy acrylic resin, 12 parts of glycerol diacrylate, 2.5 parts of polyethylene glycol 400 phosphate, 6 parts of polyethylene glycol dimethacrylate, 2.5 parts of 3- (trimethoxy silane) propyl acrylate, 2.5 parts of 2, 2-dimethoxy-2-phenyl acetophenone, 4 parts of curing agent, 16 parts of alumina and 18 parts of acetone;
the application method of the coating comprises the following steps:
a1, carrying out surface treatment on the electrical equipment so that the biting amount is 1.2 mu m;
a2, stripping the protective film on the coating, and pasting the coating on the surface of the electrical equipment;
a3, removing the coating material after ultraviolet exposure, and curing after development.
The vacuum lamination is adopted during lamination, the vacuum time of the vacuum laminator is 15s, the lamination temperature is 70 ℃, the lamination time is 15s, and the pressure is 0.6Kg/cm 2 。
Comparative example 1
The difference from example 3 is that polyethylene glycol 400 phosphate and 3- (trimethoxysilane) propyl acrylate are not added to the raw materials; otherwise, the same as in example 3 was used.
Comparative example 2
The difference from example 3 is that polyethylene glycol 400 phosphate is not added to the raw material; otherwise, the same as in example 3 was used.
Comparative example 3
The difference from example 3 is that 3- (trimethoxysilane) propyl acrylate was not added to the raw material, and the other is the same as in example 3.
Comparative example 4
The difference from example 3 is that 3- (trimethoxysilane) propyl acrylate is replaced with an equivalent amount of gamma-glycidoxypropyl trimethoxysilane, the remainder being the same as in example 3.
Performance test:
1) Water absorption rate: samples were treated using an isothermal-isotonic apparatus at a temperature of 85 ℃ and a humidity of 85% for 24 hours with water absorption = change in mass before and after treatment/mass before treatment 100%.
2) Thermal conductivity = thermal diffusivity × specific heat capacity × density.
3) Insulation resistance: the insulation resistance value of the obtained sample was measured at an applied voltage of 500V.
Table 1 properties of examples and comparative examples
The heat conductivity of the coating can be improved by adding the aluminum oxide, and the improvement effect of the aluminum oxide on the heat conductivity of the coating is exerted to the best degree due to the synergistic effect of the addition of the polyethylene glycol phosphate and the 3- (trimethoxysilane) propyl acrylate, so that the heat conductivity of the coating obtained by the embodiment is obviously higher than that of the comparative example.
However, the addition of polyethylene glycol 400 phosphate affects the water absorption of the coating, and the invention discovers that the water absorption of the coating is relatively improved when 3- (trimethoxysilane) propyl acrylate is added, so that the use requirement can be met. In addition, in the invention, the insulation property of the coating is improved to a certain extent by adding polyethylene glycol phosphate.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.
Claims (10)
1. The preparation process of the energy-saving coating of the electrical equipment is one of a printed circuit board and a semiconductor packaging substrate, and is characterized by comprising the following steps of:
s1, mixing 10-15 parts of epoxy acrylic resin, 10-15 parts of polyfunctional acrylate, 2-4 parts of polyethylene glycol phosphate, 5-8 parts of polyethylene glycol dimethacrylate, 1-3 parts of 3- (trimethoxy silane) propyl acrylate, 1-3 parts of initiator, 3-6 parts of curing agent, 15-20 parts of heat radiation filler and 15-20 parts of solvent, and coating the mixture on a coating material;
s2, drying to obtain a viscous coating;
and S3, attaching the adhesive coating and the protective film to obtain the energy-saving coating.
2. The process for preparing an energy-saving coating for electrical equipment according to claim 1, wherein the multifunctional acrylate comprises one or more of glycerol diacrylate, ethylene glycol diacrylate and 1, 4-butanediol diacrylate.
3. The process for preparing an energy-saving coating for electrical equipment according to claim 1, wherein the heat radiation filler comprises one or two of titanium oxide and aluminum oxide, and has a particle size of 20-40nm.
4. The process for preparing the energy-saving coating for the electrical equipment according to claim 1, wherein the solvent comprises one or more of acetone, ethyl acetate, DMF, butanone, tetrahydrofuran, xylene, toluene, methylene chloride and butyl acetate.
5. The process for preparing an energy-saving coating for electrical equipment according to claim 1, wherein the coating rate is 25m/min.
6. The process for preparing an energy-saving coating for electrical equipment according to claim 1, wherein the drying is: drying at 50-60deg.C for 10-12min.
7. The process for preparing an energy-saving coating for electrical equipment according to claim 1, wherein the bonding temperature is 60-70 ℃.
8. An energy saving coating obtained by the preparation process according to any one of claims 1 to 7.
9. The method of using an energy saving coating according to claim 8, comprising the steps of:
a1, carrying out surface treatment on electrical equipment;
a2, stripping the protective film on the coating, and pasting the coating on the surface of the electrical equipment;
a3, removing the coating material after ultraviolet exposure, and curing after development.
10. The method for using energy-saving coating according to claim 9, wherein the pressing and pasting adopts vacuum pressing and pasting, the vacuum time of a vacuum film pressing machine is 15s, the pressing and pasting temperature is 70-75 ℃, the pressing and pasting time is 12-15s, and the pressure is 0.6Kg/cm 2 。
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310428777.7A CN116426196A (en) | 2023-04-20 | 2023-04-20 | Energy-saving coating for electrical equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310428777.7A CN116426196A (en) | 2023-04-20 | 2023-04-20 | Energy-saving coating for electrical equipment |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113825322A (en) * | 2021-09-15 | 2021-12-21 | 广东硕成科技有限公司 | Preparation process and application of solder resist layer |
| CN115561965A (en) * | 2022-08-16 | 2023-01-03 | 广东硕成科技股份有限公司 | Solder resist dry film capable of resisting chemical reagent and preparation method thereof |
| CN115826358A (en) * | 2022-10-19 | 2023-03-21 | 广东硕成科技股份有限公司 | Resin composition for packaging carrier plate and solder-resistant dry film prepared from resin composition |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113825322A (en) * | 2021-09-15 | 2021-12-21 | 广东硕成科技有限公司 | Preparation process and application of solder resist layer |
| CN115561965A (en) * | 2022-08-16 | 2023-01-03 | 广东硕成科技股份有限公司 | Solder resist dry film capable of resisting chemical reagent and preparation method thereof |
| CN115826358A (en) * | 2022-10-19 | 2023-03-21 | 广东硕成科技股份有限公司 | Resin composition for packaging carrier plate and solder-resistant dry film prepared from resin composition |
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