CN116355417B - Conductive foam and preparation method thereof - Google Patents

Conductive foam and preparation method thereof Download PDF

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CN116355417B
CN116355417B CN202310393724.6A CN202310393724A CN116355417B CN 116355417 B CN116355417 B CN 116355417B CN 202310393724 A CN202310393724 A CN 202310393724A CN 116355417 B CN116355417 B CN 116355417B
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layer
parts
adhesive
core layer
silicone oil
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CN116355417A (en
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彭广周
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Xuzhou Yiyou Electronic Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
    • C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/0066—Use of inorganic compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/0066—Use of inorganic compounding ingredients
    • C08J9/0071—Nanosized fillers, i.e. having at least one dimension below 100 nanometers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/387—Borates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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    • Y02E60/10—Energy storage using batteries

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  • Organic Chemistry (AREA)
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  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
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Abstract

The application relates to the technical field of conductive foam, in particular to conductive foam and a preparation method thereof, wherein the conductive foam comprises a core layer, a coating layer and an adhesive layer, wherein the coating layer and the adhesive layer are coated outside the core layer, the adhesive layer is an adhesive for bonding the core layer and the coating layer, and the core layer comprises HTV silicone rubber and solvent-free SiO 2 Nanofluids, transition metal borates; the coating layer is copper foil with an electroplated layer on the surface; the adhesive comprises: methyl vinyl silicone oil, hydrogen-containing silicone oil, RTV silicone resin, chloroplatinic acid, 1-ethynyl cycloethanol and sepiolite fiber. The application adopts solvent-free SiO 2 The nanometer fluid and the transition metal borate improve the HTV silicone rubber which is a main material of the core layer, can improve the high temperature resistance of the core layer, and the adhesive containing sepiolite fibers is simpler in components, convenient in setting temperature during bonding, capable of improving the thermal stability of the adhesive, not easy to deglue during use and high in practicability.

Description

Conductive foam and preparation method thereof
Technical Field
The application relates to the technical field of conductive foam, in particular to conductive foam and a preparation method thereof.
Background
The conductive foam is a fiber cloth which is coated on the PU sponge and electroplated with copper and nickel, and after a series of treatments, the foam body with good surface conductivity and shielding effect is formed, and after the conductive adhesive is arranged on the back of the foam body, the foam body can be conveniently adhered or fixed on a device to be shielded. The conductive foam is mainly used for the parts of a main board of a computer, the inside of a shell, a heat radiation module, the main board of a mobile phone, a heat radiation component, a communication of a new energy automobile, a main board of a host machine and the like.
The patent application CN106675504A discloses an organic silicon rubber compound for packaging high-power integrated LEDs, the organic silicon rubber is prepared by taking methyl vinyl silicone oil and methyl vinyl MQ silicone resin as main raw materials, the organic silicon rubber provided by the patent can be used for sealing equipment after being cured, and the disclosed hydrogen-containing silicone oil is composite hydrogen-containing silicone oil and is more complex than the adhesive component provided by the application.
Patent application CN109273145a discloses a cladding type conductive foam, it includes the foam main part, and is located the surface of foam main part is used for with the conductive pressure sensitive adhesive layer that foam main part and electronic component are connected, the foam main part include the elastomer, and cladding in the outside conductive coating of elastomer, its electric conductivity comes from the conducting layer completely, and non-elastic layer, and the conducting layer is pure metal, in addition, the adhesive layer that this application provided is thermosetting and/or hot melt adhesive, needs to heat respectively under two different temperatures when bonding to bond the object of both sides respectively, and the temperature resistance of elastomer can be poor, and the practicality is relatively poor.
Therefore, the conventional conductive foam in the market at present generally has the characteristic of not resisting high temperature, is easy to degumm when being faced too little, and cannot completely meet the requirement of automatic production.
Disclosure of Invention
The application aims to provide a conductive foam and a preparation method thereof, which are used for solving the problems in the background technology.
