CN115881664A

CN115881664A - Automatic temperature control equipment for BGA (ball grid array) packaged chip

Info

Publication number: CN115881664A
Application number: CN202310038971.4A
Authority: CN
Inventors: 黄少娃; 黄旭彪; 郭威成; 刘政宏; 黄庭鑫
Original assignee: Shenzhen Quanxing Technology Co ltd
Current assignee: Shenzhen Quanxing Technology Co ltd
Priority date: 2023-01-13
Filing date: 2023-01-13
Publication date: 2023-03-31

Abstract

The invention relates to automatic temperature control equipment for a BGA (ball grid array) packaged chip, belonging to the technical field of BGA packaged chips. Comprises a base for bearing and fixing a chip body; the protective shell is fixedly connected to the top of the base and covers the chip body; the two heat dissipation fans are symmetrically and fixedly connected to the inner wall of the top of the protective shell and used for dissipating heat for the chip body; the temperature control mechanism is arranged in the protective shell, and the two cooling fans are automatically started and stopped by utilizing the heat dissipating capacity of the chip body, so that the cooling effect is realized. According to the invention, the expansion liquid is subjected to corresponding volume change along with the temperature rise and the temperature reduction of the chip, so that the automatic opening and closing of the cooling fan are controlled, the cooling fan is not required to be automatically started when the chip works, the temperature control effect is achieved, the energy consumption can be reduced, the service life of the fan is prolonged, meanwhile, the air flow is reduced, the mass accumulation of dust can be prevented, and a certain protection effect on the chip is also achieved.

Description

Automatic temperature control equipment for BGA (ball grid array) packaged chip

Technical Field

The invention belongs to the technical field of BGA (ball grid array) packaged chips, and relates to automatic temperature control equipment for a BGA packaged chip.

Background

With the development of integrated circuit technology, the packaging requirements for integrated circuits are more stringent. This is because the packaging technology is related to the functionality of the product, when the frequency of the IC exceeds 100MHz, the conventional packaging method may generate the so-called "CrossTalk" phenomenon, and when the Pin count of the IC is greater than 208Pin, the conventional packaging method has difficulty. Therefore, besides the QFP packaging method, the BGA (Ball Grid Array Package) packaging technology is now used for most high-pin-count chips. BGA became the best choice for high density, high performance, multi-pin packages such as CPU, south/north bridge chip on motherboard, etc.

At present, BGA package chips also can generate a large amount of heat during working, but tradition still relies on a fan heat dissipation mode, the mode design, the installation is relatively simple, the heat dissipation effect is good, generally, the fan can be automatically started when the chips start to work, heat dissipation and cooling are carried out on the chips, but the chips can only send out more heat after working for a period of time, and in winter or low-temperature environment use, the time required for reaching the condition needing cooling is longer than that under normal conditions, and the short-time work also does not need to utilize the fan for cooling, so that the mode that the traditional fan is started along with the work of the chips simultaneously can directly increase unnecessary energy consumption, simultaneously, the service life of the fan can be greatly reduced, and the air circulation is accelerated, so that dust is easy to accumulate, and certain influence is caused on the chips, therefore, an automatic temperature control device for BGA package chips is provided, and the problem provided is solved.

Disclosure of Invention

In view of the above, the present invention provides an automatic temperature control device for BGA packaged chips, which solves the problems of the conventional heat dissipation mode that the unnecessary power consumption is directly increased, the service life of the fan is greatly reduced, and dust is easily accumulated due to the accelerated air circulation.

In order to achieve the purpose, the invention provides the following technical scheme: comprises a base for bearing and fixing a chip body;

the protective shell is fixedly connected to the top of the base and covers the chip body;

the two heat dissipation fans are symmetrically and fixedly connected to the inner wall of the top of the protective shell and used for dissipating heat for the chip body;

the temperature control mechanism is arranged in the protective shell, and the two cooling fans are automatically started and stopped by utilizing the heat dissipated by the chip body, so that the cooling effect is realized;

the two groups of heat dissipation holes are respectively arranged on two sides of the protective shell, so that air circulation is facilitated;

and the mounting holes are annularly and uniformly distributed at the top of the base and are positioned on the outer side of the protective shell.

Further, accuse temperature mechanism includes fixed ring of fixed connection at protective housing inner wall, and fixed ring's inner wall is a plurality of connecting pipes of annular equidistance fixedly connected with, and the fixed intercommunication of the one end that a plurality of connecting pipes extend each other and be close to has same piston cylinder, and piston cylinder's inside sliding connection has the piston that is located the connecting pipe top, and all add the inflation liquid in a plurality of connecting pipes and the space that piston cylinder is located the piston below.

Further, the expansion liquid is prepared by mixing liquid nitrogen dioxide and liquid dinitrogen tetroxide.

Further, accuse temperature mechanism still includes the install bin of fixed connection at protective housing top inner wall, and the top of piston cylinder and the bottom fixed connection of install bin, the top fixedly connected with piston rod of piston, the top of piston rod extends to the inside and the fixedly connected with kicking block of install bin, and the outer wall cover of piston rod is equipped with first spring, the top of first spring and the bottom fixed connection of kicking block, the bottom of first spring and the bottom inner wall fixed connection of install bin.

Further, the inner wall symmetry of one side that the install bin kept away from each other is equipped with two elastic switch, and two elastic switch respectively with two radiator fan connection of electric lines, the inside symmetry of install bin is equipped with two sets of touch subassemblies that are used for controlling two elastic switch respectively and open, and two sets of touch subassemblies all with kicking block transmission fit.

Further, the touching subassembly includes the fixed plate of fixed connection in the inside top of install bin, the inside symmetric slip of fixed plate runs through there are two slide bars, the same swash plate that is located the kicking block oblique top of one end fixedly connected with of two slide bars, one side fixedly connected with push rod of kicking block is kept away from to the swash plate, the other end slip of push rod runs through one side and the fixedly connected with extrusion piece of fixed plate, and extrusion piece and elastic switch position height are corresponding, the outer wall cover of push rod is equipped with the second spring, one side fixed connection that the both ends of second spring are close to each other with extrusion piece and fixed plate respectively, the equal fixedly connected with stopper of one end of swash plate is kept away from to two slide bars.

Further, the bottom fixedly connected with movable block of swash plate, two diaphragms of the inside below symmetry fixedly connected with of install bin, sliding connection has the kelly to run through at the top of diaphragm, one side that the piston rod was kept away from to the top of kelly and the bottom of movable block are inconsistent, the outer wall cover of kelly is equipped with compression spring, compression spring's both ends respectively with the outer wall of kelly and the top fixed connection of diaphragm, the outer wall fixedly connected with L type pole of kelly, the same cover of top fixedly connected with of two L type poles is established at the loose collar in the piston rod outside, and the top of loose collar is contradicted with the bottom of kicking block, one side that the bottom of movable block is close to the piston rod is equipped with the draw-in groove with kelly top joint complex.

Furthermore, a plurality of heat conduction fins are arranged on the outer wall of each connecting pipe.

Furthermore, the inner wall of the top of the protective shell is symmetrically and fixedly connected with two ventilating hood bodies, and the two ventilating hood bodies respectively cover the two cooling fans.

Furthermore, the inner wall of one side, far away from each other, of the protection shell is fixedly connected with a dust cover, and the dust cover corresponds to the heat dissipation holes.

The invention has the beneficial effects that:

1. according to the automatic temperature control equipment for the BGA package chip, disclosed by the invention, heat emitted by a chip body during working can be absorbed into a connecting pipe through a heat conduction fin to heat expansion liquid inside the connecting pipe, the expansion liquid starts to expand when being heated, the volume of the expansion liquid is increased, a piston is further pushed to move upwards, meanwhile, a piston rod drives a top block to move upwards and pushes two inclined plates to move horizontally in a direction away from each other, the inclined plates drive an extrusion block to move horizontally through push rods and are abutted against adjacent elastic switches, and then a cooling fan is triggered to be started, so that the automatic cooling effect on the chip body is realized;

2. according to the automatic temperature control equipment for the BGA package chip, disclosed by the invention, the movable block can be driven to move simultaneously through the movement of the inclined plate, when the clamping rod corresponds to the clamping groove, the clamping rod is driven to move upwards and be clamped into the clamping groove under the elastic action of the compression spring, the limiting effect on the movable block is realized, the braking on the extrusion block is further realized, the extrusion block is enabled to be always in a state of being abutted to the elastic switch and opened, and the heat radiation fan is enabled to keep a continuous heat radiation effect;

3. according to the automatic temperature control equipment for the BGA package chip, disclosed by the invention, the expansion liquid starts to be gradually cooled by starting the cooling fan, the volume of the expansion liquid starts to be gradually reduced after the expansion liquid is cooled, the piston rod and the top block start to reset downwards under the elastic action of the first spring, and as the top block is in a cooling stage in the descending process and does not immediately restore to a normal temperature state, the cooling fan is always in an open state in the descending process of the top block, so that effective heat dissipation is ensured;

