CN116400198A - Detection equipment and detection method for array chip - Google Patents
Detection equipment and detection method for array chip Download PDFInfo
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- CN116400198A CN116400198A CN202310443134.XA CN202310443134A CN116400198A CN 116400198 A CN116400198 A CN 116400198A CN 202310443134 A CN202310443134 A CN 202310443134A CN 116400198 A CN116400198 A CN 116400198A
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- 238000001514 detection method Methods 0.000 title claims abstract description 127
- 239000000523 sample Substances 0.000 claims abstract description 157
- 230000007246 mechanism Effects 0.000 claims abstract description 114
- 239000013307 optical fiber Substances 0.000 claims description 58
- 238000013519 translation Methods 0.000 claims description 12
- 238000007689 inspection Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 239000000835 fiber Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 5
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
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- Microelectronics & Electronic Packaging (AREA)
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- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
An array type chip detection device and a detection method thereof, and an array type PD chip detection method comprises the following steps: s1, detecting the position of an array PD chip; s2, adjusting the angle of the array PD chip; s3, detecting the offset of the array PD chip; s4, adjusting the offset of the array PD chip: driving the array PD chip to translate through a chip position adjusting mechanism according to the array PD chip position detection information, and adjusting the position of the array PD chip; s5, array PD chip detection: and simultaneously detecting a plurality of chips on the array PD chip through a probe assembly with at least two probes. The array PD chip detection method can realize the detection of a plurality of chips together, and effectively improves the array PD chip detection efficiency.
Description
Technical Field
The invention relates to the technical field of chip detection, in particular to detection equipment and a detection method for array APD and PD chips.
Background
In performance testing of chips, after the chips to be tested are replaced, positioning adjustment needs to be performed for each chip. The above positioning adjustment process requires an operator to detect the chip position and readjust the camera, probe and inclination angle of the chip of the detection platform. The above process consumes a lot of time, thereby reducing the detection efficiency of the chip. Therefore, a person skilled in the art needs to design a detection device for array chips to solve the problems that the existing detection device needs to reposition the chip after replacing the chip and needs to readjust the detection device.
Disclosure of Invention
The invention aims to provide an array chip detection device and a detection method thereof, which are used for solving the problem that in the prior art, because an operator is replacing a chip, the operator is required to recalibrate the chip position and readjust the detection device, so that the chip detection efficiency is poor. For this purpose, the invention provides a detection device of an array chip, wherein the array chip is an APD chip or a PD chip; the detection device includes:
the bearing disc is provided with a chip positioning groove for bearing array chips;
a camera mechanism for observing a column matrix chip position, the camera mechanism comprising: a vertical camera and a horizontal camera disposed toward the chip positioning groove;
pushing the positioning mechanism, include: a push plate; the pushing plate is driven to push the array chip to move to the reference position of the edge of the chip positioning groove;
and the detection mechanism is used for detecting the APD chip and the PD chip.
Optionally, the positive positioning mechanism further includes:
the push plate fixing frame body comprises a fixing part and a movable part, and the push plate is arranged on the movable part;
the horizontal pushing mechanism is arranged on the fixing part and comprises: the first pushing rod and the second pushing rod are arranged along the horizontal direction and used for driving the movable part to move so as to drive the pushing plate to move along the horizontal direction;
the vertical pushing mechanism sets up on the fixed part, it includes: and the third pushing rod is arranged along the vertical direction and used for driving the movable part to move so as to drive the pushing plate to move along the vertical direction.
Optionally, the chip positioning groove is a rectangular groove.
Optionally, a positioning clamping groove is formed in the push plate; the positioning clamping groove is connected with the array chip in a clamping mode.
Optionally, the detection device of the array chip further includes:
the X-axis driving mechanism is used for driving the bearing disc to move along the length direction of the detection equipment;
the Y-axis driving mechanism is used for driving the bearing disc to move along the width direction of the detection equipment;
and the bearing disc rotating structure is used for driving the bearing disc to rotate along the circumferential direction of the bearing disc so as to adjust the inclination angle of the array chip in the horizontal direction.
Optionally, the detection mechanism includes: a first probe detection assembly and a second probe detection assembly.
Optionally, the first probe detection assembly includes:
a first probe disposed on the probe moving arm;
the first horizontal push rod of the first probe is arranged on the probe frame and used for driving the first probe to move in the horizontal direction;
the first probe is arranged on the probe frame and used for driving the first probe to move in the horizontal direction;
a height positioning component comprising: and the locating plate is arranged on the probe moving arm and is used for fixing the locating plate on the probe frame.
Optionally, the second probe detection assembly includes:
a second probe disposed on the probe moving arm;
the first horizontal push rod of the second probe is arranged on the probe frame and used for driving the second probe to move in the horizontal direction;
the second horizontal push rod of the second probe is arranged on the probe frame and used for driving the second probe to move in the horizontal direction;
a height positioning component comprising: the positioning plate is arranged on the probe moving arm and is used for fixing the positioning plate on the probe frame;
optionally, the detection device of the array chip further includes: an optical fiber clamp; the optical fiber clamp includes:
the optical fiber bracket is used for fixing optical fibers;
an optical fiber translational positioning assembly comprising: the optical fiber translation positioning plate and the optical fiber translation positioning pin;
optical fiber vertical movement positioning assembly includes: the optical fiber vertically moves the locating plate and the optical fiber vertically moves the locating pin.
Optionally, the detection mechanism includes:
the probe assembly is used for simultaneously detecting a plurality of chips on the array chip; the probe assembly includes: a probe fixing seat and a probe arranged on the probe fixing seat; the probe assembly is connected to the probe drive structure by an elastic connection.
The application method of the detection equipment using the array chip is used for the detection equipment using the array chip and comprises the following steps of:
s1, placing an array chip in a chip positioning groove, and fixing the array chip at a reference position of the chip positioning groove through a push plate of a push positioning mechanism;
s2, adjusting the position of the detection mechanism, and operating the detection mechanism to detect the array chip: moving the detection mechanism at equal intervals so as to align the array chips, and detecting each chip on the array chips;
s3, replacing the array chip with the same size as that in the step S1, and fixing the array chip at the reference position of the chip positioning groove through a push plate of a push positioning mechanism; and directly detecting the array chip through the detection mechanism in the step S2.
Optionally, in step S2, adjusting the position of the detection mechanism includes: adjusting the positions of the first probe detection assembly and the second probe detection assembly, and adjusting the position of the optical fiber clamp.
The technical scheme of the invention has the following advantages:
1. the invention provides a detection device of array chip, comprising: the bearing disc is provided with a chip positioning groove for bearing array chips; a camera mechanism for observing a column matrix chip position, the camera mechanism comprising: a vertical camera and a horizontal camera disposed toward the chip positioning groove; pushing the positioning mechanism, include: a push plate; the pushing plate is driven to push the array chip to move to the reference position of the edge of the chip positioning groove; and the detection mechanism is used for detecting the array chip.
In the invention, the array chip can be fixed at the reference position of the chip positioning groove by arranging the push positioning mechanism. Each array chip waiting to be detected is fixed at the reference position of the chip positioning groove through the alignment positioning mechanism, so that the array chips with various sizes can be conveniently and accurately aligned and clamped to the reference position, and the position is taken as the reference position. Therefore, the reference position is only required to be positioned, and the probe alignment and the optimal optical fiber irradiation coupling alignment are adjusted, so that the accurate positioning can be realized only by equidistant movement of all other subsequent chip positions on the array chip.
When the array chip is tested, the array chip can be pushed forward only by moving the push-forward positioning mechanism without repeatedly adjusting the positions of the probe and the optical fiber. The structure can greatly improve the detection efficiency of the array chip.
2. The invention provides detection equipment of an array chip, and the push positioning mechanism further comprises: the push plate fixing frame body comprises a fixing part and a movable part, and the push plate is arranged on the movable part; the horizontal pushing mechanism is arranged on the fixing part and comprises: the first pushing rod and the second pushing rod are arranged along the horizontal direction and used for driving the movable part to move so as to drive the pushing plate to move along the horizontal direction; the vertical pushing mechanism sets up on the fixed part, it includes: and the third pushing rod is arranged along the vertical direction and used for driving the movable part to move so as to drive the pushing plate to move along the vertical direction.
In the invention, the alignment positioning mechanism can stably and reliably position and fix the array chip through the horizontal pushing mechanism and the vertical pushing mechanism.
3. The chip positioning groove of the array chip detection equipment provided by the invention is a rectangular groove. The chip positioning groove with the rectangular groove structure is matched with the shape of the array chip to be detected, and the array chip can be stably and reliably limited and fixed.
4. The invention provides a detection device of an array chip, which further comprises: the X-axis driving mechanism is used for driving the bearing disc to move along the length direction of the detection equipment; the Y-axis driving mechanism is used for driving the bearing disc to move along the width direction of the detection equipment; and the bearing disc rotating structure is used for driving the bearing disc to rotate along the circumferential direction of the bearing disc so as to adjust the inclination angle of the array chip in the horizontal direction.
In the invention, the positions of the array chips on the bearing disc can be effectively adjusted through the X-axis driving mechanism, the Y-axis driving mechanism and the bearing disc rotating structure, so that the array chips correspond to the positions of the camera mechanism, the correcting and positioning mechanism and the detecting mechanism.
5. The invention provides a detection device of an array chip, which further comprises: an optical fiber clamp; the optical fiber clamp includes: the optical fiber bracket is used for fixing optical fibers; an optical fiber translational positioning assembly comprising: the optical fiber translation positioning plate and the optical fiber translation positioning pin; optical fiber vertical movement positioning assembly includes: the optical fiber vertically moves the locating plate and the optical fiber vertically moves the locating pin.
According to the invention, the position of the optical fiber can be quickly and accurately adjusted through the optical fiber clamp, so that the photosensitive characteristic of the array chip is detected.
6. The invention provides a detection device of an array chip, wherein the detection mechanism comprises: the probe assembly is used for simultaneously detecting a plurality of chips on the array chip; the probe assembly includes: a probe fixing seat and a probe arranged on the probe fixing seat; the probe assembly is connected to the probe drive structure by an elastic connection.
In the invention, the probe assembly can detect a plurality of chips on the array chip at the same time, thereby greatly improving the detection efficiency of the array chip detection equipment.
In addition, in the invention, the probe assembly is connected with the probe driving structure through the elastic connecting piece, and the arrangement can ensure that each probe on the probe assembly has proper elasticity, so that the probes are better contacted with the surface of the chip.
7. The invention provides a method for using an array chip detection device, which is used for the array chip detection device and comprises the following steps:
s1, placing an array chip in a chip positioning groove, and fixing the array chip at a reference position of the chip positioning groove through a push plate of a push positioning mechanism;
s2, adjusting the position of the detection mechanism, and operating the detection mechanism to detect the array chip: moving the detection mechanism at equal intervals so as to align the array chips, and detecting each chip on the array chips;
s3, replacing the array chip with the same size as that in the step S1, and fixing the array chip at the reference position of the chip positioning groove through a push plate of a push positioning mechanism; and directly detecting the array chip through the detection mechanism in the step S2.
In the invention, the array chip in the chip positioning groove is positioned by the push plate of the push positioning mechanism. The array chip is positioned at the reference position. Therefore, the first probe detection assembly, the second probe detection assembly and the optical fiber which form the detection mechanism move at equal intervals, and detection can be carried out on each chip on the array chip, so that the detection efficiency of the detection equipment is greatly improved.
After the array chips with the same size are replaced, the new array chips are positioned to the reference positions again only by the pushing and positioning mechanism, and then detection work can be performed again by the detection mechanism. The first probe detection assembly, the second probe detection assembly and the optical fiber of the array chip detection device do not need to recalibrate positions, so that the detection efficiency of the device is further improved to a great extent.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic perspective view of a column array type chip detection device according to the present invention;
FIG. 2 is a schematic diagram of the pushing plate for positioning and fixing a chip in the chip positioning groove;
FIG. 3 is a schematic perspective view of a positioning mechanism for pushing the positioning device;
FIG. 4 is a schematic perspective view of a first probe detection assembly according to the present invention;
FIG. 5 is a schematic diagram of a second probe detection assembly according to the present invention;
FIG. 6 is a schematic perspective view of an optical fiber clamp according to the present invention;
FIG. 7 is a schematic diagram of a perspective structure of an array chip inspection apparatus with a probe assembly according to the present invention;
FIG. 8 is a schematic perspective view of a probe assembly according to the present invention;
fig. 9 is a schematic diagram of a three-dimensional structure of a push plate according to the present invention;
fig. 10 is a schematic structural diagram of a positioning slot on a push plate and an array chip connected in a clamping manner.
Reference numerals illustrate:
1-a carrying tray; 2-array chips; 3-a chip positioning groove; 4-a vertical camera; 5-a horizontal camera; 6-pushing plate; 7-reference position; 8-a positive pushing and positioning mechanism; 9-a fixing part; 10-a movable part; 11-a first push rod; 12-a second push rod; 13-a third push rod; a 14-X axis driving mechanism; 15-Y axis driving mechanism; 16-a first probe detection assembly; 17-a second probe detection assembly; 18-a first probe; 19-a probe movement arm; 20-a first horizontal push rod of a first probe; 21-a second horizontal push rod of the first probe; 22-positioning plates; 23-limiting pins; 24-a second probe; 25-a second probe first horizontal push rod; 26-a second horizontal push rod of a second probe; 27-an optical fiber clamp; 28-an optical fiber holder; 29-optical fiber; 30-optical fiber translation positioning plate; 31-optical fiber translation locating pins; 32-optical fiber vertical movement positioning plate; 33-optical fiber vertical movement positioning pins; 34-a probe assembly; 35-a probe fixing seat; 36-elastic connection; 37-probe; 38-positioning clamping grooves.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In addition, the technical features of the different embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
Example 1
An array chip detection apparatus is described, wherein the array chip is an APD chip or a PD chip, and as shown in fig. 1, the detection apparatus includes:
as shown in fig. 2, a carrier tray 1 is provided with a chip positioning slot 3 for carrying array chips 2 on the carrier tray 1; the chip positioning groove 3 is a rectangular groove;
camera mechanism for observing array chip 2 position, said camera mechanism comprising: a vertical camera 4 and a horizontal camera 5 disposed toward the chip positioning groove 3;
the push-up positioning mechanism 8, as shown in fig. 9 and 10, includes: the push plate 6, be provided with location draw-in groove 38 on the push plate 6, location draw-in groove 38 with array chip 2 joint links to each other. The pushing plate 6 shown in fig. 2 is driven to push the array chip 2 to move to a reference position 7 at the edge of the chip positioning groove 3; in the present embodiment, as shown in fig. 3, the push positioning mechanism 8 further includes: the push plate fixing frame body comprises a fixing part 9 and a movable part 10, and the push plate 6 is arranged on the movable part 10; a horizontal pushing mechanism provided on the fixing portion 9, comprising: a first pushing rod 11 and a second pushing rod 12, which are arranged along the horizontal direction and used for driving the movable part 10 to move so as to drive the push plate 6 to move along the horizontal direction; a vertical pushing mechanism provided on the fixing portion 9, comprising: a third pushing rod 13, which is arranged along the vertical direction and is used for driving the movable part 10 to move so as to drive the pushing plate 6 to move along the vertical direction;
a carrier disk drive mechanism, as shown in fig. 1, comprising: an X-axis driving mechanism 14 for driving the carrier tray 1 to move along the length direction of the detection apparatus; a Y-axis driving mechanism 15 for driving the carrier tray 1 to move in the width direction of the detecting apparatus; the bearing disc rotating structure is used for driving the bearing disc 1 to rotate along the circumferential direction of the bearing disc to adjust the inclination angle of the array chip 2 in the horizontal direction;
and the detection mechanism is used for detecting the array chip 2. The detection mechanism includes: a first probe detection assembly 16, a second probe detection assembly 17, and a fiber clamp 27.
In the present embodiment, the first probe detection assembly 16 as shown in fig. 4 includes:
a first probe 18 provided on the probe moving arm 19;
a first horizontal push rod 20 of the first probe, which is arranged on the probe frame and is used for driving the first probe 18 to move in the horizontal direction;
a first probe second horizontal push rod 21, which is arranged on the probe frame and is used for driving the first probe 18 to move in the horizontal direction;
a height positioning component comprising: a positioning plate 22 provided on the probe moving arm 19, and a limit plug 23 for fixing the positioning plate 22 to the probe holder.
The second probe detection assembly 17 as shown in fig. 5 includes:
a second probe 24 provided on the probe moving arm 19;
a second probe first horizontal push rod 25, which is arranged on the probe frame and is used for driving the second probe 24 to move in the horizontal direction;
a second horizontal pushing rod 26 of the second probe, which is arranged on the probe frame and is used for driving the second probe 24 to move in the horizontal direction;
a height positioning component comprising: a positioning plate 22 provided on the probe moving arm 19, and a limit plug 23 for fixing the positioning plate 22 to the probe holder;
the optical fiber jig 27 as shown in fig. 6 includes:
an optical fiber holder 28 for holding an optical fiber 29;
an optical fiber translational positioning assembly comprising: a fiber translation positioning plate 30 and a fiber translation positioning pin 31;
optical fiber vertical movement positioning assembly includes: a fiber vertical movement positioning plate 32 and a fiber vertical movement positioning pin 33.
The application method of the detection equipment of the array chip comprises the following steps:
s1, placing an array chip 2 in a chip positioning groove 3, and fixing the array chip 2 at a reference position 7 of the chip positioning groove 3 through a push plate 6 of a push positioning mechanism 8;
s2, adjusting the position of the detection mechanism, and operating the detection mechanism to detect the array chip 2: moving the detection mechanism at equal intervals so as to align the array chip 2, and detecting each chip on the array chip 2; in the step S2, adjusting the position of the detecting mechanism includes: adjusting the positions of the first and second probe detection assemblies 16 and 17, and adjusting the position of the optical fiber jig 27;
s3, replacing the array chip 2 with the same size as that in the step S1, and fixing the array chip 2 at the reference position 7 of the chip positioning groove 3 through a push plate 6 of a push positioning mechanism 8; and directly detects the array chip 2 by the detection mechanism in step S2.
Of course, in the present embodiment, the specific shape of the chip positioning groove 3 is not specifically limited, and in other embodiments, the chip positioning groove 3 may be square, polygonal, or the like, which is adapted to the shape of the array chip 2.
Of course, in the present embodiment, the specific composition of the detection mechanism is not specifically limited, and in other embodiments, the optical fiber jig 27 may not be included, or the first probe detection assembly 16 and the second probe detection assembly 17 described above may not be included.
Of course, in the present embodiment, the specific structure of the alignment positioning mechanism 8 is not specifically limited, and in other embodiments, the alignment positioning mechanism 8 drives the push plate 6 to move by an electric horizontal pushing mechanism and an electric vertical pushing mechanism, so as to limit and fix the array chip 2.
Example 2
An array chip inspection apparatus is described, as shown in fig. 7, which includes:
as shown in fig. 2, a carrier tray 1 is provided with a chip positioning slot 3 for carrying array chips 2 on the carrier tray 1; the chip positioning groove 3 is a rectangular groove;
camera mechanism for observing array chip 2 position, said camera mechanism comprising: a vertical camera 4 and a horizontal camera 5 disposed toward the chip positioning groove 3;
the push positioning mechanism 8 includes: a push plate 6; the pushing plate 6 shown in fig. 2 is driven to push the array chip 2 to move to a reference position 7 at the edge of the chip positioning groove 3; in the present embodiment, as shown in fig. 3, the push positioning mechanism 8 further includes: the push plate fixing frame body comprises a fixing part 9 and a movable part 10, and the push plate 6 is arranged on the movable part 10; a horizontal pushing mechanism provided on the fixing portion 9, comprising: a first pushing rod 11 and a second pushing rod 12, which are arranged along the horizontal direction and used for driving the movable part 10 to move so as to drive the push plate 6 to move along the horizontal direction; a vertical pushing mechanism provided on the fixing portion 9, comprising: a third pushing rod 13, which is arranged along the vertical direction and is used for driving the movable part 10 to move so as to drive the pushing plate 6 to move along the vertical direction;
a carrier disk drive mechanism, as shown in fig. 1, comprising: an X-axis driving mechanism 14 for driving the carrier tray 1 to move along the length direction of the detection apparatus; a Y-axis driving mechanism 15 for driving the carrier tray 1 to move in the width direction of the detecting apparatus; the bearing disc rotating structure is used for driving the bearing disc 1 to rotate along the circumferential direction of the bearing disc to adjust the inclination angle of the array chip 2 in the horizontal direction;
and the detection mechanism is used for detecting the array chip 2. The detection mechanism includes: probe assembly 34 and fiber clamp 27.
In this embodiment, the probe assembly 34 shown in fig. 7 and 8 is used for simultaneously detecting a plurality of chips on the array chip 2; the probe assembly 34 includes: a probe holder 35, and a probe 37 provided on the probe holder 35; the probe assembly 34 is connected to the probe drive structure by a flexible connection 36.
The optical fiber jig 27 as shown in fig. 6 includes:
an optical fiber holder 28 for holding an optical fiber 29;
an optical fiber translational positioning assembly comprising: a fiber translation positioning plate 30 and a fiber translation positioning pin 31;
optical fiber vertical movement positioning assembly includes: a fiber vertical movement positioning plate 32 and a fiber vertical movement positioning pin 33.
The application method of the detection equipment of the array chip comprises the following steps:
s1, placing an array chip 2 in a chip positioning groove 3, and fixing the array chip 2 at a reference position 7 of the chip positioning groove 3 through a push plate 6 of a push positioning mechanism 8;
s2, adjusting the position of the detection mechanism, and operating the detection mechanism to detect the array chip 2: moving the detection mechanism at equal intervals so as to align the array chip 2, and detecting each chip on the array chip 2; in the step S2, adjusting the position of the detecting mechanism includes: adjusting the position of the probe assembly 34 and adjusting the position of the fiber clamp 27; the probe assembly 34 in the present embodiment has two rows of probes to detect the array chip 2 having four rows of chips;
s3, replacing the array chip 2 with the same size as that in the step S1, and fixing the array chip 2 at the reference position 7 of the chip positioning groove 3 through a push plate 6 of a push positioning mechanism 8; and directly detects the array chip 2 by the detection mechanism in step S2.
Of course, in the present embodiment, the number and arrangement of the probes of the probe assemblies 34 are not specifically limited, and in other embodiments, the probe assemblies 34 may be arranged in a single row or multiple rows, and the number of the probe assemblies 34 may also be adapted to the chip on the array chip 2.
Of course, in this embodiment, the connection manner of the probe assembly 34 and the probe driving structure is not specifically limited, and in other embodiments, the probe assembly 34 is directly connected to the probe driving structure without an elastic mechanism.
Of course, in the present embodiment, the connection manner of the probe assembly 34 and the probe driving structure is not particularly limited, and in other embodiments, a rubber pad for elastically connecting the probe assembly 34 and the probe driving structure may be further disposed at a connection position of the probe assembly 34 and the probe driving structure.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the invention.
Claims (12)
1. A detection apparatus for an array chip, comprising:
the chip positioning device comprises a bearing disc (1), wherein a chip positioning groove (3) for bearing array chips (2) is formed in the bearing disc (1);
camera mechanism for observing the position of an array chip (2), the camera mechanism comprising: a vertical camera (4) and a horizontal camera (5) arranged towards the chip positioning groove (3);
a push positioning mechanism (8) comprising: a push plate (6); the push plate (6) is driven to push the array chip (2) to move to a reference position (7) at the edge of the chip positioning groove (3);
and the detection mechanism is used for detecting the array chip (2).
2. The array chip detection apparatus as set forth in claim 1, wherein the push-up positioning mechanism (8) further includes:
the push plate fixing frame body comprises a fixing part (9) and a movable part (10), and the push plate (6) is arranged on the movable part (10);
a horizontal pushing mechanism provided on the fixing portion (9), comprising: a first pushing rod (11) and a second pushing rod (12) which are arranged along the horizontal direction and used for driving the movable part (10) to move so as to drive the push plate (6) to move along the horizontal direction;
a vertical pushing mechanism provided on the fixing portion (9), comprising: and the third pushing rod (13) is arranged along the vertical direction and used for driving the movable part (10) to move so as to drive the pushing plate (6) to move along the vertical direction.
3. The array chip detection device according to claim 1, wherein the push plate (6) is provided with a positioning clamping groove (38); the positioning clamping groove (38) is connected with the array chip (2) in a clamping way.
4. The array chip detection apparatus as claimed in claim 1, wherein the chip positioning groove (3) is a rectangular groove.
5. The array chip inspection apparatus according to claim 1, further comprising:
an X-axis driving mechanism (14) for driving the carrying disc (1) to move along the length direction of the detection device;
a Y-axis driving mechanism (15) for driving the carrier tray (1) to move in the width direction of the detecting device;
the bearing disc rotating structure is used for driving the bearing disc (1) to rotate along the circumferential direction of the bearing disc so as to adjust the inclination angle of the array chip (2) in the horizontal direction.
6. The array chip inspection apparatus according to claim 1, wherein the inspection mechanism comprises: a first probe detection assembly (16) and a second probe detection assembly (17).
7. The array chip detection apparatus as set forth in claim 6, wherein the first probe detection assembly (16) includes:
a first probe (18) provided on a probe movement arm (19);
a first horizontal push rod (20) of the first probe is arranged on the probe frame and is used for driving the first probe (18) to move in the horizontal direction;
the first probe and the second horizontal push rod (21) are arranged on the probe frame and are used for driving the first probe (18) to move in the horizontal direction;
a height positioning component comprising: a positioning plate (22) arranged on the probe moving arm (19), and a limiting bolt (23) for fixing the positioning plate (22) on the probe frame.
8. The array chip detection apparatus as set forth in claim 6, wherein the second probe detection assembly (17) includes:
a second probe (24) provided on the probe movement arm (19);
the first horizontal push rod (25) of the second probe is arranged on the probe frame and is used for driving the second probe (24) to move in the horizontal direction;
a second horizontal push rod (26) of the second probe is arranged on the probe frame and is used for driving the second probe (24) to move in the horizontal direction;
a height positioning component comprising: a positioning plate (22) arranged on the probe moving arm (19), and a limiting bolt (23) for fixing the positioning plate (22) on the probe frame.
9. The array chip inspection apparatus according to claim 6, further comprising: an optical fiber clamp (27); the optical fiber clamp (27) includes:
an optical fiber holder (28) for holding an optical fiber (29);
an optical fiber translational positioning assembly comprising: an optical fiber translation positioning plate (30) and an optical fiber translation positioning pin (31);
optical fiber vertical movement positioning assembly includes: an optical fiber vertical movement positioning plate (32) and an optical fiber vertical movement positioning pin (33).
10. The array chip inspection apparatus according to claim 1, wherein the inspection mechanism comprises:
a probe assembly (34), wherein the probe assembly (34) is used for simultaneously detecting a plurality of chips on the array chip (2); the probe assembly (34) includes: a probe holder (35) and a probe (37) provided on the probe holder (35); the probe assembly (34) is connected to the probe drive structure by a resilient connection (36).
11. A method for using the array chip detection apparatus according to claim 9, comprising the steps of:
s1, placing an array chip (2) in a chip positioning groove (3), and fixing the array chip (2) at a reference position (7) of the chip positioning groove (3) through a push plate (6) of a push positioning mechanism (8);
s2, adjusting the position of the detection mechanism, and operating the detection mechanism to detect the array chip (2): moving the detection mechanism at equal intervals so as to align the array chip (2), and detecting each chip on the array chip (2);
s3, replacing the array chip (2) with the same size as that in the step S1, and fixing the array chip (2) at a reference position (7) of the chip positioning groove (3) through a push plate (6) of a push positioning mechanism (8); and directly detecting the array chip (2) through the detection mechanism in the step S2.
12. The method according to claim 11, wherein in step S2, adjusting the position of the detecting mechanism includes: -adjusting the position of the first probe detection assembly (16) and the second probe detection assembly (17), and-adjusting the position of the optical fiber clamp (27).
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| CN202310443134.XA CN116400198A (en) | 2023-04-23 | 2023-04-23 | Detection equipment and detection method for array chip |
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