CN116288360A - Non-phosphating polishing additive and production process thereof - Google Patents
Non-phosphating polishing additive and production process thereof Download PDFInfo
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- CN116288360A CN116288360A CN202310076043.7A CN202310076043A CN116288360A CN 116288360 A CN116288360 A CN 116288360A CN 202310076043 A CN202310076043 A CN 202310076043A CN 116288360 A CN116288360 A CN 116288360A
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- corrosion inhibitor
- polishing additive
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- 238000005498 polishing Methods 0.000 title claims abstract description 47
- 239000000654 additive Substances 0.000 title claims abstract description 38
- 230000000996 additive effect Effects 0.000 title claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 51
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 41
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims abstract description 40
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 37
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 34
- 238000005282 brightening Methods 0.000 claims abstract description 28
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 28
- 230000007797 corrosion Effects 0.000 claims abstract description 22
- 238000005260 corrosion Methods 0.000 claims abstract description 22
- 239000003112 inhibitor Substances 0.000 claims abstract description 22
- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 18
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims abstract description 18
- 239000010452 phosphate Substances 0.000 claims abstract description 18
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 claims abstract description 17
- GGZHVNZHFYCSEV-UHFFFAOYSA-N 1-Phenyl-5-mercaptotetrazole Chemical compound SC1=NN=NN1C1=CC=CC=C1 GGZHVNZHFYCSEV-UHFFFAOYSA-N 0.000 claims abstract description 17
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 claims abstract description 17
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 claims abstract description 17
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000005642 Oleic acid Substances 0.000 claims abstract description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000004115 Sodium Silicate Substances 0.000 claims abstract description 17
- 239000008139 complexing agent Substances 0.000 claims abstract description 17
- 235000011187 glycerol Nutrition 0.000 claims abstract description 17
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 claims abstract description 17
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims abstract description 17
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 claims abstract description 17
- 229920000570 polyether Polymers 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 17
- 239000010703 silicon Substances 0.000 claims abstract description 17
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 claims abstract description 17
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052911 sodium silicate Inorganic materials 0.000 claims abstract description 17
- 239000000080 wetting agent Substances 0.000 claims abstract description 17
- 229920013636 polyphenyl ether polymer Polymers 0.000 claims abstract description 14
- 239000002994 raw material Substances 0.000 claims abstract description 12
- 239000000243 solution Substances 0.000 claims description 23
- 238000003756 stirring Methods 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 10
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 5
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 230000007246 mechanism Effects 0.000 claims description 5
- 239000011259 mixed solution Substances 0.000 claims description 5
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 5
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 5
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 5
- -1 polyoxy silane Polymers 0.000 claims description 5
- 239000011684 sodium molybdate Substances 0.000 claims description 5
- 235000015393 sodium molybdate Nutrition 0.000 claims description 5
- TVXXNOYZHKPKGW-UHFFFAOYSA-N sodium molybdate (anhydrous) Chemical compound [Na+].[Na+].[O-][Mo]([O-])(=O)=O TVXXNOYZHKPKGW-UHFFFAOYSA-N 0.000 claims description 5
- 235000019830 sodium polyphosphate Nutrition 0.000 claims description 5
- XMVONEAAOPAGAO-UHFFFAOYSA-N sodium tungstate Chemical compound [Na+].[Na+].[O-][W]([O-])(=O)=O XMVONEAAOPAGAO-UHFFFAOYSA-N 0.000 claims description 5
- 238000005303 weighing Methods 0.000 claims description 5
- ZXAUZSQITFJWPS-UHFFFAOYSA-J zirconium(4+);disulfate Chemical compound [Zr+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O ZXAUZSQITFJWPS-UHFFFAOYSA-J 0.000 claims description 5
- 239000005416 organic matter Substances 0.000 claims 1
- 239000002351 wastewater Substances 0.000 abstract description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 3
- 239000011574 phosphorus Substances 0.000 abstract description 3
- 238000004381 surface treatment Methods 0.000 abstract description 3
- 239000004094 surface-active agent Substances 0.000 abstract description 3
- 229920006380 polyphenylene oxide Polymers 0.000 description 14
- 239000000463 material Substances 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/02—Light metals
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to the technical field of non-phosphating polishing additives, and discloses a non-phosphating polishing additive, which is characterized by comprising the following raw materials in parts by weight: 10-15g/L of brightening agent, 12-15g/L of corrosion inhibitor, 2-4g/L of complexing agent, 3-7g/L of wetting agent, 150-200ml/L of sulfuric acid, 14-18g of mercaptophenyl tetrazole, 350-400g of sodium hydroxide, 40-60g of sodium silicate, 3-5g of sodium polyacrylate, 600-700g of water, 6-10g of glycerin, 10-15g of oleic acid, 1-3g of polyphenyl ether (PPO), 5-8g of polyether modified polyoxysilane and 3-5g of water-based organic silicon resin. According to the non-phosphate polishing additive and the production process thereof, the waste water after the phosphate polishing processing is easy to treat because of no phosphorus, and the added surfactant can enable the additive to be fully contacted with the surface of a workpiece, so that the uniformity and smoothness of the surface treatment of the workpiece are improved.
Description
Technical Field
The invention relates to the technical field of non-phosphating polishing additives, in particular to a non-phosphating polishing additive and a production process thereof.
Background
Aluminum is one of the most important nonferrous materials and is widely used in many fields. In order to meet different application requirements, aluminum products are required to have different surface effects, such as soft and sandy surfaces or bright mirror surfaces, and polishing is an important means for obtaining bright mirror surfaces. Although the mechanical polishing can obtain a smooth and clean surface, the surface of the aluminum product is subjected to pressure and local high-temperature operation in the mechanical polishing process, and crystal lattice deformation, such as direct anodic oxidation without chemical polishing, cannot obtain an oxide film layer with higher reflection coefficient, and ideal brightness is difficult to obtain, so that after the mechanical polishing, chemical polishing or electrochemical polishing is required to remove the surface crystal deformation layer, and then the high-quality film layer with good surface decoration can be obtained. With the increasing awareness of environmental protection, the replacement of acidic polishing additives with alkaline polishing additives has been the current development trend of aluminum and aluminum alloy product polishing. However, the existing alkaline polishing additive still has the problems that the additive has strong corrosiveness when the polishing time is long, and bad phenomena such as flow marks, surface patterns, exposed material lines, uneven brightness and the like are easy to occur on the surface of a product, so that the yield of the product is low and the production efficiency is low.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the invention provides the non-phosphating polishing additive and the production process thereof, which have the advantages of smooth and uniform product surface, solve the problems of the alkaline polishing additive, and have stronger corrosiveness when the polishing time is longer, and easily cause the adverse phenomena of flow marks, surface patterns, exposed material lines, uneven brightness and the like on the product surface, thereby causing the problems of low product yield and low production efficiency.
(II) technical scheme
In order to achieve the purpose of smooth and uniform surface of the product, the invention provides the following technical scheme: the non-phosphate polishing additive is characterized by comprising the following raw materials in parts by weight: 10-15g/L of brightening agent, 12-15g/L of corrosion inhibitor, 2-4g/L of complexing agent, 3-7g/L of wetting agent, 150-200ml/L of sulfuric acid, 14-18g of mercaptophenyl tetrazole, 350-400g of sodium hydroxide, 40-60g of sodium silicate, 3-5g of sodium polyacrylate, 600-700g of water, 6-10g of glycerin, 10-15g of oleic acid, 1-3g of polyphenyl ether (PPO), 5-8g of polyether modified polyoxysilane and 3-5g of water-based organic silicon resin.
Preferably, the corrosion inhibitor is at least three of sodium polyphosphate, sodium tungstate, sodium molybdate and nitrogen-containing organic matters.
Preferably, the brightening agent is a mixture of copper sulfate, nickel sulfate and zirconium sulfate.
Preferably, the feed comprises the following raw materials in parts by weight: the brightening agent comprises 10g/L of brightening agent, 12g/L of corrosion inhibitor, 2g/L of complexing agent, 3g/L of wetting agent, 150ml/L of sulfuric acid, 14g of mercaptophenyl tetrazole, 350g of sodium hydroxide, 40g of sodium silicate, 3g of sodium polyacrylate, 600g of water, 6g of glycerin, 10g of oleic acid, 1g of polyphenyl ether (PPO), 5g of polyether modified polyoxysilane and 3g of water-based organic silicon resin.
Preferably, the feed comprises the following raw materials in parts by weight: 13g/L of brightening agent, 14g/L of corrosion inhibitor, 3g/L of complexing agent, 5g/L of wetting agent, 170ml/L of sulfuric acid, 17g of mercaptophenyl tetrazole, 380g of sodium hydroxide, 50g of sodium silicate, 4g of sodium polyacrylate, 650g of water, 8g of glycerol, 13g of oleic acid, 2g of polyphenyl ether (PPO), 6.5g of polyether modified polyoxysilane and 4g of water-based organic silicon resin.
Preferably, the feed comprises the following raw materials in parts by weight: the brightening agent comprises 15g/L of brightening agent, 15g/L of corrosion inhibitor, 4g/L of complexing agent, 7g/L of wetting agent, 200ml/L of sulfuric acid, 18g of mercaptophenyl tetrazole, 400g of sodium hydroxide, 60g of sodium silicate, 3-5g of sodium polyacrylate, 700g of water, 10g of glycerol, 15g of oleic acid, 3g of polyphenyl ether (PPO), 8g of polyether modified polyoxysilane and 5g of water-based organic silicon resin.
The invention provides a production process of a non-phosphating polishing additive, which comprises the following steps:
s1, charging, namely weighing 350-400g of sodium hydroxide, 40-60g of sodium silicate, 3-5g of sodium polyacrylate, 12-15g/L of corrosion inhibitor, 3-7g/L of wetting agent and 600-700g of water, and mixing in a stirring barrel;
s2, after mixing, introducing the mixture into a mixing tank, injecting water at the speed of 50g/min, sequentially introducing 6-10g of glycerin, 10-15g of oleic acid, 1-3g of polyphenyl ether (PPO), 5-8g of polyether modified polyoxy silane and 3-5g of water-based organic silicon resin, and stirring the mixed solution at the speed of 150r/min through a mixing mechanism while discharging to obtain a first part of solution;
s3: adding 10-15g/L of brightening agent, 2-4g/L of complexing agent, 150-200ml/L of sulfuric acid and 14-18g of mercaptophenyl tetrazole into part of water, mixing, and heating for dissolving to obtain a second solution;
s4: and adding the first solution into the second solution, and stirring for 10 minutes to obtain the non-phosphate polishing additive.
(III) beneficial effects
Compared with the prior art, the invention provides the non-phosphating polishing additive and the production process thereof, and has the following beneficial effects:
1. according to the non-phosphate polishing additive and the production process thereof, the waste water after the phosphate polishing processing is easy to treat because of no phosphorus, and the added surfactant can enable the additive to be fully contacted with the surface of a workpiece, so that the uniformity and smoothness of the surface treatment of the workpiece are improved.
2. The polishing solution of the additive can emit light in a short time, so that the condition that flow marks, surface patterns and material lines are exposed due to overlong polishing time can be avoided, and the product quality can be obviously improved.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Embodiment one: the non-phosphate polishing additive comprises the following raw materials in parts by weight: the brightening agent comprises 10g/L of brightening agent, 12g/L of corrosion inhibitor, 2g/L of complexing agent, 3g/L of wetting agent, 150ml/L of sulfuric acid, 14g of mercaptophenyl tetrazole, 350g of sodium hydroxide, 40g of sodium silicate, 3g of sodium polyacrylate, 600g of water, 6g of glycerin, 10g of oleic acid, 1g of polyphenyl ether (PPO), 5g of polyether modified polyoxysilane and 3g of water-based organic silicon resin.
The corrosion inhibitor is at least three of sodium polyphosphate, sodium tungstate, sodium molybdate and nitrogenous organic matters.
The brightening agent is a mixture of copper sulfate, nickel sulfate and zirconium sulfate.
S1, charging, namely weighing 350g of sodium hydroxide, 40g of sodium silicate, 3g of sodium polyacrylate, 12g/L of corrosion inhibitor, 3g/L of wetting agent and 600g of water, and putting into a stirring barrel for mixing;
s2, after mixing, introducing the mixture into a mixing tank, injecting water at the speed of 50g/min, sequentially introducing 6g of glycerin, 10g of oleic acid, 1g of polyphenylene oxide (PPO), 5g of polyether modified polyoxy silane and 3g of aqueous organic silicon resin, and stirring the mixed solution at the speed of 150r/min through a mixing mechanism while discharging to obtain a first solution;
s3: adding 10g/L of brightening agent, 2g/L of complexing agent, 150ml/L of sulfuric acid and 14g of mercaptophenyl tetrazole into part of water, mixing, and heating for dissolving to obtain a second solution;
s4: and adding the first solution into the second solution, and stirring for 10 minutes to obtain the non-phosphate polishing additive.
Embodiment two: the non-phosphate polishing additive comprises the following raw materials in parts by weight: 13g/L of brightening agent, 14g/L of corrosion inhibitor, 3g/L of complexing agent, 5g/L of wetting agent, 170ml/L of sulfuric acid, 17g of mercaptophenyl tetrazole, 380g of sodium hydroxide, 50g of sodium silicate, 4g of sodium polyacrylate, 650g of water, 8g of glycerol, 13g of oleic acid, 2g of polyphenyl ether (PPO), 6.5g of polyether modified polyoxysilane and 4g of water-based organic silicon resin.
The corrosion inhibitor is at least three of sodium polyphosphate, sodium tungstate, sodium molybdate and nitrogenous organic matters.
The brightening agent is a mixture of copper sulfate, nickel sulfate and zirconium sulfate.
S1, charging, namely weighing 380g of sodium hydroxide, 50g of sodium silicate, 4g of sodium polyacrylate, 14g/L of corrosion inhibitor, 5/L of wetting agent and 650g of water, and putting into a stirring barrel for mixing;
s2, after mixing, introducing the mixture into a mixing tank, injecting water at the speed of 50g/min, and sequentially introducing 8g of glycerin, 13g of oleic acid, 2g of polyphenylene oxide (PPO), 6.5g of polyether modified polyoxy silane and 4g of aqueous organic silicon resin, and stirring the mixed solution at the speed of 150r/min through a mixing mechanism while discharging to obtain a first part of solution;
s3: adding 13g/L of brightening agent, 3/L of complexing agent, 170ml/L of sulfuric acid and 17g of mercaptophenyl tetrazole into part of water, mixing, and heating for dissolving to obtain a second solution;
s4: and adding the first solution into the second solution, and stirring for 10 minutes to obtain the non-phosphate polishing additive.
Embodiment III: the non-phosphate polishing additive comprises the following raw materials in parts by weight: the brightening agent comprises 15g/L of brightening agent, 15g/L of corrosion inhibitor, 4g/L of complexing agent, 7g/L of wetting agent, 200ml/L of sulfuric acid, 18g of mercaptophenyl tetrazole, 400g of sodium hydroxide, 60g of sodium silicate, 3-5g of sodium polyacrylate, 700g of water, 10g of glycerol, 15g of oleic acid, 3g of polyphenyl ether (PPO), 8g of polyether modified polyoxysilane and 5g of water-based organic silicon resin.
The corrosion inhibitor is at least three of sodium polyphosphate, sodium tungstate, sodium molybdate and nitrogenous organic matters.
The brightening agent is a mixture of copper sulfate, nickel sulfate and zirconium sulfate.
S1, charging, namely weighing 400g of sodium hydroxide, 60g of sodium silicate, 5g of sodium polyacrylate, 15g/L of corrosion inhibitor, 7g/L of wetting agent and 700g of water, and mixing in a stirring barrel;
s2, after mixing, introducing the mixture into a mixing tank, injecting water at the speed of 50g/min, sequentially introducing 10g of glycerin, 15g of oleic acid, 3g of polyphenylene oxide (PPO), 8g of polyether modified polyoxy silane and 5g of aqueous organic silicon resin, and stirring the mixed solution at the speed of 150r/min through a mixing mechanism while discharging to obtain a first solution;
s3: adding a brightening agent with the content of 15g/L, a complexing agent with the content of 4g/L, sulfuric acid with the content of 200ml/L and mercaptophenyl tetrazole with the content of 18g into part of water, mixing, and heating for dissolving to obtain a second solution;
s4: and adding the first solution into the second solution, and stirring for 10 minutes to obtain the non-phosphate polishing additive.
Experimental example:
| comparative example | Sand-forming | Flow mark | Brightness of light | Flour flower | Smooth and glossy |
| Example 1 | Without any means for | Without any means for | Clear and bright | Without any means for | High height |
| Example 2 | Without any means for | Without any means for | Clear and bright | Without any means for | High height |
| Example 3 | Without any means for | Without any means for | Bai Liang | Without any means for | High height |
Judgment standard: according to the display results, the non-phosphating polishing additive has higher effect.
The beneficial effects of the invention are as follows: the wastewater after chemical polishing processing is easy to treat due to the fact that the wastewater does not contain phosphorus, the negative influence on the environment is effectively reduced, and meanwhile, the added surfactant can enable the additive to fully contact with the surface of a workpiece, so that the uniformity and smoothness of the surface treatment of the workpiece are improved.
The polishing solution of the additive can emit light in a short time, so that the condition that flow marks, surface patterns and material lines are exposed due to overlong polishing time can be avoided, and the product quality can be remarkably improved.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The non-phosphate polishing additive is characterized by comprising the following raw materials in parts by weight: 10-15g/L of brightening agent, 12-15g/L of corrosion inhibitor, 2-4g/L of complexing agent, 3-7g/L of wetting agent, 150-200ml/L of sulfuric acid, 14-18g of mercaptophenyl tetrazole, 350-400g of sodium hydroxide, 40-60g of sodium silicate, 3-5g of sodium polyacrylate, 600-700g of water, 6-10g of glycerin, 10-15g of oleic acid, 1-3g of polyphenyl ether (PPO), 5-8g of polyether modified polyoxysilane and 3-5g of water-based organic silicon resin.
2. The non-phosphating polishing additive of claim 1, wherein the corrosion inhibitor is at least three of sodium polyphosphate, sodium tungstate, sodium molybdate, and nitrogen-containing organic matter.
3. A non-phosphating additive according to claim 1, wherein the brightening agent is a mixture of copper sulfate, nickel sulfate and zirconium sulfate.
4. The non-phosphate polishing additive according to claim 1, which is characterized by comprising the following raw materials in parts by weight: the brightening agent comprises 10g/L of brightening agent, 12g/L of corrosion inhibitor, 2g/L of complexing agent, 3g/L of wetting agent, 150ml/L of sulfuric acid, 14g of mercaptophenyl tetrazole, 350g of sodium hydroxide, 40g of sodium silicate, 3g of sodium polyacrylate, 600g of water, 6g of glycerin, 10g of oleic acid, 1g of polyphenyl ether (PPO), 5g of polyether modified polyoxysilane and 3g of water-based organic silicon resin.
5. The non-phosphate polishing additive according to claim 1, which is characterized by comprising the following raw materials in parts by weight: 13g/L of brightening agent, 14g/L of corrosion inhibitor, 3g/L of complexing agent, 5g/L of wetting agent, 170ml/L of sulfuric acid, 17g of mercaptophenyl tetrazole, 380g of sodium hydroxide, 50g of sodium silicate, 4g of sodium polyacrylate, 650g of water, 8g of glycerol, 13g of oleic acid, 2g of polyphenyl ether (PPO), 6.5g of polyether modified polyoxysilane and 4g of water-based organic silicon resin.
6. The non-phosphate polishing additive according to claim 1, which is characterized by comprising the following raw materials in parts by weight: the brightening agent comprises 15g/L of brightening agent, 15g/L of corrosion inhibitor, 4g/L of complexing agent, 7g/L of wetting agent, 200ml/L of sulfuric acid, 18g of mercaptophenyl tetrazole, 400g of sodium hydroxide, 60g of sodium silicate, 3-5g of sodium polyacrylate, 700g of water, 10g of glycerol, 15g of oleic acid, 3g of polyphenyl ether (PPO), 8g of polyether modified polyoxysilane and 5g of water-based organic silicon resin.
7. The production process of the non-phosphate polishing additive is characterized by comprising the following steps of:
s1, charging, namely weighing 350-400g of sodium hydroxide, 40-60g of sodium silicate, 3-5g of sodium polyacrylate, 12-15g/L of corrosion inhibitor, 3-7g/L of wetting agent and 600-700g of water, and mixing in a stirring barrel;
s2, after mixing, introducing the mixture into a mixing tank, injecting water at the speed of 50g/min, sequentially introducing 6-10g of glycerin, 10-15g of oleic acid, 1-3g of polyphenyl ether (PPO), 5-8g of polyether modified polyoxy silane and 3-5g of water-based organic silicon resin, and stirring the mixed solution at the speed of 150r/min through a mixing mechanism while discharging to obtain a first part of solution;
s3: adding 10-15g/L of brightening agent, 2-4g/L of complexing agent, 150-200ml/L of sulfuric acid and 14-18g of mercaptophenyl tetrazole into part of water, mixing, and heating for dissolving to obtain a second solution;
s4: and adding the first solution into the second solution, and stirring for 10 minutes to obtain the non-phosphate polishing additive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310076043.7A CN116288360A (en) | 2023-02-07 | 2023-02-07 | Non-phosphating polishing additive and production process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310076043.7A CN116288360A (en) | 2023-02-07 | 2023-02-07 | Non-phosphating polishing additive and production process thereof |
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| Publication Number | Publication Date |
|---|---|
| CN116288360A true CN116288360A (en) | 2023-06-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310076043.7A Pending CN116288360A (en) | 2023-02-07 | 2023-02-07 | Non-phosphating polishing additive and production process thereof |
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| Country | Link |
|---|---|
| CN (1) | CN116288360A (en) |
-
2023
- 2023-02-07 CN CN202310076043.7A patent/CN116288360A/en active Pending
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