4. according to the automatic temperature control equipment for the BGA package chip, disclosed by the invention, after the top block moves downwards to the bottommost end, namely the expansion liquid is restored to the normal temperature state, the movable ring is pushed downwards, the clamping rod is driven to move downwards through the L-shaped rod, so that the clamping rod is separated from the clamping connection with the clamping groove, at the moment, the extrusion block, the push rod and the inclined plate start to reset under the elastic action of the second spring, the extrusion block is separated from the collision with the elastic switch, and the elastic switch automatically resets, so that the automatic closing effect of the cooling fan is realized.

According to the invention, the expansion liquid is subjected to corresponding volume change along with the temperature rise and the temperature reduction of the chip, so that the automatic opening and closing of the cooling fan are controlled, the cooling fan is not required to be automatically started when the chip works, the temperature control effect is achieved, the energy consumption can be reduced, the service life of the fan is prolonged, meanwhile, the air flow is reduced, the mass accumulation of dust can be prevented, and a certain protection effect on the chip is also achieved.

Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims thereof.

Drawings

For the purposes of promoting a better understanding of the objects, aspects and advantages of the invention, reference will now be made to the following detailed description taken in conjunction with the accompanying drawings in which:

FIG. 1 is a perspective view showing the overall structure of an automatic temperature control apparatus for BGA packaged chips according to the present invention;

FIG. 2 is a front cross-sectional view showing the overall structure of the automatic temperature control apparatus for BGA package chips according to the present invention;

FIG. 3 is a further cross-sectional view of the overall structure of FIG. 2 showing an automatic temperature control apparatus for a BGA package chip in accordance with the present invention;

FIG. 4 is a schematic view of a portion of the temperature control apparatus of the present invention for BGA package chips shown in FIG. 3;

FIG. 5 is a schematic view of the automatic temperature control apparatus for BGA package chips of the present invention, partially shown in FIG. 4;

FIG. 6 is a top cross-sectional view of the overall structure of the automatic temperature control apparatus for BGA package chips in accordance with the present invention;

FIG. 7 is a perspective view of a connection structure of a connection tube and a piston cylinder of the automatic temperature control apparatus for BGA package chips according to the present invention;

FIG. 8 is a perspective view of a piston cylinder and mounting box connecting structure of the automatic temperature control apparatus for BGA package chips in accordance with the present invention;

FIG. 9 is a perspective view showing the internal structure of the mounting case of the automatic temperature control device for BGA package chips in accordance with the present invention;

FIG. 10 is a perspective view of the partial structure of FIG. 9 of the automatic temperature control apparatus for BGA package chips in accordance with the present invention;

fig. 11 is a structural diagram illustrating a starting state of a cooling fan triggered by the automatic temperature control device for BGA package chips according to the present invention.

Reference numerals: 1. a base; 2. a protective housing; 3. a chip body; 4. installing a box; 5. a fixing ring; 6. a connecting pipe; 7. a piston cylinder; 8. an expansion fluid; 9. a ventilation cover body; 10. a piston; 11. a piston rod; 12. a top block; 13. a first spring; 14. a heat radiation fan; 15. an elastic switch; 16. a heat conductive fin; 17. a fixing plate; 18. a slide bar; 19. a sloping plate; 20. a limiting block; 21. a push rod; 22. extruding the block; 23. a second spring; 24. a movable block; 25. a card slot; 26. a transverse plate; 27. a clamping rod; 28. an L-shaped rod; 29. a movable ring; 30. a compression spring; 31. heat dissipation holes; 32. a dust cover; 33. and (7) mounting holes.

Detailed Description

The following embodiments of the present invention are provided by way of specific examples, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention. It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present invention in a schematic way, and the features in the following embodiments and examples may be combined with each other without conflict.

Wherein the showings are for the purpose of illustrating the invention only and not for the purpose of limiting the same, and in which there is shown by way of illustration only and not in the drawings in which there is no intention to limit the invention thereto; to better illustrate the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.

The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood that if there is an orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "front", "rear", etc., based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not an indication or suggestion that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes, and are not to be construed as limiting the present invention, and the specific meaning of the terms may be understood by those skilled in the art according to specific situations.

Example one

As shown in fig. 1-11, the automatic temperature control device for BGA package chip includes a base 1 for bearing and fixing a chip body 3, a protective housing 2, two heat dissipation fans 14, two sets of heat dissipation holes 31, and a plurality of mounting holes 33; the protective shell 2 is fixedly connected to the top of the base 1 and covers the chip body 3; the two heat dissipation fans 14 are symmetrically and fixedly connected to the inner wall of the top of the protective shell 2 and used for dissipating heat for the chip body 3; the two groups of heat dissipation holes 31 are respectively arranged on the two sides of the protective shell 2, so that air circulation is facilitated; the mounting holes 33 are uniformly distributed on the top of the base 1 in a ring shape and are positioned on the outer side of the protective shell 2.

In the invention, the temperature control equipment also comprises a temperature control mechanism arranged in the protective shell 2, and can utilize the heat dissipated by the chip body 3 to automatically start and stop the two cooling fans 14, thereby realizing the cooling effect; temperature control mechanism includes fixed ring 5 of fixed connection at 2 inner walls of protective housing, and the inner wall of fixed ring 5 is a plurality of connecting pipes 6 of annular equidistance fixedly connected with, and the fixed intercommunication of the one end that a plurality of connecting pipes 6 extend each other and be close to has same piston cylinder 7, and the inside sliding connection of piston cylinder 7 has the piston 10 that is located connecting pipe 6 top, has all added inflation liquid 8 in a plurality of connecting pipes 6 and the piston cylinder 7 is located the space of piston 10 below. The expansion liquid 8 adopts the mobile liquid that has expend with heat and contract with cold characteristic, and the volume of being heated increases promptly, and the liquid that the cooling volume dwindles, after chip body 3 work produced the heat, expansion liquid 8 absorbed the heat volume and increases gradually, can promote piston 10 and upwards slide, and after chip body 3 stop work or temperature cooled down along with radiator fan 14's start-up in the

protective housing

2, 8 volumes of expansion liquid began to contract and resume to initial condition.

In the present invention, the expansion liquid 8 is prepared by mixing liquid nitrogen dioxide and liquid dinitrogen tetroxide. The chemical reaction equation of the nitrogen dioxide and the dinitrogen tetroxide is 2NO2= N2O4, the nitrogen dioxide and the dinitrogen tetroxide can be mutually converted, when the two substances are heated, the two substances move to the left of the equation, namely the content of the liquid nitrogen dioxide is increased, the volume is increased, the piston 10 is pushed to move, and when the temperature is reduced, the two substances move to the right of the equation, namely the content of the liquid dinitrogen tetroxide is increased, and the volume is reduced.

The liquid experimental video in which liquid nitrogen dioxide and liquid dinitrogen tetroxide are mixed can refer to the following website: https:// www. Bilibili. Com/video/BV16U4y127TG/? spm _ id _ from =333.788 recommend (u more) video.2, the experimental video provided by this website changes the volume of the mixed liquid by increasing the pressure, and the same principle of changing the volume by heating is the reverse conversion between the two.

In the invention, the temperature control mechanism further comprises an installation box 4 fixedly connected to the inner wall of the top of the protection shell 2, the top of the piston cylinder 7 is fixedly connected with the bottom of the installation box 4, the top of the piston 10 is fixedly connected with a piston rod 11, the top end of the piston rod 11 extends into the installation box 4 and is fixedly connected with a top block 12, a first spring 13 is sleeved on the outer wall of the piston rod 11, the top end of the first spring 13 is fixedly connected with the bottom of the top block 12, and the bottom end of the first spring 13 is fixedly connected with the inner wall of the bottom of the installation box 4. When the piston 10 is expanded by the expansion liquid 8 and moves upwards, the top block 12 can be driven to move upwards and stretch the first spring 13, and after the cooled volume of the expansion liquid 8 is reduced, the piston 10 can move downwards under the elastic acting force of the first spring 13 to reset.

In the invention, two elastic switches 15 are symmetrically arranged on the inner wall of one side of the installation box 4 away from each other, the two elastic switches 15 are respectively in electric wire connection with two cooling fans 14, two groups of touch components respectively used for controlling the two elastic switches 15 to be opened are symmetrically arranged inside the installation box 4, and the two groups of touch components are in transmission fit with the top block 12. When the top block 12 moves upwards, the touch component can be pushed to move and trigger the elastic switch 15 to be turned on, and then the heat dissipation fan 14 can be turned on to dissipate heat and cool the chip body 3.

According to the invention, the touch component comprises a fixed plate 17 fixedly connected to the upper part inside the installation box 4, two sliding rods 18 symmetrically penetrate through the fixed plate 17 in a sliding manner, one ends of the two sliding rods 18 are fixedly connected with an inclined plate 19 which is positioned on the inclined upper part of the ejector block 12, one side of the inclined plate 19 far away from the ejector block 12 is fixedly connected with a push rod 21, the other end of the push rod 21 penetrates through one side of the fixed plate 17 in a sliding manner and is fixedly connected with an extrusion block 22, the extrusion block 22 corresponds to the elastic switch 15 in position height, a second spring 23 is sleeved on the outer wall of the push rod 21, two ends of the second spring 23 are respectively fixedly connected with one side, close to each other, of the extrusion block 22 and the fixed plate 17, and one ends, far away from the inclined plate 19, of the two sliding rods 18 are fixedly connected with limiting blocks 20. When the top block 12 moves upwards along with the piston rod 11, the top block can abut against the inclined surface of the inclined plate 19 and push the inclined plate 19 to move horizontally, and meanwhile, the push rod 21 is driven to move and stretch the second spring 23, so that the extrusion block 22 is pushed to move and abut against the elastic switch 15, and the cooling fan 14 is automatically turned on.

Example two

This embodiment is a further improvement of the previous embodiment: as shown in fig. 1-11, the automatic temperature control device for BGA package chip includes a base 1 for bearing and fixing a chip body 3, a protective housing 2, two heat dissipation fans 14, two sets of heat dissipation holes 31, and a plurality of mounting holes 33; the protective shell 2 is fixedly connected to the top of the base 1 and covers the chip body 3; the two heat dissipation fans 14 are symmetrically and fixedly connected to the inner wall of the top of the protective shell 2 and used for dissipating heat for the chip body 3; the two groups of heat dissipation holes 31 are respectively arranged on the two sides of the protective shell 2, so that air circulation is facilitated; the mounting holes 33 are uniformly distributed on the top of the base 1 in a ring shape and are positioned on the outer side of the protective shell 2.

In the invention, the temperature control equipment also comprises a temperature control mechanism arranged in the protective shell 2, and can utilize the heat dissipated by the chip body 3 to automatically start and stop the two cooling fans 14, thereby realizing the cooling effect; temperature control mechanism includes fixed ring 5 of fixed connection at the 2 inner walls of protective housing, and fixed ring 5's inner wall is a plurality of connecting pipes 6 of annular equidistance fixedly connected with, and the fixed intercommunication of the one end that a plurality of connecting pipes 6 extend each other and be close to has same piston cylinder 7, and piston cylinder 7's inside sliding connection has the piston 10 that is located connecting pipe 6 top, and all added expansion liquid 8 in a plurality of connecting pipes 6 and in the space that piston cylinder 7 is located piston 10 below. The expansion liquid 8 adopts the mobile liquid that has expend with heat and contract with cold characteristic, and the volume of being heated increases promptly, and the liquid that the cooling volume dwindles, after chip body 3 work produced the heat, expansion liquid 8 absorbed the heat volume and increases gradually, can promote piston 10 and upwards slide, and after chip body 3 stop work or temperature cooled down along with radiator fan 14's start-up in the

protective housing

In the present invention, the expansion liquid 8 is made by mixing liquid nitrogen dioxide and liquid dinitrogen tetroxide. The chemical reaction equation of nitrogen dioxide and dinitrogen tetroxide is 2NO2= N2O4, and nitrogen dioxide and dinitrogen tetroxide can interconvert, and when two substances are heated, the two substances move to the left of the equation, namely the content of liquid nitrogen dioxide is increased, the volume is increased, the piston 10 is pushed to move, and when the temperature is reduced, the two substances move to the right of the equation, namely the content of liquid dinitrogen tetroxide is increased, and the volume is reduced.

According to the invention, the temperature control mechanism further comprises an installation box 4 fixedly connected to the inner wall of the top of the protection shell 2, the top of the piston cylinder 7 is fixedly connected with the bottom of the installation box 4, the top of the piston 10 is fixedly connected with a piston rod 11, the top end of the piston rod 11 extends into the installation box 4 and is fixedly connected with a top block 12, a first spring 13 is sleeved on the outer wall of the piston rod 11, the top end of the first spring 13 is fixedly connected with the bottom of the top block 12, and the bottom end of the first spring 13 is fixedly connected with the inner wall of the bottom of the installation box 4. When the piston 10 is expanded by the expansion liquid 8 and moves upwards, the top block 12 can be driven to move upwards and stretch the first spring 13, and after the cooled volume of the expansion liquid 8 is reduced, the piston 10 can move downwards under the elastic acting force of the first spring 13 to reset.

In the invention, two elastic switches 15 are symmetrically arranged on the inner wall of one side of the installation box 4 away from each other, the two elastic switches 15 are respectively connected with two cooling fans 14 through electric wires, two groups of touch components respectively used for controlling the two elastic switches 15 to be opened are symmetrically arranged inside the installation box 4, and the two groups of touch components are in transmission fit with the top block 12. When the top block 12 moves upwards, the touch component can be pushed to move and trigger the elastic switch 15 to be turned on, and then the heat dissipation fan 14 can be turned on to dissipate heat and cool the chip body 3.

According to the invention, the touch component comprises a fixed plate 17 fixedly connected to the upper part inside the installation box 4, two slide rods 18 symmetrically penetrate through the fixed plate 17 in a sliding manner, one ends of the two slide rods 18 are fixedly connected with an inclined plate 19 which is positioned obliquely above the ejector block 12, one side of the inclined plate 19 far away from the ejector block 12 is fixedly connected with a push rod 21, the other end of the push rod 21 penetrates through one side of the fixed plate 17 in a sliding manner and is fixedly connected with an extrusion block 22, the extrusion block 22 corresponds to the elastic switch 15 in position height, a second spring 23 is sleeved on the outer wall of the push rod 21, two ends of the second spring 23 are respectively fixedly connected with one side, close to each other, of the extrusion block 22 and the fixed plate 17, and one ends of the two slide rods 18 far away from the inclined plate 19 are respectively and fixedly connected with a limiting block 20. When the top block 12 moves upwards along with the piston rod 11, the top block can abut against the inclined surface of the inclined plate 19 and push the inclined plate 19 to move horizontally, and meanwhile, the push rod 21 is driven to move and stretch the second spring 23, so that the extrusion block 22 is pushed to move and abut against the elastic switch 15, and the cooling fan 14 is automatically turned on.

In the invention, the bottom of the inclined plate 19 is fixedly connected with a movable block 24, two transverse plates 26 are symmetrically and fixedly connected below the inner part of the installation box 4, the top of each transverse plate 26 is connected with a clamping rod 27 in a penetrating and sliding manner, the top end of each clamping rod 27 is abutted against one side of the bottom of the movable block 24, which is far away from the piston rod 11, the outer wall of each clamping rod 27 is sleeved with a compression spring 30, two ends of each compression spring 30 are respectively fixedly connected with the outer wall of each clamping rod 27 and the top of each transverse plate 26, the outer wall of each clamping rod 27 is fixedly connected with an L-shaped rod 28, the top ends of the two L-shaped rods 28 are fixedly connected with the same movable ring 29 sleeved on the outer side of the piston rod 11, the top of each movable ring 29 is abutted against the bottom of the top block 12, and one side, which is close to the piston rod 11, of the bottom of each movable block 24 is provided with a clamping groove 25 which is clamped and matched with the top end of each clamping rod 27. When the inclined plate 19 is in the initial state, the clamping rod 27 is not clamped with the clamping groove 25, and the compression spring 30 is always in the compression state at this time, after the top block 12 moves upwards and pushes the inclined plate 19 to move horizontally, the movable block 24 can be driven to move horizontally, when the clamping groove 25 corresponds to the clamping rod 27, the clamping rod 27 is clamped with the clamping groove 25 under the elastic action of the compression spring 30, the effect of braking the movable block 24 is achieved, and the extrusion block 22 is further kept in the touch opening state of the elastic switch 15 continuously; that is to say, after the volume of the expansion liquid 8 is reduced along with the cooling of the cooling fan 14 after being started, the top block 12 starts to move downwards for resetting, the cooling fan 14 is still in an open state during the downward movement and resetting of the top block 12, and a continuous cooling effect is maintained, after the top block 12 returns to an initial position, that is, after the temperature is reduced to a normal temperature state, the top block 12 can downwards push the movable ring 29 to move downwards, and the L-shaped rod 28 drives the clamping rod 27 to move downwards and separate from the clamping with the clamping groove 25, at this time, the movable block 24 starts to return along with the inclined plate 19, so that the extrusion block 22 is separated from the collision with the elastic switch 15, and further the effect of automatically closing the cooling fan 14 is realized, and meanwhile, the temperature in the protective shell 2 can be ensured to return to the normal temperature state.

EXAMPLE III

This embodiment is a further improvement of the previous embodiment: as shown in fig. 6 and 7, in the present invention, the outer walls of the plurality of connection pipes 6 are provided with a plurality of heat conduction fins 16. The heat emitted by the chip body 3 can be more effectively conducted to the expansion liquid 8 through the heat-conducting fins 16, so that the expansion liquid 8 can quickly and effectively absorb the heat to react.

Example four

This embodiment is a further improvement of the previous embodiment: as shown in fig. 2 and 3, in the present invention, two air-permeable covers 9 are symmetrically and fixedly connected to the inner wall of the top of the protective casing 2, and two heat dissipation fans 14 are covered by the two air-permeable covers 9 respectively. The ventilation cover 9 can provide a blocking protection effect for the radiator fan 14.

EXAMPLE five

This embodiment is a further improvement of the previous embodiment: as shown in fig. 2 and 3, in the present invention, dust covers 32 are fixedly connected to inner walls of the protection housings 2 at the sides far away from each other, and the dust covers 32 correspond to the heat dissipation holes 31. The dust in the air can be filtered to a certain extent by the arrangement of the dust cover 32, and the dust prevention effect on the chip body 3 is further improved.

The working principle is as follows: when chip body 3 work produced heat, can heat the inflation liquid 8 of inside in absorbing into connecting pipe 6 earlier with the heat through heat conduction fin 16, inflation liquid 8 is heated and begins the inflation, and the volume increase, and then promote piston 10 rebound, drive kicking block 12 rebound and promote two swash plates 19 through piston rod 11 simultaneously and carry out horizontal migration to the direction of keeping away from each other, swash plate 19 drives extrusion block 22 horizontal migration and offsets with adjacent elastic switch 15 through push rod 21, and then trigger radiator fan 14 and open, realize the cooling effect to chip body 3. Still drive the movable block 24 simultaneously and remove at swash plate 19 removal in-process, when kelly 27 and draw-in groove 25 correspond, drive kelly 27 upward movement and block into draw-in groove 25 under compression spring's 30 elastic reaction, realize the spacing effect to movable block 24, and then realize the braking to extrusion block 22, make extrusion block 22 remain with elastic switch 15 throughout and contradict the on-state, make radiator fan 14 keep the radiating effect who lasts. After the chip body 3 is cooled, the expansion liquid 8 starts to be gradually cooled along with the starting of the cooling fan 14, the volume of the expansion liquid 8 starts to be gradually reduced after the temperature is reduced, the piston 10, the piston rod 11 and the top block 12 start to reset downwards under the elastic action of the first spring 13, and the top block 12 is in a cooling stage in the process of descending, and does not immediately return to a normal temperature state, so that the cooling fan 14 is always in an open state in the process of descending the top block 12, and effective heat dissipation is guaranteed; when the top block 12 moves downwards to the bottom end, that is, the expansion liquid 8 returns to the normal temperature state, the movable ring 29 is pushed downwards, the L-shaped rod 28 drives the clamping rod 27 to move downwards, so that the clamping rod 27 is separated from the clamping with the clamping groove 25, at this time, the extrusion block 22, the push rod 21 and the inclined plate 19 start to reset under the elastic action of the second spring 23, the extrusion block 22 is separated from the abutting of the elastic switch 15, the elastic switch 15 automatically resets, and the automatic closing effect of the cooling fan 14 is realized.

However, as is well known to those skilled in the art, the working principle and wiring method of the heat dissipation fan 14 are common knowledge and are not described herein, and those skilled in the art can make any choice according to their needs or convenience.

Finally, the above embodiments are only intended to illustrate the technical solutions of the present invention and not to limit the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions, and all of them should be covered by the claims of the present invention.

Claims

1. Automatic temperature control equipment for BGA package chip is characterized by comprising:

a base (1) for bearing and fixing the chip body (3);

the protective shell (2) is fixedly connected to the top of the base (1) and covers the chip body (3);

the two cooling fans (14) are symmetrically and fixedly connected to the inner wall of the top of the protective shell (2) and used for cooling the chip body (3);

the temperature control mechanism is arranged in the protective shell (2), and the two cooling fans (14) are automatically started and stopped by using the heat dissipated by the chip body (3), so that the cooling effect is realized;

two groups of heat dissipation holes (31) are respectively arranged on two sides of the protective shell (2) to facilitate the circulation of air;

a plurality of mounting holes (33) are uniformly distributed on the top of the base (1) in an annular shape and are positioned on the outer side of the protective shell (2).

2. The automatic temperature control device for BGA package chips of claim 1, wherein the temperature control mechanism comprises a fixing ring (5) fixedly connected to the inner wall of the protective housing (2), the inner wall of the fixing ring (5) is fixedly connected with a plurality of connecting pipes (6) in an annular equidistant manner, one ends of the plurality of connecting pipes (6) extending to each other are fixedly communicated with a same piston cylinder (7), the piston (10) positioned above the connecting pipes (6) is connected to the piston cylinder (7) in a sliding manner, and the expansion liquid (8) is added into the plurality of connecting pipes (6) and the space of the piston cylinder (7) positioned below the piston (10).

3. The automatic temperature control apparatus for BGA packaged chips of claim 2, wherein said expansion liquid (8) is made of liquid nitrogen dioxide mixed with liquid dinitrogen tetroxide.

4. The automatic temperature control device for BGA package chips of claim 3, wherein the temperature control mechanism further comprises a mounting box (4) fixedly connected to the inner wall of the top of the protection housing (2), the top of the piston cylinder (7) is fixedly connected to the bottom of the mounting box (4), the top of the piston (10) is fixedly connected to a piston rod (11), the top end of the piston rod (11) extends to the inside of the mounting box (4) and is fixedly connected to a top block (12), the outer wall of the piston rod (11) is sleeved with a first spring (13), the top end of the first spring (13) is fixedly connected to the bottom of the top block (12), and the bottom end of the first spring (13) is fixedly connected to the inner wall of the bottom of the mounting box (4).

5. The automatic temperature control device for BGA package chips as claimed in claim 4, wherein the inner wall of the side of the mounting box (4) away from each other is symmetrically provided with two elastic switches (15), the two elastic switches (15) are respectively connected with the two heat dissipation fans (14) by wires, the inside of the mounting box (4) is symmetrically provided with two sets of touch components respectively used for controlling the two elastic switches (15) to be opened, and the two sets of touch components are both in transmission fit with the top block (12).

6. The automatic temperature control device for BGA package chips of claim 5, wherein the touch assembly comprises a fixing plate (17) fixedly connected to the upper portion inside the mounting box (4), two sliding rods (18) are symmetrically and slidably penetrated through the fixing plate (17), one ends of the two sliding rods (18) are fixedly connected with a same inclined plate (19) located obliquely above the top block (12), one side of the inclined plate (19) far away from the top block (12) is fixedly connected with a push rod (21), the other end of the push rod (21) slidably penetrates one side of the fixing plate (17) and is fixedly connected with an extrusion block (22), the extrusion block (22) corresponds to the position height of the elastic switch (15), a second spring (23) is sleeved on the outer wall of the push rod (21), two ends of the second spring (23) are fixedly connected with one side of the extrusion block (22) close to the fixing plate (17), and two ends of the two sliding rods (18) far away from the inclined plate (19) are fixedly connected with a limiting block (20).

7. The automatic temperature control device for the BGA package chip of claim 6, wherein the bottom of the inclined plate (19) is fixedly connected with a movable block (24), two transverse plates (26) are symmetrically and fixedly connected to the lower portion of the inside of the installation box (4), a clamping rod (27) is connected to the top of each transverse plate (26) in a penetrating and sliding manner, the top end of each clamping rod (27) is abutted to one side, away from the piston rod (11), of the bottom of each movable block (24), a compression spring (30) is sleeved on the outer wall of each clamping rod (27), two ends of each compression spring (30) are respectively fixedly connected with the outer wall of each clamping rod (27) and the top of each transverse plate (26), an L-shaped rod (28) is fixedly connected to the outer wall of each clamping rod (27), a movable ring (29) is sleeved on the outer side of the piston rod (11) in the same manner and is abutted to the top of each top of the top block (12), and a clamping groove (25) matched with the top end of each clamping rod (27) is arranged on one side, close to the piston rod (11), of each movable block (24).

8. The automatic temperature control equipment for BGA package chips according to claim 2 or 7, wherein the outer walls of a plurality of the connection tubes (6) are each provided with a plurality of heat conductive fins (16).

9. The automatic temperature control equipment for the BGA package chip as claimed in claim 1, wherein the top inner wall of the protective housing (2) is symmetrically and fixedly connected with two air-permeable cover bodies (9), and the two air-permeable cover bodies (9) respectively cover the two heat dissipation fans (14).

10. The automatic temperature control equipment for BGA package chips as claimed in claim 1, wherein the inner walls of the sides of the protection housing (2) away from each other are fixedly connected with dust covers (32), and the dust covers (32) correspond to the heat dissipation holes (31).