CN116394285A - Suspension manipulator - Google Patents

Suspension manipulator Download PDF

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Publication number
CN116394285A
CN116394285A CN202310338719.5A CN202310338719A CN116394285A CN 116394285 A CN116394285 A CN 116394285A CN 202310338719 A CN202310338719 A CN 202310338719A CN 116394285 A CN116394285 A CN 116394285A
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CN
China
Prior art keywords
adsorption
cyclone
wafer
suction
suction cup
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Pending
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CN202310338719.5A
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Chinese (zh)
Inventor
郝瀚
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Beijing Jingyi Automation Equipment Co Ltd
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Beijing Jingyi Automation Equipment Co Ltd
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Application filed by Beijing Jingyi Automation Equipment Co Ltd filed Critical Beijing Jingyi Automation Equipment Co Ltd
Priority to CN202310338719.5A priority Critical patent/CN116394285A/en
Publication of CN116394285A publication Critical patent/CN116394285A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention provides a suspension manipulator, which relates to the technical field of semiconductors and comprises the following components: the adsorption bracket is provided with an adsorption surface, the adsorption surface is used for receiving a wafer, the support seat is connected to the adsorption bracket, the adsorption bracket is provided with a plurality of cyclone suction cups, the cyclone suction cups are embedded in the adsorption surface, the cyclone suction cups are annularly arranged at intervals in sequence, a plurality of air passages are further formed in the adsorption bracket, the air passages are arranged in one-to-one correspondence with the cyclone suction cups, one ends of the air passages are in fluid communication with the corresponding cyclone suction cups, and the other ends of the air passages extend to the support seat. When the wafer is grabbed, the compressed air delivered to each cyclone sucker is relatively independent, so that the adsorption acting force applied to the wafer by each cyclone sucker can be respectively and independently controlled. Therefore, by means of the mutual matching of the cyclone suckers, relatively balanced adsorption force can be applied to the wafer on the whole, and the wafer can be effectively prevented from slipping and falling when being transported.

Description

Suspension manipulator
Technical Field
The invention relates to the technical field of semiconductors, in particular to a suspension manipulator.
Background
A wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer has a circular shape. Wafers are carriers used for producing integrated circuits, the most commonly used semiconductor materials, and are classified into 6 inch and 8 inch specifications according to their diameters, and in recent years, wafers of 12 inch and larger have been developed in order to meet the demands of semiconductor manufacturing. Along with the continuous increase of the wafer size, the requirements on the wafer manufacturing process are also continuously increasing. A cassette is an apparatus for storing and transferring wafers, which is essential in the wafer manufacturing process. In the wafer manufacturing process, the wafer needs to be taken out of the wafer box for a plurality of times and sent to a processing position, and the wafer is sent into the wafer box for storage or transfer after processing. A robot arm is a device for removing wafers from a cassette, transferring wafers from a processing station to a cassette, and transferring wafers between different processing stations.
In the related art, when a mechanical arm is used for gripping and transferring a wafer, a gap between an end effector of the mechanical arm and the wafer is very narrow, so that the wafer is very easy to slip and drop from the mechanical arm, and the quality and the yield of wafer products are affected. To solve this problem, it is currently practiced to clamp the wafer edge and vacuum chuck. However, there are cases where small particles of substances are easily accumulated in the portion in contact with the wafer, and the wafer is scraped due to surface contamination.
Therefore, how to effectively avoid the wafer from slipping and falling from the mechanical arm and ensure the quality and the yield of the wafer product is a technical problem to be solved in the present day.
Disclosure of Invention
The invention provides a suspension manipulator which is used for solving the defect that a wafer may fall off when the wafer is gripped by a manipulator arm in the prior art, and the adsorption acting force applied by each cyclone sucker to the wafer can be controlled independently by arranging the cyclone suckers with independent air supply, so that the technical effect of preventing the wafer from slipping and falling off can be realized.
The invention provides a suspension manipulator, comprising: an adsorption bracket having an adsorption surface for receiving a wafer and a support base connected to the adsorption bracket,
the adsorption bracket is provided with a plurality of cyclone suction cups, a plurality of the cyclone suction cups are embedded in the adsorption surface, the cyclone suction cups are annularly arranged at intervals in sequence, a plurality of air passages are further arranged in the adsorption bracket, the air passages are in one-to-one correspondence with the cyclone suction cups, one end of each air passage is in fluid communication with the corresponding cyclone suction cup, and the other end of each air passage extends to the supporting seat.
According to the suspension manipulator provided by the invention, the cyclone suckers comprise the first suckers and the second suckers, the number of the first suckers is the same as that of the second suckers, the first suckers and the second suckers are symmetrically arranged, the first suckers are used for outputting air flow with a first rotating direction, the second suckers are used for outputting air flow with a second rotating direction, and the first rotating direction is opposite to the second rotating direction.
According to the suspension manipulator provided by the invention, the number of the first suckers and the second suckers is 4, and the 4 first suckers and the 4 second suckers are annularly and sequentially and uniformly arranged at intervals.
According to the suspension manipulator provided by the invention, the suction bracket is provided with the plurality of suction cup mounting grooves, the cyclone suction cups are arranged in the plurality of suction cup mounting grooves in a one-to-one correspondence manner, and the suction cup mounting grooves are in fluid communication with the air passages corresponding to the cyclone suction cups.
According to the invention, the cyclone sucker comprises:
the adsorption seat is fixedly arranged in the sucker mounting groove, the adsorption seat is provided with an adsorption channel and a containing cavity, the adsorption channel is positioned at the bottom of the adsorption seat, the containing cavity is in fluid communication with the air passage through the adsorption channel, and the containing cavity is provided with a top opening facing the adsorption surface;
the adsorption body is fixedly arranged in the accommodating cavity, the top opening is sealed by the adsorption body, the adsorption body is provided with an adsorption hole penetrating along the thickness direction of the adsorption body, one end of the adsorption hole is in fluid communication with the accommodating cavity, and the other end of the adsorption hole penetrates to the adsorption surface.
According to the suspension manipulator provided by the invention, the adsorption body comprises the supporting part and the extending part, the extending part is connected to the bottom of the supporting part and extends outwards along the radial direction of the supporting part, the top of the adsorption seat is provided with the limiting part extending towards the top opening, and the extending part is fixedly connected with the limiting part.
According to the suspension manipulator provided by the invention, the limiting part at least partially covers the extending part in the thickness direction of the adsorption seat.
According to the suspension manipulator provided by the invention, the overall thickness of the cyclone sucker and the suction bracket is not more than 4 mm.
According to the suspension manipulator provided by the invention, the two offset sensors are arranged at the top of the supporting seat, are respectively positioned at two sides of the width direction of the supporting seat, and are positioned at the outer sides of the wafer area.
According to the suspension manipulator provided by the invention, the two offset sensors are embedded in the top of the supporting seat, and neither of the two offset sensors is higher than the top surface of the supporting seat.
The suspension manipulator provided by the invention comprises an adsorption bracket and a supporting seat, wherein the adsorption bracket is provided with a plurality of cyclone suction cups and air channels, the cyclone suction cups are communicated with the air channels in a one-to-one correspondence manner, and the air channels can independently convey compressed air to each cyclone suction cup.
When the wafer is grabbed, the wafer can be grabbed in a non-contact mode by conveying compressed air to each cyclone sucker, and pollution to the wafer can be avoided. Moreover, since the compressed air supplied to each cyclone chuck is relatively independent, the suction force applied to the wafer by each cyclone chuck can be controlled independently. Therefore, by means of the mutual matching of the cyclone suckers, relatively balanced adsorption force can be applied to the wafer on the whole, and the wafer can be effectively prevented from slipping and falling when being transported.
Drawings
In order to more clearly illustrate the invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a levitation robot in accordance with one embodiment of the present invention;
FIG. 2 is a schematic view of the installation of a cyclone suction cup in the levitation robot shown in FIG. 1;
fig. 3 is a schematic view of the levitation robot shown in fig. 1 in a state in which a wafer is placed.
Reference numerals:
1. an adsorption bracket; 2. a support base; 3. a cyclone suction cup; 31. a first suction cup; 32. a second suction cup; 4. an airway; 5. a first through hole; 6. an adsorption seat; 7. an adsorption body; 8. an adsorption channel; 9. an offset sensor; 10. offset retroreflective sheeting; 11. and (3) a wafer.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In one embodiment according to the present invention, there is provided a suspension robot including an adsorption bracket having an adsorption surface for receiving a wafer, and a support base, the adsorption surface being embedded with a plurality of cyclone chucks to which compressed air is supplied, so that the wafer can be effectively attached to the adsorption surface when the wafer is gripped and transferred. The levitation robot of the present invention is further described with reference to fig. 1 to 3.
Specifically, as shown in fig. 1, the suspension arm in the present embodiment includes: a suction bracket 1 and a supporting seat 2. Illustratively, the suction bracket 1 may be constructed of a flat plate of an aluminum alloy material.
In the present embodiment, the suction bracket 1 is configured in a ring shape, and the support seat 2 is connected to the suction bracket 1 and extends outward in the radial direction of the suction bracket 1.
Further, the suction bracket 1 is provided with a plurality of cyclone suction cups 3, the plurality of cyclone suction cups 3 are embedded on the suction surface, and the plurality of cyclone suction cups 3 are annularly and sequentially arranged at intervals. The inside of absorption bracket 1 still is provided with a plurality of air flue 4, and a plurality of air flue 4 and a plurality of whirlwind sucking disc 3 one-to-one set up, wherein, the one end fluid communication of air flue 4 is to corresponding whirlwind sucking disc 3, and the other end extends to supporting seat 2.
It is to be understood that in the present embodiment, the suction carrier 1 may be generally configured as an annular structure, one end face in the thickness direction of which is formed as a suction face so as to receive the wafer. The cyclone suction cups 3 are sequentially embedded on the suction surface at intervals along the circumferential direction of the annular structure.
When the wafer needs to be grabbed by means of the suspension manipulator, the adsorption surface can be made to be close to the wafer, then compressed air is conveyed to the end part of the air passage 4 extending to the supporting seat 2, then the compressed air enters the cyclone suction disc 3 through the air passage 4, finally the compressed air entering the cyclone suction disc 3 can reach a gap between the wafer and the adsorption surface, and under the action of pressure difference, the compressed air can apply adsorption force to the wafer, so that the wafer is attached to the adsorption surface.
In practical use, when a wafer is grasped or transferred, the spatial position of the wafer may change, and at this time, the adsorption force applied by the plurality of cyclone chucks 3 to the wafer may be unbalanced, so that the wafer may fall off.
In this embodiment, the cyclone chucks 3 are respectively connected with the air passages 4 independent of each other, and at this time, the pressure of the compressed air delivered to the different cyclone chucks 3 by each air passage 4 can be adjusted to adjust the adsorption force applied to the wafer by each cyclone chuck 3, so that the wafer can be subjected to the relatively balanced adsorption force, and the wafer is effectively prevented from slipping and falling.
Further, in the present embodiment, as shown in fig. 1, the plurality of cyclone suction cups 3 includes the first suction cups 31 and the second suction cups 32, the number of the first suction cups 31 and the second suction cups 32 is the same, the first suction cups 31 and the second suction cups 32 are symmetrically arranged, the first suction cups 31 are for outputting the air flow having the first rotation direction, and the second suction cups 32 are for outputting the air flow having the second rotation direction, the first rotation direction being opposite to the second rotation direction.
It will be appreciated that both the first chuck 31 and the second chuck 32 are capable of outputting a rotating air flow so as to maintain a slight gap between the wafer and the chucks. Moreover, the first suction cup 31 and the second suction cup 32 are symmetrically arranged with each other, so that the wafer can be subjected to relatively balanced suction force.
For example, the first rotation direction may be left-handed, i.e. clockwise, rotation and the second rotation direction may be right-handed, i.e. counter-clockwise, rotation. That is, the first suction cup 31 can deliver an air flow rotating in a clockwise direction, and the second suction cup 32 can deliver an air flow rotating in a counterclockwise direction.
As an implementation, the first suction cup 31 may be provided with a guiding vane guiding the compressed air to rotate in a clockwise direction, for example, a guiding vane similar to a fan or a propeller may be fixedly provided in the first suction cup, and the guiding vane may guide the compressed air to rotate in a clockwise direction and be delivered to the suction surface.
Accordingly, the second suction cup 32 may be provided with a flow guiding fin guiding the compressed air to rotate in the counterclockwise direction, for example, a flow guiding fin similar to a fan or a propeller may be fixedly provided in the second suction cup 32 as well, and the flow guiding fin may guide the compressed air to rotate in the counterclockwise direction and be delivered to the suction surface.
It can be understood that, since the rotation direction of the air flow output by the first suction cup 31 is opposite to the rotation direction of the air flow output by the second suction cup 32, after the two air flows generate adsorption forces on the wafer, the rotation forces contained in the two adsorption forces can cancel each other, so that the overall adsorption forces applied by all the cyclone suction cups 3 on the wafer can keep a relative balance state, and further the wafer is prevented from sliding and falling.
In one embodiment, as shown in fig. 1, the number of the first suction cups 31 and the second suction cups 32 is 4, and the 4 first suction cups 31 and the 4 second suction cups 32 are annularly and sequentially and uniformly arranged at intervals. Thus, the 8 cyclone suction cups 3 can be uniformly arranged at 45-degree intervals in a ring-like order in the circumferential direction of the suction bracket 1.
In order to facilitate the installation of the cyclone suction cups 3, in the present embodiment, the suction bracket 1 is provided with a plurality of suction cup mounting grooves in which the cyclone suction cups 3 are disposed in one-to-one correspondence, and the suction cup mounting grooves are in fluid communication with the air passages corresponding to the cyclone suction cups 3.
It will be appreciated that the suction cup mounting grooves are provided on the suction bracket 1 at annular intervals, and the cyclone suction cups 3 are provided in the suction cup mounting grooves in one-to-one correspondence.
Illustratively, the bottom of the suction cup mounting groove is provided with a first through hole 5, via which first through hole 5 the cyclone suction cup 3 can be in fluid communication to the air channel 4.
In a specific embodiment, as shown in fig. 2, the cyclone suction cup 3 includes: an adsorption seat 6 and an adsorption body 7.
Wherein, adsorption seat 6 is fixed to be set up in the sucking disc mounting groove, and adsorption seat 6 has adsorption channel 8 and holds the chamber, and adsorption channel 8 is located the bottom of adsorption seat 6, holds the chamber and holds the passageway 4 fluid communication via adsorption channel 8, holds the chamber and has the open-top towards the adsorption face.
The adsorption body 7 is fixedly arranged in the accommodating cavity, the adsorption body 7 can close the top opening, the adsorption body 7 is provided with an adsorption hole penetrating along the thickness direction of the adsorption body, one end of the adsorption hole is in fluid communication with the accommodating cavity, and the other end of the adsorption hole penetrates to the adsorption surface.
In actual use, when a wafer approaches the suction surface, compressed air from the air passage 4 can enter the suction cup mounting groove through the first through hole 5, then, the compressed air entering the suction cup mounting groove can enter the accommodating cavity through the suction passage 8, and then, the compressed air entering the accommodating cavity can leave through the top opening and reach the gap between the wafer and the suction surface, thereby, the compressed air can apply suction force to the wafer, and the wafer is grabbed.
In one embodiment, to facilitate fixing the adsorption body 7, as shown in fig. 2, the adsorption body 7 includes a support portion and an extension portion, the extension portion is connected to a bottom of the support portion, and the extension portion extends outward in a radial direction of the support portion, a top of the adsorption seat 6 is provided with a limit portion extending toward the top opening, and the extension portion is fixedly connected with the limit portion.
Illustratively, the adsorption body 7 may be configured as a disc-shaped cylinder having a cylindrical support portion, and an extension portion that is annular and connected to the bottom end of the support portion in the circumferential direction. The limiting part may be configured in a ring shape, which is located at the top of the adsorption seat, and at the same time, a central through hole of the limiting part is formed to be open at the top.
At this time, the annular stopper portion and the annular extension portion can be connected to each other, so that the top opening of the adsorption seat 6 is closed.
In one embodiment, the limiting portion at least partially covers the extending portion in the thickness direction of the adsorption seat 6.
In an alternative embodiment, the top of the support of the cyclone suction cup 3 can extend into the top opening of the suction seat 6. Further, the adsorption body 7 may be constructed of an alloy material.
In one embodiment, the cyclone chuck 3 may be a Bernoulli chuck or a vacuum chuck.
Wherein, when the cyclone suction cup is used as the vacuum suction cup, the suction body 7 may be made of a composite rubber material. The composite rubber material is soft, at this time, the adsorption body 7 can be attached to the surface of the wafer more easily, and the surface of the wafer can be prevented from being damaged while sealing is performed.
In some practical use scenarios, the distance between two wafers in the cassette is 10 mm, and the overall thickness of the suction carrier 1 cannot be greater than 5 mm in order to avoid scratching the wafers by fingers.
In contrast, in the present embodiment, the overall thickness of the cyclone suction cup 3 and the suction bracket 1 is not more than 4 mm.
Illustratively, the thickness of the suction bracket 1 may be 3 mm, and the overall thickness of the cyclone suction cup 3 and the suction bracket 1 may be not more than 4 mm after the cyclone suction cup 3 is disposed on the suction bracket 1 by means of the suction cup mounting groove.
In order to further monitor the position of the wafer, in the present embodiment, as shown in fig. 1, two offset sensors 9 are disposed on the top of the support base 2, the two offset sensors 9 are respectively located on two sides of the support base 2 in the width direction, and the two offset sensors 9 are located outside the wafer area.
For example, the offset sensor 9 may be embedded in a groove of the support base 2, and a sensor cable groove may be further provided in the support base 2 so that a cable of the offset sensor 9 can be connected to an external device via the sensor cable groove.
Alternatively, the offset sensor 9 may be a photoelectric sensor.
In an alternative embodiment, the distance between the offset sensor 9 and the central axis of the suction bracket 1 is greater than 300 mm. For example, the offset sensor 9 may be installed at a position 300 mm outward from the center position of the wafer, and may be symmetrically arranged with respect to the center line of the support base 2 in the width direction.
In order to avoid interference with the offset sensors 9 during the wafer moving process, in the present embodiment, the two offset sensors 9 are embedded at the top of the support base 2, and the highest positions of the two offset sensors 9 are not higher than the top surface of the support base 2.
Further, three offset reflectors 10 are further disposed on top of the supporting base 2, the three offset reflectors 10 are sequentially disposed along the circumferential direction of the adsorption bracket 1, and the three offset reflectors 10 are all located inside the wafer area.
Illustratively, three offset reflectors 10 may be respectively fitted in three grooves of the support base 2, and respectively correspond to external photoelectric sensors.
As an implementation, an external light source may be irradiated to the offset reflection sheet 10, and then the offset reflection sheet 10 reflects the light to an external photosensor, so that a position signal of the wafer is obtained by means of a feedback signal of the external photosensor.
In an alternative embodiment, the offset reflector 10 is less than 300 mm from the central axis of the suction bracket 1. For example, the offset sensor 9 may be mounted at a position 300 mm inward from the center position of the wafer.
Thus, in the process of grabbing and moving the wafer by the suspension manipulator, whether the wafer is offset or not can be judged by the feedback signals of the offset sensor 9 and the external photoelectric sensor. For example, in fig. 3, when the wafer is shifted up and down to the left, the shift sensor 9 is triggered; when the wafer is deflected up and down to the right, the exposed deflected reflective sheet 10 triggers an external photosensor by reflected light.
In the present embodiment, the "inner side" and the "outer side" of the wafer area are defined with respect to the mounting position of the wafer, specifically, the "inner side" in the area where the wafer is located and the "outer side" not in the area where the wafer is located in the thickness direction of the suction carrier 1 after the wafer is mounted on the suction carrier 1.
In addition, since the cyclone suction cup in the present embodiment includes the air flow capable of outputting different rotation directions, the suction force of the cyclone suction cup can be adjusted by adjusting the size of the air flow. Therefore, when the wafer is offset in the transferring process and the offset monitoring sensor is triggered, the control system can automatically adjust the air pressure of the cyclone suction disc in the corresponding direction, so that the wafer is adjusted and always kept at the circle center position.
It can be seen that the levitation manipulator in the present embodiment has the following advantages:
the suspension manipulator in this embodiment, including adsorbing bracket and supporting seat, adsorb the bracket and be provided with a plurality of whirlwind sucking discs and air flue, whirlwind sucking disc and air flue one-to-one intercommunication, the air flue can be mutually independent carry compressed air to every whirlwind sucking disc.
When the wafer is grabbed, the wafer can be grabbed in a non-contact mode by conveying compressed air to each cyclone sucker, and pollution to the wafer can be avoided. Moreover, since the compressed air supplied to each cyclone chuck is relatively independent, the suction force applied to the wafer by each cyclone chuck can be controlled independently. Therefore, by means of the mutual matching of the cyclone suckers, relatively balanced adsorption force can be applied to the wafer on the whole, and the wafer can be effectively prevented from slipping and falling when being transported.
The apparatus embodiments described above are merely illustrative, wherein the elements illustrated as separate elements may or may not be physically separate, and the elements shown as elements may or may not be physical elements, may be located in one place, or may be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art will understand and implement the present invention without undue burden.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. A levitation manipulator, comprising: an adsorption bracket having an adsorption surface for receiving a wafer and a support base connected to the adsorption bracket,
the adsorption bracket is provided with a plurality of cyclone suction cups, a plurality of the cyclone suction cups are embedded in the adsorption surface, the cyclone suction cups are annularly arranged at intervals in sequence, a plurality of air passages are further arranged in the adsorption bracket, the air passages are in one-to-one correspondence with the cyclone suction cups, one end of each air passage is in fluid communication with the corresponding cyclone suction cup, and the other end of each air passage extends to the supporting seat.
2. The levitation robot of claim 1, wherein the plurality of cyclone suction cups comprises a first suction cup and a second suction cup, the first suction cup and the second suction cup being the same in number, the first suction cup and the second suction cup being symmetrically arranged, the first suction cup being for outputting an air flow having a first rotational direction, the second suction cup being for outputting an air flow having a second rotational direction, the first rotational direction being opposite to the second rotational direction.
3. The levitation manipulator of claim 2, wherein the number of the first suction cups and the second suction cups is 4, and the 4 first suction cups and the 4 second suction cups are arranged at equal intervals in a ring shape.
4. The levitation manipulator of claim 1, wherein the suction bracket is provided with a plurality of suction cup mounting grooves, a plurality of the cyclone suction cups are provided in one-to-one correspondence in the plurality of suction cup mounting grooves, and the suction cup mounting grooves are in fluid communication with the air passages corresponding to the cyclone suction cups.
5. The levitation robot of claim 4, wherein the cyclone suction cup comprises:
the adsorption seat is fixedly arranged in the sucker mounting groove, the adsorption seat is provided with an adsorption channel and a containing cavity, the adsorption channel is positioned at the bottom of the adsorption seat, the containing cavity is in fluid communication with the air passage through the adsorption channel, and the containing cavity is provided with a top opening facing the adsorption surface;
the adsorption body is fixedly arranged in the accommodating cavity, the top opening is sealed by the adsorption body, the adsorption body is provided with an adsorption hole penetrating along the thickness direction of the adsorption body, one end of the adsorption hole is in fluid communication with the accommodating cavity, and the other end of the adsorption hole penetrates to the adsorption surface.
6. The levitation manipulator of claim 5, wherein the adsorption body comprises a support portion and an extension portion, the extension portion is connected to a bottom portion of the support portion, and the extension portion extends outward in a radial direction of the support portion, a top portion of the adsorption seat is provided with a limit portion extending toward the top opening, and the extension portion is fixedly connected with the limit portion.
7. The levitation robot of claim 6, wherein the stopper at least partially covers the extension in a thickness direction of the adsorption seat.
8. The levitation robot of claim 1, wherein the overall thickness of the cyclone suction cup and suction bracket is not greater than 4 millimeters.
9. The levitation manipulator of claim 1, wherein the support base has two offset sensors at a top thereof, the two offset sensors are located at both sides of the support base in a width direction thereof, respectively, and the two offset sensors are located at outer sides of the wafer region.
10. The levitation manipulator of claim 9, wherein two of the offset sensors are embedded in the top of the support base and neither of the offset sensors is above the top surface of the support base.
CN202310338719.5A 2023-03-31 2023-03-31 Suspension manipulator Pending CN116394285A (en)

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CN116759369A (en) * 2023-08-17 2023-09-15 北京锐洁机器人科技有限公司 Bernoulli finger
CN116872218A (en) * 2023-09-05 2023-10-13 泓浒(苏州)半导体科技有限公司 Eccentric correction method and system in semiconductor wafer conveying process
CN116895596A (en) * 2023-09-11 2023-10-17 宁波润华全芯微电子设备有限公司 Wafer transfer robot sucking disc finger and wafer processing equipment
CN118003367A (en) * 2024-04-09 2024-05-10 深圳市森美协尔科技有限公司 Mechanical arm and probe station

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116759369A (en) * 2023-08-17 2023-09-15 北京锐洁机器人科技有限公司 Bernoulli finger
CN116759369B (en) * 2023-08-17 2023-10-31 北京锐洁机器人科技有限公司 Bernoulli finger
CN116872218A (en) * 2023-09-05 2023-10-13 泓浒(苏州)半导体科技有限公司 Eccentric correction method and system in semiconductor wafer conveying process
CN116872218B (en) * 2023-09-05 2023-11-24 泓浒(苏州)半导体科技有限公司 Eccentric correction method and system in semiconductor wafer conveying process
CN116895596A (en) * 2023-09-11 2023-10-17 宁波润华全芯微电子设备有限公司 Wafer transfer robot sucking disc finger and wafer processing equipment
CN116895596B (en) * 2023-09-11 2023-12-22 宁波润华全芯微电子设备有限公司 Wafer transfer robot sucking disc finger and wafer processing equipment
CN118003367A (en) * 2024-04-09 2024-05-10 深圳市森美协尔科技有限公司 Mechanical arm and probe station
CN118003367B (en) * 2024-04-09 2024-06-04 深圳市森美协尔科技有限公司 Mechanical arm and probe station

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