CN116398419A - Packaging structure of temperature and pressure integrated sensor - Google Patents
Packaging structure of temperature and pressure integrated sensor Download PDFInfo
- Publication number
- CN116398419A CN116398419A CN202310414828.0A CN202310414828A CN116398419A CN 116398419 A CN116398419 A CN 116398419A CN 202310414828 A CN202310414828 A CN 202310414828A CN 116398419 A CN116398419 A CN 116398419A
- Authority
- CN
- China
- Prior art keywords
- sensor
- locking device
- temperature
- core body
- sensor core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 18
- 238000009434 installation Methods 0.000 claims abstract description 27
- 238000004891 communication Methods 0.000 claims abstract description 10
- 238000007789 sealing Methods 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- 238000009826 distribution Methods 0.000 description 5
- 238000009529 body temperature measurement Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000009530 blood pressure measurement Methods 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010720 hydraulic oil Substances 0.000 description 2
- 238000005461 lubrication Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B51/00—Testing machines, pumps, or pumping installations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/10—Internal combustion engine [ICE] based vehicles
- Y02T10/40—Engine management systems
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention relates to the technical field of sensors, in particular to a packaging structure of a temperature and pressure integrated sensor, which comprises a sensor core, wherein a sensor base is fixedly connected to the bottom of the sensor core, a locking component is fixedly connected to the outer side of the middle part of the sensor core, an installation part is clamped in the middle part of the locking component, the central axis of the installation part and the central axis of the sensor core are arranged in a collinear manner, a circuit component is arranged at the top of the sensor core, a gap is arranged between the circuit component and the locking component, a filling part is filled in the gap, and a communication part is arranged at the top of the circuit component; the sensor base is arranged on the valve plate, a sealing part is arranged between the sensor core body and the valve plate, the sensor base and the sensor core body are communicated. The central axis of the installation part and the central axis of the sensor core body are arranged in a collinear manner, so that the movable space required by the installation part is greatly reduced, and the sensor core body is convenient to operate in a narrower operation space through the installation part and the sensor base.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a packaging structure of a temperature and pressure integrated sensor.
Background
The axial plunger pump is a positive displacement fluid machine, changes in volume are realized through relative sliding of friction pairs, and further, change of system pressure and transmission of flow are realized, and the axial plunger pump is widely applied to the fields of engineering machinery, off-road vehicles, military wheeled vehicles, tracked vehicles and the like due to the advantages of high flow, high pressure, high efficiency, good dynamic performance and the like.
The flow distribution pair is used as one of three friction pairs of the axial plunger pump, the lubrication state of the flow distribution pair seriously influences the high-pressure high-speed performance and the service life of the plunger pump, and the fact that the flow distribution plate is small in size and dynamic pressure lubrication exists is particularly important how to realize simultaneous measurement of the pressure and the temperature of the flow distribution pair.
In general industrial measurement, the temperature and the pressure are measured separately, and the temperature and the pressure are required to be opened and installed on equipment independently, so that the temperature and the pressure are inconvenient and have certain requirements on installation space. The temperature and pressure integrated sensor integrates temperature and pressure measurement, and saves the manufacturing cost and the corresponding installation space of the sensor.
However, the conventional temperature and pressure integrated sensor needs to be installed by a wrench when being installed, and the wrench needs a large operation space, so that the installation in a narrow space such as a plunger pump flow distribution pair is very inconvenient, and the problem is solved by a packaging structure of the temperature and pressure integrated sensor.
Disclosure of Invention
The invention aims to provide a packaging structure of a temperature and pressure integrated sensor so as to solve the problems.
In order to achieve the above object, the present invention provides the following solutions:
the packaging structure of the temperature and pressure integrated sensor comprises a sensor core body, wherein a sensor base is fixedly connected to the bottom of the sensor core body, a locking assembly is fixedly connected to the outer side of the middle part of the sensor core body, an installation part is clamped in the middle of the locking assembly, the central axis of the installation part and the central axis of the sensor core body are arranged in a collinear manner, a circuit assembly is arranged at the top of the sensor core body, a gap is arranged between the circuit assembly and the locking assembly, a filling part is filled in the gap, and a communication part is arranged at the top of the circuit assembly; the sensor base is arranged on the valve plate, a sealing part is arranged between the sensor core body and the valve plate, the sensor base and the sensor core body are communicated.
Preferably, the locking assembly comprises a first sensor locking device and a second sensor locking device which are arranged around the outer side of the middle part of the sensor core body, the first sensor locking device and the second sensor locking device are symmetrically arranged, the first sensor locking device and the second sensor locking device are fixedly connected with the outer side of the middle part of the sensor core body, a second gap is reserved between the end parts of the first sensor locking device and the second sensor locking device, and the end part of the mounting part is clamped and fixed in the second gap.
Preferably, the mounting portion includes a buckle, an end portion of the buckle extends into the second gap, and an end portion of the buckle is clamped with the second gap.
Preferably, threads are arranged on the outer side of the bottom of the sensor base, and the sensor base is in threaded connection with the valve plate.
Preferably, the circuit assembly comprises a bonding plate, the bonding plate is fixedly connected with the top of the sensor core body, the circuit plate is fixedly connected with the top of the bonding plate, a communication part is arranged on the top of the circuit plate, and the filling part is positioned between the bonding plate and the first sensor locking device and between the filling part and the second sensor locking device.
Preferably, the bonding plate and the sensor core body are connected by adopting a bonding process, and the bonding plate is fixed in the welding hole of the circuit board in a soldering manner.
Preferably, the filling part comprises a rubber ring, and the rubber ring is filled between the bonding plate and the first sensor locking device and the second sensor locking device.
Preferably, the communication part comprises a pressure sensor lead and a temperature sensor lead, and the pressure sensor lead and the temperature sensor lead are fixedly connected on the circuit board.
Preferably, the sealing part comprises an O-shaped ring, the O-shaped ring is positioned between the sensor core body and the valve plate, and the O-shaped ring is sleeved outside the bottom of the sensor core body.
Preferably, the inner side of the middle part of the sensor core body is provided with a sensor core body drainage hole, the inner side of the middle part of the sensor base is provided with a sensor basic drainage hole, the middle part of the valve plate is provided with a valve plate drainage hole, and the sensor core body drainage hole, the sensor basic drainage hole and the valve plate drainage hole are communicated.
The invention has the following technical effects: when the sensor base with the sensor core body is placed on the valve plate, then the installation part is clamped on the locking component fixedly connected with the outer side of the sensor core body, the traditional installation mode is that tools such as a wrench are used for installation, the central axis of the tools such as the wrench is perpendicular to the central axis space of the sensor core body, and the tools such as the wrench can rotate by taking the position of the sensor core body as the center of a circle, so that a larger operation space is required.
Drawings
For a clearer description of an embodiment of the invention or of the solutions of the prior art, the drawings that are needed in the embodiment will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art:
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic view of the structure of the buckle of the present invention when installed with a first sensor locking device and a second sensor locking device;
FIG. 3 is a schematic view of a sensor base structure according to the present invention;
FIG. 4 is a schematic view of the first sensor locking device and the second sensor locking device of the present invention;
FIG. 5 is a cross-sectional view showing the structure of embodiment 2 of the present invention;
FIG. 6 is a schematic structural diagram of embodiment 2 of the present invention;
wherein, 1, a valve plate; 2. a sensor base; 3. an O-ring; 4. a sensor core; 5. a first sensor locking device; 6. a rubber ring; 7. a bonding plate; 8. a circuit board; 9. a pressure sensor lead; 10. a temperature sensor lead; 11. a second sensor locking device; 12. a sensor core drainage hole; 13. a sensor basic drainage hole; 14. a diversion hole of the valve plate; 15. a buckle; 16. a temperature sensor first lead; 17. a temperature sensor second lead; 18. thermocouple temperature sensor.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.
Example 1:
referring to fig. 1 to 4, the embodiment provides a packaging structure of a temperature and pressure integrated sensor, which comprises a sensor core 4, wherein a sensor base 2 is fixedly connected to the bottom of the sensor core 4, a locking component is fixedly connected to the outer side of the middle part of the sensor core 4, an installation part is clamped in the middle part of the locking component, the central axis of the installation part and the central axis of the sensor core 4 are arranged in a collinear manner, a circuit component is arranged at the top of the sensor core 4, a gap is arranged between the circuit component and the locking component, a filling part is filled in the gap, and a communication part is arranged at the top of the circuit component; the sensor base 2 is arranged on the valve plate 1, a sealing part is arranged between the sensor core 4 and the valve plate 1, the sensor base 2 and the sensor core 4 are communicated.
When the sensor base 2 with the sensor core 4 is placed on the valve plate 1 during use, then the installation part is clamped on the locking component fixedly connected with the outer side of the sensor core 4, the traditional installation mode is that tools such as a wrench are used for installation, the central axis of the tools such as the wrench is perpendicular to the central axis space of the sensor core 4, and the tools such as the wrench can rotate by taking the position of the sensor core 4 as the center of a circle, so that a larger operation space is required.
The sensor base 2 is fixed at the bottom of the sensor core 4 by welding (laser, electron beam, microbeam plasma and the like) to realize connection and sealing with the sensor core 4.
Further optimizing scheme, locking assembly includes around the outside first sensor locking device 5 and the second sensor locking device 11 that set up in the middle part of sensor core 4, first sensor locking device 5 and the symmetry of second sensor locking device 11 set up, first sensor locking device 5 and second sensor locking device 11 and the outside rigid coupling in the middle part of sensor core 4, leave the second clearance between the tip of first sensor locking device 5 and second sensor locking device 11, the tip card of installation department is solid in the second clearance.
The first sensor locking device 5 and the second sensor locking device 11 are fixed with the outer side of the middle part of the sensor core body 4 in an argon arc welding mode, a laser welding mode, a microbeam plasma welding mode and the like.
The first sensor locking device 5 and the second sensor locking device 11 are arc-shaped structures, the first sensor locking device 5 and the second sensor locking device 11 encircle two sides of the middle of the sensor core body 4, a second gap is reserved between the corresponding end parts of the first sensor locking device 5 and the second sensor locking device 11, the second gap is used for enabling the end part of the installation part to extend into the second gap and be clamped, and after the installation part is clamped with the second gap, the installation part is rotated to drive the sensor core body 4 to rotate, so that the sensor base 2 is screwed into the valve plate 1. The first sensor locking means 5 and the second sensor locking means 11 are identical in construction.
Further optimizing scheme, the installation department includes buckle 15, and the tip of buckle 15 stretches into the second clearance, and the tip and the second clearance joint of buckle 15.
The buckle 15 is of a U-shaped structure, a bulge is arranged at the bottom of the buckle 15 inwards and matched with the second gap in size, and the bulge of the buckle 15 stretches into the second gap, so that the buckle 15 is clamped with the first sensor locking device 5 and the second sensor locking device 11.
Besides the method, the sensor can be locked by hand screwing, and the test pressure of 60Mpa can be obtained by testing the hand screwing.
In a further optimized scheme, threads are arranged on the outer side of the bottom of the sensor base 2, and the sensor base 2 is in threaded connection with the valve plate 1.
The valve plate 1 is provided with a threaded hole, the outer side of the bottom of the sensor base 2 is provided with threads, and the sensor base 2 and the valve plate 1 are fixedly connected together through the threads.
Further optimizing scheme, circuit assembly includes bonding board 7, bonding board 7 and sensor core 4 top rigid coupling, and bonding board 7 top rigid coupling has circuit board 8, and circuit board 8 top is equipped with communication portion, and the filling portion is located between bonding board 7 and first sensor locking device 5 and second sensor locking device 11.
In a further optimized scheme, the bonding plate 7 is connected with the sensor core 4 by adopting a bonding process, and the bonding plate 7 is fixed in a welding hole of the circuit board 8 in a soldering manner.
Further preferably, the filling part comprises a rubber ring 6, and the rubber ring 6 is filled between the bonding plate 7 and the first sensor locking device 5 and the second sensor locking device 11.
The epoxy rubber ring 6 is filled between the first sensor locking device 5 and the second sensor locking device 11 and the bonding plate 7 to protect the circuit and prevent short circuit.
In a further preferred embodiment, the communication part comprises a pressure sensor lead 9 and a temperature sensor lead 10, and the pressure sensor lead 9 and the temperature sensor lead 10 are fixedly connected on the circuit board 8.
The pressure sensor lead 9 and the temperature sensor lead 10 are soldered to the circuit board 8 by soldering or lead soldering, and it is recommended to use high temperature solder.
The pressure sensor and the temperature sensor are respectively connected with a pressure sensor lead 9 and a temperature sensor lead 10, the pressure sensor lead 9 and the temperature sensor lead 10 are connected with an external functional module for outputting temperature and pressure signals, the external functional module can adopt a conditioning circuit, a transmitter and the like, the temperature sensor output is resistance, voltage or digital quantity according to the difference of sensor principles and types, and the pressure sensor output can be current, voltage or digital quantity.
In a further optimized scheme, the sealing part comprises an O-shaped ring 3, the O-shaped ring 3 is positioned between the sensor core body 4 and the valve plate 1, and the O-shaped ring 3 is sleeved outside the bottom of the sensor core body 4.
The valve plate 1 and the sensor core body 4 are sealed by adopting an O-shaped ring 3, a layer of fluorine rubber ring can be added at the upper part of the O-shaped ring 3, the service performance is enhanced, and the O-shaped ring 3 can be replaced by a high polymer rubber ring, so that the pressure measuring range is further improved; the circuit board 8, the pressure sensor lead 9 and the temperature sensor lead 10 are sealed by adopting a sealant mode, so that the hydraulic oil is prevented from contacting the surface of the circuit board 8 to cause short circuit of the circuit board 8.
In a further optimization scheme, a sensor core drainage hole 12 is formed in the inner side of the middle of the sensor core 4, a sensor basic drainage hole 13 is formed in the inner side of the middle of the sensor base 2, a valve plate drainage hole 14 is formed in the middle of the valve plate 1, and the sensor core drainage hole 12, the sensor basic drainage hole 13 and the valve plate drainage hole 14 are communicated.
The sensor base 2 is internally provided with a sensor basic drainage hole 13, the inner side of the middle part of the sensor core 4 is provided with a sensor core drainage hole 12, the middle part of the valve plate 1 is provided with a valve plate drainage hole 14, the sensor core drainage hole 12, the sensor basic drainage hole 13 and the valve plate drainage hole 14 are communicated, working fluid such as hydraulic oil enters the sensor core drainage hole 12 through the valve plate drainage hole 14 and passes through the sensor basic drainage hole 13, and the working fluid directly acts on the sensor core film to realize pressure and temperature measurement.
In the present invention, the sensor base 2 is made of a metal material, preferably the same material as the pressure sensor core 4, preferably 17-PH stainless steel, and the sensor base 2 is manufactured by machining an external thread and an internal pressure guiding hole.
According to the invention, a temperature measuring resistor is sputtered on the surface of a sensor core 4 through a sputtering process, a pressure medium directly acts on a stainless steel diaphragm made of 17-PH, a micro-scale resistance film is manufactured in a molecular bond combination mode, and a required Wheatstone bridge is manufactured through a micro-resistance process to form a full-metal sensitive element; the temperature measuring resistor is originally an internal compensation resistor of the pressure sensor, and a resistor signal is led out through an independent lead wire, so that temperature measurement is realized.
Example 2:
referring to fig. 5 to 6, the present embodiment differs from embodiment 1 only in that a thermocouple temperature sensor 18 is coaxially fixed to the inner wall of the sensor base drain hole 13.
Through punching the side wall surface of the diversion hole 14 of the valve plate, tightly winding a measuring probe at one end of a thermocouple temperature sensor 18 with higher precision on the inner wall of the diversion hole, coiling the middle part of the thermocouple temperature sensor 18 on the inner wall of the basic diversion hole 13 of the sensor, enabling the other end of the thermocouple temperature sensor 18 to pass through a through hole formed in one side of a sensor base 2, an O-shaped ring 3, a sensor core 4, a first sensor locking device 5 or a second sensor locking device 11, a rubber ring 6, a bonding plate 7 and a circuit board 8 and extend out, arranging a first temperature sensor lead 16 and a second temperature sensor lead 17 at one end of the thermocouple temperature sensor 18 extending out, connecting the first temperature sensor lead 16 and the second temperature sensor lead 17 with an external functional module for outputting temperature and pressure signals, enabling the external functional module to adopt a conditioning circuit, a transmitter and the like, and enabling the thermocouple temperature sensor 18 to be output into a resistor according to the principle and the type of the sensor.
Since through holes are formed on the sensor base 2, the O-ring 3, the sensor core 4, the first sensor locking device 5 or the second sensor locking device 11, the rubber ring 6, the bonding plate 7 and the circuit board 8, the testable pressure range of this embodiment 2 is low, but the response time to temperature is shorter than that of embodiment 1 due to the thermocouple temperature sensor 18, and the accuracy is high.
In the description of the present invention, it should be understood that the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
The above embodiments are only illustrative of the preferred embodiments of the present invention and are not intended to limit the scope of the present invention, and various modifications and improvements made by those skilled in the art to the technical solutions of the present invention should fall within the protection scope defined by the claims of the present invention without departing from the design spirit of the present invention.
Claims (10)
1. The utility model provides a packaging structure of temperature and pressure integrated sensor which characterized in that: the sensor comprises a sensor core body (4), wherein a sensor base (2) is fixedly connected to the bottom of the sensor core body (4), a locking assembly is fixedly connected to the outer side of the middle of the sensor core body (4), an installation part is clamped in the middle of the locking assembly, the central axis of the installation part and the central axis of the sensor core body (4) are arranged in a collinear manner, a circuit assembly is arranged at the top of the sensor core body (4), a gap is formed between the circuit assembly and the locking assembly, a filling part is filled in the gap, and a communication part is arranged at the top of the circuit assembly; the sensor base (2) is arranged on the valve plate (1), a sealing part is arranged between the sensor core body (4) and the valve plate (1), the sensor base (2) and the sensor core body (4) are communicated.
2. The packaging structure of a temperature and pressure integrated sensor according to claim 1, wherein: the locking assembly comprises a first sensor locking device (5) and a second sensor locking device (11) which are arranged around the outer side of the middle of the sensor core body (4), the first sensor locking device (5) and the second sensor locking device (11) are symmetrically arranged, the first sensor locking device (5) and the second sensor locking device (11) are fixedly connected with the outer side of the middle of the sensor core body (4), a second gap is reserved between the ends of the first sensor locking device (5) and the second sensor locking device (11), and the end of the installation part is clamped and fixed in the second gap.
3. The packaging structure of a temperature and pressure integrated sensor according to claim 2, wherein: the installation department includes buckle (15), the tip of buckle (15) stretches into the second clearance, the tip of buckle (15) with second clearance joint.
4. The packaging structure of a temperature and pressure integrated sensor according to claim 1, wherein: the outside of the bottom of the sensor base (2) is provided with threads, and the sensor base (2) is in threaded connection with the valve plate (1).
5. The packaging structure of a temperature and pressure integrated sensor according to claim 2, wherein: the circuit assembly comprises a bonding plate (7), the bonding plate (7) is fixedly connected with the top of the sensor core body (4), a circuit board (8) is fixedly connected with the top of the bonding plate (7), a communication part is arranged on the top of the circuit board (8), and the filling part is located between the bonding plate (7) and the first sensor locking device (5) and the second sensor locking device (11).
6. The packaging structure of a temperature and pressure integrated sensor according to claim 5, wherein: the bonding plate (7) is connected with the sensor core body (4) by adopting a bonding process, and the bonding plate (7) is fixed in a welding hole of the circuit board (8) in a soldering manner.
7. The packaging structure of a temperature and pressure integrated sensor according to claim 5, wherein: the filling part comprises a rubber ring (6), and the rubber ring (6) is filled between the bonding plate (7) and the first sensor locking device (5) and the second sensor locking device (11).
8. The packaging structure of a temperature and pressure integrated sensor according to claim 5, wherein: the communication part comprises a pressure sensor lead (9) and a temperature sensor lead (10), and the pressure sensor lead (9) and the temperature sensor lead (10) are fixedly connected on the circuit board (8).
9. The packaging structure of a temperature and pressure integrated sensor according to claim 1, wherein: the sealing part comprises an O-shaped ring (3), the O-shaped ring (3) is positioned between the sensor core body (4) and the valve plate (1), and the O-shaped ring (3) is sleeved outside the bottom of the sensor core body (4).
10. The packaging structure of a temperature and pressure integrated sensor according to claim 1, wherein: sensor core drainage hole (12) have been seted up to sensor core (4) middle part inboard, sensor basic drainage hole (13) have been seted up to sensor base (2) middle part inboard, valve plate drainage hole (14) have been seted up at valve plate (1) middle part, sensor core drainage hole (12) sensor basic drainage hole (13) with valve plate drainage hole (14) intercommunication.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310414828.0A CN116398419A (en) | 2023-04-18 | 2023-04-18 | Packaging structure of temperature and pressure integrated sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310414828.0A CN116398419A (en) | 2023-04-18 | 2023-04-18 | Packaging structure of temperature and pressure integrated sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116398419A true CN116398419A (en) | 2023-07-07 |
Family
ID=87019697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310414828.0A Pending CN116398419A (en) | 2023-04-18 | 2023-04-18 | Packaging structure of temperature and pressure integrated sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116398419A (en) |
-
2023
- 2023-04-18 CN CN202310414828.0A patent/CN116398419A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101124426B (en) | Arrangement or provision of a sensor or probe for the measuring of a condition in a pipe or the like | |
| CA3068237C (en) | Pressure sensor assembly | |
| CN201476927U (en) | Air pressure sensor | |
| US20120125115A1 (en) | Device for measuring properties of working fluids | |
| JPH05296867A (en) | Differential pressure transmitter | |
| CN210243062U (en) | Dual-redundancy differential pressure sensor | |
| CN109855789B (en) | Sensor for monitoring surface pressure of underwater small-sized vehicle | |
| CN116398419A (en) | Packaging structure of temperature and pressure integrated sensor | |
| KR102169778B1 (en) | Pressure sensor arrangement for detecting a pressure of a fluid medium in a measurement chamber | |
| CN2802486Y (en) | High-temp anti-corrosion flat-die micro-pressure transmitter | |
| CN110749775A (en) | Deep sea conductivity sensor | |
| CN206399564U (en) | A kind of wireless pressure sensor | |
| CN210719138U (en) | Hydrostatic level of accurate temperature measurement | |
| US20050072241A1 (en) | Pressure transducer with capillary tube for high pressure measures | |
| CN210827408U (en) | Pressure sensitive element and pore water pressure meter | |
| CN212513441U (en) | Pressure measuring device and liquid level measuring instrument | |
| US4586384A (en) | Pressure or pressure difference measuring instrument | |
| CN216246963U (en) | Pressure sensor with double-path redundant output | |
| CN210426860U (en) | Glass micro-melting pressure sensor | |
| CN218724360U (en) | Small-size temperature and pressure integrated transmitter | |
| CN211696524U (en) | Target type flowmeter with target rod for preventing blockage | |
| CN218628724U (en) | Dual-redundancy pressure sensor structure | |
| KR101017304B1 (en) | Manufacturing method for pressure sensor for commercial vehicle | |
| CN107976275A (en) | A kind of multi-temperature step compensation pressure transmitter | |
| CN218628423U (en) | High-pressure-resistant temperature and pressure integrated sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |