CN116339470A - Microcontroller assembly - Google Patents
Microcontroller assembly Download PDFInfo
- Publication number
- CN116339470A CN116339470A CN202310231165.9A CN202310231165A CN116339470A CN 116339470 A CN116339470 A CN 116339470A CN 202310231165 A CN202310231165 A CN 202310231165A CN 116339470 A CN116339470 A CN 116339470A
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- CN
- China
- Prior art keywords
- ventilation
- cpu
- unit
- cavity
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009423 ventilation Methods 0.000 claims abstract description 64
- 230000017525 heat dissipation Effects 0.000 claims abstract description 25
- 239000004020 conductor Substances 0.000 claims abstract description 12
- 238000004891 communication Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 238000001816 cooling Methods 0.000 description 7
- 238000001514 detection method Methods 0.000 description 7
- 238000007664 blowing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention provides a microcontroller component, which comprises a control main board and a CPU, wherein a storage frame is arranged on the control main board, an opening is formed in the storage frame, two bayonets communicated with the opening are formed in the storage frame, the CPU is clamped in the two bayonets, pins are connected to the CPU and connected with the control main board, an elastic piece is arranged on the storage frame, a ventilation block is arranged on the elastic piece, a ventilation cavity is formed in the ventilation block, a heat conductor communicated with the ventilation cavity and propped against the CPU is arranged at the bottom of the ventilation block, and a fan communicated with the ventilation cavity is arranged on the ventilation block. The invention provides a microcontroller component, which solves the problem of poor heat dissipation effect of a CPU.
Description
Technical Field
The invention relates to the technical field of controllers, in particular to a microcontroller component.
Background
The microcontroller is a computer system incorporated in a single integrated circuit, optimized for electronic device control, which is a self-sufficient and low cost microprocessor that is emphasized over the general purpose microprocessors used in personal computers in which the various components of the control machine work in concert;
if the CPU in the controller is used for too long, the interior of the controller generates heat, the controller does not have a heat dissipation function, the controller needs to be dissipated by external air blowing, and the effect of the external air blowing is poor, so that the heat dissipation effect of the CPU in the controller is poor, and the service life of the controller is influenced.
Disclosure of Invention
Based on the technical problems in the background art, the invention provides a microcontroller component
The invention provides a microcontroller component, which comprises a control main board and a CPU, wherein a storage frame is arranged on the control main board, an opening is formed in the storage frame, two bayonets communicated with the opening are formed in the storage frame, the CPU is clamped in the two bayonets, pins are connected to the CPU and connected with the control main board, an elastic piece is arranged on the storage frame, a ventilation block is arranged on the elastic piece, a ventilation cavity is formed in the ventilation block, a heat conductor communicated with the ventilation cavity and propped against the CPU is arranged at the bottom of the ventilation block, and a fan communicated with the ventilation cavity is arranged on the ventilation block.
Preferably, the heat conductor comprises a plurality of heat conducting pipes, the plurality of heat conducting pipes are all installed at the bottom of the ventilation block, one ends of the heat conducting pipes extend into the ventilation cavity, through slotted holes are formed in the heat conducting pipes, and a plurality of heat dissipation holes communicated with the slotted holes are formed in the periphery of the heat conducting pipes.
Preferably, the elastic piece comprises a plurality of fixing rods, the fixing rods are vertically arranged on the periphery of the top of the article placing frame respectively, the ventilation block is sleeved on the fixing rods in a sliding mode, springs positioned between the article placing frame and the ventilation block are sleeved on the fixing rods, and two ends of the springs are connected with the article placing frame and the ventilation block respectively.
Preferably, the air inlet cavity is formed in the object placing frame, the heat dissipation opening communicated with the air inlet cavity is formed in the inner wall of the object placing frame, the jack communicated with the air inlet cavity is formed in the top of the object placing frame, the bottom of the ventilation block is connected with the air guide pipe communicated with the ventilation cavity, and one end, far away from the ventilation block, of the air guide pipe is inserted into the jack.
Preferably, the ventilation block is provided with a heat dissipation execution unit, and the heat dissipation execution unit is respectively and electrically connected with the control main board and the fan.
Preferably, the control main board is provided with a control storage unit, a micro instruction registering unit and a temperature detecting unit, the control storage unit, the micro instruction registering unit and the temperature detecting unit are respectively and electrically connected with the control main board and the CPU, the temperature detecting unit is respectively and electrically connected with the heat dissipation executing unit and the control storage unit, the ventilation block is internally provided with a temperature sensor positioned in the ventilation cavity, and the temperature sensor is electrically connected with the temperature detecting unit.
Preferably, the control main board is provided with a communication access port.
The microcontroller component provided by the invention has the following beneficial effects:
through the heat conductor, the fan that set up, on the heat conductor that heat when CPU produced in the course of the work, if the interior temperature of ventilation piece is too high, the accessible fan blows in the ventilation piece with cold wind to the effect of cooling to the heat conductor, simultaneously, the accessible heat conductor blows the cold wind to CPU, and quickens the circulation of CPU surrounding air, quickens the radiating effect of CPU, and this structure can improve the radiating effect of CPU, improves the life of controller.
Drawings
Fig. 1 is a schematic diagram of an overall structure of a microcontroller assembly according to the present invention.
Fig. 2 is a schematic diagram of a partial structure of a microcontroller assembly according to the present invention.
Fig. 3 is an enlarged view of fig. 2 a in accordance with the present invention.
Fig. 4 is a system diagram of a microcontroller assembly according to the present invention.
In the figure: 1. a control main board; 2. a storage frame; 3. a CPU; 4. an elastic member; 41. a fixed rod; 42. a spring; 5. a ventilation block; 6. a heat conductor; 61. a heat conduction pipe; 62. a heat radiation hole; 7. a fan; 8. an air guide pipe; 9. a heat radiation port; 10. a heat dissipation execution unit; 11. a control storage unit; 12. a micro instruction register unit; 13. and a temperature detection unit.
Detailed Description
Referring to fig. 1-4, the invention provides a microcontroller assembly, which comprises a control main board 1 and a CPU3, wherein a storage frame 2 is arranged on the control main board 1, an opening is formed in the storage frame 2, two bayonets communicated with the opening are formed on the storage frame 2, the CPU3 is clamped in the two bayonets, pins are connected to the CPU3, and the pins are connected with the control main board 1.
In this embodiment, the elastic member 4 is mounted on the storage frame 2, and the ventilation block 5 is mounted on the elastic member 4. The elastic piece 4 comprises a plurality of fixing rods 41, the plurality of fixing rods 41 are vertically arranged around the top of the article placing frame 2, the ventilation block 5 is sleeved on the plurality of fixing rods 41 in a sliding mode, springs 42 located between the article placing frame 2 and the ventilation block 5 are sleeved on the fixing rods 41, and two ends of each spring 42 are connected with the article placing frame 2 and the ventilation block 5 respectively.
In this embodiment, a ventilation cavity is formed in the ventilation block 5, and a heat conductor 6 which is communicated with the ventilation cavity and abuts against the CPU3 is installed at the bottom of the ventilation block 5. The heat conductor 6 comprises a plurality of heat conducting pipes 61, the plurality of heat conducting pipes 61 are all installed at the bottom of the ventilation block 5, one ends of the heat conducting pipes 61 extend into the ventilation cavity, through slotted holes are formed in the heat conducting pipes 61, and a plurality of heat dissipation holes 62 communicated with the slotted holes are formed in the periphery of the heat conducting pipes 61. A fan 7 communicated with the ventilation cavity is arranged on the ventilation block 5.
In this embodiment, the ventilation block 5 is mounted with a heat dissipation executing unit 10, and the heat dissipation executing unit 10 is electrically connected with the control motherboard 1 and the fan 7 respectively. The control main board 1 is provided with a control storage unit 11, a micro instruction register unit 12 and a temperature detection unit 13, the control storage unit 11, the micro instruction register unit 12 and the temperature detection unit 13 are respectively and electrically connected with the control main board 1 and the CPU3, the temperature detection unit 13 is respectively and electrically connected with the heat dissipation execution unit 10 and the control storage unit 11, a temperature sensor positioned in a ventilation cavity is arranged in the ventilation block 5, and the temperature sensor is electrically connected with the temperature detection unit 13.
It should be noted that:
when in use, in order to improve the heat dissipation effect of the CPU3, the heat generated by the CPU3 in the working process can be conducted to the heat conducting tube 61, the heat in the ventilation block 5 can be correspondingly increased, the temperature sensor in the ventilation cavity can be used for transmitting the temperature real-time data to the temperature detection unit 13, the temperature detection unit 13 feeds the corresponding data back to the control storage unit 11, then the control storage unit 11 transmits the data to the micro-instruction registering unit 12 for storage and analysis, the micro-instruction registering unit 12 feeds the analyzed data back to the control storage unit 11, if the temperature exceeds a preset value, the control storage unit 11 can be used for transmitting the instruction of the fan 7 to the heat dissipation execution unit 10, the fan 7 can be controlled to work through the heat dissipation execution unit 10, the fan 7 can be used for blowing cold air into the ventilation block 5, thereby cooling the heat conducting tube 61 can be used for cooling the heat conducting tube 61, meanwhile, the heat conducting tube 61 can be used for blowing cold air to the CPU3, part of the cold air can be discharged from the heat dissipation holes 62 on the side surface of the heat conducting tube 61, and the circulation of the air around the CPU3 can be accelerated, and the CPU3 can be accelerated.
In a specific embodiment, an air inlet cavity is formed in the storage frame 2, a heat dissipation opening 9 communicated with the air inlet cavity is formed in the inner wall of the storage frame 2, a jack communicated with the air inlet cavity is formed in the top of the storage frame 2, an air guide pipe 8 communicated with the air inlet cavity is connected to the bottom of the air guide block 5, and one end, far away from the air guide pipe 5, of the air guide pipe 8 is inserted into the jack.
When the cooling fan is used, in order to further improve the heat dissipation efficiency of the CPU3, when the fan 7 works, corresponding cold air can enter an air inlet cavity formed in the storage frame 2 through the air guide pipe 8, and then the cold air can be blown to the CPU3 through the heat dissipation opening 9 on the inner wall of the storage frame 2, so that the cooling and heat dissipation effects on the CPU3 are achieved, and the cooling efficiency of the CPU3 can be further improved through the cooling fan.
In the specific embodiment, a communication access port is arranged on the control main board 1; in practical use, a 4G or 5G module is selected.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (7)
1. The utility model provides a microcontroller subassembly, its characterized in that includes, control mainboard (1), CPU (3), install on control mainboard (1) and put thing frame (2), be formed with in putting thing frame (2) uncovered and put and offered two bayonet sockets with uncovered intercommunication on thing frame (2), CPU (3) joint is in two bayonet sockets, be connected with pin and pin on CPU (3) and be connected with control mainboard (1), install on putting thing frame (2) elastic component (4) and install ventilation piece (5), set up in ventilation cavity and ventilation piece (5) bottom install with ventilation cavity intercommunication and support on CPU (3) heat conductor (6), install on ventilation piece (5) fan (7) with ventilation cavity intercommunication.
2. A microcontroller assembly as claimed in claim 1, wherein: the heat conductor (6) comprises a plurality of heat conducting pipes (61), the plurality of heat conducting pipes (61) are all installed at the bottom of the ventilation block (5), one end of each heat conducting pipe (61) extends into the ventilation cavity, a through slot hole is formed in each heat conducting pipe (61), and a plurality of heat radiating holes (62) communicated with the slot holes are formed in the periphery of each heat conducting pipe (61).
3. A microcontroller assembly as claimed in claim 2, wherein: the elastic piece (4) comprises a plurality of fixing rods (41), the fixing rods (41) are vertically arranged around the top of the article placing frame (2) respectively, the ventilation blocks (5) are sleeved on the fixing rods (41) in a sliding mode, springs (42) located between the article placing frame (2) and the ventilation blocks (5) are sleeved on the fixing rods (41), and two ends of each spring (42) are connected with the article placing frame (2) and the ventilation blocks (5) respectively.
4. A microcontroller assembly according to claim 3, wherein: the utility model discloses a ventilating structure of a refrigerator, including a storage frame (2), a ventilation block (5), an air inlet cavity is arranged in the storage frame (2), a heat dissipation opening (9) communicated with the air inlet cavity is arranged in the inner wall of the storage frame (2), a jack communicated with the air inlet cavity is arranged at the top of the storage frame (2), an air guide pipe (8) communicated with the ventilation cavity is connected to the bottom of the ventilation block (5), and one end of the air guide pipe (8) away from the ventilation block (5) is inserted into the jack.
5. A microcontroller assembly according to any one of claims 1-4, wherein: the ventilation block (5) is provided with a heat dissipation execution unit (10), and the heat dissipation execution unit (10) is electrically connected with the control main board (1) and the fan (7) respectively.
6. A microcontroller assembly as defined in claim 5, wherein: the control main board (1) is provided with a control storage unit (11), a micro instruction registering unit (12) and a temperature detecting unit (13), the control storage unit (11), the micro instruction registering unit (12) and the temperature detecting unit (13) are respectively and electrically connected with the control main board (1) and the CPU (3), the temperature detecting unit (13) is respectively and electrically connected with the heat dissipation executing unit (10) and the control storage unit (11), the ventilation block (5) is internally provided with a temperature sensor positioned in a ventilation cavity, and the temperature sensor is electrically connected with the temperature detecting unit (13).
7. A microcontroller assembly as defined in claim 5, wherein: the control main board (1) is provided with a communication access port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310231165.9A CN116339470A (en) | 2023-03-01 | 2023-03-01 | Microcontroller assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310231165.9A CN116339470A (en) | 2023-03-01 | 2023-03-01 | Microcontroller assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116339470A true CN116339470A (en) | 2023-06-27 |
Family
ID=86892305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310231165.9A Pending CN116339470A (en) | 2023-03-01 | 2023-03-01 | Microcontroller assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116339470A (en) |
-
2023
- 2023-03-01 CN CN202310231165.9A patent/CN116339470A/en active Pending
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