CN116406094A - Manufacturing method of low-resistance flexible circuit board circuit - Google Patents
Manufacturing method of low-resistance flexible circuit board circuit Download PDFInfo
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- CN116406094A CN116406094A CN202310611149.2A CN202310611149A CN116406094A CN 116406094 A CN116406094 A CN 116406094A CN 202310611149 A CN202310611149 A CN 202310611149A CN 116406094 A CN116406094 A CN 116406094A
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- circuit board
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- fabric substrate
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 77
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 61
- 239000004744 fabric Substances 0.000 claims abstract description 46
- 239000011889 copper foil Substances 0.000 claims abstract description 39
- 239000000463 material Substances 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000007639 printing Methods 0.000 claims abstract description 15
- 238000005507 spraying Methods 0.000 claims abstract description 15
- 239000002243 precursor Substances 0.000 claims abstract description 13
- 238000002360 preparation method Methods 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims description 22
- 239000010949 copper Substances 0.000 claims description 22
- 238000004140 cleaning Methods 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 13
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 9
- 238000009713 electroplating Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 7
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 6
- 239000005751 Copper oxide Substances 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 229910000431 copper oxide Inorganic materials 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 239000003638 chemical reducing agent Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 238000001514 detection method Methods 0.000 abstract description 4
- 238000007711 solidification Methods 0.000 abstract description 2
- 230000008023 solidification Effects 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/073—Displacement plating, substitution plating or immersion plating, e.g. for finish plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to the technical field of circuit board preparation, in particular to a method for manufacturing a low-resistance flexible circuit board circuit, which comprises the steps of firstly selecting a proper conductive base material, then taking a proper amount of precursor solution to completely wet a fabric substrate, placing the fabric substrate on a cleaned copper foil, taking a proper amount of ink into a piezoelectric nozzle of a droplet spraying device, starting the droplet spraying device, printing the ink on the fabric substrate on the copper foil dropwise until the ink is subjected to multilayer printing to form a printing circuit, and then carrying out quick press processing and solidification on the printing circuit, and then carrying out circuit detection to finish the manufacturing of the low-resistance flexible circuit board circuit.
Description
Technical Field
The invention relates to the technical field of circuit board preparation, in particular to a method for manufacturing a low-resistance flexible circuit board circuit.
Background
The flexible circuit board (FlexiblePrintedCircuit, FPC), also called flexible circuit board, is favored … for its excellent characteristics such as light weight, thin thickness, free bending and folding, etc., but the quality detection of domestic related FPCs also mainly relies on manual visual inspection, with high cost and low efficiency. Along with the rapid development of the electronic industry, the circuit board design tends to be high-precision and high-density, the traditional manual detection method can not meet the production requirement, and the automatic detection of FPC defects becomes the necessary trend of industrial development.
In the processing and manufacturing process of the printed circuit board, the manufacturing of the circuit is a very core process, and the circuit resistance value of the flexible circuit board manufactured in the existing mode is high, so that the using effect is influenced in actual use.
Disclosure of Invention
The invention aims to provide a manufacturing method of a low-resistance flexible circuit board circuit, which aims to solve the technical problems that in the prior art, in the process of manufacturing a printed circuit board, the circuit is manufactured in a very core process, the resistance of the flexible circuit board circuit manufactured in the prior art is higher, and the using effect is influenced in actual use.
