CN116365356A - Heat radiation structure for photoelectric board card - Google Patents
Heat radiation structure for photoelectric board card Download PDFInfo
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- CN116365356A CN116365356A CN202310183954.XA CN202310183954A CN116365356A CN 116365356 A CN116365356 A CN 116365356A CN 202310183954 A CN202310183954 A CN 202310183954A CN 116365356 A CN116365356 A CN 116365356A
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- 230000005855 radiation Effects 0.000 title abstract description 5
- 230000017525 heat dissipation Effects 0.000 claims abstract description 75
- 239000013307 optical fiber Substances 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims description 22
- 230000005693 optoelectronics Effects 0.000 claims description 21
- 230000003287 optical effect Effects 0.000 claims description 16
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 238000013461 design Methods 0.000 abstract description 5
- 238000002955 isolation Methods 0.000 abstract description 4
- 238000001816 cooling Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
- H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention provides a heat radiation structure for a photoelectric board card, which aims at providing a first heat radiation component on the side of a laser component and making a special design for the first heat radiation component: particularly, a plurality of first rib sections on the first heat dissipation assembly are connected end to end in sequence and encircle to form a polygonal cavity, each laser emitter is correspondingly accommodated in each cavity, and two first rib sections at the tail part of each cavity are used for clamping the corresponding optical fiber structure at the tail end position close to the tail part, so that the laser emitters and the optical fiber structure are prevented from being directly blown by heat dissipation wind flow, the laser emitters and the optical fiber structure are protected, and meanwhile, the thermal isolation between the laser emitters and a large photon-electron hybrid chip can be ensured.
Description
Technical Field
The invention relates to the technical fields of photoelectric transmission and photoelectric calculation, in particular to a heat dissipation structure for a photoelectric board card.
Background
In the conventional technology, the electronic integrated circuit chip is generally the whole radiator, and is typically characterized by a relatively low height, so that the space reserved for the radiator is also large enough (the space is large and easy to dissipate heat), and the photonic integrated circuit chip and the optical package are not involved.
In recent years, photonic-electronic hybrid chips have been increasingly used, wherein the typical characteristics of optical packages involving photonic integrated circuit chips are high and sensitive to temperature, because temperature affects the wavelength and power of the laser light, and further, the optical packages are not free from the fact that the photonic integrated circuit chips need to transmit the laser light from the laser emitter to the inside of the photonic integrated circuit chip via an optical fiber structure.
However, the existing photoelectric board card integrated with the photon-electron hybrid chip lacks effective design for the laser transmitter, so that the laser transmitter cannot be guaranteed to effectively dissipate heat, the laser transmitter cannot be guaranteed to influence a subsequent radiator due to the fact that the size of the laser transmitter is large, and the fixing of an optical fiber structure cannot be guaranteed. Therefore, a new heat dissipation structure for the photovoltaic card is needed.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a heat dissipation structure for a photoelectric board card, which can ensure that a laser emitter can effectively dissipate heat and can also avoid the influence of the laser emitter on a subsequent radiator due to the larger volume of the laser emitter.
The invention adopts the following technical scheme:
according to an aspect of the present invention, there is provided a heat dissipation structure for an optoelectronic board, including:
a substrate having a first surface on which a laser assembly and a photon-electron hybrid chip are disposed, the laser assembly and the photon-electron hybrid chip being arranged in a first direction;
the laser assembly comprises a plurality of laser transmitters and a plurality of optical fiber structures which are arranged along a second direction, wherein the plurality of laser transmitters are arranged in one-to-one correspondence with the plurality of optical fiber structures, and the first direction is intersected with the second direction;
the photon-electron hybrid chip comprises a photon integrated circuit chip, wherein a waveguide array and an optical coupler are arranged on the photon integrated circuit chip, the optical couplers in one-to-one alignment with the optical couplers in the photon integrated circuit chip are used for transmitting light rays emitted by the laser emitters to the photon integrated circuit chip, and the optical coupler is configured to perform mode spot conversion on the light input through the optical fiber structures and couple the light after the mode spot conversion to the waveguide array in the photon integrated circuit chip;
the laser device comprises a first surface, a second surface, a third surface and a fourth surface, wherein a first heat dissipation assembly is further arranged above the first surface, the first heat dissipation assembly comprises a plurality of first rib sections, the plurality of first rib sections are connected end to end in sequence and encircle to form a polygonal cavity, and each laser emitter is correspondingly accommodated in each cavity;
along the first direction, each cavity comprises a head portion and a tail portion, the tail portion comprises two first rib sections, and the two first rib sections are close to each other and clamp the corresponding optical fiber structure at the tail end position adjacent to the tail portion.
