CN116336761B - Electroplating machine drying mechanism based on wafer electroplating - Google Patents
Electroplating machine drying mechanism based on wafer electroplating Download PDFInfo
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- CN116336761B CN116336761B CN202310624429.7A CN202310624429A CN116336761B CN 116336761 B CN116336761 B CN 116336761B CN 202310624429 A CN202310624429 A CN 202310624429A CN 116336761 B CN116336761 B CN 116336761B
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- wafer
- action box
- pipe
- box body
- protective cover
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- 230000007246 mechanism Effects 0.000 title claims abstract description 84
- 238000001035 drying Methods 0.000 title claims abstract description 70
- 238000009713 electroplating Methods 0.000 title claims abstract description 47
- 230000009471 action Effects 0.000 claims abstract description 93
- 230000001681 protective effect Effects 0.000 claims abstract description 49
- 238000005507 spraying Methods 0.000 claims abstract description 25
- 230000007306 turnover Effects 0.000 claims abstract description 16
- 238000003860 storage Methods 0.000 claims description 28
- 229920000742 Cotton Polymers 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 238000009826 distribution Methods 0.000 claims description 7
- 238000001914 filtration Methods 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 abstract description 94
- 238000002360 preparation method Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 10
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 9
- 235000017491 Bambusa tulda Nutrition 0.000 description 9
- 241001330002 Bambuseae Species 0.000 description 9
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 9
- 239000011425 bamboo Substances 0.000 description 9
- 230000018044 dehydration Effects 0.000 description 9
- 238000006297 dehydration reaction Methods 0.000 description 9
- 238000004321 preservation Methods 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 6
- 230000003139 buffering effect Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 244000309464 bull Species 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B11/00—Machines or apparatus for drying solid materials or objects with movement which is non-progressive
- F26B11/02—Machines or apparatus for drying solid materials or objects with movement which is non-progressive in moving drums or other mainly-closed receptacles
- F26B11/08—Machines or apparatus for drying solid materials or objects with movement which is non-progressive in moving drums or other mainly-closed receptacles rotating about a vertical or steeply-inclined axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/001—Drying-air generating units, e.g. movable, independent of drying enclosure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/06—Chambers, containers, or receptacles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/06—Chambers, containers, or receptacles
- F26B25/08—Parts thereof
- F26B25/12—Walls or sides; Doors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention belongs to the technical field of wafer preparation processes, and particularly relates to a wafer electroplating-based electroplating machine drying mechanism which comprises a flower basket for placing wafers and an action box body for drying the wafers in the flower basket, wherein a protective cover plate is arranged above the action box body, a turnover mechanism is arranged between the action box body and the protective cover plate, and a clamping mechanism for placing the flower basket and a gas spraying mechanism for drying the wafers in the flower basket are respectively arranged in the action box body. This electroplating machine drying mechanism based on wafer is electroplated, through the inside top cylinder of action box action, drive the one end of actuating lever when upwards jack-up, can open the anticlockwise upset of protective cover plate, and the stroke pole slides in the slip recess of connecting the otic placode to make anti-skidding apron hang in one side of action box, can reduce the occupation space of open position, thereby avoid keeping the sealed door of vertical state to cause the scratch to the surface of wafer.
Description
Technical Field
The invention relates to the technical field of wafer preparation processes, in particular to an electroplating machine drying mechanism based on wafer electroplating.
Background
At present, when spin-drying is performed on the surface of a wafer after electroplating, some wafer production enterprises need to adopt corresponding spin-drying equipment to enable the wafer to be in a rotating state, spray hot drying gas on the surface of the wafer to enable the surface of the wafer to be kept dry after electroplating, and enable the hot drying gas to be stably diffused under the driving of the rotating wafer so as to achieve rapid drying. But in the spin-drying process, spin-drying equipment is the switch door that opens easily produces the scratch to the wafer that transports the drying bench top through the manipulator, and open switch door is in vertical state moreover and makes its occupation space great easily, and current hot dry gas need filter pretreatment to it when getting into the drying bench inside simultaneously, otherwise very easily influences the technology on wafer surface.
Disclosure of Invention
The invention provides a wafer electroplating-based electroplating machine drying mechanism, which is based on the technical problems that the existing wafer electroplating-based electroplating machine drying equipment is extremely easy to scratch the surface of a wafer, and the process of the surface of the wafer is easily influenced by impurities contained in the gas for drying the wafer.
The invention provides a wafer electroplating-based electroplating machine drying mechanism, which comprises a basket for placing wafers and an action box body for drying the wafers in the basket, wherein a protective cover plate is arranged above the action box body, a turnover mechanism is arranged between the action box body and the protective cover plate, and a clamping mechanism for placing the basket and a gas spraying mechanism for drying the wafers in the basket are respectively arranged in the action box body.
The turnover mechanism enables the action box body to be connected with the protective cover plate and drives the protective cover plate to conduct covering action on the upper surface of the action box body.
After lifting action, the clamping mechanism clamps the flower basket, so that the flower basket is fixed in position in the action box body.
The gas spraying mechanism performs annular spraying action above the basket after filtering and drying to dry the wafer.
Preferably, the turnover mechanism comprises hinged connection seats which are fixedly arranged on the upper surface of one end of the action box body and symmetrically distributed, and the surface of each hinged connection seat is hinged with a connection plate with a sliding groove on one side surface through a connection shaft.
Through above-mentioned technical scheme, the surface cladding of hinge joint seat has the guard skin of rubber material, in order to make the guard flap upset cover action box to need make tilting mechanism act and drive the guard flap, therefore set up the connecting plate at the surface of hinge joint seat, make the connecting plate be connected with the guard flap and realize the linkage, and can play the effect of direction through seting up the slip recess at the surface of connecting plate.
Preferably, the tilting mechanism is still including being symmetric distribution fixed connection the stroke pole of protective cover plate one side surface, the surface of stroke pole through the guide way of seting up with the surface of connecting plate is through the guide bar mutually supporting and slip joint of installation, one side surface fixedly connected with of protective cover plate is symmetric distribution's connection otic placode, and the surface of connecting otic placode articulates through the articulated shaft has the promotion protective cover plate carries out the actuating lever of upset, one side surface fixedly connected with rubber material's blotter of action box.
Through above-mentioned technical scheme, in order to be connected the tilting mechanism in the action box of being convenient for with protective cover and action box and move protective cover to make stroke pole and connecting rod gomphosis, in order to make protective cover overturn and cover action box or open, and then can jack-up or pull being certain radian actuating lever one end, can make the actuating lever drive protective cover slide about the surface of connecting plate under the linkage and realize protective cover's opening or closing, avoid colliding action box when making protective cover open in one side of action box, thereby separate protective cover and action box through the blotter.
Preferably, the turnover mechanism further comprises a pushing cylinder hinged with one end of the driving rod through a connecting block, the lower end of a shell of the pushing cylinder is hinged with the inner wall of the action box body through a hinged block, a buffer spring is fixedly sleeved on the outer surface of the shell of the pushing cylinder, and the free end of the buffer spring is fixedly connected with the surface of the connecting block of the driving rod.
Through the technical scheme, the pushing cylinder is installed on the inner side walls of the two sides of the action box body, in order to jack up or pull down one end of the driving rod upwards, the piston rod of the pushing cylinder is hinged with one end of the driving rod through the connecting block, and then under the buffering of the buffer spring, one end of the driving rod can be turned over and opened anticlockwise when the driving rod is jacked upwards, and the travel rod slides in the sliding groove of the connecting plate, so that the anti-slip cover plate is suspended on one side of the action box body, and the occupied space of the opening position can be reduced.
Preferably, the clamping mechanism comprises a draining cylinder which is arranged on the upper surface of a centrifugal rotating rod and is used for carrying out centrifugal rotation, the circumferential outer surface of the draining cylinder is distributed in an annular array, draining holes are formed in a penetrating mode, a telescopic cylinder which is used for carrying out up-down telescopic action is fixedly arranged on the inner bottom wall of the draining cylinder, and a placing bottom plate is fixedly connected to the upper surface of a piston rod of the telescopic cylinder.
Through the technical scheme, the wafer is required to be placed in the basket for batch cleaning after electroplating, the surface of the wafer is required to be kept dry after cleaning is finished, in order to accelerate the drying process, the basket with the wafer is placed on the placing bottom plate in the draining cylinder through the clamping manipulator, the centrifugal motor arranged in the action box body is used for controlling the centrifugal rotating rod to rotate at a high speed, and then the draining cylinder is used for driving the basket in the draining cylinder to perform centrifugal swing, so that the cleaning liquid on the surface of the wafer can be thrown out in advance and discharged from the draining hole, the piston rod of the draining cylinder is upwards pushed out of the draining cylinder through the telescopic cylinder in order to facilitate the clamping manipulator to prevent scraping when the wafer is placed in the draining cylinder, and then the flower basket is reset by the telescopic cylinder, so that the basket is placed in the draining cylinder to complete dehydration.
Preferably, the clamping mechanism further comprises clamping cylinders symmetrically arranged on the lower surface of the placing bottom plate, a horizontal chute used for sliding the clamping jaws of the clamping cylinders is formed in the upper surface of the placing bottom plate, clamping plates used for clamping the outer surface of the lower end of the flower basket are fixedly connected to one side surface of the clamping jaws of the clamping cylinders, and a discharge pipe communicated with the inner portion of the action box is fixedly connected to one side surface of the action box.
Through the technical scheme, in order to enable the draining cylinder to drive the basket to centrifugally rotate, the wafer in the basket is dehydrated and then the surface of the wafer is dried, then after the wafer is placed on the placing bottom plate by the clamping manipulator, the clamping cylinder at the bottom of the clamping cylinder acts, so that the clamping plate can clamp and fix the lower end of the basket, the dehydration of the draining cylinder is realized, and the cleaning liquid can be discharged through the discharge pipe to keep the inside of the action box dry.
Preferably, the gas spraying mechanism comprises a gas storage tank which is installed inside the action box body through a bracket, an insulation ring is fixedly sleeved on the outer surface of the gas storage tank, and a heating pipe is arranged between the inner surface of the insulation ring and the outer surface of the gas storage tank.
