CN116367427A - Alignment method of CCD drilling machine and printed circuit board - Google Patents
Alignment method of CCD drilling machine and printed circuit board Download PDFInfo
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- CN116367427A CN116367427A CN202310228003.XA CN202310228003A CN116367427A CN 116367427 A CN116367427 A CN 116367427A CN 202310228003 A CN202310228003 A CN 202310228003A CN 116367427 A CN116367427 A CN 116367427A
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- 238000005553 drilling Methods 0.000 title claims abstract description 113
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000000608 laser ablation Methods 0.000 claims abstract description 27
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- 229910052802 copper Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
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Abstract
The invention discloses an alignment method of a CCD (charge coupled device) drilling machine and a printed circuit board, wherein the alignment method of the CCD drilling machine comprises the following steps: obtaining a plate to be aligned; the plate to be aligned comprises an inner plate and an outer plate which are arranged in a fitting manner; laser ablation is carried out on preset positions of the outer layer plate through a CCD drilling machine so as to expose a plurality of bonding pads on the inner layer plate; and scanning a plurality of bonding pads through the CCD drilling machine, and aligning the plate to be aligned. Through the mode, the alignment precision of the CCD drilling machine can be improved.
Description
Technical Field
The invention is applied to the technical field of alignment of drilling machines, in particular to an alignment method of a CCD drilling machine and a printed circuit board.
Background
Along with the high-speed development of the electronic industry, the PCB industry is developed towards high multilayer, small-spacing and dense circuits, and the development trend makes the design party bring requirements for the alignment of PCB precision.
At present, single angle or local hole deviation of the Kobang hole is frequently generated in the Kobang hole processed by the drilling technology, when the phenomenon that a drilling machine scans a CCD target hole is found in the follow-up of the field processing, burrs and gaps exist on the wall of the target hole, the precision of the drilling machine scanning and grabbing the target hole is reduced, and then the generated pre-expansion and contraction drilling belt is influenced, and the hole position precision capability of drilling is influenced.
Disclosure of Invention
The invention provides an alignment method of a CCD (charge coupled device) drilling machine and a printed circuit board, which are used for solving the problem of low precision of target hole sweeping and grabbing of the drilling machine.
In order to solve the technical problems, the invention provides a method for aligning a CCD drilling machine, which comprises the following steps: obtaining a plate to be aligned; the plate to be aligned comprises an inner plate and an outer plate which are arranged in a fitting manner; laser ablation is carried out on preset positions of the outer layer plate through a CCD drilling machine so as to expose a plurality of bonding pads on the inner layer plate; and scanning a plurality of bonding pads through the CCD drilling machine, and aligning the plate to be aligned.
The outer-layer plate comprises a dielectric layer and a metal layer which are arranged in a bonding mode, and the dielectric layer and the inner-layer plate are arranged in a bonding mode; the step of laser ablating preset positions of the outer layer plate through the CCD drilling machine to expose a plurality of bonding pads on the inner layer plate comprises the following steps: covering a corrosion-resistant film on the metal layer on one side of the outer layer plate far away from the inner layer plate, and exposing the preset position; etching the preset position to prepare a plurality of initial positioning holes at the preset position; and (3) carrying out laser ablation on the preset positions based on the positions of the initial positioning holes through a CCD drilling machine until a plurality of bonding pads on the inner layer plate are exposed correspondingly.
The step of carrying out laser ablation on the preset positions of the outer layer plate based on the positions of the initial positioning holes through the CCD drilling machine until a plurality of bonding pads on the exposed inner layer plate are corresponding comprises the following steps: scanning the positions of the initial positioning holes through a CCD drilling machine to position preset positions; and (3) carrying out laser ablation on each initial positioning hole at a preset position through a CCD (charge coupled device) drilling machine until a plurality of bonding pads on the inner layer plate are exposed correspondingly.
Wherein the plurality of bonding pads are formed at the edge of the inner panel and/or the middle area of the inner panel.
The step of scanning a plurality of bonding pads through a CCD drilling machine to align the plate to be aligned comprises the following steps: scanning a plurality of bonding pads through a CCD drilling machine to obtain actual position information of each bonding pad; and in response to the deviation between the actual position information of each bonding pad and the corresponding target position information being within a deviation range, aligning the plate to be aligned based on the actual position information of each bonding pad.
