CN116342590A - Method and device for detecting wafer test needle mark - Google Patents
Method and device for detecting wafer test needle mark Download PDFInfo
- Publication number
- CN116342590A CN116342590A CN202310589731.3A CN202310589731A CN116342590A CN 116342590 A CN116342590 A CN 116342590A CN 202310589731 A CN202310589731 A CN 202310589731A CN 116342590 A CN116342590 A CN 116342590A
- Authority
- CN
- China
- Prior art keywords
- image
- needle mark
- size
- determining
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 58
- 238000012360 testing method Methods 0.000 title claims abstract description 41
- 238000001514 detection method Methods 0.000 claims abstract description 75
- 239000011159 matrix material Substances 0.000 claims description 80
- 238000012545 processing Methods 0.000 claims description 26
- 238000003709 image segmentation Methods 0.000 claims description 11
- 230000011218 segmentation Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 30
- 230000008569 process Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000003086 colorant Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 206010027146 Melanoderma Diseases 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
- G06T7/11—Region-based segmentation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/60—Analysis of geometric attributes
- G06T7/62—Analysis of geometric attributes of area, perimeter, diameter or volume
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
- G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Abstract
The application provides a detection method and a detection device for a wafer test needle mark, wherein the method comprises the following steps: acquiring a target image, wherein the target image comprises a pin image of a wafer and a needle mark image covering part of pins; determining size information of the needle mark and position information of the needle mark on the pin according to the target image; and determining whether the needle mark is qualified or not according to the size information and the position information. The problem that needle mark detection efficiency is lower after the wafer needle surveys among the prior art has been solved to this application.
Description
Technical Field
The application relates to the field of pixel detection, in particular to a detection method and a detection device for a wafer test needle mark.
Background
In wafer acceptance test (Wafer Acceptance Test, WAT), PADs (pins) of complete dies on the whole wafer are contacted by using metal probes, and whether the dies meet requirements is judged by applying different test conditions. After the metal probe contacts the lead 100, a trace 101 (such as a black spot shown in fig. 1) is left, and if the measured trace 101 deviates or the trace 101 is too deep (determined according to the size), the measurement result is inaccurate and the quality of the wafer is affected, wherein the problematic trace 101 is shown in fig. 2.
Therefore, the needle mark needs to be monitored after the wafer needle measurement, and when the needle mark which does not meet the specification is found, the measurement mode or the measurement machine is timely adjusted and maintained so as not to influence the measurement of the subsequent wafer, thereby causing unnecessary loss.
Currently, whether the needle mark meets the requirements mainly depends on engineers to check manually, and a plurality of defects exist depending on manual judgment: (1) the data cannot be processed in time, and the needle mark with problems cannot be alarmed in real time; (2) the method can not process a large amount of data, the capacity is improved, and a manpower gap exists; (3) the artificial judgment is subjective, and erroneous judgment can occur.
Disclosure of Invention
The main objective of the present application is to provide a method and device for detecting a trace of a wafer, so as to solve the problem of low trace detection efficiency after the wafer is detected by a needle in the prior art.
According to an aspect of the embodiment of the present invention, there is provided a method for detecting a trace of a wafer test needle, including: acquiring a target image, wherein the target image comprises a pin image of a wafer and a trace image covering part of pins; determining size information of the needle mark and position information of the needle mark on the pin according to the target image; and determining whether the needle mark is qualified or not according to the size information and the position information.
Optionally, acquiring the target image includes: acquiring a wafer image of a wafer subjected to testing; and processing the wafer image by adopting an image segmentation algorithm to extract the target image.
Optionally, processing the wafer image using an image segmentation algorithm to extract the target image includes: acquiring the actual size of the pin and the vertex coordinates of the pin in the wafer image; and carrying out region segmentation on the wafer image according to the actual size and the vertex coordinates to obtain the target image.
Optionally, determining size information of the trace and position information of the trace on the pin according to the target image includes: performing binarization processing on the target image to obtain an image matrix of the pins and the corresponding needle marks; acquiring the image size of the target image and the actual size of the pin; and determining the size information and the position information according to the image size, the actual size and the image matrix.
Optionally, determining the size information and the position information according to the image size, the actual size and the image matrix includes: determining the pixel size corresponding to each pixel point in the image matrix according to the image size and the actual size; and determining the size information and the position information according to the image matrix and the pixel size.
Optionally, determining the position information according to the image matrix and the pixel size includes: sequentially traversing each row of the image matrix along a first direction, determining whether a first target pixel exists in the row, and determining the distance between the needle mark and a first edge of the pin according to the position of the row where the first target pixel exists and the pixel size when the first target pixel exists in the row, wherein the first target pixel is the pixel point with a gray value reaching a preset value, and the first direction is perpendicular to the first edge; sequentially traversing each row of the image matrix along a second direction, determining whether the first target pixel exists in the row, and determining a distance between the needle mark and a second edge of the pin according to the position of the row where the first target pixel exists and the pixel size when the first target pixel exists in the row, wherein the second direction is opposite to the first direction, and the second edge is parallel to the first edge; sequentially traversing each column of the image matrix along a third direction, determining whether the first target pixel exists in the column, and determining a distance between the needle mark and a third edge of the pin according to the position of the column where the first target pixel exists and the pixel size when the first target pixel exists in the column, wherein the third direction is perpendicular to the third edge, and the third edge is perpendicular to the first edge and the second edge respectively; and traversing each column of the image matrix in a fourth direction sequentially, determining whether the first target pixel exists in the column, and determining the distance between the needle mark and a fourth edge of the pin according to the position of the column where the first target pixel exists and the pixel size when the first target pixel exists in the column, wherein the fourth direction is opposite to the third direction, and the fourth edge is parallel to the third edge.
Optionally, the distance between the trace and the first edge of the pin is a first distance, the distance between the trace and the second edge of the pin is a second distance, the distance between the trace and the third edge of the pin is a third distance, the distance between the trace and the fourth edge of the pin is a fourth distance, and determining the size information according to the image matrix and the pixel size includes: multiplying the absolute value of the difference between the first distance and the second distance by the pixel size to obtain the length of the needle mark; and multiplying the absolute value of the difference between the third distance and the fourth distance by the pixel size to obtain the width of the needle mark.
