CN116422555A - Control system for improving curing strength of LED lamp lens - Google Patents
Control system for improving curing strength of LED lamp lens Download PDFInfo
- Publication number
- CN116422555A CN116422555A CN202310375180.0A CN202310375180A CN116422555A CN 116422555 A CN116422555 A CN 116422555A CN 202310375180 A CN202310375180 A CN 202310375180A CN 116422555 A CN116422555 A CN 116422555A
- Authority
- CN
- China
- Prior art keywords
- led
- lens
- glue
- led lens
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003292 glue Substances 0.000 claims abstract description 73
- 210000002381 plasma Anatomy 0.000 claims abstract description 35
- 238000004140 cleaning Methods 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 238000001816 cooling Methods 0.000 claims abstract description 12
- 238000005476 soldering Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 230000001737 promoting effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 7
- 230000000630 rising effect Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 239000002390 adhesive tape Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
- B05D3/141—Plasma treatment
- B05D3/142—Pretreatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
- B05D3/0272—After-treatment with ovens
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Led Device Packages (AREA)
Abstract
The application provides a control system for improving the curing strength of an LED lamp lens, which comprises the steps of using a plasma cleaning machine to generate high-energy disordered plasma in a vacuum cavity; bombarding disordered plasmas on the surface of a cleaned product by using a plasma cleaner to clean the surface of the LED substrate; adhering transparent glue to the surface of the LED lens by using a glue dispenser, and placing the LED lens after glue dispensing in a curing area to combine the glue with the LED lens; placing the LED lens in a constant-temperature standing room for standing, so that the transparent glue is further combined with the LED lens; placing the LED lens combined with the transparent glue in a baking oven for baking, and cooling after baking is finished; the technical key points are as follows: the plasma cleaning machine is used for cleaning, and the LED lens is combined with the glue at normal temperature and in a temperature rising state, so that the effect of curing between the LED lens and the glue is more remarkable after moisture and bubbles between the glue and the LED lens are removed.
Description
Technical Field
The invention belongs to the technical field of LED lamp production and processing, and particularly relates to a control system for improving the curing strength of an LED lamp lens.
Background
The LED as a light emitting device emits light by energy released by recombination of electrons and holes has a wide range of applications in modern society, such as lighting, flat panel display, medical devices, and the like. Early LEDs only emit red light at low luminosity, and later, other versions of monochromatic light have evolved, with the emitted light being over visible, infrared, and ultraviolet light, with luminosity also increasing to comparable luminosity. The light emitting diode is composed of a PN junction as a common diode and also has unidirectional conductivity. When a forward voltage is applied to the light emitting diode, holes injected from the P region to the N region and electrons injected from the N region to the P region recombine with the electrons in the N region and the holes in the P region within several micrometers near the PN junction, respectively, generating spontaneous emission fluorescence. The LED lens is closely connected with the LED, so that the use efficiency and the luminous efficiency of light can be improved, and the LED lens can be used according to different effects. The specifications of the LED lens are three types of penetrating type, refracting type and reflecting type. In the production and processing process of the LED lens, the LED lens needs to be cured after being shaped.
The existing production process of the high-power LED lamp cap lens with the publication number of CN101852386B adopts the UV adhesive component added with the magnetized carbon nano tube powder as a lens material, so that the heat dissipation capacity of the lens can be improved, and the brightness of the LED lamp can be improved. And the chip work affected by local overheating caused by the accumulation of the chip heat can be effectively prevented, and the attenuation of the LED chip caused by overheating is reduced, so that the quality and the service life of the LED can be improved. The lens is suitable for producing high-power LEDs and ensuring the quality thereof.
However, in the process of implementing the above technical solution, the following technical problems are found in the above technical solution:
when the UV glue component of the magnetized carbon nanotube powder is added to the existing LED lamp cap lens to serve as a lens material, the existing fixing flow is adopted to carry out lens production, the existing curing flow cannot meet the thrust requirement after lens curing, a large amount of glue points fall off during production, new glue is needed to be selected again to adapt to the lens, and production cost is increased.
Disclosure of Invention
In order to overcome the existing defects, the embodiment of the application provides a control system for improving the curing strength of an LED lamp lens, plasma is generated by using a plasma cleaning machine to bombard an LED substrate before the step of curing the traditional LED lamp lens, comprehensive cleaning is carried out, the LED lens is combined with glue at normal temperature before the step of combining the LED lens with the glue at sixty degrees, the combining effect of the glue and the LED lens is improved, moisture and bubbles between the glue and the LED lens are finally removed in a reflow soldering mode before cooling, the push-pull force value of the LED lens and the glue after curing can be improved, the product qualification rate is improved, the production cost is reduced, the problem that the existing LED lamp cap lens adopts the existing fixing process to carry out the production work of the lens, the thrust requirement of the lens after curing cannot be met, a large amount of glue points fall off is solved, new glue is required to be reselected to adapt to the lens, and the problem of production cost is increased.
The technical scheme adopted by the embodiment of the application for solving the technical problems is as follows:
a control system for improving the curing strength of an LED lamp lens, comprising:
s1, using a plasma cleaning machine to control a radio frequency power supply to generate high-energy disordered plasma in a vacuum cavity under a certain pressure condition;
s2, bombarding disordered plasmas on the surface of a cleaned product by using a plasma cleaner to clean the surface of the LED substrate;
s3, adhering transparent glue to the surface of the LED lens by using a glue dispenser, and placing the LED lens subjected to glue dispensing in a curing area so as to combine the glue with the LED lens;
s4, placing the LED lens in a constant-temperature standing room for standing, and further combining the transparent glue with the LED lens;
s5, placing the LED lens combined with the transparent glue in a baking oven for baking, and cooling after baking is completed.
In one possible implementation, the cleaning frequency of the plasma cleaning machine in S1 is 25-40kHz.
In one possible implementation, the curing area of the LED lens in S3 is a normal temperature environment, and the curing time is one hour.
In one possible implementation, the temperature inside the stationary room used for the LED lens in S4 is sixty degrees celsius, and the curing time is one hour.
In one possible implementation, the baking temperature of the LED lens in S5 is one hundred ninety degrees, and the baking time is ten minutes.
In one possible implementation manner, the cooling temperature of the LED lens in S5 is normal temperature.
In one possible implementation manner, the baking and heating manner of the LED lens in S5 is reflow soldering.
The beneficial effects of this application are:
firstly, in the scheme, plasma is generated by a plasma cleaning machine to bombard the surface of the LED substrate, comprehensive cleaning is carried out, then glue is primarily combined with the LED lens and the LED substrate at normal temperature, and is further combined at sixty degrees in a standing room for transition, so that moisture and bubbles between the glue and the LED lens and the LED substrate can be removed in the process of reflow soldering and drying, and the phenomenon of falling off of glue points can not occur in the subsequent use process;
secondly, in this scheme, through before the transparent glue step of the some of traditional LED lamp lens solidification, utilize plasma cleaning machine to produce plasma bombardment LED base plate, carry out comprehensive cleaning work, and make LED lens and glue combine under normal atmospheric temperature state earlier before sixty degrees temperature make LED lens and glue combine, promote the bonding effect of glue and LED lens, finally utilize the mode of reflow soldering to get rid of moisture and bubble between glue and the LED lens before the cooling, push-pull force numerical value after can promoting LED lens and the glue solidification is favorable to through improving the product percent of pass, reduction in production cost.
Drawings
FIG. 1 is a flowchart showing the improvement of the curing strength of an LED lamp lens according to the present invention;
FIG. 2 is a flow chart of curing a conventional LED lamp lens;
fig. 3 is a flow chart of the invention for improving the curing process of the lens of the conventional LED lamp.
Detailed Description
The technical scheme in the embodiment of the application aims to solve the problems of the background technology, and the overall thought is as follows:
example 1:
the embodiment describes a specific structure of a control system for improving curing strength of an LED lamp lens, specifically referring to fig. 1 and 3, including:
s1, using a plasma cleaning machine to control a radio frequency power supply to generate high-energy disordered plasma in a vacuum cavity under a certain pressure condition;
when the plasma cleaning machine is connected with a radio frequency power supply, the working frequency of the plasma cleaning machine is between 25 kHz and 40kHz, two electrodes are arranged in a sealed container to form an electric field, a vacuum pump is used for realizing a certain vacuum degree, the molecular distance and the free movement distance of molecules or ions are longer and longer along with the gradual rarefaction of gas, and the molecules or ions collide to form plasma under the action of the electric field, so that the LED substrate and an LED lens on the substrate are not damaged when the surface of the LED substrate is cleaned by the generated plasma;
s2, bombarding disordered plasmas on the surface of a cleaned product by using a plasma cleaner to clean the surface of the LED substrate;
s3, adhering transparent glue to the surface of the LED lens by using a glue dispenser, and placing the LED lens subjected to glue dispensing in a curing area so as to combine the glue with the LED lens;
when the transparent glue is primarily bonded with the LED lens, the transparent glue needs to be normally cured at room temperature, the curing time needs to be kept for one hour, and the glue and the LED lens are simply combined;
s4, placing the LED lens in a constant-temperature standing room for standing, and further combining the transparent glue with the LED lens;
after the primary combination of the LED lens and the glue is finished, the LED lens is transferred into a standing room, the temperature is kept at sixty ℃ for a long time, the glue and the LED lens are combined more tightly when the contact surface of the glue and the LED lens is heated, and the process is kept for about one hour;
s5, placing the LED lens combined with the transparent glue in a baking oven for baking, and cooling after baking is finished;
after the LED lens and the glue are further combined in the standing room, the LED lens is transferred into a baking box, the baking temperature is controlled to be one hundred ninety degrees, moisture between the glue and the LED lens is evaporated after the LED lens and the glue are dried for ten minutes, bubbles in the glue are removed, the bonding capability of the LED lens and the glue is improved, and the possibility of separating the glue from the LED lens is reduced;
secondly, in order to prevent the temperature change in the dried glue from being severe, the glue between the LED lens and the LED substrate is deformed, the cooling temperature of the LED lens is controlled to be normal temperature, and the temperature of the contact surface of the LED lens is slowly reduced;
and in order to ensure that the LED lens, the LED substrate and the glue are heated uniformly, the temperature is not too high, the internal circuit of the LED substrate is damaged, the reflow soldering mode is utilized for baking and heating, and in the heating process, nitrogen is heated to a sufficiently high temperature by the heating circuit and then is blown between the LED lens, the LED substrate and the glue, so that the cost is lower.
By adopting the technical scheme:
according to the design, plasma is generated by using the plasma cleaning machine to bombard the surface of the LED substrate, substances left in a conventional cleaning mode and substances easy to clean in a conventional mode can be cleaned, cleaning is comprehensive, glue is firstly combined with the LED lens and the LED substrate at normal temperature before the glue is dried by reflow soldering, transition is further carried out by combining at the temperature of sixty degrees in a standing room, combination is promoted, the glue can be removed, moisture and bubbles between the glue and the LED lens and the LED substrate can be removed in the reflow soldering drying process, and the situation that the LED lens falls off can not occur in the subsequent use process.
Example 2:
based on the embodiment 1, this embodiment describes the difference between the present application and the conventional method for curing the LED lamp lens, where the conventional method includes the steps of dispensing the LED lamp lens, directly standing at sixty degrees for one hour, bonding the LED lens to the LED substrate directly by glue, fixing the LED lens in a normal temperature environment, and cooling the LED substrate;
according to the LED lens cleaning device, before the transparent adhesive tape is dropped, plasma bombardment is generated by using a plasma cleaning machine to clean the LED substrate, the problem that a traditional cleaning mode is incomplete is solved, before the LED lens is combined with the adhesive tape at the temperature of sixty degrees, the LED lens is combined with the adhesive tape at the normal temperature, the combining effect of the adhesive tape and the LED lens is improved, and finally moisture and bubbles between the adhesive tape and the LED lens are removed by using a reflow soldering mode before cooling.
By adopting the technical scheme:
according to the design, before the step of curing the traditional LED lamp lens, plasma is generated by using a plasma cleaning machine to bombard the LED substrate, comprehensive cleaning is carried out, the LED lens is combined with the glue at normal temperature before the LED lens is combined with the glue at the temperature of sixty ℃, the combination effect of the glue and the LED lens is improved, finally, moisture and bubbles between the glue and the LED lens are removed by using a reflow soldering mode before cooling, the push-pull force value of the LED lens and the glue after curing can be improved, the problem that the lens falls off is solved, the product percent of pass is facilitated to be improved, the production cost is reduced, and the curing effect between the LED lens and the glue is better and more remarkable.
Finally, it should be noted that: it is apparent that the above examples are only illustrative of the present invention and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. And obvious variations or modifications thereof are contemplated as falling within the scope of the present invention.
Claims (7)
1. Control system for promoting LED lamp lens solidification intensity, characterized by comprising:
s1, generating high-energy disordered plasma in a vacuum cavity by using a plasma cleaning machine;
s2, bombarding disordered plasmas on the surface of a cleaned product by using a plasma cleaner, and cleaning the surface of the LED substrate;
s3, adhering transparent glue to the surface of the LED lens by using a glue dispenser, and placing the LED lens subjected to glue dispensing in a curing area so as to combine the glue with the LED lens;
s4, placing the LED lens in a constant-temperature standing room for standing, and further combining the transparent glue with the LED lens;
s5, placing the LED lens combined with the transparent glue in a baking oven for baking, and cooling after baking is completed.
2. The control system for improving the curing strength of an LED lamp lens according to claim 1, wherein: the cleaning frequency of the plasma cleaning machine in the step S1 is 25-40kHz.
3. The control system for improving the curing strength of an LED lamp lens according to claim 1, wherein: and (3) the curing area of the LED lens in the step (S3) is a normal-temperature environment, and the curing time is one hour.
4. The control system for improving the curing strength of an LED lamp lens according to claim 1, wherein: and (4) the internal temperature of the standing room used by the LED lens in the step (S4) is sixty degrees centigrade, and the curing time is one hour.
5. The control system for improving the curing strength of an LED lamp lens according to claim 1, wherein: and the baking temperature of the LED lens in the step S5 is one hundred ninety degrees, and the baking time is ten minutes.
6. The control system for improving the curing strength of an LED lamp lens according to claim 1, wherein: and S5, the cooling temperature of the LED lens is normal temperature.
7. The control system for improving the curing strength of an LED lamp lens according to claim 1, wherein: and S5, the baking and heating mode of the LED lens is reflow soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310375180.0A CN116422555A (en) | 2023-04-10 | 2023-04-10 | Control system for improving curing strength of LED lamp lens |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310375180.0A CN116422555A (en) | 2023-04-10 | 2023-04-10 | Control system for improving curing strength of LED lamp lens |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116422555A true CN116422555A (en) | 2023-07-14 |
Family
ID=87079235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310375180.0A Pending CN116422555A (en) | 2023-04-10 | 2023-04-10 | Control system for improving curing strength of LED lamp lens |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116422555A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210156421U (en) * | 2019-06-26 | 2020-03-17 | 惠州市聚飞光电有限公司 | LED packaging body |
| CN112750934A (en) * | 2020-12-30 | 2021-05-04 | 中国科学院半导体研究所 | Ultraviolet LED packaging structure and packaging method thereof |
| CN113036020A (en) * | 2020-10-23 | 2021-06-25 | 中芯先进半导体(深圳)有限公司 | Lens vacuum packaging method |
-
2023
- 2023-04-10 CN CN202310375180.0A patent/CN116422555A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210156421U (en) * | 2019-06-26 | 2020-03-17 | 惠州市聚飞光电有限公司 | LED packaging body |
| CN113036020A (en) * | 2020-10-23 | 2021-06-25 | 中芯先进半导体(深圳)有限公司 | Lens vacuum packaging method |
| CN112750934A (en) * | 2020-12-30 | 2021-05-04 | 中国科学院半导体研究所 | Ultraviolet LED packaging structure and packaging method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 宋露露等: "《LED封装检测与应用》", 华中科技大学出版社, pages: 145 - 148 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2014015632A1 (en) | Frame sealing adhesive curing device and vacuum folding device | |
| US7569984B2 (en) | White-light fluorescent lamp having luminescence layer with silicon quantum dots | |
| JP2008516414A (en) | Luminescent light source, method for manufacturing the same, and light emitting device | |
| CN102185083B (en) | Illuminating light emitting diode (LED) and manufacturing method thereof | |
| CN105098049A (en) | LED (Light Emitting Diode) aluminium substrate having high thermal conductivity and manufacturing process thereof | |
| CN116422555A (en) | Control system for improving curing strength of LED lamp lens | |
| JP6571251B2 (en) | Power control of field emission lighting system | |
| CN203731166U (en) | LED bulb lamp | |
| CN101619814B (en) | Directly embedded high-power LED illumination module | |
| WO2022037138A1 (en) | Light source and production process of light source | |
| CN108450061B (en) | Illumination light source and method for manufacturing the same | |
| CN102005532A (en) | High-efficiency reflective LED package structure and packaging method thereof | |
| TW201432950A (en) | Fluorescent layer forming method for light emitting diode | |
| US20130015758A1 (en) | Reflective anode structure for a field emission lighting arrangement | |
| CN101324325A (en) | LED module unit | |
| CN103388763B (en) | A kind of LED bulb | |
| JP3640598B2 (en) | Light emitting diode and manufacturing method thereof | |
| CN206093593U (en) | Cavity formula does not have base plate pottery lamp | |
| CN206300016U (en) | A kind of semiconductor lighting energy-saving lamp | |
| CN201954329U (en) | LED (light-emitting diode) integrated packaging flat fluorescent light source | |
| CN204042539U (en) | The uniform LED area light source of a kind of light distribution | |
| CN103759147A (en) | Energy saving lamp bulb | |
| CN202749330U (en) | Electrodeless lamp normal state ageing apparatus | |
| CN102606918A (en) | Novel LED (light emitting diode) white light lamp and white light generation method thereof | |
| CN105443997A (en) | LED lamp and production process thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |