CN116285774A - Epoxy adhesive, cover film and printing screen - Google Patents
Epoxy adhesive, cover film and printing screen Download PDFInfo
- Publication number
- CN116285774A CN116285774A CN202310227159.6A CN202310227159A CN116285774A CN 116285774 A CN116285774 A CN 116285774A CN 202310227159 A CN202310227159 A CN 202310227159A CN 116285774 A CN116285774 A CN 116285774A
- Authority
- CN
- China
- Prior art keywords
- resin
- epoxy
- film
- cover film
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013039 cover film Substances 0.000 title claims abstract description 50
- 229920006332 epoxy adhesive Polymers 0.000 title claims abstract description 35
- 229920005989 resin Polymers 0.000 claims abstract description 50
- 239000011347 resin Substances 0.000 claims abstract description 50
- 239000003822 epoxy resin Substances 0.000 claims abstract description 47
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 47
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 24
- 239000002904 solvent Substances 0.000 claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 claims abstract description 6
- 229920001721 polyimide Polymers 0.000 claims description 59
- 239000010408 film Substances 0.000 claims description 32
- 239000010410 layer Substances 0.000 claims description 19
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 16
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 16
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 16
- 239000004593 Epoxy Substances 0.000 claims description 15
- 238000001035 drying Methods 0.000 claims description 15
- 229920000459 Nitrile rubber Polymers 0.000 claims description 13
- 238000007731 hot pressing Methods 0.000 claims description 12
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- 238000003851 corona treatment Methods 0.000 claims description 10
- -1 alkyl phenolic resin Chemical compound 0.000 claims description 8
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical group NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 7
- 150000001412 amines Chemical class 0.000 claims description 6
- 150000008064 anhydrides Chemical class 0.000 claims description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 229920001568 phenolic resin Polymers 0.000 claims description 5
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- UNKQPEQSAGXBEV-UHFFFAOYSA-N formaldehyde;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound O=C.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 UNKQPEQSAGXBEV-UHFFFAOYSA-N 0.000 claims description 3
- 239000003208 petroleum Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 150000003505 terpenes Chemical class 0.000 claims description 3
- 235000007586 terpenes Nutrition 0.000 claims description 3
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical group C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 claims description 2
- KPAPHODVWOVUJL-UHFFFAOYSA-N 1-benzofuran;1h-indene Chemical compound C1=CC=C2CC=CC2=C1.C1=CC=C2OC=CC2=C1 KPAPHODVWOVUJL-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- QCBSYPYHCJMQGB-UHFFFAOYSA-N 2-ethyl-1,3,5-triazine Chemical compound CCC1=NC=NC=N1 QCBSYPYHCJMQGB-UHFFFAOYSA-N 0.000 claims description 2
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 claims description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical group CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 2
- 229910015900 BF3 Inorganic materials 0.000 claims description 2
- 239000004305 biphenyl Substances 0.000 claims description 2
- 235000010290 biphenyl Nutrition 0.000 claims description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Substances FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004202 carbamide Substances 0.000 claims description 2
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 claims description 2
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims description 2
- 150000003672 ureas Chemical class 0.000 claims description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 10
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 239000003292 glue Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 239000004642 Polyimide Substances 0.000 description 49
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 16
- 229910000831 Steel Inorganic materials 0.000 description 10
- 239000010959 steel Substances 0.000 description 10
- 238000013329 compounding Methods 0.000 description 8
- 238000005096 rolling process Methods 0.000 description 8
- 238000012545 processing Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 238000004090 dissolution Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229920000800 acrylic rubber Polymers 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920006287 phenoxy resin Polymers 0.000 description 2
- 239000013034 phenoxy resin Substances 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- JMXKSZRRTHPKDL-UHFFFAOYSA-N titanium ethoxide Chemical compound [Ti+4].CC[O-].CC[O-].CC[O-].CC[O-] JMXKSZRRTHPKDL-UHFFFAOYSA-N 0.000 description 2
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 206010059866 Drug resistance Diseases 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000009759 San-Chi Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/14—Forme preparation for stencil-printing or silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/34—Screens, Frames; Holders therefor
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
- C09J109/02—Copolymers with acrylonitrile
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
- C09J193/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2409/00—Presence of diene rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
Abstract
The invention relates to an epoxy adhesive, a cover film and a printing screen. The epoxy adhesive consists of epoxy resin, film-forming resin, tackifying resin, curing agent, curing accelerator and solvent, wherein the total mass of the epoxy resin, the film-forming resin, the tackifying resin, the curing agent and the curing accelerator is 1-1.2 times of the mass of the solvent. The invention improves the adhesive formula and the cover film, so that the cover film can be molded at low temperature, and the cover film has good bonding performance with the screen plate body, is not easy to overflow glue and delaminate, and has good chemical resistance. The printing screen plate has long service life, saves material cost, saves the replacement working hours of a production line and improves the use efficiency.
Description
The invention relates to a divisional application of an epoxy adhesive, a cover film and a printing screen, wherein the application date is 12/30 of 2020, the application number is 2020116166892.
Technical Field
The invention relates to an epoxy adhesive, a cover film and a printing screen.
Background
The photosensitive ink adopted by the traditional printing screen is coated on a steel screen, and then a desired line is obtained by a mode of film exposure and liquid medicine development and washing. The traditional method has large chemical pollution, the service life period of the obtained printing screen is not long enough, the screen plate needs to be frequently replaced in the production line using the screen plate, the production efficiency is affected, and the printing ink, silver paste and the like in the production line are wasted.
Disclosure of Invention
The invention aims to provide an epoxy adhesive, a cover film and a printing screen, which can prolong the service life of the printing screen.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the invention provides an epoxy adhesive, which comprises the following components in percentage by mass:
in the invention, the weight proportion of the epoxy resin is 20-60 percent; below 20% the system is not sufficiently resistant; above 60% the adhesive layer is too hard and affects the adhesion properties. The weight proportion of the film-forming resin is selected to be 20-40%, the shrinkage cavity phenomenon of the coating can be brought about when the weight proportion is less than 20%, and when the weight proportion is more than 40%, the viscosity of the adhesive is too high, so that the coating is not easy, and the bonding strength is affected.
Preferably, the epoxy adhesive comprises the following components in mass percent:
further preferably, the epoxy adhesive comprises the following components in mass percent:
preferably, the epoxy resin is bisphenol A epoxy, bisphenol F epoxy, phenolic epoxy, biphenyl epoxy, phenol epoxy, and one or more of rubber modified, polyurethane modified and acrylic modified epoxy resin.
Further preferably, the epoxy resin is preferably a mixture of one or more of double a-type epoxy, phenolic epoxy, rubber modified epoxy, polyurethane modified epoxy.
Further preferably, the epoxy resin is a combination of two epoxy resins, such as a mixture of any two of epoxy resin 128E, epoxy resin N740S, epoxy resin NPPN-272H, epoxy resin NPES 901; further preferably, the mass ratio of the two epoxy resins is 1:1-2.
According to a preferred embodiment, the epoxy resin is a combination of epoxy resin 128E and epoxy resin N740S in a mass ratio of 1 to 3.
According to another preferred embodiment, the epoxy resin is a combination of an epoxy resin NPPN-272H and an epoxy resin NPES901 in a mass ratio of 1-3.
Preferably, the film-forming resin is one or a combination of a plurality of nitrile rubber, acrylic rubber and phenoxy resin.
Preferably, the weight average molecular weight Mw of the film-forming resin is more than or equal to 30000.
According to one toolIn a preferred embodiment, the nitrile rubber is 1072CG of Taiwan Nandi chemical industry, XER-32, EXR-91 of JSR in Japan, X-740 of Lanxess in Germany; acrylic rubber such as DuPont
G，/>
GXF，
Ultra HT; phenoxy resins such as YP50, YP50S, YP, ZX-1356-2, mitsubishi chemical 1256, 4250, 4275 of Nippon iron.
Preferably, the tackifying resin is one or a combination of two or more of rosin resin, rosin derivative, terpene resin, petroleum resin, dicyclopentadiene (DCPD) resin, coumarone-indene resin and alkyl phenolic resin. Wherein rosin and its derivative resin such as GA-85, GA90, GA100, GA115 of Japanese Qichuan chemical, rosin terpene resin T803, T901, T805, T85, hydrogenated rosin GA-85H, GH100, petroleum resin such as FTR6100, FTR8100 of Japanese Sanchi chemical, etc., alkyl phenol resin has phenol ortho-position (or ortho) alkyl phenol resin containing tert-butyl, octyl 1 nonyl, phenyl and cyclohexyl.
Preferably, the curing agent is at least one or a combination of two or more of phenolic curing agents, organic amine curing agents and anhydride curing agents. Wherein, phenolic curing agents such as linear phenol formaldehyde resin, linear bisphenol A formaldehyde resin, linear o-cresol formaldehyde resin curing agent, organic amine such as Dicyandiamide (DICY), 4-diamino diphenyl sulfone (4, 4-DDS), diamino Diphenyl Methane (DDM), anhydride curing agents such as methyl nadic anhydride MNA-a, polyazelaic anhydride; among them, preferred is a mixture of one or more of DICY, 4-DDS, linear phenol formaldehyde resin, linear bisphenol A formaldehyde resin.
Preferably, the curing accelerator is at least one or a combination of more than two of amine accelerators, substituted urea accelerators, imidazole and salt accelerators thereof, boron trifluoride amine complexes, phenol accelerators, metal organic salt accelerators and phosphine accelerators.
Further preferably, the curing accelerator is 2-ethyl-4-methylimidazole (2E 4 MZ), 1-cyanoethyl-2-ethyl-4-methylimidazole 2E4MZ-CN, 2, 4-diamino-6[2 ' -ethyl-4 ' -methylimidazole- (1 ') ] ethyl-S-triazine 2E4MZ-A, 2-methylimidazole-triisocyanate 2MZ-OK or the like, more preferably 2E4MZ-CN.
Preferably, the epoxy adhesive further comprises a solvent, and the total mass of the epoxy resin, the film-forming resin, the tackifying resin, the curing agent and the curing accelerator is 1 to 1.2 times of the mass of the solvent.
The second aspect of the invention provides a cover film comprising a Polyimide (PI) film layer, and a bonding layer formed on the polyimide film layer, wherein the bonding layer is formed by the epoxy adhesive.
Preferably, the thickness of the polyimide film layer is 5-25 mu m; the thickness of the bonding layer is 3-20 mu m. If the bonding layer is too thin, the bonding effect of the bonding layer is affected, and if the bonding layer is too thick, glue overflow is generated to the other side of the printing screen plate, so that the laser processing is affected; if the thickness of the polyimide film layer is too thick, laser processing efficiency can be affected, larger laser energy and longer processing time are needed, the laser energy is too high, the screen plate can be penetrated by too long processing time, and the rejection rate is increased.
In a third aspect of the present invention, a method for preparing the cover film is provided, wherein a polyimide film is subjected to corona treatment, and then the epoxy adhesive is coated on the corona surface of the polyimide film, and the cover film is prepared by drying and curing.
Preferably, the drying temperature is 70-130 ℃ and the drying time is 1-10 min; the curing temperature is 40-50 ℃ and the curing time is 20-30 h.
A fourth aspect of the present invention provides a printing screen, comprising a screen body, and a cover film disposed on the screen body, wherein a bonding layer of the cover film contacts with the screen body; the covering film is provided with a hollowed-out part for forming a required circuit.
The screen body in the invention is a printing steel screen in the prior art.
The fifth aspect of the present invention provides a method for preparing a printing screen, wherein the adhesive layer of the cover film is attached to one surface of the screen body, and then the printing screen is prepared by hot-pressing at 80-120 ℃ and 0.5-1 MPa for 30-60 min, and then performing hollow-out treatment on the cover film in a laser manner.
According to the invention, through laser processing, finer hollows can be obtained, and during printing, silver paste is transferred and attached to a product through the hollows, so that a finer line drawing can be obtained, and the material cost can be saved.
By adopting the technical scheme, compared with the prior art, the invention has the following advantages:
the adhesive formula and the cover film are improved, so that the cover film can be subjected to low-temperature hot-pressing, and the cover film has good bonding performance with the screen plate body, is not easy to overflow and delaminate, and has good chemical resistance.
The printing screen plate has long service life, saves material cost, saves the replacement working hours of a production line and improves the use efficiency.
Drawings
FIG. 1 is a schematic diagram of a structure in which a cover film is attached to a screen body;
fig. 2 is a schematic diagram of a laser processing of a cover film.
Detailed Description
The technical scheme of the present invention will be further described with reference to specific embodiments, but the present invention is not limited to the following examples. The implementation conditions employed in the examples may be further adjusted according to specific requirements, and the implementation conditions not specified are generally those in routine experiments.
The raw materials and reagents used in the present invention are all commercially available.
Example 1
128E/20 parts of epoxy resin, NPPN-272H/30 parts of rosin resin: GA90A/10 parts, nitrile rubber 1072CG/40 parts, 4-DDS/15 parts, 2E4MZ-CN/0.5 parts, and butanone solvent/100 parts were used for dissolution or dispersion to prepare an epoxy adhesive.
And (3) carrying out corona treatment on the PI film in advance, coating an epoxy adhesive on the corona surface of the PI film, drying a solvent at 80 ℃/5mins, compounding release paper, rolling and placing in an oven for curing at 45 ℃/24H to prepare the PI cover film.
And after tearing off the release paper, the PI cover film is attached to one surface of the steel mesh, and then hot pressing is carried out in a hot press under the condition of 120 ℃/60 mins/0.5-1.0 Mpa. And (3) carrying out local hollowed-out treatment on the PI covering film on the screen plate by using a laser mode to obtain the desired circuit.
Example 2
128E/30 parts of epoxy resin, NPPN-272H/30 parts of rosin resin: 100/10 parts of GA, 1072CG/30 parts of nitrile rubber, 4-DDS/18 parts, 2E4MZ-CN/0.5 part, and 100 parts of butanone solvent are used for dissolution or dispersion to prepare the epoxy adhesive.
And (3) carrying out corona treatment on the PI film in advance, coating an epoxy adhesive on the corona surface of the PI film, drying a solvent at 80 ℃/5mins, compounding release paper, rolling and placing in an oven for curing at 45 ℃/24H to prepare the PI cover film.
And after tearing off the release paper, the PI cover film is attached to one surface of the steel mesh, and then hot pressing is carried out in a hot press under the condition of 120 ℃/60 mins/0.5-1.0 Mpa. And (3) carrying out local hollowed-out treatment on the PI covering film on the screen plate by using a laser mode to obtain the desired circuit.
Example 3
128E/30 parts of epoxy resin, NPPN-272H/30 parts of rosin resin: 100/10 parts of GA, 1072CG/40 parts of nitrile rubber, 6 parts of DICY, and 0.5 part of 2E4 MZ-CN/100 parts of butanone solvent are used for dissolution or dispersion, and an epoxy adhesive is prepared.
And (3) carrying out corona treatment on the PI film in advance, coating an epoxy adhesive on the corona surface of the PI film, drying a solvent at 80 ℃/5mins, compounding release paper, rolling and placing in an oven for curing at 45 ℃/24H to prepare the PI cover film.
And after tearing off the release paper, the PI cover film is attached to one surface of the steel mesh, and then hot pressing is carried out in a hot press under the condition of 120 ℃/60 mins/0.5-1.0 Mpa. And (3) carrying out local hollowed-out treatment on the PI covering film on the screen plate by using a laser mode to obtain the desired circuit.
Example 4
Epoxy resin N740S/20 parts, epoxy resin NPPN-272H/40 parts, nitrile rubber 1072CG/30 parts, rosin resin: GB120/10 parts, 4-DDS 16 parts, 2E4MZ-CN 0.5 parts, and butanone solvent 100 parts.
And (3) carrying out corona treatment on the PI film in advance, coating an epoxy adhesive on the corona surface of the PI film, drying a solvent at 80 ℃/5mins, compounding release paper, rolling and placing in an oven for curing at 45 ℃/24H to prepare the PI cover film.
And after tearing off the release paper, the PI cover film is attached to one surface of the steel mesh, and then hot pressing is carried out in a hot press under the condition of 120 ℃/60 mins/0.5-1.0 Mpa. And (3) carrying out local hollowed-out treatment on the PI covering film on the screen plate by using a laser mode to obtain the desired circuit.
Example 5
Epoxy resin N740S/20 parts, epoxy resin NPES901/40 parts, nitrile rubber 1072CG/30 parts, rosin resin: GB120/10 parts, 4-DDS/2 parts, DICY/4 parts, 2E4MZ-CN/0.5 parts, and butanone solvent/100 parts were used for dissolution or dispersion to prepare an epoxy adhesive.
And (3) carrying out corona treatment on the PI film in advance, coating an epoxy adhesive on the corona surface of the PI film, drying a solvent at 80 ℃/5mins, compounding release paper, rolling and placing in an oven for curing at 45 ℃/24H to prepare the PI cover film.
And after tearing off the release paper, the PI cover film is attached to one surface of the steel mesh, and then hot pressing is carried out in a hot press under the condition of 120 ℃/60 mins/0.5-1.0 Mpa. And (3) carrying out local hollowed-out treatment on the PI covering film on the screen plate by using a laser mode to obtain the desired circuit.
Comparative example 1
128E/20 parts of epoxy resin, NPPN-272H/10 parts of epoxy resin, 1072CG/60 parts of nitrile rubber, rosin resin: GB120/10 parts, 4-DDS 9 parts, 2E4MZ-CN 0.5 parts, and butanone solvent 100 parts.
And (3) carrying out corona treatment on the PI film in advance, coating an epoxy adhesive on the corona surface of the PI film, drying a solvent at 80 ℃/5mins, compounding release paper, rolling and placing in an oven for curing at 45 ℃/24H to prepare the PI cover film.
And after tearing off the release paper, the PI cover film is attached to one surface of the steel mesh, and then hot pressing is carried out in a hot press under the condition of 120 ℃/60 mins/0.5-1.0 Mpa. And (3) carrying out local hollowed-out treatment on the PI covering film on the screen plate by using a laser mode to obtain the desired circuit.
Comparative example 2
128E/30 parts of epoxy resin, NPPN-272H/55 parts of epoxy resin, 1072CG/10 parts of nitrile rubber, rosin resin: GB120/5 parts, 4-DDS 24 parts, 2E4MZ-CN 0.5 parts, and butanone solvent 100 parts.
And (3) carrying out corona treatment on the PI film in advance, coating an epoxy adhesive on the corona surface of the PI film, drying a solvent at 80 ℃/5mins, compounding release paper, rolling and placing in an oven for curing at 45 ℃/24H to prepare the PI cover film.
And after tearing off the release paper, the PI cover film is attached to one surface of the steel mesh, and then hot pressing is carried out in a hot press under the condition of 120 ℃/60 mins/0.5-1.0 Mpa. And (3) carrying out local hollowed-out treatment on the PI covering film on the screen plate by using a laser mode to obtain the desired circuit.
Comparative example 3
128E/20 parts of epoxy resin, NPPN-272H/40 parts of epoxy resin, 1072CG/30 parts of nitrile rubber, rosin resin: GB120/10 parts, 4-DDS 15 parts, butanone solvent 100 parts, and dissolving or dispersing to obtain epoxy adhesive.
And (3) carrying out corona treatment on the PI film in advance, coating an epoxy adhesive on the corona surface of the PI film, drying a solvent at 80 ℃/5mins, compounding release paper, rolling and placing in an oven for curing at 45 ℃/24H to prepare the PI cover film.
And after tearing off the release paper, the PI cover film is attached to one surface of the steel mesh, and then hot pressing is carried out in a hot press under the condition of 120 ℃/60 mins/0.5-1.0 Mpa. And (3) carrying out local hollowed-out treatment on the PI covering film on the screen plate by using a laser mode to obtain the desired circuit.
The sources of the raw materials are as follows:
epoxy resin 128E, south Asia of Taiwan China
Epoxy resin N740S, nantong star chemical industry
Epoxy resin NPPN-272, south Asia of Taiwan China
Epoxy resin NPES901, taiwan south Asia nitrile rubber 1072CG, taiwan south Di Chemie
4,4-DDS, indian Africa diagram
DICY Ningxia Jiafeng chemical industry
2E4MZ-CN, japanese four-national chemistry
Rosin resins GA90A, GA100 and GB120 are chemical products of Japanese waste Sichuan
Experimental data for the above examples and comparative examples are as follows:
comprehensive evaluation
"O" represents that the performance was satisfactory, "verygood" represents that the performance was excellent, "DELTA" represents that the performance was general, and "×" represents that the performance was poor.
The evaluation method comprises the following steps:
adhesive strength: after the PI cover film and the screen plate were hot-pressed, they were cut into 1cm×20cm, the PI film at the end in the longitudinal direction was pulled out, peeled off at 180℃and peeled off at a speed of 100 mm/min.
Touch dry: after the hot pressing is finished, the PI cover film touches the adhesive surface with fingers, the adhesive surface is not touched with the viscosity of OK, and the adhesive surface is touched with the viscosity of NG.
Glue overflow amount: and 5 holes are punched on the PI cover film by using a puncher with the diameter of 10mm, hot-pressed with a screen plate according to the conditions of 120 ℃/60mins/0.5Mpa, and the flow glue amount overflowed from the round holes is measured by using an electron microscope.
Drug resistance: soaking the screen plate cut by laser in the slurry for 24H, then wiping, observing whether the liquid medicine of the slurry is permeated between PI and an adhesive layer on a cover film or between the adhesive layer and the screen plate through a microscope, wherein floating or layering phenomenon occurs, if the phenomenon occurs, NG occurs, and if the phenomenon does not occur, OK occurs;
(paste composition: silver powder/80%, bisphenol A epoxy/10%, acid anhydride curing agent 2%, methylimidazole/0.5%, butyl acetate/5%, reactive diluent 692/1.5%, tetraethyl titanate/0.5%, polyamide wax/0.5%).
Dimensional stability: after PI cover films 200mm x 200mm and a screen plate are hot pressed, ABCD is selected at 4 angles of PI films, 4 points are measured, and punctiform marks are made by using an oil pen. The pitch AB ', BC', CD ', DA' before AB, BC, CD, DA points were tested using a two-dimensional test, and the pitch between these 4 points was measured by scraping 10000 times using a printing squeegee. Shrinkage 1= [ (AB '-AB)/ab+ (CD' -CD)/CD ]/2 was calculated, shrinkage 2= [ (BC '-BC)/bc+ (DA' -DA)/DA ]/2 was calculated, and the maximum value of shrinkage 1 and 2 was recorded as the value of dimensional stability.
The present invention has been described in detail in order to make those skilled in the art understand the present invention and implement it, but the present invention is not limited to the above embodiments, and all equivalent changes or modifications according to the spirit of the present invention should be included in the scope of the present invention.
Claims (12)
1. An epoxy adhesive, characterized in that: the epoxy adhesive consists of epoxy resin, film-forming resin, tackifying resin, curing agent, curing accelerator and solvent, wherein the total mass of the epoxy resin, the film-forming resin, the tackifying resin, the curing agent and the curing accelerator is 1 to 1.2 times of the mass of the solvent,
the epoxy resin is bisphenol A epoxy, bisphenol F epoxy, phenolic epoxy, biphenyl epoxy, phenol epoxy, and one or more of rubber modified matters, polyurethane modified matters and acrylic acid modified matters of the epoxy resin;
the film-forming resin is nitrile rubber;
the tackifying resin is one or a combination of two or more of rosin resin, rosin derivative, terpene resin, petroleum resin, dicyclopentadiene resin, coumarone-indene resin and alkyl phenolic resin;
the curing agent is at least one or a combination of more than two of phenolic curing agents, organic amine curing agents and anhydride curing agents;
the curing accelerator is at least one or a combination of two or more of amine accelerators, substituted urea accelerators, imidazole and salt accelerators thereof, boron trifluoride amine complexes, phenol accelerators, metal organic salt accelerators and phosphine accelerators.
2. An epoxy adhesive according to claim 1, wherein: based on the total mass of the epoxy resin, the film-forming resin, the tackifying resin, the curing agent and the curing accelerator as a percentage,
3. an epoxy adhesive according to claim 2, wherein: based on the total mass of the epoxy resin, the film-forming resin, the tackifying resin, the curing agent and the curing accelerator as a percentage,
4. an epoxy adhesive according to claim 1, wherein: 50-60 parts of epoxy resin, 30-40 parts of film-forming resin, 10 parts of tackifying resin, 6-18 parts of curing agent, 0.5 part of curing accelerator and 100 parts of solvent.
5. An epoxy adhesive according to claim 1, wherein: the epoxy resin is a combination of two epoxy resins, and the mass ratio of the two epoxy resins is 1: (1-2); and/or the number of the groups of groups,
the weight average molecular weight Mw of the film-forming resin is more than or equal to 30000; and/or the number of the groups of groups,
the phenolic curing agent is selected from linear phenol formaldehyde resin, linear bisphenol A formaldehyde resin and linear o-cresol formaldehyde resin curing agent, the organic amine curing agent is selected from dicyandiamide, 4-diamino diphenyl sulfone and diamino diphenyl methane, and the anhydride curing agent is selected from methyl nadic anhydride MNA-a and polyazeic anhydride; and/or the number of the groups of groups,
the curing accelerator is selected from the group consisting of 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2, 4-diamino-6[2 ' -ethyl-4 ' -methylimidazole- (1 ') ] ethyl-S-triazine and 2-methylimidazole-triisocyanate.
6. A cover film, characterized by: a bonding layer comprising a polyimide film layer, formed on said polyimide film layer, said bonding layer being formed of the epoxy adhesive of any one of claims 1 to 5.
7. The cover film of claim 6, wherein: the bonding layer is formed by drying the solvent of the epoxy adhesive.
8. The cover film of claim 6, wherein: the thickness of the polyimide film layer is 5-25 mu m;
the thickness of the bonding layer is 3-20 mu m.
9. A method of producing the cover film according to any one of claims 6 to 8, characterized in that: and carrying out corona treatment on the polyimide film, coating the epoxy adhesive on the corona surface of the polyimide film, and drying and curing to obtain the covering film.
10. The method of producing a cover film according to claim 9, wherein: the drying temperature is 70-130 ℃ and the drying time is 1-10 min; the curing temperature is 40-50 ℃ and the curing time is 20-30 h.
11. A printing screen, comprising a screen body, characterized in that: the printing screen further comprising a cover film according to any one of claims 6 to 8 disposed on the screen body, the adhesive layer of the cover film being in contact with the screen body; the covering film is provided with a hollowed-out part for forming a required circuit.
12. A method of making a printing screen as claimed in claim 11, wherein: and (3) attaching the bonding layer of the cover film to one surface of the screen plate body, then hot-pressing for 30-80 min at the temperature of 100-160 ℃ and the pressure of 0.5-1 MPa, and then carrying out hollowed-out treatment on the cover film in a laser mode to obtain the printing screen plate.
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| CN114395346A (en) * | 2021-12-21 | 2022-04-26 | 苏州赛伍应用技术股份有限公司 | Adhesive, polyimide adhesive film, polyimide heating film and preparation method thereof |
| CN114479732A (en) * | 2021-12-28 | 2022-05-13 | 苏州赛伍应用技术股份有限公司 | Epoxy adhesive, polyimide cover film and printing screen |
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| JP4212786B2 (en) * | 2000-07-03 | 2009-01-21 | 信越化学工業株式会社 | Adhesive composition, flexible printed wiring board and coverlay film |
| KR20090078051A (en) * | 2008-01-14 | 2009-07-17 | 도레이새한 주식회사 | Adhesive composition for halogen-free coverlay film and coverlay film using the same |
| CN102143645B (en) * | 2010-01-28 | 2013-05-15 | 昆山雅森电子材料科技有限公司 | Cover layer and printed circuit board with same |
| CN107619643A (en) * | 2017-10-13 | 2018-01-23 | 苏州赛伍应用技术股份有限公司 | Photovoltaic module busbar insulating tape, busbar and photovoltaic module comprising the insulating tape |
| CN108003812B (en) * | 2017-12-14 | 2020-11-03 | 中国科学院深圳先进技术研究院 | Reaction type heat-conducting insulating double-sided adhesive tape and preparation method thereof |
| CN109651988A (en) * | 2018-12-21 | 2019-04-19 | 苏州赛伍应用技术股份有限公司 | A kind of adhesive and the insulation reinforcement adhesive tape comprising it |
| CN111073571B (en) * | 2019-12-30 | 2022-07-12 | 苏州赛伍应用技术股份有限公司 | Adhesive, packaging tape containing adhesive and application of packaging tape |
| CN111918482A (en) * | 2020-06-05 | 2020-11-10 | 江西一诺新材料有限公司 | Manufacturing method of FPC (flexible printed circuit) micropores |
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