CN116313982A - Film turning device for wafer - Google Patents
Film turning device for wafer Download PDFInfo
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- CN116313982A CN116313982A CN202310367712.6A CN202310367712A CN116313982A CN 116313982 A CN116313982 A CN 116313982A CN 202310367712 A CN202310367712 A CN 202310367712A CN 116313982 A CN116313982 A CN 116313982A
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- air suction
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- wafer
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- 230000007246 mechanism Effects 0.000 claims abstract description 67
- 230000002457 bidirectional effect Effects 0.000 claims abstract description 30
- 238000001125 extrusion Methods 0.000 claims description 42
- 238000003825 pressing Methods 0.000 claims description 30
- 230000007306 turnover Effects 0.000 claims description 20
- 230000000712 assembly Effects 0.000 claims description 15
- 238000000429 assembly Methods 0.000 claims description 15
- 239000012528 membrane Substances 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 7
- 230000001105 regulatory effect Effects 0.000 claims description 4
- 238000009423 ventilation Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 230000001681 protective effect Effects 0.000 description 24
- 238000000034 method Methods 0.000 description 18
- 230000008569 process Effects 0.000 description 17
- 230000009471 action Effects 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a wafer film turning device which comprises a fixing frame, wherein a bidirectional driving mechanism is arranged on the side wall of the fixing frame, a turning positioning mechanism and an air suction mechanism are sequentially arranged in the middle of the bidirectional driving mechanism from top to bottom, and the upper end of the fixing frame is connected with a film uncovering mechanism through a bracket.
Description
Technical Field
The invention relates to the technical field of wafer film turning, in particular to a wafer film turning device.
Background
A wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer is circular in shape; various circuit element structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions. The starting material for the wafer is silicon, while the crust surface is useful with inexhaustible silicon dioxide. The silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polysilicon, and the purity of the polysilicon is as high as 99.999999999 percent. The wafer processing process comprises a plurality of process steps including scribing, film turning, back inspection, film expansion, splitting, testing, sorting and the like. The film turning is a step after dicing, and in the existing film turning process, the back surface of the wafer is usually turned over, and then pressed for film tearing.
However, the positioning of the pressing mode is difficult to control the strength, the situation that the wafer slides when the film is torn is easy to cause due to the smaller strength, the body of the wafer is easy to be damaged due to the larger strength, and in the film tearing process, the strength of the film is difficult to control, the film is easy to generate fold deformation when the film is torn, and the generated fold causes abnormal arrangement conditions such as grain arrangement deflection, rotation and the like, so that the quality and efficiency of film turning are affected.
The application designs a wafer film turning device to solve the defects.
Disclosure of Invention
In order to realize the air suction positioning and the rapid uncovering of the reverse film in the wafer overturning process and prevent the abnormal arrangement conditions such as the inclination, rotation and the like of the arrangement of the crystal grains, the application provides a wafer film overturning device.
The wafer film turning device adopts the following technical scheme:
the wafer film turning device comprises a fixing frame, wherein a bidirectional driving mechanism is arranged on the side wall of the fixing frame, a turning positioning mechanism and an air suction mechanism are sequentially arranged in the middle of the bidirectional driving mechanism from top to bottom, and the upper end of the fixing frame is connected with a film uncovering mechanism through a support.
The overturning positioning mechanism comprises an overturning assembly, a connecting ring, an air bag assembly, a connecting seat, a rotating assembly, an air suction plate and an air suction assembly, wherein the connecting ring is installed at the front end of the overturning assembly, the inner cavity of the connecting ring is provided with the air bag assembly, the connecting seat is symmetrically installed at the left end and the right end of the connecting ring, the rotating assembly is arranged inside the connecting seat, the air suction plate is installed at the outer end of the rotating assembly, and the air suction assembly is arranged inside the air suction plate.
The film uncovering mechanism comprises a return frame, electric sliding blocks, connecting blocks, adjusting blocks, guide grooves, air suction assemblies and laminating assemblies, wherein a support is connected between the return frame and a fixing frame, the electric sliding blocks are symmetrically arranged in front of and behind the return frame, the connecting blocks are arranged between the electric sliding blocks, the lower ends of the connecting blocks are provided with the adjusting blocks in a sliding mode, the side walls of the adjusting blocks are provided with cylindrical sliding pieces, the cylindrical sliding pieces are arranged in the guide grooves formed in the side walls of the return frame in a sliding mode, in the horizontal movement process of the connecting blocks, the adjusting blocks are adjusted in an up-down and left-right mode according to the tracks of the guide grooves, the laminating assemblies capable of being adjusted in an angle mode are arranged at the lower ends of the adjusting blocks, and the air suction assemblies arranged in the adjusting blocks are connected with the laminating assemblies in a ventilation mode.
Specifically, a semiconductor wafer is placed on a suction mechanism to perform suction positioning (at the moment, the front surface of the wafer faces upwards, the surface with a protective film attached thereon faces downwards), then the protective film is attached to the front surface of the wafer, then a rotation assembly drives a suction plate to rotate for one hundred eighty degrees, the suction plate is attached to the upper end surface of the wafer (the front surface with the film attached thereto) under the extrusion action, at the moment, the suction assembly is electrified to suck the wafer on the suction plate, meanwhile, the air bag assembly is in an overflow state to further wrap and position the edge of the wafer in an air bag manner, then the suction mechanism stops suction (at the moment, the current upper end surface and the edge of the wafer are positioned by the suction assembly and the air bag assembly), then a turnover positioning mechanism and the suction mechanism are driven to reversely move by a bidirectional driving mechanism until the turnover positioning mechanism moves to the highest position, the air suction mechanism descends to the lowest position, a turnover assembly in the turnover positioning mechanism forms a passage to drive a connecting ring to rotate for one hundred eighty degrees, the wafer synchronously rotates, the original back protection film is turned over to the upper side, then an electric sliding block drives a connecting block to move rightwards, under the action of a guide groove and an air suction assembly, the laminating assembly sucks the original back protection film in a contact mode and then horizontally conveys the original back protection film in a long distance so as to perform film uncovering treatment, and then the wafer after film uncovering is subjected to next step treatment (back inspection treatment), the wafer positioning is set by adopting air suction positioning according to the actual situation, the wafer is in a stable positioning state all the time in the adjustment process, and after the position adjustment, the back protection film is uncovered in an air suction uncovering mode, the efficiency of the whole mould turning process is improved.
As a preferable technical scheme of the invention, the bidirectional driving mechanism comprises a bidirectional screw rod, a driving motor and a sliding block, wherein the upper end and the lower end of the bidirectional screw rod are connected with a fixed frame through bearings, the bidirectional screw rod is connected with an output shaft of the driving motor arranged on the fixed frame, the sliding block is symmetrically arranged on the bidirectional screw rod and is in threaded fit connection with the bidirectional screw rod, the sliding block is arranged in a sliding groove formed in the fixed frame in a vertically sliding manner, and the sliding block which is arranged up and down is correspondingly connected with a turnover assembly and an air suction mechanism respectively.
As a preferable technical scheme of the invention, the overturning assembly consists of a shell, a rotating motor, a power supply and a switch key, wherein the shell is connected with a sliding block arranged on the upper side, the rotating motor, the power supply and the switch key which are arranged in the shell are electrically connected, an output shaft of the rotating motor is connected with a connecting ring, a starting piece corresponding to the position of the switch key is arranged at the lower end of a square frame, and the switch key contacted with the starting piece is in a closed state.
As a preferable technical scheme of the invention, the air bag component comprises an edge membrane, a piston block, a lower pressing piece and an internal spring, wherein the opening position of the inner side of the inner cavity of the connecting ring is in annular sealing connection through the edge membrane, the piston block is arranged at the upper end of the inner cavity of the connecting ring in a sliding manner, the piston block is connected with the lower pressing piece, the internal spring is connected between the lower pressing piece and a hidden groove formed at the upper end of the connecting ring, and the internal spring always keeps the trend of pushing the lower pressing piece upwards.
As a preferable technical scheme of the invention, the rotating assembly comprises a connecting motor, a rotating piece, a sleeving block, an extrusion piece and an extrusion roller, wherein an output shaft of the connecting motor arranged in the connecting seat is connected with the rotating piece, the rotating piece is rotatably arranged on the connecting seat, the sleeving block is arranged in the middle of the rotating piece in a sliding manner, the sleeving block is fixedly connected with the air suction plate, the extrusion piece is arranged on the outer side of the lower end of the sleeving block, and the extrusion roller corresponding to the extrusion piece is rotatably arranged on the side wall of the connecting ring.
As a preferable technical scheme of the invention, a reset spring is connected between the rotating piece and the sleeving block, the reset spring plays a role of elastic reset, the cross section of the transverse part of the extrusion piece is of an isosceles trapezoid structure, in the process of contacting the extrusion piece with the extrusion roller, the extrusion roller is firstly in inclined surface contact with the side of the transverse part of the extrusion piece, the extrusion roller is gradually extruded with the middle part of the transverse part of the extrusion piece along with the continuous rotation of the air suction plate, and the extrusion piece is gradually pressed down to drive the air suction plate to sink in a small amplitude because of the isosceles trapezoid structure, and the arrangement between the extrusion piece and the extrusion roller mainly ensures that the air suction plate is not directly horizontally rotated to be in contact with the upper end surface of a wafer, so that the direct contact is easy to cause abrasion, but is pressed down to sink to be in contact with the wafer after the extrusion in the short-range horizontal rotation (a gap exists between the air suction plate and the wafer in the large-range rotation), so that the abrasion degree is greatly reduced.
As a preferable technical scheme of the invention, the air suction assembly comprises an air suction pump, a battery, a starting key and a pressing piece, wherein a placing groove is formed in the inner side of the air suction plate, the air suction pump, the battery and the starting key which are arranged in the placing groove are electrically connected, an air cavity formed in the lower end of the air suction plate is communicated with the air suction pump, air holes are uniformly formed in the lower end of the air cavity, the pressing piece is arranged in the lower end of the inner side of the air suction plate, and the position between the pressing piece and the pressing piece corresponds to the position between the pressing piece and the pressing piece.
As a preferable technical scheme of the invention, the air suction mechanism comprises an air suction seat and an air suction pump, wherein the air suction seat is connected with a sliding block arranged at the lower side, and an air suction cavity formed in the air suction seat is communicated with the air suction pump arranged at the lower end of the air suction seat.
As a preferable technical scheme of the invention, the adjusting block comprises a middle block and a sliding column, the sliding column arranged at the upper end of the middle block is arranged at the lower end of the connecting block in a vertical sliding way, and the side wall of the middle block is provided with a cylindrical sliding piece.
As a preferable technical scheme of the invention, the guide groove is formed by communicating a straight groove and a bending groove with a U-shaped structure, when the cylindrical sliding piece slides to the bending groove with the U-shaped structure, the adjusting block moves downwards along with the cylindrical sliding piece and then resets upwards, when the adjusting block descends to the lowest position, the attaching component is contacted with the protective film on the original back surface of the wafer, the protective film on the original back surface is sucked on the attaching component under the action of the air suction component, the attaching component is enabled to uncover the protective film on the original back surface along with the lifting of the adjusting block, and the attaching component is enabled to move in a close range straight horizontal motion along with the running of the adjusting block in the subsequent straight groove until the protective film is completely uncovered.
As a preferable technical scheme of the invention, the air suction component comprises a pump body, a battery pack, two starting switches and a connecting pipe, wherein an insulating cavity is formed in the middle block, the pump body, the battery pack and the two starting switches which are arranged in the insulating cavity are connected in series, and the output position of the pump body is communicated with the connecting pipe.
As a preferable technical scheme of the invention, trigger pieces are symmetrically arranged at the left end and the right end of the square frame, the trigger pieces correspond to the starting switch in position, and the starting switch is in an off state when the starting switch is in contact with the trigger pieces.
As a preferred technical scheme of the invention, the attaching assembly comprises a sliding plate, a connecting spring, an angle block and a flexible pipe, wherein the sliding plate is horizontally arranged at the lower end of the adjusting block in a sliding way, the connecting spring is connected between the adjusting block and the sliding plate of a U-shaped structure, the lower end of the sliding plate is connected with the angle block through a pin shaft, an output cavity is formed at the lower end of the angle block, the flexible pipe is connected between the output cavity and the connecting pipe, the lower end of the output cavity is provided with a through hole, and due to the fact that a part of the straight line structure is arranged in the middle of the bending groove, after the attaching assembly descends to the lowest position and contacts and is sucked by the protective film, a short-distance horizontal movement exists, at the moment, the sliding plate horizontally slides at the lower end of the adjusting block, and can be stopped at the current position temporarily (the sliding plate is stopped temporarily, so that the angle block is stopped synchronously, the situation that the protective film is folded caused by the movement of the lowest position of the angle block on the protective film is avoided, the situation that crystal grains are easily arranged to be skewed, the abnormal arrangement is easily caused by the fold, the situation that the crystal grain is arranged is gradually and the adjusting block moves upwards, and under the action of the connecting spring, the angle block is reset, and the angle film is opened, and the angle film is suitable for the angle film is opened.
In summary, the present application includes at least one of the following beneficial technical effects:
1. according to the wafer film turning device, the wafer is positioned by adopting the air suction positioning arrangement, the targeted position adjustment is carried out according to the actual situation, the wafer is always in a stable positioning state in the adjustment process, the damage or deviation caused by positioning can not occur, after the position turning adjustment, the protective film on the back is flexibly opened in a targeted air suction film uncovering mode, compared with manual tearing, the tearing force control is reduced, and meanwhile, the situations such as wrinkling and the like can not occur;
2. according to the wafer film turning device, for the positioning condition of a wafer, firstly, the bottom air suction positioning is carried out on the wafer with the right side facing upwards through the air suction mechanism, then before turning, the air suction plate and the upper end face of the wafer are subjected to air suction positioning through the sinking rotation of the air suction plate in the turning positioning mechanism, and the edge of the wafer is subjected to air bag type wrapping positioning through the air bag component in the overflow state, so that the position positioning of the wafer is stable, and the wafer is synchronously turned upwards along with the rising and rotation of the turning positioning mechanism;
3. according to the wafer film turning device, for the film uncovering condition, the film uncovering mechanism mainly enables the attaching component to be in contact with and sucked by the original protective film on the back face briefly under the guidance of the guide groove in the rightward movement process of the connecting block, and the attaching component is lifted and then moves horizontally and rightward continuously along with the continued rightward movement of the connecting block, so that the film uncovering action is simulated, but the phenomenon of wrinkling caused by force and other reasons is avoided when the film uncovering is replaced by the air suction film uncovering;
4. the wafer film turning device disclosed by the invention has the advantages that the structural design of the bonding assembly is mainly used for simulating the actions of primarily contacting and uncovering the protective film, so that the film uncovering is carried out remotely immediately after the bonding assembly contacts the protective film, the phenomenon of wrinkles in the film uncovering process is avoided, the guide groove (the bonding assembly integrally ascends and resets after being temporarily descended and then moves linearly) is also used for ensuring that the film uncovering is immediately separated after the bonding assembly is air-sucked with the protective film, and the rotating connection of the angle block and the connection mode of the sliding plate arranged at the lower end of the adjusting block in a sliding manner are also used for ensuring that the bonding assembly can smoothly suck and primarily tear the protective film and then separate the film tearing is carried out.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a first schematic construction of the present invention;
FIG. 2 is a second schematic structural view of the present invention;
FIG. 3 is an overall cross-sectional view of the present invention;
FIG. 4 is a schematic view of the structure between the turnover positioning mechanism and the slide block of the present invention;
FIG. 5 is an enlarged view of a portion of the invention at X of FIG. 3;
fig. 6 is an enlarged view of a portion of the invention at Y of fig. 3.
Detailed Description
Embodiments of the present invention are described below with reference to the accompanying drawings. In this process, to ensure clarity and convenience of description, the widths of the lines or the sizes of the constituent elements in the drawings may be exaggerated.
In addition, the terms hereinafter are defined based on functions in the present invention, and may be different according to intention of a user, an operator, or a convention. Accordingly, these terms are defined based on the entire contents of the present specification.
As shown in fig. 1 to 6, a wafer film turning device comprises a fixing frame 1, wherein a bidirectional driving mechanism 2 is arranged on the side wall of the fixing frame 1, a turning positioning mechanism 3 and an air suction mechanism 4 are sequentially arranged in the middle of the bidirectional driving mechanism 2 from top to bottom, and the upper end of the fixing frame 1 is connected with a film uncovering mechanism 5 through a bracket.
The turnover positioning mechanism 3 comprises a turnover assembly 31, a connecting ring 32, an air bag assembly 33, a connecting seat 34, a rotating assembly 35, an air suction plate 36 and an air suction assembly 37, wherein the connecting ring 32 is installed at the front end of the turnover assembly 31, the air bag assembly 33 is arranged in an inner cavity of the connecting ring 32, the connecting seat 34 is symmetrically installed at the left end and the right end of the connecting ring 32, the rotating assembly 35 is arranged inside the connecting seat 34, the air suction plate 36 is installed at the outer end of the rotating assembly 35, and the air suction assembly 37 is arranged inside the air suction plate 36.
The film uncovering mechanism 5 comprises a return frame 51, electric sliding blocks 52, connecting blocks 53, adjusting blocks 54, guide grooves 55, air suction assemblies 56 and attaching assemblies 57, a support is connected between the return frame 51 and a fixing frame 1, the electric sliding blocks 52 are symmetrically arranged in front of and behind the inner portion of the return frame 51, the connecting blocks 53 are arranged between the electric sliding blocks 52, the lower ends of the connecting blocks 53 are provided with the adjusting blocks 54 in a sliding mode, the side walls of the adjusting blocks 54 are provided with cylindrical sliding pieces, the cylindrical sliding pieces are arranged in the guide grooves 55 formed in the side walls of the return frame 51 in a sliding mode, in the horizontal movement process of the connecting blocks 53, the adjusting blocks 54 are adjusted in an up-down and left-right synchronous mode according to the track of the guide grooves 55, the attaching assemblies 57 capable of being adjusted in an angle mode are arranged at the lower ends of the adjusting blocks 54, and the air suction assemblies 56 arranged inside the adjusting blocks 54 are connected with the attaching assemblies 57 in a ventilation mode.
Specifically, the semiconductor wafer is placed on the air suction mechanism 4 for air suction positioning (the front surface of the wafer faces upwards, the surface with the protective film attached thereon faces downwards), then the protective film is attached to the front surface of the wafer, then the air suction plate 36 is driven to rotate for one hundred eighty degrees through the rotating component 35, the air suction plate 36 is attached to the upper end surface of the wafer (the front surface with the film attached thereto) under the extrusion action, the air suction component 56 is electrified to suck the wafer on the air suction plate 36, meanwhile, the air bag component 33 is in an overflow state to further wrap and position the edge of the wafer, then the air suction mechanism 4 stops air suction (the current upper end surface and the edge of the wafer are positioned through the air suction component 56 and the air bag component 33), then the reversing positioning mechanism 3 and the air suction mechanism 4 are driven to reversely move through the bidirectional driving mechanism 2, until the turnover positioning mechanism 3 moves to the highest position, the air suction mechanism 4 descends to the lowest position, at the moment, the turnover assembly 31 in the turnover positioning mechanism 3 forms a passage to drive the connecting ring 32 to rotate by one hundred eighty degrees, the wafer synchronously rotates, the original back protection film is turned over to the upper side, then the electric sliding block 52 drives the connecting block 53 to move rightwards, the lamination assembly 57 sucks the original back protection film in a contact mode under the action of the guide groove 55 and the air suction assembly 56, the film uncovering treatment is carried out, the next step treatment (back inspection treatment) is carried out on the wafer after the film uncovering, the setting of the air suction positioning is adopted for the positioning of the wafer according to the actual situation, the targeted position adjustment is carried out, the wafer is always in a stable positioning state in the adjustment process, after the position is adjusted, the protective film on the back is uncovered by an air suction uncovering film mode, and the efficiency of the whole mold overturning process is improved.
In another embodiment of the present invention, further, the bidirectional driving mechanism 2 includes a bidirectional screw 21, a driving motor 22, and a sliding block 23, where the upper and lower ends of the bidirectional screw 21 are connected with the fixing frame 1 through bearings, the bidirectional screw 21 is connected with an output shaft of the driving motor 22 installed on the fixing frame 1, the bidirectional screw 21 is symmetrically provided with the sliding block 23, the sliding block 23 is in threaded fit connection with the bidirectional screw 21, the sliding block 23 is vertically slidably disposed in a sliding groove formed in the fixing frame 1, and the sliding block 23 vertically disposed is correspondingly connected with the overturning assembly 31 and the air suction mechanism 4 respectively.
Specifically, the driving motor 22 drives the bidirectional screw rod 21 to rotate, so that the sliding blocks 23 arranged up and down are driven to move in opposite directions or move in opposite directions, and the overturning and positioning mechanism 3 and the air suction mechanism 4 are synchronously adjusted.
Further, the turnover assembly 31 is composed of a casing, a rotating motor, a power supply and a switch key, the casing is connected with the slide block 23 arranged on the upper side, the rotating motor, the power supply and the switch key which are arranged in the casing are electrically connected, an output shaft of the rotating motor is connected with the connecting ring 32, the starting piece 6 corresponding to the position of the switch key is installed at the lower end of the square frame 51, and the switch key contacted with the starting piece 6 is in a closed state.
Specifically, when the slide block 23 arranged at the upper side drives the turnover positioning mechanism 3 to rise to the highest position, the switch key is in contact with the starting piece 6, at the moment, the rotating motor, the power supply and the switch key form a passage, and the rotating motor drives the connecting ring 32 and the wafer to rotate one hundred eighty degrees after being electrified, so that the turnover adjustment is performed on the wafer.
Further, the air bag assembly 33 includes an edge membrane 331, a piston block 332, a pressing member 333 and an internal spring 334, the inner opening of the inner cavity of the connecting ring 32 is connected by an annular seal with the edge membrane 331, the piston block 332 is slidably disposed at the upper end of the inner cavity of the connecting ring 32, the piston block 332 is connected with the pressing member 333, the internal spring 334 is connected between the pressing member 333 and a hidden groove formed at the upper end of the connecting ring 32, and the internal spring 334 always keeps a trend of pushing the pressing member 333 upwards.
Specifically, when the air suction plate 36 is about to rotate to one hundred eighty degrees, the pressing piece 374 contacts with the pressing piece 333, and as the air suction plate 36 continues to rotate, the air suction plate 36 sinks down, so that the pressing piece 374 presses down the pressing piece 333, after the air suction plate 36 rotates to one hundred eighty degrees, the descending piston block 332 injects the inner cavity of the connecting ring 32, so that the edge membrane 331 is in an overflow state, and therefore wrapping limiting is performed on the edge of the wafer.
Further, the rotating assembly 35 includes a connection motor 351, a rotating member 352, a sleeving block 353, an extrusion member 354 and a squeeze roller 355, an output shaft of the connection motor 351 installed in the connection seat 34 is connected with the rotating member 352, the rotating member 352 is rotationally arranged on the connection seat 34, the sleeving block 353 is arranged in a sliding manner up and down in the middle of the rotating member 352, the sleeving block 353 is fixedly connected with the air suction plate 36, the extrusion member 354 is installed on the outer side of the lower end of the sleeving block 353, the squeeze roller 355 corresponding to the position of the extrusion member 354 is rotationally arranged on the side wall of the connection ring 32, further, a reset spring is connected between the rotating member 352 and the sleeving block 353, the reset spring plays a role of elastic reset, the cross section of the transverse portion of the extrusion member 354 is of an isosceles trapezoid structure, in the contact process between the extrusion member 354 and the squeeze roller 355, the squeeze roller 355 is firstly contacted with the side inclined surface of the transverse portion of the extrusion member 354, and the extrusion roller 355 gradually rotates along with the continuous rotation of the air suction plate 36, the cross section of the transverse portion of the extrusion member 354 is of an isosceles trapezoid structure, the extrusion member 354 gradually drops down, the extrusion member 354 is gradually, the amplitude of the extrusion member 354 is corresponding to the extrusion member 354 is gradually drops down, the air suction plate 36 is greatly, the wafer is in the horizontal contact with the wafer is greatly and the wafer is not worn down, and the wafer is in the horizontal contact with the wafer is greatly and the wafer is in the horizontal contact with the wafer, and the wafer is in the wafer has a high contact state, and the wafer has abrasion state.
Specifically, the rotating member 352 is driven to rotate by one hundred and eighty degrees through the connection motor 351, the air suction plate 36 synchronously rotates, when the air suction plate rotates to one hundred and eighty degrees, the extrusion member 354 is in contact with the extrusion roller 355, and the extrusion member 354 moves downwards under the extrusion of the extrusion roller 355, so that the air suction plate 36 is sunk while rotating, and when the air suction plate rotates to one hundred and eighty degrees, the air suction plate 36 is tightly attached to the upper end surfaces of the connection ring 32 and the wafer.
Further, the air suction assembly 37 includes an air suction pump 371, a battery 372, a start key 373 and a pressing member 374, a placement groove is provided on the inner side of the air suction plate 36, the air suction pump 371, the battery 372 and the start key 373 which are provided in the placement groove are electrically connected, an air cavity provided on the lower end of the air suction plate 36 is communicated with the air suction pump 371, air holes are uniformly provided on the lower end of the air cavity, the pressing member 374 is provided on the inner side lower end of the air suction plate 36, and the positions between the pressing member 374 and the pressing member 333 correspond to each other.
Specifically, after the air suction plate 36 rotates to one hundred eighty degrees, the air suction plate 36 which is sinking slightly makes the starting key 373 which is sinking follow contact with the upper end face of the connecting ring 32, at this time, the starting key 373 is in a connection state, a passage is formed among the air suction pump 371, the battery 372 and the starting key 373, and the air suction pump 371 is electrified so as to suck the wafer with the upper end film attached on the lower end of the air suction plate 36.
Further, the air suction mechanism 4 includes an air suction seat 41 and an air suction pump 42, the air suction seat 41 is connected with the slider 23 arranged at the lower side, and an air suction cavity formed in the air suction seat 41 is communicated with the air suction pump 42 mounted at the lower end of the air suction seat 41.
Specifically, the lower end surface of the wafer is sucked onto the suction base 41 by the suction pump 42.
Further, the adjusting block 54 includes a middle block 541 and a sliding column 542, the sliding column 542 mounted at the upper end of the middle block 541 is disposed at the lower end of the connecting block 53 in a vertically sliding manner, the side wall of the middle block 541 is provided with a cylindrical sliding member, the guide groove 55 is formed by communicating a straight groove with a curved groove of a U-shaped structure, when the cylindrical sliding member slides to the curved groove of the U-shaped structure, the adjusting block 54 moves downward first and then resets upward, when the adjusting block 54 descends to the lowest position, the attaching component 57 contacts with the protective film on the original back surface of the wafer at this time, and sucks the protective film on the original back surface onto the attaching component 57 under the action of the air suction component 56, along with the lifting of the adjusting block 54, the attaching component 57 is enabled to uncover the protective film on the original back surface, and along with the running of the adjusting block 54 in the subsequent straight groove, the attaching component 57 is enabled to move in a close-range straight horizontal motion until the protective film is completely uncovered.
Further, the air suction assembly 56 includes a pump body 561, a battery pack 562, two start switches 563, and a connecting pipe 564, an insulation cavity is provided in the middle block 541, the pump body 561, the battery pack 562, and the two start switches 563 that are provided in the insulation cavity are connected in series, an output position of the pump body 561 is connected with the connecting pipe 564, the two ends of the mold frame 51 are symmetrically provided with trigger pieces, the trigger pieces correspond to positions of the start switches 563, and the start switches 563 are in an off state when the start switches 563 contact with the trigger pieces.
Specifically, when the air suction assembly 56 is at the rightmost side or leftmost side, due to the contact between one of the start switches 563 and the trigger piece at the corresponding position, the current start switch 563 is in the off state, the air suction assembly 56 is in the open-circuit connection as a whole, and only when the electric slider 52 drives the connecting block 53 to move, the pump body 561 is electrified when the start switch 563 is separated from the trigger piece, so that the air suction treatment is performed on the lower end surface of the attaching assembly 57.
Further, the attaching assembly 57 includes a sliding plate 571, a connecting spring 572, an angle block 573 and a flexible tube 574, the sliding plate 571 is horizontally slidably disposed at the lower end of the adjusting block 54, the connecting spring 572 is connected between the adjusting block 54 and the sliding plate 571 with a U-shaped structure, the lower end of the sliding plate 571 is connected with the angle block 573 through a pin shaft, an output cavity is formed at the lower end of the angle block 573, the flexible tube 574 is connected between the output cavity and the connecting tube 564, a through hole is formed at the lower end of the output cavity, and a part of the middle part of the bending groove has a linear structure, after the attaching assembly 57 descends to the lowest position and contacts and absorbs the protection film, a short-distance horizontal movement exists, at this time, the sliding plate 571 is horizontally slidably disposed at the lower end of the adjusting block 54, so that when the adjusting block 54 slides rightwards normally, the sliding plate 571 can be stopped at the current position (temporary stop of the sliding plate 571, so that the angle block 573 is synchronously stopped, the situation of the protection film caused by moving on the protection film on the lowest position is avoided, the inclination of the angle block 573 is easily caused, the arrangement is easily caused, the inclination of the protection film is gradually increased, the inclination of the protection film is gradually caused, the inclination of the protection film is increased, and the inclination of the protection film is gradually increased, and the inclination of the inclination film is adjusted under the situation when the inclination of the inclination film is adjusted, and the inclination of the inclination film is adjusted, and the inclination is adjusted under the situation, and the inclination of the inclination is adjusted, and accordingly, and the inclination is adjusted.
Specifically, after the terminal surface and protection film contact and hold under angle piece 573, along with the whole right-hand member that the regulating block 54 drove laminating subassembly 57, through the rotation of angle piece 573 in this application and the sliding plate 571 slip setting at the connected mode of the lower extreme of regulating block 54 this moment make laminating subassembly 57 can be smoothly with the protection film hold and carry out preliminary tearing to the present film state of tearing off of adaptation more.
The working process comprises the following steps:
s1, placing the diced semiconductor wafer on a suction mechanism 4 for suction positioning, and then attaching a protective film on the front surface of the wafer;
s2, driving the air suction plate 36 to rotate for one hundred eighty degrees through the rotating assembly 35, attaching the air suction plate 36 to the upper end face of the wafer under the extrusion action, and simultaneously electrifying the air suction assembly 56 to suck the wafer on the air suction plate 36, wherein the air bag assembly 33 is in an overflow state to further wrap and position the edge of the wafer;
s3, shutting down the air suction mechanism 4;
s4, driving the overturning and positioning mechanism 3 and the air suction mechanism 4 to reversely move through the bidirectional driving mechanism 2 until the distance between the overturning and positioning mechanism 3 and the air suction mechanism is at the maximum value, wherein a passageway is formed by the overturning assembly 31 in the overturning and positioning mechanism 3 so as to drive the connecting ring 32 and the air-sucked wafer to rotate for one hundred and eighty degrees, and the protection film on the original back is overturned to the upper side;
s5, driving the connecting block 53 to move rightwards through the electric sliding block 52, and under the action of the guide groove 55 and the air suction component 56, lifting the original back protective film by the attaching component 57 for horizontal conveying after contact suction, so as to perform film uncovering treatment;
s6, finally, carrying out subsequent back inspection treatment on the wafer after the film is removed.
While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the invention, which is defined by the appended claims.
Claims (10)
1. The utility model provides a wafer turns over membrane device, includes mount (1), its characterized in that: the side wall of the fixing frame (1) is provided with a bidirectional driving mechanism (2), the middle part of the bidirectional driving mechanism (2) is sequentially provided with a turnover positioning mechanism (3) and an air suction mechanism (4) from top to bottom, and the upper end of the fixing frame (1) is connected with a film uncovering mechanism (5) through a bracket;
the turnover positioning mechanism (3) comprises a turnover assembly (31), a connecting ring (32), an air bag assembly (33), a connecting seat (34), a rotating assembly (35), an air suction plate (36) and an air suction assembly (37), wherein the connecting ring (32) is installed at the front end of the turnover assembly (31), the air bag assembly (33) is arranged in an inner cavity of the connecting ring (32), the connecting seat (34) is symmetrically installed at the left end and the right end of the connecting ring (32), the rotating assembly (35) is arranged inside the connecting seat (34), the air suction plate (36) is installed at the outer end of the rotating assembly (35), and the air suction assembly (37) is arranged inside the air suction plate (36);
the film uncovering mechanism (5) comprises a return frame (51), electric sliding blocks (52), connecting blocks (53), adjusting blocks (54), guide grooves (55), air suction assemblies (56) and attaching assemblies (57), wherein a support is connected between the return frame (51) and a fixing frame (1), the electric sliding blocks (52) are symmetrically arranged in the return frame (51), the connecting blocks (53) are arranged between the electric sliding blocks (52), the adjusting blocks (54) are arranged at the lower ends of the connecting blocks (53) in a sliding mode, cylindrical sliding pieces are arranged on the side walls of the adjusting blocks (54) in the guide grooves (55) formed in the side walls of the return frame (51) in a sliding mode, the lower ends of the adjusting blocks (54) are provided with angle-adjustable attaching assemblies (57), and the air suction assemblies (56) arranged in the adjusting blocks (54) are connected with the attaching assemblies (57) in a ventilation mode.
2. The wafer film turning device according to claim 1, wherein: the bidirectional driving mechanism (2) comprises a bidirectional screw (21), a driving motor (22) and a sliding block (23), wherein the upper end and the lower end of the bidirectional screw (21) are connected with the fixing frame (1) through bearings, the bidirectional screw (21) is connected with an output shaft of the driving motor (22) installed on the fixing frame (1), the sliding block (23) is symmetrically arranged on the bidirectional screw (21), the sliding block (23) is in threaded fit connection with the bidirectional screw (21), the sliding block (23) is vertically arranged in a sliding groove formed in the fixing frame (1) in a sliding mode, and the sliding block (23) which is vertically arranged is respectively connected with the overturning assembly (31) and the air suction mechanism (4) in a corresponding mode.
3. The wafer film turning device according to claim 2, wherein: the turnover assembly (31) is composed of a shell, a rotating motor, a power supply and a switch key, the shell is connected with a sliding block (23) arranged on the upper side, the rotating motor, the power supply and the switch key which are arranged in the shell are electrically connected, an output shaft of the rotating motor is connected with a connecting ring (32), and a starting piece (6) corresponding to the position of the switch key is arranged at the lower end of the square frame (51).
4. The wafer film turning device according to claim 1, wherein: the air bag assembly (33) comprises an edge membrane (331), a piston block (332), a pressing piece (333) and an internal spring (334), wherein the opening position of the inner side of the inner cavity of the connecting ring (32) is in annular sealing connection through the edge membrane (331), the piston block (332) is slidably arranged at the upper end of the inner cavity of the connecting ring (32), the piston block (332) is connected with the pressing piece (333), and the internal spring (334) is connected between the pressing piece (333) and a hidden groove formed in the upper end of the connecting ring (32).
5. The wafer film turning device according to claim 1, wherein: the rotating assembly (35) comprises a connecting motor (351), a rotating part (352), a sleeving block (353), an extrusion part (354) and an extrusion roller (355), wherein an output shaft of the connecting motor (351) arranged in the connecting seat (34) is connected with the rotating part (352), the rotating part (352) is rotatably arranged on the connecting seat (34), the middle part of the rotating part (352) is provided with the sleeving block (353) in a sliding manner up and down, the sleeving block (353) is fixedly connected with the air suction plate (36), the extrusion part (354) is arranged on the outer side of the lower end of the sleeving block (353), and the extrusion roller (355) corresponding to the extrusion part (354) is rotatably arranged on the side wall of the connecting ring (32);
a reset spring is connected between the rotating piece (352) and the sleeving block (353), and the cross section of the transverse part of the extrusion piece (354) is of an isosceles trapezoid structure.
6. The wafer film turning device according to claim 4, wherein: the air suction assembly (37) comprises an air suction pump (371), a battery (372), a starting key (373) and a pressing piece (374), wherein a placing groove is formed in the inner side of the air suction plate (36), the air suction pump (371), the battery (372) and the starting key (373) are arranged in the placing groove and are electrically connected, an air cavity formed in the lower end of the air suction plate (36) is communicated with the air suction pump (371), air holes are uniformly formed in the lower end of the air cavity, a pressing piece (374) is arranged at the lower end of the inner side of the air suction plate (36), and the pressing piece (374) corresponds to the position between the pressing piece (333).
7. The wafer film turning device according to claim 2, wherein: the air suction mechanism (4) comprises an air suction seat (41) and an air suction pump (42), the air suction seat (41) is connected with a sliding block (23) arranged at the lower side, and an air suction cavity formed in the air suction seat (41) is communicated with the air suction pump (42) arranged at the lower end of the air suction seat (41).
8. The wafer film turning device according to claim 1, wherein: the adjusting block (54) comprises a middle block (541) and a sliding column (542), and the sliding column (542) arranged at the upper end of the middle block (541) is arranged at the lower end of the connecting block (53) in a vertical sliding manner;
the guide groove (55) is formed by communicating a straight groove with a bent groove of a U-shaped structure.
9. The wafer film turning device according to claim 8, wherein: the air suction assembly (56) comprises a pump body (561), a battery pack (562), two starting switches (563) and a connecting pipe (564), an insulating cavity is formed in the middle block (541), the pump body (561), the battery pack (562) and the two starting switches (563) are arranged in the insulating cavity and are connected in series, and the output position of the pump body (561) is communicated with the connecting pipe (564);
trigger pieces are symmetrically arranged at the left end and the right end of the square frame (51), the trigger pieces correspond to the starting switch (563), and the starting switch (563) is in an off state when the starting switch (563) is in contact with the trigger pieces.
10. The wafer film turning device according to claim 9, wherein: laminating subassembly (57) is including sliding plate (571), coupling spring (572), angle piece (573) and flexible pipe (574), sliding plate (571) horizontal slip sets up the lower extreme at regulating block (54), and be connected with coupling spring (572) between sliding plate (571) of regulating block (54) and U type structure, the lower extreme of sliding plate (571) is connected with angle piece (573) through the round pin axle, output chamber has been seted up to the lower extreme of angle piece (573), be connected with flexible pipe (574) between output chamber and connecting pipe (564), the through-hole has been seted up to the lower extreme in output chamber.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310367712.6A CN116313982B (en) | 2023-04-07 | 2023-04-07 | Film turning device for wafer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310367712.6A CN116313982B (en) | 2023-04-07 | 2023-04-07 | Film turning device for wafer |
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| CN116313982A true CN116313982A (en) | 2023-06-23 |
| CN116313982B CN116313982B (en) | 2024-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5762751A (en) * | 1995-08-17 | 1998-06-09 | Semitool, Inc. | Semiconductor processor with wafer face protection |
| CN106653956A (en) * | 2015-11-04 | 2017-05-10 | 无锡华润华晶微电子有限公司 | Wafer membrane overturning method and locating device |
| CN208570553U (en) * | 2018-08-06 | 2019-03-01 | 上海东煦电子科技有限公司 | One kind turning over film device for semiconductor crystal wafer |
| CN110422416A (en) * | 2019-07-04 | 2019-11-08 | 宁波市鄞州特尔斐电子有限公司 | A kind of integrated circuit and its dyestripping method and dyestripping plate-laying equipment |
| WO2020066285A1 (en) * | 2018-09-28 | 2020-04-02 | 三星ダイヤモンド工業株式会社 | Wafer breaking device, inverting device, and conveyance system |
| CN115258616A (en) * | 2022-07-19 | 2022-11-01 | 深圳市博辉特科技有限公司 | Novel turnover mechanism |
-
2023
- 2023-04-07 CN CN202310367712.6A patent/CN116313982B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5762751A (en) * | 1995-08-17 | 1998-06-09 | Semitool, Inc. | Semiconductor processor with wafer face protection |
| CN106653956A (en) * | 2015-11-04 | 2017-05-10 | 无锡华润华晶微电子有限公司 | Wafer membrane overturning method and locating device |
| CN208570553U (en) * | 2018-08-06 | 2019-03-01 | 上海东煦电子科技有限公司 | One kind turning over film device for semiconductor crystal wafer |
| WO2020066285A1 (en) * | 2018-09-28 | 2020-04-02 | 三星ダイヤモンド工業株式会社 | Wafer breaking device, inverting device, and conveyance system |
| CN110422416A (en) * | 2019-07-04 | 2019-11-08 | 宁波市鄞州特尔斐电子有限公司 | A kind of integrated circuit and its dyestripping method and dyestripping plate-laying equipment |
| CN115258616A (en) * | 2022-07-19 | 2022-11-01 | 深圳市博辉特科技有限公司 | Novel turnover mechanism |
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| CN116313982B (en) | 2024-06-11 |
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