Further, the head portion includes two first rib sections, and in the first direction, the two first rib sections are adjacent to each other and converge to form a sharp edge structure at a front end position adjacent to the head portion, and the two first rib sections are separated from each other at a rear end position adjacent to the head portion.
Further, the first heat dissipating assembly further includes a plurality of second rib segment groups arranged along a second direction, each of the second rib segment groups including a plurality of second rib segments extending along the first direction and arranged along the second direction.
Further, in the second direction, the cavity is located between two adjacent second rib segment groups.
Further, two of the second rib sections located on both sides of the cavity and two of the first rib sections located on the head form two air inlet ports, respectively.
Further, the photonic-electronic hybrid chip further comprises a second heat dissipation assembly, wherein the second heat dissipation assembly is located on one side, away from the substrate, of the photonic-electronic hybrid chip, and the second heat dissipation assembly comprises a bearing plate and a plurality of heat dissipation fins located on the bearing plate.
Further, the plurality of heat dissipation fins extend along the first direction and are arranged along the second direction.
Further, the bearing plate is contacted with one side surface of the photon-electron hybrid chip, which is far away from the substrate, through a first heat dissipation gasket.
Further, one or more chiplets are also provided on the first surface of the substrate and the one or more chiplets and the photon-electron hybrid chip are fixed to an area of the first surface covered by a projection of the second heat sink assembly in a direction parallel to the first surface.
Further, the carrier plate is in contact with a side surface of the one or more chiplets facing away from the substrate through a second heat sink pad.
The embodiment of the invention provides a heat dissipation structure for a photoelectric board card, which aims at providing a first heat dissipation assembly at the side of a laser assembly and making special designs for the first heat dissipation assembly: particularly, a plurality of first rib sections on the first heat dissipation assembly are connected end to end in sequence and encircle to form a polygonal cavity, each laser emitter is correspondingly accommodated in each cavity, and two first rib sections at the tail part of each cavity are used for clamping the corresponding optical fiber structure at the tail end position close to the tail part, so that the laser emitters and the optical fiber structure are prevented from being directly blown by heat dissipation wind flow, the laser emitters and the optical fiber structure are protected, and meanwhile, the thermal isolation between the laser emitters and a large photon-electron hybrid chip can be ensured.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other embodiments may be obtained according to these drawings without inventive effort to a person skilled in the art.
Fig. 1 is a schematic structural view of a heat dissipation structure for an optoelectronic board according to an embodiment of the present invention.
Fig. 2 is a schematic top view of a heat dissipation structure for an optoelectronic board shown in fig. 1.
Fig. 3 is a schematic side view of the heat dissipation structure for the photovoltaic card shown in fig. 1 as viewed from the length direction.
Fig. 4 is a schematic side view of the heat dissipation structure for the photovoltaic card shown in fig. 1, as viewed from the width direction.
Detailed Description
The foregoing description is only an overview of the present invention, and is intended to be implemented in accordance with the teachings of the present invention, as well as the preferred embodiments thereof, together with the following detailed description of the invention, given by way of illustration only, together with the accompanying drawings.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
The invention will be further described in detail with reference to the drawings and detailed description below in order to make the objects, features and advantages of the invention more comprehensible.
Fig. 1 is a schematic structural view of a heat dissipation structure for an optoelectronic board according to an embodiment of the present invention, fig. 2 is a schematic structural view from a length direction of a heat dissipation structure for an optoelectronic board according to the embodiment shown in fig. 1, fig. 3 is a schematic structural view from a length direction of a heat dissipation structure for an optoelectronic board according to the embodiment shown in fig. 1, and fig. 4 is a schematic structural view from a width direction of a heat dissipation structure for an optoelectronic board according to the embodiment shown in fig. 1.
As shown in fig. 1 to 4, a heat dissipation structure for an optoelectronic board provided in an embodiment of the present invention includes:
a substrate 101, the substrate 101 having a first surface 101a, on the first surface 101a, a laser assembly 200 and a photonic-electronic hybrid chip 401 (i.e., a chip of a photonic integrated circuit chip and an electronic integrated circuit chip hybrid package) are disposed, the laser assembly 200 and the photonic-electronic hybrid chip 401 being arranged along a first direction;
the laser assembly 200 includes a plurality of laser emitters 210 and a plurality of optical fiber structures 220 arranged along a second direction, the plurality of laser emitters 210 being disposed in one-to-one correspondence with the plurality of optical fiber structures 220, wherein the first direction intersects the second direction;
the photonic-electronic hybrid chip 401 includes a photonic integrated circuit chip on which a waveguide array (not shown) and an optical coupler (not shown) are disposed, the plurality of optical fiber structures 220 are aligned one by one with the optical couplers (not shown) within the photonic integrated circuit chip to transmit light emitted from the plurality of laser emitters 210 to the photonic integrated circuit chip, and the optical coupler (not shown) is configured to perform a spot-conversion of light input through the plurality of optical fiber structures 220 and to couple the spot-converted light to the waveguide array (not shown) within the photonic integrated circuit chip;
a first heat dissipation assembly 300 is further disposed above the first surface 101a, where the first heat dissipation assembly 300 includes a plurality of first rib segments 301, and the plurality of first rib segments 301 are sequentially connected end to end and encircle to form a polygonal cavity 310, and each laser emitter 210 is correspondingly accommodated in each cavity 310;
along the first direction, each cavity 310 includes a head 311 and a tail 312, and the tail 312 includes two first rib sections 301, and at a terminal position adjacent to the tail 312, the two first rib sections 301 are close to each other and clamp the corresponding optical fiber structure 220.
Illustratively, in the embodiment of the present invention, the substrate 101 is a board card, a PCB (Printed Circuit Board, printed circuit) board or a circuit board, and the substrate 101 is a support for electronic components (such as a hybrid photon-electron chip and other chips), and is also a carrier for electrically interconnecting the electronic components, for example, a copper-clad design is performed on the substrate 101 to serve as a connecting wire.
Specifically, in the embodiment of the invention, the photonic integrated circuit chip is a silicon-based optical chip that uses photons as an information carrier to process information and transmit data. An electronic integrated circuit chip is a processing of information and transfer of data with electronics as an information carrier, such as a silicon-based electrical chip, a germanium-based electrical chip or a compound semiconductor electrical chip. The integration of the photonic-electronic hybrid chip may be achieved by stacking the photonic integrated circuit chip with the electronic integrated circuit chip. Wherein at least one electronic integrated circuit chip is soldered or otherwise secured over a side surface of each photonic integrated circuit chip. For example, at least one electronic integrated circuit chip is flip-chip bonded to one side surface of each photonic integrated circuit chip.
It should be noted that, in the embodiment of the present invention, since the wind temperature required by the laser emitter 210 is low, the laser emitter 210 needs to be placed at the wind gap. However, since the laser transmitter 210 has a relatively large size, it can block the heat dissipation airflow, and thus affect the heat dissipation of the subsequent electronic components, so some structural transitions are needed to avoid the wind pressure loss and severe wind direction changes, which result in that the heat dissipation airflow cannot be blown onto the subsequent heat dissipation component (radiator), and thus the effective air cooling cannot be achieved. In addition, the fiber optic structure 220 cannot be exposed to wind and would otherwise be blown out.
