CN115084092A - Radio frequency front-end module of integrated filter, preparation method and wireless communication system - Google Patents
Radio frequency front-end module of integrated filter, preparation method and wireless communication system Download PDFInfo
- Publication number
- CN115084092A CN115084092A CN202210533005.5A CN202210533005A CN115084092A CN 115084092 A CN115084092 A CN 115084092A CN 202210533005 A CN202210533005 A CN 202210533005A CN 115084092 A CN115084092 A CN 115084092A
- Authority
- CN
- China
- Prior art keywords
- substrate
- filter
- radio frequency
- signal transmission
- end module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5386—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76895—Local interconnects; Local pads, as exemplified by patent document EP0896365
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
- H01P1/20327—Electromagnetic interstage coupling
- H01P1/20336—Comb or interdigital filters
- H01P1/20345—Multilayer filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/007—Manufacturing frequency-selective devices
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Geometry (AREA)
- Transceivers (AREA)
Abstract
The invention provides a radio frequency front end module of an integrated filter, a preparation method and a wireless communication system, wherein the radio frequency front end module of the integrated filter comprises the following components: the radio frequency filter comprises a multilayer substrate, and a filter and a radio frequency chip which are integrated on the multilayer substrate; the multilayer substrate is internally provided with a signal transmission line which penetrates through the multilayer substrate and is used for signal transmission; the filter is positioned between any two layers of substrates and comprises a signal input port and an output port, a plurality of first grounding holes filled with metal are symmetrically arranged around the input port and the output port, the first grounding holes are respectively and annularly distributed on one sides of the input port and the output port, which are far away from the filter body, and signal transmission lines are respectively connected with the input port and the output port; the radio frequency chip is assembled on the upper substrate, the input end of the radio frequency chip is connected with the output port of the filter through a signal transmission line, and the output end of the radio frequency chip is connected with the radio frequency signal outlet through a signal transmission line. The radio frequency front end module provided by the invention has higher integration.
Description
Technical Field
The invention relates to the field of semiconductor chip packaging, in particular to a radio frequency front-end module of an integrated filter, a preparation method and a wireless communication system.
Background
The radio frequency front end is a core component of a wireless communication system and plays a role in receiving and transmitting radio frequency signals. The main components of the radio frequency front end comprise a filter, and the filter is used for filtering frequencies except for specific frequencies. In a wireless communication system, a filter is used to filter interference and attenuate noise.
With the continuous development of communication technology, 5G terminals put forward a series of new requirements on the rf front end, such as large bandwidth, high power, low power consumption and miniaturization. In particular, radio frequency front end components used in satellite-borne, missile-borne, airborne, etc. are being developed toward miniaturization, light weight, high frequency, low cost, and high reliability. Low pass filters are important passive components of the rf front-end, which all present higher challenges to the design and production of the filter.
However, although the current filter can achieve lower loss, the requirements of miniaturization and light weight of the radio frequency front end cannot be met because the circuit needs to be protected by using an integrated package or a metal package and the like in the later stage.
Disclosure of Invention
The embodiment of the invention provides a radio frequency front end module of an integrated filter, a preparation method and a wireless communication system, aiming at solving the problem of low integration of the existing radio frequency front end.
In a first aspect, an embodiment of the present invention provides a radio frequency front end module of an integrated filter, including: the radio frequency filter comprises a multilayer substrate, and a filter and a radio frequency chip which are integrated on the multilayer substrate; wherein the content of the first and second substances,
a signal transmission line which penetrates through the multilayer substrate and is used for signal transmission is arranged in the multilayer substrate;
the filter is positioned between any two layers of substrates and comprises a signal input port and an output port, a plurality of first grounding holes filled with metal are symmetrically arranged around the input port and the output port, the first grounding holes are respectively and annularly distributed on one sides of the input port and the output port, which are far away from the filter body, and signal transmission lines are respectively connected with the input port and the output port;
the radio frequency chip is assembled on the upper substrate, the input end of the radio frequency chip is connected with the output port of the filter through a signal transmission line, and the output end of the radio frequency chip is connected with the radio frequency signal outlet through a signal transmission line.
In one possible implementation, the filter includes:
the ground metal layer is etched with a filtering cavity;
the coupling lines are arranged in the filter cavity in an interdigital mode, and one end of each coupling line is connected with the grounding metal layer; and
taps serving as input and output ports, respectively;
the first grounding hole vertically penetrates through the grounding metal layer and forms a coaxial vertical interconnection structure with the signal transmission line.
