CN116419476A - Composite metal foil - Google Patents
Composite metal foil Download PDFInfo
- Publication number
- CN116419476A CN116419476A CN202111644009.2A CN202111644009A CN116419476A CN 116419476 A CN116419476 A CN 116419476A CN 202111644009 A CN202111644009 A CN 202111644009A CN 116419476 A CN116419476 A CN 116419476A
- Authority
- CN
- China
- Prior art keywords
- layer
- stripping
- thin copper
- chromium
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 51
- 239000002184 metal Substances 0.000 title claims abstract description 51
- 239000011888 foil Substances 0.000 title claims abstract description 38
- 239000002131 composite material Substances 0.000 title claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 104
- 229910052802 copper Inorganic materials 0.000 claims abstract description 83
- 239000010949 copper Substances 0.000 claims abstract description 83
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 28
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 24
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical group [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 claims abstract description 12
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 11
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000010937 tungsten Substances 0.000 claims abstract description 10
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 10
- 229910000599 Cr alloy Inorganic materials 0.000 claims abstract description 9
- 239000000788 chromium alloy Substances 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims description 317
- 239000011241 protective layer Substances 0.000 claims description 28
- 239000011889 copper foil Substances 0.000 claims description 21
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 16
- 229910021389 graphene Inorganic materials 0.000 claims description 16
- 239000011651 chromium Substances 0.000 claims description 13
- 239000000956 alloy Substances 0.000 claims description 12
- 229910052804 chromium Inorganic materials 0.000 claims description 12
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 229910002064 alloy oxide Inorganic materials 0.000 claims description 7
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910052750 molybdenum Inorganic materials 0.000 claims description 6
- 239000011733 molybdenum Substances 0.000 claims description 6
- 238000004544 sputter deposition Methods 0.000 claims description 5
- 229910001182 Mo alloy Inorganic materials 0.000 claims description 4
- DDTIGTPWGISMKL-UHFFFAOYSA-N molybdenum nickel Chemical compound [Ni].[Mo] DDTIGTPWGISMKL-UHFFFAOYSA-N 0.000 claims description 4
- 229910002065 alloy metal Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000012260 resinous material Substances 0.000 claims 1
- 230000007547 defect Effects 0.000 abstract description 8
- OYSYRRRAJPTBHI-UHFFFAOYSA-N chromium molybdenum tungsten Chemical compound [Cr][W][Mo] OYSYRRRAJPTBHI-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011347 resin Substances 0.000 description 26
- 229920005989 resin Polymers 0.000 description 26
- 239000000758 substrate Substances 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000012876 carrier material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000007731 hot pressing Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 229910000990 Ni alloy Inorganic materials 0.000 description 3
- 239000012776 electronic material Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a composite metal foil, which comprises a carrier layer, a stripping layer and a thin copper layer which are sequentially laminated, wherein the stripping layer comprises a first stripping layer and a second stripping layer, the first stripping layer is positioned at one side close to the carrier layer, the first stripping layer is a nickel metal layer, a chromium metal layer or a nickel-chromium alloy layer, the thickness of the first stripping layer is 0.005-0.05 micrometers, the second stripping layer is positioned at one side close to the thin copper layer, and the second stripping layer is a molybdenum metal layer, a tungsten metal layer, a chromium metal layer or a molybdenum-tungsten-chromium alloy layer. The first stripping layer enables the thin copper layer and the carrier layer to be always separated, and further enables the thin copper layer to be stripped smoothly. The existence of the second stripping layer ensures that the thin copper layer is protected before and after stripping, and the surface of the thin copper layer can not be directly acted by external force during stripping, thereby avoiding the defects of pinholes and the like of the thin copper layer.
Description
Technical Field
The invention relates to the technical field of printed circuit board materials, in particular to a composite metal foil.
Background
Today, electronic technology is vigorously developed, and along with the continuous pursuit and search of miniaturization of electronic devices in the market, especially, the important component of the electronic devices, namely, a circuit board, the miniaturization and the light weight are continuously developed. Currently, copper foil is mainly used as an important electronic material of a printed circuit board, the copper foil is an extremely thin copper sheet, and in practical application, copper foil with a thickness of less than 5 micrometers is used as an electronic material of the printed circuit board. The main body of the printed circuit board includes a resin substrate and a copper foil attached to the resin substrate, and a complex circuit structure is formed using the copper foil. The thickness of the copper foil is extremely thin, and the copper foil is not easy to operate in the production process, so that the copper foil in the production process mainly appears in a form of a composite metal foil, namely, the extremely thin copper foil is attached to a carrier material, and the carrier material is used as a supporting structure of the whole composite metal foil, so that the copper foil is convenient to use. In forming a printed circuit board, a resin substrate and a copper foil are pressed together by means of hot pressing, and then a carrier material is peeled from the copper foil, finally obtaining a main body material for manufacturing the printed circuit board. In the prior art, in order to enable good separation between the copper foil and the carrier material, a release layer is provided between the copper foil and the carrier material, the release layer being formed of an organic material, such as benzotriazole. The release layer has poor heat resistance, and organic materials are easily decomposed due to high temperature of hot pressing in the lamination process, so that the copper foil is contacted with the carrier material due to the lack of the release layer, and the copper foil and the carrier material are difficult to peel and separate.
Therefore, it is desirable to provide a new composite metal foil that ensures that the copper foil is successfully peeled from the carrier material.
Disclosure of Invention
The aim of the embodiment of the invention is that: a composite metal foil is provided which ensures a good peeling effect by providing a first peeling layer and a second peeling layer between a thin copper layer and a carrier layer and controlling the thickness of the peeling layers.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the utility model provides a composite metal foil, including carrier layer, peel ply and the thin copper layer that stacks gradually and set up, the peel ply includes first peel ply and second peel ply, first peel ply is located be close to one side of carrier layer, first peel ply is nickel metal layer, chromium metal layer or nickel-chromium alloy layer, the thickness of first peel ply is 0.005-0.05 micron, the second peel ply is located be close to one side of thin copper layer, the second peel ply is molybdenum metal layer, tungsten metal layer, chromium metal layer or contains molybdenum, tungsten, chromium alloy layer.
Further, the thickness of the second release layer is 0.001-0.1 micrometers, and the thickness of the second release layer is smaller than the thickness of the first release layer.
Further, the first and second release layers are amorphous layers.
Further, a protective layer is arranged on one side surface of the thin copper layer, which is away from the stripping layer, and the thermal expansion coefficient of the protective layer is lower than that of the thin copper layer.
Further, the protective layer is a nickel metal layer, a molybdenum metal layer or a nickel-molybdenum alloy layer.
Further, a graphene layer is sandwiched between the thin copper layer and the protective layer.
Further, the first stripping layer is a nickel-chromium alloy layer, the proportion of nickel and chromium alloy of one side surface of the first stripping layer, which is close to the carrier layer, is higher than that of alloy oxide, and the proportion of nickel and chromium alloy of one side surface of the first stripping layer, which is close to the second stripping layer, is lower than that of alloy oxide.
Further, the peeling layer and the thin copper layer are both formed by sputtering.
Further, the carrier layer is made of copper foil, chromium foil, zinc foil or alloy metal foil containing at least one of copper, chromium and zinc.
Further, the carrier layer is made of a resin-based material.
The beneficial effects of the invention are as follows: by providing a first release layer and a second release layer between the carrier layer and the thin copper layer, and controlling the thickness of the first release layer to be between 0.005 and 0.05 microns, both the first release layer and the second release layer are metal layers. The first stripping layer is arranged so that the thin copper layer and the carrier layer can be always separated from each other, adhesion cannot occur due to the absence of the first stripping layer, and the thin copper layer can be stripped smoothly. The existence of the second stripping layer ensures that the thin copper layer is protected before and after stripping, and the surface of the thin copper layer can not be directly acted by external force during stripping, so that the damage of the concave-convex structure on the attached surface is avoided, and further, the defects of pinholes and the like of the thin copper layer are avoided. Therefore, the composite metal foil has the characteristics of being convenient to peel and avoiding pinhole defects.
Drawings
The invention is described in further detail below with reference to the drawings and examples.
Fig. 1 is a cross-sectional view of a composite metal foil according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view of a composite metal foil according to another embodiment of the invention.
Fig. 3 is a cross-sectional view of a composite metal foil according to yet another embodiment of the invention.
In the figure:
1. a carrier layer; 2. a peeling layer; 21. a first release layer; 22. a second peeling layer; 3. a thin copper layer; 4. a protective layer; 5. and a graphene layer.
Detailed Description
In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved more clear, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
Example 1
As shown in fig. 1, the composite metal foil provided by the invention comprises a carrier layer 1, a stripping layer 2 and a thin copper layer 3 which are sequentially stacked, wherein the stripping layer 2 comprises a first stripping layer 21 and a second stripping layer 22, the first stripping layer 21 is positioned on one side close to the carrier layer 1, the first stripping layer 21 is a nickel metal layer, a chromium metal layer or a nickel-chromium alloy layer, and the thickness of the first stripping layer 21 is 0.005-0.05 micrometer. The second release layer 22 is located on the side close to the thin copper layer 3, the second release layer 22 is a molybdenum metal layer, a tungsten metal layer, a chromium metal layer or a molybdenum-tungsten-chromium alloy layer, and the thickness of the second release layer 22 is 0.001-0.1 μm. It will be appreciated that the composite metal foil is an electronic material used in the process of manufacturing a printed circuit board, and when manufacturing a printed circuit board, the thin copper layer 3 is fixed on the resin substrate by means of hot pressing, and the thin copper layer 3 is formed into an intricate circuit. The carrier layer 1 serves as an integral support for the composite metal foil for ease of use in the manufacturing process. The thickness of the thin copper layer 3 is extremely thin and is mainly below 10 micrometers, the thickness of the thin copper layer 3 is determined by the process design requirements of the printed circuit board, and the thin copper layer 3 can be formed by adopting electroplating and sputtering modes. The purpose of the release layer 2 is to achieve a release separation between the thin copper layer 3 and the carrier layer 1. The release layer 2 is composed of a first release layer 21 and a second release layer 22, and one side of the first release layer 21 is connected to the carrier layer 1, i.e., the first release layer 21 is attached to the carrier layer 1. One side of the second release layer 22 is connected to the thin copper layer 3, i.e. the second release layer 22 is attached to the thin copper layer 3. The first release layer 21 and the second release layer 22 are both metal layers, and the first release layer 21 is made of metallic nickel or chromium, and includes an alloy material made of nickel and/or chromium. The metallic nickel, metallic chromium and nickel-chromium alloy have good heat resistance. The copper foil is not decomposed in the hot pressing process, so that the diffusion of the thin copper layer 3 towards the carrier layer 1 in the hot pressing process is avoided, and the smooth stripping is ensured. Since the first release layer 21 is required to have good heat resistance, when the first release layer 21 is a nickel-chromium alloy, the nickel alloy content or the chromium alloy content in the first release layer 21 should be 100 μg/dm2 or more. The thickness of the first peeling layer 21 is between 0.005 and 0.05 μm, and the first peeling layer 21 is not damaged during hot pressing and peeling by controlling the thickness of the first peeling layer 21, so as to solve the problem that the thin copper layer 3 is difficult to peel in contact with the carrier layer 1. The second release layer 22 is made of metallic molybdenum, tungsten or chromium and includes an alloy material made of molybdenum and/or tungsten and/or chromium. So that the second release layer 22 adheres well to the thin copper layer 3. When peeled, the first peeling layer 21 and the second peeling layer 22 are torn, and at least part of the second peeling layer 22 remains attached to the thin copper layer 3. After the stripping is completed, the second stripping layer 22 on the thin copper layer 3 is removed by etching.
The nickel-chromium alloy layer in this embodiment is a metal layer made of an alloy material, and the alloy contains one or two of nickel element and chromium element. The alloy layer containing molybdenum, tungsten and chromium in the embodiment is a metal layer made of an alloy material, and the alloy contains one or more of molybdenum element, tungsten element and chromium element.
In this embodiment, by providing the first peeling layer 21 and the second peeling layer 22 so that the first peeling layer 21 and the second peeling layer 22 are separated from each other at the time of peeling, the first peeling layer 21 is required to be finally left on the carrier layer 1, and the second peeling layer 22 is required to be left on the thin copper layer 3. To achieve this technical effect, an optimal selection range of the thickness of the release layer 2 was obtained through experiments. Table one shows the test results of the first release layer 21, in which five first release layers 21 having different thicknesses were selected, namely, no. one, no. two, no. three, no. four, and No. five, and the thicknesses of the five first release layers 21 were 0.001 micrometers, 0.005 micrometers, 0.01 micrometers, 0.02 micrometers, and 0.04 micrometers, respectively. The coverage of the first release layer 21 on the carrier layer 1 after peeling was examined to determine whether the first release layer 21 was damaged after peeling, i.e., the first release layer 21 was adhered to the second release layer 22. It is found from experiments that when the thickness of the first release layer 21 is greater than 0.005 μm, the coverage on the carrier layer 1 after release is 95% or more. Of course, an increase in the thickness of the first release layer 21 also causes an increase in manufacturing cost and time, and therefore, 0.005 to 0.05 μm is selected as the thickness range of the first release layer 21 in this embodiment. Similarly, table two shows the results of the test of the second release layer 22, in which five second release layers 22 of different thicknesses were selected, no. one, no. two, no. three, no. four, and No. five, and the thicknesses of the five second release layers 22 were 0.0005 microns, 0.001 microns, 0.01 microns, 0.05 microns, and 0.08 microns, respectively. The coverage of the second peeling layer 22 on the thin copper layer 3 after peeling was examined to determine whether the second peeling layer 22 was damaged after peeling, i.e., the second peeling layer 22 was adhered to the first peeling layer 21. It is found from experiments that when the thickness of the second peeling layer 22 is greater than 0.001 μm, the coverage on the thin copper layer 3 after peeling becomes 80% or more. Of course, the increase in thickness of the second peeling layer 22 also causes an increase in manufacturing cost and time, and increases the time for subsequent etching removal, and therefore, the present embodiment selects 0.001-0.1 μm as the thickness range of the second peeling layer 22.
List one
| First release layer | First number | No. two | No. three | Fourth size | No. five |
| Thickness of (L) | 0.001 micron | 0.005 micron | 0.01 micron | 0.02 micron | 0.04 micrometers |
| Coverage rate | 80％ | 95％ | 97％ | 100％ | 100％ |
Watch II
| A second peeling layer | First number | No. two | No. three | Fourth size | No. five |
| Thickness of (L) | 0.0005 micrometers | 0.001 micron | 0.01 micron | 0.05 micron | 0.08 micrometer |
| Coverage rate | 50％ | 80％ | 90％ | 100％ | 100％ |
Specifically, the thickness of the second peeling layer 22 is smaller than the thickness of the first peeling layer 21. It will be appreciated that the first and second release layers 21, 22 are extremely thin metal film layers, the thickness of which is capable of affecting the strength of adhesion between each and the carrier layer 1 or the thin copper layer 3. The thickness of the first peeling layer 21 is made larger than that of the second peeling layer 22, so that a large amount of peeling layer 2 is prevented from being left on the thin copper layer 3 after peeling, and the removal amount of the peeling layer 2 at the time of the post etching treatment is reduced.
Specifically, the first peeling layer 21 and the second peeling layer 22 are both amorphous layers. Amorphous is defined as the case where a broad diffraction peak occurs when measured by glancing into an X-ray diffraction or where a halo pattern occurs at the peak when measuring electron beam diffraction by a transmission electron microscope. In this embodiment, the first peeling layer 21 and the second peeling layer 22 are amorphous alloys. Amorphous alloys, also known as amorphous alloys, have an irregular atomic structure. The surface of the stripping layer 2 is smooth, and pinhole defects of the stripping layer 2 on the thin copper layer 3 are avoided.
Specifically, the first release layer 21 is a nickel-chromium alloy layer, the proportion of nickel-chromium alloy on the side of the first release layer 21 near the carrier layer 1 is higher than that of alloy oxide, and the proportion of nickel-chromium alloy on the side of the first release layer 21 near the second release layer 22 is lower than that of alloy oxide. The purpose of this structure is to enable a side of the first release layer 21 close to the carrier layer 1 to be more tightly adhered to the carrier layer 1, while the adhesive strength between the first release layer 21 and the second release layer 22 is significantly lower than the adhesive strength between the first release layer 21 and the carrier layer 1. At the peeling operation, so that the incidental part of the thin copper layer 3 is separated from the first peeling layer 21 by the second peeling layer 22. The alloy oxide is an oxide formed by combining a metal atom in an alloy with an oxygen atom, for example, an oxide formed by combining chromium metal with oxygen.
Specifically, the peeling layer 2 and the thin copper layer 3 are both formed by sputtering. Since the peeling layer 2 and the thin copper layer 3 are each of a film-like structure having a very small thickness, each metal layer is formed in sequence on the carrier layer 1 by sputtering. Of course, an electroplating process, an evaporation process, or the like may be employed.
Specifically, the carrier layer 1 is made of a metal material, and the carrier layer 1 may be a copper foil, a chromium foil, a zinc foil, or an alloy metal foil containing at least one of copper, chromium, and zinc. The carrier layer 1 has the function of supporting the entire composite metal foil, so that the carrier layer 1 needs to have high mechanical strength and toughness to avoid being damaged by the outside during production and use.
In addition, the carrier layer 1 may be made of a non-metal material, and the carrier layer 1 is made of a resin material. For example, the material of the carrier layer 1 may be polyimide-based resin, maleimide-based resin, polybutadiene-based resin, triazine-based resin, polyphenylene ether-based resin, or epoxy-based resin. Or one or more of polyimide resin, maleimide resin, polybutadiene resin, triazine resin, polyphenylene oxide resin and epoxy resin.
Example two
As shown in fig. 2, the composite metal foil includes a carrier layer 1, a first release layer 21, a second release layer 22, a thin copper layer 3, and a protective layer 4, which are laminated in this order. The protective layer 4 is attached to the side of the thin copper layer 3 facing away from the release layer 2. The protective layer 4 has a lower coefficient of thermal expansion and the coefficient of thermal expansion of the protective layer 4 is lower than that of the thin copper layer 3. I.e. the protective layer 4 does not undergo significant expansion extension when subjected to the high temperatures of hot pressing. The protective layer 4 is a metal layer made of nickel, molybdenum or nickel-molybdenum alloy. Preferably, the protective layer 4 in this embodiment is a nickel-molybdenum alloy layer. The protective layer 4 mainly plays a role in the lamination operation of the thin copper layer 3 and the resin substrate, and when lamination is performed, the protective layer 4 is combined with the resin substrate, that is, the thin copper layer 3 is combined with the resin substrate through the protective layer 4 to fix the thin copper layer 3 and the resin substrate. Since the protective layer 4 having a low expansion coefficient is in contact with the resin substrate at the time of lamination, deformation of the protective layer 4 is extremely small, and therefore, the problem of curling of the resin substrate due to thermal deformation of the protective layer 4 can be avoided. Meanwhile, the protective layer 4 is clamped between the thin copper layer 3 and the resin substrate, and even if impurities or concave-convex structures exist on the resin substrate, the impurities or the concave-convex structures cannot contact with the thin copper layer 3, so that pinhole defects of the thin copper layer 3 are avoided. The thickness of the protective layer 4 is 1-5 micrometers, and the thickness of the protective layer 4 is slightly larger than the thickness of the thin copper layer 3. Therefore, the strength of the protection layer 4 is higher than that of the thin copper layer 3, and the protection layer 4 plays a supporting role on the thin copper layer 3, so that the protection effect on the thin copper layer 3 is realized.
Example III
As shown in fig. 3, the composite metal foil includes a carrier layer 1, a first peeling layer 21, a second peeling layer 22, a thin copper layer 3, a graphene layer 5, and a protective layer 4, which are laminated in this order. The graphene layer 5 is sandwiched between the thin copper layer 3 and the protective layer 4. It is understood that graphene has extremely high thermal conductivity and thermal emissivity, and the thermal conductivity of single-layer graphene can reach 5300W/mK. Meanwhile, the graphene layer 5 with the thickness of micron order or below can be obtained by mechanical stripping, vapor deposition and other methods. Therefore, the graphene layer 5 is provided between the thin copper layer 3 and the protective layer 4, and the excellent thermal conductivity of the graphene layer 5 is used to dissipate heat. When the composite metal foil and the resin substrate are hot-pressed together, the graphene layer 5 can conduct heat from the middle part of the thin copper layer 3 to the periphery, so that the whole thin copper layer 3 and the protective layer 4 are heated uniformly, bending deformation caused by uneven heating is avoided, and further the resin substrate is curled. In this embodiment, the graphene layer 5 is preferably formed by chemical vapor deposition, and the thin copper layer 3 is used as a substrate, and the graphene layer 5 is deposited on the surface of the thin copper layer 3. The thickness of the graphene layer 5 is not limited in this embodiment, and it is preferable that the thickness of the graphene layer 5 is smaller than the thickness of the thin copper layer 3, so as to avoid the influence of the graphene layer 5 on the mechanical strength of the thin copper layer 3.
The composite metal foil has the beneficial effects that: by providing the first peeling layer 21 and the second peeling layer 22 between the carrier layer 1 and the thin copper layer 3, and controlling the thickness of the first peeling layer 21 to be between 0.005 and 0.05 μm, both the first peeling layer 21 and the second peeling layer 22 are metal layers. The first stripping layer 21 is arranged so that the thin copper layer 3 and the carrier layer 1 can be always separated, and adhesion cannot occur due to the defect of the first stripping layer 21, so that the thin copper layer 3 can be stripped smoothly. The second stripping layer 22 protects the thin copper layer 3 before and after stripping, and the surface of the thin copper layer 3 is not directly acted by external force during stripping, so that the damage of the concave-convex structure of the attached surface is avoided, and further the defects such as pinholes and the like of the thin copper layer 3 are avoided. Therefore, the composite metal foil has the characteristics of being convenient to peel and avoiding pinhole defects.
The foregoing is merely exemplary of the present invention, and those skilled in the art should not be considered as limiting the invention, since modifications may be made in the specific embodiments and application scope of the invention in light of the teachings of the present invention.
Claims (10)
1. The composite metal foil is characterized by comprising a carrier layer, a stripping layer and a thin copper layer which are sequentially stacked, wherein the stripping layer comprises a first stripping layer and a second stripping layer, the first stripping layer is positioned at one side close to the carrier layer, the first stripping layer is a nickel metal layer, a chromium metal layer or a nickel-chromium alloy layer, the thickness of the first stripping layer is 0.005-0.05 microns, the second stripping layer is positioned at one side close to the thin copper layer, and the second stripping layer is a molybdenum metal layer, a tungsten metal layer, a chromium metal layer or an alloy layer containing molybdenum, tungsten and chromium.
2. The composite metal foil of claim 1, wherein the second release layer has a thickness of 0.001-0.1 microns and the second release layer has a thickness that is less than the thickness of the first release layer.
3. The composite metal foil of claim 1, wherein the first and second release layers are both amorphous layers.
4. The composite metal foil of claim 1, wherein a side of the thin copper layer facing away from the release layer is provided with a protective layer having a lower coefficient of thermal expansion than the thin copper layer.
5. The composite metal foil of claim 4, wherein the protective layer is a nickel metal layer, a molybdenum metal layer, or a nickel-molybdenum alloy layer.
6. The composite metal foil of claim 4, wherein a graphene layer is sandwiched between the thin copper layer and the protective layer.
7. The composite metal foil of claim 1, wherein the first peel ply is a nickel-chromium alloy layer, wherein a ratio of nickel to chromium alloy of a side of the first peel ply adjacent to the carrier layer is higher than a ratio of alloy oxide, and wherein a ratio of nickel to chromium alloy of a side of the first peel ply adjacent to the second peel ply is lower than a ratio of alloy oxide.
8. The composite metal foil of claim 1, wherein the peel layer and the thin copper layer are both formed by sputtering.
9. The composite metal foil of claim 1, wherein the carrier layer is made of copper foil, chromium foil, zinc foil or an alloy metal foil containing at least one of copper, chromium, zinc.
10. The composite metal foil of claim 1, wherein the carrier layer is made of a resinous material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111644009.2A CN116419476A (en) | 2021-12-29 | 2021-12-29 | Composite metal foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111644009.2A CN116419476A (en) | 2021-12-29 | 2021-12-29 | Composite metal foil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116419476A true CN116419476A (en) | 2023-07-11 |
Family
ID=87049751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111644009.2A Pending CN116419476A (en) | 2021-12-29 | 2021-12-29 | Composite metal foil |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116419476A (en) |
-
2021
- 2021-12-29 CN CN202111644009.2A patent/CN116419476A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4455181A (en) | Method of transfer lamination of copper thin sheets and films | |
| WO2012137923A1 (en) | Transfer sheet provided with transparent conductive film mainly composed of graphene, method for manufacturing same, and transparent conductor | |
| JP2016168687A (en) | Composite metal foil and production method of the same, as well as printed wiring board | |
| JP6069749B2 (en) | Copper foil with release film | |
| CN115038237B (en) | Metal foil, copper-clad laminated plate and printed circuit board | |
| JP6300206B2 (en) | Method for producing copper foil with release film | |
| CN116419476A (en) | Composite metal foil | |
| WO2009099235A1 (en) | Process for producing structure with metal film, mother die for use in the process, and structure produced by the process | |
| US20040075528A1 (en) | Printed circuit heaters with ultrathin low resistivity materials | |
| US20080283278A1 (en) | Flexible Circuit Substrate | |
| JPWO2018186156A1 (en) | Graphite composite film and method for producing the same | |
| TW202027979A (en) | Multilayer body | |
| JP5565764B2 (en) | Electromagnetic wave interference prevention transfer film | |
| CN113068313A (en) | Manufacturing method of circuit board, circuit board manufactured by manufacturing method and electronic equipment | |
| Noh et al. | Effects of different kinds of seed layers and heat treatment on adhesion characteristics of Cu/(Cr or Ni–Cr)/PI interfaces in flexible printed circuits | |
| JP2009241597A (en) | Substrate material and substrate | |
| JP2022141112A (en) | Metal-clad laminate and circuit board, and method for producing them | |
| CN113185929A (en) | Conductive composite adhesive tape | |
| JP6705094B2 (en) | Copper foil with release film and method for producing copper foil with release film | |
| JPWO2018142876A1 (en) | Graphite composite film and method for producing the same | |
| JPH1192917A (en) | Metal polyimide film laminated body | |
| KR20200001348A (en) | Reinforcing film for ground and composite printed circuit board for shielding electromagenetic wave comprising the same | |
| JP5756834B2 (en) | Transfer film, method for producing the same, and method for producing transparent conductive laminate | |
| CN111669957B (en) | FPC hot-pressing shielding film and production method thereof | |
| CN216626415U (en) | FPC electromagnetic wave shielding heat dissipation film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |