CN116417399A - Design method of wafer carrier - Google Patents

Design method of wafer carrier Download PDF

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Publication number
CN116417399A
CN116417399A CN202310236236.4A CN202310236236A CN116417399A CN 116417399 A CN116417399 A CN 116417399A CN 202310236236 A CN202310236236 A CN 202310236236A CN 116417399 A CN116417399 A CN 116417399A
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CN
China
Prior art keywords
base
screw
wafer
wafer carrier
axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310236236.4A
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Chinese (zh)
Inventor
程盼盼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Hiwafer Technology Co Ltd
Original Assignee
Chengdu Hiwafer Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chengdu Hiwafer Technology Co Ltd filed Critical Chengdu Hiwafer Technology Co Ltd
Priority to CN202310236236.4A priority Critical patent/CN116417399A/en
Publication of CN116417399A publication Critical patent/CN116417399A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a design method of a wafer carrier, which is characterized in that a wafer bearing structure is arranged on a base in a ring manner, wherein the wafer bearing structure surrounds a round supporting structure by taking the axle center of the base as the circle center; and a driving component is provided at the axis of the base and drives the wafer bearing structure to move radially by taking the axis of the base as an axis. The method can enable the rotary processing equipment to carry wafers with different sizes, can improve the utilization rate of the equipment, reduces the utilization rate of the equipment due to the loss of the wafer carrier, and can reduce the production and manufacturing cost. Meanwhile, the position of the wafer bearing structure is automatically adjusted to adapt to wafers with any size, so that the flexibility, reliability and stability of the device are improved.

Description

Design method of wafer carrier
Technical Field
The present invention relates to the field of semiconductor devices, and in particular, to a method for designing a wafer carrier.
Background
Integrated circuits (Integrated Circuit, ICs) have wide application in the fields of electronic information, daily life, aerospace, military, and the like. The integrated circuit industry is the foundation of modern information society development, including cloud computing, the Internet of things, big data, the industrial Internet, new generation communication network equipment (5G) and the like, and has important strategic significance for current economic and social development, national defense safety, international competition and social and civil life. In the manufacture of integrated circuits, rotary processing equipment is used in some of the processes, and wafers to be produced are transferred by the equipment arm and placed on the wafer carrier to complete the corresponding process. In the current integrated circuit manufacturing industry, the main stream wafer size is generally 4 inches, 6 inches, 8 inches and 12 inches, in the manufacturing process of 4 inches gallium arsenide and gallium nitride integrated circuits, because the industry is upgraded and the wafers with the sizes of 6 inches, 8 inches, 12 inches or other sizes are required to be manufactured, corresponding production lines are required to be established, and if equipment capable of respectively containing the wafers with the sizes of 6 inches, 8 inches, 12 inches or other sizes is purchased, the production and manufacturing cost and the use of manpower resources are greatly increased; if the wafer carriers of 6 inches, 8 inches, 12 inches or other sizes are purchased respectively, the carriers are replaced frequently in the equipment process cavity, so that the hardware of the equipment is greatly worn, the service life of the equipment is reduced, the cleanliness of the process cavity is affected, the labor cost is increased, and the utilization rate of the equipment is reduced.
Therefore, if a carrier which can be compatible with wafers of different sizes is designed, the production and manufacturing cost is greatly reduced, the abrasion to equipment caused by long-term replacement of the wafer carrier is reduced, the labor cost is reduced, and the equipment utilization rate can be effectively improved.
Disclosure of Invention
The invention aims to overcome the defects of a wafer carrier in the prior art and provides a design method of the wafer carrier.
The aim of the invention is realized by the following technical scheme:
mainly provides a design method of a wafer carrier, which is used for carrying wafers with any size, and the method comprises the following steps:
the wafer bearing structure is arranged on a base in a ring mode, wherein the wafer bearing structure surrounds a round supporting structure by taking the axis of the base as the center of a circle;
and a driving component is provided at the axis of the base and drives the wafer bearing structure to move radially by taking the axis of the base as an axis.
As a preferred option, a design method of a wafer carrier, the wafer carrying structure comprises a plurality of ring-shaped wafer carrying mechanisms distributed, each wafer carrying mechanism is arranged on a sliding component, and the driving component is connected with the sliding component.
As a preferred aspect, the design method of the wafer carrier, the sliding assembly includes a slider and a sliding rail, and the slider is mounted on the sliding rail.
As a preferred option, the wafer carrying mechanism comprises a first screw and a second screw, wherein the first screw and the second screw are both arranged on the sliding block, the first screw is arranged on the outer side of the second screw, and the height of the first screw is larger than that of the second screw.
As a preferred option, the design method of the wafer carrier is characterized in that the driving assembly comprises a driving device, a screw rod, a nut, a connecting rod, a positioning bearing, a hinge and a fixing bolt, wherein the driving device is connected with one end of the screw rod through the fixing bolt, the other end of the screw rod is fixed on the base through the positioning bearing, and the nut is connected with the sliding block through the hinge and the connecting rod.
As a preferred option, a design method of the wafer carrier is to uniformly distribute the sliding components on the base by taking the axle center of the base as the center of a circle.
As a preferred option, a method of designing a wafer carrier includes distributing two adjacent slide assemblies at 60 ° intervals.
As a preferred option, a design method of the wafer carrier is characterized in that a scale is arranged beside the sliding rail, a pointer is arranged on the sliding block, and the pointer is opposite to the scale.
As a preferred option, a wafer carrier design method is provided in which the center of the base is hollowed out.
As a preferred option, a design method of the wafer carrier is to arrange a base below the base and to connect the base with the base in a threaded manner.
It should be further noted that the technical features corresponding to the above options may be combined with each other or replaced to form a new technical scheme without collision.
Compared with the prior art, the invention has the beneficial effects that:
(1) According to the invention, the driving assembly drives the wafer bearing structure to slide radially by taking the axis of the base as the axis, and the position of the wafer bearing structure is flexibly adjusted to adapt to wafers with any size including main flow of 4 inches, 6 inches, 8 inches and 12 inches, so that the rotary processing equipment can carry wafers with various different sizes, the utilization rate of the equipment can be improved, new equipment purchased due to industrial upgrading is reduced, the utilization rate of the equipment lost due to replacement of the wafer carrier is reduced, and the production and manufacturing cost can be reduced.
(2) In one example, the wafer carrier may be scaled up or down according to a specific wafer size to accommodate different sized wafers, or may be selected from different materials according to different processes.
(3) In one example, the wafer bearing mechanism comprises a first screw and a second screw, the first screw is installed on the outer side of the second screw, the height of the first screw is larger than that of the second screw, a round structure formed by encircling the first screw is used as a fixing structure of the edge of the wafer, and a round structure formed by encircling the second screw is used as a supporting structure of the bottom of the wafer, so that the effect of stably supporting the wafer is achieved.
(4) In one example, the wafer bearing mechanism is automatically and finely adjusted through the driving assembly, the nut in the driving assembly can move up and down when the screw rod rotates positively and negatively to drive the sliding block to slide in the sliding rail, the nut can move up and down after the fixing bolt is disassembled, and the size of the round structure formed by the wafer bearing mechanism can be calibrated.
(5) In one example, a scale is arranged beside the sliding rail, a pointer is arranged on the sliding block and is opposite to the scale, so that the size of a round structure formed by wafer bearing is measured, data is visualized, and fine adjustment and control of a wafer bearing mechanism are facilitated.
(6) In one example, the center of the susceptor is designed as a hollowed-out frame structure that can ensure that the process chamber effectively sprays, etches, cleans or dries the front and back sides of the wafer.
Drawings
FIG. 1 is a schematic top view of a wafer carrier compatible with wafers of different sizes according to the design method of the present invention;
FIG. 2 is a schematic diagram of a partial cross-sectional structure of a wafer carrier and a pedestal according to an embodiment of the present invention;
FIG. 3 is a block diagram of a control system for a wafer carrier according to an embodiment of the present invention;
fig. 4 is a schematic top view of a base according to an embodiment of the present invention.
Reference numerals in the drawings: the device comprises a base, a wafer bearing mechanism, a first screw, a second screw, a driving component, a screw rod, a nut, a connecting rod, a positioning bearing, a hinge, a fixed bolt, a driving device, a sliding component, a sliding block, a pointer, a scale, a first screw hole, a second screw hole, a base, a hollowed hole, a third screw hole, a controller and an operating terminal.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully understood from the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that directions or positional relationships indicated as being "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are directions or positional relationships described based on the drawings are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements to be referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In addition, the technical features of the different embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
In an exemplary embodiment, a method for designing a wafer carrier to carry a wafer of any size is provided, the method comprising:
the wafer bearing structure is arranged on a base 10 in a ring mode, wherein the wafer bearing structure surrounds a round supporting structure by taking the axis of the base 10 as the center of a circle;
a driving assembly 30 is provided at the axis of the susceptor 10, and the driving assembly 30 drives the wafer carrying structure to move radially about the axis of the susceptor 10.
Specifically, the wafer carrier drives the wafer carrying structure to slide radially by taking the axis of the base 10 as the axis through the driving component 30, so as to drive the wafer carrying structure to move radially, and flexibly adjust the position of the wafer carrying structure to adapt to wafers with any size including main flow of 4 inches, 6 inches, 8 inches and 12 inches, so that the rotary processing equipment carries wafers with various sizes, the utilization rate of the equipment can be improved, new equipment purchased due to industrial upgrading is reduced, the utilization rate of the equipment lost due to replacement of the wafer carrier is reduced, and the production and manufacturing cost can be reduced.
In another exemplary embodiment, according to the design method, a wafer carrier compatible with wafers of different sizes is provided, as shown in fig. 1, the wafer carrier structure includes a plurality of ring-shaped wafer carriers 20 distributed, each wafer carrier 20 is disposed on a sliding component 40, and the driving component 30 is connected to the sliding component 40. The wafer carrier drives the sliding assembly 40 to slide radially with the axis of the base 10 as the axis through the driving assembly 30, thereby driving the wafer carrying mechanism 20 to move radially, and finally realizing the overall radial movement of the wafer carrying structure.
In one example, the slide assembly 40 includes a slider 41 and a slide rail 42, the slider 41 being mounted on the slide rail 42. The wafer carrying mechanism 20 comprises a first screw 21 and a second screw 22, wherein the first screw 21 and the second screw 22 are both installed on the sliding block 41, the first screw 21 is installed on the outer side of the second screw 22, and the height of the first screw 21 is larger than that of the second screw 22. Specifically, the plurality of first screws 21 enclose a circular structure with a diameter larger than the diameter of the wafer as a fixing structure of the wafer edge, and the plurality of second screws 22 enclose a circular structure with a diameter smaller than the diameter of the wafer as a supporting structure of the wafer bottom, so as to play a role in stably supporting the wafer.
In one example, referring to fig. 2, the drive assembly 30 basically includes a drive device 37, a screw 31, a nut 32, a link 33, a positioning bearing 34, a hinge 35, a fixing bolt 36. The driving device 37 can be a servo motor, one end of the screw 31 is connected with the screw 31 through the fixing bolt 36, the other end of the screw 31 is fixed on the base 10 through the positioning bearing 34, so that stability of the screw 31 is improved, the screw 31 can rotate along with the driving device 37, the nut 32 is connected with the sliding block 41 through the hinge 35, the nut 32 can move up and down when the screw 31 rotates positively and negatively to drive the sliding block 41 to slide in the sliding rail 42, the nut 32 can move up and down after the fixing bolt 36 is disassembled, and the size of a circular structure formed by the wafer bearing mechanism 20 can be calibrated. Wherein the driving means 37 comprise a servo motor. The automatic and fine adjustment of the wafer carrying mechanism 20 is realized through the driving assembly 30, the defect that the existing carrying mechanism can only carry wafers with fixed sizes is overcome, and meanwhile finer control than manual adjustment is realized. It should be noted that the driving assembly 30 is not to be understood herein as being limited to a motor driving manner, and those skilled in the art may substitute other feasible driving manners according to practical situations.
Further, as shown in fig. 3, the controller 100 can control the driving device 37 to rotate in a forward and reverse direction, so as to adjust the circular structure of the wafer carrying mechanism 20 to adapt to the wafer size.
Further, the operation terminal 110 can communicate with the controller 100 and exchange information, the size of the circular structure formed by the wafer carrying mechanism 20 can be set, the wafer size can be automatically called according to the product menu, the instruction can be transmitted to the driving component 30, and the driving component 30 feeds back information to the controller 100 and the operation terminal 110.
In one example, the plurality of sliding assemblies 40 are uniformly distributed on the base 10 around the axis of the base 10, and the first screws 21 and the second screws 22 are also uniformly distributed around the axis of the base 10. Specifically, referring to fig. 1, adjacent two slide assemblies are distributed at 60 ° intervals. The positions of the first screws 21 and the second screws 22 on the disc of the base 10 are symmetrically distributed, the angular positions of 6 first screws 21 are respectively 0 °, 60 °, 120 °, 180 °, 240 °, 300 °, and the angular positions of 6 second screws 22 are respectively 0 °, 60 °, 120 °, 180 °, 240 °, 300 °, and the positions of the two screws can be respectively distributed at intervals of 60 °, and particularly the number of the screws is uniformly distributed within 360 °, which is only an example and is not interpreted as limiting the distribution of the positions of the screws, and a person skilled in the art can select different screw distributions according to practical situations.
Further, the wafer carrier may be scaled up or down according to the size of a specific wafer to accommodate a variety of different sized wafers. The first screw 21 and the second screw 22 can be made of PTFE materials, the PTFE materials are smooth and not high in hardness, and the edge of the wafer can be effectively protected from being damaged; and the PTFE material has the advantages of excellent chemical stability, corrosion resistance, high temperature resistance, low temperature resistance, good ageing resistance, high lubricating viscosity, strong plasticity, no toxicity and good electrical insulation. PTFE materials can be used at-190 to 250 ℃, allow quenching and quenching, or alternate cold and hot operation, are extremely stable and are not prone to generating dirty particles.
In one example, a scale 52 is disposed beside the sliding rail 42 on the base 10, a pointer 51 is disposed on the sliding block 41, and the pointer 51 is opposite to the scale 52, so as to measure the size of the circular structure formed by the carrying mechanism 20, visualize data, and facilitate fine adjustment and control of the position of the wafer carrying mechanism 20.
In one example, referring to fig. 1 and 4, the center of the susceptor 10 is designed as a hollowed-out frame structure, which can ensure that the process chamber effectively sprays, etches, cleans or dries the front and back sides of the wafer.
Further, the wafer carrier further includes a base 70, the base 70 is disposed below the base 10, and the base 10 is in threaded connection with the base 70. Specifically, a plurality of first screw holes 61 are further formed in the base 10, the first screw holes 61 are formed in the periphery of the hollowed-out position of the base 10, the first screw holes 61 are matched with second screw holes 62 in the base 70, third screws are mounted on the first screw holes 61, and the plurality of third screws are connected with the fixed base 10 and the base 70, so that the wafer carrier is integrally assembled.
Further, the base 70 is similar to a bowl-shaped structure, and the side wall is designed with the hollow hole 80, so that the weight can be reduced, the spraying flow of liquid and gas can be prevented from being affected, and the bottom of the base 70 is fixed with the installation position of the equipment through the third screw hole 90.
The foregoing detailed description of the invention is provided for illustration, and it is not to be construed that the detailed description of the invention is limited to only those illustration, but that several simple deductions and substitutions can be made by those skilled in the art without departing from the spirit of the invention, and are to be considered as falling within the scope of the invention.

Claims (10)

1. A method for designing a wafer carrier to carry wafers of any size, the method comprising:
the wafer bearing structure is arranged on a base in a ring mode, wherein the wafer bearing structure surrounds a round supporting structure by taking the axis of the base as the center of a circle;
and a driving assembly is provided at the axis of the base, and drives the wafer bearing structure to move radially by taking the axis of the base as an axis.
2. The method of claim 1, wherein the wafer carrier comprises a plurality of annularly distributed wafer carriers, each wafer carrier being disposed on a slide assembly, the drive assembly being coupled to the slide assembly.
3. The method of claim 2, wherein the slide assembly comprises a slider and a slide rail, the slider being mounted on the slide rail.
4. The method of claim 3, wherein the wafer carrier comprises a first screw and a second screw, the first screw and the second screw are mounted on the slider, the first screw is mounted outside the second screw, and the height of the first screw is greater than the height of the second screw.
5. The method of claim 4, wherein the driving assembly comprises a driving device, a screw, a nut, a connecting rod, a positioning bearing, a hinge, and a fixing bolt, the driving device is connected to one end of the screw through the fixing bolt, the other end of the screw is fixed to the base through the positioning bearing, and the nut is connected to the slider through the hinge and the connecting rod.
6. The method of claim 2, wherein the plurality of sliding assemblies are uniformly distributed on the base around the center of the base.
7. The method of claim 6, wherein the adjacent slide assemblies are spaced apart by 60 °.
8. A method of designing a wafer carrier according to claim 3, wherein a scale is disposed beside the slide rail, and a pointer is disposed on the slider so as to face the scale.
9. The method of claim 1, wherein the center of the base is hollowed out.
10. The method of claim 9, wherein a base is disposed below the base, and the base is screwed with the base.
CN202310236236.4A 2023-03-13 2023-03-13 Design method of wafer carrier Pending CN116417399A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310236236.4A CN116417399A (en) 2023-03-13 2023-03-13 Design method of wafer carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310236236.4A CN116417399A (en) 2023-03-13 2023-03-13 Design method of wafer carrier

Publications (1)

Publication Number Publication Date
CN116417399A true CN116417399A (en) 2023-07-11

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ID=87052414

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310236236.4A Pending CN116417399A (en) 2023-03-13 2023-03-13 Design method of wafer carrier

Country Status (1)

Country Link
CN (1) CN116417399A (en)

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