The application is realized by the following technical scheme:
a conductive foam comprises a core layer, a coating layer coated outside the core layer and an adhesive layer, wherein the adhesive layer is an adhesive for bonding the core layer and the coating layer,
the core layer comprises the following components in parts by weight: 55-75 parts of HTV silicon rubber and solvent-free SiO 2 3-10 parts of nano fluid and 2-5 parts of transition metal borate;
the coating layer is a copper foil with an electroplated layer on the surface, and the copper foil is an electrolytic copper foil;
the raw materials of the adhesive comprise the following components in parts by weight: 3 to 7 parts of methyl vinyl silicone oil, 0.1 to 0.5 part of hydrogen-containing silicone oil, 1 to 3 parts of RTV silicone resin, 0.05 to 0.5 part of chloroplatinic acid, 0.05 to 0.5 part of 1-ethynyl cyclic ethanol and 0.1 to 3 parts of sepiolite fiber;
the HTV silicone rubber is high-temperature silicone rubber, the RTV silicone resin is room-temperature silicone rubber, the transition metal borate is zinc borate with good conductivity, the hydrogen-containing silicone oil is used as a cross-linking agent, and the 1-ethynyl cyclic ethanol is used as an inhibitor.
As a further scheme of the application, the raw materials of the conductive foam comprise the following components in parts by weight: 55-75 parts of HTV silicon rubber and solvent-free SiO 2 3-10 parts of nano fluid and 2-5 parts of transition metal borate; 5-8 parts of electroplated layer materials; 10-15 parts of copper foil; 3 to 7 parts of methyl vinyl silicone oil, 0.1 to 0.5 part of hydrogen-containing silicone oil, 1 to 3 parts of RTV silicone resin, 0.05 to 0.5 part of chloroplatinic acid, 0.05 to 0.5 part of 1-ethynyl cyclic ethanol and 0.1 to 3 parts of sepiolite fiber.
As a further aspect of the present application, the material of the plating layer is selected from any one of the following: tiN, gold, silver, nickel, chromium, zinc, titanium, palladium, cadmium, platinum, alloys of any of the above at least two materials, and a transition metal nitride, preferably TiN.
Preferably, the thickness of the core layer is 1-5 mm.
Preferably, the thickness of the coating layer is 10-20 μm, and the thickness of the adhesive layer is 5-10 μm.
Preferably, in the coating layer, the thickness of the copper foil is 6 to 12 μm, and the thickness of the plating layer is 3 to 12 μm.
Preferably, the viscosity of the methyl vinyl silicone oil is 100 to 200000cPs, more preferably 50000 to 200000cPs; the hydrogen content of the hydrogen-containing silicone oil is 0.05-0.36%; the RTV silicone resin is MQ methyl silicone resin, and the M/Q value is 0.5-1; the concentration of the chloroplatinic acid is 2000-5000 ppm.
The application also provides a preparation method of the conductive foam, which comprises the following specific steps:
s1, taking HTV silicon rubber, transition metal borate and solvent-free SiO according to set weight 2 The nano-fluid is sent into a high-speed stirrer to be mixed and stirred for 5-15 min, so as to obtain a uniformly mixed core layer material, and the core layer material is foamed or perforated to form a core layer;
s2, electroplating a metal material on the surface of the cleaned copper foil to form a copper foil with an electroplated layer on one side surface;
s3, taking methyl vinyl silicone oil, hydrogen-containing silicone oil, RTV silicone resin, 1-ethynyl cyclic ethanol and sepiolite fibers according to a set weight, sending the methyl vinyl silicone oil, the hydrogen-containing silicone oil, the RTV silicone resin and the sepiolite fibers into a high-speed stirrer for high-speed dispersion, maintaining the temperature below 25 ℃ for stirring and dispersing for 2-4 hours to obtain a premix, adding chloroplatinic acid with the set weight, maintaining the temperature below 25 ℃ for stirring for 0.5-1 hour, and uniformly mixing and stirring to obtain an adhesive;
and S4, screen printing the adhesive obtained in the step S3 on the surface of the non-electroplated metal material of the copper foil obtained in the step S2, wrapping the copper foil obtained in the step S2 on the surface of the core layer through the adhesive, compacting by using a jig, and heating in an oven to finally obtain the target conductive foam.
As a further scheme of the application, the temperature of the oven is set to be 100-150 ℃, preferably 130 ℃; the heating time is 20 to 40min, preferably 30min.
Compared with the prior art, the application has the beneficial effects that:
the application adopts solvent-free SiO 2 The nanometer fluid and the transition metal borate improve the HTV silicone rubber which is a main material of the core layer, can improve the high temperature resistance of the core layer, and the adhesive containing sepiolite fibers is simpler in component than the adhesive of the patent application CN106675504A, is convenient in setting temperature during bonding, can improve the thermal stability of the adhesive, is not easy to deglue during use, and has strong practicability.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Unless otherwise indicated, all reagents used in the examples were readily available from commercial companies, and the parts in the examples were parts by weight.
The core layer has a length of 5m×width of 5mm, and the cladding layer has a length of 5m×width of 15mm.
Example 1:
the embodiment provides a conductive foam, which comprises:
the core layer comprises the following components: 55 parts of HTV high-temperature silicon rubber and solvent-free SiO 2 3 parts of nano fluid and 3 parts of zinc borate;
the cladding layer is coated outside the core layer, and the cladding layer is an electrolytic copper foil with tin electroplated on the surface;
the adhesive layer is an adhesive for bonding the core layer and the coating layer, and the raw materials of the adhesive comprise the following components: 6 parts of methyl vinyl silicone oil with the viscosity of 50000-200000 cPs, 0.1 part of hydrogen-containing silicone oil with the hydrogen content of 0.05-0.36%, 1 part of MQ methyl silicone resin with the M/Q value of 0.5-1, 0.5 part of chloroplatinic acid with the concentration of 2000-5000 ppm, 0.4 part of 1-ethynyl cyclic ethanol and 0.1 part of sepiolite fiber;
the embodiment also provides a preparation method of the conductive foam, which comprises the following specific steps:
s1, taking HTV high-temperature silicon rubber, zinc borate and solvent-free SiO according to set weight 2 The nano-fluid is sent into a high-speed stirrer to be mixed and stirred for 5-15 min, so as to obtain a uniformly mixed core layer material, and the core layer material is foamed or perforated to form a core layer with the thickness of 3 mm;
s2, electroplating a metal material on the surface of the cleaned electrolytic copper foil with the thickness of 8 mu m to form a copper foil with a 4 mu m electroplated layer on one side surface, wherein the obtained copper foil is a coating layer with the thickness of 12 mu m;
s3, taking methyl vinyl silicone oil, hydrogen-containing silicone oil, MQ methyl silicone resin, 1-ethynyl cyclic ethanol and sepiolite fibers according to a set weight, sending the methyl vinyl silicone oil, the hydrogen-containing silicone oil, the MQ methyl silicone resin and the sepiolite fibers into a high-speed stirrer for high-speed dispersion, maintaining the temperature below 25 ℃ for stirring and dispersing for 2-4 hours to obtain a premix, adding chloroplatinic acid with the set weight, maintaining the temperature below 25 ℃ for stirring for 0.5-1 hour, and uniformly mixing and stirring to obtain an adhesive;
s4, screen printing the adhesive obtained in the step S3 on the surface of the non-electroplated metal material of the copper foil obtained in the step S2, keeping the tin-plated surface non-adhesive, wrapping the copper foil obtained in the step S2 on the surface of the core layer through the adhesive, compacting by using a jig, and heating in a baking oven at 130 ℃ for 20-40 min to finally obtain the target conductive foam, wherein the thickness of the adhesive layer is 5-10 mu m.
Example 2:
the embodiment provides a conductive foam, which comprises:
the core layer comprises the following components: 65 parts of HTV high-temperature silicon rubber and solvent-free SiO 2 5 parts of nano fluid and 4 parts of zinc borate;
the cladding layer is coated outside the core layer, and the cladding layer is an electrolytic copper foil with tin electroplated on the surface;
the adhesive layer is an adhesive for bonding the core layer and the coating layer, and the raw materials of the adhesive comprise the following components: 6 parts of methyl vinyl silicone oil with the viscosity of 50000-200000 cPs, 0.25 part of hydrogen-containing silicone oil with the hydrogen content of 0.05-0.36%, 2 parts of MQ methyl silicone resin with the M/Q value of 0.5-1, 0.5 part of chloroplatinic acid with the concentration of 2000-5000 ppm, 0.4 part of 1-ethynyl cyclic ethanol and 1 part of sepiolite fiber;
the embodiment also provides a preparation method of the conductive foam, which has the specific steps substantially identical to those of embodiment 1, and is different in that the thickness of the core layer obtained in step S1 is 5mm, and the rest is the same as embodiment 1.
Example 3:
the embodiment provides a conductive foam, which comprises:
the core layer comprises the following components: 75 parts of HTV high-temperature silicon rubber and solvent-free SiO 2 10 parts of nano fluid and 5 parts of zinc borate;
the cladding layer is coated outside the core layer, and the cladding layer is an electrolytic copper foil with tin electroplated on the surface;
the adhesive layer is an adhesive for bonding the core layer and the coating layer, and the raw materials of the adhesive comprise the following components: 7 parts of methyl vinyl silicone oil with the viscosity of 50000-200000 cPs, 0.5 part of hydrogen-containing silicone oil with the hydrogen content of 0.05-0.36%, 3 parts of MQ methyl silicone resin with the M/Q value of 0.5-1, 0.5 part of chloroplatinic acid with the concentration of 2000-5000 ppm, 0.4 part of 1-ethynyl cyclic ethanol and 3 parts of sepiolite fiber;
the embodiment also provides a preparation method of the conductive foam, which has the specific steps substantially identical to those of embodiment 1, and is different in that the thickness of the core layer obtained in step S1 is 5mm, and the rest is the same as embodiment 1.
Example 4:
the embodiment provides a conductive foam, which comprises:
the core layer comprises the following components: 65 parts of HTV high-temperature silicon rubber and solvent-free SiO 2 5 parts of nano fluid and 4 parts of zinc borate;
the coating layer is coated outside the core layer, and is an electrolytic copper foil with TiN electroplated on the surface;
the adhesive layer is an adhesive for bonding the core layer and the coating layer, and the raw materials of the adhesive comprise the following components: 6 parts of methyl vinyl silicone oil with the viscosity of 50000-200000 cPs, 0.25 part of hydrogen-containing silicone oil with the hydrogen content of 0.05-0.36%, 2 parts of MQ methyl silicone resin with the M/Q value of 0.5-1, 0.5 part of chloroplatinic acid with the concentration of 2000-5000 ppm, 0.4 part of 1-ethynyl cyclic ethanol and 1 part of sepiolite fiber;
the embodiment also provides a preparation method of the conductive foam, and the specific steps are the same as those of embodiment 2.
Example 5:
the embodiment provides a conductive foam, which comprises:
the core layer comprises the following components: 65 parts of HTV high-temperature silicon rubber and solvent-free SiO 2 5 parts of nano fluid and 4 parts of zinc borate;
the coating layer is coated outside the core layer, and is an electrolytic copper foil with TiN electroplated on the surface;
the adhesive layer is an adhesive for bonding the core layer and the coating layer, and the raw materials of the adhesive comprise the following components: 7 parts of methyl vinyl silicone oil with the viscosity of 50000-200000 cPs, 0.5 part of hydrogen-containing silicone oil with the hydrogen content of 0.05-0.36%, 3 parts of MQ methyl silicone resin with the M/Q value of 0.5-1, 0.5 part of chloroplatinic acid with the concentration of 2000-5000 ppm, 0.4 part of 1-ethynyl cyclic ethanol and 3 parts of sepiolite fiber;
the embodiment also provides a preparation method of the conductive foam, which has the specific steps substantially identical to those of embodiment 1, and is different in that the thickness of the core layer obtained in step S1 is 5mm, and the rest is the same as embodiment 1.
Comparative example provides a conductive foam, which adopts a similar technical scheme and preparation method as in example 2, and is characterized in that the raw material components comprise:
the core layer comprises the following components: 65 parts of HTV high-temperature silicone rubber;
the cladding layer is coated outside the core layer, and the cladding layer is an electrolytic copper foil with tin electroplated on the surface;
the adhesive layer is an adhesive for bonding the core layer and the coating layer, and the raw materials of the adhesive comprise the following components: 6 parts of methyl vinyl silicone oil with the viscosity of 50000-200000 cPs, 0.25 part of hydrogen-containing silicone oil with the hydrogen content of 0.05-0.36%, 2 parts of MQ methyl silicone resin with the M/Q value of 0.5-1, 0.5 part of chloroplatinic acid with the concentration of 2000-5000 ppm and 0.4 part of 1-ethynyl cyclic ethanol.
The core and bond ply materials and compositions for examples 1-5 and comparative examples are shown in Table 1.
Table 1:
example 1 Example 2 Example 3 Example 4 Example 5 Comparative example
HTV silicone rubber 55 65 75 65 65 65
Solvent-free SiO 2 Nanofluids 3 5 10 5 5 /
Zinc borate 2 4 5 4 4 /
Electroplating material for coating layer Sn Sn Sn TiN TiN Sn
Methyl vinyl silicone oil 6 6 7 6 7 6
Hydrogen-containing silicone oil 0.1 0.25 0.5 0.25 0.5 0.25
MQ methyl silicone resin 1 2 3 2 3 2
Chloroplatinic acid 0.5 0.5 0.5 0.5 0.5 0.5
1-ethynyl cyclic ethanol 0.4 0.4 0.4 0.4 0.4 0.4
Sepiolite fiber 0.1 1 3 1 3 /
The products prepared in examples 1 to 5 and comparative example were tested for welding strength, surface resistance, vertical resistance, temperature resistance and high and low temperature resistance during welding according to the SMT chip production process, and the test standards are shown in Table 2.
Table 2:
through detection, the welding strength, surface resistance, vertical resistance and high and low temperature resistance of the conductive foam provided by the embodiment of the application can completely meet the design requirements of products. The application adopts solvent-free SiO 2 The nanometer fluid and the transition metal borate improve the HTV silicone rubber which is a main material of the core layer, can improve the high temperature resistance of the core layer, and the adhesive containing sepiolite fibers is simpler in component than the adhesive of the patent application CN106675504A, is convenient in setting temperature during bonding, can improve the thermal stability of the adhesive, is not easy to deglue during use, and has strong practicability.
The preferred embodiments of the application disclosed above are intended only to assist in the explanation of the application. The preferred embodiments are not exhaustive or to limit the application to the precise form disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the application and the practical application, to thereby enable others skilled in the art to best understand and utilize the application. The application is limited only by the claims and the full scope and equivalents thereof.

Claims (7)

1. The conductive foam is characterized by comprising a core layer, a cladding layer and an adhesive layer, wherein the cladding layer and the adhesive layer are coated outside the core layer, the adhesive layer is an adhesive for bonding the core layer and the cladding layer,
the core layer comprises the following components in parts by weight: 55-75 parts of HTV silicon rubber and solvent-free SiO 2 3-10 parts of nano fluid and 2-5 parts of transition metal borate;
the coating layer is copper foil with an electroplated layer on the surface;
the raw materials of the adhesive comprise the following components in parts by weight: 3 to 7 parts of methyl vinyl silicone oil, 0.1 to 0.5 part of hydrogen-containing silicone oil, 1 to 3 parts of RTV silicone resin, 0.05 to 0.5 part of chloroplatinic acid, 0.05 to 0.5 part of 1-ethynyl cyclic ethanol and 0.1 to 3 parts of sepiolite fiber;
the material of the electroplated layer is selected from any one of the following materials: tin, gold, silver, nickel, chromium, zinc, titanium, palladium, cadmium, platinum, alloys of any of the above at least two materials, transition metal nitrides;
the viscosity of the methyl vinyl silicone oil is 100 to 200000cPs; the hydrogen content of the hydrogen-containing silicone oil is 0.05-0.36%; the RTV silicone resin is MQ methyl silicone resin, and the M/Q value is 0.5-1; the concentration of the chloroplatinic acid is 2000-5000 ppm.
2. The conductive foam according to claim 1, wherein the conductive foam comprises the following components in parts by weight: 55-75 parts of HTV silicon rubber and solvent-free SiO 2 3-10 parts of nano fluid and 2-5 parts of transition metal borate; 5-8 parts of electroplated layer materials; 10-15 parts of copper foil; 3 to 7 parts of methyl vinyl silicone oil, 0.1 to 0.5 part of hydrogen-containing silicone oil, 1 to 3 parts of RTV silicone resin, 0.05 to 0.5 part of chloroplatinic acid, 0.05 to 0.5 part of 1-ethynyl cyclic ethanol and 0.1 to 3 parts of sepiolite fiber.
3. The conductive foam of claim 1, wherein the core layer has a thickness of 1-5 mm.
4. A conductive foam according to claim 3, wherein the thickness of the coating layer is 10 to 20 μm and the thickness of the adhesive layer is 5 to 10 μm.
5. The conductive foam according to claim 4, wherein the thickness of the copper foil in the coating layer is 6 to 12 μm and the thickness of the plating layer is 3 to 12 μm.
6. A method for preparing the conductive foam according to any one of claims 1 to 5, comprising the following specific steps:
s1, taking HTV silicon rubber, transition metal borate and solvent-free SiO according to set weight 2 The nano-fluid is sent into a high-speed stirrer to be mixed and stirred for 5-15 min, so as to obtain a uniformly mixed core layer material, and the core layer material is foamed or perforated to form a core layer;
s2, electroplating a metal material on the surface of the cleaned copper foil to form a copper foil with an electroplated layer on the surface;
s3, taking methyl vinyl silicone oil, hydrogen-containing silicone oil, RTV silicone resin, 1-ethynyl cyclic ethanol and sepiolite fibers according to a set weight, sending the methyl vinyl silicone oil, the hydrogen-containing silicone oil, the RTV silicone resin and the sepiolite fibers into a high-speed stirrer for high-speed dispersion, stirring and dispersing for 2-4 hours at a temperature lower than 25 ℃ to obtain a premix, adding chloroplatinic acid with a set weight, stirring for 0.5-1 hour at a temperature lower than 25 ℃, and uniformly mixing and stirring to obtain an adhesive;
and S4, screen printing the adhesive obtained in the step S3 on the surface of the non-electroplated metal material of the copper foil obtained in the step S2, wrapping the copper foil obtained in the step S2 on the surface of the core layer through the adhesive, compacting by using a jig, and heating in an oven to finally obtain the target conductive foam.
7. The method for preparing conductive foam according to claim 6, wherein in step S4, the temperature of the oven is set to 100-150 ℃ and the heating time is 20-40 min.
CN202310393724.6A 2023-04-13 2023-04-13 Conductive foam and preparation method thereof Active CN116355417B (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103313585A (en) * 2013-05-24 2013-09-18 深圳市鸿富诚屏蔽材料有限公司 Conductive foam and preparation method thereof
CN105555116A (en) * 2016-02-22 2016-05-04 深圳市鸿富诚屏蔽材料有限公司 Conductive foam and fabrication method thereof
CN106675504A (en) * 2015-11-09 2017-05-17 北京科化新材料科技有限公司 Organic silicon rubber compound for large-power integral light-emitting diode (LED) packaging
CN109273145A (en) * 2018-11-06 2019-01-25 深圳市美信电子有限公司 A kind of cladded type conducting foam and preparation method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103313585A (en) * 2013-05-24 2013-09-18 深圳市鸿富诚屏蔽材料有限公司 Conductive foam and preparation method thereof
CN106675504A (en) * 2015-11-09 2017-05-17 北京科化新材料科技有限公司 Organic silicon rubber compound for large-power integral light-emitting diode (LED) packaging
CN105555116A (en) * 2016-02-22 2016-05-04 深圳市鸿富诚屏蔽材料有限公司 Conductive foam and fabrication method thereof
CN109273145A (en) * 2018-11-06 2019-01-25 深圳市美信电子有限公司 A kind of cladded type conducting foam and preparation method thereof

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