Optionally, after determining whether the needle mark is acceptable, the method further comprises: and sending alarm information to the terminal and/or the client under the condition that the needle mark is unqualified.
Optionally, determining whether the needle mark is qualified according to the size information and the position information includes: determining that the needle mark is qualified when the size information is in a first preset range and the position information is in a second preset range; and determining that the needle mark is unqualified when the size information is not in the first preset range or the position information is not in the second preset range.
According to still another aspect of the embodiment of the present invention, there is further provided a device for detecting a trace of a wafer, including an acquiring unit, a first determining unit, and a second determining unit, where the acquiring unit is configured to acquire a target image, where the target image includes a pin image of the wafer and a trace image covering a part of pins; the first determining unit is used for determining size information of the needle mark and position information of the needle mark on the pin according to the target image; the second determining unit is used for determining whether the needle mark is qualified or not according to the size information and the position information.
In the embodiment of the invention, compared with the problem of lower needle mark detection efficiency after the wafer needle detection in the prior art, the method and the device for detecting the needle mark based on the target image comprise the wafer pin image and the pin needle mark image, the size information of the needle mark and the position information of the needle mark on the pin are determined, whether the needle mark is qualified or not is determined according to the size information and the position information, the automatic detection of the needle mark effect is realized, the problem of low efficiency caused by the manual detection of the needle mark effect in the prior art is solved, and the higher detection efficiency is ensured. In addition, this application can handle a large amount of needle mark data fast, can in time discover unqualified needle mark, has avoided manual detection to cause to wait to examine the product and pile up, and then leads to in time finding unusual problem, has guaranteed that the quality of wafer is comparatively controllable. In addition, because the manual judgment needle mark effect has subjectivity, the problem of misjudgment can appear, the automatic detection of the application effectively solves the problem of manual misjudgment, and ensures that the detection result is more accurate.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute an undue limitation to the application. In the drawings:
FIG. 1 shows a schematic view of a normal needle mark;
FIG. 2 shows a schematic view of an abnormal needle mark;
FIG. 3 is a schematic diagram of a method for detecting a wafer test trace according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a target image obtained by performing a graph segmentation algorithm on a wafer image according to an embodiment of the present application;
FIG. 5 illustrates a generated pixel image matrix schematic in accordance with an embodiment of the present application;
FIG. 6 illustrates a schematic diagram of target image binarization according to an embodiment of the present application;
fig. 7 is a schematic flow chart of a specific method for detecting a wafer test trace according to an embodiment of the application;
fig. 8 shows a schematic diagram of a device for detecting a wafer test needle mark according to an embodiment of the application.
Wherein the above figures include the following reference numerals:
100. pins; 101. needle mark.
Detailed Description
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
In order to make the present application solution better understood by those skilled in the art, the following description will be made in detail and with reference to the accompanying drawings in the embodiments of the present application, it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, shall fall within the scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe the embodiments of the present application described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. Furthermore, in the description and in the claims, when an element is described as being "connected" to another element, the element may be "directly connected" to the other element or "connected" to the other element through a third element.
As described in the background art, in order to solve the above problem, in an exemplary embodiment of the present application, a method and an apparatus for detecting a trace of a wafer are provided.
According to an embodiment of the application, a method for detecting a wafer test needle mark is provided.
Fig. 3 is a flowchart of a method for detecting a wafer test trace according to an embodiment of the present application. As shown in fig. 3, the method comprises the steps of:
step S101, obtaining a target image, wherein the target image comprises a pin image of a wafer and a needle mark image covering part of pins;
step S102, determining size information of the needle mark and position information of the needle mark on the pin according to the target image;
Step S103, determining whether the needle mark is qualified or not according to the size information and the position information.
According to the method for detecting the needle mark of the wafer test, firstly, a target image comprising a pin image of the wafer and a needle mark image covering part of pins is obtained, then, size information of the needle mark and position information on the pins are determined according to the target image, and finally, whether the needle mark is qualified or not is judged according to the size information and the position information. Compared with the problem that the needle mark detection efficiency is lower after the wafer needle detection in the prior art, the method and the device have the advantages that the size information of the needle mark and the position information of the needle mark on the pin are determined according to the target image comprising the wafer pin image and the pin needle mark image, whether the needle mark is qualified or not is determined according to the size information and the position information, automatic detection of the needle mark effect is achieved, the problem that the efficiency is low due to the fact that the needle mark effect is detected manually in the prior art is solved, and the detection efficiency is high is guaranteed. In addition, this application can handle a large amount of needle mark data fast, can in time discover unqualified needle mark, has avoided manual detection to cause to wait to examine the product and pile up, and then leads to in time finding unusual problem, has guaranteed that the quality of wafer is comparatively controllable. In addition, because the manual judgment needle mark effect has subjectivity, the problem of misjudgment can appear, the automatic detection of the application effectively solves the problem of manual misjudgment, and ensures that the detection result is more accurate.
Specifically, according to the size information and the position information, a specific implementation manner of determining whether the needle mark is qualified may be: determining that the needle mark is qualified when the size information is within a first preset range and the position information is within a second preset range; and determining that the needle mark is unqualified when the size information is not in the first preset range or the position information is not in the second preset range.
According to a specific embodiment of the present application, acquiring a target image includes: acquiring a wafer image of the wafer shown in fig. 1 or 2 after the wafer is subjected to the test; the wafer image is processed by an image segmentation algorithm to extract the target image, resulting in an image as shown in fig. 4. And (3) carrying out image segmentation on the tested wafer image, extracting a pin image and a corresponding needle mark image from the wafer image to obtain a target wafer, and facilitating the follow-up accurate needle mark detection on the target wafer.
In order to further ensure that the wafer image is extracted more accurately, according to another specific embodiment of the present application, the processing the wafer image by using an image segmentation algorithm to extract the target image includes: acquiring the actual size of the pin and the vertex coordinates of the pin in the wafer image; and dividing the wafer image into areas according to the actual size and the vertex coordinates to obtain the target image. Because the size of the pins and the positions in the image are fixed, the target image can be accurately and completely segmented only according to the vertex coordinates and the size of the pins.
In the practical application process, the pins are all in a regular rectangular shape, and the vertex coordinates can be the upper left vertex of the pins, the lower left vertex of the pins, or the upper right vertex or the lower right vertex of the pins. Those skilled in the art can flexibly set the device according to the actual situation.
According to still another specific embodiment of the present application, determining the size information of the trace and the position information of the trace on the pin according to the target image includes: performing binarization processing on the target image shown in fig. 4, as shown in fig. 5, to obtain an image matrix of the pins and the corresponding needle marks, wherein the binarized image corresponding to the image matrix is shown in fig. 6; acquiring the image size of the target image and the actual size of the pin; and determining the size information and the position information based on the image size, the actual size, and the image matrix. The obtained target image is subjected to binarization processing to obtain an image matrix with pixel points of black and white colors, the purpose of separating a main body in a gray image from a background is achieved, the data volume required to be processed in the whole process is guaranteed to be small, operation is convenient, and then the position information and the size information of the needle mark are determined according to the size of the target image, the actual size of a pin and the image matrix, so that the automatic detection of the needle mark effect is further achieved, and the higher efficiency of the needle mark detection is further guaranteed.
Specifically, the target images with 256 brightness levels are selected through a proper threshold value, so as to obtain a binarized image capable of reflecting the needle mark and the pin characteristics. By selecting a proper threshold value, the better binarization processing effect can be ensured. The threshold may be calculated by one skilled in the art and is, in one particular embodiment, 127. When the pixel is set to 127, the background of the target image can be well converted to be pure white, the needle mark is converted to be pure black, thus, only 0 and 255 data are provided in the pixel matrix, as shown in fig. 5, 0 represents that the pixel point is pure black, 255 represents that the pixel point is pure white, the operation is greatly performed, and the efficiency of detecting the needle mark is improved.
In order to further improve the efficiency of detecting the needle mark, according to another embodiment of the present application, determining the size information and the position information according to the image size, the actual size, and the image matrix includes: determining the pixel size corresponding to each pixel point in the image matrix according to the image size and the actual size; and determining the size information and the position information according to the image matrix and the pixel size. In this embodiment, the pixel size of each pixel point in the image matrix is determined according to the image size and the actual size, and then the size information and the position information of the needle mark are determined according to the image matrix and the pixel size, so that the automatic detection of the needle mark effect is further realized, the problem of low efficiency caused by manual detection is further avoided, and the higher efficiency of the needle mark detection is further ensured.
According to still another embodiment of the present application, determining the position information according to the image matrix and the pixel size includes: sequentially traversing each row of the image matrix along a first direction, namely sequentially traversing each row downwards from a first row of the image matrix, determining whether a first target pixel exists in the row, and when the first target pixel exists in the row, indicating that the row comprises an upper edge pixel point of a needle mark, determining a distance between the needle mark and a first edge of the pin according to the position of the row where the first target pixel exists and the pixel size, wherein the first target pixel is the pixel point with a gray value reaching a preset value, and the first direction is perpendicular to the first edge; sequentially traversing each row of the image matrix along a second direction, namely traversing each row sequentially upwards from the last row of the image matrix, determining whether the first target pixel exists in the row, and if the first target pixel exists in the row, indicating that the row comprises a lower edge pixel point of a needle mark, determining a distance between the needle mark and a second edge of the pin according to the position of the row where the first target pixel exists and the pixel size, wherein the second direction is opposite to the first direction, and the second edge is parallel to the first edge; sequentially traversing each column of the image matrix along a third direction, namely traversing each column from a first column at the left side of the image matrix to the right in turn, determining whether the first target pixel exists in the column, and when the first target pixel exists in the column, indicating that the column comprises a left edge pixel point of a needle mark, determining a distance between the needle mark and a third edge of the pin according to the position of the column where the first target pixel exists and the pixel size, wherein the third direction is perpendicular to the third edge, and the third edge is perpendicular to the first edge and the second edge respectively; traversing each column of the image matrix in a fourth direction, that is, traversing each column in a left direction from a first column on a right side of the image matrix, determining whether the first target pixel exists in the column, and determining a distance between the needle mark and a fourth edge of the pin according to a position of the column where the first target pixel exists and the pixel size when the first target pixel exists in the column, wherein the fourth direction is opposite to the third direction, and the fourth edge is parallel to the third edge. Therefore, the distances between the needle mark and the upper, lower, left and right edges of the pin are further ensured to be more accurate and rapid, and the needle mark effect is further conveniently determined according to the information.
Of course, the above-described order of determining the upper, lower, left, and right edges of the needle mark is not limited to the above-described order of first upper, lower, left, and right, and may be any other order as long as the pixel points of the upper, lower, left, and right edges of the needle mark are obtained.
Specifically, the pixel point corresponding to the pin is white, the corresponding brightness level is 255, the edge pixel point of the pin mark is black, the corresponding brightness level is 0, the center pixel point is white, and the corresponding brightness level is 255, so the predetermined value is 255.
In order to further ensure that the actual size of the trace is obtained simply and quickly, and further ensure that the obtained actual size is accurate, according to still another embodiment of the present application, the distance between the trace and the first edge of the pin is a first distance, the distance between the trace and the second edge of the pin is a second distance, the distance between the trace and the third edge of the pin is a third distance, the distance between the trace and the fourth edge of the pin is a fourth distance, and the size information is determined according to the image matrix and the pixel size, including: multiplying the absolute value of the difference between the first distance and the second distance by the pixel size to obtain the length of the needle mark; and multiplying the absolute value of the difference between the third distance and the fourth distance by the pixel size to obtain the width of the needle mark. The length is the length of the needle mark in the first direction or the second direction, and the width is the length of the needle mark in the third direction or the fourth direction.
In a specific embodiment, the actual size of the wafer pins is 50×30 μm, and the image matrix obtained by binarizing the target image is a 100×60 pixel image, so that every two pixel points correspond to the actual 1 μm, and the scale is 2:1, i.e. the pixel size is 1/2. As shown in fig. 6, the first edge of the pixel matrix is traversed, whether all elements in a row have 0 is determined, until a row of 0 is found, and the number u of rows is recorded, where the actual first distance is: u/2 μm; traversing the second edge of the pixel matrix, determining whether all elements in the row have 0 or not, until the row with 0 is found, and recording the row number d, wherein the actual second distance is as follows: (60-d)/2 μm; traversing the third edge of the pixel matrix, determining whether all elements in the row have 0 or not, until the row with 0 is found, and recording the row number l, wherein the actual third distance is as follows: l/2 μm; traversing the fourth edge of the pixel matrix, determining whether all elements in the row have 0 or not until the row with 0 is found, and recording the row number r, wherein the actual fourth distance is as follows: (100-r)/2 μm; the length of the needle mark obtained from the first distance, the second distance, the third distance and the fourth distance is as follows: (d-u)/2 μm, width: (r-l)/2. Mu.m.
According to another embodiment of the present application, after determining whether the needle mark is acceptable, the method further includes: and sending alarm information to the terminal and/or the client under the condition that the needle mark is unqualified. When the needle mark is detected to be unqualified, alarm information is sent to remind a user to check and process in time, so that problems can be found in time, and the problems can be processed in time, and defective products are reduced.
Specifically, a specific flow of a method for detecting a wafer test trace according to an embodiment of the present application is shown in fig. 7, and the method includes: the method comprises the steps of obtaining a wafer image of the wafer after the wafer is subjected to testing, performing image segmentation algorithm processing on the wafer image, performing binarization processing to obtain an image matrix, generating a pixel image matrix with only 0 and 255 for the image matrix which is a black-white two-color pixel image, sequentially traversing the pixel image matrix to obtain the position distance of each pixel point, calculating to obtain the position information and the size information of the needle mark, comparing the obtained position information and size information with a judgment standard to check whether the needle mark is qualified or not, if the needle mark is qualified, continuously and circularly detecting the next needle mark, and if the needle mark is unqualified, sending alarm information by a machine to remind a user to check whether the needle mark has a problem or not.
It should be noted that the steps illustrated in the flowcharts of the figures may be performed in a computer system such as a set of computer executable instructions, and that although a logical order is illustrated in the flowcharts, in some cases the steps illustrated or described may be performed in an order other than that illustrated herein.
The embodiment of the application also provides a device for detecting the wafer test needle mark, and the device for detecting the wafer test needle mark can be used for executing the method for detecting the wafer test needle mark. The following describes a device for detecting a wafer test needle mark provided in an embodiment of the present application.
Fig. 8 is a schematic diagram of a device for detecting a wafer test needle mark according to an embodiment of the application. As shown in fig. 8, the apparatus includes an acquiring unit 10, a first determining unit 20, and a second determining unit 30, where the acquiring unit 10 is configured to acquire a target image, and the target image includes a pin image of a wafer and a trace image covering a part of pins; the first determining unit 20 is configured to determine size information of a trace and position information of the trace on the pin according to the target image; the second determining unit 30 is configured to determine whether the needle mark is acceptable or not based on the size information and the position information.
According to the detection device for the wafer test needle mark, the acquisition unit is used for acquiring the target image comprising the pin image of the wafer and the needle mark image covering part of the pins, the first determination unit is used for determining the size information of the needle mark and the position information on the pins according to the target image, and the second determination unit is used for determining whether the needle mark is qualified or not according to the size information and the position information. Compared with the problem that the needle mark detection efficiency is lower after the wafer needle detection in the prior art, the method and the device have the advantages that the size information of the needle mark and the position information of the needle mark on the pin are determined according to the target image comprising the wafer pin image and the pin needle mark image, whether the needle mark is qualified or not is determined according to the size information and the position information, automatic detection of the needle mark effect is achieved, the problem that the efficiency is low due to the fact that the needle mark effect is detected manually in the prior art is solved, and the detection efficiency is high is guaranteed. In addition, this application can handle a large amount of needle mark data fast, can in time discover unqualified needle mark, has avoided manual detection to cause to wait to examine the product and pile up, and then leads to in time finding unusual problem, has guaranteed that the quality of wafer is comparatively controllable. In addition, because the manual judgment needle mark effect has subjectivity, the problem of misjudgment can appear, the automatic detection of the application effectively solves the problem of manual misjudgment, and ensures that the detection result is more accurate.
According to a specific embodiment of the present application, the acquiring unit includes a first acquiring module and a first processing module, where the first acquiring module is configured to acquire a wafer image of the wafer after the wafer is subjected to the test, as shown in fig. 1 or fig. 2; the first processing module is configured to process the wafer image by using an image segmentation algorithm to extract the target image, so as to obtain an image as shown in fig. 4. And (3) carrying out image segmentation on the tested wafer image, extracting a pin image and a corresponding needle mark image from the wafer image to obtain a target wafer, and facilitating the follow-up accurate needle mark detection on the target wafer.
In order to further ensure that the wafer image is extracted more accurately, according to another specific embodiment of the present application, the first processing module includes an obtaining sub-module and a dividing sub-module, where the obtaining sub-module is configured to obtain an actual size of the pin and a vertex coordinate of the pin in the wafer image; the dividing sub-module is used for dividing the wafer image into areas according to the actual size and the vertex coordinates to obtain the target image. Because the size of the pins and the positions in the image are fixed, the target image can be accurately and completely segmented only according to the vertex coordinates and the size of the pins.
In the practical application process, the pins are all in a regular rectangular shape, and the vertex coordinates can be the upper left vertex of the pins, the lower left vertex of the pins, or the upper right vertex or the lower right vertex of the pins. Those skilled in the art can flexibly set the device according to the actual situation.
According to still another specific embodiment of the present application, the first determining unit includes a second processing module, a second obtaining module, and a determining module. The second processing module is configured to perform binarization processing on the target image shown in fig. 4, as shown in fig. 5, to obtain an image matrix of the pin and the corresponding pin trace, where the binarized image corresponding to the image matrix is shown in fig. 6; the second acquisition module is used for acquiring the image size of the target image and the actual size of the pin; the determining module is configured to determine the size information and the position information according to the image size, the actual size, and the image matrix. The obtained target image is subjected to binarization processing to obtain an image matrix with pixel points of black and white colors, the purpose of separating a main body in a gray image from a background is achieved, the data volume required to be processed in the whole process is guaranteed to be small, operation is convenient, and then the position information and the size information of the needle mark are determined according to the size of the target image, the actual size of a pin and the image matrix, so that the automatic detection of the needle mark effect is further achieved, and the higher efficiency of the needle mark detection is further guaranteed.
Specifically, the target images with 256 brightness levels are selected through a proper threshold value, so as to obtain a binarized image capable of reflecting the needle mark and the pin characteristics. By selecting a proper threshold value, the better binarization processing effect can be ensured. The threshold may be calculated by one skilled in the art and is, in one particular embodiment, 127. When the pixel is set to 127, the background of the target image can be well converted to be pure white, the needle mark is converted to be pure black, thus, only 0 and 255 data are provided in the pixel matrix, as shown in fig. 5, 0 represents that the pixel point is pure black, 255 represents that the pixel point is pure white, the operation is greatly performed, and the efficiency of detecting the needle mark is improved.
In order to further improve the efficiency of detecting the needle mark, according to another embodiment of the present application, the determining module includes a first determining submodule and a second determining submodule, where the first determining submodule is configured to determine a pixel size corresponding to each pixel point in the image matrix according to the image size and the actual size; the second determining submodule is used for determining the size information and the position information according to the image matrix and the pixel size. In this embodiment, the pixel size of each pixel point in the image matrix is determined according to the image size and the actual size, and then the size information and the position information of the needle mark are determined according to the image matrix and the pixel size, so that the automatic detection of the needle mark effect is further realized, the problem of low efficiency caused by manual detection is further avoided, and the higher efficiency of the needle mark detection is further ensured.
According to yet another embodiment of the present application, the second determining submodule includes traversing each row of the image matrix sequentially in a first direction, that is, traversing each row sequentially from a first row of the image matrix downward, determining whether a first target pixel exists in the row, and if the first target pixel exists in the row, indicating that the row includes an upper edge pixel point of a needle mark, determining a distance between the needle mark and a first edge of the pin according to a position of the row where the first target pixel exists and the pixel size, where the first target pixel is the pixel point whose gray value reaches a predetermined value, and where the first direction is perpendicular to the first edge; sequentially traversing each row of the image matrix along a second direction, namely traversing each row sequentially upwards from the last row of the image matrix, determining whether the first target pixel exists in the row, and if the first target pixel exists in the row, indicating that the row comprises a lower edge pixel point of a needle mark, determining a distance between the needle mark and a second edge of the pin according to the position of the row where the first target pixel exists and the pixel size, wherein the second direction is opposite to the first direction, and the second edge is parallel to the first edge; sequentially traversing each column of the image matrix along a third direction, namely traversing each column from a first column at the left side of the image matrix to the right in turn, determining whether the first target pixel exists in the column, and when the first target pixel exists in the column, indicating that the column comprises a left edge pixel point of a needle mark, determining a distance between the needle mark and a third edge of the pin according to the position of the column where the first target pixel exists and the pixel size, wherein the third direction is perpendicular to the third edge, and the third edge is perpendicular to the first edge and the second edge respectively; traversing each column of the image matrix in a fourth direction, that is, traversing each column in a left direction from a first column on a right side of the image matrix, determining whether the first target pixel exists in the column, and determining a distance between the needle mark and a fourth edge of the pin according to a position of the column where the first target pixel exists and the pixel size when the first target pixel exists in the column, wherein the fourth direction is opposite to the third direction, and the fourth edge is parallel to the third edge. Therefore, the distances between the needle mark and the upper, lower, left and right edges of the pin are further ensured to be more accurate and rapid, and the needle mark effect is further conveniently determined according to the information.
Of course, the above-described order of determining the upper, lower, left, and right edges of the needle mark is not limited to the above-described order of first upper, lower, left, and right, and may be any other order as long as the pixel points of the upper, lower, left, and right edges of the needle mark are obtained.
Specifically, the pixel point corresponding to the pin is white, the corresponding brightness level is 255, the edge pixel point of the pin mark is black, the corresponding brightness level is 0, the center pixel point is white, and the corresponding brightness level is 255, so the predetermined value is 255.
In order to further ensure that the actual size of the trace is obtained simply and quickly, and further ensure that the obtained actual size is accurate, according to still another embodiment of the present application, the distance between the trace and the first edge of the pin is a first distance, the distance between the trace and the second edge of the pin is a second distance, the distance between the trace and the third edge of the pin is a third distance, the distance between the trace and the fourth edge of the pin is a fourth distance, and the second determining submodule includes: multiplying the absolute value of the difference between the first distance and the second distance by the pixel size to obtain the length of the needle mark; and multiplying the absolute value of the difference between the third distance and the fourth distance by the pixel size to obtain the width of the needle mark. The length is the length of the needle mark in the first direction or the second direction, and the width is the length of the needle mark in the third direction or the fourth direction.
In a specific embodiment, the actual size of the wafer pins is 50×30 μm, and the image matrix obtained by binarizing the target image is a 100×60 pixel image, so that every two pixel points correspond to the actual 1 μm, and the scale is 2:1, i.e. the pixel size is 1/2. As shown in fig. 6, the first edge of the pixel matrix is traversed, whether all elements in a row have 0 is determined, until a row of 0 is found, and the number u of rows is recorded, where the actual first distance is: u/2 μm; traversing the second edge of the pixel matrix, determining whether all elements in the row have 0 or not, until the row with 0 is found, and recording the row number d, wherein the actual second distance is as follows: (60-d)/2 μm; traversing the third edge of the pixel matrix, determining whether all elements in the row have 0 or not, until the row with 0 is found, and recording the row number l, wherein the actual third distance is as follows: l/2 μm; traversing the fourth edge of the pixel matrix, determining whether all elements in the row have 0 or not until the row with 0 is found, and recording the row number r, wherein the actual fourth distance is as follows: (100-r)/2 μm; the length of the needle mark obtained from the first distance, the second distance, the third distance and the fourth distance is as follows: (d-u)/2 μm, width: (r-l)/2. Mu.m.
According to another embodiment of the present application, the apparatus further includes a sending unit, where the sending unit is configured to send an alarm message to the terminal and/or the client in case the needle mark is not qualified after determining whether the needle mark is qualified. When the needle mark is detected to be unqualified, alarm information is sent to remind a user to check and process in time, so that problems can be found in time, and the problems can be processed in time, and defective products are reduced.
Specifically, a specific flow of a method for detecting a wafer test trace according to an embodiment of the present application is shown in fig. 7, and the method includes: the method comprises the steps of obtaining a wafer image of the wafer after the wafer is subjected to testing, performing image segmentation algorithm processing on the wafer image, performing binarization processing to obtain an image matrix, generating a pixel image matrix with only 0 and 255 for the image matrix which is a black-white two-color pixel image, sequentially traversing the pixel image matrix to obtain the position distance of each pixel point, calculating to obtain the position information and the size information of the needle mark, comparing the obtained position information and size information with a judgment standard to check whether the needle mark is qualified or not, if the needle mark is qualified, continuously and circularly detecting the next needle mark, and if the needle mark is unqualified, sending alarm information by a machine to remind a user to check whether the needle mark has a problem or not.
The device for detecting the wafer test needle mark comprises a processor and a memory, wherein the acquisition unit, the first determination unit, the second determination unit and the like are all stored in the memory as program units, and the processor executes the program units stored in the memory to realize corresponding functions.
The processor includes a kernel, and the kernel fetches the corresponding program unit from the memory. The inner core can be provided with one or more cores, and the problem of low detection efficiency of the needle mark of the wafer after the needle detection in the prior art is solved by adjusting the parameters of the inner core.
The memory may include volatile memory, random Access Memory (RAM), and/or nonvolatile memory, such as Read Only Memory (ROM) or flash memory (flash RAM), among other forms in computer readable media, the memory including at least one memory chip.
The embodiment of the invention provides a computer readable storage medium, wherein a program is stored in the computer readable storage medium, and the program is executed by a processor to realize the method for detecting the wafer test needle mark.
The embodiment of the invention provides a processor, which is used for running a program, wherein the method for detecting the wafer test needle mark is executed when the program runs.
The embodiment of the invention provides equipment, which comprises a processor, a memory and a program stored in the memory and capable of running on the processor, wherein the processor realizes at least the following steps when executing the program:
step S101, obtaining a target image, wherein the target image comprises a pin image of a wafer and a needle mark image covering part of pins;
step S102, determining size information of the needle mark and position information of the needle mark on the pin according to the target image;
step S103, determining whether the needle mark is qualified or not according to the size information and the position information.
The device herein may be a server, PC, PAD, cell phone, etc.
The present application also provides a computer program product adapted to perform a program initialized with at least the following method steps when executed on a data processing device:
step S101, obtaining a target image, wherein the target image comprises a pin image of a wafer and a needle mark image covering part of pins;
step S102, determining size information of the needle mark and position information of the needle mark on the pin according to the target image;
step S103, determining whether the needle mark is qualified or not according to the size information and the position information.
The embodiment of the invention provides wafer testing equipment, which comprises one or more processors, a memory and one or more programs, wherein the one or more programs are stored in the memory and are configured to be executed by the one or more processors, and the one or more programs comprise a program for executing any one of the methods.
The wafer test equipment comprises one or more processors, a memory and one or more programs, wherein the wafer test equipment comprises one or more programs and is used for executing the wafer test needle mark detection method. Compared with the problem that the needle mark detection efficiency is lower after the wafer needle detection in the prior art, the method and the device have the advantages that the size information of the needle mark and the position information of the needle mark on the pin are determined according to the target image comprising the wafer pin image and the pin needle mark image, whether the needle mark is qualified or not is determined according to the size information and the position information, automatic detection of the needle mark effect is achieved, the problem that the efficiency is low due to the fact that the needle mark effect is detected manually in the prior art is solved, and the detection efficiency is high is guaranteed. In addition, this application can handle a large amount of needle mark data fast, can in time discover unqualified needle mark, has avoided manual detection to cause to wait to examine the product and pile up, and then leads to in time finding unusual problem, has guaranteed that the quality of wafer is comparatively controllable. In addition, because the manual judgment needle mark effect has subjectivity, the problem of misjudgment can appear, the automatic detection of the application effectively solves the problem of manual misjudgment, and ensures that the detection result is more accurate.
In the foregoing embodiments of the present invention, the descriptions of the embodiments are emphasized, and for a portion of this disclosure that is not described in detail in this embodiment, reference is made to the related descriptions of other embodiments.
In the several embodiments provided in the present application, it should be understood that the disclosed technology content may be implemented in other manners. The above-described embodiments of the apparatus are merely exemplary, and the division of the units may be a logic function division, and there may be another division manner when actually implemented, for example, a plurality of units or components may be combined or may be integrated into another system, or some features may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some interfaces, units or modules, or may be in electrical or other forms.
The units described above as separate components may or may not be physically separate, and components shown as units may or may not be physical units, may be located in one place, or may be distributed over a plurality of units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in the embodiments of the present invention may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.
The integrated units described above, if implemented in the form of software functional units and sold or used as stand-alone products, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present invention may be embodied in essence or a part contributing to the prior art or all or part of the technical solution in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a server or a network device, etc.) to perform all or part of the steps of the above-mentioned method of the various embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a removable hard disk, a magnetic disk, or an optical disk, or other various media capable of storing program codes.
From the above description, it can be seen that the above embodiments of the present application achieve the following technical effects:
1) According to the method for detecting the needle mark of the wafer test, firstly, a target image comprising a pin image of the wafer and a needle mark image covering part of pins is obtained, then, size information of the needle mark and position information on the pins are determined according to the target image, and finally, whether the needle mark is qualified or not is judged according to the size information and the position information. Compared with the problem that the needle mark detection efficiency is lower after the wafer needle detection in the prior art, the method and the device have the advantages that the size information of the needle mark and the position information of the needle mark on the pin are determined according to the target image comprising the wafer pin image and the pin needle mark image, whether the needle mark is qualified or not is determined according to the size information and the position information, automatic detection of the needle mark effect is achieved, the problem that the efficiency is low due to the fact that the needle mark effect is detected manually in the prior art is solved, and the detection efficiency is high is guaranteed. In addition, this application can handle a large amount of needle mark data fast, can in time discover unqualified needle mark, has avoided manual detection to cause to wait to examine the product and pile up, and then leads to in time finding unusual problem, has guaranteed that the quality of wafer is comparatively controllable. In addition, because the manual judgment needle mark effect has subjectivity, the problem of misjudgment can occur, the automatic detection effectively solves the problem of manual misjudgment, and ensures that the detection result is more accurate;
2) According to the detection device for the wafer test needle mark, the acquisition unit is used for acquiring the target image comprising the pin image of the wafer and the needle mark image covering part of the pins, the first determination unit is used for determining the size information of the needle mark and the position information on the pins according to the target image, and the second determination unit is used for judging whether the needle mark is qualified or not according to the size information and the position information. Compared with the problem that the needle mark detection efficiency is lower after the wafer needle detection in the prior art, the method and the device have the advantages that the size information of the needle mark and the position information of the needle mark on the pin are determined according to the target image comprising the wafer pin image and the pin needle mark image, whether the needle mark is qualified or not is determined according to the size information and the position information, automatic detection of the needle mark effect is achieved, the problem that the efficiency is low due to the fact that the needle mark effect is detected manually in the prior art is solved, and the detection efficiency is high is guaranteed. In addition, this application can handle a large amount of needle mark data fast, can in time discover unqualified needle mark, has avoided manual detection to cause to wait to examine the product and pile up, and then leads to in time finding unusual problem, has guaranteed that the quality of wafer is comparatively controllable. In addition, because the manual judgment needle mark effect has subjectivity, the problem of misjudgment can occur, the automatic detection effectively solves the problem of manual misjudgment, and ensures that the detection result is more accurate;
3) The wafer test equipment comprises one or more processors, a memory and one or more programs, wherein the wafer test equipment comprises one or more programs and is used for executing the method for detecting the needle mark of the wafer. Compared with the problem that the needle mark detection efficiency is lower after the wafer needle detection in the prior art, the method and the device have the advantages that the size information of the needle mark and the position information of the needle mark on the pin are determined according to the target image comprising the wafer pin image and the pin needle mark image, whether the needle mark is qualified or not is determined according to the size information and the position information, automatic detection of the needle mark effect is achieved, the problem that the efficiency is low due to the fact that the needle mark effect is detected manually in the prior art is solved, and the detection efficiency is high is guaranteed. In addition, this application can handle a large amount of needle mark data fast, can in time discover unqualified needle mark, has avoided manual detection to cause to wait to examine the product and pile up, and then leads to in time finding unusual problem, has guaranteed that the quality of wafer is comparatively controllable. In addition, because the manual judgment needle mark effect has subjectivity, the problem of misjudgment can appear, the automatic detection of the application effectively solves the problem of manual misjudgment, and ensures that the detection result is more accurate.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims (10)
1. The method for detecting the wafer test needle mark is characterized by comprising the following steps of:
acquiring a target image, wherein the target image comprises a pin image of a wafer and a trace image covering part of pins;
determining size information of the needle mark and position information of the needle mark on the pin according to the target image;
and determining whether the needle mark is qualified or not according to the size information and the position information.
2. The method of claim 1, wherein acquiring the target image comprises:
acquiring a wafer image of a wafer subjected to testing;
and processing the wafer image by adopting an image segmentation algorithm to extract the target image.
3. The method of claim 2, wherein processing the wafer image using an image segmentation algorithm to extract the target image comprises:
Acquiring the actual size of the pin and the vertex coordinates of the pin in the wafer image;
and carrying out region segmentation on the wafer image according to the actual size and the vertex coordinates to obtain the target image.
4. The method of claim 1, wherein determining size information of a trace and position information of the trace on the pin from the target image comprises:
performing binarization processing on the target image to obtain an image matrix of the pins and the corresponding needle marks;
acquiring the image size of the target image and the actual size of the pin;
and determining the size information and the position information according to the image size, the actual size and the image matrix.
5. The method of claim 4, wherein determining the size information and the position information based on the image size, the actual size, and the image matrix comprises:
determining the pixel size corresponding to each pixel point in the image matrix according to the image size and the actual size;
and determining the size information and the position information according to the image matrix and the pixel size.
6. The method of claim 5, wherein determining the location information based on the image matrix and the pixel size comprises:
sequentially traversing each row of the image matrix along a first direction, determining whether a first target pixel exists in the row, and determining the distance between the needle mark and a first edge of the pin according to the position of the row where the first target pixel exists and the pixel size when the first target pixel exists in the row, wherein the first target pixel is the pixel point with a gray value reaching a preset value, and the first direction is perpendicular to the first edge;
sequentially traversing each row of the image matrix along a second direction, determining whether the first target pixel exists in the row, and determining a distance between the needle mark and a second edge of the pin according to the position of the row where the first target pixel exists and the pixel size when the first target pixel exists in the row, wherein the second direction is opposite to the first direction, and the second edge is parallel to the first edge;
sequentially traversing each column of the image matrix along a third direction, determining whether the first target pixel exists in the column, and determining a distance between the needle mark and a third edge of the pin according to the position of the column where the first target pixel exists and the pixel size when the first target pixel exists in the column, wherein the third direction is perpendicular to the third edge, and the third edge is perpendicular to the first edge and the second edge respectively;
And traversing each column of the image matrix in a fourth direction sequentially, determining whether the first target pixel exists in the column, and determining the distance between the needle mark and a fourth edge of the pin according to the position of the column where the first target pixel exists and the pixel size when the first target pixel exists in the column, wherein the fourth direction is opposite to the third direction, and the fourth edge is parallel to the third edge.
7. The method of claim 5, wherein the distance between the trace and the first edge of the pin is a first distance, the distance between the trace and the second edge of the pin is a second distance, the distance between the trace and the third edge of the pin is a third distance, the distance between the trace and the fourth edge of the pin is a fourth distance, and determining the size information based on the image matrix and the pixel size comprises:
multiplying the absolute value of the difference between the first distance and the second distance by the pixel size to obtain the length of the needle mark;
and multiplying the absolute value of the difference between the third distance and the fourth distance by the pixel size to obtain the width of the needle mark.
8. The method of any one of claims 1 to 7, wherein after determining whether the needle mark is acceptable, the method further comprises:
and sending alarm information to the terminal and/or the client under the condition that the needle mark is unqualified.
9. The method according to any one of claims 1 to 7, wherein determining whether the needle mark is acceptable based on the size information and the position information, comprises:
determining that the needle mark is qualified when the size information is in a first preset range and the position information is in a second preset range;
and determining that the needle mark is unqualified when the size information is not in the first preset range or the position information is not in the second preset range.
10. The utility model provides a detection device of wafer test needle trace which characterized in that includes:
the device comprises an acquisition unit, a processing unit and a processing unit, wherein the acquisition unit is used for acquiring a target image, and the target image comprises a pin image of a wafer and a needle mark image covering part of pins;
the first determining unit is used for determining size information of the needle mark and position information of the needle mark on the pin according to the target image;
And the second determining unit is used for determining whether the needle mark is qualified or not according to the size information and the position information.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310589731.3A CN116342590B (en) | 2023-05-24 | 2023-05-24 | Method and device for detecting wafer test needle mark |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310589731.3A CN116342590B (en) | 2023-05-24 | 2023-05-24 | Method and device for detecting wafer test needle mark |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116342590A true CN116342590A (en) | 2023-06-27 |
| CN116342590B CN116342590B (en) | 2023-11-03 |
Family
ID=86880702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310589731.3A Active CN116342590B (en) | 2023-05-24 | 2023-05-24 | Method and device for detecting wafer test needle mark |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116342590B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002318263A (en) * | 2001-04-23 | 2002-10-31 | Sony Corp | Method of inspecting trace of probing needle |
| JP2006190974A (en) * | 2004-12-10 | 2006-07-20 | Dainippon Screen Mfg Co Ltd | Needle-trace sensor, and needle-trace sensing method |
| JP2006318965A (en) * | 2005-05-10 | 2006-11-24 | Matsushita Electric Ind Co Ltd | Method and apparatus for inspecting semiconductor device |
| JP2008028103A (en) * | 2006-07-20 | 2008-02-07 | Fujifilm Corp | Wafer prober |
| JP2009277871A (en) * | 2008-05-14 | 2009-11-26 | Tokyo Seimitsu Co Ltd | Probe position correcting method and prober |
| WO2019196542A1 (en) * | 2018-04-10 | 2019-10-17 | 阿里巴巴集团控股有限公司 | Image processing method and apparatus |
| CN111128782A (en) * | 2019-12-27 | 2020-05-08 | 上海华虹宏力半导体制造有限公司 | Wafer testing method |
| CN114913119A (en) * | 2022-03-02 | 2022-08-16 | 上海哥瑞利软件股份有限公司 | Automatic probe state identification method in semiconductor wafer detection process |
| CN115376948A (en) * | 2022-08-08 | 2022-11-22 | 西安紫光国芯半导体有限公司 | Wafer needle pressure testing method and system |
| CN115578318A (en) * | 2022-09-08 | 2023-01-06 | 山东万腾电子科技有限公司 | Probe needle mark detection method and system based on image processing |
-
2023
- 2023-05-24 CN CN202310589731.3A patent/CN116342590B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002318263A (en) * | 2001-04-23 | 2002-10-31 | Sony Corp | Method of inspecting trace of probing needle |
| JP2006190974A (en) * | 2004-12-10 | 2006-07-20 | Dainippon Screen Mfg Co Ltd | Needle-trace sensor, and needle-trace sensing method |
| JP2006318965A (en) * | 2005-05-10 | 2006-11-24 | Matsushita Electric Ind Co Ltd | Method and apparatus for inspecting semiconductor device |
| JP2008028103A (en) * | 2006-07-20 | 2008-02-07 | Fujifilm Corp | Wafer prober |
| JP2009277871A (en) * | 2008-05-14 | 2009-11-26 | Tokyo Seimitsu Co Ltd | Probe position correcting method and prober |
| WO2019196542A1 (en) * | 2018-04-10 | 2019-10-17 | 阿里巴巴集团控股有限公司 | Image processing method and apparatus |
| CN111128782A (en) * | 2019-12-27 | 2020-05-08 | 上海华虹宏力半导体制造有限公司 | Wafer testing method |
| CN114913119A (en) * | 2022-03-02 | 2022-08-16 | 上海哥瑞利软件股份有限公司 | Automatic probe state identification method in semiconductor wafer detection process |
| CN115376948A (en) * | 2022-08-08 | 2022-11-22 | 西安紫光国芯半导体有限公司 | Wafer needle pressure testing method and system |
| CN115578318A (en) * | 2022-09-08 | 2023-01-06 | 山东万腾电子科技有限公司 | Probe needle mark detection method and system based on image processing |
Non-Patent Citations (1)
| Title |
|---|
| 王乐乐: "基于机器视觉的全自动探针台定位技术研究", 《中国优秀硕士学位论文全文数据库电子期刊》, pages 68 - 71 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116342590B (en) | 2023-11-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI588475B (en) | Detecting defects on a wafer using template image matching | |
| CN113096130B (en) | Method and device for detecting object defects | |
| KR100598381B1 (en) | in-line typed apparatus for auto wafer-defect classification and control method thereof | |
| CN110909640A (en) | Method and device for determining water level line, storage medium and electronic device | |
| CN110443278B (en) | Method, device and equipment for detecting thickness abnormality of grid line of solar cell | |
| CN104201130B (en) | A kind of optical detecting method classified for defect | |
| CN115661040A (en) | Lithium battery cell gluing detection method and device and electronic equipment | |
| CN115775244A (en) | Coil winding detection method and device, electronic equipment and storage medium | |
| CN114881996A (en) | Defect detection method and device | |
| CN114332012A (en) | Defect detection method, device, equipment and computer readable storage medium | |
| CN113902697A (en) | Defect detection method and related device | |
| CN114581415A (en) | Method and device for detecting defects of PCB, computer equipment and storage medium | |
| CN116342590B (en) | Method and device for detecting wafer test needle mark | |
| CN115564776B (en) | Abnormal cell sample detection method and device based on machine learning | |
| CN113012121B (en) | Method and device for processing bare chip scanning result, electronic equipment and storage medium | |
| CN115564719A (en) | Battery detection method, controller and computer-readable storage medium | |
| CN111292374B (en) | Method and equipment for automatically plugging and unplugging USB interface | |
| CN109408951A (en) | A kind of the part inspection method and relevant apparatus of PCB | |
| CN114432685A (en) | Standing long jump testing method and device | |
| CN111504608B (en) | Brightness uniformity detection system and brightness uniformity detection method | |
| CN114494765A (en) | Method and device for identifying true and false cigarette identification points, electronic equipment and storage medium | |
| CN114078109A (en) | Image processing method, electronic device, and storage medium | |
| CN111256609A (en) | Method and device for detecting USB interface depth | |
| CN117274267B (en) | Automatic detection method and device for mask layout, processor and electronic equipment | |
| TW202207078A (en) | Image processing method, electronic device and storage device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |