CN116423380A - Chip delamination plane grinds machine - Google Patents
Chip delamination plane grinds machine Download PDFInfo
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- CN116423380A CN116423380A CN202310642847.9A CN202310642847A CN116423380A CN 116423380 A CN116423380 A CN 116423380A CN 202310642847 A CN202310642847 A CN 202310642847A CN 116423380 A CN116423380 A CN 116423380A
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- 230000032798 delamination Effects 0.000 title claims abstract description 12
- 238000001514 detection method Methods 0.000 claims abstract description 214
- 230000007246 mechanism Effects 0.000 claims abstract description 95
- 239000004020 conductor Substances 0.000 claims abstract description 21
- 238000005192 partition Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 abstract description 19
- 238000001125 extrusion Methods 0.000 abstract description 4
- 238000012423 maintenance Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 description 13
- 230000000694 effects Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 206010044565 Tremor Diseases 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 244000137852 Petrea volubilis Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The invention relates to the technical field of plane grinding, in particular to a chip delamination plane grinding machine, which comprises an integral external mechanism and an integral bottom plate, wherein the integral external mechanism is internally provided with a bottom detection mechanism for avoiding the situation of mismatching with a measuring machine caused by grinding chips with the same size and different types, the bottom detection mechanism is internally provided with a detection main board and a detection conductor, when a top grinding mechanism extrudes downwards, the detection main board and the detection conductor are extruded downwards by the detection top board to form a stacked state by being stressed, and after extrusion is finished, the bottom detection mechanism completely covers the back of a chip, so that the bottom detection mechanism can adapt to detection of all types with the same size, and on the other hand, the detection mechanism has no complicated procedures of other large-scale instruments on the market, and simple equipment and mechanical structure can ensure quick and convenient later maintenance.
Description
Technical Field
The invention relates to the technical field of plane grinding, in particular to a chip delamination plane grinding machine.
Background
In order to ensure that the disc surfaces of an upper millstone and a lower millstone of a double-sided grinder in the market are parallel to each other, after the double-sided grinder is used for a period of time, the parallel errors of the upper millstone and the lower millstone are required to be corrected manually, so that the upper millstone and the lower millstone are restored to be parallel to each other, however, the manual correction method is required to consume manpower and time, has lower precision and cannot meet the precision requirement of precision parts, the existing grinder mostly grinds the surface of a chip through the grinding disc, the grinding disc rotates at a central point, the peripheral speed of the grinding disc is higher than that of an inner ring, therefore, the removal speed of the layer on the outer side of a test piece with an area is higher than that of the center of a sample,
most of grinding machines in the current market use grinding paper as main materials, but the application efficiency of the grinding paper is low, and the grinding paper needs to be replaced for a long time, so that the uniformity of sample delamination is poor, the ideal condition that each part of a test piece can be delaminated evenly cannot be achieved, meanwhile, the traditional device is not provided with a proper chip clamping mechanism, and different types of chips cannot be clamped effectively, so that the practical limitation is large.
Disclosure of Invention
In order to solve the technical problems, the invention provides a chip delamination plane grinding machine, which comprises an integral external mechanism, wherein the integral external mechanism further comprises an integral bottom plate, an integral main column is fixedly connected to a central shaft of the outer wall of the top of the integral bottom plate, an integral telescopic main rod is fixedly connected to the outer wall of the top of the integral bottom plate, the integral external mechanism provides an installation position for a subsequent mechanism, has a stabilizing effect in the operation process, counteracts tremble and vibration generated during the operation of the mechanism, ensures the normal operation of equipment, avoids the occurrence of jolting and other problems, and further comprises:
the bottom detection mechanism, bottom detection mechanism is still including detecting the bottom plate, detect the top outer wall axis department fixedly connected with of bottom plate and detect the bottom ring, detect the top outer wall department sliding connection of bottom ring and have a plurality of to detect the mainboard, set up the bearing that this bottom detection mechanism's aim at fixed needs processing and make equipment can process the original paper of equidimension not, avoid because of grinding the chip of same equidimension different models, lead to appearing with the condition of measuring machine mismatch.
The top dull polish mechanism, top dull polish mechanism is still including dull polish jack-up, the top outer wall department fixedly connected with dull polish gear of dull polish jack-up, the bottom outer wall department rotation of dull polish jack-up is connected with the dull polish body of dismantling, and this power motor provides moving power for whole mechanism, drives the operation of dull polish main part and dull polish bearing in the top dull polish mechanism, realizes getting rid of the effect of shell to the chip dull polish.
Preferably, the whole external mechanism further comprises a whole middle shaft plate fixed at the outer wall of the whole telescopic main rod, a plurality of whole small holes are formed in the outer wall of the top of the whole middle shaft plate, a whole telescopic auxiliary column is slidably connected to the outer wall of the top of the whole telescopic main rod, and a whole top plate is fixedly connected to the outer wall of the top of the whole telescopic auxiliary column.
Preferably, the whole external mechanism further comprises a whole big hole formed in the outer wall of the top of the whole top plate, a power motor is fixedly connected to the middle shaft of the outer wall of the top of the whole top plate, the front end side wall of the power motor is rotationally connected with the whole gear, the power motor provides grinding power for whole equipment, automation is achieved, meanwhile, error phenomena of products are reduced, and yield is improved.
Preferably, the bottom detection mechanism further comprises a detection conductor fixed at the bottom of the detection main board, a detection fixing body is fixedly connected to the middle shaft of the outer wall of the detection conductor, a plurality of detection spacing plates are fixedly connected to the adjacent left and right side walls of the detection main board, detection springs are fixedly connected between the two adjacent detection spacing plates, the detection main board and the detection conductor are arranged inside the bottom detection mechanism through the detection springs, the detection conductor and the detection main board, and when the top frosting mechanism is extruded downwards, the detection main board is extruded downwards by the stress of the detection top board and the stress of the detection conductor form a stacked state.
Preferably, the bottom detection mechanism further comprises a detection short rod which is slidably connected to the top of the detection bottom plate, a first detection variant is fixedly connected to a middle shaft at the outer wall of the top of the detection short rod, a short detection spring is fixedly connected to the outer wall of the bottom of the first detection variant, a long detection rod is slidably connected to the rear of the outer wall of the detection bottom plate, a second detection variant is fixedly connected to the middle shaft of the outer wall of the top of the detection long rod, a long detection spring is fixedly connected to the outer wall of the bottom of the second detection variant, a detection bottom block is fixedly connected to one end of the long detection spring far away from the second detection variant, a chip which needs to be ground is sleeved at the outer wall of the bottom detection mechanism, so that the sleeved part cannot form a stacked state, after the extrusion is completed, the bottom detection mechanism completely covers the back of the chip, and therefore the bottom detection mechanism can adapt to detection of all types of the same size.
Preferably, the bottom detection mechanism further comprises a detection main pipe fixed at the middle shaft of the outer wall of the detection bottom plate, the middle shaft of the inner wall of the detection main pipe is fixedly connected with a detection main spring, the middle shaft of the outer wall of the top of the detection main spring is fixedly connected with a detection partition board, the northeast middle shaft of the detection partition board is fixedly connected with a detection top column, the outer wall of the top of the detection top column is fixedly connected with a detection top plate, the outer wall of the top of the detection main plate is provided with a plurality of detection top grooves, the inner wall of each detection top groove is rotationally connected with a detection pulley, the detection main pipe is connected with a power supply through an external power motor, and the grinding main body arranged inside the grinding outer wall is driven to rotate, so that the outer surface of a chip is ground.
Preferably, the top dull polish mechanism is still including fixing the dull polish supporter in dull polish dismantlement body bottom, the bottom outer wall axis department fixedly connected with dull polish bottom plate of dull polish supporter, the outer wall department of dull polish bottom plate rotates and is connected with dull polish outer wall, dull polish inside groove has been seted up to the inner wall department of dull polish outer wall, and changes current grinding disc into roller type design and make every point speed all the same in the dull polish main part, the homogeneity of grinding can be reached, the homogeneity of removing the layer reaches, then the area of observing can enlarge, also can be better on the efficiency of grinding, need not adjust force way and angle always when grinding, improve the efficiency of device grinding and the accuracy of grinding.
Preferably, the top dull polish mechanism is still including rotating the dull polish bearing of connection in dull polish outer wall bottom, dull polish inner panel is fixedly connected with in dull polish bearing's inner wall axis department, a plurality of dull polish little hole has been seted up in dull polish inner panel's top outer wall department, a plurality of the little hole of dull polish's inner wall department sliding connection has dull polish main part, sets up the aim at of this dull polish main part, replaces the effect of dull polish paper through the dull polish main part in the operation process, reduces the problem that need frequently change the dull polish paper in the dull polish link, reduces the step of workman's operation on the process, improves work efficiency, alleviates because mechanical fatigue who brings when frequently changing.
The invention has the beneficial effects that:
1. in order to avoid the situation that the chips with the same size and different types are not matched with a measuring machine due to grinding, the invention is internally provided with the bottom detection mechanism, the bottom detection mechanism is internally provided with the detection main board and the detection conductor, when the top grinding mechanism extrudes downwards, the detection main board and the detection conductor are extruded downwards by the stress of the detection top board to form a stacked state, and the outer wall of the bottom detection mechanism is sleeved with the chips needing grinding, so that the sleeved part cannot form the stacked state, and after the extrusion is finished, the bottom detection mechanism completely covers the back of the chips, so that the bottom detection mechanism can adapt to detection of all types with the same size, on the other hand, the detection mechanism does not have complicated procedures of other large-scale instruments on the market, and simple equipment and mechanical structures can ensure the rapid and convenient later maintenance.
2. This kind of chip removes layer plane and grinds machine, through being provided with dull polish bottom plate and dull polish main part, the power connection of switch-on through outside power motor drives the inside dull polish main part that sets up of dull polish outer wall and rotates, thereby grind the surface of chip, and change current grinding disc into roller formula design and make every little speed all the same in the dull polish main part, the homogeneity of grinding can be reached, the homogeneity of removing the layer reaches, then the area of observing can enlarge, also can be better on the efficiency of grinding, need not adjust force way and angle always when grinding, the efficiency of improvement device grinding and the accuracy of grinding.
3. In order to reduce the investment of labor cost and realize automatic detection, after the detection procedure is finished, the bottom detection mechanism stretches upwards to withdraw downward pressure, a detection main spring arranged in the detection mechanism upwards generates force to drive a detection top plate to reset upwards and enable a detection main plate and a detection conductor in a stacked state to be restored, at the moment, the detection main spring is pressed upwards and drives the detection top plate to move upwards, and demoulding is finished.
4. The chip clamping device has the advantages that the chip can be effectively clamped and fixed, the shaking of the chip during grinding is avoided, meanwhile, the clamping can be adjusted according to different lengths of the chip, the practicability of the device is improved, and meanwhile, the position between the chip and the annular sand paper can be adjusted according to the thickness of the chip, so that the chip can be clamped and fixed conveniently.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic cross-sectional view of the overall structure of the present invention;
FIG. 3 is a schematic diagram of the overall external mechanism of the present invention;
FIG. 4 is a schematic diagram of a bottom detection mechanism according to the present invention;
FIG. 5 is a schematic cross-sectional view of a bottom detection mechanism of the present invention;
FIG. 6 is an enlarged view of FIG. 5A in accordance with the present invention;
FIG. 7 is a schematic view of a top sanding mechanism according to the present invention;
fig. 8 is a schematic cross-sectional view of a top sanding mechanism of the present invention.
In the figure: 1. an integral external mechanism; 101. an integral base plate; 102. an integral main column; 103. an integral telescopic main rod; 104. an integral center shaft plate; 105. the whole small hole is formed; 106. an integral telescopic auxiliary column; 107. an integral top plate; 108. the whole is large in hole; 109. a power motor; 110. an integral gear; 2. a bottom detection mechanism; 201. detecting a bottom plate; 202. detecting a bottom ring; 203. detecting a main board; 204. detecting a conductor; 205. detecting a fixed body; 206. detecting a partition plate; 207. detecting a spring; 208. detecting a top plate; 209. detecting a short rod; 210. detecting a first variant; 211. detecting a short spring; 212. detecting a long rod; 213. detecting a bottom block; 214. detecting a second variant; 215. detecting a long spring; 216. detecting a main pipe; 217. detecting a main spring; 218. detecting a partition board; 219. detecting a top column; 220. detecting a top groove; 221. detecting a pulley; 3. a top sanding mechanism; 301. polishing a top column; 302. a frosted gear; 303. a frosted disassembly body; 304. a frosted support; 305. a frosted bottom plate; 306. grinding the outer wall; 307. a frosted inner tank; 308. a frosted bearing; 309. a frosted inner plate; 310. grinding small holes; 311. a sanding body.
Detailed Description
The invention will be described in further detail with reference to the drawings and the detailed description. The embodiments of the invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Referring to fig. 1-3, the present invention is a chip delamination plane grinder, including an integral external mechanism 1, the integral external mechanism 1 further includes an integral bottom plate 101, a central shaft of an outer wall of a top of the integral bottom plate 101 is fixedly connected with an integral main column 102, an outer wall of a top of the integral bottom plate 101 is fixedly connected with an integral telescopic main rod 103, the integral external mechanism 1 provides an installation position for a subsequent mechanism, and has a stabilizing effect in an operation process, and counteracts tremble and vibration generated during operation of the mechanism, so as to ensure normal operation of equipment and avoid jolt and other problems, and further includes:
the bottom detection mechanism 2, bottom detection mechanism 2 still including detecting bottom plate 201, detect bottom plate 201's top outer wall axis department fixedly connected with detects bottom ring 202, detect the top outer wall department sliding connection of bottom ring 202 and have a plurality of to detect mainboard 203, set up the bearing of this bottom detection mechanism 2's aim at fixed required processing and make equipment can process the original paper of equidimension not, avoid leading to appearing with the unmatched condition of measuring machine because of grinding the chip of same equidimension different models.
The top dull polish mechanism 3, top dull polish mechanism 3 is still including dull polish jack-prop 301, the top outer wall department fixedly connected with of dull polish jack-prop 301 of complaining is a plurality of dull polish gear 302, and the bottom outer wall department rotation of dull polish jack-prop 301 is connected with dull polish dismantlement body 303, and this power motor 109 provides moving power for whole mechanism, drives the operation of dull polish main part 311 and dull polish bearing 308 in the top dull polish mechanism 3, realizes getting rid of the effect of shell to the chip dull polish.
The integral external mechanism 1 further comprises an integral middle shaft plate 104 fixed at the outer wall of the integral telescopic main rod 103, a plurality of integral small holes 105 are formed in the outer wall of the top of the integral middle shaft plate 104, an integral telescopic auxiliary column 106 is slidably connected to the outer wall of the top of the integral telescopic main rod 103, and an integral top plate 107 is fixedly connected to the outer wall of the top of the integral telescopic auxiliary column 106.
The integral external mechanism 1 further comprises an integral big hole 108 formed in the outer wall of the top of the integral top plate 107, a power motor 109 is fixedly connected to the middle shaft of the outer wall of the top of the integral top plate 107, the front end side wall of the power motor 109 is rotationally connected with an integral gear 110, the power motor 109 provides grinding power for integral equipment, automation is realized, meanwhile, the error phenomenon of products is reduced, and the yield is improved.
Referring to fig. 4-8, the present invention is a chip delamination plane grinder, based on the first embodiment, the bottom detection mechanism 2 further includes a detection conductor 204 fixed at the bottom of the detection main board 203, a detection fixing body 205 is fixedly connected to a central axis of an outer wall of the detection conductor 204, a plurality of detection spacers 206 are fixedly connected to adjacent left and right side walls of the plurality of detection main boards 203, a detection spring 207 is fixedly connected between two adjacent detection spacers 206, the detection main board 203 and the detection conductor 204 are disposed inside the bottom detection mechanism 2 through the detection spring 207 and the detection conductor 204, and when the top grinding mechanism 3 is pressed downward, the detection top plate 208 is pressed downward to press the detection main board 203 and the detection conductor 204 to form a stacked state.
The bottom detection mechanism 2 further comprises a detection short rod 209 which is slidably connected to the top of the detection bottom plate 201, a first detection variant 210 is fixedly connected to a middle shaft at the outer wall of the top of the detection short rod 209, a detection short spring 211 is fixedly connected to the outer wall of the bottom of the first detection variant 210, a detection long rod 212 is slidably connected to the rear part of the outer wall of the detection bottom plate 201, a second detection variant 214 is fixedly connected to the middle shaft at the outer wall of the top of the detection long rod 212, a detection long spring 215 is fixedly connected to the bottom outer wall of the second detection variant 214, a detection bottom block 213 is fixedly connected to one end of the detection long spring 215 far away from the second detection variant 214, a chip to be ground is sleeved on the outer wall of the bottom detection mechanism 2, so that a stacked state cannot be formed, after extrusion is completed, the bottom detection mechanism 2 completely covers the back of the chip, and therefore the bottom detection mechanism 2 can adapt to all types detection of the same size, on the other large-sized instruments on the other hand, the detection mechanism has no complicated procedures, and the simple equipment and mechanical structure can ensure rapid and convenient maintenance in the later period.
The bottom detection mechanism 2 further comprises a detection main pipe 216 fixed at the middle axis of the outer wall of the detection bottom plate 201, a detection main spring 217 is fixedly connected to the middle axis of the inner wall of the detection main pipe 216, a detection partition 218 is fixedly connected to the middle axis of the outer wall of the top of the detection main spring 217, a detection top column 219 is fixedly connected to the middle axis of the northeast of the detection partition 218, a detection top plate 208 is fixedly connected to the outer wall of the top of the detection top column 219, a plurality of detection top grooves 220 are formed in the outer wall of the top of the detection main plate 203, detection pulleys 221 are rotatably connected to the inner wall of the plurality of detection top grooves 220, and the detection main body 311 is connected with a power supply through an external power motor 109 to drive the grinding main body 311 arranged inside the grinding outer wall 306 to grind the outer surface of a chip.
The top dull polish mechanism 3 is still including fixing the dull polish supporter 304 in dull polish dismantlement body 303 bottom, the bottom outer wall axis department fixedly connected with dull polish bottom plate 305 of dull polish supporter 304, the outer wall department rotation of dull polish bottom plate 305 is connected with dull polish outer wall 306, dull polish inside groove 307 has been seted up to the inner wall department of dull polish outer wall 306, and change current grinding dish into roller formula design makes every point speed all the same on the dull polish main part 311, the homogeneity of grinding can be reached, the homogeneity of removing the layer is reached, then the area of observing can enlarge, also can be better on the efficiency of grinding, need not adjust force and angle always when grinding, improve the efficiency of device grinding and the accuracy of grinding.
The top dull polish mechanism 3 is still including rotating the dull polish bearing 308 of connection in dull polish outer wall 306 bottom, dull polish inner panel 309 is fixedly connected with in dull polish bearing 308's inner wall axis department, a plurality of dull polish aperture 310 has been seted up in dull polish inner panel 309's top outer wall department, a plurality of dull polish aperture 310's inner wall department sliding connection has dull polish main part 311, set up the aim at of this dull polish main part 311, replace the effect of dull polish paper through dull polish main part 311 in the operation process, the problem of need frequently changing the dull polish paper in the reduction dull polish link, reduce the step of workman's operation in the process, improve work efficiency, alleviate because mechanical fatigue who brings when frequently changing.
One specific application of this embodiment is: when the grinding machine is used in an operation, a required grinding original is placed at the position of a detection top plate 208 before the grinding process is carried out, a power supply of a power motor 109 in the whole external mechanism 1 is turned on, a detection main plate 203 and a detection conductor 204 are arranged in the bottom detection mechanism 2, when the top grinding mechanism 3 is pressed downwards, the detection top plate 208 is forced to press the detection main plate 203 and the detection conductor 204 downwards to form a stacked state, and a chip required for grinding is sleeved at the outer wall of the bottom detection mechanism 2, so that the sleeved part cannot form the stacked state, after the pressing is finished, the bottom detection mechanism 2 completely covers the back of the chip, the chip is subjected to the plane grinding machine, the grinding main plate 311 is driven to rotate through the power supply connection of the grinding main plate 311 arranged in the outer wall 306 of the grinding machine, so that the investment of labor cost is reduced, and automatic detection is realized, when the detection process is finished, the bottom detection mechanism 2 is retracted upwards, the detection main spring 217 arranged in the detection mechanism is forced upwards, the detection main plate 208 is driven to reset upwards, the detection main plate 203 and the detection conductor 204 in the stacked state cannot be formed, the whole process is reduced, and the whole process is not required to be interfered by the main spring, and the whole process is finished.
It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art and which are included in the embodiments of the present invention without the inventive step, are intended to be within the scope of the present invention. Structures, devices and methods of operation not specifically described and illustrated herein, unless otherwise indicated and limited, are implemented according to conventional means in the art.
Claims (8)
1. The utility model provides a chip removes layer plane and grinds machine, includes whole external mechanism (1), whole external mechanism (1) still including whole bottom plate (101), the top outer wall axis department fixedly connected with whole principal post (102) of whole bottom plate (101), the top outer wall department fixedly connected with whole flexible mobile jib (103) of whole bottom plate (101), its characterized in that still includes:
the bottom detection mechanism (2), the bottom detection mechanism (2) further comprises a detection bottom plate (201), a detection bottom ring (202) is fixedly connected to the middle shaft of the outer wall of the top of the detection bottom plate (201), and a plurality of detection main boards (203) are slidably connected to the outer wall of the top of the detection bottom ring (202);
the top dull polish mechanism (3), top dull polish mechanism (3) is still including dull polish jack-up post (301), the top outer wall department fixedly connected with a plurality of dull polish gear (302) of dull polish jack-up post (301), the bottom outer wall department rotation of dull polish jack-up post (301) is connected with dull polish dismantlement body (303).
2. A chip delamination plane grinder as defined in claim 1, wherein: the integral external mechanism (1) further comprises an integral middle shaft plate (104) fixed on the outer wall of the integral telescopic main rod (103), a plurality of integral small holes (105) are formed in the outer wall of the top of the integral middle shaft plate (104), an integral telescopic auxiliary column (106) is slidably connected to the outer wall of the top of the integral telescopic main rod (103), and an integral top plate (107) is fixedly connected to the outer wall of the top of the integral telescopic auxiliary column (106).
3. A chip delamination plane grinder as defined in claim 2, wherein: the integral external mechanism (1) further comprises an integral big hole (108) formed in the outer wall of the top of the integral top plate (107), a power motor (109) is fixedly connected to the center shaft of the outer wall of the top of the integral top plate (107), and the front end side wall of the power motor (109) is rotationally connected with an integral gear (110).
4. A die delamination flat grinder according to claim 3, wherein: the bottom detection mechanism (2) further comprises a detection conductor (204) fixed at the bottom of the detection main board (203), a detection fixing body (205) is fixedly connected to the middle shaft of the outer wall of the detection conductor (204), a plurality of detection spacing plates (206) are fixedly connected to the adjacent left and right side walls of the detection main board (203), and a detection spring (207) is fixedly connected between the two adjacent detection spacing plates (206).
5. The die-removing surface grinder according to claim 4, wherein: the bottom detection mechanism (2) further comprises a detection short rod (209) which is slidably connected to the top of the detection bottom plate (201), a first detection variant (210) is fixedly connected to a middle shaft at the outer wall of the top of the detection short rod (209), a short detection spring (211) is fixedly connected to the outer wall of the bottom of the first detection variant (210), a long detection rod (212) is slidably connected to the rear of the outer wall of the detection bottom plate (201), a second detection variant (214) is fixedly connected to the middle shaft at the outer wall of the top of the detection long rod (212), a long detection spring (215) is fixedly connected to the outer wall of the bottom of the second detection variant (214), and a detection bottom block (213) is fixedly connected to one end of the long detection spring (215) far away from the second detection variant (214).
6. A chip delamination plane grinder as defined in claim 5 wherein: the bottom detection mechanism (2) further comprises a detection main pipe (216) fixed at the middle axis of the outer wall of the detection bottom plate (201), a detection main spring (217) is fixedly connected to the middle axis of the inner wall of the detection main pipe (216), a detection partition plate (218) is fixedly connected to the middle axis of the outer wall of the top of the detection main spring (217), a detection top column (219) is fixedly connected to the middle axis of the northeast of the detection partition plate (218), a detection top plate (208) is fixedly connected to the outer wall of the top of the detection top column (219), a plurality of detection top grooves (220) are formed in the outer wall of the top of the detection main plate (203), and detection pulleys (221) are rotatably connected to the inner wall of the detection top grooves (220).
7. The die de-layering planar grinder of claim 6, wherein: the top frosting mechanism (3) further comprises a frosting supporting body (304) fixed at the bottom of the frosting disassembling body (303), a frosting bottom plate (305) is fixedly connected to a center shaft of the outer wall of the bottom of the frosting supporting body (304), a frosting outer wall (306) is rotationally connected to the outer wall of the frosting bottom plate (305), and a frosting inner groove (307) is formed in the inner wall of the frosting outer wall (306).
8. The die de-layering planar finishing machine as set forth in claim 7 wherein: the top frosting mechanism (3) further comprises a frosting bearing (308) which is rotationally connected to the bottom of the frosting outer wall (306), a frosting inner plate (309) is fixedly connected to the middle shaft of the inner wall of the frosting bearing (308), a plurality of frosting small holes (310) are formed in the outer wall of the top of the frosting inner plate (309), and a plurality of frosting small holes (310) are slidably connected with a frosting main body (311) at the inner wall of the frosting small holes (310).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310642847.9A CN116423380A (en) | 2023-06-01 | 2023-06-01 | Chip delamination plane grinds machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310642847.9A CN116423380A (en) | 2023-06-01 | 2023-06-01 | Chip delamination plane grinds machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116423380A true CN116423380A (en) | 2023-07-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310642847.9A Pending CN116423380A (en) | 2023-06-01 | 2023-06-01 | Chip delamination plane grinds machine |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013111384A1 (en) * | 2012-01-23 | 2013-08-01 | 東京オートマック株式会社 | Blade sharpener and grinding machine |
| CN209319540U (en) * | 2018-11-25 | 2019-08-30 | 醴陵市东方电子有限公司 | Twin grinder is used in a kind of processing of power semiconductor device |
| CN114750068A (en) * | 2021-04-01 | 2022-07-15 | 苏州椿桔五金制品有限公司 | Plane grinding machine with quick cooling structure |
| CN217966510U (en) * | 2022-08-25 | 2022-12-06 | 闳康科技(厦门)有限公司 | Chip layer-removing plane grinder |
-
2023
- 2023-06-01 CN CN202310642847.9A patent/CN116423380A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013111384A1 (en) * | 2012-01-23 | 2013-08-01 | 東京オートマック株式会社 | Blade sharpener and grinding machine |
| CN209319540U (en) * | 2018-11-25 | 2019-08-30 | 醴陵市东方电子有限公司 | Twin grinder is used in a kind of processing of power semiconductor device |
| CN114750068A (en) * | 2021-04-01 | 2022-07-15 | 苏州椿桔五金制品有限公司 | Plane grinding machine with quick cooling structure |
| CN217966510U (en) * | 2022-08-25 | 2022-12-06 | 闳康科技(厦门)有限公司 | Chip layer-removing plane grinder |
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Application publication date: 20230714 |