In addition, the first heat sink 300 is not directly in contact with the substrate 101, but is located above the substrate 101, because there are some chiplets 402 below the first heat sink 300 that share heat dissipation with the laser assembly 200, the chiplets 402 typically being power chips, controller chips, etc. of the laser transmitter 210. In addition, capillary channels (not shown) are typically disposed inside the carrier plate 105 of the first heat dissipation assembly 300, and some chambers exist inside the capillary channels, i.e., as conventional heat dissipation chambers.
Therefore, one of the purposes of the embodiments of the present invention is to provide a heat dissipation structure for an optoelectronic board card, which not only can meet the lower wind temperature required by a laser emitter, but also can avoid heat exchange between the laser emitter and a heat dissipation component of a photon-electron hybrid chip, and simultaneously can realize clamping and fixing of an optical fiber structure, so as to prevent the optical fiber structure from shaking, deforming and misplacement during air cooling, thereby causing the problem of poor optical coupling efficiency with a photon integrated circuit chip in the photon-electron hybrid chip.
Illustratively, in the embodiment of the present invention, the laser assembly 200 and the photon-electron hybrid chip 401 are arranged along a first direction, the laser assembly 200 includes a plurality of laser emitters 210 and a plurality of optical fiber structures 220 arranged along a second direction, and the plurality of laser emitters 210 are disposed in a one-to-one correspondence with the plurality of optical fiber structures 220, where the first direction intersects the second direction, and in some embodiments, the first direction may also be a main extension direction of the heat dissipation airflow line 302 of the first heat dissipation assembly 300. In some embodiments, the first direction is substantially perpendicular to the second direction.
Illustratively, the first heat dissipating component 300 includes a plurality of first rib segments 301, where the plurality of first rib segments 301 are connected end to end in sequence and form a polygonal cavity 310 in a surrounding manner, for example, four polygonal cavities 310 are shown, and in practical use, the first rib segments 301 may be adaptively adjusted according to the number of the laser emitters 210. Each laser emitter 210 is correspondingly accommodated in each cavity 310, and along the first direction, each cavity 310 includes a head 311 and a tail 312, and the tail 312 includes two first rib sections 301, and at a position adjacent to the tail 312, the two first rib sections 301 are close to each other and clamp the corresponding optical fiber structure 220.
By adopting the technical scheme provided by the embodiment of the invention, the first heat dissipation component is arranged at the side of the laser component, and the first heat dissipation component is specially designed: particularly, a plurality of first rib sections on the first heat dissipation assembly are connected end to end in sequence and encircle to form a polygonal cavity, each laser emitter is correspondingly accommodated in each cavity, and two first rib sections at the tail part of each cavity are used for clamping the corresponding optical fiber structure at the tail end position close to the tail part, so that the laser emitters and the optical fiber structure are prevented from being directly blown by heat dissipation wind flow, the laser emitters and the optical fiber structure are protected, and meanwhile, the thermal isolation between the laser emitters and a large photon-electron hybrid chip can be ensured.
Further, in some embodiments, the head 311 includes two first rib sections 301, along the first direction, at a front end position adjacent to the head 311, the two first rib sections 301 are close to each other and converge to form a sharp edge structure, and at an end position adjacent to the head 311, the two first rib sections 301 are separated from each other, so that the cooling air flow line 302 can flow along the extending direction of the side wall of the sharp edge structure, thereby reducing wind pressure loss and not affecting the cooling of subsequent electronic components.
Further, the first heat dissipating assembly 300 further includes a plurality of second rib segment groups 320 arranged along a second direction, each of the second rib segment groups 320 including a plurality of second rib segments 322, the plurality of second rib segments 322 extending along the first direction and being arranged along the second direction.
Illustratively, each second rib section group 320 includes 3, 4, or more second rib sections 322, with the plurality of second rib sections 322 extending in the first direction and aligned in the second direction.
Further, the cavity 310 is located between two adjacent second rib segment groups 320 along the second direction, so that the air cooling uniformly acts on the periphery of the laser assembly 200, and the wind direction does not change drastically.
Further, two of the second rib sections 322 located at both sides of the cavity 310 and two of the first rib sections 301 located at the head 311 form two inlet ports 330, respectively, and cooling gas is introduced from the inlet ports 330 located at both sides of each of the cavities 310.
The heat dissipation structure for an optoelectronic board according to the embodiment of the present invention further includes a second heat dissipation assembly 500, where the second heat dissipation assembly 500 is located on a side of the photonic-electronic hybrid chip 401 facing away from the substrate 101, and the second heat dissipation assembly 500 includes a carrier plate 510 and a plurality of heat dissipation fins 511 located on the carrier plate 510. The heat dissipation fins 511 are made of aluminum and copper, and are used for dissipating heat transferred from the hot end in a convection manner.
Further, the plurality of heat dissipation fins 511 extend along the first direction and are arranged along the second direction, so that heat on the second heat dissipation assembly 500 side is driven away by the air cooling transmitted from the first heat dissipation assembly 300 side, and the gaps between two adjacent heat dissipation fins 511 can also serve as air outlets for discharging the heat.
In some embodiments, the carrier plate 510 contacts a surface of the photonic-electronic hybrid chip 401 facing away from the substrate 101 through a first heat sink pad 61.
Further, one or more chiplets 402 are also provided on the first surface 101a of the substrate 101, and the one or more chiplets 402 and the photon-electron hybrid chip 401 are fixed to an area of the first surface 101a covered by a projection of the second heat sink assembly 500 in a direction parallel to the first surface 101 a. That is, the one or more chiplets 402 and the hybrid photon-electron chip 401 share heat dissipation through the second heat dissipation assembly 500.
In some embodiments, the carrier plate 510 is in contact with a side surface of the one or more chiplets 402 facing away from the substrate 101 through a second heat dissipation pad 62.
It should be noted that, in the embodiment of the present invention, the thickness of the photonic-electronic hybrid chip 401 is relatively thick in the thickness direction of the substrate 101, so the photonic-electronic hybrid chip 401 is typically contacted with the carrier plate 510 through a thin heat dissipation pad, and one or more chiplets located near the photonic-electronic hybrid chip 401 are typically contacted with the carrier plate 510 through a thick heat dissipation pad due to their relatively thin thickness. Therefore, the thickness of the first heat dissipation pad 61 is generally greater than the thickness of the second heat dissipation pad 62.
As can be seen from the above, the heat dissipation structure for an optoelectronic board provided by the embodiment of the present invention aims to provide a first heat dissipation assembly on a side of a laser assembly, and make a special design for the first heat dissipation assembly: particularly, a plurality of first rib sections on the first heat dissipation assembly are connected end to end in sequence and encircle to form a polygonal cavity, each laser emitter is correspondingly accommodated in each cavity, and two first rib sections at the tail part of each cavity are used for clamping the corresponding optical fiber structure at the tail end position close to the tail part, so that the laser emitters and the optical fiber structure are prevented from being directly blown by heat dissipation wind flow, the laser emitters and the optical fiber structure are protected, and meanwhile, the thermal isolation between the laser emitters and a large photon-electron hybrid chip can be ensured.
The foregoing description of the preferred embodiments of the present invention is not intended to limit the scope of the invention, but rather to cover all equivalent variations and modifications in shape, construction, characteristics and spirit according to the scope of the present invention as defined in the appended claims.
Claims (10)
1. A heat dissipation structure for an optoelectronic board, comprising:
a substrate having a first surface on which a laser assembly and a photon-electron hybrid chip are disposed, the laser assembly and the photon-electron hybrid chip being arranged in a first direction;
the laser assembly comprises a plurality of laser transmitters and a plurality of optical fiber structures which are arranged along a second direction, wherein the plurality of laser transmitters are arranged in one-to-one correspondence with the plurality of optical fiber structures, and the first direction is intersected with the second direction;
the photon-electron hybrid chip comprises a photon integrated circuit chip, wherein a waveguide array and an optical coupler are arranged on the photon integrated circuit chip, the optical couplers in one-to-one alignment with the optical couplers in the photon integrated circuit chip are used for transmitting light rays emitted by the laser emitters to the photon integrated circuit chip, and the optical coupler is configured to perform mode spot conversion on the light input through the optical fiber structures and couple the light after the mode spot conversion to the waveguide array in the photon integrated circuit chip;
the laser device comprises a first surface, a second surface, a third surface and a fourth surface, wherein a first heat dissipation assembly is further arranged above the first surface, the first heat dissipation assembly comprises a plurality of first rib sections, the plurality of first rib sections are connected end to end in sequence and encircle to form a polygonal cavity, and each laser emitter is correspondingly accommodated in each cavity;
along the first direction, each cavity comprises a head portion and a tail portion, the tail portion comprises two first rib sections, and the two first rib sections are close to each other and clamp the corresponding optical fiber structure at the tail end position adjacent to the tail portion.
2. The heat dissipating structure for an optoelectronic board of claim 1,
the head comprises two first rib sections,
in the first direction, two first rib sections are adjacent to each other and converge to form a sharp edge structure at a front end position adjacent to the head, and two first rib sections are separated from each other at a rear end position adjacent to the head.
3. The heat dissipating structure for an optoelectronic board of claim 1,
the first heat dissipation assembly further includes a plurality of second rib segment groups arranged along a second direction, each of the second rib segment groups including a plurality of second rib segments extending along the first direction and arranged along the second direction.
4. The heat dissipating structure for an optoelectronic board of claim 3 wherein,
in the second direction, the cavity is located between two adjacent second rib segment groups.
5. The heat dissipating structure for an optoelectronic board of claim 4 wherein,
the two second rib sections positioned on two sides of the cavity and the two first rib sections positioned on the head part respectively form two air inlet ports.
6. The heat dissipating structure for an optoelectronic board of claim 1 further comprising a second heat dissipating component,
the second heat dissipation assembly is located on one side, away from the substrate, of the photon-electron hybrid chip, and comprises a bearing plate and a plurality of heat dissipation fins located on the bearing plate.
7. The heat dissipating structure for an optoelectronic board of claim 6 wherein,
the plurality of heat dissipation fins extend along the first direction and are arranged along the second direction.
8. The heat dissipating structure for an optoelectronic board of claim 6 wherein,
the bearing plate is contacted with one side surface of the photon-electron hybrid chip, which is far away from the substrate, through a first heat dissipation gasket.
9. The heat dissipating structure for an optoelectronic board of claim 6 wherein,
one or more chiplets are also provided on the first surface of the substrate and the one or more chiplets and the photon-electron hybrid chip are secured to an area of the first surface covered by a projection of the second heat sink assembly in a direction parallel to the first surface.
10. The heat dissipating structure for an optoelectronic board of claim 9 wherein,
the carrier plate is in contact with a surface of the one or more chiplets facing away from the substrate through a second heat sink pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310183954.XA CN116365356A (en) | 2023-02-23 | 2023-02-23 | Heat radiation structure for photoelectric board card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310183954.XA CN116365356A (en) | 2023-02-23 | 2023-02-23 | Heat radiation structure for photoelectric board card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116365356A true CN116365356A (en) | 2023-06-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310183954.XA Pending CN116365356A (en) | 2023-02-23 | 2023-02-23 | Heat radiation structure for photoelectric board card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116365356A (en) |
-
2023
- 2023-02-23 CN CN202310183954.XA patent/CN116365356A/en active Pending
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