CN116261316A - IGBT packaging structure with temperature measurement function - Google Patents
IGBT packaging structure with temperature measurement function Download PDFInfo
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- CN116261316A CN116261316A CN202310546879.9A CN202310546879A CN116261316A CN 116261316 A CN116261316 A CN 116261316A CN 202310546879 A CN202310546879 A CN 202310546879A CN 116261316 A CN116261316 A CN 116261316A
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- igbt
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 26
- 238000009529 body temperature measurement Methods 0.000 title claims description 23
- 230000007246 mechanism Effects 0.000 claims abstract description 63
- 238000007789 sealing Methods 0.000 claims abstract description 26
- 239000000428 dust Substances 0.000 claims description 58
- 238000001816 cooling Methods 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 20
- 230000006870 function Effects 0.000 claims description 19
- 238000007599 discharging Methods 0.000 claims description 14
- 239000012535 impurity Substances 0.000 claims description 13
- 230000005855 radiation Effects 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 abstract description 2
- 238000013461 design Methods 0.000 description 7
- 238000009434 installation Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 2
- 235000017491 Bambusa tulda Nutrition 0.000 description 2
- 241001330002 Bambuseae Species 0.000 description 2
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 2
- 239000011425 bamboo Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
- B01D46/10—Particle separators, e.g. dust precipitators, using filter plates, sheets or pads having plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
- B08B15/04—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20181—Filters; Louvers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of IGBT packaging, in particular to an IGBT packaging structure with a temperature measuring function, which comprises a plastic packaging shell, a mounting box and an IGBT chip; the mounting box is arranged in the plastic package shell in a sliding manner, and the IGBT chip is arranged in the mounting box; the device also comprises a plastic package cover plate, a supporting mechanism, an adjusting mechanism, a temperature measuring mechanism and an air supplying mechanism; the plastic sealing cover plate is arranged at the opening of the plastic sealing shell; exhaust grooves are formed in two sides of the plastic package shell; supporting mechanism and adjustment mechanism set up inside plastic envelope casing and can shelter from and open the exhaust duct according to temperature variation, temperature measuring mechanism sets up inside the mounting box and monitors the temperature. The air supply mechanism can cool the plastic package shell through the air exhaust groove along with the temperature rise; monitoring the operation temperature through a temperature measuring mechanism; through the cooperation of mounting box and plastic envelope apron, the staff of being convenient for dismantles and maintains.
Description
Technical Field
The invention relates to the technical field of IGBT packaging, in particular to an IGBT packaging structure with a temperature measurement function.
Background
The IGBT and the insulated gate bipolar transistor are composite full-control voltage-driven power semiconductor devices composed of BJTs and MOS, and have the advantages of high input impedance of the MOSFET and low conduction voltage drop of the GTR. The GTR saturation voltage is reduced, the current carrying density is high, but the driving current is high; the MOSFET has small driving power, high switching speed, large conduction voltage drop and small current carrying density. The IGBT combines the advantages of the two devices, and has small driving power and reduced saturation voltage. The device is very suitable for being applied to the fields of variable current systems with the direct current voltage of 600V or above, such as alternating current motors, frequency converters, switching power supplies, lighting circuits, traction transmission and the like.
The IGBT module is widely applied in the circuit, the highest working temperature of the IGBT in the running state is 150 degrees, if the IGBT module runs at this temperature for a long time, the IGBT module will be damaged, and the common cooling modes include air cooling, circulating water cooling, and heat pipe radiator cooling; but these cooling methods are all used for cooling the outside of IGBT module, like this to the unable timely dissipation of IGBT module inside temperature to current IGBT module is difficult to dismantle and does not possess the temperature measurement function, when IBGT damages, can't be convenient maintain the change to the IGBT module.
Disclosure of Invention
Aiming at the problems existing in the prior art, the IGBT packaging structure with the temperature measuring function is provided, and through the cooperation of the supporting mechanism, the air supply mechanism and the adjusting mechanism, the air supply mechanism can cool the inside of the IGBT along with temperature change through the exhaust groove; the temperature of the running of the IGBT is monitored through a temperature measuring mechanism, so that the running state of the IGBT is known in time; through the cooperation of mounting box and plastic envelope apron, the staff of being convenient for advances to dismantle the maintenance to the IGBT.
In order to solve the problems in the prior art, the invention adopts the following technical scheme:
an IGBT packaging structure with a temperature measurement function comprises a plastic package shell, a mounting box and an IGBT chip; the mounting box is arranged in the plastic package shell in a horizontal state in a sliding manner, and IGBT chips are arranged in the mounting box in a matrix arrangement manner; the device also comprises a plastic package cover plate, a supporting mechanism, an adjusting mechanism, a temperature measuring mechanism and an air supplying mechanism; the plastic sealing cover plate is arranged on the plastic sealing shell and is used for sealing the opening of the plastic sealing shell; the top parts of two sides of the plastic package shell along the length direction are equidistantly provided with a plurality of exhaust grooves; the supporting mechanism is arranged in the plastic package shell and used for enabling the mounting box to move towards the direction of the plastic package cover plate so as to seal the exhaust groove; the adjusting mechanism is arranged in the plastic package shell and can enable the mounting box to move along the direction away from the plastic package cover plate along with the temperature rise so as to open the exhaust groove; the temperature measuring mechanism is arranged in the mounting box and is used for measuring the temperature of the IGBT chip during operation; the air supply mechanism is arranged on the plastic package cover plate and can convey air to the inside of the plastic package shell along with the opening of the air exhaust groove.
Preferably, the supporting mechanism comprises a limiting cylinder and a pushing spring; the two limiting cylinders are arranged on the inner wall of the bottom of the plastic package shell in a vertical state and symmetrically arranged relative to the center of the bottom of the plastic package shell; two sliding columns are arranged at the bottom of the mounting box and can be arranged in the corresponding limiting cylinders in a sliding manner; the pushing springs are arranged in the corresponding limiting cylinders and are positioned between the corresponding sliding columns and the inner walls of the bottoms of the limiting cylinders.
Preferably, the adjustment mechanism comprises a memory metal strip; the bottom of the mounting box is provided with two first connecting parts; the inner wall of the bottom of the plastic package shell is provided with two second connecting parts corresponding to the first connecting parts; the memory metal strips are in a spiral shape, and two ends of the memory metal strips are respectively arranged on the corresponding first connecting part and the second connecting part.
Preferably, the air supply mechanism comprises a cooling fan and an energizing assembly; a through hole is arranged in the center of one side of the top of the plastic sealing cover plate; the heat radiation fan is arranged in the through hole; the power-on assembly is arranged at the bottom of the plastic package cover plate and can supply power and cut off power to the cooling fan along with the movement of the mounting box; the bottom of the plastic sealing cover plate is provided with an air supply channel which is communicated with the through hole, and the length direction of the air supply channel is the same as the length direction of the plastic sealing cover plate; the air supply channel is provided with a plurality of air supply holes along both sides of the length direction.
Preferably, the energizing assembly comprises a rectangular protective frame, a first conductive sheet and a second conductive sheet; the rectangular protection frame is arranged at the bottom of the plastic package shell in a vertical state, the first conducting strip is arranged inside the rectangular protection frame, and the first conducting strip is electrically connected with the cooling fan; the second conducting strip is arranged at one side, far away from the first conducting strip, inside the rectangular protective frame, and the second conducting strip is in contact with the first conducting strip; the top of the mounting box is also provided with a separation sheet for separating the first conductive sheet and the second conductive sheet, and the separation sheet is positioned between the first conductive sheet and the second conductive sheet.
Preferably, the top of the plastic sealing cover plate is also provided with a slot which is communicated with the air supply channel, and a filter plate is inserted in the slot.
Preferably, the bottom of the plastic package cover plate is also provided with a dust discharging channel, the dust discharging channel is communicated with the through hole and the air supply channel, and the length direction of the dust discharging channel is perpendicular to the length direction of the air supply channel; rectangular grooves for avoiding dust discharging channels are formed in two sides of the plastic package shell.
Preferably, two ends of the dust discharging channel are provided with dust collecting boxes for containing dust and impurities, and the dust collecting boxes are communicated with the dust discharging channel;
a rectangular notch is arranged on one side of each dust collection box far away from the dust discharge channel, and a sealing door is hinged in the rectangular notch.
Preferably, the center of each side edge of the plastic package cover plate is hinged with an arc-shaped pressing plate; each arc-shaped pressing plate is provided with a horizontal placing plate, and the horizontal placing plates are provided with sliding holes; a plate is arranged on each horizontal placement plate, and a connecting hole matched with the sliding hole is formed in the center of each plate; the connecting holes and the sliding holes are coaxially arranged, a locking rod is slidably arranged in each sliding hole, a limiting disc is arranged on each locking rod, and the limiting disc is positioned between the plate and the horizontally placed plate; the locking rod is also sleeved with a locking spring, and the locking spring is positioned between the limiting disc and the plate; four walls of the plastic package shell are provided with clamping plates matched with the arc-shaped pressing plates, and each clamping plate is provided with a limiting hole for accommodating the locking rod.
Preferably, the temperature measuring mechanism comprises a temperature sensor; the temperature sensor is arranged at the center of the inside of the installation box.
Compared with the prior art, the beneficial effects of this application are:
1. this application is through spacing section of thick bamboo, promote the spring, memory metal strip, radiator fan and the mutually supporting of circular telegram subassembly, when IGBT operation, the inside temperature of plastic envelope casing risees, memory metal strip can stimulate the mounting box and remove, thereby make the exhaust duct open, circular telegram subassembly can drive radiator fan and work, the air current that radiator fan produced can be through exhaust duct discharge plastic envelope casing, through exhaust duct and radiator fan's setting, make the air current can have the unidirectionality, improve the cooling effect to IGBT, after the temperature drops to the design numerical value, under the elastic force effect of promotion spring, the mounting box can reset, thereby shelter from the exhaust duct, at this moment, the circular telegram subassembly can outage radiator fan, thereby avoid radiator fan to move excessively, radiator fan's life is improved.
2. This application is through under cooperation of filter, dust exhaust passageway and dust collection case, and the dust collection case can carry out the shutoff to the both ends of dust exhaust passageway to guide the air current that radiator fan formed, the filter inserts and establishes in the slot, thereby intercepts dust and impurity, avoids dust and impurity to enter into inside the plastic envelope casing along with the air current.
3. This application is through under the cooperation of arc pressing board, locking lever and cardboard, makes the staff can be quick carry out the dismouting to whole device, and the staff of being convenient for maintains the IGBT chip.
4. This application is through being provided with temperature sensor inside the mounting box to the staff of being convenient for can monitor the temperature when IGBT operation, thereby the timely running state of knowing IGBT of staff of being convenient for.
Drawings
Fig. 1 is a perspective view of an IGBT package with temperature measurement;
fig. 2 is a perspective exploded view of an IGBT package with temperature measurement;
FIG. 3 is a top view of an IGBT packaging structure with temperature measurement function in an unused state;
FIG. 4 is a plan cross-sectional view taken along the direction A-A of FIG. 3;
fig. 5 is a top view of an IGBT package with temperature measurement in use;
FIG. 6 is a plan cross-sectional view of FIG. 5 taken along the direction B-B;
FIG. 7 is a partial enlarged view at D in FIG. 6;
FIG. 8 is an enlarged view of a portion of FIG. 6 at E;
FIG. 9 is a plan sectional view taken along the direction C-C in FIG. 5;
fig. 10 is a partial perspective view I of an IGBT packaging structure with a temperature measurement function;
FIG. 11 is an enlarged view of a portion of FIG. 10 at E;
fig. 12 is a partial perspective view II of an IGBT package with temperature measurement.
The reference numerals in the figures are:
1-plastic packaging the shell; 11-an exhaust groove; 12-a second connection; 13-rectangular grooves; 14-clamping plates; 141-a limiting hole;
2-mounting boxes; 21-a sliding column; 22-a first connection; 23-separating sheets;
a 3-IGBT chip;
4-plastic package cover plate; 41-through holes; 42-an air supply channel; 421-air feed holes; 43-slot; 431-filter plate; 432-pulling the handle; 44-dust discharge channel; 441-ash collection box; 442-rectangular notch; 443-sealing the door; 45-arc-shaped pressing plates; 451-horizontally placing a plate; 4511-sliding aperture; 4512-locking bar; 45121-limit plate; 45122-locking spring; 45123-pulling the plate; 452- plates; 4521-connecting holes; 453-rectangular cutout;
5-a supporting mechanism; 51-a limiting cylinder; 52-pushing the spring;
6-an adjusting mechanism; 61-memory metal strips;
7-a temperature measuring mechanism; 71-a temperature sensor;
8-an air supply mechanism; 81-a heat radiation fan; 82-energizing the assembly; 821-rectangular protective frame; 822-a first conductive sheet; 823-second conductive sheet.
Detailed Description
The invention will be further described in detail with reference to the drawings and the detailed description below, in order to further understand the features and technical means of the invention and the specific objects and functions achieved.
Referring to fig. 1 to 12, an IGBT packaging structure with temperature measurement function includes a plastic package case 1, a mounting case 2, and an IGBT chip 3; the mounting box 2 is arranged in the plastic package shell 1 in a horizontal state in a sliding manner, and the IGBT chips 3 are arranged in a matrix manner in the mounting box 2; the device also comprises a plastic package cover plate 4, a supporting mechanism 5, an adjusting mechanism 6, a temperature measuring mechanism 7 and an air supply mechanism 8; the plastic sealing cover plate 4 is arranged on the plastic sealing shell 1 and is used for sealing the opening of the plastic sealing shell 1; the tops of the two sides of the plastic package shell 1 along the length direction are equidistantly provided with a plurality of exhaust grooves 11; the supporting mechanism 5 is arranged inside the plastic package shell 1 and is used for enabling the mounting box 2 to move towards the direction of the plastic package cover plate 4 so as to seal the exhaust groove 11; the adjusting mechanism 6 is arranged inside the plastic package shell 1 and can move the mounting box 2 along the direction away from the plastic package cover plate 4 along with the temperature rise so as to open the exhaust groove 11; the temperature measuring mechanism 7 is arranged inside the mounting box 2 and is used for measuring the temperature of the IGBT chip 3 during operation; the air supply mechanism 8 is provided on the plastic package cover 4 and can supply air into the plastic package case 1 with the air discharge duct 11 opened.
The method comprises the steps that firstly, an IGBT chip 3 is attached to the inside of an installation box 2 by workers and corresponding heat-conducting silica gel is injected, then, the installation box 2 is placed in the inside of a plastic package shell 1 and the plastic package shell 1 is packaged through a plastic package cover 4, at the moment, the inside of the plastic package shell 1 is in a room temperature state, a supporting mechanism 5 pushes the installation box 2 to move towards a direction close to the plastic package cover 4 (as shown in fig. 4), two sides of the installation box 2 along the length direction can seal exhaust grooves 11 on two sides of the plastic package shell 1, so that dust and impurities are prevented from entering the inside of the plastic package shell 1, when the IGBT chip 3 runs, the temperature generated by the IGBT chip 3 conducts preliminary heat dissipation through the heat-conducting silica gel, at the moment, the temperature inside the plastic package shell 1 rises, and after the temperature rises to a design value, an adjusting mechanism 6 can pull the installation box 2 to move towards a direction far away from the plastic package cover 4, and accordingly the exhaust grooves 11 on two sides of the plastic package shell 1 are opened (as shown in fig. 6); at this time, the air supply mechanism 8 can convey air into the plastic package casing 1, and the air is discharged out of the plastic package casing 1 through the air discharge groove 11, so that the temperature inside the plastic package casing 1 is reduced, the running stability of the IGBT is ensured, the temperature measuring mechanism 7 arranged inside the mounting box 2 can measure the temperature of the IGBT chip 3 more accurately, and a worker can monitor the running state of the IGBT conveniently and timely.
Referring to fig. 2, 4 and 6, the supporting mechanism 5 includes a limiting cylinder 51 and a push spring 52; the two limiting cylinders 51 are arranged on the inner wall of the bottom of the plastic package shell 1 in a vertical state, and the two limiting cylinders 51 are symmetrically arranged relative to the center of the bottom of the plastic package shell 1; two sliding columns 21 are arranged at the bottom of the mounting box 2, and the sliding columns 21 can be arranged in the corresponding limiting cylinders 51 in a sliding manner; the pushing springs 52 are two, and the pushing springs 52 are arranged inside the corresponding limiting cylinder 51 and are positioned between the corresponding sliding column 21 and the inner wall of the bottom of the limiting cylinder 51.
The mounting box 2 bottom is provided with the slip post 21, and the slip post 21 can be gliding set up in the spacing section of thick bamboo 51 that corresponds, under IGBT unoperated state, promotes spring 52 and produces elastic force to promote mounting box 2 towards being close to the removal of plastic envelope casing 1 opening direction, at this moment, the plastic envelope apron 4 of setting in plastic envelope casing 1 opening part can restrict the position of mounting box 2, thereby avoids mounting box 2 to be pushed out plastic envelope casing 1 because the elastic force of promotion spring 52. When the IGBT operates, the heat is rapidly dissipated through the heat-conducting silica gel, at this moment, the temperature inside the plastic package shell 1 rises, after the temperature reaches the design value, the adjusting mechanism 6 can pull the mounting box 2 to move towards the direction away from the plastic package cover 4, so that the exhaust groove 11 is opened, the air supply mechanism 8 can supply air to the inside of the plastic package shell 1 along with the opening of the exhaust groove 11, so that the IGBT chip 3 is cooled, when the temperature falls below the design value, the mounting box 2 can shield the exhaust groove 11 under the action of the elastic force of the adjusting mechanism 6 and the pushing spring 52, so that dust and impurities are prevented from entering the inside of the plastic package shell 1 through the exhaust groove 11.
Referring to fig. 4 and 6, the adjustment mechanism 6 includes a memory metal strip 61; two first connecting parts 22 are arranged at the bottom of the mounting box 2; the inner wall of the bottom of the plastic package shell 1 is provided with two second connecting parts 12 corresponding to the first connecting parts 22; the memory metal strips 61 are two, the memory metal strips 61 are spiral, and two ends of the memory metal strips 61 are respectively arranged on the corresponding first connecting part 22 and the second connecting part 12.
Through being provided with the memory metal strip 61 of spiral shape, along with the rising of IGBT temperature, when the temperature risees to design numerical value, memory metal strip 61 can shrink fast, thereby pulling mounting box 2 and moving towards being close to plastic envelope 1 bottom inner wall direction, at this moment, the space between mounting box 2 and the plastic envelope board 4 grow, exhaust duct 11 opens along with the removal of mounting box 2, thereby the gas is continuously carried to plastic envelope 1 inside along with the removal of mounting box 2 to gas feed mechanism 8, the gas carries the inside high temperature gas of plastic envelope 1 to discharge plastic envelope 1 through exhaust duct 11, thereby reduce the inside temperature of plastic envelope 1, when the temperature falls below design numerical value, memory metal strip 61 stretches and resets, at this moment, under the elastic force effect of push spring 52, mounting box 2 moves towards being close to plastic envelope board 4 direction, thereby shelter from exhaust duct 11, ensure plastic envelope 1's leakproofness.
Referring to fig. 2, 4, 6, 7, 10, and 11, the air supply mechanism 8 includes a heat radiation fan 81 and an energization module 82; a through hole 41 is arranged at the center of one side of the top of the plastic cover plate 4; the heat radiation fan 81 is disposed inside the through hole 41; the power-on assembly 82 is arranged at the bottom of the plastic cover plate 4 and can supply power and cut off power to the cooling fan 81 along with the movement of the mounting box 2; the bottom of the plastic cover plate 4 is provided with an air supply channel 42, the air supply channel 42 is communicated with the through hole 41, and the length direction of the air supply channel 42 is the same as the length direction of the plastic cover plate 4; the air supply passage 42 is provided with a plurality of air supply holes 421 on both sides in the longitudinal direction.
When the IGBT operates to generate temperature, the memory metal strip 61 is compressed, so that the mounting box 2 is pulled to move towards the direction close to the bottom of the plastic package casing 1, the energizing assembly 82 is electrically connected with the cooling fan 81, at this time, the energizing mechanism can energize the cooling fan 81, the cooling fan 81 rotates, so that gas is continuously conveyed into the gas supply channel 42, the gas supply channel 42 is positioned in the plastic package object, the gas flows towards the inside of the plastic package casing 1 through the gas supply hole 421, thereby ensuring unidirectionality of gas circulation and improving the cooling speed in the plastic package casing 1; after the temperature drops below the design value, the memory metal strip 61 resets, under the action of the elastic force of the pushing spring 52, the mounting box 2 moves to the top of the plastic package shell 1, at this time, the power-on component 82 can power off the cooling fan 81, and in the normal running state of the IGBT, the running time of the cooling fan 81 is reduced, and the service life of the cooling fan 81 is prolonged.
Referring to fig. 6, 7 and 11, the energizing assembly 82 includes a rectangular guard frame 821, a first conductive tab 822 and a second conductive tab 823; the rectangular protection frame 821 is arranged at the bottom of the plastic package shell 1 in a vertical state, the first conductive sheet 822 is arranged inside the rectangular protection frame 821, and the first conductive sheet 822 is electrically connected with the cooling fan 81; the second conductive sheet 823 is disposed at a side of the inside of the rectangular protective frame 821 away from the first conductive sheet 822, and the second conductive sheet 823 is in contact with the first conductive sheet 822; the mounting box 2 is also provided at the top with a partition piece 23 for separating the first conductive piece 822 and the second conductive piece 823, the partition piece 23 being located between the first conductive piece 822 and the second conductive piece 823.
When the mounting case 2 is positioned at the top of the plastic package case 1 under the elastic force of the pushing spring 52, the partition piece 23 is protruded into the inside of the rectangular protection frame 821 and is positioned between the first conductive piece 822 and the second conductive piece 823, so that the first conductive piece 822 and the second conductive piece 823 are separated, and at this time, the heat radiation fan 81 is in a power-off state; when the IGBT chip 3 is operated, as the temperature inside the plastic package 1 increases, the memory metal strip 61 of the spiral shape contracts at a specific temperature, thereby pulling the mounting box 2 to move toward the direction close to the bottom of the plastic package 1, so that the exhaust grooves 11 on both sides of the plastic package 1 are opened, at this time, the partition sheet 23 is moved out from the inside of the rectangular protection frame 821, at this time, the first conductive sheet 822 and the second conductive sheet 823 are in contact with each other, and the heat dissipation fan 81 is in an energized state; the heat radiation fan 81 is enabled to operate according to the temperature change of the IGBT, and the effective operating time of the heat radiation fan 81 is improved.
Referring to fig. 2, 5 and 8, the plastic cover 4 is further provided with a slot 43 at the top, the slot 43 is communicated with the air supply channel 42, and a filter plate 431 is inserted into the slot 43.
Through being provided with the filter 431, when radiator fan 81 carries out the during operation, the filter 431 can intercept dust and impurity in the air to avoid dust and impurity to enter into inside the plastic envelope casing 1 through the inlet channel, still be provided with pulling handle 432 on the filter 431, thereby be convenient for the staff to change the filter 431.
Referring to fig. 2, 8 and 10, the plastic cover plate 4 is further provided with a dust discharging channel 44 at the bottom thereof, the dust discharging channel 44 is communicated with the through hole 41 and the air supplying channel 42, and the length direction of the dust discharging channel 44 is perpendicular to the length direction of the air supplying channel 42; rectangular grooves 13 for avoiding dust discharging channels 44 are formed in two sides of the plastic package shell 1.
By being provided with the dust discharge passage 44, when the heat radiation fan 81 operates, the filter plate 431 can isolate dust and impurities, the length direction of the dust discharge passage 44 is perpendicular to the length direction of the air intake passage, and the dust and impurities isolated by the filter plate 431 can be discharged through the dust discharge passage 44, thereby reducing accumulation of dust and impurities.
Referring to fig. 5, 9 and 10, both ends of the dust discharge passage 44 are provided with dust collection boxes 441 for accommodating dust and foreign substances, and the dust collection boxes 441 communicate with the dust discharge passage 44; a rectangular notch 442 is arranged on one side of each dust collection box 441 far away from the dust discharge channel 44, and a sealing door 443 is hinged in the rectangular notch 442.
The dust collection box 441 is L-shaped, when the sealing door 443 is in a closed state, two ends of the dust discharge channel 44 are communicated with the dust collection box 441 to form a closed space, so that air flow formed by the cooling fan 81 is guided, the air flow can enter the plastic package shell 1 through the air supply channel 42 to cool the IGBT, the inner wall at the bottom of the dust discharge channel 44 is triangular (as shown in fig. 9), so that dust and impurities can be guided, and the dust and impurities can fall into the dust collection box 441 at the two ends under the action of gravity; the worker can treat dust and foreign substances through the sealing door 443, thereby ensuring that the IGBT can continuously operate.
Referring to fig. 10 to 12, an arc-shaped pressing plate 45 is hinged to the center of each side edge of the plastic package cover plate 4; each arc-shaped pressing plate 45 is provided with a horizontal placing plate 451, and the horizontal placing plate 451 is provided with a sliding hole 4511; each horizontal placement plate 451 is provided with a plate 452, and a connecting hole 4521 matched with the sliding hole 4511 is formed in the center of the plate 452; the connecting holes 4521 and the sliding holes 4511 are coaxially arranged, a locking rod 4512 is arranged in each sliding hole 4511 in a sliding manner, a limit disc 45121 is arranged on the locking rod 4512, and a limit disc 45121 is arranged between the plate 452 and the horizontal placing plate 451; the locking rod 4512 is also sleeved with a locking spring 45122, and the locking spring 45122 is positioned between the limit plate 45121 and the plate 452; the plastic package housing 1 is provided with clamping plates 14 matched with the arc-shaped pressing plates 45 on four walls, and each clamping plate 14 is provided with a limiting hole 141 for accommodating the locking rod 4512.
A pulling plate 45123 is arranged at one end of each locking rod 4512 close to the -shaped plate 452, the pulling plate 45123 is positioned at one end of the -shaped plate 452 far away from the horizontal placing plate 451, a worker places the plastic sealing plate 4 on the plastic sealing shell 1 and adjusts the arc-shaped pressing plates 45 so as to enable the horizontal placing plate 451 to move towards the clamping plate 14, a rectangular notch 453 is further arranged on each arc-shaped pressing plate 45, the worker downwards moves the pulling plate 45123 through the rectangular notch 453 so as to enable the locking rod 4512 to move towards the direction close to the -shaped plate 452, the locking spring 45122 is extruded along with the movement of the locking rod 4512, when the sliding hole 4511, the connecting hole 4521 and the limiting hole 141 are coaxial, the worker releases the pulling plate 45123, and under the elastic force of the locking spring 45122, the locking rod 4512 can extend into the limiting hole 141 so as to limit the position of the plastic sealing plate 4; under the cooperation of the arc-shaped pressing plate 45 and the clamping plate 14, a worker can quickly disassemble and assemble the whole device, and the worker can conveniently maintain the IGBT chip 3.
Referring to fig. 4 and 6, the temperature measuring mechanism 7 includes a temperature sensor 71; the temperature sensor 71 is provided at the inner center of the mounting case 2.
Through being provided with temperature sensor 71, after IGBT chip 3 pastes the dress and accomplishes, place temperature sensor 71 in installation box 2 bottom inner wall center department, later, pour into the heat conduction silica gel and fix temperature sensor 71 into, when IGBT chip 3 operates, temperature sensor 71 can carry out the monitoring often to the temperature of operation to the timely running state of understanding IGBT of staff of being convenient for.
The foregoing examples merely illustrate one or more embodiments of the invention, which are described in greater detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
1. An IGBT packaging structure with a temperature measurement function comprises a plastic package shell (1), a mounting box (2) and an IGBT chip (3); the mounting box (2) is arranged in the plastic package shell (1) in a horizontal state in a sliding manner, and the IGBT chips (3) are arranged in a matrix manner in the mounting box (2); the device is characterized by further comprising a plastic package cover plate (4), a supporting mechanism (5), an adjusting mechanism (6), a temperature measuring mechanism (7) and an air supply mechanism (8);
the plastic package cover plate (4) is arranged on the plastic package shell (1) and is used for sealing the opening of the plastic package shell (1);
a plurality of exhaust grooves (11) are equidistantly arranged at the tops of two sides of the plastic package shell (1) along the length direction;
the supporting mechanism (5) is arranged in the plastic package shell (1) and used for enabling the mounting box (2) to move towards the direction of the plastic package cover plate (4) so as to seal the exhaust groove (11);
the adjusting mechanism (6) is arranged in the plastic package shell (1) and can enable the mounting box (2) to move along the direction away from the plastic package cover plate (4) along with the temperature rise so as to enable the exhaust groove (11) to be opened;
the temperature measuring mechanism (7) is arranged in the mounting box (2) and is used for measuring the temperature of the IGBT chip (3) during operation;
the air supply mechanism (8) is arranged on the plastic package cover plate (4) and can supply air into the plastic package shell (1) along with the opening of the air exhaust groove (11).
2. The IGBT packaging structure with temperature measurement function according to claim 1, characterized in that the supporting mechanism (5) comprises a limit cylinder (51) and a push spring (52);
the two limiting cylinders (51) are arranged on the inner wall of the bottom of the plastic package shell (1) in a vertical state, and the two limiting cylinders (51) are symmetrically arranged relative to the center of the bottom of the plastic package shell (1);
two sliding columns (21) are arranged at the bottom of the mounting box (2), and the sliding columns (21) can be slidably arranged in the corresponding limiting cylinders (51);
the pushing springs (52) are two, and the pushing springs (52) are arranged inside the corresponding limiting cylinders (51) and are positioned between the corresponding sliding columns (21) and the inner walls of the bottoms of the limiting cylinders (51).
3. An IGBT packaging structure with temperature measurement function according to claim 2, characterized in that the adjusting mechanism (6) comprises a memory metal strip (61);
two first connecting parts (22) are arranged at the bottom of the mounting box (2); the inner wall of the bottom of the plastic package shell (1) is provided with two second connecting parts (12) corresponding to the first connecting parts (22);
the memory metal strips (61) are two, the memory metal strips (61) are spiral, and two ends of the memory metal strips (61) are respectively arranged on the corresponding first connecting part (22) and the second connecting part (12).
4. An IGBT packaging structure with temperature measurement function according to claim 3, characterized in that the air feeding mechanism (8) comprises a heat radiation fan (81) and an energizing assembly (82);
a through hole (41) is arranged in the center of one side of the top of the plastic package cover plate (4); the heat radiation fan (81) is arranged inside the through hole (41);
the power-on assembly (82) is arranged at the bottom of the plastic package cover plate (4) and can supply power and cut off power to the cooling fan (81) along with the movement of the mounting box (2);
an air supply channel (42) is arranged at the bottom of the plastic sealing cover plate (4), the air supply channel (42) is communicated with the through hole (41), and the length direction of the air supply channel (42) is the same as the length direction of the plastic sealing cover plate (4);
the air supply channel (42) is provided with a plurality of air supply holes (421) along both sides in the longitudinal direction.
5. The IGBT packaging structure with temperature measurement function according to claim 4, characterized in that the energizing assembly (82) comprises a rectangular protective frame (821), a first conductive sheet (822) and a second conductive sheet (823);
the rectangular protection frame (821) is arranged at the bottom of the plastic package shell (1) in a vertical state, the first conductive sheet (822) is arranged inside the rectangular protection frame (821), and the first conductive sheet (822) is electrically connected with the cooling fan (81); the second conductive sheet (823) is arranged at one side, far away from the first conductive sheet (822), inside the rectangular protective frame (821), and the second conductive sheet (823) is in contact with the first conductive sheet (822);
the top of the mounting box (2) is also provided with a separation sheet (23) for separating the first conductive sheet (822) and the second conductive sheet (823), and the separation sheet (23) is positioned between the first conductive sheet (822) and the second conductive sheet (823).
6. The IGBT packaging structure with the temperature measurement function according to claim 4, wherein a slot (43) is further formed in the top of the plastic packaging cover plate (4), the slot (43) is communicated with the air supply channel (42), and a filter plate (431) is inserted into the slot (43).
7. The IGBT packaging structure with the temperature measurement function according to claim 6, wherein a dust discharging channel (44) is further arranged at the bottom of the plastic packaging cover plate (4), the dust discharging channel (44) is communicated with the through hole (41) and the air supplying channel (42), and the length direction of the dust discharging channel (44) is perpendicular to the length direction of the air supplying channel (42); rectangular grooves (13) for avoiding dust discharging channels (44) are formed in two sides of the plastic package shell (1).
8. The IGBT packaging structure with temperature measurement function according to claim 7, characterized in that dust collection boxes (441) for containing dust and impurities are provided at both ends of the dust discharge channel (44), the dust collection boxes (441) being in communication with the dust discharge channel (44);
a rectangular notch (442) is arranged on one side of each dust collection box (441) far away from the dust discharge channel (44), and a sealing door (443) is hinged in the rectangular notch (442).
9. The IGBT packaging structure with the temperature measurement function according to claim 1, wherein an arc-shaped pressing plate (45) is hinged at the center of each side edge of the plastic packaging cover plate (4); each arc-shaped pressing plate (45) is provided with a horizontal placing plate (451), and the horizontal placing plates (451) are provided with sliding holes (4511);
each horizontal placing plate (451) is provided with a plate (452), and the center of the plate (452) is provided with a connecting hole (4521) matched with the sliding hole (4511); the connecting holes (4521) and the sliding holes (4511) are coaxially arranged, a locking rod (4512) is arranged in each sliding hole (4511) in a sliding mode, a limiting disc (45121) is arranged on the locking rod (4512), and the limiting disc (45121) is located between the -shaped plate (452) and the horizontal placing plate (451);
the locking rod (4512) is also sleeved with a locking spring (45122), and the locking spring (45122) is positioned between the limit disc (45121) and the plate (452);
clamping plates (14) matched with the arc-shaped pressing plates (45) are arranged on the four walls of the plastic package shell (1), and limiting holes (141) used for accommodating the locking rods (4512) are formed in each clamping plate (14).
10. An IGBT packaging structure with temperature measurement function according to claim 1, characterized in that the temperature measurement mechanism (7) comprises a temperature sensor (71);
a temperature sensor (71) is provided at the inner center of the mounting box (2).
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| CN202310546879.9A CN116261316B (en) | 2023-05-16 | 2023-05-16 | IGBT packaging structure with temperature measurement function |
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| CN116261316B (en) | 2023-09-08 |
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Denomination of invention: An IGBT packaging structure with temperature measurement function Effective date of registration: 20231225 Granted publication date: 20230908 Pledgee: Zaozhuang rural commercial bank Limited by Share Ltd. Yicheng sub branch Pledgor: Weihong induction (Shandong) Technology Co.,Ltd. Registration number: Y2023980074023 |