In order to achieve the above purpose, the manufacturing method of the low-resistance flexible circuit board circuit adopted by the invention comprises the following steps:
step one: selecting a material, selecting a proper conductive substrate, primarily cutting the conductive substrate according to actual requirements, and cleaning the cut conductive substrate by adopting a chemical cleaning mode, wherein the conductive substrate is preferably copper foil;
step two: taking a proper amount of precursor solution to completely wet a fabric substrate, placing the fabric substrate on a cleaned copper foil, taking a proper amount of ink to be placed in a piezoelectric nozzle of a droplet spraying device, starting the droplet spraying device, printing the ink on the fabric substrate on the copper foil dropwise until the ink forms a printing circuit after being printed in multiple layers, forming a copper plating layer on the surface of an outer layer circuit pattern through electroplating, backing a film, sticking a film on the copper foil again, and removing the film outside the outer layer circuit pattern through exposure and development in sequence to expose the copper surface outside the outer layer circuit pattern on the copper foil;
step three: etching away a thickened copper layer and a copper plating layer area of the copper foil plate without a circuit to obtain the required circuit, then removing a film to form an outer layer circuit, and then chemically cleaning the copper foil again and drying;
step four: wiping the auxiliary material of the quick press by using dust-free cloth, checking whether the auxiliary material of the quick press is damaged or not, stacking at least two base materials between two release films, stacking a curing film between the base materials, and pressing at least two base materials at high temperature to obtain a circuit board;
step five: and then placing the circuit board into a curing furnace for heating and curing treatment, cooling to obtain an ultralow-resistance flexible conductive circuit, electroplating NIAU on the circuit board, then attaching back glue, detecting the circuit on the circuit board to be qualified, and then completing the manufacture of the circuit of the low-resistance flexible circuit board, wherein a protective film is attached on the circuit board for protecting the circuit after the manufacture is completed.
In the first step, the purpose of cleaning the conductive substrate is to clean the oxide layer on the conductive substrate, and if not cleaned, the copper oxide on the copper foil will continuously oxidize the circuit board, which is a loss for the practical service life of the low-resistance flexible circuit board circuit.
In the first step, the conductive substrate may be any one of an aluminum substrate, a tin substrate, and a zinc substrate.
In the second step, the preparation process of the precursor solution is as follows: dissolving a reducing agent in deionized water, uniformly stirring, filtering with filter paper to obtain a precursor solution, and sealing for later use.
In the second step, the preparation process of the fabric substrate is as follows: selecting a proper fabric substrate, putting the fabric substrate into a carbon nano tube solution, uniformly soaking the fabric substrate in a magnetic stirrer, then fishing the fabric substrate out, hanging the fabric substrate on a bracket, standing and drying the fabric substrate at room temperature for 1-2 hours, and obtaining the fabric substrate for standby.
In the third step, the solution selected in the etching is a solution such as hydrochloric acid or sulfuric acid, preferably a hydrochloric acid solution.
In the third step, the spraying upper pressure is 2.4Kg/cm2, the lower pressure is 2.2Kg/cm2, and the etching speed is 3.0-5.5 m/min.
In the fifth step, the protective film bonded after the completion of the production is preferably a silica gel protective film.
The invention relates to a method for manufacturing a low-resistance flexible circuit board circuit, which comprises the steps of firstly selecting a proper conductive substrate, primarily cutting the conductive substrate, cleaning an oxide layer on the conductive substrate, continuously oxidizing a circuit board if copper oxide on a copper foil is not cleaned, completely wetting a fabric substrate for the practical service life of the low-resistance flexible circuit board circuit, then taking a proper amount of precursor solution, placing the fabric substrate on the cleaned copper foil, taking a proper amount of ink, placing the proper amount of precursor solution into a piezoelectric nozzle of a droplet spraying device, starting the droplet spraying device, gradually printing the ink on the fabric substrate on the copper foil dropwise until the ink forms a printing circuit after multi-layer printing, forming a copper plating layer on the surface of an outer layer circuit pattern through electroplating, then removing a film, and sticking the film on the copper foil again, the method comprises the steps of exposing and developing to remove films outside the outer layer circuit patterns, exposing copper surfaces outside the outer layer circuit patterns on the copper foil, etching away a thickened copper layer and a copper layer area of a copper foil board without circuits to obtain the required circuits, and then carrying out quick press processing and solidification on the circuits to finish the manufacture of the low-resistance flexible circuit board circuits, wherein the method can utilize active wave metal on a metal substrate to replace metal, namely silver particles, in ink, and simultaneously ensure that the silver particles deposited at gaps of a fabric keep good contact, reduce the resistance, improve the use effect, improve the service life of the low-resistance flexible circuit board circuits, have the characteristics of low circuit manufacture cost and high efficiency, ensure that no extra pollutants are generated in the manufacturing process, realize recycling of punching waste, and greatly reduce the cost and improve the efficiency.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flow chart of steps of a method for manufacturing a low-resistance flexible circuit board circuit according to the present invention.
Detailed Description
Referring to fig. 1, fig. 1 is a step flow chart of a method for manufacturing a low-resistance flexible circuit board circuit according to the present invention, and the present invention provides a method for manufacturing a low-resistance flexible circuit board circuit, comprising the following steps:
s1: selecting a material, selecting a proper conductive substrate, primarily cutting the conductive substrate according to actual requirements, and cleaning the cut conductive substrate by adopting a chemical cleaning mode, wherein the conductive substrate is preferably copper foil;
s2: taking a proper amount of precursor solution to completely wet a fabric substrate, placing the fabric substrate on a cleaned copper foil, taking a proper amount of ink to be placed in a piezoelectric nozzle of a droplet spraying device, starting the droplet spraying device, printing the ink on the fabric substrate on the copper foil dropwise until the ink forms a printing circuit after being printed in multiple layers, forming a copper plating layer on the surface of an outer layer circuit pattern through electroplating, backing a film, sticking a film on the copper foil again, and removing the film outside the outer layer circuit pattern through exposure and development in sequence to expose the copper surface outside the outer layer circuit pattern on the copper foil;
s3: etching away a thickened copper layer and a copper plating layer area of the copper foil plate without a circuit to obtain the required circuit, then removing a film to form an outer layer circuit, and then chemically cleaning the copper foil again and drying;
s4: wiping the auxiliary material of the quick press by using dust-free cloth, checking whether the auxiliary material of the quick press is damaged or not, stacking at least two base materials between two release films, stacking a curing film between the base materials, and pressing at least two base materials at high temperature to obtain a circuit board;
s5: and then placing the circuit board into a curing furnace for heating and curing treatment, cooling to obtain an ultralow-resistance flexible conductive circuit, electroplating NIAU on the circuit board, then attaching back glue, detecting the circuit on the circuit board to be qualified, and then completing the manufacture of the circuit of the low-resistance flexible circuit board, wherein a protective film is attached on the circuit board for protecting the circuit after the manufacture is completed.
In the first step, the purpose of cleaning the conductive substrate is to clean the oxide layer on the conductive substrate, and if not cleaned, the copper oxide on the copper foil will continuously oxidize the circuit board, which is a loss for the practical service life of the low-resistance flexible circuit board circuit.
In the first step, the conductive substrate may be any one of aluminum, tin, and zinc substrates.
In the second step, the precursor solution is prepared by the following steps: dissolving a reducing agent in deionized water, uniformly stirring, filtering with filter paper to obtain a precursor solution, and sealing for later use.
In the second step, the preparation process of the fabric substrate is as follows: selecting a proper fabric substrate, putting the fabric substrate into a carbon nano tube solution, uniformly soaking the fabric substrate in a magnetic stirrer, then fishing the fabric substrate out, hanging the fabric substrate on a bracket, standing and drying the fabric substrate at room temperature for 1-2 hours, and obtaining the fabric substrate for standby.
In the third step, the solution selected in the etching is a solution such as hydrochloric acid or sulfuric acid, preferably a hydrochloric acid solution.
In the third step, in the etching process, spraying and pressing are 2.4Kg/cm < 2 >, pressing is 2.2Kg/cm < 2 >, and the etching speed is 3.0-5.5 m/min.
In the fifth step, the protective film bonded after the completion of the production is preferably a silicone protective film.
The invention has the beneficial effects that: firstly, selecting a proper conductive substrate, washing an oxide layer on the conductive substrate after the conductive substrate is primarily cut, continuously oxidizing a copper oxide layer on a copper foil if the copper oxide layer is not washed, exposing a copper surface of the copper foil outside the outer layer circuit pattern by sequentially exposing and developing, completely wetting a fabric substrate by a proper amount of precursor solution, placing the fabric substrate on the washed copper foil, placing a proper amount of ink into a piezoelectric nozzle of a droplet spraying device, starting the droplet spraying device, printing the ink on the fabric substrate on the copper foil dropwise until the ink is subjected to multi-layer printing to form a printed circuit, forming a copper plating layer on the surface of the outer layer circuit pattern by electroplating, removing a film, adhering the film on the copper foil again, sequentially exposing and developing to remove the film outside the outer layer circuit pattern, exposing the copper surface outside the outer layer pattern on the copper foil, etching the copper foil plate, removing the copper layer of the circuit without the copper layer and the copper plating layer area of the circuit, obtaining the needed circuit, performing quick press processing and curing, finishing the circuit and detecting, namely finishing the manufacturing of the low-resistance flexible circuit board, manufacturing the silver-coated circuit by using the metal circuit, and removing the metal circuit with high-wave-activated metal circuit, and the high-resistance particle-free particle-to-size metal particle-free silver particle-free conductive circuit, and manufacturing the silver-free particle-free conductive circuit has the characteristics of manufacturing cost, and the advantages that the manufacturing the metal particle-free performance is greatly reduced, and the cost, and the manufacturing cost of the circuit is greatly reduced.
The above disclosure is only a preferred embodiment of the present invention, and it should be understood that the scope of the invention is not limited thereto, and those skilled in the art will appreciate that all or part of the procedures described above can be performed according to the equivalent changes of the claims, and still fall within the scope of the present invention.
Claims (8)
1. The manufacturing method of the low-resistance flexible circuit board circuit is characterized by comprising the following steps of:
step one: selecting a material, selecting a proper conductive substrate, primarily cutting the conductive substrate according to actual requirements, and cleaning the cut conductive substrate by adopting a chemical cleaning mode, wherein the conductive substrate is preferably copper foil;
step two: taking a proper amount of precursor solution to completely wet a fabric substrate, placing the fabric substrate on a cleaned copper foil, taking a proper amount of ink to be placed in a piezoelectric nozzle of a droplet spraying device, starting the droplet spraying device, printing the ink on the fabric substrate on the copper foil dropwise until the ink forms a printing circuit after being printed in multiple layers, forming a copper plating layer on the surface of an outer layer circuit pattern through electroplating, backing a film, sticking a film on the copper foil again, and removing the film outside the outer layer circuit pattern through exposure and development in sequence to expose the copper surface outside the outer layer circuit pattern on the copper foil;
step three: etching away a thickened copper layer and a copper plating layer area of the copper foil plate without a circuit to obtain the required circuit, then removing a film to form an outer layer circuit, and then chemically cleaning the copper foil again and drying;
step four: wiping the auxiliary material of the quick press by using dust-free cloth, checking whether the auxiliary material of the quick press is damaged or not, stacking at least two base materials between two release films, stacking a curing film between the base materials, and pressing at least two base materials at high temperature to obtain a circuit board;
step five: and then placing the circuit board into a curing furnace for heating and curing treatment, cooling to obtain an ultralow-resistance flexible conductive circuit, electroplating NIAU on the circuit board, then attaching back glue, detecting the circuit on the circuit board to be qualified, and then completing the manufacture of the circuit of the low-resistance flexible circuit board, wherein a protective film is attached on the circuit board for protecting the circuit after the manufacture is completed.
2. The method of manufacturing a low-resistance flexible circuit board circuit according to claim 1, wherein,
in the first step, the purpose of cleaning the conductive substrate is to clean the oxide layer on the conductive substrate, and if not cleaned, the copper oxide on the copper foil will continuously oxidize the circuit board, which is a loss for the practical service life of the low-resistance flexible circuit board circuit.
3. The method for manufacturing a low-resistance flexible circuit board circuit according to claim 2, wherein,
in the first step, the conductive substrate may be any one of an aluminum substrate, a tin substrate, and a zinc substrate.
4. The method for manufacturing a low-resistance flexible circuit board circuit according to claim 3, wherein,
in the second step, the precursor solution is prepared by the following steps: dissolving a reducing agent in deionized water, uniformly stirring, filtering with filter paper to obtain a precursor solution, and sealing for later use.
5. The method of manufacturing a low-resistance flexible circuit board circuit according to claim 4, wherein,
in the second step, the preparation process of the fabric substrate is as follows: selecting a proper fabric substrate, putting the fabric substrate into a carbon nano tube solution, uniformly soaking the fabric substrate in a magnetic stirrer, then fishing the fabric substrate out, hanging the fabric substrate on a bracket, standing and drying the fabric substrate at room temperature for 1-2 hours, and obtaining the fabric substrate for standby.
6. The method of manufacturing a low-resistance flexible circuit board circuit according to claim 5, wherein,
in the third step, the solution selected in the etching is a solution such as hydrochloric acid or sulfuric acid, preferably a hydrochloric acid solution.
7. The method of manufacturing a low-resistance flexible circuit board circuit according to claim 6, wherein,
in the third step, in the etching process, spraying and pressing are 2.4Kg/cm < 2 >, pressing is 2.2Kg/cm < 2 >, and the etching speed is 3.0-5.5 m/min.
8. The method of manufacturing a low-resistance flexible circuit board circuit according to claim 7, wherein,
in the fifth step, the protective film bonded after the completion of the production is preferably a silicone protective film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310611149.2A CN116406094A (en) | 2023-05-29 | 2023-05-29 | Manufacturing method of low-resistance flexible circuit board circuit |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310611149.2A CN116406094A (en) | 2023-05-29 | 2023-05-29 | Manufacturing method of low-resistance flexible circuit board circuit |
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| CN116406094A true CN116406094A (en) | 2023-07-07 |
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| CN202310611149.2A Pending CN116406094A (en) | 2023-05-29 | 2023-05-29 | Manufacturing method of low-resistance flexible circuit board circuit |
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| CN111432560A (en) * | 2020-03-31 | 2020-07-17 | 西安工程大学 | Manufacturing method of ultra-low resistance flexible conductive circuit |
| CN111479396A (en) * | 2020-03-31 | 2020-07-31 | 西安工程大学 | Preparation method of fabric-based high-conductivity circuit |
| CN112930038A (en) * | 2021-02-08 | 2021-06-08 | 隽美经纬电路有限公司 | Flexible circuit board manufacturing process |
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2023
- 2023-05-29 CN CN202310611149.2A patent/CN116406094A/en active Pending
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|---|---|---|---|---|
| CN108513461A (en) * | 2018-04-28 | 2018-09-07 | 珠海智锐科技有限公司 | A kind of FPC plates manufacture craft |
| CN110430664A (en) * | 2019-07-29 | 2019-11-08 | 厦门大学 | A kind of stretchable degradable flexible circuit board and the preparation method and application thereof |
| CN111432560A (en) * | 2020-03-31 | 2020-07-17 | 西安工程大学 | Manufacturing method of ultra-low resistance flexible conductive circuit |
| CN111479396A (en) * | 2020-03-31 | 2020-07-31 | 西安工程大学 | Preparation method of fabric-based high-conductivity circuit |
| CN112930038A (en) * | 2021-02-08 | 2021-06-08 | 隽美经纬电路有限公司 | Flexible circuit board manufacturing process |
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Application publication date: 20230707 |