Wherein the step of scanning actual position information of the plurality of pads by the CCD drill includes:
scanning actual position information of a preset number of bonding pads in the plurality of bonding pads through a CCD drilling machine; the step of aligning the board to be aligned based on the actual position information of each bonding pad includes: and in response to the deviation between the actual position information of the preset number of bonding pads and the corresponding target position information being in a deviation range, aligning the plate to be aligned based on the actual position information of the preset number of bonding pads.
Wherein the step of scanning actual position information of the plurality of pads by the CCD drill further comprises: multiple overlapping and cross scanning are carried out on the plurality of bonding pads through the CCD drilling machine until the actual position information of each bonding pad is obtained; wherein, the CCD rig scans a preset number of bonding pads each time.
The position information comprises center point coordinates, a connecting line angle and a contraction-expansion ratio.
The step of scanning the plurality of bonding pads through the CCD drilling machine to align the plate to be aligned comprises the following steps: and preparing the printed circuit board based on the aligned plate to be aligned.
In order to solve the technical problems, the invention also provides a printed circuit board which is prepared after the alignment method of the CCD drilling machine is adopted for alignment.
In order to solve the technical problems, the alignment method of the CCD drilling machine disclosed by the invention is used for carrying out laser ablation on the preset position of the outer layer plate through the CCD drilling machine so as to expose a plurality of bonding pads on the inner layer plate, scanning the bonding pads through the CCD drilling machine and aligning the plate to be aligned, so that phenomena of burrs, gaps and the like caused by mechanical drilling can be avoided by utilizing laser ablation, the hole wall of a blind hole of the exposed bonding pad on the outer layer plate is smoother and clearer, the scanning precision of the CCD drilling machine is further improved, the interference of the phenomena of burrs, gaps and the like on the scanning of the CCD drilling machine is reduced, and the laser scanning precision capability of the CCD drilling machine is effectively improved. In addition, the drilling and positioning scanning are performed by using the CCD drilling machine, so that the occurrence of the condition of replacing the instrument is reduced in the alignment process, and the alignment efficiency is improved.
Drawings
FIG. 1 is a schematic flow chart of an embodiment of a positioning method of a CCD drilling machine provided by the invention;
FIG. 2 is a schematic flow chart of another embodiment of the alignment method of the CCD drilling machine provided by the invention;
fig. 3 is a schematic distribution diagram of an embodiment of a plurality of pads of an inner panel.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are intended to fall within the scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present invention, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
Referring to fig. 1, fig. 1 is a flow chart of an embodiment of a positioning method of a CCD drilling machine according to the present invention.
Step S11: obtaining a plate to be aligned; wherein, wait to counterpoint the plate and including the inlayer plate and the skin plate that the laminating set up.
Obtain including laminating the interior plate that sets up and treat counterpoint plate of outer plate. In a specific application scenario, the plate to be aligned may include an inner plate and an outer plate that are disposed in a fitting manner; in a specific application scenario, the plate to be aligned may include a first outer plate, an inner plate and a second outer plate that are disposed in a fitting manner, which is specifically set based on practical situations, and is not limited herein.
The inner panel may comprise a single layer substrate or a multi-layer panel. In one specific application scenario, when the inner layer plate comprises a single-layer substrate, the inner layer plate can comprise a copper substrate, an aluminum substrate, a silver substrate or an alloy substrate and the like, and in another specific application scenario, when the inner layer plate comprises an outer layer plate, the inner layer plate can be formed by sequentially laminating and attaching at least one dielectric layer and at least one metal layer.
Wherein, a plurality of bonding pads are formed on one side of the inner layer plate close to the outer layer plate. The bonding pad is used for performing alignment scanning of the CCD drilling machine. CCD (Charge Coupled Devices) is a charge coupled device, which is a silicon chip for detecting light, and the change of a semiconductor potential well is generated and controlled by clock pulse voltage, so that the solid-state electronic device for storing and transmitting charge information is realized. The CCD has the advantages of small volume, high resolution, high precision, good stability, vibration resistance, electromagnetic interference resistance and the like.
Step S12: and carrying out laser ablation on preset positions of the outer layer plate through a CCD drilling machine so as to expose a plurality of bonding pads on the inner layer plate.
The preset positions of the outer layer plate refer to positions on the outer layer plate corresponding to the plurality of bonding pads on the inner layer plate. And (3) carrying out laser ablation on the preset position of the outer layer plate through a CCD (charge coupled device) drilling machine, and burning out a plurality of blind holes at the preset position of the outer layer plate, wherein the bottoms of the blind holes correspond to a plurality of bonding pads on the exposed inner layer plate.
The laser ablation can be performed by adopting a laser module of the CCD drilling machine, so that the situation that the instrument is replaced and the alignment efficiency is affected in the alignment process is avoided.
The laser ablation is performed on the preset position of the outer plate to form a hole, so that phenomena such as burrs, gaps and the like caused by mechanical drilling can be avoided, the wall of the blind hole is smooth and clear, the precision of the subsequent CCD drilling machine in scanning is improved, and the interference of the phenomena such as burrs, gaps and the like to the scanning of the CCD drilling machine is reduced.
Step S13: and scanning a plurality of bonding pads through the CCD drilling machine, and aligning the plate to be aligned.
After a plurality of bonding pads on the inner-layer plate are exposed, the bonding pads are scanned through a CCD drilling machine, and the plate to be aligned is aligned based on the positions of the bonding pads on the inner-layer plate.
Because the blind holes of the exposed bonding pads on the outer layer plate are made by laser ablation, the phenomena of burrs, gaps and the like caused by mechanical drilling can be avoided, and the precision of laser bonding pad sweeping of the CCD drilling machine can be effectively improved.
Through the steps, the alignment method of the CCD drilling machine of the embodiment carries out laser ablation on the preset position of the outer layer plate through the CCD drilling machine so as to expose a plurality of bonding pads on the inner layer plate, and scans the bonding pads through the CCD drilling machine to align the plate to be aligned, so that phenomena such as burrs, gaps and the like caused by mechanical drilling can be avoided by utilizing laser ablation, the hole wall of a blind hole of the exposed bonding pad on the outer layer plate is smoother and clearer, the scanning precision of the CCD drilling machine is further improved, the scanning interference of the phenomena such as burrs, burrs and gaps on the CCD drilling machine is reduced, and the laser scanning precision capability of the CCD drilling machine is effectively improved. In addition, the drilling and positioning scanning are performed by using the CCD drilling machine, so that the occurrence of the condition of replacing the instrument is reduced in the alignment process, and the alignment efficiency is improved.
Referring to fig. 2, fig. 2 is a flow chart of another embodiment of the alignment method of the CCD drilling machine provided by the present invention.
Step S21: obtaining a plate to be aligned; wherein, wait to counterpoint the plate and including the inlayer plate and the skin plate that the laminating set up.
A plurality of bonding pads are formed on one side of the inner layer plate close to the outer layer plate. The bonding pad is used for performing alignment scanning of the CCD drilling machine.
The outer plate comprises a dielectric layer and a metal layer which are arranged in a laminating way, and the dielectric layer and the inner plate are arranged in a laminating way, namely the metal layer is exposed at the outermost side of the plate to be aligned.
The step is the same as the step S21 in the foregoing embodiment, please refer to the foregoing, and the description is omitted herein.
Step S22: covering a corrosion-resistant film on the metal layer on one side of the outer layer plate far away from the inner layer plate, and exposing the preset position; etching the preset position to prepare a plurality of initial positioning holes at the preset position.
The preset position refers to a position on the outer layer plate corresponding to a plurality of bonding pads on the inner layer plate. And then covering a resist film on the metal layer of the outer layer plate to expose the preset positions corresponding to the plurality of bonding pads. I.e. the preset position may comprise a plurality of independent positions.
The resist film is a polymer compound, and can form a stable substance attached to the plate surface, thereby achieving the function of blocking etching.
In a specific application scenario, the whole resist film may be first adhered to the metal layer, and then the resist film at the preset position is removed to expose the preset position. In another specific application scenario, the position on the resist film corresponding to the preset position may be hollowed out, and then the resist film may be adhered to the metal layer. In a specific application scenario, the whole photosensitive resist film may be first adhered to the metal layer, and then exposed and developed based on the preset position to expose the preset position. The specific method for exposing the preset position is not limited herein.
After exposing the preset position on the metal layer, etching the preset position through etching liquid medicine to prepare a plurality of initial positioning holes at the preset position on the metal layer.
The initial positioning hole may penetrate or partially penetrate the metal layer, for example, penetrate 2/3 of the metal layer, and the initial positioning hole is used for helping the CCD drilling machine to position the preset position, and the CCD drilling machine can position the preset position by identifying the initial positioning hole.
After the etching is completed, the resist film is removed.
Step S23: and (3) carrying out laser ablation on the preset positions based on the positions of the initial positioning holes through a CCD drilling machine until a plurality of bonding pads on the inner layer plate are exposed correspondingly.
Specifically, the positions of the initial positioning holes are scanned through the CCD drilling machine so as to identify the positions of the initial positioning holes, and then the preset positions are positioned, so that the accuracy of laser ablation is improved.
And after the positions of the initial positioning holes are positioned to the preset positions, carrying out laser ablation on the initial positioning holes at the preset positions through a CCD (charge coupled device) drilling machine until the positions of the initial positioning holes correspond to a plurality of bonding pads on the exposed inner-layer plate.
The laser ablation is carried out on the preset position of the outer plate to manufacture holes, so that phenomena such as burrs, gaps and the like caused by mechanical drilling can be avoided, the wall of the blind hole is smooth and clear, the accuracy of the subsequent CCD drilling machine in scanning is improved, and the interference of the phenomena such as burrs, gaps and the like to the scanning of the CCD drilling machine is reduced.
Step S24: and scanning the plurality of bonding pads through a CCD drilling machine to obtain the actual position information of each bonding pad. And in response to the deviation between the actual position information of each bonding pad and the corresponding target position information being within a deviation range, aligning the plate to be aligned based on the actual position information of each bonding pad.
And scanning a plurality of bonding pads on the inner layer plate through a CCD drilling machine to obtain the actual position information of each bonding pad. Because the blind hole wall of the exposed bonding pad on the outer plate is smoother and clearer, the precision of the CCD drilling machine during scanning can be improved, the interference of phenomena such as burrs, gaps and the like on the scanning of the CCD drilling machine is reduced, and the precision capability of the laser scanning bonding pad of the CCD drilling machine is effectively improved.
And scanning the plurality of bonding pads through a CCD drilling machine to obtain the actual position information of each bonding pad. The position information of the bonding pads comprises coordinates of central points of the bonding pads, connecting line angles among different bonding pads and expansion and contraction ratios.
In a specific application scenario, the actual position information of a preset number of bonding pads in the plurality of bonding pads can be scanned at a time through the CCD drilling machine during scanning. Comparing the actual position information of the preset number of bonding pads with the corresponding target position information, and responding to the fact that the deviation between the actual position information of the preset number of bonding pads and the corresponding target position information is in a deviation range, indicating that the actual position information of the preset number of bonding pads obtained by scanning of the CCD drilling machine is accurate, so that the alignment plate can be aligned based on the actual position information of the preset number of bonding pads.
The preset number may be 4, 6, 8, etc., and may specifically be set based on actual requirements. The target position information corresponding to the bonding pad is theoretical position information of the bonding pad on the inner layer plate. The deviation range and the deviation may be specifically set based on actual requirements, and are not limited herein.
In a specific application scenario, when the preset number is 4, the CCD drilling machine scans whether the coordinates of the center points of the 4 bonding pads coincide with the coordinates of the target center points of the corresponding bonding pads, whether the connecting line angles between the different bonding pads coincide with the angles of the target points of the corresponding bonding pads, and whether the 4 bonding pads are in expansion-contraction with the same proportion or not coincide with the theoretical expansion-contraction proportion, if so, the actual position information of the preset number of bonding pads obtained by scanning by the CCD drilling machine is accurate, and the alignment of the plate to be aligned can be performed based on the actual position information of the preset number of bonding pads.
In another specific application scene, multiple times of local superposition cross scanning can be carried out on a plurality of bonding pads through a CCD drilling machine until the actual position information of each bonding pad is obtained; wherein, the CCD rig scans a preset number of bonding pads each time. For example: when 10 bonding pads exist on the plate, 4 bonding pads can be scanned each time, and the bonding pads are overlapped in a crossed mode until all bonding pads are scanned, and actual position information of each bonding pad is obtained. And responding to the fact that the deviation between the actual position information of each bonding pad and the corresponding target position information is in a deviation range, the fact that the actual position information of the bonding pad obtained by scanning by the CCD drilling machine is accurate is indicated, and therefore the plate to be aligned can be aligned based on the actual position information of the bonding pad.
After the CCD drilling machine performs alignment on the plate to be aligned, preparing the printed circuit board based on the aligned plate to be aligned. For example, the processes of etching the outer layer pattern, drilling the via hole, etching, and soldering-resisting can be performed on the board to be aligned after alignment, and the arrangement can be specifically performed based on the actual requirement of the printed circuit board, which is not limited herein.
In a specific application scene, after the actual position information of each bonding pad is obtained, generating a pre-expanding and contracting drill band based on the actual position information of each bonding pad, and performing subsequent preparation operation by using the drill band to improve the drill band precision.
Through the steps, the alignment method of the CCD drilling machine of the embodiment covers the resist film on the metal layer on one side of the outer layer plate far away from the inner layer plate, and exposes the preset position; etching is conducted on the preset positions to obtain a plurality of initial positioning holes in the preset positions, so that the positions of the initial positioning holes can be identified through the CCD drilling machine, the preset positions are further positioned, and the laser ablation accuracy is improved. And the CCD drilling machine carries out laser ablation to the preset position of the outer layer plate so as to expose a plurality of bonding pads on the inner layer plate, and scans the bonding pads through the CCD drilling machine, and the plate to be aligned is aligned, so that the phenomena of burrs, gaps and the like caused by mechanical drilling can be avoided by utilizing laser ablation, the hole wall of a blind hole of the exposed bonding pad on the outer layer plate is smoother and clearer, the scanning precision of the CCD drilling machine is further improved, the interference of the phenomena of burrs, gaps and the like on the scanning of the CCD drilling machine is reduced, the inconsistent hole position is improved, the laser bonding pad scanning precision capability of the CCD drilling machine is effectively improved, and the plate alignment capability and the plate preparation precision are improved. In addition, the drilling and positioning scanning are performed by using the CCD drilling machine, so that the occurrence of the condition of replacing the instrument is reduced in the alignment process, and the alignment efficiency is improved.
In other embodiments, a plurality of pads may be formed at an edge of the inner panel and/or at a middle region of the inner panel. When a plurality of pads can be formed at the edge of the inner panel, the influence on the wiring accuracy of the printed circuit board can be reduced, and the wiring density can be improved.
Referring to fig. 3, fig. 3 is a schematic distribution diagram of an embodiment of a plurality of pads of an inner board.
The inner panel 30 of this embodiment may be formed from a plurality of sub-panels 31. Wherein the first pads 32 provided at the edge of the inner panel 30 may be provided at the edge of the inner panel 30 or the edge of the sub-panel 31. The second pads 33 disposed at the middle region of the inner panel 30 may be disposed at the edges of the sub-panel 31.
According to the embodiment, phenomena such as burrs, gaps and the like caused by mechanical drilling are avoided by utilizing laser ablation, so that the hole wall of a blind hole of an exposed bonding pad on an outer layer plate is smooth and clear, the precision of a CCD (charge coupled device) drilling machine in scanning is improved, the interference of the phenomena such as burrs, gaps and the like on the scanning of the CCD drilling machine is reduced, and the precision capability of the laser scanning bonding pad of the CCD drilling machine can be effectively improved.
Based on the same inventive concept, the invention also provides a printed circuit board, which is prepared after the alignment method of the CCD drilling machine of any embodiment is adopted for alignment.
The alignment precision of the printed circuit board in the preparation process is effectively improved, so that the preparation precision of the printed circuit board is improved, and the reliability and the stability are improved.
The foregoing description is only of embodiments of the present invention, and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the present invention.
Claims (10)
1. The alignment method of the CCD drilling machine is characterized by comprising the following steps of:
obtaining a plate to be aligned; the plate to be aligned comprises an inner plate and an outer plate which are arranged in a fitting mode;
laser ablation is carried out on preset positions of the outer layer plate through the CCD drilling machine so as to expose a plurality of bonding pads on the inner layer plate;
and scanning a plurality of bonding pads through the CCD drilling machine, and aligning the plate to be aligned.
2. The alignment method of a CCD drilling machine according to claim 1, wherein the outer plate comprises a dielectric layer and a metal layer which are arranged in a fitting manner, and the dielectric layer is arranged in a fitting manner with the inner plate;
the step of performing laser ablation on the preset position of the outer layer plate through the CCD drilling machine to expose the plurality of bonding pads on the inner layer plate comprises the following steps:
covering a corrosion-resistant film on the metal layer on one side of the outer layer plate far away from the inner layer plate, and exposing the preset position;
etching the preset position to prepare a plurality of initial positioning holes at the preset position;
and carrying out laser ablation on the preset positions by the CCD drilling machine based on the positions of the initial positioning holes until a plurality of bonding pads on the inner-layer plate are correspondingly exposed.
3. The alignment method of a CCD drill according to claim 2, wherein the step of performing laser ablation on the preset position of the outer-layer board until the plurality of pads on the inner-layer board are correspondingly exposed by the CCD drill based on the position of each of the initial positioning holes comprises:
scanning the positions of the initial positioning holes through the CCD drilling machine to position the preset positions;
and carrying out laser ablation on each initial positioning hole at the preset position through the CCD drilling machine until a plurality of bonding pads on the inner-layer plate are correspondingly exposed.
4. A method of aligning a CCD drill according to any one of claims 1 to 3, wherein a plurality of the pads are formed at an edge of the inner panel and/or a middle region of the inner panel.
5. The alignment method of a CCD drill according to claim 1, wherein the step of scanning a plurality of the pads by the CCD drill to align the board to be aligned comprises:
scanning a plurality of bonding pads through the CCD drilling machine to obtain actual position information of each bonding pad;
and responding to the deviation between the actual position information of each bonding pad and the corresponding target position information in a deviation range, and aligning the plate to be aligned based on the actual position information of each bonding pad.
6. The alignment method of a CCD drill according to claim 5, wherein the step of scanning actual positional information of a plurality of the pads by the CCD drill includes:
scanning actual position information of a preset number of bonding pads in a plurality of bonding pads through the CCD drilling machine;
the step of aligning the board to be aligned based on the actual position information of each bonding pad in response to the deviation between the actual position information of each bonding pad and the corresponding target position information being within the deviation range includes:
and responding to the deviation between the actual position information of the preset number of bonding pads and the corresponding target position information in a deviation range, and aligning the plate to be aligned based on the actual position information of the preset number of bonding pads.
7. The alignment method of a CCD drill according to claim 5, wherein the step of scanning actual positional information of a plurality of the pads by the CCD drill further comprises:
overlapping and cross-scanning a plurality of bonding pads for a plurality of times through the CCD drilling machine until the actual position information of each bonding pad is obtained; wherein, the CCD rig scans a preset number of bonding pads each time.
8. The method of aligning a CCD drill according to any one of claims 5-7, wherein the positional information includes center point coordinates, link angles, and a collapse/expansion ratio.
9. The alignment method of a CCD drill according to claim 1, wherein the step of scanning a plurality of the pads by the CCD drill to align the board to be aligned includes:
and preparing the printed circuit board based on the aligned plate to be aligned.
10. The printed circuit board is characterized in that the printed circuit board is prepared after being aligned by the alignment method of the CCD drilling machine of any one of 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310228003.XA CN116367427A (en) | 2023-02-28 | 2023-02-28 | Alignment method of CCD drilling machine and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310228003.XA CN116367427A (en) | 2023-02-28 | 2023-02-28 | Alignment method of CCD drilling machine and printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN116367427A true CN116367427A (en) | 2023-06-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310228003.XA Pending CN116367427A (en) | 2023-02-28 | 2023-02-28 | Alignment method of CCD drilling machine and printed circuit board |
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| Country | Link |
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| CN (1) | CN116367427A (en) |
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