In one possible implementation manner, the multilayer substrate is a first substrate and a second substrate from bottom to top in sequence, and the filter is arranged in a first preset area on the upper surface of the first substrate;
the radio frequency chip is arranged in a second preset area of the uppermost layer substrate;
the first preset area and the second preset area are not overlapped in the direction perpendicular to the multilayer substrate.
In one possible implementation manner, the multilayer substrate is a three-layer substrate, the filter is located between the first substrate and the second substrate, a third substrate is arranged on the upper surface of the second substrate, and a radio frequency chip is arranged on the upper surface of the third substrate;
and the first substrate, the second substrate and the third substrate are respectively provided with a signal transmission line which is communicated with each other and used for connecting the filter and the radio frequency chip.
In a possible implementation manner, a second grounding hole penetrating through the first substrate is further formed in the grounding metal layer, and the second grounding hole surrounds the periphery outside the filter cavity.
In a possible implementation manner, a plurality of radio frequency chips are arranged, and the radio frequency chips are connected with each other and the signal transmission line through bonding wires.
In a possible implementation manner, a sealed package casing is further disposed at the periphery of the substrate of the radio frequency chip, and the package casing includes a package tube shell and a cover plate, and is used for packaging the radio frequency chip.
In one possible implementation manner, the multilayer substrates are bonded by using a bonding layer, wherein the bonding layer is one or a combination of tungsten, molybdenum, nickel or platinum.
In a second aspect, an embodiment of the present invention provides a method for manufacturing a radio frequency front end module of an integrated filter, including:
manufacturing interconnection through holes at preset positions of a multilayer substrate, and manufacturing a plurality of first grounding holes and second grounding holes in a preset area on the substrate of the filter to be manufactured;
preparing a grounding metal layer in a first preset area on a substrate of a filter to be manufactured, and manufacturing an interdigital cavity filter on the grounding metal layer by adopting a thick film photoetching process; the filter comprises a filter, a grounding metal layer and a first grounding hole, wherein taps of the filter are used as an input port and an output port of signal transmission, the grounding metal layer outside the input port and the output port is annularly provided with the first grounding hole, and the grounding metal layer outside the filter is provided with a second grounding hole surrounding the filter;
placing all the substrates according to a preset stacking sequence, and laminating to form a multilayer substrate;
slicing, co-firing, brazing and plating the substrate group to form a single substrate assembly;
pasting a radio frequency chip on the substrate on the uppermost layer of the single substrate assembly, and bonding the radio frequency chip with the interconnection through hole;
fix the encapsulation tube on single base plate subassembly to seal the encapsulation tube with the apron.
In a third aspect, an embodiment of the present invention provides a wireless communication system, including the rf front-end module of the integrated filter of any one of the first aspect.
According to the radio frequency front-end module of the integrated filter, the preparation method and the wireless communication system, the filter and the radio frequency chip are integrated in the multilayer substrate, the connection between the filter and the radio frequency chip is realized through the signal transmission line between the multilayer substrates, and finally the filter and the radio frequency chip are packaged together through integrated packaging, and secondary packaging is not needed in the subsequent circuit assembling process, so that the radio frequency front-end module of the integrated filter is compact in structure and light in weight, and meets the requirements of the existing wireless communication system.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of an rf front-end module of an integrated filter according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of the filter in fig. 1 according to an embodiment of the present invention.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following description is made by way of specific embodiments with reference to the accompanying drawings.
As mentioned in the background, the current rf front-end is moving towards miniaturized integration, light-weight integration, high-frequency integration, low cost, and high reliability. The low-pass filter, as an important passive device in radio frequency circuits and systems, also needs to be reduced in size on the premise of excellent performance.
At present, a filter is mainly manufactured by adopting a microstrip line, a waveguide and a cavity, and although the manufactured filter can achieve the purpose of low loss, the size of the filter is often very large. And the circuit is protected by using integrated packaging, metal packaging and other modes after the circuit is subjected to micro-assembly, the quality of the circuit is greatly improved by using the packaging materials, the process complexity is increased, and the preparation process period and the production cost are improved.
In order to solve the problems in the prior art, embodiments of the present invention provide a radio frequency front end module of an integrated filter, a manufacturing method thereof, and a wireless communication system.
A filter integrated radio frequency front end module comprising: the multilayer substrate and integrated filter and radio frequency chip on multilayer substrate.
The multilayer substrate is internally provided with a signal transmission line which penetrates through the multilayer substrate and is used for signal transmission, and the signal transmission line can be connected with the filter and the radio frequency chip and is connected with an external radio frequency signal port. The filter is located between any two layers of substrates, comprises an input port and an output port for signal transmission, is symmetrically provided with a plurality of first grounding holes filled with metal around the input port and the output port, the first grounding holes are respectively distributed on one sides of the input port and the output port far away from the filter body in a surrounding manner, and the signal transmission lines are respectively connected with the input port and the output port.
The radio frequency chip is assembled on the uppermost layer substrate, the input end of the radio frequency chip is connected with the output port of the filter through a signal transmission line, and the output end of the radio frequency chip is connected with the radio frequency signal outlet through a signal transmission line.
The radio frequency chip may include, but is not limited to, a power amplifier chip, a low noise amplifier chip, which implements amplification or noise reduction of the received/transmitted radio frequency signal.
Specifically, the conventional cavity filter requires multiple substrates to form a cavity-type filter, which occupies a large space, and the filter can be disposed between the two substrates to reduce the occupied space of the filter.
The filter is an interdigital filter, and a filtering cavity is etched on the grounding metal layer. And a tap and a coupling line are arranged in the filter cavity. The coupling lines are arranged in the filter cavity in an interdigital mode, and one end of each coupling line is connected with the grounding metal layer. The taps serve as input and output ports. The first grounding hole vertically penetrates through the grounding metal layer and forms a coaxial vertical interconnection structure with the signal transmission line.
In addition, besides the first grounding hole, a second grounding hole is also arranged outside the grounding metal layer. The first grounding hole and the second grounding hole penetrate through the upper surface and the lower surface of the substrate, and metal is filled inside the first grounding hole and the second grounding hole. The first grounding hole and the transmission through hole used as the signal transmission line form a coaxial interconnection structure. The second grounding hole surrounds the periphery of the filter cavity. The second grounding hole is mainly used for connecting a grounding plane. And the first grounding hole surrounding the input port and the output port and the signal transmission through hole on the substrate form a vertical transmission structure, namely a coaxial interconnection structure, for transmitting microwave signals. And signal transmission lines are arranged in the transmission through holes on the substrate.
And signal transmission through holes are formed in the multilayer substrate, the signal transmission through holes are three-dimensional vertical interconnection through holes, and signal transmission lines are arranged in all the signal transmission through holes and used for connecting the filter and the radio frequency chip.
In some embodiments, the multilayer substrate is a first substrate and a second substrate from bottom to top, and the filter is disposed in a first predetermined area on the upper surface of the first substrate. Namely, the grounding metal layer is positioned on the upper surface of the first preset area of the first substrate, and the filter is positioned between the first substrate and the second substrate. The radio frequency chip is arranged in a second preset area of the uppermost layer substrate. The first preset area and the second preset area are not overlapped in the direction perpendicular to the multilayer substrate. It should be noted here that the multilayer substrate includes at least three substrates, the filter is between the first substrate and the second substrate, and the rf chip is located on the upper surface of the third substrate.
The radio frequency chips can be arranged in a plurality of numbers, and the radio frequency chips are connected with the signal transmission line through bonding wires. The bonding adopts gold wire bonding, and the length of the gold wire is less than 100 times of the diameter of the gold wire.
The radio frequency chip is fixed on the upper substrate by adopting a surface mounting sintering process, and the reserved position for mounting the radio frequency chip is at least 0.05mm larger than the chip.
In addition, a sealed packaging shell is arranged on the periphery of the substrate of the radio frequency chip, and the packaging shell comprises a packaging tube shell and a cover plate and is used for packaging the radio frequency chip.
In some embodiments, the multilayer substrates are bonded together by using a bonding layer, wherein the bonding layer is made of one or more of tungsten, molybdenum, nickel or platinum.
Fig. 1 and fig. 2 together illustrate a filter-integrated rf front-end module according to an embodiment of the present invention, which includes a three-layer substrate, a filter 20, two rf chips 41, and a package.
The three substrates are a first substrate 11, a second substrate 12 and a third substrate 13 from bottom to top, three-dimensional vertical interconnection through holes are formed in the three substrates, and signal transmission lines 31 are arranged in the through holes. The filter 20 is located between the first substrate 11 and the second substrate 12. The substrate may be AlN.
A ground metal layer 21 is disposed in a first predetermined region on the first substrate 11, a filter cavity 22 is etched on the ground metal layer 21, and a plurality of coupled lines 23 and 2 taps 24 are disposed in the filter cavity 22. The plurality of coupled lines are interdigitated within the filter cavity 22 and one end of each coupled line 23 is connected to the ground metal layer 21. An input port 27 and an output port 28 for transmitting signals are provided on the two taps, respectively. First and second ground holes 25 and 26 are further formed in the ground metal layer 21, wherein a plurality of the first ground holes 25 are annularly arranged on the input port 27 and the output port 28 on the side away from the filter 20 body, and the second ground holes 26 are circumferentially arranged outside the filter cavity 22. The first ground hole 25 and the second ground hole 26 both penetrate the upper and lower sides of the first substrate 11, and are filled with metal.
The three substrates are bonded together through a bonding layer 14, and the bonding layer 14 is one or a combination of tungsten, molybdenum, nickel or platinum.
A first ground hole 25 and an input port 27 and an output port 28 on the two taps respectively. And the signal transmission lines 31 in the interconnection through holes communicated with the signal transmission lines form a coaxial vertical interconnection structure. The second ground hole 26 is mainly used for connecting a ground plane.
And the three substrates are provided with grounding holes penetrating through the substrates, and the grounding holes are connected with the grounding metal on each layer of substrate. Not shown here in the figure.
The first grounding hole 25, the second grounding hole 26 and the three-dimensional vertical interconnection through hole are all manufactured on the substrate group by adopting an HTCC AlN process.
The rf chip 41 is mounted on the third substrate 13, and an input end of the rf chip 41 is connected to the output port 28 of the filter 20 through the signal transmission line 31, and an output end of the rf chip 41 is connected to the rf signal outlet 33 through the signal transmission line 31. The input port 27 of the filter 20 is connected to a radio frequency signal inlet 32 via a signal transmission line 31. The rf signal inlet 32 and the rf signal outlet 33 are provided on the ceramic substrate.
The plurality of rf chips 41 and the signal transmission line 31 are connected by bonding wires 36. The bonding adopts gold wire bonding, and the length of the gold wire is less than 100 times of the diameter of the gold wire. The plurality of rf chips 41 are fixed on the third substrate by a sintering process.
In addition, a sealed package is disposed on the periphery of the third substrate 13, and the package includes a package case 34 and a cover plate 35 for packaging the rf chip. The sealing cap can adopt a laser sealing cap or a parallel sealing cap.
According to the radio frequency front end module of the integrated filter, the filter and the radio frequency chip are integrated in the multilayer substrate, the connection between the filter and the radio frequency chip is realized through the signal transmission line among the multilayer substrate, and finally the filter and the radio frequency chip are packaged together through integrated packaging, so that the radio frequency front end module of the integrated filter is compact in structure and light in weight and does not need to be packaged again in the subsequent circuit assembling process, and the requirements of the existing wireless communication system are met.
In a second aspect, an embodiment of the present invention provides a method for manufacturing a radio frequency front end module of an integrated filter, including:
firstly, interconnection through holes are manufactured at preset positions of a multilayer substrate, and a plurality of first grounding holes and second grounding holes are manufactured in a preset area on the substrate of the filter to be manufactured. The substrate may be AlN. And filling metal in the interconnection through hole, the first grounding hole and the second grounding hole. The first grounding hole, the second grounding hole and the three-dimensional vertical interconnection through hole are all manufactured on the substrate group by adopting an HTCC AlN process.
And then, preparing a grounding metal layer in a first preset area on the substrate of the filter to be manufactured, and manufacturing the interdigital cavity filter on the grounding metal layer by adopting a thick film photoetching process. The tap of the filter is provided with an input port and an output port for signal transmission, the grounding metal layers outside the input port and the output port are annularly provided with first grounding holes, and the grounding metal layer outside the filter is provided with a second grounding hole surrounding the filter.
And then, placing all the substrates according to a preset stacking sequence, forming a compact substrate group structure at a certain temperature and pressure, ensuring the communication of metallization patterns in the vertical direction, and laminating to form a multilayer substrate. The multilayer substrate set is diced, co-fired, soldered and plated to form a single substrate assembly.
And finally, pasting the radio frequency chip on the substrate on the uppermost layer of the single substrate assembly, and bonding the radio frequency chip and the interconnection through hole. And fixing the packaging tube shell on the single substrate assembly, and sealing the packaging tube shell by using the cover plate.
The radio frequency chip is fixed by adopting a sintering process, and the side length of the reserved position of the chip is at least 0.05mm longer than that of the chip. The fixed packaging tube shell adopts a laser sealing cap or a parallel sealing cover. The plurality of radio frequency chips and the signal transmission line are connected through bonding wires. The bonding adopts gold wire bonding, and the length of the gold wire is less than 100 times of the diameter of the gold wire.
It should be understood that, the sequence numbers of the steps in the foregoing embodiments do not imply an execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.
In addition, the invention also provides a wireless communication system, which comprises the radio frequency front-end module of the integrated filter, so that the integrated packaging of the filter and the radio frequency chip is realized, and after the filter and the radio frequency chip are assembled, the integrated packaging or metal packaging is not needed again, so that the integration level of the obtained wireless communication system is higher, and the weight of the whole system is greatly reduced.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (10)
1. A filter-integrated radio frequency front end module, comprising: the radio frequency filter comprises a multilayer substrate, and a filter and a radio frequency chip which are integrated on the multilayer substrate; wherein the content of the first and second substances,
a signal transmission line which penetrates through the multilayer substrate and is used for signal transmission is arranged in the multilayer substrate;
the filter is positioned between any two layers of substrates and comprises a signal input port and an output port, a plurality of first grounding holes filled with metal are symmetrically arranged around the input port and the output port, the first grounding holes are respectively and annularly distributed on one sides of the input port and the output port, which are far away from the filter body, and the signal transmission lines are respectively connected with the input port and the output port;
the radio frequency chip is assembled on the upper substrate, the input end of the radio frequency chip is connected with the output port of the filter through the signal transmission line, and the output end of the radio frequency chip is connected with the radio frequency signal outlet through the signal transmission line.
2. The radio frequency front end module of claim 1, wherein the filter comprises:
the ground metal layer is etched with a filtering cavity;
the coupling lines are arranged in the filter cavity in an interdigital mode, and one end of each coupling line is connected with the grounding metal layer; and
taps serving as the input port and the output port, respectively;
the first grounding hole vertically penetrates through the grounding metal layer and forms a coaxial vertical interconnection structure with the signal transmission line.
3. The rf front-end module of claim 2, wherein the multi-layer substrate comprises a first substrate and a second substrate from bottom to top, and the filter is disposed in a first predetermined area on an upper surface of the first substrate;
the radio frequency chip is arranged in a second preset area of the uppermost layer substrate;
the first preset area and the second preset area are not overlapped in the direction perpendicular to the multilayer substrate.
4. The rf front-end module of claim 3, wherein the multilayer substrate is a three-layer substrate, the filter is located between the first substrate and a second substrate, a third substrate is disposed on an upper surface of the second substrate, and the rf chip is disposed on an upper surface of the third substrate;
the first substrate, the second substrate and the third substrate are respectively provided with the signal transmission lines which are communicated with one another and used for connecting the filter and the radio frequency chip.
5. The RF front-end module of claim 3, wherein the ground metal layer further comprises a second ground via extending through the first substrate, and the second ground via surrounds the filter cavity.
6. The rf front-end module of claim 1, wherein a plurality of the rf chips are disposed, and the rf chips and the signal transmission line are connected by bonding wires.
7. The rf front-end module of claim 1, further comprising a hermetic package casing disposed around the substrate of the rf chip, wherein the package casing comprises a package casing and a cover plate for packaging the rf chip.
8. The rf front-end module of claim 1, wherein the multi-layer substrates are bonded together by an adhesive layer, wherein the adhesive layer is one or a combination of tungsten, molybdenum, nickel, or platinum.
9. A method for preparing a radio frequency front end module of an integrated filter is characterized by comprising the following steps:
manufacturing interconnection through holes at preset positions of a multilayer substrate, and manufacturing a plurality of first grounding holes and second grounding holes in a preset area on the substrate of the filter to be manufactured;
preparing a ground metal layer in a first preset area on a substrate of a filter to be manufactured, and manufacturing an interdigital cavity filter on the ground metal layer by adopting a thick film photoetching process; the taps of the filter are used as an input port and an output port for signal transmission, the first grounding holes are annularly distributed on the grounding metal layers outside the input port and the output port, and the second grounding holes surrounding the filter are arranged on the grounding metal layers outside the filter;
placing all the substrates according to a preset stacking sequence, and laminating to form a multilayer substrate;
slicing, co-firing, brazing and plating the substrate group to form a single substrate assembly;
pasting a radio frequency chip on the substrate on the uppermost layer of the single substrate assembly, and bonding the radio frequency chip with the interconnection through hole;
and fixing a packaging tube shell on the single substrate assembly, and sealing the packaging tube shell by using a cover plate.
10. A wireless communication system, characterized by a radio frequency front end module comprising an integrated filter according to any of claims 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210533005.5A CN115084092A (en) | 2022-05-11 | 2022-05-11 | Radio frequency front-end module of integrated filter, preparation method and wireless communication system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210533005.5A CN115084092A (en) | 2022-05-11 | 2022-05-11 | Radio frequency front-end module of integrated filter, preparation method and wireless communication system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115084092A true CN115084092A (en) | 2022-09-20 |
Family
ID=83247241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210533005.5A Pending CN115084092A (en) | 2022-05-11 | 2022-05-11 | Radio frequency front-end module of integrated filter, preparation method and wireless communication system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115084092A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116722335A (en) * | 2023-08-09 | 2023-09-08 | 成都华兴大地科技有限公司 | Vertical transition structure and application |
-
2022
- 2022-05-11 CN CN202210533005.5A patent/CN115084092A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116722335A (en) * | 2023-08-09 | 2023-09-08 | 成都华兴大地科技有限公司 | Vertical transition structure and application |
| CN116722335B (en) * | 2023-08-09 | 2023-10-27 | 成都华兴大地科技有限公司 | Vertical transition structure and application |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111048500B (en) | Integrally packaged radio frequency microsystem assembly | |
| KR100954030B1 (en) | Electronic component comprising a multilayer substrate and corresponding method of production | |
| US20130189935A1 (en) | LOW TEMPERATURE CO-FIRED CERAMIC (LTCC) SYSTEM IN A PACKAGE (SiP) CONFIGURATIONS FOR MICROWAVE/MILLIMETER WAVE PACKAGING APPLICATIONS | |
| CN113838845B (en) | TR assembly based on three-dimensional stacked airtight package and assembling method | |
| US8981881B2 (en) | Stacked module | |
| CN111146190B (en) | Silicon-based three-dimensional integrated microwave frequency conversion assembly | |
| JP2006203652A (en) | High frequency module and communication equipment using the same | |
| CN114613751B (en) | High-power three-dimensional stacked three-dimensional integrated radio frequency front end microsystem | |
| CN109904128B (en) | Three-dimensional integrated T/R assembly packaging structure and packaging method based on silicon-based carrier plate | |
| JP4603527B2 (en) | Modular component with capsule | |
| CN115084092A (en) | Radio frequency front-end module of integrated filter, preparation method and wireless communication system | |
| CN111555734A (en) | Surface acoustic wave switch filtering module based on RF-SiP technology and electronic equipment | |
| US9275923B2 (en) | Band pass filter for 2.5D/3D integrated circuit applications | |
| CN111525904A (en) | Laminated high-pass filter | |
| EP4325722A2 (en) | Semiconductor device, communication apparatus, and producing method thereof | |
| CN115166641A (en) | SIP-based miniaturized surface mount receiving and transmitting assembly | |
| CN116073849A (en) | POP stacking integrated miniature broadband transceiving frequency conversion module and assembly method thereof | |
| CN109067414A (en) | A kind of superhet frequency conversion chip based on sip technique | |
| JP2012222491A (en) | Module | |
| CN115469274A (en) | Miniaturized millimeter wave TR subassembly based on MMIC | |
| KR100541079B1 (en) | Ceramic package and manufacturing method thereof | |
| CN114698259A (en) | Radio frequency front end module board-level system packaging structure and packaging method thereof | |
| CN115084814B (en) | Transmit-receive front-end packaging module, preparation method and microwave communication system | |
| CN112687638B (en) | Vertical interconnected metal ceramic packaging shell, device and preparation method | |
| CN219477944U (en) | Matching component suitable for B1 frequency band MEMS resonator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |