CN116403931A

CN116403931A - Patch attaching device

Info

Publication number: CN116403931A
Application number: CN202111627474.5A
Authority: CN
Inventors: 陈正钦; 林柏育
Original assignee: Wanyi International Co ltd
Current assignee: Wanyi International Co ltd
Priority date: 2021-12-28
Filing date: 2021-12-28
Publication date: 2023-07-07

Abstract

A patch attaching device comprises a patch, a first adhesive film, a fixture and a patch taking and placing mechanism. The patch comprises a first surface and a second surface opposite to the first surface. The first adhesive film comprises a third surface, a fourth surface opposite to the third surface and a side edge connecting the third surface and the fourth surface. The fixture is attached to the third surface of the first adhesive film. The patch pick-and-place mechanism is used for picking up the patch and fixing the first surface of the patch. The patch picking and placing mechanism is also used for attaching the second surface of the patch to the third surface of the first adhesive film. The second surface of the patch extends outwardly from the side edge of the first adhesive film to expose a portion of the second surface of the patch.

Description

Patch attaching device

Technical Field

The present invention relates to a patch attaching device, and more particularly, to a patch attaching device for automatically attaching a patch to a first adhesive film attached with a fixture, and the patch is used for assisting a tearing mechanism to tear the first adhesive film from the fixture.

Background

After dicing, the Wafer (Wafer) forms a plurality of Die, and since the plurality of pitches between the Die formed by dicing are very small, if the Die collides during the transportation or the Die taking process, the side edges of the Die will be broken.

In order to solve the problem of possible collision of the diced bare die, a wafer dicing process is performed after a wafer dicing process. Before the wafer is cut, a ductile film is attached to the bottom surface of the wafer in advance, and after the wafer is cut and the bare chips are separated, the film is uniformly spread by the film spreading device, so that the intervals between the bare chips can be uniformly pulled out at the same time.

When the spacing between the bare dies is pulled apart by the film-spreading film, the opposite side of the bare die, to which the film-spreading film is attached, will be attached with the transfer film which is not stretched again to fix the spacing between the bare dies. After the bare die is attached with the transfer film, the dicing film must be torn off.

Since the outer contour of the cut bare die is approximately circular, the side edge of the dicing film is also cut into a circular shape. The contact area of the round film-enlarging adhesive film and the attached bare die on the side edge part of the film-enlarging adhesive film is increased along with the size improvement of the wafer, and the increase of the contact area means that the tearing difficulty of the film-enlarging adhesive film is increased, so that the side edge part of the film-enlarging adhesive film is not easy to tear through any automatic equipment.

In the existing glue tearing mechanism, the side edge part of the spread film is always required to be torn away from the bare crystal by a certain area through manual advance in the glue tearing process, so that the glue tearing mechanism can continue the glue tearing process. In the production line, because the continuous glue tearing process needs to be alternately connected between the manual work and the glue tearing mechanism, the glue tearing process in the prior art is not beneficial to automatic manufacturing or can not effectively improve the production efficiency.

Disclosure of Invention

In order to solve the problems of the prior art in a tearing process of a tearing mechanism after a wafer expanding process, the invention provides a patch attaching device. The patch attaching device comprises a patch, a first adhesive film, a fixture and a patch taking and placing mechanism. The patch comprises a first surface and a second surface opposite to the first surface. The first adhesive film comprises a third surface, a fourth surface opposite to the third surface and a side edge connecting the third surface and the fourth surface. The fixture is attached to the third surface of the first adhesive film. The patch pick-and-place mechanism is used for picking up the patch and fixing the first surface of the patch. The patch picking and placing mechanism is also used for attaching the second surface of the patch to the third surface of the first adhesive film. The second surface of the patch extends outwardly from the side edge of the first adhesive film to expose a portion of the second surface of the patch. When the first adhesive film is torn off by the adhesive tearing mechanism, the adhesive tearing mechanism is connected to the fourth surface of the first adhesive film and the second surface of the patch, and the adhesive tearing mechanism tears up the first adhesive film through the patch, so that the first adhesive film is separated from the fixed object.

In an embodiment, the second surface of the patch includes a first area protruding from the side of the first adhesive film and a second area attached to the third surface of the first adhesive film.

In an embodiment, the patch pick-and-place mechanism includes a suction head for picking up the patch or releasing the patch on the first adhesive film.

In one embodiment, the patch applying device of the present invention further comprises a patch feeding mechanism. The patch supplying mechanism is used for supplying the patches to the patch picking and placing mechanism for picking.

In one embodiment, the patch pick-and-place mechanism further includes a first moving assembly. The first moving assembly is connected with the suction head. The suction head of the patch pick-and-place mechanism moves back and forth between the patch supply mechanism and the third surface of the first adhesive film through the first moving assembly.

In one embodiment, the patch pick-and-place mechanism further includes a second moving assembly. The first moving assembly is connected with the suction head through the second moving assembly. The suction head of the patch pick-and-place mechanism passes through the first moving assembly and the second moving assembly to and fro between the patch supply mechanism and the third surface of the first adhesive film.

In one embodiment, the second moving assembly is moved along a first axis by the first moving assembly, and the suction head is moved along a second axis by the second moving assembly. The first axis is perpendicular to the second axis. The second shaft is perpendicular to the first adhesive film.

In an embodiment, the first moving component and the second moving component comprise a sliding rail and sliding block set or a telescopic cylinder.

In one embodiment, the patch feeding mechanism includes a patch accommodating space and a patch cutting assembly. The patch accommodating space is used for accommodating a patch coil. The patch cutting component is used for cutting the patch coiled material into the patch.

In one embodiment, the patch feeding mechanism includes a patch accommodating space. The patch accommodating space is used for accommodating a plurality of stacked patches.

The patch attaching device can solve the problems in the adhesive tearing process after the wafer expanding process. The patch attaching device can automatically attach the patch on the third surface of the first adhesive film attached to the fixed object and partially protrude out of the side edge of the first adhesive film, so that the patch can assist the adhesive tearing mechanism to automatically tear the first adhesive film from the fixed object, and automatic manufacturing is achieved and production efficiency is improved.

Drawings

Fig. 1 is a perspective view of a patch attaching device of the present invention.

Fig. 2 is a top view of a first adhesive film with a patch attached thereto.

Fig. 3 is a cross-sectional view of a partial area a of fig. 2 taken along section line A-A.

Fig. 4 is a perspective view of the patch attaching device of the present invention in a first state.

Fig. 5 is a perspective view of the patch attaching device of the present invention in a second state.

Fig. 6 is a top view of the first adhesive film with the patch attached, in a tearing process.

FIG. 7 is a cross-sectional view of a portion B of FIG. 6 taken along section line B-B.

Detailed Description

The foregoing and other objects, features and advantages of the invention will be apparent from the following more particular description of preferred embodiments of the invention, as illustrated in the accompanying drawings.

Referring to fig. 1, a perspective view of a patch attaching device of the present invention is shown. The patch attachment device includes a patch pick-and-place mechanism 300. The patch pick-and-place mechanism 300 is used for attaching a patch 100 to a first adhesive film 400.

As shown in FIG. 1, in one embodiment, the patch pick-and-place mechanism 200 includes a suction head 310. The suction head 310 is used for picking up the patch 100 or releasing the patch 100 on the first adhesive film 400. The suction head 310 is connected to a vacuum system. When the suction head 310 contacts the patch 100, the vacuum system is activated so that the suction head 310 picks up the patch 100. When the suction head 310 attaches the patch 100 to the first adhesive film 400, the vacuum system is stopped so that the suction head 310 releases the patch 100.

Please refer to fig. 2 and fig. 3. Fig. 2 is a top view of the first adhesive film 400 with the patch 100 attached thereto. Fig. 3 is a cross-sectional view of a partial area a of fig. 2 taken along section line A-A. The patch 100 includes a first surface 110 and a second surface 120 opposite the first surface 110. The first adhesive film 400 includes a third surface 410, a fourth surface 420 opposite to the third surface 410, and a side 430 connecting the third surface 410 and the fourth surface 420.

In the present embodiment, the patch 100 secures the first surface 110 of the patch 100 by the suction head 310 of the patch pick-and-place mechanism 300, and attaches the second surface 120 of the patch 100 to the third surface 410 of the first adhesive film 400. The second surface 120 of the patch 100 extends outwardly from the side 430 of the first adhesive film 400 to expose a portion of the second surface 120 of the patch 100.

As shown in fig. 2 and 3, the second surface 120 of the patch 100 includes a first region 130 and a second region 140. The first region 130 protrudes from the side 430 of the first adhesive film 400. The second region 140 is attached to the third surface 410 of the first adhesive film 400. The first area 130 is the area where the second surface 120 of the patch 100 extends outward from the side 430 of the first adhesive film 400 and is exposed.

In the present embodiment, a fixture 500 is attached to the third surface 410 of the first adhesive film 400, and the fourth surface 420 of the first adhesive film 400 is adsorbed to a vacuum platform 600 and remains fixed. After a wafer expanding process, the first adhesive film 400 for the wafer expanding process must be torn off for subsequent processes. Therefore, the first adhesive film 400 and the fixture 500 after the wafer expanding process are placed on the vacuum platform 600 to wait for a tearing process to tear the first adhesive film 400. The fixture 500 includes a wafer or a plurality of bare dies cut from the wafer.

As shown in fig. 1, in one embodiment, the patch application device further includes a patch feeding mechanism 200. The patch feeding mechanism 200 is used for feeding the patch 100 to the patch pick-and-place mechanism 300 for picking.

The patch feeding mechanism 200 includes a patch accommodating space 210 and a patch cutting assembly 220.

In one embodiment, the patch accommodating space 210 is used for accommodating a patch coil 150. The patch cutting assembly 220 is configured to cut the patch roll 150 into the patch 100. In another embodiment, the patch accommodating space 210 is configured to accommodate a stacked plurality of patches 100. The patch accommodating space 210 of the patch feeding mechanism 200 may be changed according to the configuration of the accommodated patch 100, and the structure thereof is not limited to the above.

In one embodiment, a substrate material of the patch 100 includes Polyethylene (PE), polyvinyl chloride (polyvinyl chloride, PVC), polypropylene (PP), polyethylene terephthalate (polyethylene terephthalate, PET), or Polyimide (PI). And, the second surface 120 of the patch 100 includes an adhesive material including acrylic acid (acrylic acid) glue and butyl acetate (sec-butyl acetate).

As shown in fig. 1, in an embodiment, the patch pick-and-place mechanism 200 further includes a first moving component 320. The first moving assembly 320 is coupled to the suction head 310. The suction head 310 of the patch pick-and-place mechanism 300 is reciprocated between the patch supply mechanism 200 and the third surface 410 of the first adhesive film 400 by the first moving unit 320.

It should be noted that the technical features of the first moving component 320 connected to the suction head 310 include that the first moving component 320 is directly connected to the suction head 310, and that the first moving component 320 is indirectly connected to the suction head 310 through other components. Therefore, the first moving component 320 is connected to the suction head 310 in any manner to achieve the technical effect that the suction head 310 of the patch pick-and-place mechanism 300 moves back and forth between the patch feeding mechanism 200 and the third surface 410 of the first adhesive film 400, without departing from the scope of the present invention.

In this embodiment, the patch pick-and-place mechanism 200 further includes a second moving assembly 330. The first moving assembly 320 is coupled to the suction head 310 via the second moving assembly 330. The suction head 310 of the patch pick-and-place mechanism 300 moves back and forth between the patch supply mechanism 200 and the third surface 410 of the first adhesive film 400 through the first moving assembly 320 and the second moving assembly 330.

It should be noted that the technical features of the first moving assembly 320 connected to the suction head 310 through the second moving assembly 330 include direct connection or indirect connection between the first moving assembly 320, the second moving assembly 330, and the suction head 310. Therefore, the first moving unit 320, the second moving unit 330, and the suction head 310 are connected in any manner to achieve the technical effect that the suction head 310 of the patch pick-and-place mechanism 300 moves to and from the patch feeding mechanism 200 and the third surface 410 of the first adhesive film 400, without departing from the scope of the present invention.

In one embodiment, as shown in FIG. 1, the second moving assembly 330 can be moved along a first axis X by the first moving assembly 320, and the suction head 310 can be moved along a second axis Y by the second moving assembly 330. The first axis X is perpendicular to the second axis Y. The second axis Y is perpendicular to the first adhesive film 400.

Referring to fig. 4, a perspective view of the patch attaching device of the present invention in a first state is shown. In the present embodiment, in the first state, the first moving member 320 and the second moving member 330 connected thereto move toward the patch feeding mechanism 200 along the first axis X, and the second moving member 330 and the suction head 310 connected thereto move toward the patch feeding mechanism 200 along the second axis Y. In the first state, the suction head 310 of the patch pick-and-place mechanism 300 moves, aligns, and picks up the patch 100 supplied by the patch supply mechanism 200.

In this embodiment, the first state of the patch attaching device is simultaneously carried by the vacuum platform 600, and the first adhesive film 400 and the fixture 500 move along a third axis Z toward the patch attaching device and stop at a predetermined position in front of the patch attaching device.

Referring to fig. 5, a perspective view of the patch attaching device of the present invention in a second state is shown. In the present embodiment, in the second state, the first moving member 320 and the second moving member 330 connected thereto move toward the predetermined position of the vacuum stage 600 along the first axis X, and the second moving member 330 and the suction head 310 connected thereto move toward the first adhesive film 400 on the vacuum stage 600 along the second axis Y. In the second state, the suction head 310 of the patch pick-and-place mechanism 300 moves, aligns, and attaches the patch 100 adsorbed to the suction head 310 to the third surface 410 of the first adhesive film 400.

In this embodiment, the vacuum platform 600 carrying the first adhesive film 400 and the fixture 500 is stopped at the predetermined position before the patch attaching device, so that the first adhesive film 400 receives the patch attaching device to attach the patch 100. The vacuum platform 600 moves to the predetermined position to satisfy the condition that the side 430 of the first adhesive film 400 intersects with the suction head 310 of the patch pick-and-place mechanism 300, so that the vacuum platform 600 can precisely attach the patch 100 to the third surface 410 of the first adhesive film 400 in cooperation with the patch attaching device and the patch 100 partially protrudes from the side 430 of the first adhesive film 400.

To achieve the movement of the first moving element 320 along the first axis X and the movement of the second moving element 330 along the second axis Y, in one embodiment, the first moving element 320 and the second moving element 330 of the patch pick-and-place mechanism 300 comprise a sliding rail and sliding block set or a telescopic cylinder. In other words, the first moving component 320 or the second moving component 330 moves on the first axis X or the second axis Y by using the sliding rail and the sliding block set, or the first moving component 320 or the second moving component 330 moves on the first axis X or the second axis Y by using the telescopic cylinder.

It should be noted that the patch attaching device shown in fig. 1, 4 and 5 is only used to illustrate the connection relationship between the components of the present invention. In fig. 1, 4, and 5, the first moving assembly 320 is the slide rail and slider set, and the second moving assembly 330 is the telescopic cylinder. However, the first moving component 320 and the second moving component 330 of the patch pick-and-place mechanism 300 may be two sliding rail and sliding block sets at the same time, or two telescopic cylinders at the same time. The structure of the patch attaching device of the present invention can change the component configuration according to the actual requirement, and the structures of the first moving component 320 and the second moving component 330 of the patch pick-and-place mechanism 300 are not limited to the above.

After the wafer expanding process described in the foregoing embodiments, the first adhesive film 400 used for the wafer expanding process must be torn off to facilitate the adhesive tearing process. Please refer to fig. 6 and 7. Fig. 6 is a top view of the first adhesive film 400 with the patch 100 attached thereto during the adhesive tearing process. FIG. 7 is a cross-sectional view of a portion B of FIG. 6 taken along section line B-B. In order to tear the first adhesive film 400 from the fixture 500, after the patch 100 is attached to the first adhesive film 400, a second adhesive film 700 is attached to a surface of the fixture 500 opposite to the first adhesive film 400, and a side surface of the second adhesive film 700 opposite to the fixture 500 is attached to the vacuum platform 600. In other words, before the adhesive tearing process, the first adhesive film 400 attached with the patch 100 and the fixture 500 is turned upside down with the surface 700 attached with the fixture 500 opposite to the first adhesive film 400, and the second adhesive film 700 is fixed on the vacuum platform 600 instead.

As shown in fig. 7, in the adhesive tearing process, an adhesive tearing mechanism 800 is connected to the fourth surface 420 of the first adhesive film 400 and the second surface 120 of the patch 100, and the first adhesive film 400 on the fixture 500 is torn off with the aid of the patch 100. The second surface 120 of the patch 100 is configured to provide the connection of the adhesive tearing mechanism 800, and the adhesive tearing mechanism 800 is configured to apply a traction force to the patch 100, and pull up the patch 100 and the first adhesive film 400 by using the traction force, so that the first adhesive film 400 is separated from the fixture 500.

As shown in the cross-sectional views of fig. 3 and 7, a first point P1 is located between the patch 100 and the third surface 410 of the first adhesive film 400. Since fig. 3 and fig. 7 are only cross-sectional views as schematic structural views, in actual situations, a first line segment formed by connecting an infinite number of first points P1 is located between the patch 100 and the third surface 410 of the first adhesive film 400. Similarly, as shown in the cross-sectional view of fig. 3, a second point P2 is located between the first adhesive film 400 and a side 510 of the fixture 500. Since fig. 3 is only a cross-sectional view as a schematic structure, in a practical situation, a second line segment formed by connecting an infinite number of second points P2 is located between the first adhesive film 400 and the side 510 of the fixture 500.

As shown in fig. 7, when the adhesive tearing process is performed, since the medium on the second surface 120 of the patch 100 located at both sides of the first line segment of the first point P1 uniformly extends outwards, the tensile stress of the second surface 120 of the patch 100 can be dispersed without stress concentration, and therefore the second surface 120 of the patch 100 located at the first line segment is firmly attached to the first adhesive film 400. In contrast, as shown in fig. 5, when the adhesive tearing process is performed, the medium on the third surface 410 of the first adhesive film 400 located on both sides of the second line segment of the second point P2 cannot uniformly extend outward, so that the stress concentration is easily generated on the third surface 410 of the first adhesive film 400, and therefore the first adhesive film 400 located on the second line segment is easily separated from the fixture 500.

In an embodiment, as shown in fig. 2, in order to make the medium of the second surface 120 of the patch 100 located at both sides of the first line segment of the first point P1 extend outward uniformly to disperse the tensile stress of the second surface 120 of the patch 100 without concentrating the stress, the area of the second region 120 of the second surface 120 of the patch 100 occupies more than about 30% of the area of the second surface 120 of the patch 100. In other words, more than 30% of the second surface 120 of the patch 100 is attached to the third surface 410 of the first adhesive film 400, so that the patch 100 can achieve the objective effect of assisting the adhesive tearing mechanism 800 to tear the first adhesive film 400 from the fixture 500.

In the prior art, the area of the third surface 410 of the first adhesive film 400 adjacent to the side 430 is manually peeled away from the fixture 500 by a certain area, so that the adhesive tearing mechanism 800 can continue the adhesive tearing process, which is disadvantageous for automatic manufacturing or unable to effectively improve production efficiency. As can be seen from the description of the above embodiments with reference to fig. 1 to 7, the patch attaching device of the present invention can solve the problems encountered in the tearing process after the wafer expanding process. The patch supply mechanism 200 of the patch applying device can automatically and continuously supply the patches 100. The patch pick-and-place mechanism 300 is also capable of automatically and continuously picking up the patches 100 while attaching the patches 100 to the third surface 410 of the first adhesive film 400 and partially protruding the side edges 430 of the first adhesive film 400. Therefore, when the patch 100 is connected to the adhesive tearing mechanism 800 to perform the adhesive tearing process, the patch 100 attached to the third surface 410 of the first adhesive film 400 can be used as a guide to tear the adhesive tearing mechanism 800 off the first adhesive film 400 with the aid of the patch, so that the first adhesive film 400 is separated from the fixture 500. Since the patch attaching device of the present invention can automatically attach the patch 100 to the third surface 410 of the first adhesive film 400 attached to the fixture 500 and partially protrude the side 430 of the first adhesive film 400, the patch 100 can assist the adhesive tearing mechanism 800 to automatically tear the first adhesive film 400 from the fixture 500, so as to achieve automatic manufacturing and increase production efficiency.

The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention as defined in the claims.

Claims

1. A patch attaching device, comprising:

a patch including a first surface and a second surface opposite to the first surface;

a first adhesive film comprising a third surface, a fourth surface opposite to the third surface and a side edge connecting the third surface and the fourth surface;

the fixed object is attached to the third surface of the first adhesive film; and

a patch pick-and-place mechanism for picking up the patch and fixing the first surface of the patch, the patch pick-and-place mechanism further being configured to attach the second surface of the patch to the third surface of the first adhesive film, the second surface of the patch extending outwardly from the side of the first adhesive film to expose a portion of the second surface of the patch;

when the first adhesive film is torn off by the adhesive tearing mechanism, the adhesive tearing mechanism is connected to the fourth surface of the first adhesive film and the second surface of the patch, and the adhesive tearing mechanism tears up the first adhesive film through the patch, so that the first adhesive film is separated from the fixture.

2. The patch attachment device of claim 1, wherein the second surface of the patch comprises a first region protruding beyond the side edge of the first adhesive film and a second region attached to the third surface of the first adhesive film.

3. The patch attaching device of claim 1, wherein the patch pick-and-place mechanism comprises a suction head for picking up the patch or releasing the patch from the first adhesive film.

4. A patch application device as claimed in claim 3, wherein the patch application device further comprises a patch supply mechanism for supplying the patch to be picked up by the patch pick-and-place mechanism.

5. The patch application device of claim 4, wherein the patch pick-and-place mechanism further comprises a first moving assembly, the first moving assembly being coupled to the suction head, the suction head of the patch pick-and-place mechanism being moved back and forth between the patch supply mechanism and the third surface of the first adhesive film by the first moving assembly.

6. The patch attaching apparatus of claim 5, wherein the patch pick-and-place mechanism further comprises a second moving assembly, the first moving assembly is coupled to the suction head via the second moving assembly, and the suction head of the patch pick-and-place mechanism is moved back and forth between the patch supply mechanism and the third surface of the first adhesive film via the first moving assembly and the second moving assembly.

7. The patch attachment device of claim 6, wherein the second movement assembly is moved by the first movement assembly along a first axis, the suction head is moved by the second movement assembly along a second axis, the first axis is perpendicular to the second axis, and the second axis is perpendicular to the first adhesive film.

8. The patch attachment device of claim 6, wherein the first moving assembly and the second moving assembly comprise a slide and slider assembly or a telescoping cylinder.

9. The patch attachment device of claim 1, wherein the patch supply mechanism includes a patch receiving space for receiving a patch roll and a patch cutting assembly for cutting the patch roll into the patch.

10. The patch application device of claim 1, wherein the patch supply mechanism includes a patch receiving space for receiving a plurality of the patches of the stack.