Through the technical scheme, hot dry gas for wafer drying is firstly introduced into the gas storage tank for storage pretreatment, the heat preservation ring is made of rubber plastic heat preservation plates, so that the gas in the gas storage tank can be further subjected to heat preservation treatment, and the gas for wafer drying in the gas storage tank is preheated, so that a heating pipe in a spiral shape is arranged on the outer surface of the gas storage tank, and the gas in the tank is preheated through the heating pipe.
Preferably, the gas spraying mechanism further comprises a vent pipe for outputting pretreatment gas, one end of the vent pipe is fixedly communicated with the air outlet end of the gas storage tank, and a filter core pipe is arranged on the inner wall of the air inlet end of the vent pipe.
Through the technical scheme, in order to avoid the damage of the wafer surface process caused by impurities in the dry gas output from the gas storage tank, the pretreated gas is filtered through the filter core tube before being introduced through the vent pipe, and moisture absorption cotton is contained in the filter core tube, so that the input gas can be further ensured to be in a dry state.
Preferably, the gas spraying mechanism further comprises a processing annular pipe above the draining cylinder, the head end and the tail end of the processing annular pipe are fixedly communicated with a communication pipe which is inclined and provided with an electromagnetic valve, and electric heat tracing bands and filter cotton which are annular spiral and are attached to the inner wall of the processing annular pipe are arranged in the processing annular pipe.
According to the technical scheme, one end of the treatment loop pipe is cut off, so that gas sprayed out of the upper part of the draining cylinder is kept dry, gas sprayed out of the gas storage tank enters the treatment loop pipe through the communicating pipe at the head end, the gas is further heated by the electric tracing band, filtered cotton is further absorbed and filtered, and then sprayed out of the communicating pipe at the tail end, nondestructive drying of a wafer can be achieved, and the electric tracing band is composed of conductive polymer, two parallel metal wires and an insulating sheath.
Preferably, the gas spraying mechanism further comprises an air inlet ring pipe arranged on the inner surface of the processing ring pipe, the air inlet ring pipe and the processing ring pipe are supported and installed on the inner bottom wall of the action box body through annular array supporting frames, high-frequency ion air nozzles communicated with the inner portion of the air inlet ring pipe are fixedly installed on the outer surface of the air inlet ring pipe in an annular array distribution mode, and a pressure sensor is installed on the upper surface of the processing ring pipe.
According to the technical scheme, the model of the high-frequency ion air nozzle is KZ-10C, the size is small, in order to timely dry the surface of a wafer in a flower basket after dehydration, when the water draining cylinder drives the flower basket to centrifugally rotate, hot drying gas subjected to further pretreatment in the treatment loop is opened into the air inlet loop through the electromagnetic valve and then blown out by the high-frequency ion air nozzle, so that the non-destructive drying of the surface of the wafer is realized, the high-frequency ion air nozzle can generate air masses with positive and negative charges, the air masses are blown out by compressed gas, the charges on the object can be neutralized, static electricity on the surface of the object is neutralized, the purpose of eliminating static electricity is achieved, and accumulated water on the wafer can be blown away and dried by the high-speed hot drying gas.
The beneficial effects of the invention are as follows:
1. through setting up tilting mechanism, can carry out the opening mode of the closing door protective cover plate of the equipment that spin-dries the processing to the wafer and adjust, at the in-process of adjusting, through the inside top cylinder of action box action, make its piston rod under buffer spring's buffering, the one end that drives the actuating lever is when upwards jack-up, can open the protective cover plate anticlockwise upset, and the stroke pole slides in the slip recess inside of connecting plate, thereby make anti-skidding apron hang in one side of action box, can reduce the occupation space of open position, thereby avoid keeping the closing door of vertical state to cause the scratch to the surface of wafer.
2. Through setting up fixture, can carry out fixed in position to the wafer that spin-dries in spin-drying equipment and handle to the dehydration of wafer of being convenient for, in the regulation and obtaining the in-process, move through flexible cylinder, make its piston rod upwards will place the bottom plate and carry out ejecting water draining section of thick bamboo, and then can place the basket of flowers, then the centre gripping cylinder of its bottom moves, can make splint realize the centre gripping fixed to the lower extreme of basket of flowers, reset by flexible cylinder again, can make the basket of flowers place in the water draining section of thick bamboo and accomplish the dehydration.
3. Through setting up gas eruption mechanism, can carry out preliminary treatment to the hot dry gas that is used for the wafer to accelerate the stoving of wafer, in the in-process of adjusting, through set up the heating pipe that is the heliciform at the surface of gas holding vessel, realize preheating through its gas to the in-tank, and filter core pipe filtration processing through the filter core pipe when gas lets in, and filter core pipe inside contains the moisture absorption cotton, can further guarantee that the gas of input is dry state, gas holding vessel spun gas gets into the processing loop through the communicating pipe of head end, make gas further heat through electric tracing area and the further moisture absorption filtration of filter cotton back by the communicating pipe blowout of tail end to the inlet loop, blow out by high frequency ion wind mouth again, thereby realize the harmless drying to wafer surface.
Drawings
FIG. 1 is a schematic diagram of a wafer electroplating-based electroplating machine drying mechanism according to the present invention;
FIG. 2 is a perspective view of a structure of an action box of a drying mechanism of an electroplating machine based on wafer electroplating according to the invention;
FIG. 3 is a perspective view of a protective cover plate of a wafer-electroplating-based electroplating machine drying mechanism according to the present invention;
FIG. 4 is a perspective view of a structure of a connecting plate of a drying mechanism of an electroplating machine based on wafer electroplating according to the invention;
FIG. 5 is a perspective view of a driving rod structure of a wafer-electroplating-based electroplating machine drying mechanism according to the present invention;
FIG. 6 is a perspective view of a gas spraying mechanism of a wafer-electroplating-based electroplating machine drying mechanism according to the present invention;
FIG. 7 is a perspective view of a draining cylinder of a wafer-electroplating-based electroplating machine drying mechanism according to the present invention;
FIG. 8 is a perspective view of a placement base plate structure of a wafer-electroplating-based electroplating machine drying mechanism according to the present invention;
FIG. 9 is a perspective view of a clamping cylinder structure of a wafer-electroplating-based electroplating machine drying mechanism according to the present invention;
FIG. 10 is a perspective view of a gas storage tank structure of a wafer plating-based electroplating machine drying mechanism according to the present invention;
FIG. 11 is a perspective view of a filter core tube structure of a wafer-electroplating-based electroplating machine drying mechanism according to the present invention;
FIG. 12 is a perspective view of a high frequency ion tuyere structure of a wafer plating-based electroplating machine drying mechanism according to the present invention;
FIG. 13 is a perspective view showing a processing loop of a wafer plating-based electroplating machine drying mechanism according to the present invention;
FIG. 14 is a perspective view of an air inlet ring pipe structure of a wafer plating-based electroplating machine drying mechanism according to the present invention;
fig. 15 is a perspective view of an electric tracing band structure of a plating machine drying mechanism based on wafer plating according to the present invention.
In the figure: 1. flower basket; 2. an action box; 21. an exhaust fan; 22. drying the particles; 3. a protective cover plate; 4. a turnover mechanism; 41. a hinged connection seat; 42. a connecting plate; 43. a travel bar; 44. connecting an ear plate; 45. a driving rod; 46. a cushion pad; 47. pushing cylinder; 48. a buffer spring; 5. a clamping mechanism; 51. a draining cylinder; 52. a draining hole; 53. a telescopic cylinder; 54. placing a bottom plate; 55. a clamping cylinder; 56. a horizontal chute; 57. a clamping plate; 58. a discharge pipe; 6. a gas spraying mechanism; 61. a gas storage tank; 62. a heat-insulating ring; 63. heating pipes; 64. a vent pipe; 65. a filter core tube; 66. treating the loop; 67. a communicating pipe; 68. an electric tracing band; 69. filtering cotton; 70. an air inlet ring pipe; 71. a support frame; 72. high-frequency ion wind nozzle; 73. a pressure sensor.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1-15, a wafer electroplating-based electroplating machine drying mechanism comprises a basket 1 for placing a wafer and an action box 2 for drying the wafer in the basket 1, a protective cover plate 3 is arranged above the action box 2, a turnover mechanism 4 is arranged between the action box 2 and the protective cover plate 3, and a clamping mechanism 5 for placing the basket 1 and a gas spraying mechanism 6 for drying the wafer in the basket 1 are respectively arranged in the action box 2.
In order to keep the inside of the operation box 2 clean and dry after the wafer drying is completed, so that the next wafer drying treatment is facilitated, an exhaust fan 21 is mounted on the inner surface of the protective cover plate 3, and dry particles 22 are laid on the inner bottom wall of the operation box 2.
As shown in fig. 2 to 5, the tilting mechanism 4 connects the operation box 2 and the protective cover 3, and drives the protective cover 3 to perform a covering operation on the upper surface of the operation box 2.
In order to protect the wafer during spin-drying treatment, the protective cover plate 3 needs to be turned over to cover the action box body 2, and in order to realize the action, the turning mechanism 4 comprises hinged connection seats 41 fixedly installed on the upper surface of one end of the action box body 2 and symmetrically distributed, the surface of each hinged connection seat 41 is hinged with a connecting plate 42 with a sliding groove on one side through a connecting shaft, so that the connecting plates 42 are connected with the protective cover plate 3 to realize linkage, and the sliding grooves are formed on the surfaces of the connecting plates 42 to play a role in guiding.
In order to connect the protective cover plate 3 with the action box body 2 and facilitate the turnover mechanism 4 in the action box body 2 to act on the protective cover plate 3, the turnover mechanism 4 further comprises travel rods 43 which are symmetrically distributed and fixedly connected to one side surface of the protective cover plate 3, the outer surfaces of the travel rods 43 are matched with the outer surfaces of the connecting plates 42 through guide grooves, so that the protective cover plate 3 is turned over to cover the action box body 2 or is opened, one side surface of the protective cover plate 3 is fixedly connected with connecting lug plates 44 which are symmetrically distributed, and the surfaces of the connecting lug plates 44 are hinged with driving rods 45 which push the protective cover plate 3 to turn over through hinge shafts, so that the driving rods 45 can drive the protective cover plate 3 to slide up and down on the surface of the connecting plates 42 under linkage to realize opening or closing of the protective cover plate 3, and in order to prevent the protective cover plate 3 from colliding with the action box body 2 when one side of the action box body 2 is opened, one side surface of the action box body 2 is fixedly connected with a buffer cushion 46 made of rubber materials.
In order to jack up or pull down the one end of actuating lever 45, then tilting mechanism 4 still includes the top pushing cylinder 47 that carries out articulated connection through connecting block and the one end of actuating lever 45, the casing lower extreme of top pushing cylinder 47 articulates through the articulated piece with the inner wall of action box 2, the shell surface mounting of top pushing cylinder 47 has cup jointed buffer spring 48, buffer spring 48's free end and actuating lever 45's connecting block fixed surface connection, the piston rod of top pushing cylinder 47 articulates through connecting block and actuating lever 45's one end, and then under buffer spring 48's buffering, make actuating lever 45's one end can be with the anticlockwise upset of protective cover plate 3 open when jack up, and stroke pole 43 slides in the inside slip recess of connecting plate 42, thereby make the anti-skidding apron hang in one side of action box 2, can reduce the occupation space of open position.
Through setting up tilting mechanism 4, can carry out the opening mode of the closing door protective cover plate 3 of the equipment that spin-dries the processing to the wafer and adjust, at the in-process of adjusting, through the inside top pushing cylinder 47 of action box 2 acts, make its piston rod under buffer spring 48's buffering, when driving the one end of actuating lever 45 and upwards jack-up, can open the anticlockwise upset of protective cover plate 3, and stroke lever 43 slides in the inside slip recess of connecting plate 42, thereby make protective cover plate 3 hang in one side of action box 2, can reduce the occupation space of open position, thereby avoid keeping the closing door of vertical state to cause the scratch to the surface of wafer.
As shown in fig. 6 to 9, the clamping mechanism 5 performs a lifting operation and then clamps the basket 1, so that the basket 1 is fixed in position inside the operation box 2.
The wafer need place in basket 1 and carry out batch washing after electroplating, it need keep the drying on wafer surface to wash after accomplishing, in order to accelerate the process of drying, then fixture 5 includes through the centrifugal bull stick upper surface fixed mounting who installs in action box 2 bottom wall has the waterlogging caused by excessive rainfall section of thick bamboo 51, and the circumference outer surface of waterlogging caused by excessive rainfall section of thick bamboo 51 is annular array distribution and runs through and offer the waterlogging caused by excessive rainfall hole 52, basket 1 with the wafer is placed in the waterlogging caused by excessive rainfall section of thick bamboo 51 through the centre gripping manipulator, centrifugal bull stick is controlled through action box 2 internally mounted centrifugal motor and carries out high-speed rotation, and then make the waterlogging caused by excessive rainfall section of thick bamboo 51 drive its inside basket 1 and carry out centrifugal whipping, thereby can advance the washing liquid on wafer surface to throw out, and be discharged from the waterlogging caused by excessive rainfall hole 52, in order to avoid scraping when the centre gripping manipulator places the wafer in the waterlogging caused by excessive rainfall section of thick bamboo 51, then the bottom wall fixed mounting has the telescopic cylinder 53 that carries out telescopic cylinder about telescopic cylinder 53, telescopic cylinder 53's upper surface fixed connection has placed bottom plate 54, carry out the action, make it carries out the basket 1 to carry out the action, and can be reset by telescopic cylinder 51, and can place basket 1 and then put into the basket 51 and can reset, and can carry out the basket.
In order to make the draining cylinder 51 drive the basket 1 to centrifugally rotate, and further facilitate the drying of the wafer surface of the basket 1 after the wafer in the basket 1 is dehydrated, the clamping mechanism 5 further comprises clamping cylinders 55 symmetrically distributed and installed on the lower surface of the placing bottom plate 54, a horizontal sliding chute 56 for sliding the clamping jaws of the clamping cylinders 55 is formed in the upper surface of the placing bottom plate 54, a clamping plate 57 for clamping the outer surface of the lower end of the basket 1 is fixedly connected to one side surface of the clamping jaws of the clamping cylinders 55, a discharge pipe 58 communicated with the inner portion of the action box 2 is fixedly connected to one side surface of the action box 2, so that after the wafer is placed on the placing bottom plate 54 by the clamping manipulator, the clamping cylinders 55 at the bottom of the action box can act, the clamping plate 57 can clamp and fix the lower end of the basket 1, and therefore the dehydration of the draining cylinder 51 is realized, and the cleaning liquid can be discharged through the discharge pipe 58 to keep the inner portion of the action box 2 dry.
Through setting up fixture 5, can carry out the fixed position to the wafer that spin-dries in spin-dry equipment and handle to the dehydration of wafer of being convenient for, in the regulation obtains the in-process, through flexible cylinder 53 action, make its piston rod upwards will place bottom plate 54 and push out a drip section of thick bamboo 51, and then can place basket of flowers 1, then the centre gripping cylinder 55 of its bottom acts on, can make splint 57 realize the centre gripping fixed to the lower extreme of basket of flowers 1, reset by flexible cylinder 53 again, can make basket of flowers 1 place in drip section of thick bamboo 51 and accomplish the dehydration.
As shown in fig. 6 and 10 to 15, the gas spraying mechanism 6 performs the annular spraying operation above the basket 1 after the gas spraying mechanism is filtered and dried, thereby drying the wafer.
In order to facilitate the storage of the hot drying gas and realize the pretreatment thereof, the gas spraying mechanism 6 comprises a gas storage tank 61 which is installed inside the action box body 2 through a bracket, a heat preservation ring 62 is fixedly sleeved on the outer surface of the gas storage tank 61, a heating pipe 63 is arranged between the inner surface of the heat preservation ring 62 and the outer surface of the gas storage tank 61, the heat preservation ring 62 is made of a rubber plastic heat preservation plate, so that the gas in the gas storage tank 61 can be further subjected to heat preservation treatment, and a heating pipe 63 which is spiral is arranged on the outer surface of the gas storage tank 61 and can preheat the gas in the tank.
In order to avoid the damage of the wafer surface process caused by the impurities in the dry gas output from the gas storage tank 61, the gas spraying mechanism 6 further comprises a vent pipe 64 for outputting the pretreated gas, one end of the vent pipe 64 is fixedly communicated with the air outlet end of the gas storage tank 61, and a filter core pipe 65 is mounted on the inner wall of the air inlet end of the vent pipe 64, so that the pretreated gas is filtered by the filter core pipe 65 before being introduced through the vent pipe 64, and moisture absorption cotton is contained in the filter core pipe 65, so that the input gas can be further ensured to be in a dry state.
In order to keep the gas sprayed above the draining cylinder 51 dry, the gas spraying mechanism 6 further comprises a processing ring pipe 66 above the draining cylinder 51, the head end and the tail end of the processing ring pipe 66 are fixedly communicated with a communicating pipe 67 which is inclined and provided with an electromagnetic valve, an electric tracing band 68 and a filter cotton 69 which are in a ring spiral shape and are attached to the inner wall of the processing ring pipe 66 are respectively arranged in the processing ring pipe 66, so that the gas sprayed from the gas storage tank 61 enters the processing ring pipe 66 through the communicating pipe 67 at the head end, and the gas is further heated by the electric tracing band 68, filtered by the filter cotton 69, and sprayed from the communicating pipe 67 at the tail end after being further absorbed and filtered, thereby realizing nondestructive drying of wafers.
In order to timely dry the surface of the wafer in the basket 1 after dehydration, the gas spraying mechanism 6 further comprises an air inlet ring pipe 70 arranged on the inner surface of the processing ring pipe 66, the air inlet ring pipe 70 and the processing ring pipe 66 are supported and installed on the inner bottom wall of the action box 2 through annular array supporting frames 71, high-frequency ion air nozzles 72 communicated with the inner part of the air inlet ring pipe 70 are fixedly installed on the outer surface of the air inlet ring pipe 70 in an annular array distribution mode, and a pressure sensor 73 is installed on the upper surface of the processing ring pipe 66, so that when the draining cylinder 51 drives the basket 1 to centrifugally rotate, hot drying gas subjected to further pretreatment in the processing ring pipe 66 is opened into the air inlet ring pipe 70 through an electromagnetic valve and then blown out by the high-frequency ion air nozzles 72, and nondestructive drying of the surface of the wafer is achieved.
Through setting up gas eruption mechanism 6, can carry out preliminary treatment to the hot dry gas that is used for the wafer to accelerate the stoving of wafer, in the in-process of adjusting, through setting up at the surface of gas holding vessel 61 and being spiral heating pipe 63, realize preheating through its gas to the jar in, and filter the core tube 65 filtration treatment when the gas lets in, and filter the inside moisture absorption cotton that contains of core tube 65, can further guarantee that the gas of input is dry state, gas holding vessel 61 spun gas gets into processing ring canal 66 through the communicating pipe 67 of head end, make gas further heat and filter cotton 69 further moisture absorption filtration back by the communicating pipe 67 of tail end blowout to air inlet ring canal 70, blow out by high frequency ion wind mouth 72 again, thereby realize the harmless drying to the wafer surface.
Working principle: in a specific embodiment, when the surface of a wafer is dried, the flower basket 1 with the wafer needs to be moved to the upper part of the spin-drying equipment by a clamping manipulator, at the moment, a telescopic cylinder 53 in a water draining cylinder 51 acts to enable a piston rod of the telescopic cylinder to push a placing bottom plate 54 upwards out of the water draining cylinder 51, so that the flower basket 1 can be placed, then a clamping cylinder 55 at the bottom of the telescopic cylinder acts to enable a clamping plate 57 to clamp and fix the lower end of the flower basket 1, and then the telescopic cylinder 53 resets to enable the flower basket 1 with the wafer to be fixed in the water draining cylinder 51;
in order to protect the wafer during spin-drying, the protection cover plate 3 needs to be covered on the upper surface of the action box 2, the pushing cylinder 47 in the action box 2 acts to enable the piston rod of the pushing cylinder to drive one end of the driving rod 45 to pull downwards under the buffering of the buffer spring 48, and the travel rod 43 slides in the sliding groove of the connecting lug plate 44, so that the protection cover plate 3 can be turned clockwise to cover the upper surface of the action box 2;
at this time, the centrifugal motor arranged in the action box body 2 controls the centrifugal rotating rod to rotate at a high speed, so that the draining cylinder 51 drives the flower basket 1 in the action box body to perform centrifugal swing, and the cleaning liquid on the surface of the wafer can be thrown out in a feeding manner and discharged from the draining hole 52;
when the flower basket 1 with the wafer is dehydrated in a rotating way, the gas stored in the gas storage tank 61 is pretreated by the heat preservation ring 62 and the heating pipe 63 and then is led out through the vent pipe 64, the gas passes through the filter core pipe 65 in the vent pipe 64 to finish the filter treatment, and the filter core pipe 65 contains moisture absorption cotton, so that the input gas can be further ensured to be in a dry state;
the gas sprayed from the gas storage tank 61 enters the processing ring pipe 66 through the communicating pipe 67 at the head end, so that the gas is further heated by the electric tracing band 68, the filter cotton 69 is further absorbed and filtered, then sprayed out through the communicating pipe 67 at the tail end, the gas enters the ring pipe 70 and then is sprayed out through the high-frequency ion air nozzle 72, and the non-damage drying of the surface of the wafer is realized;
after the wafer is dried, the basket 1 is taken away by the clamping manipulator, and at the moment, the exhaust fan 21 on the inner surface of the covered protective cover plate 3 acts and the dry particles 22 on the inner bottom wall of the action box 2 act, so that the inside of the action box 2 can be kept clean and dry, and the next drying treatment of the wafer is facilitated.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (2)
1. Electroplating machine stoving mechanism based on wafer is electroplated, including basket of flowers (1) that are used for placing the wafer and right the action box (2) that carries out the stoving processing to the wafer in basket of flowers (1), its characterized in that: a protective cover plate (3) is arranged above the action box body (2), a turnover mechanism (4) is arranged between the action box body (2) and the protective cover plate (3), and a clamping mechanism (5) used for placing the flower basket (1) and a gas spraying mechanism (6) used for drying the wafer in the flower basket (1) are respectively arranged in the action box body (2);
the turnover mechanism (4) enables the action box body (2) to be connected with the protective cover plate (3) and drives the protective cover plate (3) to conduct covering action on the upper surface of the action box body (2);
the turnover mechanism (4) comprises hinged connection seats (41) which are fixedly arranged on the upper surface of one end of the action box body (2) and are symmetrically distributed, and a connecting plate (42) with a sliding groove on one side surface is hinged on the surface of the hinged connection seat (41) through a connecting shaft;
the turnover mechanism (4) further comprises travel rods (43) which are symmetrically distributed and fixedly connected to one side surface of the protective cover plate (3), the outer surface of the travel rods (43) is matched with the outer surface of the connecting plate (42) through guide grooves, the outer surface of the protective cover plate (3) is fixedly connected with connecting lug plates (44) which are symmetrically distributed, the surface of the connecting lug plates (44) is hinged with driving rods (45) which push the protective cover plate (3) to turn over through a hinge shaft, and a buffer cushion (46) made of rubber is fixedly connected to one side surface of the action box body (2);
the turnover mechanism (4) further comprises a pushing cylinder (47) which is hinged with one end of the driving rod (45) through a connecting block, the lower end of a shell of the pushing cylinder (47) is hinged with the inner wall of the action box body (2) through a hinging block, a buffer spring (48) is fixedly sleeved on the outer surface of the shell of the pushing cylinder (47), and the free end of the buffer spring (48) is fixedly connected with the surface of the connecting block of the driving rod (45);
after the clamping mechanism (5) performs lifting action, the flower basket (1) is clamped, so that the flower basket (1) is fixed in position in the action box body (2);
the clamping mechanism (5) comprises a draining cylinder (51) which is arranged on the upper surface of a centrifugal rotating rod and is used for carrying out centrifugal rotation, the circumferential outer surface of the draining cylinder (51) is distributed in an annular array and penetrates through a draining hole (52), a telescopic cylinder (53) which is used for carrying out up-down telescopic action is fixedly arranged on the inner bottom wall of the draining cylinder (51), and a placing bottom plate (54) is fixedly connected to the upper surface of a piston rod of the telescopic cylinder (53);
the gas spraying mechanism (6) performs annular spraying action above the flower basket (1) after filtering and drying to dry the wafer;
the gas spraying mechanism (6) comprises a gas storage tank (61) which is arranged in the action box body (2) through a bracket, an insulation ring (62) is fixedly sleeved on the outer surface of the gas storage tank (61), and a heating pipe (63) is arranged between the inner surface of the insulation ring (62) and the outer surface of the gas storage tank (61);
the gas spraying mechanism (6) further comprises a vent pipe (64) for outputting pretreatment gas, one end of the vent pipe (64) is fixedly communicated with the air outlet end of the gas storage tank (61), and a filter core pipe (65) is arranged on the inner wall of the air inlet end of the vent pipe (64);
the gas spraying mechanism (6) further comprises a processing annular pipe (66) above the water draining cylinder (51), the head end and the tail end of the processing annular pipe (66) are fixedly communicated with a communication pipe (67) which is inclined and provided with an electromagnetic valve, and an electric tracing band (68) and filter cotton (69) which are annular spiral and are attached to the inner wall of the processing annular pipe (66) are arranged in the processing annular pipe;
the gas spraying mechanism (6) further comprises an air inlet ring pipe (70) arranged on the inner surface of the processing ring pipe (66), the air inlet ring pipe (70) and the processing ring pipe (66) are supported and installed on the inner bottom wall of the action box body (2) through annular array supporting frames (71), high-frequency ion air nozzles (72) communicated with the inside of the air inlet ring pipe (70) are fixedly installed on the outer surface of the air inlet ring pipe (70) in an annular array distribution mode, and a pressure sensor (73) is installed on the upper surface of the processing ring pipe (66).
2. The wafer plating-based electroplating machine drying mechanism of claim 1, wherein: clamping mechanism (5) are still including place clamping cylinder (55) of bottom plate (54) lower surface carrying out symmetric distribution installation, place the upper surface of bottom plate (54) offer be used for clamping cylinder (55) clamping jaw carries out gliding horizontal spout (56), clamping cylinder (55) clamping jaw one side surface fixedly connected with pair of clamping plate (57) of the lower extreme surface of basket of flowers (1) carries out the centre gripping, one side surface fixedly connected with of action box (2) rather than inside drain pipe (58) of intercommunication.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310624429.7A CN116336761B (en) | 2023-05-30 | 2023-05-30 | Electroplating machine drying mechanism based on wafer electroplating |
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| CN202310624429.7A CN116336761B (en) | 2023-05-30 | 2023-05-30 | Electroplating machine drying mechanism based on wafer electroplating |
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| CN116336761B true CN116336761B (en) | 2023-08-22 |
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| CN110131970A (en) * | 2019-05-16 | 2019-08-16 | 昆山市智程自动化设备有限公司 | A kind of silicon wafer dryer |
| CN211109821U (en) * | 2019-08-30 | 2020-07-28 | 罗博特科智能科技股份有限公司 | Basket of flowers centre gripping subassembly and basket of flowers handling device |
| CN211413072U (en) * | 2019-10-22 | 2020-09-04 | 佛山市南海天富科技有限公司 | Charging basket belt cleaning device and charging basket belt cleaning drying device |
| CN112146401A (en) * | 2020-09-30 | 2020-12-29 | 常宁德邦生物科技有限公司 | High-efficiency energy-saving circulating type feed drying device |
| CN214426341U (en) * | 2020-12-29 | 2021-10-19 | 无锡琨圣智能装备股份有限公司 | Online drying device that spin-dries |
| CN216937370U (en) * | 2021-12-31 | 2022-07-12 | 北京华林嘉业科技有限公司 | Wafer cleaning and drying tank |
| CN218351424U (en) * | 2022-10-25 | 2023-01-20 | 江西兆驰半导体有限公司 | Spin-drying device |
| CN218677054U (en) * | 2022-10-26 | 2023-03-21 | 江苏帝浦拓普智能装备有限公司 | Automatic spin-drying equipment |
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Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110131970A (en) * | 2019-05-16 | 2019-08-16 | 昆山市智程自动化设备有限公司 | A kind of silicon wafer dryer |
| CN211109821U (en) * | 2019-08-30 | 2020-07-28 | 罗博特科智能科技股份有限公司 | Basket of flowers centre gripping subassembly and basket of flowers handling device |
| CN211413072U (en) * | 2019-10-22 | 2020-09-04 | 佛山市南海天富科技有限公司 | Charging basket belt cleaning device and charging basket belt cleaning drying device |
| CN112146401A (en) * | 2020-09-30 | 2020-12-29 | 常宁德邦生物科技有限公司 | High-efficiency energy-saving circulating type feed drying device |
| CN214426341U (en) * | 2020-12-29 | 2021-10-19 | 无锡琨圣智能装备股份有限公司 | Online drying device that spin-dries |
| CN216937370U (en) * | 2021-12-31 | 2022-07-12 | 北京华林嘉业科技有限公司 | Wafer cleaning and drying tank |
| CN218351424U (en) * | 2022-10-25 | 2023-01-20 | 江西兆驰半导体有限公司 | Spin-drying device |
| CN218677054U (en) * | 2022-10-26 | 2023-03-21 | 江苏帝浦拓普智能装备有限公司 | Automatic spin-drying equipment |
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| CN116336761A (en) | 2023-06-27 |
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Address after: No. 889 Zhonghua Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province, 215300 Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region after: China Address before: Room 3, no.299, Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region before: China |