CN116380906A

CN116380906A - Detection device and detection method thereof

Info

Publication number: CN116380906A
Application number: CN202310204602.8A
Authority: CN
Inventors: 杨乐; 郑洪宝; 翁水才; 谢周阳; 周世超
Original assignee: Hangzhou Changchuan Technology Co Ltd
Current assignee: Hangzhou Changchuan Technology Co Ltd
Priority date: 2023-03-01
Filing date: 2023-03-01
Publication date: 2023-07-04

Abstract

The application relates to the technical field of semiconductor detection, and provides a detection device and a detection method thereof. The detection device comprises a detection platform and a detection module; the detection platform is provided with a detection window for placing the semiconductor element, and a detection carrier plate is arranged at the detection window; the detection module is arranged on the detection platform, and detection modules are arranged on two sides of the detection carrier plate along the thickness direction of the detection carrier plate; the detection module has a light source, a reflector, and a detection camera configured to obtain a detection image of the semiconductor element in response to the reflector based on reflection of the material by the light source. By the arrangement, not only is the detection angle of the detection camera relative to the semiconductor element reduced, but also the distance for acquiring the image of the semiconductor element is reduced, so that the occupied space is reduced, and interference with other structures is reduced.

Description

Detection device and detection method thereof

Technical Field

The present disclosure relates to the field of semiconductor detection technologies, and in particular, to a detection device and a detection method thereof.

Background

At present, visual inspection is often adopted in the process of inspecting semiconductor elements, but this method requires a large amount of labor and has low inspection accuracy. In the related art, some manufacturers take images of semiconductor devices with cameras to detect defects. However, the camera shooting method needs to adjust the shooting position of the camera relative to the semiconductor element, and if the camera is improperly arranged, the camera occupies a large space, so that the camera is easy to interfere with other structures in the semiconductor processing equipment.

Disclosure of Invention

Based on this, it is necessary to provide a detection device that satisfies defect detection of a semiconductor element, reduces the occupied space, and improves the shooting definition.

A detection device comprises a detection platform and a detection module; the detection platform is provided with a detection window for placing the semiconductor element, and a detection carrier plate is arranged at the detection window; the detection module is arranged on the detection platform, and the detection modules are arranged on two sides of the detection carrier plate along the thickness direction of the detection carrier plate; the detection module has a light source, a reflector, and a detection camera configured to obtain a detection image of the semiconductor element in response to the reflector based on reflection of material by the light source.

According to the detection device, the detection modules are arranged on the two sides of the detection carrier plate along the thickness direction of the detection carrier plate, and when the semiconductor element is placed in the detection window, the two sides of the semiconductor element along the thickness direction of the detection carrier plate are respectively corresponding to the detection modules so as to meet the detection of the upper surface and the lower surface of the semiconductor element. Meanwhile, due to the arrangement of the reflecting mirror in the detection module, light rays emitted by the light source can be reflected so as to change the light path transmission direction, and the detection camera only needs to be arranged on the light path with changed direction. By the arrangement, not only is the detection angle of the detection camera relative to the semiconductor element reduced, but also the distance for acquiring the image of the semiconductor element is reduced, so that the occupied space is reduced, and interference with other structures is reduced.

In one embodiment, the light source and the reflecting mirror are both disposed at an angle relative to the first direction, and an included angle between the light source and the first direction is a first angle α; taking the distance between the light of the light source and the incident point of the detection carrier plate and the reflecting point on the reflecting mirror as a first interval and taking the distance between the optical axis of the detection camera and the detection carrier plate as a second interval; the ratio of the second spacing to the first spacing is cos alpha.

In one embodiment, the length of the reflector from the light source to the detection camera is greater than 80mm; and/or along a third direction, the extension of the mirror is greater than 80mm; wherein the third direction is disposed at an angle to the first direction and is disposed at an angle to an optical axis of the detection camera; and/or the angle value of the first angle alpha is between 20 degrees and 60 degrees; and/or the reflectivity of the mirror is greater than 80%.

In one embodiment, the detection module further comprises a first base, a rotating shaft, an adjusting piece and a driving rod; the first base is arranged on the detection platform, and the rotating shaft is rotatably connected to the first base and detachably connected with the reflecting mirror; one end of the adjusting piece is connected with the rotating shaft, and the other end of the adjusting piece penetrates through the first base and is movably connected with the driving rod; the driving rod is rotationally connected to the first base, and can rotate around the axis of the driving rod, so that the adjusting piece is driven to drive the rotating shaft to rotate around the axis of the rotating shaft.

In one embodiment, the first base is configured with a first elongated hole having a length extending axially along the drive rod; the adjusting piece comprises a connecting arm, a moving block and a connecting column, one end of the connecting arm is fixedly arranged on the rotating shaft, and a second long hole with the length extending along the thickness direction of the detection carrier plate is formed at the other end of the connecting arm; the connecting post is connected to the connecting arm, and is connected to the moving block through the second long hole and the first long hole, and the moving block is connected to the driving rod in a threaded manner; the moving block is configured to move along the axial direction of the driving rod in response to the threaded transmission of the driving rod so as to drive the connecting arm to rotate around the axis of the rotating shaft through the engagement post.

In one embodiment, the detection module further comprises a second base and a locking member; the second base is provided with a plurality of mounting holes, and the mounting holes are arranged at intervals along the emergent direction of the light source; each mounting hole is correspondingly provided with a locking piece, the locking piece passes through the mounting hole and is connected with the light source, and the locking piece can move in the mounting hole.

In one embodiment, the second base includes: a mounting base body configured with a third long hole having a length extending in the thickness direction of the detection carrier plate; the support cantilever is provided with at least two arm bodies which are oppositely arranged at intervals along a third direction, and each arm body is provided with a mounting hole for connecting the light source; one side of the support cantilever, which is away from the light source, is abutted against the mounting seat body; one end of the adjusting column penetrates through the mounting seat body and is connected with the supporting cantilever; and a locking member having one end connected to the support cantilever through the third long hole; the adjusting column can rotate around the axis of the adjusting column, so that the supporting cantilever is driven to move along the axial direction of the adjusting column relative to the mounting base, the locking piece can move in the third long hole, and the locking piece is used for locking the supporting cantilever relative to the mounting base.

In one embodiment, the detection module further includes a camera moving mechanism, and a power output end of the camera moving mechanism is connected with the corresponding detection camera to drive the detection camera to move along the optical axis direction of the detection camera.

In one embodiment, the number of the detection modules is two, namely a first detection module and a second detection module; the first detection module and the second detection module jointly define a detection path for the movement of the semiconductor element, and the first detection module and the second detection module are staggered on the detection path; the arrangement sequence of the light source, the reflecting mirror and the detection camera in the first detection module is opposite to the arrangement sequence of the light source, the reflecting mirror and the detection camera in the second detection module.

In one embodiment, the detecting device includes a pressing mechanism, where the pressing mechanism is used to press the edge of the semiconductor element against the detecting carrier plate; and/or, the detection platform further comprises a gland mechanism, wherein the gland mechanism is provided with a gland carrier plate, and the gland carrier plate is used for flattening the semiconductor element.

In one embodiment, the detection device further comprises a dust removal mechanism, the dust removal mechanism being disposed upstream of the detection platform; the dust removal mechanism comprises a first dust removal component and a second dust removal component, the first dust removal component and the second dust removal component are arranged in a staggered mode along the first direction, the first dust removal component is used for cleaning the lower surface of the semiconductor element, and the second dust removal component is used for cleaning the upper surface of the semiconductor element.

The application also provides a detection method for detecting the semiconductor element, which is operated based on the detection device, wherein the detection device is provided with a first detection module and a second detection module which are arranged at intervals along a second direction; the detection method comprises the following steps:

adjusting the angle of the reflecting mirror relative to the vertical direction and/or adjusting the position of the detection camera along the optical axis direction of the detection camera, wherein the optical axis direction is the second direction;

placing a material to be detected on a detection carrier plate, driving the detection carrier plate to move along a second direction, and sequentially passing through the second detection module and the first detection module, wherein each detection camera acquires first image information of the material to be detected of the detection carrier plate in the moving process;

driving the detection carrier plate to reversely move along a second direction, and sequentially passing through the first detection module and the second detection module, wherein each detection camera acquires second image information of a material to be detected of the detection carrier plate in the moving process;

and analyzing and processing the first image information and the second image information to obtain defect information of the material to be detected.

In one embodiment, the first detection module and the second detection module together define a detection path, the detection path having a start end and a termination end;

The material to be detected is placed on the detection carrier plate, the detection carrier plate is driven to move along the second direction, and the material to be detected sequentially passes through the second detection module and the first detection module comprises:

the detection carrier plate is positioned at the initial end of the detection path,

the gland mechanism moves to the starting end of the detection path and is connected with the detection carrier plate, and the gland mechanism drives the detection carrier plate to move to the ending end of the detection path along the second direction.

In one embodiment, the capping mechanism comprises a capping carrier plate; the driving the detection carrier plate moves reversely along the second direction and sequentially passes through the first detection module and the second detection module, and the detection carrier plate comprises:

the gland support plate moves downwards relative to the detection support plate so as to enable the material to be detected to be pressed flatly, and the gland mechanism drives the detection support plate to reversely move to the starting end of the detection path along the second direction.

In one embodiment, the placing the material to be detected on the detection carrier plate includes;

cleaning the lower surface of the material to be detected, and placing the cleaned material to be detected on the detection carrier plate;

the material to be detected is pressed and fixed relative to the detection carrier plate, and the second dust removing assembly is started to enable the air knife and the ion air bar to move along a third direction so as to clean the upper surface of the material to be detected;

After cleaning, the pressing fixation of the materials to be detected is released.

Drawings

In order to more clearly illustrate the technical solutions of embodiments or conventional techniques of the present application, the drawings that are required to be used in the description of the embodiments or conventional techniques will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.

FIG. 1 is a first schematic view of a detection device provided in the present application at a detection station;

FIG. 2 is a second schematic view of the inspection device provided in the present application at an inspection station;

FIG. 3 is a schematic diagram illustrating an angular relationship of a detection module in the detection device provided in the present application;

FIG. 4 is a schematic diagram of a mirror assembly in the detection module provided in FIG. 2;

FIG. 5 is a schematic diagram of a portion of the detection module provided in FIG. 2;

FIG. 6 is a first partial schematic view of the inspection apparatus provided in FIG. 2 at an inspection station;

FIG. 7 is a second partial schematic view of the inspection apparatus provided in FIG. 2 at an inspection station;

FIG. 8 is a third partial schematic view of a detection station in the detection apparatus provided herein;

Fig. 9 is a schematic diagram of a tray in the detection device provided in the present application;

fig. 10 is a schematic diagram of a first handling manipulator in the detection device provided in the present application;

fig. 11 is a schematic diagram of a second handling manipulator in the detection device provided in the present application;

FIG. 12 is a schematic diagram of a visual positioning module in the detecting device provided by the present application;

fig. 13 is a first schematic diagram of an adjustment platform in the detection device provided in the present application;

fig. 14 is a second schematic diagram of the adjustment platform in the detection device provided in the present application;

FIG. 15 is a schematic view of a dust removing mechanism in the detection device provided by the present application;

fig. 16 is a schematic diagram of a pressing mechanism and a detection carrier in the detection device provided by the application;

FIG. 17 is a schematic diagram of a detection device provided herein;

fig. 18 is a flowchart of the detection method provided in the present application.

Reference numerals: 100. a detection module; 101. a first detection module; 102. a second detection module; 110. a support base; 120. a support beam; 111. a plate body; 112. support legs; 11. a light source; 12. a reflecting mirror; 13. detecting a camera; 200. a detection platform; 2001. a detection window; 210. detecting a carrier plate; 121. a frame; 122. a lens; 123. a limit baffle; 1211. an exhaust hole; 21. a first base; 22. a rotating shaft; 23. an adjusting member; 24. a driving rod; 211. a cross plate; 212. a riser; 2121. an arc groove; 213. arc-shaped buckles; 221. a clamping groove; 222. cutting into sections; 2101. a first long hole; 231. a connecting arm; 232. a moving block; 2311. a second long hole; 241. a fixed block; 25. a second base; 2501. a mounting hole; 251. a mounting base body; 252. supporting the cantilever; 253. an adjusting column; 2511. a third long hole; 255. a bending arm; 2521. an arm body; 2522. a cross arm; 2512. a fourth long hole; 27. a camera moving mechanism; 28. a base; 131. a camera body; 132. a lens; 31. a first linear module; 32. a moving guide rail; 312. a first toothed plate; 313. a link driving mechanism; 331. a second toothed plate; 3131. a toothed plate cylinder; 3132. a connecting block; 3133. a connecting rod; 3134. a pushing plate; 40. a capping mechanism; 41. pressing the carrier plate; 42. a gland base; 43. a gland bracket; 44. a driving source; 45. a drive gear; 46. a passive rack; 47. a spring; 50. a material tray; 51. a material receiving disc; 52. a waste tray; 53. a feed tray; 501. avoidance holes; 54. a positioning piece; 61. a first handling robot; 611. an electrostatic stage frame; 612. a voltage amplifier; 613. an electrostatic platform; 614. a paper ejection cylinder; 62. a second handling robot; 621. an adsorption frame; 622. an absorbing member; 63. a lifting mechanism; 64. assembling a beam; 65. a sliding seat; 601. a cross frame beam; 602. a longitudinal frame beam; 603. a sheet metal bending part; 70. a visual positioning module; 71. positioning a camera; 73. a visual support; 74. adjusting the sliding table; 741. a reference block; 742. a first adjustment block; 743. a second adjustment block; 7421. a first arcuate aperture; 7431. a second arcuate aperture; 80. adjusting a platform; 81. a rotation mechanism; 82. a translation mechanism; 83. an adjustment panel; 84. a support plate; 85. a sliding support block; 86. sliding the support rail; 811. a rotating electric machine; 812. rotating the driving wheel; 813. rotating the driven wheel; 814. rotating the synchronous belt; 821. a translation motor; 822. a first synchronization band set; 823. a second set of synchronized bands; 824. joining the substrates; 8221. a first drive wheel; 8222. a first driven wheel; 8223. a first belt; 8231. a second driving wheel; 8232. a second driven wheel; 8233. a second timing belt; 90. a dust removing mechanism; 91. a first dust removal assembly; 92. a second dust removal assembly; 93. an integrated base; 9011. an air knife; 9012. an ion wind bar; 921. a second linear module; 922. a suspension arm; 923. moving the guide bracket; 130. a pressing mechanism; 1301. an integrated board; 1302. pressing down the arm; 1303. a first cylinder; 1304. pressing down the supporting plate; 1305. and a second cylinder.

Detailed Description

In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used in the description of the present application for purposes of illustration only and do not represent the only embodiment.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.

In this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be a direct contact of the first feature with the second feature, or an indirect contact of the first feature with the second feature via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely under the second feature, or simply indicating that the first feature is less level than the second feature.

Unless defined otherwise, all technical and scientific terms used in the specification of this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. The term "and/or" as used in the specification of this application includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1, 2 and 17, the present invention provides a detection device mainly used in defect detection of a semiconductor element. The detection device comprises a detection platform 200 and a detection module 100, wherein the detection platform 200 is provided with a detection window 2001 for placing a semiconductor element, a detection carrier plate 210 is arranged at the detection window 2001, the detection module 100 is arranged on the detection platform 200, and the detection carrier plate 210 is provided with the detection module 100 along two sides of the thickness direction of the detection carrier plate. The inspection module 100 has a light source 11, a mirror 12, and an inspection camera 13, the inspection camera 13 being configured to obtain an inspection image of the semiconductor device based on reflection of the material by the mirror 12.

Specifically, for convenience of description, the two detecting modules 100 are referred to as a first detecting module 101 and a second detecting module 102, respectively. The detection platform 200 is used for integrating the detection module 100 and supporting the detection module 100. The inspection window 2001 on the inspection platform 200 facilitates the first inspection module 101 and the second inspection module 102 to inspect the front and the back of the semiconductor device, respectively, for example, the inspection window 2001 is a through hole formed on the inspection platform 200, so that the front and the back of the semiconductor device located at the inspection window 2001 are exposed to the inspection module 100. During the detection process, the light emitted by the light source 11 can be reflected by the reflecting mirror 12, so as to change the light path transmission direction. At this time, the detection camera 13 only needs to be disposed on the light path after the change of direction. By the arrangement, the detection angle of the detection camera 13 relative to the semiconductor element is reduced, and more importantly, the distance between the detection camera 13 and the semiconductor element image is reduced, so that the space occupied by the whole detection module 100 is reduced, and interference between the detection module 100 and other structures is reduced.

As shown in fig. 1-3, in some embodiments, the light source 11 and the reflecting mirror 12 are disposed at an angle relative to the first direction, and the included angle between the light source 11 and the first direction is a first angle α, that is, the incident angle of the light source 11 on the detection carrier 210 is the first angle α. Meanwhile, the distance between the incident point of the light source 11 and the reflecting point on the reflecting mirror 12 is a first distance, and the distance between the optical axis of the detecting camera 13 and the detecting carrier 210 is a second distance, so that the ratio of the second distance to the first distance is cos α.

The first direction is the thickness direction of the detection carrier 210 along the first direction, and when the detection carrier 210 is horizontally placed in actual use, the first direction is the vertical direction. The semiconductor device is placed on the test carrier 210 such that the front surface of the semiconductor device faces the first test module 101 and the back surface of the semiconductor device faces the second test module 102. Thus, for convenience of description, the second direction may be the moving direction of the detection carrier 210 along the detection platform 200, or may be the optical axis direction of the detection camera 13; the third direction is perpendicular to the second direction and the first direction. The first direction, the second direction, and the third direction will be described below as examples.

Taking the first detection module 101 as an example, the light source 11 and the reflecting mirror 12 are both located above the detection carrier 210 and are both disposed at an angle to the detection carrier 210. The incident light emitted by the light source 11 relative to the detection carrier 210 is along the axis of the light source 11, so that the first angle is the same as the angle of incidence of the light source 11 relative to the detection carrier 210. The incident light emitted from the light source 11 to the detection carrier 210 is reflected by the detection carrier 210, and then reflected by the reflection light to the reflection mirror 12, and reflected by the reflection mirror 12 to the detection camera 13. Therefore, for the detection carrier 210, the incident light and the reflected light have normal lines perpendicular to the detection carrier 210, and the incident angle is the same as the reflected angle. Meanwhile, the optical axis of the detection camera 13 is parallel to the detection carrier 210, and the second distance is a linear distance from the optical axis of the detection camera 13 to the detection carrier 210. At this time, the first pitch, the second pitch and the detection carrier 210 form a right triangle, where the first pitch is the hypotenuse of the right triangle, and the second pitch is the long right angle side of the right triangle; meanwhile, the included angle between the long right-angle side and the inclined side and the reflection angle are inner stagger angles, and the angles of the long right-angle side and the inclined side are the same and alpha. Thus, the ratio of the second pitch to the first pitch is cos α.

When the reflecting mirror 12 is not present, the light emitted from the light source 11 is reflected by the detection carrier plate 210 and then directly emitted to the detection camera 13, and according to the reflection principle, the detection camera 13 needs to be disposed on the light reflection path, that is, needs to be disposed obliquely; also, the installation height of the detection camera 13 exceeds the installation height of the light source 11, which results in a large space in the vertical direction, and is liable to interfere with other structures.

The first detection module 101, the light source 11, the reflecting mirror 12 and the detection camera 13 disclosed in the embodiment can be installed at the same height and all located above the detection carrier 210. By adjusting the angles of the reflecting mirror 12 and the light source 11, and the length of the interval between the reflecting mirror 12 and the detection camera 13, it is possible to satisfy the detection of the semiconductor element and obtain a clear picture, and reduce the space occupied in the vertical direction. The first distance is F, and the second distance is H, with the distance between the lens 132 of the detection camera 13 and the reflection point on the reflection mirror 12 being N. Where H and N are known values, then f=h/cos α.

The distance between the detection camera 13 and the detection carrier 210 is L when the mirror 12 is not present, and the incident angle of the light source 11 to the detection carrier 210 is still the first angle α. L/cos α=n+h/cos α. Wherein H < L.

Therefore, with the first detection module 101 disclosed in this embodiment, the light reflected by the detection carrier 210 is reflected again by the reflector 12, and is redirected to the horizontal direction, so that the installation height of the detection camera 13 is reduced, the structural compactness of the whole first detection module 101 is improved, the whole first detection module 101 is more stable, and the integration and the assembly are convenient.

It should be added that the arrangement principle of the second detection module 102 is basically similar to that of the first detection module 101, except that the second detection module 102 is located below the detection carrier 210 in the vertical direction. Therefore, after the first detection module 101 and the second detection module 102 respectively reduce the occupied space along the vertical direction, the whole detection device is equivalent to the reduced space, and the structure is more compact.

The first detection module 101 is described below by taking an example, and the assembly and the selection of the reflecting mirror 12 are described in detail first.

As shown in fig. 2, 4 and 5, in some embodiments, the first detection module 101 further includes a first base 21, a rotation shaft 22, an adjusting member 23 and a driving lever 24; the first base 21 is mounted on the detection platform 200, and the rotating shaft 22 is rotatably connected to the first base 21 and detachably connected to the reflecting mirror 12; one end of the adjusting piece 23 is connected with the rotating shaft 22, and the other end of the adjusting piece is penetrated through the first base 21 and is movably connected with the driving rod 24; the driving rod 24 is rotatably connected to the first base 21, and the driving rod 24 can rotate around its own axis to drive the adjusting member 23 to drive the rotating shaft 22 to rotate around the axis of the rotating shaft 22.

Further, the first detection module 101 further includes a support base 110, where the support base 110 includes a plate body 111 and support legs 112 disposed at four vertices of the plate body 111, and the four support legs 112 are all fixedly disposed on the detection platform 200. The light source 11, the reflecting mirror 12 and the detecting camera 13 are all installed on the supporting base 110, so as to be supported away from the detecting carrier plate 210 through the supporting base 110, thereby meeting the detection height. In the assembly of the reflector 12, the first base 21 comprises a transverse plate 211 and two vertical plates 212 fixedly arranged on two sides of the length direction of the transverse plate 211, the transverse plate 211 is fixedly arranged on the plate body 111 of the support base 110, one sides of the two vertical plates 212, which are away from the transverse plate 211, are provided with arc grooves 2121, two ends of the rotating shaft 22 are respectively arranged in the arc grooves 2121 on the same side, and the rotating shaft 22 is locked with the vertical plates 212 by utilizing arc buckles 213 so as to meet the rotating connection of the rotating shaft 22 relative to the first base 21. A clamping groove 221 is formed in the middle of the rotating shaft 22, and the reflecting mirror 12 is clamped in the clamping groove 221 and fixed by a screw.

Still further, the reflecting mirror 12 includes a frame 121 and lenses 122, the frame 121 has a mounting cavity for accommodating the lenses 122, and the middle portion of the frame 121 is clamped in the clamping groove 221, and then the frame 121 is fixed to the rotating shaft 22 by using screws. After the lens 122 is placed in the mounting cavity, limit baffles 123 are installed at four top corners of the lens holder 121 to prevent the lens 122 from falling out of the mounting cavity. The side wall of the frame 121 near the bottom of the mounting cavity is provided with an air vent 1211 to facilitate air extrusion during assembly of the lens 122 to ensure the accuracy of assembly of the lens 122. Meanwhile, a cut surface 222 is formed at a side of the rotation shaft 22 facing away from the catching groove 221 in a radial direction thereof so as to be fastened by the mounting screw.

In actual use, the driving rod 24 rotates around the axis thereof to drive the adjusting piece 23 to swing relative to the first base 21, the adjusting piece 23 drives the rotating shaft 22 to rotate relative to the first base 21, and the rotating shaft 22 can drive the reflecting mirror 12 to synchronously rotate, so as to adjust the installation angle of the reflecting mirror 12, thereby further improving the installation layout between the light source 11 and the detection camera 13 and improving the space occupied by the whole first detection module 101.

With continued reference to fig. 2, 4 and 5, as some specific embodiments thereof, the first base 21 is configured with a first elongated hole 2101 having a length extending in the second direction. The adjusting member 23 includes a connection arm 231, a moving block 232, and a coupling post, one end of the connection arm 231 is fixedly disposed on the rotation shaft 22, and the other end of the connection arm 231 is configured with a second long hole 2311 having a length extending in the first direction. The engagement post is coupled to the connection arm 231 and is coupled to the moving block 232 through the second elongated hole 2311 and the first elongated hole 2101, and the moving block 232 is screw-coupled to the driving rod 24. The moving block 232 is configured to move in the axial direction of the driving rod 24 in response to the screw transmission of the driving rod 24 to drive the link arm 231 to rotate about the axis of the rotating shaft 22 through the engagement post. The axial direction of the drive rod 24 is in the same direction as the second direction.

Wherein the two risers 212 are a first riser and a second riser, respectively, and the adjusting member 23 is mounted at the first riser. The first long hole 2101 is provided on the first vertical plate, and its length extends in the second direction. The connection arm 231 is located at a side of the first riser facing away from the second riser, and a second long hole 2311 extending in the first direction in length is provided at an end of the connection arm 231 facing away from the rotation shaft 22. The driving rod 24 is installed on one side of the first vertical plate facing the second vertical plate, and two fixing blocks 241 are fixedly arranged on the first vertical plate, and two ends of the driving rod 24 penetrate through the fixing blocks 241 on the same side respectively so as to support the driving rod 24 through the two fixing blocks 241. The moving block 232 is located between the two fixed blocks 241. One end of the engagement post, which is away from the connecting arm 231, sequentially passes through the second long hole 2311 and the first long hole 2101 to be connected with the moving block 232, and the first long hole 2101 and the second long hole 2311 are matched to form movement constraint on the engagement post.

During actual assembly, the driving rod 24 rotates around the axis thereof under the action of external force to drive the moving block 232 to move, the moving block 232 drives the connecting column to move, the connecting column contacts the hole wall of the second long hole 2311 to drive the connecting arm 231 to swing, and the connecting arm 231 drives the rotating shaft 22 to rotate, so that the installation angle of the reflecting mirror 12 is adjusted.

It should be noted that, in this embodiment, the angle adjustment is more prone to fine adjustment.

Illustratively, the length of the mirror 12 from the light source 11 to the detection camera 13 is greater than 80mm; and, in the third direction, the extension length of the mirror 12 is greater than 80mm. That is, when the mirror 12 is horizontally disposed (or parallel) with respect to the detection carrier 210, the length of the mirror 12 in the second direction is greater than 80mm, and the length of the mirror 12 in the third direction is greater than 80mm. In this arrangement, the length and width dimensions of the reflecting mirror 12 are limited, so that no matter what angle the light source 11 is incident on, the reflected light after passing through the detection carrier 210 can be reflected by the reflecting mirror 12 to the detection camera 13.

Further, the reflectivity of the mirror 12 is greater than 80%. By limiting the reflectivity of the reflecting mirror 12, the image reflected by the reflecting mirror 12 can be reflected to the detecting camera 13 more fully and clearly, and the definition of the image acquired by the detecting camera 13 is improved. Of course, the higher the reflectance of the mirror 12, the higher the sharpness of the reflected image.

Still further, the included angle of the reflecting mirror 12 relative to the first direction is between 20 degrees and 60 degrees, and the installation included angle of the light source 11 relative to the first direction is also between 20 degrees and 60 degrees. If the angle is too large, the space occupied by the whole detection module 100 is increased, but if the angle is too small, the definition of the picture may be affected. Therefore, the installation angles of the light source 11 and the reflecting mirror 12 are selected to be between 20 degrees and 60 degrees, so that the clear detection picture is obtained while the space is reduced, and the detection quality is ensured. Wherein the included angle of the reflecting mirror 12 relative to the first direction is larger than the included angle of the light source 11 relative to the first direction. In some specific embodiments, the included angle of the light source 11 is 20 degrees, 32 degrees, 45 degrees, or 60 degrees with respect to the first direction; the included angle of the mirror 12 with respect to the first direction is 60 degrees, 50 degrees, 29 degrees or 20 degrees. Among them, it may be preferable that the light source 11 has an included angle of 32 degrees with respect to the first direction, and the reflecting mirror 12 has an included angle of 29 degrees with respect to the first direction. It should be noted that the above degrees are merely illustrative, and there is no regular correspondence, and specific angle values may be obtained based on multiple experiments by those skilled in the art.

In summary, based on the preferred mounting angles of the light source 11 and the reflecting mirror 12, the maximum workpiece width combined with the product to be inspected is 250mm, and the height H of the optical axis of the inspection camera 13 from the inspection carrier plate 210 is substantially 250mm, and the aperture of the inspection camera 13 is 70mm. At this time, based on the perspective principle, in the present embodiment, the width of the mirror 12 in the third direction is greater than 110mm, and the length of the mirror 12 in the second direction is greater than 100mm, for example, 115mm, 126mm, etc.; meanwhile, the thickness of the reflecting mirror 12 is preferably greater than 5mm; of course, the thickness of the reflector 12 may be between 2mm and 10mm, and may be selected to be 4mm or 6mm in the shape selection. Based on this, it can be understood that the rectangular mirror 122 or the square mirror 122 is adopted for the mirror 12, and the constraints on the length and the width of the mirror 12 satisfy space reduction and clear images, so that the mirror 12 can not only ensure that the images of the product are totally reflected into the field of view of the detection camera 13, but also reduce the assembly interference between the mirror 12 and other structures, so as to ensure the assembly stability of the mirror 12.

Again, the assembly of the light source 11 will be described in detail.

As shown in fig. 2 and 5, in some embodiments, the detection module 100 further includes a second base 25 and a locking member; wherein the second base 25 is configured with a plurality of mounting holes 2501, and the plurality of mounting holes 2501 are arranged at intervals along the outgoing direction of the light source 11, each mounting hole 2501 is correspondingly equipped with a locking member, the locking member can be connected with the light source 11 through the mounting hole 2501, and the locking member can move within the mounting hole 2501. That is, the light source 11 is set apart from the support base 110 by the second base 25 to satisfy the installation height of the light source 11. The light source 11 itself has a light source housing to facilitate mating assembly with the retaining member, second base 25. Moreover, the plurality of mounting holes 2501 and the plurality of locking pieces cooperate to satisfy multi-point fixation between the light source 11 and the second base 25, thereby improving assembly reliability; meanwhile, since the plurality of mounting holes 2501 are arranged at intervals along the outgoing direction of the light source 11 so as to unify the above-mentioned points on a straight line, the mounting interference between the locking members is reduced.

Further, the mounting hole 2501 is provided as an arc-shaped hole. In this way, the mounting angle of the light source 11 with respect to the second base 25 is facilitated to be adjusted. It should be noted that, the angle adjustment generally occurs during the assembly process, and after the installation angle of the light source 11 is determined, no change will generally occur, and only the installation angle of the reflector 12 needs to be adjusted to meet the adjustment of the spatial layout.

With continued reference to fig. 2 and 5, in some embodiments, the second base 25 includes a mounting base 251, a support cantilever 252, an adjustment post 253, and a locking member; the mounting base 251 is configured with a third long hole 2511 having a length extending in the thickness direction of the detection carrier 210; the support cantilever 252 has at least two arms 2521 arranged opposite to each other along the third direction and spaced apart, each arm 2521 is configured with a mounting hole 2501 for connecting the light source 11, and one side of the support cantilever 252 facing away from the light source 11 is abutted against the mounting base 251; one end of the adjusting column 253 penetrates through the mounting base 251 and is connected to the supporting cantilever 252, and one end of the locking piece penetrates through the third long hole 2511 and is connected to the supporting cantilever 252; the adjusting column 253 can rotate around its own axis to drive the supporting cantilever 252 to move along the axial direction of the adjusting column 253 relative to the mounting base 251, the locking piece can move in the third long hole 2511, and the locking piece is used for locking the supporting cantilever 252 relative to the mounting base 251.

That is, the support cantilever 252 can be urged to move in the first direction with respect to the mounting base 251 by the arrangement of the adjustment column 253 to adjust the mounting height of the light source 11; in addition, during the moving process, the locking piece is located in the third long hole 2511, so that the locking piece is restrained along the width direction of the third long hole 2511 through the hole wall of the third long hole 2511, and the moving guide of the support cantilever 252 is met. After the support cantilever 252 is moved to the target height, the locking member is locked. The number of the corresponding third long holes 2511 is two, and the corresponding third long holes 2511 are arranged at intervals along the third direction, and a plurality of assembly holes are arranged on the support cantilever 252 at intervals along the length direction of the third long holes 2511 in a range corresponding to the third long holes 2511, one assembly hole is correspondingly provided with one locking piece, so that the assembly reliability is improved.

Referring to fig. 2 and 5, in actual use, two bending arms 255 are disposed at the top of the mounting base 251, the two bending arms 255 are arranged at intervals along the third direction, each bending arm 255 includes a vertical edge and a horizontal edge that are disposed at an angle and connected, the vertical edge is fixedly disposed on the mounting base 251, the horizontal edge is suspended above the supporting cantilever 252, and the adjusting column 253 passes through the horizontal edge and is in threaded transmission connection with the supporting cantilever 252, so as to realize movement of the supporting cantilever 252 along the first direction. Wherein, the bending arm 255 is provided with a round hole for the adjusting column 253 to pass through, and is rotatably connected with the adjusting column 253 to support the adjusting column 253. For example, when adjustment post 253 is rotated counterclockwise about its own axis, support cantilever 252 is caused to move upward in a first direction; the adjustment post 253 rotates clockwise about its own axis causing the support cantilever 252 to move downwardly in a first direction.

Further, the locking member is a bolt and nut fit, and when the mounting height of the light source 11 needs to be adjusted, the nut is unscrewed; and after the height is adjusted to the target height, screwing the nut.

With continued reference to fig. 2 and 5, further, the support arm 252 includes two arm bodies 2521 and a cross arm 2522 disposed between the two arm bodies 2521, where the cross arm 2522 and the two arm bodies 2521 are enclosed together to form a U shape; the light source 11 is mounted between two arms 2521, and two sets of mounting holes are provided on both sides of the bridge 2522 in the third direction. The mounting base 251 is in an L-shaped arrangement, the transverse edge of the mounting base 251 is fixedly arranged on the supporting base 110, the vertical edge of the mounting base 251 is provided with a third long hole 2511 for connecting a cross arm 2522 of the supporting cantilever 252, and the bending arm 255 is fixedly arranged on the top of the vertical edge of the mounting base 251. At least two fourth long holes 2512 spaced along the third direction are formed on the lateral edge of the mounting base 251, so as to adjust the position of the mounting base 251 relative to the support base 110; namely: the mounting base 251 can be finely tuned along the second direction relative to the support base 110 to change the distance between the light source 11 and the reflector 12, and is suitable for emitting light at different mounting angles.

In summary, the installation height of the light source 11 along the vertical direction can be adjusted to meet the adjustment of the space between the light source 11 and the detection carrier plate 210; meanwhile, the installation position of the light source 11 along the second direction can be adjusted to meet the adjustment of the distance between the light source 11 and the reflecting mirror 12 along the second direction. Thus, the adjustment of the incident angle of the light source 11 to the detection carrier 210 can be satisfied.

With continued reference to fig. 5, in some embodiments, the angle of the reflecting mirror 12 can be adjusted, and the angle of the light source 11 can be properly adjusted during the assembly of the detection module 100, so that the detection camera 13 can also be moved along the second direction to adjust the distance between the detection camera 13 and the reflecting mirror 12. Specifically, the first detecting module 101 further includes a camera moving mechanism 27, where a power output end of the camera moving mechanism 27 is connected to the detecting camera 13 to drive the detecting camera 13 to move along an optical axis direction (i.e. the second direction) of the detecting camera 13. The camera moving mechanism 27 is mounted on the supporting base 110, and a linear module is adopted, wherein a slide block on the linear module is connected with the detecting camera 13 through a base 28, and two spaced rib plates are arranged on the vertical edge of the base to improve the supporting performance.

Further, the detection camera 13 includes a camera body 131 and a lens 132, which are integrated on the above-mentioned base 28.

It should be added that the second detection module 102 is substantially similar to the first detection module 101, except that the first detection module 101 and the second detection module 102 are arranged in a staggered manner along the second direction. At the time of actual inspection, the first inspection module 101 and the second inspection module 102 together define an inspection path for semiconductor element movement inspection, which is along the second direction. The second detection module 102 is close to the start end of the detection path, the first detection module 101 is close to the end of the detection path, and the arrangement sequence of the light source 11, the reflecting mirror 12 and the detection camera 13 in the first detection module 101 is opposite to the arrangement sequence of the light source 11, the reflecting mirror 12 and the detection camera 13 in the second detection module 102. Because the second detecting module 102 is used for detecting the lower surface of the semiconductor device and the semiconductor device is placed on the detecting carrier 210, the second detecting module 102 can have a sufficient detecting height compared with the semiconductor device without the supporting base 110.

The semiconductor element is transferred to the start end of the inspection path and placed on the inspection carrier 210, the inspection carrier 210 moves gradually along the inspection path from the start end to the end, and the second inspection module 102 and the first inspection module 101 sequentially perform image acquisition, so as to satisfy inspection. Wherein, two position sensors are arranged at intervals on the detection path so as to trigger the first detection module 101 and the second detection module 102 respectively.

The test carrier 210 is made of glass, so that the lower surface of the semiconductor device is sufficiently exposed to the second test module 102 at the test window 2001 for testing the lower surface of the semiconductor device.

As shown in fig. 2 and 6, in actual use, the detection device further includes a first linear module 31 and two moving rails 32, where the two moving rails 32 are arranged at intervals along a third direction and are connected to the bottom of the detection carrier 210 through a plurality of sliders arranged at intervals; each of the sliders is fixed to the detection carrier 210 and slidably coupled to the moving rail 32. The power output end of the first linear module 31 is detachably connected with the detection carrier 210, so as to drive the detection carrier 210 to move along the second direction, thereby satisfying the detection of the upper and lower surfaces of the semiconductor device.

As shown in fig. 2, 6, 7 and 8, further, the first toothed plate 312 and the link driving mechanism 313 connected to the first toothed plate 312 are mounted on the slider of the first linear module 31, the detection carrier 210 is provided with the second toothed plate 331, and the link driving mechanism 313 can drive the first toothed plate 312 to move along the third direction to be engaged with and locked with the second toothed plate 331 or to be released and unlocked from the second toothed plate 331. When the first toothed plate 312 and the second toothed plate 331 are engaged and locked, the detection carrier 210 can move along with the sliding blocks of the first linear module 31 and gradually enter the detection areas of the first detection module 101 and the second detection module 102.

As shown in fig. 2 and fig. 6-8, the link driving mechanism 313 further includes a toothed plate cylinder 3131, a connecting block 3132, a connecting rod 3133 and a pushing plate 3134, the connecting block 3132 is connected with a piston rod of the toothed plate cylinder 3131, one end of the connecting rod 3133 is hinged to the connecting block 3132, the other end of the connecting rod 3133 is hinged to the pushing plate 3134, the connecting block 3132 and the pushing plate 3134 are both slidingly connected to a sliding block of the first linear module 31, and one side of the pushing plate 3134, which is away from the connecting rod 3133, is connected with the first toothed plate 312. The piston rod of the toothed plate cylinder 3131 stretches and contracts along the second direction to drive the connecting block 3132 to reciprocate along the second direction, and the connecting block 3132 drives the pushing plate 3134 to reciprocate along the third direction through the connecting rod 3133 so as to meet the engagement locking or release unlocking of the first toothed plate 312 and the second toothed plate 331. An electromagnet may be used to magnetically attract the connecting block 3132, so that the pushing plate 3134 is driven to move by the connecting rod 3133, so as to realize the movement of the first toothed plate 312 relative to the second toothed plate 331.

With reference to fig. 2, 6 and 7, in the inspection process, in order to ensure the flat lamination of the semiconductor device, the adjustment of the inspection conditions is satisfied. In some embodiments, the inspection apparatus further includes a capping mechanism 40, where the capping mechanism 40 is used to planarize the semiconductor device with respect to the inspection carrier 210 to eliminate inspection interference caused by product deformation. The capping mechanism 40 is mounted on the slider of the first linear module 31 and protrudes in the third direction so as to perform ballasting of the semiconductor element. Specifically, the capping mechanism 40 includes a capping carrier 41, where the capping carrier 41 can move along a first direction to press the semiconductor element onto the detection carrier 210.

The cover carrier 41 is also made of glass material, so that the upper surface of the semiconductor device is fully exposed to the first detecting module 101 at the detecting window 2001 for detecting the upper surface of the semiconductor device.

With continued reference to fig. 2, 6 and 7, further, the capping mechanism 40 further includes a driving source 44, a driving gear 45 and a driven rack 46, the driving source 44 is in transmission connection with the driving gear 45, the driving gear 45 is in meshed transmission with the driven rack 46, the length of the driven rack 46 extends along the first direction, and the driven rack 46 is connected with the capping carrier 41. Wherein the drive source 44 employs a motor. Meanwhile, the gland mechanism 40 further comprises a gland base 42 and a gland bracket 43 slidably connected to the gland base 42, the gland bracket 43 is arranged around the gland carrier 41, and the gland base 42 is mounted on the slider to support the gland carrier 41 through the gland bracket 43. The passive rack 46 is mounted on the gland bracket 43 and the drive source 44 is mounted on the gland base 42. Meanwhile, a spring 47 is further connected between the gland base 42 and the gland bracket 43 to protect the gland carrier 41.

In practical use, the capping mechanism 40 is located at the end of the inspection path, and after the semiconductor device is transported to the inspection carrier 210, the capping mechanism 40 moves to the beginning of the inspection path along the second direction under the action of the first linear module 31 and is located above the inspection carrier 210. Then, the rack cylinder 3131 is activated to drive the first rack 312 to move through the connection block 3132, the connection rod 3133 and the pushing plate 3134, so that the first rack 312 is engaged with and locked with the second rack 331. Then, the driving source 44 drives the driving gear 45 to rotate, so as to drive the gland bracket 43 to drive the gland carrier 41 to move downwards through the meshing transmission with the driven rack 46. The first linear module 31 can drive the gland carrier 41, the detection carrier 210 and the semiconductor element to synchronously move along the detection path, so as to realize the detection of the semiconductor element. After the inspection is completed, the driving source 44 is started to move the gland carrier 41 up away from the inspection carrier 210, and the toothed plate cylinder 3131 is also started to drive the first toothed plate 312 and the second toothed plate 331 to release and unlock.

The inspection apparatus in the present application will be described in detail below in terms of the inspection flow of the entire semiconductor device.

As shown in fig. 9 and 17, in some embodiments, the detection device further includes a plurality of trays 50 arranged at intervals, at least one of the plurality of trays 50 being a receiving tray 51, at least one being a waste tray 52, at least one further being a supply tray 53; moreover, the material receiving tray 51, the waste material tray 52 and the material feeding tray 53 respectively correspond to a material receiving station, a waste material station and a material feeding station, and two opposite guide rails which are arranged at intervals are arranged at each station, so that the material tray 50 can slide in or slide out along the corresponding guide rails. Meanwhile, a handle is arranged at the tail of each tray 50, so that the trays 50 can be replaced manually. The feeding tray 53 is used for placing semiconductor elements to be detected, the receiving tray 51 is used for placing qualified semiconductor elements after detection, and the waste tray 52 is used for placing unqualified semiconductor elements after detection.

In actual use, each tray 50 is configured with relief holes 501. The detecting device further comprises a positioning piece 54, a part of the positioning piece 54 can penetrate through the avoiding hole 501 to extend into the tray 50, and the positioning piece 54 can push the semiconductor element to move in the tray 50 under the action of external force driving so as to ensure that the semiconductor element is in place. Specifically, each tray 50 is rectangular, and at least one long side and at least one short side are provided with avoiding holes 501, and the avoiding holes 501 penetrate along the depth of the tray 50. The positioning member 54 is installed at the bottom of the tray 50 and partially extends from the escape hole 501 from bottom to top to satisfy the positioning of the semiconductor device. The positioning piece 54 can be lifted up and down in the vertical direction and can be linearly moved in the horizontal direction so as to meet the positioning of semiconductor elements of different specifications. Wherein the movement of the positioning member 54 is mainly achieved by a linear cylinder drive.

In some embodiments, the semiconductor devices in the tray 53 need to be transferred to the inspection module 100 (also referred to as an inspection station) after various processes. Therefore, a transfer robot is required for transferring the semiconductor element between the steps. Meanwhile, in actual use, when qualified semiconductor elements are placed on the receiving tray 51, dust-free paper needs to be placed between any two adjacent semiconductor elements to protect any two adjacent semiconductor elements, dust-free paper needs to be placed at the bottom of the receiving tray 51, then the semiconductor elements are stacked one by one, and dust-free paper is arranged between any two adjacent semiconductor elements. Therefore, the handling robot is also required for handling the dust-free paper. The first conveyance robot 61 is used for conveying the semiconductor element, and the second conveyance robot 62 is used for conveying the dust-free paper.

As shown in fig. 17, specifically, the detection platform 200 is further provided with a support beam 120, where the length of the support beam 120 extends along the third direction, and the first carrying robot 61 and the second carrying robot 62 are disposed at intervals and are both slidingly connected to the support beam 120, and are both capable of moving along the length direction of the support beam 120. To avoid interference between the two handling operations, the first handling robot 61 is disposed close to the feeding tray 53 and circulates between the feeding station and the detecting station; the second carrying robot 62 is disposed at a position close to the collecting tray 51 so as to circulate between a station for storing dust-free paper and a collecting station.

When the second conveyance robot 62 picks up the dust-free paper, the dust-free paper may be picked up from the feeding station or from another position, as long as the dust-free paper can be ensured to be placed between any two adjacent semiconductor elements at the receiving station. In addition, the structure of the supporting beam 120 is a mature technology, and is not an improvement point of the present application, so that a detailed description is omitted.

The structures of the first and

second conveyance robots

61 and 62 are described in detail below.

Because the thickness of the semiconductor element to be absorbed is small and the overall size is large, special attention is paid to stability in the process of carrying, so that the semiconductor element is prevented from falling off in the process of carrying, and the protection of the semiconductor element is improved. Based on this, as shown in fig. 10 and 17, in some embodiments, the first handling robot 61 includes a static platform frame 611, a voltage amplifier 612 and a static platform 613, the static platform frame 611 is slidably connected to the supporting beam 120, the static platform 613 is mounted on the static platform frame 611, and the static platform 613 is electrically connected to the voltage amplifier 612, and the voltage amplifier 612 can regulate the static voltage of the static platform 613.

That is, the electrostatic adsorption method is used to convey the semiconductor device. Since the projection area of the electrostatic stage 613 in the vertical direction is large, it can be substantially adapted to the size of the semiconductor element; therefore, the semiconductor element can form an entire contact state with the semiconductor element during adsorption, and the contact area between the semiconductor element and the semiconductor element is increased, so that stable adsorption of the semiconductor element is met, and the falling risk is reduced.

Further, since the semiconductor element and the dust-free paper are placed across each other, a paper ejection cylinder 614 is also mounted on the electrostatic stage frame 611, and the driving end of the paper ejection cylinder 614 can pass through the electrostatic stage 613 to press against the dust-free paper, so as to prevent the dust-free paper located in the collecting tray 51 from adhering to the semiconductor element or the electrostatic stage 613. Wherein, the electrostatic platform 613 is correspondingly provided with a through hole for the driving end of the paper ejection cylinder 614 to pass through, and the position of the through hole is matched with the position of the paper ejection cylinder 614; a gap is formed between the electrostatic stage frame 611 and the electrostatic stage 613 on the side facing away from the suction side. When the drive end of the top paper cylinder 614 does not need to press against the dust-free paper, it can retract within the gap or be flush with the electrostatic stage 613. The projection surface dimension of the electrostatic stage 613 in the vertical direction is larger than the planar dimension of the semiconductor element. In this way, the suction with the entire surface of the semiconductor element is ensured, and the suction is formed with the operation of the top paper cylinder 614. Wherein the number of top paper cylinders 614 is plural and spaced apart.

Meanwhile, because the dust-free paper is used for protecting the semiconductor element, the plane size of the dust-free paper is larger than that of the semiconductor element, so that the dust-free paper is not easy to carry, and the risk of falling off is more likely to exist. Based on this, as shown in fig. 11 and 17, the second conveyance robot 62 includes a suction frame 621, a plurality of suction members 622, and a power source, the suction frame 621 being slidably connected to the support beam 120, the plurality of suction members 622 being arranged at intervals in the suction frame 621 and being connected to the power source. Thus, the plurality of adsorbing members 622 are arranged at intervals to meet the requirement of a larger adsorption area, and the plurality of adsorbing members 622 are fixed at multiple points, so that the adsorption effect on the dust-free paper is improved on the basis of meeting the planar size of the dust-free paper. Wherein, the power source is the structure that is used for realizing negative pressure vacuum.

Wherein, the suction member 622 adopts a Bernoulli chuck to finish the suction of the dust-free paper in a non-contact manner. The Bernoulli sucker is more convenient for grabbing workpieces softly, and contact with dust-free paper is reduced to the greatest extent.

It should be added that the specific working principle of the bernoulli chuck is the prior art, and the bernoulli chuck does not belong to the invention point of the application, so that the specific working principle is not repeated.

To sum up, as shown in fig. 10 and 11, the first and

second transfer robots

61 and 62 need to be lifted and lowered in the vertical direction to satisfy the suction operation of the electrostatic stage 613 and the suction member 622. Thus, the first and

second transfer robots

61 and 62 each have a lifting mechanism 63, and the lifting mechanism 63 employs a linear cylinder or other linear driving module to be connected to the corresponding electrostatic stage frame 611 or suction frame 621 in each transfer robot by a follower slider. Further, in order to improve the assembly quality, an L-shaped assembly beam 64 is fixed between the electrostatic stage frame 611 and the corresponding slider, an L-shaped assembly beam 64 is also fixed between the suction frame 621 and the corresponding slider, the two assembly beams 64 have substantially the same structure, and a buffer is further mounted on the assembly beam 64. The lifting mechanism 63 of the first and

second handling robots

61 and 62 is provided with a slide seat 65 for cooperation with the support cross member 120 on a side facing away from the L-shaped mounting beam 64.

Further, the electrostatic stage frame 611 and the suction frame 621 are substantially identical, each including a cross frame beam 601 and a longitudinal frame beam 602, which are vertically disposed; the length of the longitudinal frame beam 602 is smaller than that of the transverse frame beam 601, and the longitudinal frame beam 602 is fixedly arranged at the bottom of the transverse frame beam 601.

In the electrostatic stage frame 611, a sheet metal bending member 603 is fixedly provided at a position at an end of the cross frame beam 601 to assemble a top paper cylinder 614 through the sheet metal bending member 603 and form a gap with the electrostatic stage 613. The structures of the two sheet metal bending parts 603 may be the same or different, for example, one sheet metal bending part 603 is arranged in a zigzag manner with an included angle of 90 degrees, and the other sheet metal bending part 603 is arranged in an inverted convex shape.

In the adsorption frame 621, the number of the longitudinal frame beams 602 is four, the number of the transverse frame beams 601 is two, and the four longitudinal frame beams 602 are uniformly distributed at intervals along the length direction of the transverse frame beams 601 so as to separate the transverse frame beams 601 into three spaced mounting sections, and each mounting section is provided with an adsorption piece 622; thus, in the present embodiment, the number of the adsorbing members 622 is six.

In terms of the entire inspection process of the semiconductor element, when the semiconductor element is placed on the supply tray 53, the position thereof needs to be positioned so that the first conveyance robot 61 starts conveyance. Thus, as shown in fig. 12 and 17, the detecting device further includes a visual positioning module 70, the visual positioning module 70 having a positioning camera 71, the positioning camera 71 being mounted above the feed tray 53. The semiconductor elements placed in the supply tray 53 are photographed by the positioning camera 71 to determine the positions of the semiconductor elements. The vision positioning module 70 further includes an illumination light source 11, a vision bracket 73 and an adjusting sliding table 74, wherein the illumination light source 11 and the positioning camera 71 are both installed on the adjusting sliding table 74, and are installed on the vision bracket 73 through the adjusting sliding table 74. The setting of the adjusting sliding table 74 is convenient for fine tuning the position of the positioning camera 71 relative to the semiconductor element, specifically, the adjusting sliding table 74 can rotate around the Z axis and the Y axis relative to the vision support 73, and the adjusting sliding table 74 can drive the positioning camera 71 to move along the Z axis and the X axis respectively, so as to fine tune the position of the positioning camera 71 relative to the semiconductor element. The Z-axis direction is the first direction, the Y-axis direction is the second direction, and the X-axis direction is the third direction. The bottom end of the visual support 73 is fixedly arranged on the detection platform 200 and is positioned on one side of the supporting beam 120, which is away from the carrying manipulator; the top end of the vision support 73 extends upward in the vertical direction, then extends toward the feed tray 53 in the second direction, and then extends downward in the vertical direction by a certain section; the adjustment slide 74 is suspended from the extended end of the vision bracket 73 by an engagement arm.

As shown in fig. 12, further, the adjustment slide 74 includes a reference block 741, a first adjustment block 742, and a second adjustment block 743; the reference block 741 is fixedly connected with the connecting arm; the first adjusting block 742 comprises a first connecting arm and a second connecting arm which are arranged at an angle and connected, the first connecting arm is lapped on the top of the reference block 741 and connected with the reference block 741, and the second connecting arm is positioned on one side of the reference block 741 away from the visual stand 73 and connected with the second adjusting block 743; the second adjustment block 743 is connected to the positioning camera 71. Wherein, the first connecting arm is provided with two first arc holes 7421, and the two first arc holes 7421 are concentrically arranged and radially arranged at intervals along the first connecting arm; meanwhile, two second arc-shaped holes 7431 are formed in both sides of the second adjusting block 743 along the third direction, and the two second arc-shaped holes 7431 are concentrically arranged and radially arranged at intervals. Such a setting facilitates adjustment of the mounting angle of the first adjustment block 742 with respect to the reference block 741 on a horizontal plane, and facilitates adjustment of the mounting angle of the second adjustment block 743 with respect to the first adjustment block 742 on a vertical plane, thereby achieving adjustment of the mounting angle of the positioning camera 71.

Still further, a first adjusting seat is connected to the second connecting arm of the first adjusting block 742, and is in threaded connection with the second adjusting block 743 through a first bolt, and the second adjusting block 743 is driven to move along the Z axis relative to the first adjusting block 742 by rotating the first bolt. The reference block 741 is connected to a second adjustment seat, and is screwed to the first adjustment block 742 by a second bolt, and the first adjustment block 742 is driven to move along the X-axis relative to the reference block 741 by rotating the second bolt.

When the angle does not meet the detection requirement after photographing and positioning the semiconductor element with respect to the position in the feed tray 53, the angle of the semiconductor element needs to be adjusted. Based on this, as shown in fig. 13, 14 and 17, in some embodiments, the inspection apparatus further includes an adjustment platform 80, where the adjustment platform 80 is disposed downstream of the feeding tray 53, and the first handling robot 61 may handle the semiconductor elements of the feeding tray 53 to the adjustment platform 80 to adjust the angles and positions of the semiconductor elements so as to meet the placement requirement of the inspection carrier 210. Specifically, the adjusting platform 80 includes a rotating mechanism 81, a translating mechanism 82 and an adjusting panel 83, the rotating mechanism 81 is connected to the bottom of the adjusting panel 83, the translating mechanism 82 is connected to the rotating mechanism 81, the translating mechanism 82 is used for driving the adjusting panel 83 to move along the second direction through the rotating mechanism 81, and the rotating mechanism 81 is used for driving the adjusting panel 83 to rotate around the central axis of the adjusting panel 83.

Specifically, the rotation mechanism 81 includes a rotation motor 811, a rotation driving wheel 812, a rotation driven wheel 813, and a rotation timing belt 814, wherein a motor shaft of the rotation motor 811 is in transmission connection with the rotation driving wheel 812, and the rotation timing belt 814 is tensioned between the rotation driving wheel 812 and the rotation driven wheel 813 so as to drive the rotation driven wheel 813 to rotate through the rotation driving wheel 812. The rotation driven wheel 813 is connected to the adjustment panel 83 through a disc to drive the adjustment panel 83 to rotate synchronously. The housing of the rotary motor 811 is fixed to a support plate 84, the support plate 84 is connected to the translation mechanism 82, and the support plate 84 is provided with a shaft protruding upward to be rotatably connected to the rotary driven wheel 813. The support plate 84 is provided with a photoelectric switch and the disk is provided with a contact piece extending therefrom so as to be matched with the photoelectric switch. The diameter of the rotary driving wheel 812 is smaller than that of the rotary driven wheel 813, so that the rotary synchronous belt 814 can be tensioned better, and the transmission stability is improved.

Meanwhile, the translation mechanism 82 includes a translation motor 821, a first synchronous belt group 822, a second synchronous belt group 823 and a linking substrate 824, the linking substrate 824 and the translation motor 821 are both mounted on the detection platform 200, a motor shaft of the translation motor 821 is in transmission connection with the first synchronous belt group 822, the first synchronous belt group 822 is in transmission connection with the second synchronous belt group 823, and the support plate 84 is connected with the first synchronous belt group 822 through a sliding support block 85 so as to satisfy the linear movement of the support plate 84. The first synchronous belt set 822 includes a first driving wheel 8221, a first driven wheel 8222 and a first driving belt 8223, the first driving wheel 8221 is in driving connection with a motor shaft of the translation motor 821, and the first driving belt 8223 is tensioned between the first driving wheel 8221 and the first driven wheel 8222. The second synchronous belt set 823 comprises a second driving wheel 8231, a second driven wheel 8232 and a second driving belt, the second driving wheel 8231 is in transmission connection with the first driven wheel 8232 through a rotating shaft, the second driving belt is tensioned between the second driving wheel 8231 and the second driven wheel 8232, and the sliding supporting block 85 is connected with the second driving belt. The engagement substrate 824 is configured with a rotation hole for the rotation shaft to pass through, and the rotation shaft is rotatably connected with the engagement substrate 824 through a bearing. A sliding support rail 86 is disposed on a side of the engagement substrate 824 facing away from the first synchronization belt set 822, and a sliding support block 85 is slidably connected to the sliding support rail 86, so as to support and move the sliding support block 85. Wherein, the number of the sliding supporting blocks 85 is at least two, and one sliding supporting block 85 is connected with the second synchronous belt 8233 and is in sliding connection with the sliding supporting rail 86; the other sliding support block 85 is connected to one side of the support plate 84 facing away from the adjustment panel 83 and is slidably connected to the sliding support rail 86; in this way, the support to the support plate 84 can be improved.

In actual use, after the first carrying manipulator 61 drives the semiconductor element to move from the feeding tray 53 to the adjustment panel 83, based on the position captured by the positioning camera 71, the controller can control the translation motor 821 and the rotation motor 811 to move respectively so as to meet the angle and position adjustment of the adjustment panel 83, so that the semiconductor element thereon reaches the target position and angle; then, the first handling robot 61 is started again to transfer the semiconductor device onto the inspection carrier 210.

Because the press-fitting operation of the pressing carrier 41 and the inspection carrier 210 is required when the semiconductor element is inspected on the inspection carrier 210, both the upper surface and the lower surface of the semiconductor element need to be cleaned (including dust removal and static electricity removal) before press-fitting to prevent the impurity from causing damage to the semiconductor element under the action of the pressing force. Based on this, in some embodiments, as shown in fig. 15 and 17, the detection apparatus further includes a dust removing mechanism 90, the dust removing mechanism 90 being disposed downstream of the adjustment platform 80. The dust removing mechanism 90 includes a first dust removing component 91 and a second dust removing component 92, and the first dust removing component 91 and the second dust removing component 92 are respectively disposed on two sides of the detection carrier plate 210 along the third direction. The first dust removing assembly 91 is used for cleaning the lower surface of the semiconductor element, and the second dust removing assembly 92 is used for cleaning the upper surface of the semiconductor element.

Specifically, the first dust removing assembly 91 and the second dust removing assembly 92 each include an air knife 9011 and an ion air bar 9012, and the air knives 9011 are staggered along the ion air bar 9012 along a third direction, so as to perform multi-angle dust removal and static electricity removal (i.e. cleaning) on the semiconductor element through airflow and current effects. Meanwhile, the first dust removing assembly 91 and the second dust removing assembly 92 further include an integrated base 93 to satisfy the support and integrated assembly of the air knife 9011 and the ion air bar 9012. In actual use, the second dust removing assembly 92 further includes a second linear module 921, a suspension arm 922 connected to the second linear module 921, and a moving guide bracket 923, where the second linear module 921 and the moving guide bracket 923 are arranged at intervals along the second direction, one end of the integrated base 93 in the second dust removing assembly 92 is connected to the suspension arm 922, and the other end is connected to the moving guide bracket 923 through a sliding block. In this way, the air knife 9011 and the ion air bar 9012 in the second dust removal component 92 can reciprocate along the third direction under the power of the second linear module 921, so as to satisfy the cleaning operation of the upper surface of the semiconductor element.

It should be added that the working principles of how the air knife 9011 performs dust removal through air flow blowing and how the ion air bar 9012 performs static removal all belong to the prior art, and do not belong to the invention point of the present application, so that the description is omitted.

Further, when cleaning the upper surface of the semiconductor device, the semiconductor device needs to be fixed relative to the inspection carrier 210 to prevent the semiconductor device from being deviated or separated under the action of the second dust removing component 92. Based on this, as shown in fig. 16 and 17, the inspection apparatus provided in the present embodiment further includes a pressing mechanism 130 for pressing the semiconductor element against the inspection carrier 210. Specifically, the pressing mechanism 130 includes an integrated board 1301 and a plurality of pressing arms 1302, and the plurality of pressing arms 1302 are arranged at intervals along the second direction and connected to the integrated board 1301. The integrated board 1301 can move along the first direction and the third direction, so as to drive the plurality of pressing arms 1302 to move synchronously, and the plurality of pressing arms 1302 are used for pressing on the semiconductor element.

Further, the pressing mechanism 130 includes a first cylinder 1303, a pressing support plate 1304, and a second cylinder 1305, the first cylinder 1303 being mounted on the inspection platform 200 and connected to the pressing support plate 1304, and the second cylinder 1305 being mounted on the pressing support plate 1304 and connected to the integrated board 1301. As such, the first cylinder 1303 drives the pressing support plate 1304 to move in the first direction, and the second cylinder 1305 drives the integrated plate 1301 to move in the third direction, so as to satisfy the pressing of the plurality of pressing arms 1302 to the semiconductor element. After the plurality of pressing arms 1302 compress the semiconductor device on the test carrier 210, the second dust removing assembly 92 is started, so that the air knife 9011 and the ion air bar 9012 in the second dust removing assembly 92 can reciprocate along the third direction under the power action of the second linear module 921, so as to satisfy the cleaning operation of the upper surface of the semiconductor device. After the upper surface cleaning is completed, the first cylinder 1303 and the second cylinder 1305 are activated again, respectively, to urge the plurality of pressing arms 1302 back to the safe positions.

In actual use, when the first linear module 31 drives the detection carrier 210 to drive the semiconductor element to move along the second direction, and the semiconductor element passes through the first detection module 101 and the second detection module 102, the position sensor on the detection path is triggered in sequence, the signal processing center obtains the moving speed and position of the semiconductor element according to the grating ruler signal installed on the detection platform 200, and after integration, the moving signal is sent to the image acquisition card, and the detection camera 13 scans images with specific frequency and line number. All the patterns are processed by the image card to form a complete product image, and the complete product image is sent to vision detection software for defect analysis. In order to meet the requirement of more comprehensive detection data, the semiconductor element performs scanning detection on the product on the detection path passing in and out of the detection area, and when the product enters the detection area along the detection path for the first time, the gland carrier 41 in the gland mechanism 40 is positioned above the semiconductor element and is not in direct contact with the product, so that defects such as warping, deformation, broken line and the like of the product can be effectively detected through the scanning structure. The product is returned along the inspection path for a second inspection, and before entering the inspection area, the capping carrier 41 in the capping mechanism 40 moves down to press the semiconductor element, and then moves back into the inspection area. The detection section can eliminate the interference caused by the deformation of the semiconductor element, thereby effectively detecting the defects of the semiconductor element such as color change, dirt, broken line, pinholes and the like. Thus, the quality of the semiconductor element is ensured by the two detections of the reciprocating movement along the detection path.

As shown in fig. 18, an embodiment of the present application further provides a detection method for detecting a semiconductor element, which is operated based on the detection device, and the detection method includes the following steps:

adjusting the angle of the reflecting mirror 12 relative to the first direction, and/or adjusting the position of the detecting camera 13 along the optical axis direction thereof, wherein the optical axis direction is the second direction;

placing a material to be detected (i.e., the semiconductor element) on the detection carrier plate 210, driving the detection carrier plate 210 to move along a second direction, sequentially passing through the second detection module 102 and the first detection module 101, and acquiring first image information of the semiconductor element during the movement of the detection carrier plate 210 by each detection camera 13;

driving the detection carrier plate 210 to reversely move along the second direction and sequentially passing through the first detection module 101 and the second detection module 102, wherein each detection camera 13 acquires second image information of the semiconductor element of the detection carrier plate 210 in the moving process;

the first image information and the second image information are analyzed and processed to acquire defect information of the semiconductor element.

Wherein, according to actual needs, only the angle of the reflecting mirror 12 relative to the first direction can be selected to be adjusted, or only the position of the detecting camera 13 along the second direction can be selected to be adjusted; of course, the two may be adjusted simultaneously. It should be noted that, the adjustment may occur before the semiconductor device moves into the inspection areas of the two inspection modules 100; alternatively, the semiconductor element may be moved into the inspection area so as to adjust the mirror 12 or the inspection camera 13, and then moved to the start end of the inspection path to perform inspection again. Whichever mode is selected, it is sufficient to be able to meet the detection of the semiconductor element. In addition, the mounting angle of the light source 11 may be adjusted when the detection device is assembled, in a manner described in detail above.

Specifically, the whole process of the semiconductor device inspection is as follows:

and (3) manual discharging: the operator places the semiconductor element to be inspected in the supply tray 53.

Placing the bottom dust-free paper: the second carrying manipulator 62 moves, and the first piece of dust-free paper in the dust-free paper magazine is sucked by the plurality of suction members 622 and placed in the receiving tray 51; the code reader on the second carrying manipulator 62 finishes the code reading of the dust-free paper in the moving process, and the positioning camera 71 in the visual positioning module 70 photographs the semiconductor elements in the feeding tray 53 to obtain the attitude and position of the product.

Carrying a semiconductor element: the first carrying robot 61 is started, and the semiconductor element in the feed tray 53 is sucked up by the electrostatic stage 613 and placed on the adjustment panel 83; then, according to the requirement of the actual detection position, the angle and the position of the adjusting panel 83 are adjusted by the rotating mechanism 81 and the shifting mechanism 82 so as to meet the position compensation of the semiconductor element; at this time, the second conveyance robot 62 sucks the second dust-free paper, and conveys it to the safe position to wait.

Cleaning the lower surface: the first handling robot 61 is started again to adsorb the semiconductor element after the position compensation and drive the semiconductor element to move towards the direction close to the inspection station, and in the moving process, the first dust removing assembly 91 is used to clean the lower surface of the semiconductor element and place the cleaned semiconductor element on the inspection carrier 210. The detection carrier 210 is located at the beginning of the detection path.

Cleaning the upper surface: the pressing mechanism 130 is started to press and fix the semiconductor element relative to the detection carrier plate 210 by using a plurality of pressing arms 1302, and then the second dust removing assembly 92 is started to enable the air knife 9011 and the ion air bar 9012 to move along a third direction, so that the upper surface of the semiconductor element is cleaned (including dust removal and static electricity removal); after cleaning, the plurality of hold-down arms 1302 return to the original position.

Defect detection: the first linear module 31 is started to enable the sliding block to drive the first toothed plate 312 and the capping mechanism 40 to move to the starting end of the detection path; the toothed plate cylinder 3131 is started to drive the first toothed plate 312 to move so as to be engaged and locked with the second toothed plate 331, so that the connection between the sliding block and the detection carrier 210 is met; the gland carrier 41 in the gland mechanism 40 moves downwards to be close to the detection carrier 210, but is not in contact with and pressed against the semiconductor element; then, the first linear module 31 drives the capping mechanism 40, the detection carrier 210 and the semiconductor element to gradually enter the detection area along the detection path through the sliding block so as to perform the first detection and record the first image information; when the semiconductor element moves to the end of the detection path, the gland carrier 41 moves downwards to enable the semiconductor element to be pressed flatly, and then moves reversely along the detection path under the action of the first linear module 31 to perform second detection and record second image information; thus, the detection of the lower surface and the lower surface of the semiconductor element in different states can be satisfied.

And (3) replying: after the detection is completed, the gland carrier 41 moves upwards to separate from the semiconductor element, the first toothed plate 312 and the second toothed plate 331 are released and unlocked, and the first linear module 31 drives the gland mechanism 40 and the first toothed plate 312 to move towards the termination end along the detection path for homing; then, the first carrying robot 61 moves down to adsorb the inspected semiconductor element and carries it to the receiving tray 51; at this time, the second carrying robot 62 carrying the second piece of dust-free paper is started to place the dust-free paper above the semiconductor element; if the waste is not acceptable, the waste is placed on the waste tray 52.

Image processing: after the first image information and the second image information are recorded by the detection camera 13, the image information is analyzed and processed by the vision processing system to obtain defect information of the semiconductor element, a drawing paper is drawn, and data can be displayed on a display of an upper computer in real time and transmitted to a server.

And performing the above operation until the defect detection of all the semiconductor elements is completed.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of the present application is to be determined by the following claims.

Claims

1. The detection device is characterized by comprising a detection platform (200) and a detection module (100);

the detection platform (200) is provided with a detection window (2001) for placing a semiconductor element, and a detection carrier plate (210) is arranged at the detection window (2001); the detection module (100) is mounted on the detection platform (200), and the detection modules (100) are arranged on two sides of the detection carrier plate (210) along the thickness direction of the detection carrier plate;

the detection module (100) has a light source (11), a mirror (12) and a detection camera (13), the detection camera (13) being configured to obtain a detection image of the semiconductor element in response to the mirror (12) based on a reflection of material by the light source (11).

2. The detection device according to claim 1, characterized in that the light source (11) and the mirror (12) are each arranged at an angle to the first direction and at a first angle α to the first direction;

taking the distance between the incident point of the light source (11) relative to the detection carrier plate (210) and the reflecting point on the reflecting mirror (12) as a first interval, and taking the distance from the optical axis of the detection camera (13) to the detection carrier plate (210) as a second interval;

the ratio of the second spacing to the first spacing is cos alpha.

3. The detection device according to claim 2, characterized in that the length of the mirror (12) from the light source (11) to the detection camera (13) is greater than 80mm; and/or

In a third direction, the extension of the mirror (12) is greater than 80mm; wherein the third direction is arranged at an angle to the first direction and to the optical axis of the detection camera (13); and/or

The angle value of the first angle alpha is between 20 and 60 degrees; and/or the reflectivity of the mirror (12) is greater than 80%.

4. The detection device according to claim 1, wherein the detection module (100) further comprises a first base (21), a rotation shaft (22), an adjusting member (23) and a driving lever (24);

The first base (21) is mounted on the detection platform (200), and the rotating shaft (22) is rotatably connected to the first base (21) and detachably connected with the reflecting mirror (12); one end of the adjusting piece (23) is connected with the rotating shaft (22), and the other end of the adjusting piece is penetrated through the first base (21) and is movably connected with the driving rod (24); the driving rod (24) is rotatably connected to the first base (21), and the driving rod (24) can rotate around the axis of the driving rod, so that the adjusting piece (23) is driven to drive the rotating shaft (22) to rotate around the axis of the rotating shaft (22).

5. The detection device according to claim 4, characterized in that the first base (21) is configured with a first elongated hole (2101) extending in length along the axial direction of the driving rod (24);

the adjusting piece (23) comprises a connecting arm (231), a moving block (232) and a connecting column, one end of the connecting arm (231) is fixedly arranged on the rotating shaft (22), and a second long hole (2311) with the length extending along the thickness direction of the detection carrier plate (210) is formed at the other end of the connecting arm (231); the engagement post is connected to the connection arm (231) and connected to the moving block (232) through the second long hole (2311) and the first long hole (2101), and the moving block (232) is connected to the driving rod (24) in a threaded manner;

The moving block (232) is configured to move in the axial direction of the driving rod (24) in response to the threaded transmission of the driving rod (24) so as to drive the connecting arm (231) to rotate around the axis of the rotating shaft (22) through the engagement post.

6. The detection device according to claim 1, wherein the detection module (100) further comprises a second base (25) and a locking member;

the second base (25) is configured with a plurality of mounting holes (2501), and the plurality of mounting holes (2501) are arranged at intervals along the emission direction of the light source (11); each mounting hole (2501) is correspondingly provided with a locking piece, the locking piece is connected with the light source (11) through the mounting hole (2501), and the locking piece can move in the mounting hole (2501).

7. The detection device according to claim 6, wherein the second base (25) comprises:

a mounting base (251) having a third long hole (2511) with a length extending in the thickness direction of the detection carrier plate (210);

a support cantilever (252) having at least two arm bodies (2521) arranged at an opposite interval in a third direction, each of the arm bodies (2521) being configured with the mounting hole (2501) for connecting the light source (11); one side of the supporting cantilever (252) facing away from the light source (11) is abutted against the mounting base body (251);

An adjusting column (253), one end of which is penetrated through the mounting base (251) and is connected with the supporting cantilever (252); and

a locking member having one end connected to the support cantilever (252) through the third long hole (2511);

the adjusting column (253) can rotate around the axis of the adjusting column, so that the supporting cantilever (252) is driven to move along the axial direction of the adjusting column (253) relative to the mounting base (251), the locking piece can move in the third long hole (2511), and the locking piece is used for locking the supporting cantilever (252) relative to the mounting base (251).

8. The detection device according to claim 1, wherein the detection module (100) further comprises a camera moving mechanism (27), and a power output end of the camera moving mechanism (27) is connected with the corresponding detection camera (13) so as to drive the detection camera (13) to move along the optical axis direction of the detection camera (13).

9. The detection device according to claim 1, wherein the number of detection modules (100) is two, a first detection module (101) and a second detection module (102), respectively; the first detection module (101) and the second detection module (102) jointly define a detection path for movement of the semiconductor element, and the first detection module (101) and the second detection module (102) are staggered on the detection path;

The arrangement sequence of the light source (11), the reflecting mirror (12) and the detection camera (13) in the first detection module (101) is opposite to the arrangement sequence of the light source (11), the reflecting mirror (12) and the detection camera (13) in the second detection module (102).

10. The inspection apparatus according to claim 1, characterized in that the inspection apparatus comprises a pressing mechanism (130), the pressing mechanism (130) being configured to press an edge of the semiconductor element against the inspection carrier board (210); and/or

The detection platform (200) further comprises a capping mechanism (40), the capping mechanism (40) is provided with a capping carrier plate (41), and the capping carrier plate (41) is used for flattening the semiconductor element.

11. The detection device according to claim 1, further comprising a dust removal mechanism (90), the dust removal mechanism (90) being arranged upstream of the detection platform (200);

the dust removal mechanism (90) comprises a first dust removal component (91) and a second dust removal component (92), the first dust removal component (91) and the second dust removal component (92) are arranged in a staggered mode along a first direction, the first dust removal component (91) is used for cleaning the lower surface of the semiconductor element, and the second dust removal component (92) is used for cleaning the upper surface of the semiconductor element.

12. A test method for testing a semiconductor element, characterized in that it is operated based on a test device according to any one of claims 1 to 11, said test device having a first test module (101) and a second test module (102) arranged at intervals along a second direction; the detection method comprises the following steps:

adjusting the angle of the reflecting mirror (12) relative to the first direction and/or adjusting the position of the detection camera (13) along the self optical axis direction, wherein the optical axis direction is the second direction;

placing a material to be detected on a detection carrier plate (210), driving the detection carrier plate (210) to move along a second direction, sequentially passing through the second detection module (102) and the first detection module (101), and acquiring first image information of the material to be detected by the detection carrier plate in the moving process by each detection camera (13);

the detection carrier plate (210) is driven to reversely move along a second direction and sequentially pass through the first detection module (101) and the second detection module (102), and each detection camera (13) acquires second image information of a material to be detected of the detection carrier plate (210) in the moving process;

13. The detection method according to claim 12, characterized in that the first detection module (101) and the second detection module (102) together define a detection path, the detection path having a start end and a stop end;

the material to be detected is placed on the detection carrier plate (210), and the detection carrier plate (210) is driven to move along a second direction, and the material to be detected sequentially passes through the second detection module (102) and the first detection module (101) comprises:

the detection carrier plate (210) is positioned at the initial end of the detection path,

the gland mechanism (40) moves to the initial end of the detection path and is connected with the detection carrier plate (210), and the gland mechanism (40) drives the detection carrier plate (210) to move to the final end of the detection path along the second direction.

14. The detection method according to claim 13, wherein the capping mechanism (40) comprises a capping carrier plate (41); the driving the detection carrier plate (210) to reversely move along the second direction and sequentially pass through the first detection module (101) and the second detection module (102) includes:

the gland carrier plate (41) moves downwards relative to the detection carrier plate (210) to enable materials to be detected to be pressed flatly, and the gland mechanism (40) drives the detection carrier plate (210) to reversely move to the starting end of the detection path along the second direction.

15. The method of claim 12, wherein placing the material to be inspected on the inspection carrier plate (210) comprises;

cleaning the lower surface of the material to be detected, and placing the cleaned material to be detected on the detection carrier plate (210);

pressing and fixing the material to be detected relative to the detection carrier plate (210), and starting the second dust removing assembly (92) to enable the air knife (9011) and the ion air bar (9012) to move along a third direction so as to clean the upper surface of the material to be detected;