CN116419513A - Rack-mounted electronic equipment and cabinet - Google Patents
Rack-mounted electronic equipment and cabinet Download PDFInfo
- Publication number
- CN116419513A CN116419513A CN202111678108.2A CN202111678108A CN116419513A CN 116419513 A CN116419513 A CN 116419513A CN 202111678108 A CN202111678108 A CN 202111678108A CN 116419513 A CN116419513 A CN 116419513A
- Authority
- CN
- China
- Prior art keywords
- rack
- expansion module
- height
- mounted electronic
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims abstract description 47
- 238000001816 cooling Methods 0.000 claims abstract description 43
- 230000017525 heat dissipation Effects 0.000 claims abstract description 40
- 238000004891 communication Methods 0.000 claims description 9
- 230000005514 two-phase flow Effects 0.000 claims description 5
- 238000005192 partition Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 230000006870 function Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
- H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the application provides rack-mounted electronic equipment and rack, relates to the technical field of chassis, and the rack-mounted electronic equipment includes: the equipment comprises an equipment shell, a main board and a liquid cooling heat dissipation assembly, wherein the equipment shell is provided with a first height, the first height is a standard height suitable for rack mounting, the main board is arranged in the equipment shell, the main board is provided with the CPU assembly, the liquid cooling heat dissipation assembly is arranged above the CPU assembly and used for dissipating heat for the CPU assembly, and the sum of the heights of the main board, the CPU assembly and the liquid cooling heat dissipation assembly is a second height; and the expansion module is arranged above the liquid cooling heat dissipation assembly, and the expansion module is provided with a third height, and the sum of the third height and the second height is smaller than or equal to the first height. According to the method and the device, the function module of the rack-mounted electronic equipment can be expanded on the premise that the standard size of the rack-mounted equipment is not changed, so that the performance of the rack-mounted electronic equipment is effectively improved, the application range of the rack-mounted electronic equipment is further expanded, and the product competitiveness is improved.
Description
Technical Field
The embodiment of the application relates to the technical field of racks, in particular to a rack-mounted electronic device and a cabinet.
Background
Rack-mounted electronic devices, such as rack-mounted servers, are a common server architecture with good stability, security, and data processing capabilities. The length, the height and the width of the chassis of the rack-mounted server have unified standards, and functional units such as a main board, a hard disk, an optical floppy drive, a memory, a CPU, a radiator, a control card, a power supply and the like are assembled in the chassis.
As rack-mounted electronic devices have increased performance requirements, functional modules need to be extended to meet the required performance requirements, however, there is currently no space available inside to extend performance due to the limitations of standard dimensions and internal device dimensions of the rack-mounted devices. For example, at present, requirements of rack-mounted electronic devices such as a server or a storage device on storage density or computing capacity are higher and higher, the server needs to continuously increase the storage capacity of a hard disk to meet the storage density requirement, or the computing capacity requirement is improved by utilizing a GPU (graphics processing unit) component, but on the premise of not changing the standard size of the rack-mounted device, the capacity of the hard disk is directly increased, on the one hand, the number of the hard disks is not increased by redundant space in the rack-mounted electronic device, on the other hand, the heat dissipation problem and the instability risk are brought, and on the other hand, the large-capacity hard disk is directly adopted and limited by a process, so that the large-capacity hard disk is difficult to realize.
Disclosure of Invention
The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.
The embodiment of the invention provides a rack-mounted electronic device and a cabinet, which can effectively improve the storage capacity or the computing capacity of a hard disk in the rack-mounted electronic device and expand the application range of the rack-mounted electronic device on the premise of not changing the standard size of the rack-mounted device.
A first aspect of an embodiment of the present application provides a rack-mounted electronic device, including: the equipment comprises an equipment shell, a first support, a second support and a control unit, wherein the equipment shell is provided with a first height which is a standard height suitable for rack mounting; the main board is arranged in the equipment shell, and a CPU assembly is arranged on the main board; the liquid cooling heat dissipation assembly is arranged above the CPU assembly and used for dissipating heat for the CPU assembly, and the sum of the heights of the main board, the CPU assembly and the liquid cooling heat dissipation assembly is a second height; the expansion module is arranged above the liquid cooling radiating component and is provided with a third height, and the sum of the third height and the second height is smaller than or equal to the first height.
A second aspect of an embodiment of the present application provides a cabinet comprising at least one rack-mounted electronic device as described in any of the first aspects.
The embodiment of the application provides a rack-mounted electronic device, compare with the correlation technique, include: the equipment comprises an equipment shell, a main board and a liquid cooling heat dissipation assembly, wherein the equipment shell is provided with a first height, the first height is a standard height suitable for rack mounting, the main board is arranged in the equipment shell, the main board is provided with the CPU assembly, the liquid cooling heat dissipation assembly is arranged above the CPU assembly and used for dissipating heat for the CPU assembly, and the sum of the heights of the main board, the CPU assembly and the liquid cooling heat dissipation assembly is a second height; and the expansion module is arranged above the liquid cooling heat dissipation assembly, and the expansion module is provided with a third height, and the sum of the third height and the second height is smaller than or equal to the first height. According to the embodiment, the function module of the rack-mounted electronic equipment can be expanded on the premise that the standard size of the rack-mounted equipment is not changed, so that the performance of the rack-mounted electronic equipment is effectively improved, the application range of the rack-mounted electronic equipment is further expanded, and the product competitiveness is improved.
It will be appreciated that the advantages of the second aspect compared with the related art are the same as those of the first aspect compared with the related art, and reference may be made to the related description in the first aspect, which is not repeated here.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required for the embodiments or the description of the related art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort to a person having ordinary skill in the art.
FIG. 1 is a schematic diagram of a rack structure of a rack server;
FIG. 2 is an enlarged partial view of the main panel portion of FIG. 1;
FIG. 3 is a schematic diagram of a heat sink and heat dissipation assembly according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a heat dissipating assembly according to an embodiment of the present invention;
FIG. 5 is a schematic view of a rack structure according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of an expansion module according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of an expansion module structure according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of an expansion module structure according to an embodiment of the present invention;
FIG. 9 is a schematic diagram illustrating rotation of an expansion module according to an embodiment of the present invention;
reference numerals: 100-rack structure, 110-rack housing, 120-basic hard disk module, 130-fan module, 140-heat sink, 150-motherboard, 160-rear card, 151-CPU component, 170-heat sink component, 180-expansion module, 181-expansion unit, 182-expansion module housing, 183-spindle, 1831-torque spring, 184-cable, 1821-expansion module housing upper cover, 1822-expansion module housing partition, 1823-expansion module housing bottom plate, 1824-housing back plate, 1825-housing snap-in structure, 1826-snap-in, 1827-stop structure, 1828-expansion module housing side plate, 1832-spring snap-in groove 1833-snap-in groove.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention. The embodiments of the present invention and the features in the embodiments may be arbitrarily combined with each other without collision.
The terms first, second and the like in the description and in the claims and in the above-described figures, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that if an orientation or positional relationship such as upper, lower, front, rear, left, right, etc. is referred to, it is for convenience of description and simplification of the description only, and does not indicate or imply that the apparatus or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention.
It should be noted that the meaning of a plurality is one or more, the meaning of a plurality is two or more, and that greater than, less than, exceeding, etc. is understood to exclude the present number, and that greater than, less than, within, etc. is understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
The following disclosure provides many different embodiments, or examples, for implementing different aspects of the invention.
Rack-mounted electronic devices, such as rack-mounted servers, are a common server architecture with good stability, security, and data processing capabilities. The length, the height and the width of the chassis of the rack-mounted server have unified standards, and functional units such as a main board, a hard disk, an optical floppy drive, a memory, a CPU, a radiator, a control card, a power supply and the like are assembled in the chassis to realize specific functions.
As rack-mounted electronic devices have increased performance requirements, functional modules need to be extended to meet the required performance requirements, however, there is currently no space available inside to extend performance due to the limitations of standard dimensions and internal device dimensions of the rack-mounted devices. For example, currently, rack-mounted electronic devices such as servers or storage devices have increasingly higher requirements for storage density or computing capability, and servers need to continuously increase hard disk storage capacity to meet the storage density requirements, or utilize GPU components to increase the computing capability requirements. For the rack server, if storage capacity expansion is required, on one hand, no redundant space is left in the rack server for hard disk number expansion, and the direct increase of the hard disk number occupies extra space and the size of the rack server needs to be changed, so that the rack server cannot adapt to the integral cabinet machine. On the other hand, because the electronic components in the rack server release larger heat when the rack server works, the service life of the components with large heat productivity such as a power supply, a CPU (Central processing Unit), a display card and the like at the back of the machine box can be reduced in an overheated environment for a long time, so that the number of hard disks is directly increased or the components of the GPU are inserted to bring about heat dissipation and stability risks, the problem of heat dissipation needs to be solved, and if the heat sink is directly added, more effective space in the machine box is occupied. On the other hand, if the size of the hard disk is to be kept unchanged, the direct adoption of the large-capacity hard disk is limited by the technology, and the realization is difficult.
Therefore, compared with the related art, the embodiment of the invention provides a rack-mounted electronic device, which comprises: the equipment comprises an equipment shell, a main board and a liquid cooling heat dissipation assembly, wherein the equipment shell is provided with a first height, the first height is a standard height suitable for rack mounting, the main board is arranged in the equipment shell, the main board is provided with the CPU assembly, the liquid cooling heat dissipation assembly is arranged above the CPU assembly and used for dissipating heat for the CPU assembly, and the sum of the heights of the main board, the CPU assembly and the liquid cooling heat dissipation assembly is a second height; and the expansion module is arranged above the liquid cooling heat dissipation assembly, and the expansion module is provided with a third height, and the sum of the third height and the second height is smaller than or equal to the first height. According to the embodiment, on the premise that the standard size of the rack-mounted equipment is not changed, the storage capacity or the computing capacity of a hard disk in the rack-mounted electronic equipment can be effectively improved, the application range of the rack-mounted electronic equipment is expanded, and the product competitiveness is improved.
Embodiments of the present invention will be further described below with reference to the accompanying drawings.
In this embodiment, the rack-mounted electronic device has different specifications of 2U, 4U, 6U, or 8U, where 1U (1u=1.75 inches=44.45 mm), and a rack-mounted server will be described below as an example.
Rack servers are installed in standard 19 inch cabinets, typically functional servers. Fig. 1 is a schematic diagram of a rack structure of a rack server in the related art.
Referring to fig. 1, a rack server with 2U specifications has a main structure of a rack structure 100, where the rack structure 100 includes an equipment housing 110, and the equipment housing 110 is sequentially arranged in the following manner: a basic hard disk module 120, a fan module 130, a heat sink 140, a motherboard 150, and a rear card 160. The basic hard disk module 120 is composed of a plurality of hard disks, for example, 12 hard disks with a size of 3.5 inches or 25 hard disks with a size of 2.5 inches are commonly used for realizing the storage function of the rack server; the fan module 130 is used for radiating heat; the main board 150 has a size of about 400mm long and 400mm wide, a CPU assembly (not shown) is mounted above the main board 150, a depth space of about 400mm is provided above the main board 150, and the heat sink 140 is located on the main board 150 for dissipating heat from the CPU assembly and other components; the rear plug-in card 160 is an extended functional component, and is used for implementing functional extension on the rack server in a hot plug manner.
Referring to fig. 2, a partial enlarged view of the main board portion in fig. 1 is shown.
As can be seen in fig. 1 and 2, the heat sink 140 is mounted on the main board 150, and the heat sink 140 has a relatively high height, and occupies the entire height space above the main board 150 of the rack structure 100, and the heights of other components (such as the basic hard disk module 120, the fan module 130, the main board 150, and the rear card 160) are located in the space of about 1U in the lower half of the height of the rack structure 100.
As can be seen from the contents of fig. 1 and 2, the height of the radiator in the rack structure of the related art affects the overall height of the rack structure, and the space of the depth 1U above the motherboard is not fully utilized. Therefore, in order to expand the capacity without changing the size of the chassis, the present embodiment optimizes and reforms the rack structure of the rack-mounted electronic device.
In one embodiment, the related art radiator is replaced with a liquid-cooled radiator assembly that is more powerful but smaller in size, so as to make room for expansion from the rack structure. Referring to fig. 3, a schematic diagram of a radiator and a liquid-cooled radiator module in this embodiment is shown. As can be seen from fig. 3, in the related art, the 2U rack-mounted server uses an air-cooled radiator, which has a large volume, a large number of heat pipes and a large height, so that the space occupies a large part of the depth space above the motherboard, while in this embodiment, the air-cooled radiator is replaced by a liquid-cooled radiator assembly with a smaller height for heat dissipation, and as can be seen in fig. 3, the liquid-cooled radiator assembly adopted in this embodiment is lower than the height of the radiator in the related art, so that a space with a certain depth can be reserved in the space above the motherboard for expansion.
Referring to fig. 4, an installation schematic diagram of a liquid cooling heat dissipation assembly according to an embodiment of the present application is shown.
In fig. 4, the main board 150 includes: the CPU module, the liquid cooling heat dissipation module 170 is installed on the CPU module, and dissipates heat for the CPU module.
In an embodiment, the sum of the heights of the motherboard 150, the CPU component and the liquid cooling heat dissipation component 170 is within a predetermined height range, for example, the predetermined height range is [ 1U-predetermined distance, 1u+predetermined distance ], the predetermined distance may be 3mm to 10mm, that is, the height of the liquid cooling heat dissipation component 170 may be similar to the heights of other components on the motherboard, so that a space with a depth of about 1U can be increased above the motherboard 150 for expansion.
In one embodiment, the liquid-cooled heat sink assembly 170 may be a liquid-cooled cold plate heat sink or a two-phase flow heat sink, wherein the liquid-cooled heat sink comprises: an open-loop radiator and a closed-loop radiator, the two-phase flow radiator comprising: loop heat pipe heat sinks and loop gravity assisted heat pipe (Loop Thermosiphon, LTS) heat sinks.
For the liquid cooling radiator in this embodiment, since the heat dissipation speed of the liquid is far greater than that of air, the heat dissipation effect of the liquid cooling radiator is better than that of the air cooling radiator, and the liquid cooling radiator generally comprises: water cooling block, circulating liquid, water pump, pipeline and water tank or heat exchanger. The water cooling block is a metal block with a water channel inside, is made of copper or aluminum, is contacted with the CPU and absorbs the heat of the CPU; the circulating liquid flows in the circulating pipeline under the action of the water pump, the liquid absorbing the heat of the CPU flows away from the water cooling block on the CPU, and the new low-temperature circulating liquid continuously absorbs the heat of the CPU; the water pipe is connected with the water pump, the water cooling block and the water tank, and the circulating liquid can circularly flow in a closed channel without leakage, so that the liquid cooling heat dissipation system can work normally; the water tank is used for storing circulating liquid, the heat exchanger is a device similar to a radiating fin, the circulating liquid transfers heat to the radiating fin with large surface area, and a fan on the radiating fin takes away heat flowing into air.
For the two-phase flow radiator in this embodiment, at least one phase in a flow system is fluid, the two-phase flow radiator is driven by power such as a pump or a compressor to provide power, bubbles in the liquid are continuously generated, separated and broken on the heat exchange wall surface, and the power such as the pump and the compressor drives the cooling working medium to flow on the heat exchange surface, so that heat dissipation is realized.
According to the embodiment, the liquid cooling radiating component is used for replacing the radiator, the height is reduced, and the depth space is reserved above the main board for capacity expansion. Referring to fig. 5, a schematic diagram of a rack structure according to an embodiment of the invention is shown.
Fig. 5 is optimized on the basis of fig. 1, the rack structure 100 comprising an equipment housing 110, the equipment housing 110 being of a frame structure, the equipment housing 110 having a first height h 1 First height h 1 To accommodate standard heights for rack-mounted installations, such as 2U, 4U, 6U, or 8U.
The internal layout of the device housing 110 is: a basic hard disk module 120, a fan module 130, a liquid-cooled heat sink assembly 170, an expansion module 180, a motherboard 150, and a rear card 160. The expansion module 180 is disposed in a depth space reserved above the motherboard 150, and the motherboard 150 and the liquid cooling heat dissipation assembly 170 are below the expansion module 180, where the motherboard 150 and the liquid cooling heat dissipation assembly 170 are not shown in the figure, and specific structural relationships are as follows:
the main board 150 is mounted thereon: the CPU assembly, motherboard 150 is mounted within device housing 110. Referring to fig. 2, the motherboard 150 further has low-height components, which are disposed adjacent to the CPU assembly, and the expansion module 180 covers the heat dissipation assembly 170 and the upper side of the low-height components, wherein the low-height components include a memory bank assembly and other necessary components for implementing the motherboard function.
The liquid cooling heat dissipation assembly 170 is mounted on the CPU assembly to dissipate heat for the CPU assembly and the memory bank assembly, wherein the sum of the heights of the motherboard 150, the CPU assembly 152 and the liquid cooling heat dissipation assembly 170 is a second height h 2 。
The expansion module 180 is located above the motherboard 150, specifically: above the liquid cooling heat dissipation assembly 170, the expansion module 180 has a third height h 3 In one embodiment, a third height h 3 And a second height h 2 The sum is smaller than or equal to the first height h 1 That is, after the liquid cooling heat dissipation assembly 170 and the expansion module 180 are installed inside the equipment housing 110, the height of the equipment housing 110 still meets the standard size of the rack-mounted equipment, for example, the expansion module housing 182 is clamped in the equipment housing 110, and when the expansion module housing 182 is placed flat, the upper surface of the expansion module housing 182 is flush with the upper surface of the equipment housing 110 or slightly lower than the upper surface of the equipment housing 110, that is, the expansion module 180 can be placed inside the equipment housing 110.
In one embodiment, when the first height h 1 At a second height h of 2U 2 May be about 1U, i.e. the second height h 2 A height less than or equal to 1U, or a height greater than a preset error value of 1U, is expressed as: 1U-sigma is less than or equal to h 2 And less than or equal to 1 U+sigma, wherein sigma represents a preset error value, and can be any value from 1mm to 17mm, and the specific limitation is not included herein.
Referring to fig. 6, a schematic diagram of an expansion module structure in this embodiment is shown.
As can be seen in fig. 6, the expansion module 180 includes: at least one expansion unit 181, expansion module casing 182 and cable 184, wherein at least one expansion unit 181 is pegged graft in expansion module casing 182, expansion module casing 182 installs in equipment housing 110, expansion module casing 182 passes through cable 184 and mainboard 150 communication connection.
The refinement of this example is as follows:
the expansion module housing 182 is a frame structure, and specifically includes: an expansion module housing top cover 1821, an expansion module housing spacer 1822, an expansion module housing bottom plate 1823, a housing back plate 1824, and two expansion module housing side plates 1828.
Wherein the expansion module housing upper cover 1821, the expansion module housing bottom plate 1823, the two expansion module housing side plates 1828 and the housing back plate 1824 constitute a frame structure, and the expansion module housing partition plate 1822 divides the frame structure into receiving areas, i.e. mounting grooves, of the at least two expansion units 181, the at least two mounting grooves corresponding to the at least two expansion units.
The extension unit 181 is inserted in the corresponding mounting groove and is in communication connection with the housing backboard 1824, the housing backboard 1824 is in communication connection with the motherboard 150 through the cable 184, that is, one end of the extension unit 181 is in contact with the housing backboard 1824, and then is in communication connection with the motherboard 150 through the cable 184, so that the storage capacity or the computing capacity of the hard disk can be increased.
In an embodiment, the expansion unit 181 may be a hard disk assembly or a GPU assembly, which is selected according to actual performance requirements. For example, when storage performance expansion is required, the expansion unit 181 is a hard disk assembly, and when operation capability expansion is required, the expansion unit 181 is a GPU assembly.
In an embodiment, if the expansion unit 181 is a GPU component, the length of the GPU component is not greater than 312mm, that is, the GPU belongs to a GPU with a full-length size, and in the related art, the GPU with the size is not easy to be placed into the rack server.
In an embodiment, if the expansion unit 181 is a CPU component, the power of the CPU component is 250W or more, for example 350W or 400W. Because the higher the power of the CPU is, the more the heat is generated, if the air-cooled radiator is adopted, the size of the air-cooled radiator is larger, so the high-performance small-size liquid-cooled radiating component adopted in the embodiment can adapt to the high-power CPU component, and the operation performance of the rack server can be improved.
In an embodiment, when the expansion unit 181 is a hard disk assembly, the height range of the expansion module 180 is: 22mm to 32mmThird height h 3 The height range of (2) is: 22mm to 32mm, for example 27mm may be used. In this embodiment, 4 receiving areas are shown in fig. 6, into which 4 expansion units 181 can be plugged. If the expansion unit 181 is a hard disk assembly, the hard disk assembly is a 3.5 inch hard disk, or a 2.5 inch hard disk, for example, 4 3.5 inch hard disks may be inserted into the installation slot of the expansion module 180 to increase the storage capacity by about 33%, or 10 2.5 inch hard disks may be inserted to increase the storage capacity by about 40%, which is not particularly limited herein.
In an embodiment, the cable 184 is a Slimline cable, where the Slimline cable is connected through a Slimline interface, the Slimline interface is a high-density and small-size connection interface, and a signal type transmitted by the Slimline interface is a SATA signal, so that communication interconnection between a CPU component and the expansion unit 181 in the motherboard 150 can be realized, rapid, reliable and seamless data transmission is realized, and safe circulation of data is ensured.
In addition, in one embodiment, referring to fig. 7, another schematic diagram of the expansion module is shown.
The device housing 110 further includes: two equipment housing side plates, the expansion module housing 182 further includes: one end of the expansion module housing 182 is connected to one of the equipment housing side plates of the equipment housing 110 through the rotation shaft 183, so that an opening end of the expansion module housing 182 (i.e., an end for plugging the expansion unit 181) rotates along the rotation shaft 183 at a preset angle, where the preset angle refers to a rotation angle for limiting the expansion module, and other components in the equipment housing are prevented from being affected.
In one embodiment, the shaft 183 is mounted on at least one expansion module housing side plate 1828, e.g., two sets of shafts 183 are symmetrically disposed on each side of the expansion module housing 182.
In an embodiment, referring to fig. 8, as a further schematic diagram of the expansion module, it can be seen that at least one end of the rotating shaft 183 is further sleeved with a torque spring 1831, and one side plate of the device housing 110 includes a spring clamping groove 1832 for clamping the torque spring 1831, that is, the rotating shaft 183 is clamped in the spring clamping groove 1832 by the torque spring 1831, one side is connected with the rotating shaft 183, and the other side is sleeved with the expansion module housing 182. When the expansion module housing 182 is engaged with the device housing 110, the torque spring 1831 stores a force, and when the expansion module housing 182 is disengaged from the device housing 110, the torque spring 1831 drives the expansion module housing 182 to rotate upward along the rotation shaft 183 by a previous stored force.
Because the extension module housing 182 is mounted above the motherboard 150, it may be placed or fastened. Referring to fig. 7, in this embodiment, the expansion module housing 182 is snapped into the device housing 110, and the expansion module housing 182 further includes: the housing fastening structure 1825 disposed at one end of the expansion module housing side plate 1828, where the housing fastening structure 1825 and the rotating shaft 183 are located on the same side, and one side plate of the device housing 110 includes a fastening slot 1833, and the expansion module housing 182 is fastened to the inner side of the device housing 110 through the housing fastening structure 1825, specifically: the open end of the expansion module housing 182 is engaged with the side plate of the device housing 110 through the housing engagement structure 1825 and the engagement groove 1833. In this embodiment, the housing engagement structure 1825 and the corresponding rotation shaft 183 may also be symmetrically disposed on both side plates of the device housing 110.
In one embodiment, the housing engagement structure 1825 includes: the latch 1826 and the stop structure 1827, referring to fig. 8, the open end of the expansion module housing 182 is clamped with the side plate of the device housing 110 through the clamp slot 1833, when the latch 1826 is separated from the side plate of the device housing, that is, the latch 1826 is separated from the clamp slot 1833, the torque spring 1831 makes the open end of the expansion module housing 182 rotate around the rotation shaft 183 to the stop structure 1827, and the stop structure 1827 is clamped on the side plate of the device housing 110, so as to ensure that the rotation of the expansion module housing 182 does not exceed the preset angle.
In this embodiment, when the expansion module 180 is installed, the catch 1826 is disengaged from the engaging groove 1833 of the side plate of the device housing 110, and the expansion module 180 is rotated around the rotation shaft 183 until the front end (the opening end of the expansion module housing 182) of the stop structure 1827 is attached to the device housing 110, and at this time, the catch 1826 is engaged with the inner side of the device housing 110, thereby completing the installation process.
When the expansion unit in the expansion module needs to be maintained, the expansion module is rotated to display the expansion unit, referring to fig. 9, for the rotation schematic diagram of the expansion module in the embodiment, the buckles on two sides are pushed to the inner direction of the equipment shell, at the moment, the buckles are separated from the constraint of the equipment shell, the buckles are opened, the expansion module is unscrewed under the action of the torque spring and rotates around the rotating shaft, the expansion module can be opened after reaching a certain angle and touching the stop structure, namely, the rotation is automatically stopped, the accommodation area of the expansion unit is operated, and the operations of replacing, hot plug maintenance and the like of the expansion units such as the hard disk assembly or the GPU assembly are realized.
The embodiment of the invention provides a rack structure, which comprises: the equipment comprises an equipment shell, a main board and a liquid cooling heat dissipation assembly, wherein the equipment shell is provided with a first height, the first height is a standard height suitable for rack mounting, the main board is arranged in the equipment shell, the main board is provided with the CPU assembly, the liquid cooling heat dissipation assembly is arranged above the CPU assembly and used for dissipating heat for the CPU assembly, and the sum of the heights of the main board, the CPU assembly and the liquid cooling heat dissipation assembly is a second height; and the expansion module is arranged above the liquid cooling heat dissipation assembly, and the expansion module is provided with a third height, and the sum of the third height and the second height is smaller than or equal to the first height. According to the embodiment, on the premise that the standard size of the rack-mounted equipment is not changed, the storage capacity or the computing capacity of a hard disk in the rack-mounted electronic equipment can be effectively improved, the application range of the rack-mounted electronic equipment is expanded, and the product competitiveness is improved.
In addition, in an embodiment of the present invention, the rack-mounted electronic device is a server or a storage device, which is not limited herein.
In addition, in an embodiment of the present invention, a cabinet is provided, including at least one rack-mounted electronic device as described in any one of the above.
While the preferred embodiment of the present invention has been described in detail, the embodiment of the present invention is not limited to the above-described embodiment, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the embodiment of the present invention, and these equivalent modifications or substitutions are included in the scope of the embodiment of the present invention as defined in the appended claims.
Claims (19)
1. A rack-mounted electronic device, comprising:
the equipment comprises an equipment shell, a first support, a second support and a control unit, wherein the equipment shell is provided with a first height which is a standard height suitable for rack mounting;
the main board is arranged in the equipment shell, and a CPU assembly is arranged on the main board;
the liquid cooling heat dissipation assembly is arranged above the CPU assembly and used for dissipating heat for the CPU assembly, and the sum of the heights of the main board, the CPU assembly and the liquid cooling heat dissipation assembly is a second height;
the expansion module is arranged above the liquid cooling radiating component and is provided with a third height, and the sum of the third height and the second height is smaller than or equal to the first height.
2. The rack-mounted electronic device of claim 1, wherein the first height is 2U, 4U, 6U, or 8U.
3. The rack-mounted electronic device of claim 2, wherein the first height is 2U, the second height is less than or equal to 1U, or the second height is greater than a height of 1U preset error value.
4. The rack-mounted electronic device of claim 1, wherein the expansion module comprises: at least one expansion unit, an expansion module housing and a cable; at least one expansion unit is inserted into the expansion module shell, and the expansion unit is in communication connection with the main board through the cable.
5. The rack-mounted electronic device of claim 4, wherein the expansion unit comprises a hard disk assembly or a GPU assembly.
6. The rack-mounted electronic device of claim 5, wherein the expansion unit is a hard disk assembly, and the third height has a height range of: 22mm to 32mm.
7. The rack electronic device of claim 6, wherein the hard disk assembly is a 3.5 inch hard disk, or a 2.5 inch hard disk.
8. The rack-mounted electronic device of claim 4, wherein the expansion module housing further comprises: an expansion module housing upper cover, two expansion module housing side plates, an expansion module housing partition plate, an expansion module housing bottom plate and a housing back plate;
the expansion module shell upper cover, the expansion module shell bottom plate, the two expansion module shell side plates and the shell back plate form a frame structure, the frame structure is divided into at least two mounting grooves by the expansion module shell partition plate, and the at least two mounting grooves correspond to the at least two expansion units;
the extension units are inserted in the corresponding mounting grooves and are in communication connection with the shell backboard, and the shell backboard is in communication connection with the main board through the cable.
9. The rack-mounted electronic device of claim 4, wherein the device housing includes two device housing side plates disposed opposite each other, the expansion module further comprising: a rotating shaft;
one end of the expansion module shell is connected with one side plate of the equipment shell through the rotating shaft, so that one end of the opening of the expansion module shell can rotate along the rotating shaft at a preset angle.
10. The rack-mounted electronic device of claim 9, wherein the shaft is mounted on at least one side plate of the expansion module housing, at least one end of the shaft is further sleeved with a torque spring, one side plate of the device housing comprises a spring clamping groove for clamping the torque spring, and the torque spring is clamped in the spring clamping groove;
the expansion module housing further includes: the shell clamping structure is arranged at one end of the side plate of the expansion module shell, the shell clamping structure and the rotating shaft are positioned at the same side, and one side plate of the equipment shell comprises a clamping groove;
when the expansion module shell is clamped with the equipment shell, the torque spring stores the force;
when the expansion module shell is separated from the equipment shell, the torque spring drives the expansion module shell to rotate upwards along the rotating shaft.
11. The rack-mounted electronic device of claim 10, wherein the housing-engaging structure comprises: the device comprises a buckle and a stop structure, wherein one end of an opening of the expansion module shell is clamped with a side plate of the device shell through the clamping groove, and when the buckle is separated from the side plate of the device shell, the torque spring enables the one end of the opening of the expansion module shell to rotate around the rotating shaft to the stop structure.
12. The rack-mounted electronic device of claim 5, wherein the expansion unit is a GPU assembly, the length of the GPU assembly being no greater than 312mm.
13. The rack-mounted electronic device of any one of claims 1 to 12, wherein a low-height component is further mounted on the motherboard, the low-height component being disposed adjacent to the CPU assembly, the expansion module being disposed over the heat sink assembly and the low-height component.
14. The rack-mounted electronic device of any one of claims 1-12, wherein the liquid-cooled heat sink assembly comprises: liquid cooled cold plate heat sinks or two phase flow heat sinks.
15. The rack-mounted electronic device of any one of claims 4 to 12, wherein the cable of the expansion module is a Slimline cable.
16. The rack-mounted electronic device of any one of claims 1-12, wherein the rack-mounted electronic device further comprises: and the basic hard disk module is in communication connection with the main board and is positioned in the equipment shell.
17. The rack-mounted electronic device of any one of claims 1-12, wherein the CPU assembly has a power of 250W or more.
18. The rack-mounted electronic device of any one of claims 1-12, wherein the rack-mounted electronic device is a server or a storage device.
19. A cabinet comprising at least one rack-mounted electronic device as claimed in any one of claims 1 to 18.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111678108.2A CN116419513A (en) | 2021-12-31 | 2021-12-31 | Rack-mounted electronic equipment and cabinet |
| PCT/CN2022/142858 WO2023125670A1 (en) | 2021-12-31 | 2022-12-28 | Rack-mounted electronic apparatus and cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111678108.2A CN116419513A (en) | 2021-12-31 | 2021-12-31 | Rack-mounted electronic equipment and cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116419513A true CN116419513A (en) | 2023-07-11 |
Family
ID=86998035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111678108.2A Pending CN116419513A (en) | 2021-12-31 | 2021-12-31 | Rack-mounted electronic equipment and cabinet |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN116419513A (en) |
| WO (1) | WO2023125670A1 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000047753A (en) * | 1998-07-27 | 2000-02-18 | Toshiba Corp | Electronic equipment |
| JP3959495B2 (en) * | 1999-08-31 | 2007-08-15 | 富士通株式会社 | Information processing device |
| CN201159867Y (en) * | 2007-12-21 | 2008-12-03 | 亚冠国际有限公司 | Extension type internal memory guard sheet |
| CN207992899U (en) * | 2018-03-15 | 2018-10-19 | 研祥智能科技股份有限公司 | Industrial personal computer |
| CN208904008U (en) * | 2018-10-30 | 2019-05-24 | 中国航天空气动力技术研究院 | A kind of parallel heat radiation device for loop heat pipe for server chips heat dissipation |
| CN209947829U (en) * | 2019-08-10 | 2020-01-14 | 山东超越数控电子股份有限公司 | LRM module heat dissipation cold plate based on XMC expansion card |
| CN113655869A (en) * | 2021-07-22 | 2021-11-16 | 浪潮商用机器有限公司 | Modular radiator and server |
-
2021
- 2021-12-31 CN CN202111678108.2A patent/CN116419513A/en active Pending
-
2022
- 2022-12-28 WO PCT/CN2022/142858 patent/WO2023125670A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023125670A1 (en) | 2023-07-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10070560B2 (en) | Drawer-level immersion-cooling with hinged, liquid-cooled heat sink | |
| US8164901B2 (en) | High efficiency heat removal system for rack mounted computer equipment | |
| JP4903295B2 (en) | Case and rack system for liquid immersion cooling of arrayed electronic devices | |
| US7002799B2 (en) | External liquid loop heat exchanger for an electronic system | |
| US6421240B1 (en) | Cooling arrangement for high performance electronic components | |
| TW540289B (en) | Electronic apparatus | |
| US7012807B2 (en) | Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack | |
| US8437129B2 (en) | Server cabinet | |
| US10375863B2 (en) | Liquid cooled chassis | |
| US20020159233A1 (en) | Cooling plate arrangement for electronic components | |
| US20080092387A1 (en) | Method of assembling a cooling system for a multi-component electronics system | |
| US20120026668A1 (en) | Mass storage retention, insertion, and removal in a conduction cooled system and stacking hard drive backplane | |
| EP1763978A1 (en) | Liquid cooling system including hot-swappable components | |
| JP2005182776A (en) | One or more heat exchange components operated by disposing major part outside computer chassis | |
| US11497145B2 (en) | Server rack and data center including a hybrid-cooled server | |
| JP2004319628A (en) | System module | |
| US9036351B2 (en) | Passive cooling system and method for electronics devices | |
| CN114258233A (en) | Hybrid oil immersion server and associated computer rack | |
| CN116419513A (en) | Rack-mounted electronic equipment and cabinet | |
| CN216387952U (en) | 2U cold drawing formula liquid cooling server | |
| CN115568153A (en) | Server | |
| US10897837B1 (en) | Cooling arrangement for a server mountable in a server rack | |
| CN114126377A (en) | Liquid cooling machine box | |
| US20240215198A1 (en) | Liquid Based Cooling Systems And Methods For Server Racks In Data Centers | |
| CN216982358U (en) | Liquid cooling machine box |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication |