CN116299889A

CN116299889A - Receiving-transmitting integrated BOSA bidirectional optical component and optical module

Info

Publication number: CN116299889A
Application number: CN202111570079.8A
Authority: CN
Inventors: 张玲艳
Original assignee: Zte Photonics Technology Co ltd
Current assignee: Zte Photonics Technology Co ltd
Priority date: 2021-12-21
Filing date: 2021-12-21
Publication date: 2023-06-23
Also published as: WO2023115921A1

Abstract

The invention discloses a receiving and transmitting integrated BOSA bidirectional optical component, which can be widely applied to the technical field of electronic equipment. The receiving and transmitting integrated BOSA bidirectional optical component comprises a PLC multiplexer/demultiplexer, an optical fiber interface, a laser component and a detector chip; the optical fiber interface is coupled with the first side end face of the PLC multiplexer/demultiplexer; the laser component is coupled with the second side end face of the planar optical waveguide multiplexer-demultiplexer; the detector component is coupled with the second side end face of the planar optical waveguide multiplexer-demultiplexer; the first side end face and the second side end face are opposite end faces. The invention adopts the PLC combining and wave-dividing device integration technology, does not need to independently package a laser component and a detector chip, omits a 45-degree filter, and reduces the manufacturing cost.

Description

Receiving-transmitting integrated BOSA bidirectional optical component and optical module

Technical Field

The invention relates to the technical field of electronic equipment, in particular to a BOSA bidirectional optical component and an optical module integrated with transceiver.

Background

The BOSA (Bi-Directional Optical Sub-Assembly) optical module is a core optical module widely used in the ONU (Optical Network Unit ) (user side equipment of PON system) field of PON (Passive Optical Network ) and optical module needing to transmit and receive integrated optical module.

Disclosure of Invention

The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

The embodiment of the invention provides a receiving and transmitting integrated BOSA bidirectional optical component and an optical module, which can reduce the manufacturing cost and are more convenient for miniaturization so as to further reduce the volume of a terminal.

On one hand, the embodiment of the invention provides a receiving and transmitting integrated BOSA bidirectional optical component, which comprises a PLC multiplexer/demultiplexer, an optical fiber interface, a laser component and a detector component; the optical fiber interface is coupled with the first side end face of the PLC multiplexer/demultiplexer; the laser component is coupled with the second side end face of the PLC multiplexer/demultiplexer; the detector component is coupled with the second side end face of the PLC multiplexer/demultiplexer; the first side end face and the second side end face are two opposite end faces or the same end face.

Further, the detector assembly comprises a laser detector chip and a 0-degree filter, and is coupled with the second side end face of the PLC multiplexer/demultiplexer, wherein the coupling mode comprises at least one of the following steps:

when the second side end surface coupled with the detector component is an inclined end surface, the laser detector chip is coupled with the upper surface of the second side end surface of the PLC multiplexer/demultiplexer through a 0-degree filter; or (b)

When the second side end surface coupled with the detector component is a vertical end surface, the laser detector chip is coupled with the second side end surface of the PLC multiplexer/demultiplexer through a 0-degree filter.

Further, the inclined end face has an inclination angle of 30 DEG to 60 deg.

Further, the laser assembly includes a laser chip and a substrate.

Further, the receiving and transmitting integrated BOSA bidirectional optical component further comprises a base, wherein the base is used for bearing the PLC multiplexer/demultiplexer, the optical fiber interface, the laser component and the detector component.

Further, when the second side end surface coupled with the detector assembly is a vertical end surface and the base is a PCB board, the PLC combiner-splitter, the optical fiber interface, the laser assembly and the detector assembly are mounted on the PCB board.

Further, a heat dissipation assembly is embedded on the base, and the heat dissipation assembly is used for dissipating heat of the laser assembly.

Further, the laser assembly is coupled to the PLC combiner-divider by at least one of: an optical lens or an isolator.

Further, the detector assembly is coupled to the PLC combiner-divider by an optical lens.

Further, the PLC combiner-divider has an anti-crosstalk slot structure disposed between the laser assembly and the detector assembly.

Further, the laser component is connected with an external circuit board through an FPC board, and the detector component is connected with the external circuit board through the FPC board.

Further, the laser assembly further comprises an MPD detector for monitoring the working state of the laser assembly.

Further, the probe assembly is connected to the FPC board by one of:

the detector component is connected with the FPC board through a transimpedance amplifier; or (b)

The detector assembly is connected with the FPC board through a transimpedance amplifier and a capacitor.

Further, the optical fiber interface is connected with an optical fiber adapter,

the optical fiber adapter is directly coupled with the PLC multiplexer/demultiplexer; or (b)

The optical fiber adapter is coupled with the PLC multiplexer/demultiplexer through an optical lens

On the other hand, the embodiment of the invention also provides an optical module, which comprises the receiving-transmitting integrated BOSA bidirectional optical component.

The beneficial effects of the invention include: the receiving and transmitting integrated BOSA bidirectional optical component comprises a PLC multiplexer/demultiplexer, an optical fiber interface, a laser component and a detector component; the optical fiber interface is coupled with the first side end face of the PLC multiplexer/demultiplexer; the laser component is coupled with the second side end face of the planar optical waveguide multiplexer-demultiplexer; the detector component is coupled with the second side end face of the planar optical waveguide multiplexer-demultiplexer; the first side end face and the second side end face are opposite end faces. The invention adopts the PLC wave combining and dividing device integration technology, does not need to independently package the laser component and the detector component, directly couples the laser component and the detector component with the PLC wave combining and dividing device respectively, outputs the laser component and the detector component through the PLC wave combining and dividing device, saves a 45-degree filter, reduces the manufacturing cost, and is more convenient for miniaturization so as to further reduce the volume of the terminal.

Drawings

FIG. 1 is a structural outline view of a BOSA optical module of the prior art;

FIG. 2 is a schematic diagram of the optical path of the BOSA optical module of FIG. 1;

FIG. 3 is a schematic diagram of a bi-directional optical transceiver module of the BOSA according to one embodiment of the invention;

FIG. 4 is a schematic diagram of a backplane of a BOSA bidirectional optical module according to one embodiment of the invention;

FIG. 5 is a side view of an exemplary transceiver integrated BOSA bidirectional optical module according to one embodiment of the invention;

FIG. 6 is a schematic diagram of a chassis with a heat dissipation assembly for a BOSA bidirectional optical module according to one embodiment of the invention;

FIG. 7 is a side view of the end face of the PLC combiner-splitter in an embodiment of the invention, showing an angled end face;

FIG. 8 is a top view of the end face of the PLC combiner-divider in an embodiment of the invention being a vertical end face;

FIG. 9 is a side view of the end face of the PLC combiner-splitter in an embodiment of the invention, which is a vertical end face;

FIG. 10 is a schematic diagram of a base board of a BOSA bidirectional optical module as a PCB in an embodiment of the invention;

fig. 11 is a schematic structural diagram of a bi-directional optical transceiver module according to another embodiment of the present invention.

Detailed Description

For the purposes of making the objects, technical solutions and advantages of the present application more apparent, embodiments of the present application will be described in detail hereinafter with reference to the accompanying drawings. It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be arbitrarily combined with each other.

In order to make the present application solution better understood by those skilled in the art, the following description will be made in detail and with reference to the accompanying drawings in the embodiments of the present application, it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, shall fall within the scope of the present application.

The terms "first," "second," "third," and "fourth" and the like in the description and in the claims of this application and in the drawings, are used for distinguishing between different objects and not for describing a particular sequential order. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

In the related art, a BOSA (Bi-Directional Optical Sub-Assembly) optical module is a core optical module widely used in an optical module of a PON (Passive Optical Network ) field ONU (Optical Network Unit, optical network unit) (a user side device of a PON system) and an integrated optical module to be transmitted and received, and the optical module package Form used by the module may be any optical module structure package Form such as SFP (Small Form-factor Pluggables) meeting protocol requirements or non-standard, and as a communication system is continuously developed, the application of an onboard optical module BOSA is very wide, the mainstream technical scheme of an ONU BOSA integrated optical module applied to a PON system still mainly uses coaxial packages, the scheme needs to package a transmitting laser and a receiving detector respectively, then the transmitting and receiving are integrated in a module by integrating a wave splitter on an external optical path, and finally forming an integrated optical module with a pluggable optical port or integrated function, and the integrated optical module package Form is a structure of a BOSA 1-2, and a structure of the optical module is a transmitter-96 in a prior art (fig. 1-2 is a structure of a transmitter-a chip of a BOSA transmitter-96 of the optical module in a PON system; ROSA (Receiver Optical Subassembly Assemble, receiver detector Assembly) is a receiver detector 2, within which is a receiver detector chip APD (Acalanche Photodiode, avalanche photodiode) or PD (Photo devices or Photo dioder, a photodetector or photodiode) and a transimpedance amplifier TIA (Transimpedance Amplifier) chip to convert an optical signal into an electrical signal; the optical fiber interface 3 is used for outputting an optical signal of the transmitting laser and inputting an external optical signal, and the wave combination and the wave separation are realized between the transmitter 1 and the receiving detector 2 through a structural member 4, and the structural member 4 generally comprises a 45-degree filter 5, a 0-degree filter 7 (other combinations of different angle filters are possible) and an isolator 6. The BOSA optical assembly with the structure needs two TO CAN (transmitter-outline-CAN, laser diode module) bases, the TO CAN bases are respectively used for supporting a transmitting laser chip and a receiving detector chip, two TO caps are respectively required TO respectively package the transmitting chip and the receiving chip TO be respectively packaged TO obtain a semi-finished product TO CAN (transmitter-outline-CAN, laser diode module) with an independent optical path structure, and then the semi-finished product TO CAN is fixedly coupled with an optical port through a metal piece, so that the transmitting TO CAN and the receiving TO CAN are respectively coupled. The BOSA component with the structure has high cost and long manufacturing flow.

The BOSA optical assembly needs TO integrate the receiving and transmitting functions together through twice TO CAN packaging and twice optical path coupling, has long production period, and needs twice packaging material cost due TO separate packaging of transmitting and receiving, and in addition, the cost of an external combiner-splitter and the cost of some matched parts in the BOSA optical path are also needed. Moreover, the BOSA optical component has low integration level, is unfavorable for miniaturization of the structural size, and is unfavorable for further reduction of the volume of the terminal.

Based on the above, the embodiment of the application provides a receiving and transmitting integrated BOSA bidirectional optical component, which comprises a PLC combiner-demultiplexer, an optical fiber interface, a laser component and a detector component; the optical fiber interface is coupled with the first side end face of the PLC multiplexer/demultiplexer; the laser component is coupled with the second side end face of the PLC multiplexer/demultiplexer; the detector component is coupled with the second side end face of the PLC multiplexer/demultiplexer; the first side end face and the second side end face are two opposite end faces or the same end face. The optical component with the integrated receiving and transmitting functions is realized by adopting the wave combining and dividing device technology of the optical waveguide structure, and the optical waveguide structure is respectively and directly coupled with the transmitting laser and the receiving detector, and the optical waveguide and the optical fiber are coupled, so that the transmitting laser and the receiving detector do not need TO be respectively and independently packaged, the material cost, the manufacturing cost and the production period of the transmitting TO CAN and the receiving TO CAN of the BOSA optical component in the prior art are saved, and the size of the BOSA optical component is reduced; the wave combining and dividing device technology of the optical waveguide structure is adopted to realize the wave combining and dividing of the emission and the receiving, so that a 45-degree filter plate is omitted, and the production cost is further reduced.

In this embodiment of the present application, referring specifically to fig. 3, a bi-directional optical transceiver module of the BOSA module of the present application, it should be noted that fig. 3 includes some structures of the bi-directional optical transceiver module of the present application and the optical transceiver module connected to an external circuit structure. The PLC multiplexer/demultiplexer 7, the laser component, the detector component and the optical fiber interface are indispensable components. It should be noted that fig. 3 shows the first side end face and the second side end face as opposite end faces, and the first side end face and the second side end face may be set to be the same end face.

In this embodiment, referring to fig. 3, the optical component includes a PLC multiplexer/demultiplexer 7, where the material may be glass, silicon-based silica, silicon oxynitride, etc., and the PLC multiplexer/demultiplexer 7 is used to connect a laser component and a detector component, and implement optical path connection with an external optical fiber. In some embodiments, the material of the PLC multiplexer/demultiplexer 7 may be a low-cost glass material with less coupling loss with the optical fiber. Specifically, the PLC combiner/demultiplexer 7 is fabricated by a semiconductor process, and adopts a one-to-two structure. The left side of the optical fiber connector is provided with an optical access, the optical access is connected with an optical fiber interface, and the optical fiber interface is used for being connected with an optical fiber; the right side of the laser is provided with two light inlets and outlets which are respectively coupled with the laser component and the detector component.

In the present embodiment, referring to fig. 3, the optical assembly includes a laser assembly, which may include a substrate 9 and a laser chip 10. The substrate 9 and the laser chip 10 are fixedly connected by eutectic soldering to form a laser assembly. Notably, the laser assembly may be implemented by a single chip. The laser chip 10 is a light source for emitting light, and emits a laser signal. The substrate 9 may be a glass, ceramic, silicon-based material for carrying the laser chip, while it has a heat dissipation function. In some embodiments, the substrate 9 has a metallization layer thereon, the anode and cathode of the laser chip 10 are connected with the metallization layer on the substrate 9 by a gold wire bonding process, and then the substrate 9 is connected with the FPC flexible-rigid board 4 by gold wire bonding, so as to realize electrical connection between the laser chip 10 and the outside. In some embodiments, the substrate 9 may be made of a ceramic material to achieve a good heat dissipation effect. And then the laser chip with the substrate is coupled with one of two light inlets and outlets on the right side of the PLC multiplexer/demultiplexer 7, and the coupled light output power is maximized by connecting the laser chip with the substrate with an external power machine through a connector of the optical fiber adapter 3 and monitoring the laser chip at any time. After the coupling light output reaches the maximum value, UV glue is coated on the side surface of the substrate 9, which is close to the PLC multiplexer/demultiplexer 7, the laser chip 10 is coupled with the PLC multiplexer/demultiplexer 7 again, after the coupling is coupled to the maximum value, the end surfaces of the laser chip 10 and the PLC multiplexer/demultiplexer 7 are filled with refractive index matching liquid, and the matching liquid can reduce the reflection of the coupling end surface, improve the coupling efficiency and the coupling tolerance and reduce the adverse effect of reflected light on the laser. And then the ultraviolet light irradiates the substrate 9 and the PLC multiplexer/demultiplexer 7, and the PLC multiplexer/demultiplexer 7 is made of glass material and can transmit light, so that the UV glue on the side surfaces of the substrate 9 and the PLC multiplexer/demultiplexer 7 can be cured, and after the UV glue is cured, the connection is reinforced and the firmness is enhanced by heat curing.

In this embodiment of the application, laser instrument subassembly passes through the FPC board and is connected with external circuit board, and the detector subassembly passes through the FPC board and is connected with external circuit board. Referring to fig. 3, the transmitting-end FPC board 4 is used for connecting the laser assembly with an external circuit board to realize connection of electrical functions. In this technical scheme, the transmitting end FPC board 4 needs to be wire bonded with an internal circuit, so that a rigid-flex board structure is adopted here. And the receiving end FPC board 5 is used for connecting the detector assembly with an external circuit board to realize connection of electrical functions. The receiving end FPC board 5 needs to be wire bonded, so a rigid-flex board structure is adopted here. In other embodiments, the transmitting-end FPC board 4 and the receiving-end FPC board 5 may be implemented by the same FPC board, without necessarily separating the transmitting-end and the receiving-end into two FPC boards.

In some embodiments, referring to fig. 3, the laser assembly further includes an MPD detector for monitoring an operational state of the laser assembly. The laser component is connected with the FPC board through the MPD detector 11 and is used for receiving light of the back of the laser 10 and converting the light into photocurrent, and the working state of the laser component is monitored by monitoring the photocurrent.

In some embodiments, the probe assembly is connected to the FPC board through a transimpedance amplifier TIA (Transimpedance Amplifier) 14. The transimpedance amplifier TIA (Transimpedance Amplifier) is used for amplifying the weak photocurrent signal converted and output by the detector chip and outputting the weak photocurrent signal as a voltage signal.

In some embodiments, the probe assembly is connected to the FPC board through a transimpedance amplifier TIA (Transimpedance Amplifier) and a capacitive chip 15. According to the performance requirement of the detector assembly, a plurality of capacitance chips with different capacitance values can be matched to filter and reduce noise.

In some embodiments, the fiber optic interface is connected to a fiber optic adapter 3, and the fiber optic adapter 3 is directly coupled to the optical port of the PLC multiplexer/demultiplexer.

In some embodiments, the fiber interface is connected to a fiber adapter 3, and the fiber adapter 3 is coupled to the light inlet and outlet of the PLC combiner-demultiplexer through an optical lens.

In some embodiments, the fiber optic interface has a V-groove structure 8 for connecting the fiber optic adapter 3, and also for securing the fiber optic lens, protecting, supporting, and coupling the fiber optic adapter 3 to the PLC combiner-splitter.

In this embodiment, referring to fig. 3, the optical assembly includes a detector assembly, which may include a 0 ° filter 12 and a laser detector chip 13. Notably, the detector assembly may be implemented by a single chip. The laser detector chip 13 is configured to receive external incoming signal light and convert the signal light into photocurrent, and the 0 ° filter 12 is configured to filter out other interference light or stray light coming through the combiner-divider of the optical waveguide structure, so as to prevent the interference light or stray light from entering the laser detector chip 13, thereby reducing crosstalk between the emitted light and the received light, so as not to affect normal operation of the laser detector chip 13. It is noted that the 0 ° filter 12 and the upper surface or the left end face of the PLC combiner-divider 7 are fixed by UV transparent glue.

Referring to fig. 4-5, the transceiver-integrated BOSA bidirectional optical assembly may further include a base, where the base is configured to carry the PLC combiner-splitter, the optical fiber interface, the laser assembly, and the detector assembly. Specifically, the material of the base 1 can be selected from non-metal such as ceramic, glass, PCB, etc., or alloy such as kovar, etc., and the base itself has a certain heat dissipation function, is used for bearing various components inside the optical assembly, and plays a supporting and protecting role for the BOSA bidirectional optical assembly.

In some embodiments, referring to fig. 5, the bi-directional optical module of the BOSA integrated with transceiver may further include an upper cover plate 2, where the upper cover plate 2 may be made of a non-metal such as ceramic, glass, or the like, or may be made of a kovar, and the upper cover plate 2 is used to protect the internal structure from being damaged by the external harsh environment.

In some embodiments, referring to fig. 6, the base 1 may be embedded with a heat dissipating component, which may be a high thermal conductivity metal structure, for dissipating heat from the laser component. In this embodiment, since the base 1 is made of a kovar material with poor thermal conductivity, a tungsten copper material with high thermal conductivity is embedded on the kovar base as a heat dissipation metal material for dissipating heat of the laser chip. In an alternative embodiment, a highly thermally conductive damascene structure may not be used if the power consumption of the laser assembly is small.

In some embodiments, when the second side end face coupled with the detector assembly is an angled end face, see fig. 7, the laser detector chip is coupled with an upper surface at the second side end face of the PLC combiner-divider through a 0 ° filter. In the structure, after passing through the PLC multiplexer/demultiplexer, the laser component and the detector component realize the output and input of optical signals through the optical fiber adapter 3. In some embodiments, the laser assembly and the detector assembly may be packaged in the same assembly, and the laser chip 10 is directly coupled to the combiner-divider 7 of the optical waveguide structure and then output through the fiber adapter 3. In other embodiments, the light input from the optical fiber adapter 3 is incident to the APD chip 13 of the receiving detector after being turned upwards by using the inclined end surface of the PLC combiner-divider as a reflecting structure, and the pigtail 3 and the combiner-divider 7 of the optical waveguide structure are fixed by coupling. The angle of the inclined end face is generally selected to be between 30 and 60 degrees, can be 45 degrees or 42 degrees, and the specific angle is determined according to the light path structure and the coupling efficiency. As shown in fig. 7, the PLC combiner-divider has an inclined end surface of 45 ° as a reflecting structure, and can reflect light in the combiner-divider of the optical waveguide structure into the reception detector chip 13.

In some embodiments, when the second side facet coupled to the detector assembly is a perpendicular facet, see fig. 8-9, the laser detector chip is coupled to the second side facet of the PLC combiner-divider through a 0 ° filter. In this embodiment, the detector assembly may be coupled to the waveguide on the end face of the PLC combiner-divider using the same coupling scheme as the laser assembly, and in this case, the 0 ° filter 12 may be attached to the front end face of the combiner-divider chip of the optical waveguide structure. In fig. 8-9, because the end-face coupling is adopted between the detector assembly and the PLC combiner-splitter, the laser detector chip 13 needs to be mounted on the TIA in a coplanar manner through a carrier 16, so that electrical connection between the TIA and the laser detector chip 13 is facilitated through gold wire bonding. The carrier 16 is mainly used for carrying the detector chip and has a circuit pattern thereon, and the material of the carrier 16 can be selected from non-metal materials such as ceramics, silicon and the like.

In some embodiments, the PLC combiner-divider has an anti-crosstalk slot structure disposed between the laser assembly and the detector assembly. Because the laser component and the receiving detector component are attached to the end face of the PLC combiner-demultiplexer 7 at the same time, when more light energy of the light emitted by the laser chip cannot be coupled into the optical waveguide structure of the combiner-demultiplexer, the laser emitted by the laser chip 10 at the transmitting end may cause optical crosstalk to the receiving detector component by the light scattered or reflected by the end face of the PLC combiner-demultiplexer 7, which affects the normal operation of the detector component. Because the laser component and the coupling end face of the PLC multiplexer/demultiplexer 7 have the highest energy and the strongest reflection or scattering, and the material of the PLC multiplexer/demultiplexer 7 can be made of glass material, the glass material has good light transmittance, so that part of light can enter the medium of the PLC multiplexer/demultiplexer 7, and optical crosstalk between transmission and reception is caused. After the anti-crosstalk groove structure is added, the anti-crosstalk groove structure can separate most of light energy of the laser component on the coupling end surface of the PLC multiplexer/demultiplexer 7 from being reflected or scattered to the receiving waveguide of the laser detector chip 13 or the front end surface of the PLC multiplexer/demultiplexer 7. Therefore, the crosstalk prevention groove structure can reduce or prevent the occurrence of the problem of optical crosstalk between the transmission and the reception. In some embodiments, a light absorbing material film layer may be further plated on the side surface of the anti-crosstalk slot structure, so that optical crosstalk between the transmitting end and the receiving end can be further reduced, and the influence of leaked light on performance stability of the transmitting chip and the receiving chip when the laser chip is coupled with the PLC combiner-demultiplexer 7 is prevented. Since the 0 ° filter 12 between the laser detector chip 13 and the PLC combiner-divider 7 also functions to reduce optical crosstalk, the 0 ° filter 12 can only transmit light of a wavelength that the laser detector chip 13 needs to receive, and isolate all light of the remaining wavelengths. The anti-crosstalk slot structure is thus a double safety structure against crosstalk. In some embodiments, the crosstalk-preventing slot structure may be a V-shaped slot or a rectangular slot.

In some embodiments, when the second side end face of the PLC combiner/splitter coupled with the detector assembly is a vertical end face and the base is a PCB board, the PLC combiner/splitter, the fiber optic interface, the laser assembly, and the detector assembly are mounted on the PCB board. In this embodiment, the integration of the assembly module is realized in the form of COB, without being connected to an external module structure in the form of a soft and hard combined FPC board. As shown in fig. 10, various electrical chips, capacitors, inductors, resistors, and other components required for realizing the functions of the module are also mounted on the PCB board 101. Wherein 102, 103, 104, 105 are various electrical chips and components such as capacitance, inductance, resistance, etc. 106 is a golden finger of the PCB board for connecting with external devices. The cost of the components and the modules can be reduced by directly mounting the photoelectric chips on the PCB of the module. Because the photoelectric chip is in the incompletely sealed environment in this scheme, consequently cover one deck insulating protection glue at the upper surface of the components and parts such as photoelectric chip, gold thread and optic fibre that are liable to receive external environment, play the effect that makes photoelectric chip and external environment keep apart, use the structural adhesive to consolidate at optic fibre and WDM to close the portion that the wave separator connects and cover one deck sealing gum again, finally, place a apron in PCB top again, can be fixed through setting up the locating hole between apron and the PCB board, also can be fixed through intensity glue. And then sealing the gap between the cover plate and the PCB by using sealant, thereby reducing or preventing water vapor and pollutants in the external environment from entering, and prolonging the service life of the assembly and the module. In this embodiment, the electrical chip on the module circuit board may be a packaged electrical chip, or may be in the form of a bare chip, which is beneficial to reducing the cost of the module. In the same way, insulating glue can be coated on the upper surface of the module electric chip to isolate and protect the module electric chip from the outside.

In some embodiments, the laser component may not be directly coupled to the PLC combiner/demultiplexer, but the coupling between the laser component and the PLC combiner/demultiplexer may be implemented by a spatial optical lens, and in this embodiment, as shown in fig. 11, an optical element such as an isolator may be disposed on an optical path between the laser component and the PLC combiner/demultiplexer. Fig. 11 shows only the optical path structure of the inside of the bi-directional optical module, and after the inside of the bi-directional optical module is assembled, a cover plate is added to the upper surface of the bi-directional optical module for protecting the internal structure.

In some embodiments, the optical component of the structure may also be implemented in COB form, specifically, all components or chips and optical lenses are attached to the PCB, and then a cover plate is added over the bi-directional optical component to protect the internal structure. In this embodiment, since there are many discrete optical components, a non-hermetic package structure with a rigid-flex board is preferred, which is advantageous for improving the reliability of the assembly.

Because the coupling of the transmitting end component or the chip and the receiving end component or the chip and the PLC multiplexer/demultiplexer in the structure uses a spatial optical structure such as a lens, light emitted by the laser component and incident light emitted from the PLC multiplexer/demultiplexer may enter the detector component or the laser component through reflection, diffuse reflection and the like on the surfaces of the lens, the isolator or the PD chip of the detector and the like, thereby causing optical crosstalk to the receiving end or causing operation failure of the laser component. The optical component structure of fig. 11 is thus augmented with intermediate structural members 21 to prevent optical crosstalk between transmission and reception. Further, a layer of wave-absorbing material may be further plated on the surface of the structural member 21, so as to further reduce the propagation of light in space and the influence on the transmitting and receiving chips.

In some embodiments, the laser chip 10 and the detector chip 13 are coupled with the PLC multiplexer/demultiplexer 7 through optical lenses, wherein a laser front lens 17 is arranged between the laser chip 10 and the PLC multiplexer/demultiplexer 7; the isolator 18 is used for preventing reflected light from entering the laser chip 10, and a second lens 19 is arranged between the isolator 18 and the PLC multiplexer/demultiplexer 7 and is used for coupling laser light into the PLC multiplexer/demultiplexer 7. It should be noted that, the front lens 17 and the second lens 19 between the laser chip 10 and the PLC multiplexer/demultiplexer 7 may be a double lens or a single lens. The detector chip 13 receives the light emitted from the multiplexer/demultiplexer chip 7 of the optical waveguide structure through the optical lens 20, and the optical lens 20 may be a single lens or a double lens. In addition, in an embodiment, the detector chip 13 may also adopt an arrangement that the receiving surface faces upward, specifically, an optical path turning mirror may be placed between the optical lens 20 and the detector chip 13, and light in the horizontal direction is changed into light traveling downward after passing through the 45 ° reflecting mirror, and the light traveling downward in the direction is perpendicularly irradiated onto the receiving surface of the detector chip 13. In this embodiment, the 0 ° filter 12 may be placed on the optical path between the detector and the combiner/divider chip of the optical waveguide structure, or may be placed between the optical lens 20 and the PLC combiner/divider 7.

The embodiment of the application also provides an optical module, which comprises the receiving-transmitting integrated BOSA bidirectional optical component.

Similarly, the content in the above-mentioned embodiment of the bi-directional optical transceiver module is applicable to the embodiment of the optical module, and the functions specifically implemented by the embodiment of the optical module are the same as those of the embodiment of the bi-directional optical transceiver module, and the beneficial effects achieved by the embodiment of the method are the same as those achieved by the embodiment of the method.

It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly or indirectly fixed or connected to the other feature. Further, the descriptions of the upper, lower, left, right, etc. used in this disclosure are merely with respect to the mutual positional relationship of the various components of this disclosure in the drawings. As used in this disclosure, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. In addition, unless defined otherwise, all technical and scientific terms used in this example have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in the description of the embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used in this embodiment includes any combination of one or more of the associated listed items.

It should be understood that although the terms first, second, third, etc. may be used in this disclosure to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element of the same type from another. For example, a first element could also be termed a second element, and, similarly, a second element could also be termed a first element, without departing from the scope of the present disclosure. The use of any and all examples, or exemplary language (e.g., "such as") provided herein, is intended merely to better illuminate embodiments of the invention and does not pose a limitation on the scope of the invention unless otherwise claimed.

The present invention is not limited to the above embodiments, but can be modified, equivalent, improved, etc. by the same means to achieve the technical effects of the present invention, which are included in the spirit and principle of the present invention. Various modifications and variations are possible in the technical solution and/or in the embodiments within the scope of the invention.

Claims

1. The receiving and transmitting integrated BOSA bidirectional optical component is characterized by comprising a PLC multiplexer/demultiplexer, an optical fiber interface, a laser component and a detector component;

the optical fiber interface is coupled with the first side end face of the PLC multiplexer/demultiplexer;

the laser component is coupled with the second side end face of the PLC multiplexer/demultiplexer;

the detector component is coupled with the second side end face of the PLC multiplexer/demultiplexer;

the first side end face and the second side end face are two opposite end faces or the same end face.

2. The transceiver-integrated BOSA bi-directional optical module of claim 1, wherein the detector module comprises a laser detector chip and a 0 ° filter, the detector module being coupled to the second side facet of the PLC combiner-divider, wherein the coupling means comprises at least one of:

3. The transceiver-integrated BOSA bi-directional optical module of claim 2, wherein the inclined end surface has an inclination angle of 30 ° -60 °.

4. The bi-directional optical assembly of claim 1, wherein the laser assembly comprises a laser chip and a substrate.

5. The integrated BOSA bi-directional optical module of claim 1, further comprising a base for carrying the PLC combiner-splitter, fiber optic interface, laser assembly and detector assembly.

6. The transceiver-integrated BOSA bi-directional optical module of claim 2, wherein when the second side end surface coupled with the detector module is a vertical end surface and the base is a PCB board, the PLC combiner-splitter, the optical fiber interface, the laser module and the detector module are mounted on the PCB board.

7. The bi-directional optical module of any one of claims 1-6, wherein a heat sink is embedded in the base, the heat sink configured to dissipate heat from the laser assembly.

8. The transceiver-integrated BOSA bi-directional optical module of claim 1, characterized in that the laser module is coupled to the PLC combiner-splitter by at least one of: an optical lens or an isolator.

9. The transceiver-integrated BOSA bi-directional optical module of claim 6 or 8, characterized in that the detector module is coupled to the PLC combiner-divider by an optical lens.

10. The transceiver-integrated BOSA bi-directional optical module of claim 1, wherein the PLC combiner-divider has an anti-crosstalk slot structure disposed between the laser module and the detector module.

11. The bi-directional optical transceiver-integrated BOSA module of claim 1, wherein the laser module is connected to an external circuit board through an FPC board and the probe module is connected to the external circuit board through an FPC board.

12. The bi-directional optical transceiver-integrated BOSA assembly of claim 1, wherein the laser assembly further comprises an MPD detector for monitoring an operating state of the laser assembly.

13. The transceiver-integrated BOSA bi-directional optical assembly of claim 2, wherein the probe assembly is connected to the FPC board by one of:

14. The transceiver-integrated BOSA bi-directional optical module of claim 1, wherein the fiber optic interface is connected with a fiber optic adapter,

The optical fiber adapter is coupled with the PLC multiplexer/demultiplexer through an optical lens.

15. An optical module comprising the transceiver-integrated BOSA bi-directional optical assembly of claims 1-14.