CN116360043A - Four-channel high-speed ceramic shell - Google Patents
Four-channel high-speed ceramic shell Download PDFInfo
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- CN116360043A CN116360043A CN202211562199.8A CN202211562199A CN116360043A CN 116360043 A CN116360043 A CN 116360043A CN 202211562199 A CN202211562199 A CN 202211562199A CN 116360043 A CN116360043 A CN 116360043A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 35
- 230000008054 signal transmission Effects 0.000 claims abstract description 54
- 230000003287 optical effect Effects 0.000 claims abstract description 41
- 230000005540 biological transmission Effects 0.000 claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 229910000833 kovar Inorganic materials 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 239000013307 optical fiber Substances 0.000 claims description 4
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- 239000011224 oxide ceramic Substances 0.000 claims description 3
- 229910052574 oxide ceramic Inorganic materials 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 7
- 238000002955 isolation Methods 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 abstract description 4
- 238000004891 communication Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 235000011449 Rosa Nutrition 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 230000018199 S phase Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005571 horizontal transmission Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4279—Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses a four-channel high-speed ceramic shell which comprises a high-speed port, a shell and an optical window, wherein the high-speed port adopts a differential pair structure to transmit signals. The beneficial effects of the invention are as follows: the port of the high-speed shell is mostly transmitted by adopting a differential pair with opposite phases, and the corner can lead the wiring to be more compact, thereby realizing the miniaturization of the ceramic shell. The corner structure of the differential pair can damage the symmetry of the differential pair, distortion is caused, and the differential pair structure is subjected to capacitance compensation by arranging the compensation corner pair, so that the phases of differential signals on two transmission lines are kept opposite, and the signal integrity of high-speed signal transmission is ensured. The four-channel high-speed ceramic shell combining corner compensation and surface through hole technology has good signal integrity while ensuring isolation, realizes miniaturization and high-speed under the background of rapid improvement of the current signal transmission rate, and supports photoelectric modules and chip packages with higher speed.
Description
Technical Field
The invention relates to a ceramic shell, in particular to a four-way high-speed ceramic shell, and belongs to the technical field of packaging shells of electronic components.
Background
Under the background of rapid development of communication technology, large-scale integrated circuits are widely applied to the emerging fields of network security, artificial intelligence, big data and the like, and rapidly iterate towards the directions of high speed and miniaturization. The integrated circuit module can be put into operation only after being packaged by the shell, the shell provides stable support for the module, and the microelectronic packaging technology is closely related to the design of the chip, and the integrated circuit module and the shell are mutually promoted and jointly developed. The shell is used as an important product in electronic packaging, not only provides physical support and a closed environment for the internal chip of the shell, but also plays roles of signal transmission, electromagnetic shielding and the like in the whole electronic equipment. The performance and structure of the housing plays a critical role in the assembly and practical use of the device.
The tube shells of the optical emission component (Transmitter optical sub-assembly, TOSA) and the optical receiving component (Receiver optical sub-assembly, ROSA) are composed of two ports, one end of the tube shell is connected with an optical fiber through an optical window to transmit optical signals, the other end of the tube shell is connected with an electric signal through a radio frequency port, and optical/electric or electric/optical conversion is realized inside the tube shell. The multi-channel signal transmission of the shell is necessary, and the signal transmission rate of the photoelectric shell can reach a plurality of times of the single-channel signal transmission rate through the multi-channel signal transmission.
Limited by the transmission structure of the differential pair, the four-way optical module housing currently used has a large volume, and the transmission rate is 100Gbps (4×25 Gbps). The traditional different-surface transmission structure basically adopts differential via holes to realize high-speed signal transmission, and realizes multiple channels through an array, so that crosstalk minimization is realized for ensuring the effectiveness of shielding holes, and the distance between adjacent channels is larger. Along with the improvement of the signal transmission rate, the optical communication housing adopting the traditional four-channel differential via structure for signal transmission cannot meet the development trend of high speed and miniaturization of the optical module.
Disclosure of Invention
The invention aims to solve at least one technical problem, and provides a four-channel high-speed ceramic shell which adopts a brand new compensation capacitor structure, namely corner compensation. The structure can carry out capacitance compensation for distortion caused by asymmetry of corners of the differential pair, and signal integrity is ensured. And then the compensation corner structure is combined with the corner and surface through hole structure to replace the traditional differential via hole structure, and the impedance matching is realized by adjusting the size of the transmission line and adjusting the transmission impedance. Through compact wiring and an innovative transmission mode, the size of a signal transmission port of the shell can be effectively reduced, the signal transmission rate of the shell is greatly improved, and the high-speed signal transmission rate of 4 x 56Gbps is realized. The high-speed shell with high port signal transmission rate can realize downward compatibility and can package the optical module with lower rate, so the invention provides packaging support with extremely high compatibility for the optical module and is beneficial to the development of optical communication.
The invention realizes the above purpose through the following technical scheme: the four-channel high-speed ceramic shell comprises a high-speed port, a shell and an optical window, wherein the high-speed port adopts a differential pair structure to transmit signals, the shell is a polygonal cavity for packaging at least one circuit or chip for accommodating a photoelectric module, and the optical window is connected with an optical fiber arranged outside to transmit optical signals;
the high-speed port is positioned on one side of the shell, the high-speed port is connected with the electric signal output end of the photoelectric module through a lead wire, the optical window is positioned on the other side of the shell, and the optical window is connected with the optical signal input end of the photoelectric module through a lead wire;
the high-speed port comprises an inner coplanar waveguide of the shell, corners, a surface through hole, a reference ground, a control port, an outer coplanar waveguide of the shell and a compensation corner, four-channel high-speed signal transmission channels are arranged on the reference ground, the two ends of each high-speed signal transmission channel are respectively provided with the inner coplanar waveguide of the shell and the outer coplanar waveguide of the shell, the inner coplanar waveguide of the shell and the outer coplanar waveguide of the shell are connected through the surface through hole, the corners and the compensation corners are arranged on the inner coplanar waveguide of the shell, and the control port for transmitting control signals is arranged on the upper side of each high-speed signal transmission channel.
As still further aspects of the invention: the transmission of differential signals is realized by gold wire bonding between the coplanar waveguide inside the shell and the photoelectric module circuit or chip packaged inside the shell, wherein the intercept of the coplanar waveguide inside the shell is 0.2-1.0mm.
As still further aspects of the invention: the coplanar waveguide outside the shell is connected with the ceramic shell integral component through a welded lead, wherein the intercept of the coplanar waveguide outside the shell is 0.5-1.0mm.
As still further aspects of the invention: the height of the surface through holes is 0.8-5.0mm.
As still further aspects of the invention: the height of the control port from the high-speed signal transmission channel is greater than 0.6mm.
As still further aspects of the invention: the corner and the compensation corner are designed by adopting round corner structures.
As still further aspects of the invention: the manufacturing materials of the signal transmission line and the reference ground in the high-speed signal transmission channel are metal tungsten, the manufacturing materials of the medium in the high-speed signal transmission channel are aluminum oxide ceramic or aluminum nitride ceramic, the manufacturing materials of the shell are Kovar alloy, and the manufacturing materials of the heat sink at the bottom of the shell are Kovar alloy or tungsten copper.
As still further aspects of the invention: each of the four-channel high-speed signal transmission channels can independently transmit high-speed signals.
As still further aspects of the invention: the high-speed signal transmission channels formed on the reference ground include but are not limited to four channels.
The beneficial effects of the invention are as follows: the symmetry of differential pair can be influenced to the corner structure, differential pair time delay of inequality also can not realize unanimity, can take place the distortion phenomenon after the signal passes through the corner transmission, partial differential mode signal turns into common mode signal, in order to reduce common mode noise, guarantee the signal integrity of high-speed signal, according to kirchhoff's law, need add compensation capacitance on the transmission line of turning inboard, make the characteristic impedance of two transmission lines keep unanimous, adopt the compensation corner to provide compensation capacitance, the differential signal is opposite on two transmission lines's phase place, satisfy differential signal transmission characteristic, make the transmission line design of four channel structure more compact through the corner and compensation corner, realize the miniaturization of shell. The dense via holes are arranged between four channels in a reference way for electromagnetic shielding, so that the mutual crosstalk of transmission signals of adjacent channels can be effectively restrained, and the index requirement that the isolation of the adjacent channels is more than 30dB can be realized through a dense hole filling technology. The combined surface through hole technology is used for carrying out different-surface transmission of high-speed signals, impedance matching can be better realized by adjusting the impedance of the size-adjusting surface through hole of the side wall metal surface while parasitic inductance is effectively reduced, the different-surface transmission rate of the single-channel high-speed signals is greatly improved, the single-channel signal transmission rate of the traditional differential through hole is basically lower than 25Gbps, the single-channel signal transmission rate of the surface through hole can reach 56Gbps, and after the four-channel array, the high-speed ceramic shell can meet the high-speed signal transmission rate of 4 x 56Gbps, the isolation is higher than 30dB, and miniaturization and high speed are realized.
Drawings
FIG. 1 is a schematic diagram of a signal transmission port;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is a schematic diagram of the structure of an embodiment of the present invention;
FIG. 4 is a schematic diagram of a signal transmission line;
FIG. 5 is a common mode noise contrast for a differential pair without corner structure and a differential pair with compensating corners;
FIG. 6 shows the isolation of adjacent channels in FIG. 3.
In the figure: 1. high-speed port 1-1, shell inner coplanar waveguide, 1-2, corner, 1-3, surface through hole, 1-4, reference ground, 1-5, control port, 1-6, shell outer coplanar waveguide, 1-7, compensation corner, 2, shell, 3, light window.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
As shown in fig. 1 to 4, a four-channel high-speed ceramic housing includes a high-speed port 1, a housing 2, and an optical window 3, where the high-speed port 1 uses a differential pair structure to transmit signals, the housing 2 encapsulates at least one polygonal cavity for accommodating a circuit or a chip of an optoelectronic module, and the optical window 3 is connected with an optical fiber of an external device to transmit optical signals;
the high-speed port 1 is positioned on one side of the shell 2, the high-speed port 1 is connected with the electric signal output end of the photoelectric module through a lead wire, the optical window 3 is positioned on the other side of the shell 2, and the optical window 3 is connected with the optical signal input end of the photoelectric module through a lead wire;
the high-speed port 1 comprises an inner coplanar waveguide 1-1 of a shell, corners 1-2, surface through holes 1-3, a reference ground 1-4, a control port 1-5, an outer coplanar waveguide 1-6 of the shell and compensation corners 1-7, four high-speed signal transmission channels are formed in the reference ground 1-4, the inner coplanar waveguide 1-1 of the shell and the outer coplanar waveguide 1-6 of the shell are arranged at two ends of each high-speed signal transmission channel, the inner coplanar waveguide 1-1 of the shell is connected with the outer coplanar waveguide 1-6 of the shell through the surface through holes 1-3, the corners 1-2 and the compensation corners 1-7 are arranged on the inner coplanar waveguide 1-1 of the shell, and the control port 1-5 for transmitting control signals is arranged on the upper side of each high-speed signal transmission channel.
Example two
As shown in fig. 1 to 4, this embodiment includes, in addition to all the technical features of the first embodiment, the following steps:
the transmission of differential signals is realized by gold wire bonding between the coplanar waveguide 1-1 in the shell and the photoelectric module circuit or chip packaged in the shell 2, wherein the intercept of the coplanar waveguide 1-1 in the shell is 0.2-1.0mm.
The coplanar waveguide 1-6 outside the shell is connected with the ceramic shell integral component through a welded lead wire to realize the transmission of differential signals, wherein the intercept of the coplanar waveguide 1-6 outside the shell is 0.5-1.0mm.
The height of the surface through holes 1-3 is 0.8-5.0mm.
The height from the control ports 1-5 to the high-speed signal transmission channel is larger than 0.6mm, so that the influence on the high-speed signal below is avoided.
The corners 1-2 and the compensating corners 1-7 are designed in a rounded structure, and the rounded corners are adopted to replace right angles in the structural design so as to reduce reflection.
The manufacturing materials of the signal transmission line in the high-speed signal transmission channel and the reference ground 1-4 are metal tungsten, the manufacturing materials of the medium in the high-speed signal transmission channel are aluminum oxide ceramic or aluminum nitride ceramic, the manufacturing materials of the shell 2 are kovar alloy, and the manufacturing materials of the heat sink at the bottom of the shell 2 are kovar alloy or tungsten copper.
Each of the four channels of the high-speed signal transmission channels can independently transmit a high-speed signal.
The high-speed signal transmission channels provided on the reference grounds 1-4 include, but are not limited to, four channels.
Example III
As shown in fig. 3, taking a ROSA tube shell as an example, a four-channel high-speed ceramic shell comprises a shell and signal transmission ports positioned at two sides of the shell, wherein an optical window 3 is used for inputting optical signals, an optical module packaged in the cavity converts the received optical signals into corresponding electrical signals, and the electrical signals are output through a lead by the port 1, so that the function of an optical receiving assembly is realized.
As shown in fig. 3 to 4, the four-channel high-speed ceramic housing transmits the high-speed signal generated by the internal optical module to the coplanar waveguide 1-1 inside the housing through gold wire bonding, then transmits the high-speed signal to the surface through hole 1-3 through the corner 1-2 and the compensation corner 1-7 on the strip line, realizes the out-of-plane transmission of the high-speed signal to the coplanar waveguide 1-6 outside the housing through the surface through hole, and finally transmits the high-speed signal to the external integrated circuit system through the lead wire welded by the external coplanar waveguide.
Further, in the horizontal transmission of high-speed signals, the transmission lines can be printed on the surface and inside of the ceramic by a process means of multilayer ceramic printing. In the different-surface transmission of the high-speed signal, a surface through hole structure is adopted to replace a traditional through hole structure, and compared with the traditional through hole technology of punching and then filling holes, the surface through hole needs to be opened firstly and then hung with holes, and finally a round cavity is opened for the second time, so that a pair of parallel and opposite metal surfaces are realized to transmit the high-speed differential signal.
Further, as shown in fig. 5, three structures, namely, a differential pair without a corner structure and a differential pair with a compensation corner, are subjected to common mode noise simulation, and according to simulation results, it can be seen that: when there are no corners in the differential pair, transmission characteristics of symmetry, equal length, etc. are satisfied, common mode noise is negligible with respect to the transmission voltage, and signal integrity of signal transmission is not substantially affected. When the differential pair has corners, the differential pair cannot meet the characteristics of symmetry, equal length and the like, serious common mode noise exists, and the common mode noise can adversely affect the signal integrity of signal transmission and interfere the transmission and the reception of high-speed signals. After the compensation corner is added, although common mode noise still exists, the common mode noise is obviously suppressed compared with a differential pair without the compensation corner, and the fact that the compensation corner is arranged is verified to be beneficial to improving the signal integrity of the differential pair with the corner.
Further, as shown in fig. 6, the isolation of the adjacent channels of the four-channel high-speed ceramic housing shown in fig. 3 is greater than 30dB, which indicates that the housing has good isolation, the four channels can be in independent signal transmission states, and the crosstalk between the channels does not affect the signal integrity of the high-speed port.
The invention solves the distortion problem caused by using the corner in order to realize miniaturization in the prior art, realizes the impedance matching of the transmission line by arranging the compensation corner, obviously suppresses common mode noise and ensures the signal integrity of the high-speed port. The novel surface through hole structure is adopted to replace the traditional differential via hole structure in different-surface transmission, so that parasitic inductance in the transmission structure is effectively reduced, the signal transmission rate of the high-speed port is greatly improved, and the miniaturization of the shell and the high-speed are realized.
Errors exist in the manufacturing and processing of products, and certain requirements are required on the size of a transmission structure in order to ensure printing precision, wherein the intercept of a differential pair is more than 0.2mm; the width of the surface through hole is more than 0.15mm; the radius of the anti-bonding pad is more than 0.2mm; the radius of the circular cavity is more than 0.2mm. When the height of the out-of-plane transmission is more than 0.8mm, the advantage of the through-plane via on high-speed signal transmission is more obvious compared with the traditional differential via.
The invention adopts a high-temperature ceramic co-firing technology, ceramic ports are prepared through various process steps of punching, hole filling, printing, hole hanging, lamination, cavity opening, sintering and the like, and then the ceramic packaging high-speed shell shown in figure 3 is formed after brazing, nickel plating and gold plating.
The invention adopts an innovative differential transmission structure to replace the traditional four-channel differential via structure, thereby fundamentally solving the problems of high speed and miniaturization of the optical communication shell and conforming to the development trend of optical modules.
Working principle: the four-channel high-speed ceramic shell combined with the corner compensation and the surface through hole technology has good signal integrity, can ensure isolation, realizes miniaturization and high speed under the background of rapid improvement of the current signal transmission rate, and supports a photoelectric module and chip package with higher rate.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (9)
1. A four-channel high-speed ceramic shell is characterized in that: comprises a high-speed port (1), a shell (2) and an optical window (3), wherein the high-speed port (1) adopts a differential pair structure to transmit signals, the shell (2) is a polygonal cavity for packaging at least one circuit or chip of the photoelectric module, and the optical window (3) is connected with an optical fiber arranged outside to transmit optical signals;
the high-speed port (1) is positioned on one side of the shell (2), the high-speed port (1) is connected with the electric signal output end of the photoelectric module through a lead wire, the optical window (3) is positioned on the other side of the shell (2), and the optical window (3) is connected with the optical signal input end of the photoelectric module through a lead wire;
the high-speed port (1) comprises shell inner coplanar waveguides (1-1), corners (1-2), surface through holes (1-3), reference ground (1-4), control ports (1-5), shell outer coplanar waveguides (1-6) and compensation corners (1-7), four-channel high-speed signal transmission channels are formed in the reference ground (1-4), the two ends of each high-speed signal transmission channel are provided with the shell inner coplanar waveguides (1-1) and the shell outer coplanar waveguides (1-6), the shell inner coplanar waveguides (1-1) are connected with the shell outer coplanar waveguides (1-6) through the surface through holes (1-3), the corners (1-2) and the compensation corners (1-7) are formed in the shell inner coplanar waveguides (1-1), and the control ports (1-5) for transmitting control signals are formed in the upper sides of the high-speed signal transmission channels.
2. A four-channel high-speed ceramic housing as defined in claim 1, wherein: the coplanar waveguide (1-1) inside the shell and the photoelectric module circuit or chip packaged inside the shell (2) realize transmission of differential signals through gold wire bonding, wherein the intercept of the coplanar waveguide (1-1) inside the shell is 0.2-1.0mm.
3. A four-channel high-speed ceramic housing as defined in claim 1, wherein: the coplanar waveguide (1-6) outside the shell is connected with the ceramic shell integral component through a welded lead, wherein the intercept of the coplanar waveguide (1-6) outside the shell is 0.5-1.0mm.
4. A four-channel high-speed ceramic housing as defined in claim 1, wherein: the height of the surface through holes (1-3) is 0.8-5.0mm.
5. A four-channel high-speed ceramic housing as defined in claim 1, wherein: the height from the control port (1-5) to the high-speed signal transmission channel is larger than 0.6mm, so that the influence on the high-speed signal below is avoided.
6. A four-channel high-speed ceramic housing as defined in claim 1, wherein: the corners (1-2) and the compensating corners (1-7) are designed by adopting round corner structures.
7. A four-channel high-speed ceramic housing as defined in claim 1, wherein: the manufacturing materials of the signal transmission line in the high-speed signal transmission channel and the reference ground (1-4) are metal tungsten, the manufacturing materials of the medium in the high-speed signal transmission channel are aluminum oxide ceramic or aluminum nitride ceramic, the manufacturing materials of the shell (2) are Kovar alloy, and the manufacturing materials of the heat sink at the bottom of the shell (2) are Kovar alloy or tungsten copper.
8. A four-channel high-speed ceramic housing as defined in claim 1, wherein: each of the four channels of the high-speed signal transmission channels can independently transmit a high-speed signal.
9. A four-channel high-speed ceramic housing as defined in claim 1, wherein: the high-speed signal transmission channels arranged on the reference ground (1-4) comprise but are not limited to four channels.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211562199.8A CN116360043A (en) | 2022-12-07 | 2022-12-07 | Four-channel high-speed ceramic shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211562199.8A CN116360043A (en) | 2022-12-07 | 2022-12-07 | Four-channel high-speed ceramic shell |
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| Publication Number | Publication Date |
|---|---|
| CN116360043A true CN116360043A (en) | 2023-06-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211562199.8A Pending CN116360043A (en) | 2022-12-07 | 2022-12-07 | Four-channel high-speed ceramic shell |
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| Country | Link |
|---|---|
| CN (1) | CN116360043A (en) |
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- 2022-12-07 CN CN202211562199.8A patent/CN116360043A/en active Pending
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